1272055 五、發明說明（1) [發明所屬之技術領域] 本發明係有關於一種電子裝置及別a 有關於一種可針對不同元丰 政…衣直％別疋 置。 牛進仃不同冷卻作用之散熱裝 [先前技術] 件做子裝置内部進行冷卻時，需先對所有的元 度V】；：；設條二ί括，例如，電壓、大氣温 雖二風戶$ 1 …、後。又计出_個安全的冷卻條件。 I 雖然風扇或其他散熱裝置能 r 1他冷卻條件，作常當 见感測為改變其轉速或其 其他元件過度冷卻的情況發生，谷易々口p，而有對 費能源。 卩”月况1…且因此而增加噪音，並浪 [發明内容] 本發明之目的在於提供一種 .冷卻達到最佳的冷卻效果。 裝置，其猎由適應性 本發明之另一目的在於提供— 不同元件進行不同的冷卻作=_放熱裝置，其可針對 根據本發明，提供一種電 丨散熱裝置，其中基板上設有一第一 一基板和一 散熱裝置與基板鄰接，且在其上# : 一第二元件，而 一冷卻元件、-第二感測器：以第：：：測器、-第 :::用：量測基板在第-元件附近的溫：部Ϊ件1第— :與弟一感測器耦接，以調整基板在第—元乐—冷卻元 度，弟二感測器用以量測基板在第_ 牛附近的溫 在弟—兀件附近的溫度，第 第6頁 0535-A20621TWF(N2) ；A04281 ;TUNGMING.ptd 五、發明說明（2) 二冷卻元件與第二感測器耦 近的溫度。 以调正基板在第二元件附 應了解的是上述電子 —電子安定器，·又，第一 可為一投影機，而基板可為 為一致冷晶片 < 一彳％^ :兀件和第二冷卻元件可分別 複數個感測器：及=種散熱裝置，其包括-本體、 鄰接的複數個區域，且各：:：：二其中本體具有相互 接件δ又置於區域中，且舆設置於同-區域中的感繼 —第發明：：提供另-種電子裝置，包括-基板、 件、一 Μ _ 第一 70件、一第一感測器、一第一冷卻元 •和第二以=其f及一第二冷卻元件，其中第-元件 • = I又置於基板上，第一感測器以與第一元件位置 、：一式設置於基板中，以量測基板在第一元件附近的 =又i弟一冷卻元件以與第一元件位置對應的方式設置於 土反=，且與第一感測器耦接，以調整基板在第一元件附 近的溫度；第二感測器以與第二元件位置對應的方式設置 於基板中，以量測基板在第二元件附近的溫度丨第二冷卻 =件以與第二元件位置對應的方式設置於基板中，且與第 一感測态耦接，以調整基板在第二元件附近的溫度。 為了讓本發明之上述和其他目的、特徵、和優點能更 明顯易懂’下文特舉一較佳實施例，並配合所附圖示，作 详細說明如下。1272055 V. INSTRUCTION DESCRIPTION OF THE INVENTION (1) [Technical Field to Be Invented by the Invention] The present invention relates to an electronic device and a device related to a different type of material. Niu Jinyu's cooling device with different cooling effects [Prior Art] When cooling the inside of the sub-device, you need to first set all the metrics V;;;; set the bar, for example, voltage, temperature, although the second wind $ 1 ..., after. Also counted _ a safe cooling condition. I Although the fan or other heat sink can r 1 his cooling condition, it is often the case that the sensing is to change the speed of its or its other components to overcool, and there is a fee for energy.月"月况1...and thus increase noise, and wave [invention] It is an object of the present invention to provide a cooling effect that achieves optimum cooling. Apparatus, hunting by adaptation Another object of the present invention is to provide - Different components perform different cooling as a heat release device, which can provide an electric heat sink according to the present invention, wherein the substrate is provided with a first substrate and a heat sink adjacent to the substrate, and on the #: a second component, and a cooling element, a second sensor: using a ::: detector, -:::: to measure the temperature of the substrate in the vicinity of the first element: part 1 -: and The first sensor is coupled to adjust the substrate in the first-yuan music-cooling element, and the second sensor is used to measure the temperature of the substrate near the temperature in the vicinity of the _ cattle, page 6 0535- A20621TWF (N2); A04281; TUNGMING.ptd V. Description of the invention (2) The temperature at which the two cooling elements are coupled to the second sensor. The adjustment of the substrate in the second component is known as the above-mentioned electronic-electronic ballast. , · Again, the first can be a projector, and the substrate In order to be a uniform cold wafer, a plurality of sensors and a second cooling element may respectively be a plurality of sensors: and a heat dissipating device, which includes a body, a plurality of adjacent regions, and each:::: Secondly, the body has a mutual component δ and is placed in the region, and the 舆 is disposed in the same-region. The first invention: provides another electronic device, including - substrate, piece, Μ _ first 70 pieces a first sensor, a first cooling element and a second to = a f and a second cooling element, wherein the first element = = I is placed on the substrate again, the first sensor is first The position of the component is set in the substrate to measure the substrate in the vicinity of the first component, and the cooling component is disposed in the opposite manner to the position of the first component, and is coupled to the first sensor. Connecting to adjust the temperature of the substrate in the vicinity of the first component; the second sensor is disposed in the substrate in a manner corresponding to the position of the second component to measure the temperature of the substrate in the vicinity of the second component, and the second cooling= Provided in the substrate corresponding to the position of the second component, and with the first sensing The above and other objects, features, and advantages of the present invention will be more apparent and understood from the <RTIgt; A detailed description is as follows.
〇535-A20621TWF(N2);A04281;TUNGMING.ptd 第7頁 1272055 五、發明說明（3) [實施方式] 第一實施例 十參考第1圖，本實施例之散熱裝置1 0包括一本體丨i、 複數個感測器1 2、以及複數個冷卻元件丨3，其中本體u具 有相互鄰接的複數個區域lla，且各感測器12分別設置於' 上述區域1 la的任一個中，而各冷卻元件13也分別設置於 上述區域lla的任一個中，且與設置於同一區域na中的感 測器1 2耦接。 丨、 應了解的是感測器丨2可為一電子感溫計，而冷卻元件 13可分別為一致冷晶片、一微型風扇、或一微型散埶模 、组 ° ”、、一 麥考第2a和2b圖，本實施例之電子裝置1〇〇包括一基 板20和上述散熱裝置1〇，其中基板2〇上設有一第一元件u t 一第^元件22，而散熱裝置10與基板20鄰接；在第2a圖 中，與第一 7G件21位置對應的感測器稱為第一 m量測基板20在第一元件21附近的溫度，^盘 弟一元件21位置對應的冷卻元件稱為第一冷卻元件i3a /，、 其用以調整基板20在第一元件21附近的溫度，盥 •22位置對應的感測器稱為第二感測器丨2b，其用以 板20在第二元件22附近的溫度，而與第二元件^ ^ :冷卻=稱為第二冷卻元細，其用靖 弟一兀件2 2附近的溫度。 本實施例之構成如上所述，當第一元件21 0535-A20621T\VF(N2);A04281;TUNGMING.ptd 第8頁 i 1272055 五、發明說明（4) 溫度升高，，而將此訊息通知第一冷卻元件1 3a，藉由第一 冷卻元件‘13a，以將基板2 0在第一元件2 1附近的溫度降 低；同理，當第二元件22的溫度升高時，第二感測器】2b 可感測到基板2 〇在第二元件2 2附近的溫度升高，而將此部 息通知第二冷卻元件l3b，藉由第一冷卻元件l3b，以將基 板2 0在第二元件2 2附近的溫度降低；應注意的是在散熱妒 置1 0上未對應到發熱元件的感測器和冷卻元件係處於待機 的狀態。 ，20可ΐΐΐ的ίί述電子裝置100可為一投影機，而基板 20 了為一電子安定為（ballast)。 中，於散熱裝置係在如棋盤狀的各區域 中均叹有感測為和冷卻元件，因此可方便量 用於各種不同的電子裝置中；又，由 ：：應 :進行不同的冷卻效果，可使冷卻最佳化，來節 本’並且確保產品的穩定度和延長使用年限。”「成 第二實施例 弟3圖择員示本發明之電子步 >例與第-實施例不同之處一…貫施例’本實施 設計概念直接應用於電子;】：：：：例中之散熱裝置的 芩考弟3圖，在本實施例中，電子 = 210、一第一元件220、一第—分杜9qn置2 0 0匕括一基板 94Π 璧、入为-仙 昂一件23 0、一第一感測器 24U、一弟一冷部兀件25η、一给- 二冷卻元件2 70，其中第一元件22〇和第 弟一感測器2 6 0、以及一第 元件23 0設置於 第9頁 〇535-A20621TWF(N2);A04281;TUNGMING.ptd 1272055 五、發明說明（5) 基板上，'第一感測 '器，24〇以與第一元件22〇位 設置於基板2 1 〇中，以！、日丨*化Ω , Λ 4艰的万式 ㈤产.m 一、人义 里測基板21 0在弟一凡件22〇附近的 狐又，弟々σΡ兀件2 5 0以與第一元件22 0位置對應的4 設置於基板210中，且與第一感測器24(^接，㈣ ; 2—W在第-元件22 0附近的溫度；第二感測器26〇:舆-基二板 兀件23^位置對應的方式設置於基板21〇中，以量測美 210 一在第二元件2 3 0附近的溫度；第二冷卻元件27〇以土與 二兀件2 3 0位置對應的方式設置於基板21〇中，且盥第、一 測器26()減，以調整基板2财第二元件23()附近的弟溫一感 ’度。 應了解的是在基板上未對應有發熱元件的區域也可設 有感測器和冷卻元件，以方便量產。 狀藉由本κ施例可了解本發明之概念也可直接應用至電 子裝置之基板上，來達到散熱最佳化的效果。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限^本發曰[任何熟習此技藝者，在不脫離本發明之精神 =範圍内，虽可作些許之更動與潤飾，因此本發明之保護 •範圍當視後附之申請專利範圍所界定者為準。〇 535-A20621TWF (N2); A04281; TUNGMING.ptd Page 7 1272055 V. Description of the Invention (3) [Embodiment] First Embodiment 10 Referring to FIG. 1, the heat sink 10 of the present embodiment includes a body 丨i, a plurality of sensors 1 2, and a plurality of cooling elements 丨3, wherein the body u has a plurality of regions 11a adjacent to each other, and each of the sensors 12 is disposed in each of the above-mentioned regions 1 la, and Each of the cooling elements 13 is also disposed in any of the above-mentioned regions 11a, and is coupled to the sensor 12 provided in the same region na.丨, it should be understood that the sensor 丨2 can be an electronic thermometer, and the cooling element 13 can be a uniform cold chip, a micro fan, or a micro-diffusion module, a group, a McCormick 2a and 2b, the electronic device 1 of the present embodiment includes a substrate 20 and the heat sink 1〇, wherein a first component ut a second component 22 is disposed on the substrate 2, and the heat sink 10 is adjacent to the substrate 20. In the 2a figure, the sensor corresponding to the position of the first 7G piece 21 is referred to as the temperature of the first m measuring substrate 20 in the vicinity of the first element 21, and the cooling element corresponding to the position of the component 21 of the disk is called The first cooling element i3a /, which is used to adjust the temperature of the substrate 20 in the vicinity of the first element 21, the sensor corresponding to the position 22 is referred to as a second sensor 丨 2b, which is used for the board 20 in the second The temperature near the element 22, and the second element ^ ^ : cooling = called the second cooling element is fine, which uses the temperature near the Jing 2 piece 2 2 . The composition of this embodiment is as described above, when the first element 21 0535-A20621T\VF(N2); A04281; TUNGMING.ptd Page 8 i 1272055 V. Description of invention (4) Temperature rise, And notifying the first cooling element 13a with the first cooling element '13a to lower the temperature of the substrate 20 in the vicinity of the first element 2 1; similarly, when the temperature of the second element 22 rises When the second sensor 2b can sense the temperature rise of the substrate 2 附近 in the vicinity of the second element 22, and notify the second cooling element 13b by the first cooling element l3b, The temperature of the substrate 20 in the vicinity of the second element 2 2 is lowered; it should be noted that the sensor and the cooling element that do not correspond to the heat generating element on the heat dissipation device 10 are in a standby state. The electronic device 100 can be a projector, and the substrate 20 is ballasted. In the heat sink, the heat sink is sensed as a cooling element in each area such as a checkerboard shape, so that the heat can be easily It is used in a variety of different electronic devices; in addition, it should: perform different cooling effects, optimize cooling, and save the product's stability and extend the service life." Example 3 shows the electronic step of the present invention. The difference between the first embodiment and the first embodiment is as follows: 'The design concept of the present embodiment is directly applied to the electron; 】:::: The image of the heat sink device 3 in the example, in this embodiment, the electron = 210, one The first component 220, a first-division 9qn is set to 200, and includes a substrate 94Π, an input----------------- a first sensor 24U, a younger one cold part 25n, one a two-cooling element 2 70, wherein the first element 22 and the first sensor one 206 0 0, and one first element 23 0 are set on page 9 〇 535-A20621TWF (N2); A04281; TUNGMING.ptd 1272055 V. Description of the Invention (5) On the substrate, the 'first sensing' device is placed in the substrate 2 1 〇 with the first element 22 to be mounted!丨 化 化 Ω Λ Λ 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰 艰4 corresponding to the position of the element 22 0 is disposed in the substrate 210, and is connected to the first sensor 24, (4); 2-W is at a temperature near the first element 22 0; the second sensor 26 is: 舆- The position of the base plate member 23 is correspondingly disposed in the substrate 21〇 to measure the temperature of the US 210 in the vicinity of the second element 2 3 0; the second cooling element 27 is made of the earth and the second piece 2 3 0 The position corresponding manner is set in the substrate 21〇, and the first and second detectors 26() are subtracted to adjust the temperature of the second element 23() of the substrate 2 to the degree of sensitivity. It should be understood that the substrate is on the substrate. The region not corresponding to the heating element may also be provided with a sensor and a cooling element for mass production. The concept of the present invention can also be directly applied to the substrate of the electronic device by using the κ embodiment to achieve the most heat dissipation. The present invention has been disclosed in the above preferred embodiments, but it is not intended to limit the present invention [anyone skilled in the art without departing from the invention. = Within the spirit scope, although it may make various modifications and variations shall be defined and therefore the protection of the scope of the present invention when view • patent, whichever range.
1272055 圖式簡單說明 ' 第1圖係為本發明之散熱裝置之第一實施例的示意 圖； 第2 a圖係為本發明之電子裝置之第一實施例的分解示 意圖； 第2b圖係為本發明之電子裝置之第一實施例的組合示 意圖；以及 第3圖係為本發明之電子裝置之第二實施例的示意 圖。 •【主要元件符號說明】 I 0散熱裝置 11本體 II a 區域 12感測器 1 3 冷卻元件 20基板 2 1第一元件 22第二元件 • 1 0 0 電子裝置 2 0 0 電子裝置 2 1 0 基板 2 2 0第一元件 2 3 0 第二元件 240第一感測器1272055 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a first embodiment of a heat sink according to the present invention; FIG. 2a is an exploded perspective view showing a first embodiment of the electronic device of the present invention; A schematic diagram of a combination of a first embodiment of an electronic device of the invention; and a third diagram is a schematic view of a second embodiment of the electronic device of the present invention. • [Main component symbol description] I 0 heat sink 11 body II a area 12 sensor 1 3 cooling element 20 substrate 2 1 first element 22 second element • 1 0 0 electronic device 2 0 0 electronic device 2 1 0 substrate 2 2 0 first element 2 3 0 second element 240 first sensor
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