TWI272053B - A heat sink and method for constructing the same - Google Patents

A heat sink and method for constructing the same Download PDF

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Publication number
TWI272053B
TWI272053B TW092102788A TW92102788A TWI272053B TW I272053 B TWI272053 B TW I272053B TW 092102788 A TW092102788 A TW 092102788A TW 92102788 A TW92102788 A TW 92102788A TW I272053 B TWI272053 B TW I272053B
Authority
TW
Taiwan
Prior art keywords
heat sink
heat
hole
base
drive
Prior art date
Application number
TW092102788A
Other languages
English (en)
Chinese (zh)
Other versions
TW200402260A (en
Inventor
Brent A Boudreaux
Stacy Fraker
Eric C Peterson
Christian L Belady
Original Assignee
Hewlett Packard Development Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co filed Critical Hewlett Packard Development Co
Publication of TW200402260A publication Critical patent/TW200402260A/zh
Application granted granted Critical
Publication of TWI272053B publication Critical patent/TWI272053B/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4338—Pistons, e.g. spring-loaded members
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/006—Heat conductive materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW092102788A 2002-07-31 2003-02-11 A heat sink and method for constructing the same TWI272053B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/209,981 US6695042B1 (en) 2002-07-31 2002-07-31 Adjustable pedestal thermal interface

Publications (2)

Publication Number Publication Date
TW200402260A TW200402260A (en) 2004-02-01
TWI272053B true TWI272053B (en) 2007-01-21

Family

ID=31187183

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092102788A TWI272053B (en) 2002-07-31 2003-02-11 A heat sink and method for constructing the same

Country Status (3)

Country Link
US (1) US6695042B1 (enExample)
JP (1) JP2004072106A (enExample)
TW (1) TWI272053B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385768B (zh) * 2006-02-09 2013-02-11 Olantra Fund X L L C 積體電路上液冷設備之防漏安裝的裝置及方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7288839B2 (en) * 2004-02-27 2007-10-30 International Business Machines Corporation Apparatus and methods for cooling semiconductor integrated circuit package structures
US7257001B2 (en) * 2004-04-23 2007-08-14 Shmuel Erez Device and method for fastener-free connection via a heat-shrinkable insert
FR2886809B1 (fr) * 2005-06-03 2007-08-10 Thales Sa Drain thermique pour carte electronique
US7277291B2 (en) * 2005-08-08 2007-10-02 Verifone Holdings, Inc. Thermal transfer device
KR100691900B1 (ko) 2006-01-16 2007-03-09 삼성전자주식회사 하드디스크 드라이브
US20080173427A1 (en) * 2007-01-23 2008-07-24 Richard Schumacher Electronic component cooling
US20100008045A1 (en) * 2008-07-09 2010-01-14 Hong Fu Jin Precision Industry(Shenzhen) Co., Ltd Heat sink
US8018719B2 (en) * 2009-05-26 2011-09-13 International Business Machines Corporation Vapor chamber heat sink with cross member and protruding boss
WO2015012792A1 (en) * 2013-07-22 2015-01-29 Ge Intelligent Platforms, Inc. Screw plug adjustable heat sinks and methods of fabricating the same
WO2015012790A1 (en) * 2013-07-22 2015-01-29 Ge Intelligent Platforms, Inc. Square plug adjustable heat sinks and methods of fabricating the same
US9736966B1 (en) 2016-02-10 2017-08-15 International Business Machines Corporation Heat sink with integrated threaded lid
US10182514B2 (en) 2016-06-27 2019-01-15 International Business Machines Corporation Thermal interface material structures
CN106852073B (zh) * 2017-01-13 2019-06-07 奇鋐科技股份有限公司 散热模组
CN108260325B (zh) * 2017-12-04 2024-02-06 国网新疆电力公司吐鲁番供电公司 水冷散热装置
US11262815B2 (en) * 2019-11-01 2022-03-01 Hewlett Packard Enterprise Development Lp Heat sink system with broad compatibility capacity
US12126069B2 (en) * 2021-04-01 2024-10-22 Hughes Network Systems, Llc Cavity resonance suppression using discrete thermal pedestals in active electronically scanned array
EP4092720A1 (en) * 2021-05-20 2022-11-23 Aptiv Technologies Limited Heat sink
US20230320039A1 (en) * 2022-04-05 2023-10-05 Honeywell International Inc. Integrated heat spreader
US11908495B2 (en) 2022-04-21 2024-02-20 Western Digital Technologies, Inc. Electronic device with heat transfer pedestal having optimized interface surface and associated methods
EP4407675B1 (en) * 2023-01-25 2025-08-13 Aptiv Technologies AG An adjustable heat spreader for a heat sink

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2993153A (en) * 1958-09-25 1961-07-18 Westinghouse Electric Corp Seal
US3170098A (en) * 1963-03-15 1965-02-16 Westinghouse Electric Corp Compression contacted semiconductor devices
US3313987A (en) * 1964-04-22 1967-04-11 Int Rectifier Corp Compression bonded semiconductor device
DE1764795A1 (de) * 1968-01-12 1971-11-11 Siemens Ag Gleichrichteranordnung
DE2042333A1 (de) * 1970-08-26 1972-03-02 Siemens Ag Verfahren zum gasdichten Verschließen von Halbleiterbauelementen
JPH1070219A (ja) * 1996-08-27 1998-03-10 Fujitsu Ltd 実装モジュールの冷却装置
US6014315A (en) * 1998-09-08 2000-01-11 Chip Coolers, Inc. Heat sink assembly with multiple pressure capability
US5945736A (en) * 1998-09-28 1999-08-31 Chip Coolers, Inc. Heat sink assembly with snap-in cover plate having multiple pressure capability
US6021045A (en) * 1998-10-26 2000-02-01 Chip Coolers, Inc. Heat sink assembly with threaded collar and multiple pressure capability

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385768B (zh) * 2006-02-09 2013-02-11 Olantra Fund X L L C 積體電路上液冷設備之防漏安裝的裝置及方法

Also Published As

Publication number Publication date
US20040020634A1 (en) 2004-02-05
TW200402260A (en) 2004-02-01
JP2004072106A (ja) 2004-03-04
US6695042B1 (en) 2004-02-24

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