1271787 九、發明說明： 【發明所屬之技術領域】 丨發明係關於-種形成微結構之製程，尤指-種形成 3D立體似六角形微結構之製程及其應用，其概應隸屬於半 導體製程之應用，運用於微結構製造之技術領域範嘴。 【先前技術】 不論是液晶顯示器（LCD)、行動電話的榮幕、個人 妻文位助理（PDA)等均需要更亮、更持久、更省電及體積 • $小的光源來強化顯示效果，其中3D立體似六角形微結 構屬於-精密元件，需與其他元件配合而具功能性者，而° .-傳統的微：構的製造方法可分為以下幾種，其分別為： ' θ 一、等向性蝕刻（Isotr〇Pic Etching)熱壓法：此種方 法疋利用等向性蝕刻之後在矽基板上留下的弧形凹槽，再 加以熱壓而形成微透鏡；例如要在矽基板的母模上要形成 弧形凹槽’可以採用氫氟酸（HF)、石肖酸（HN〇3)及醋 I ( CH3CO〇H )的混和溶液加上適當溫度與時@，便可完 成石夕基板的等向性姓刻，然後再進行熱壓製程，即可完成 U透鏡陣列的製造，然而此種方法對於钮刻參數的控制不 易。 一光阻熱熔法：將厚膜光阻經過曝光顯影後而形成 柱狀的微結構，並經由高溫整形及光阻柱狀微結構炫化等 藉由内聚力與表面張力的作帛，使微凸圓柱逐漸變形成具 有半球狀的表面，達到具有微透鏡狀陣列之結冑，此種方 法所製成的微透鏡曲率半徑雖可藉由厚膜光阻厚度及直徑 5 1271787 來控制’但是半球狀表面的控制不易精確控制，所以製程 的整體穩定性不夠。 ^ 二、熱壓成形法：此法是以深刻電鑄模造（LithGgraphie GaVanoformung八⑽咖叩；uga )技術製成所需的模且， 然後將此模具放置於熱壓機的聚合塑膠薄板上以高壓高溫 ==壓模方式而形成微透鏡陣列，此種方式所製成的 =率半徑可以藉由熱壓溫度及壓力控制，但是當溫度 =叫合塑膠薄板則無法形成透鏡’另當 精確控制。觸核具頂部，所以半球狀的表面不易 技秫-二液滴噴出法：其藉由類似噴墨（Μ*)印刷之 Μ出微液滴的方式使複數個微液滴至光阻層上，進而 之微透鏡陣列。此製程所製出微透鏡的直徑與 …。徑大小相關，而且難以控制外表面的精確外形 (包括大小、高度、焦距等）。 ㈣二、準分子雷射加工法：藉由準分子雷射微細加工技 ’丁々方式製作出微小的3D矜姓播 ^ . 雷射光裝置以…轴上移程式控制的 如聚甲其兩^ 〇方式，在尚为子材料基材 甲基丙烯酉夂甲酯（PMMA)、聚碳 楚卢、車^圓球狀的外表面’然而所得的微結構其表面的粗 。，’加上雷射光設借複雜且昂貴，不符合經濟效益。 由此可知，各種製# # # 的控n _ 的方式對於微結構的表面 ，因此.、.、法有效地掌握微結構的品f，使得產 6 1271787 口口的良率無法提高，加上各種參數控制不易且設備昂責， 相對地増加製造者的成本與時間的負擔。 【發明内容】 因此’本發明人有鑑於上述製作微結構的缺失與問題， 斗寸經過不斷的研究與試驗，終於發展出一種能改進現有缺 失之本發明，不僅可改善一般製模方法複雜的缺失，且不 受限於單一鏡片的高度。 本發明之主要目的係在於提供一種在晶圓上蝕刻製作 出3D立體似六角形微結構的方法，其主要經由光罩設計 圖形與尺寸來對準晶圓的特定晶格，且經光罩尺寸的變化 而產生不同大小的3D立體似六角形微結構，另經由高分 子固化材料將其形狀翻製，因此可依照不同光罩尺寸的控 制而蝕刻出不同大小的3D立體似六角形微結構，本發明 的製程穩定，因此可精確製造不同大小3D立體似六角形 U結構，使微結構的品質及效率提高，並且使微結構的品 質能有效控管而提升產品的品質，加上可翻製成模具組而 提高產量，可達到提高微結構製造的使用性及功能性之目 的。 為達到上述目的，本發明係提供一種形成3D立體似 六角形微結構之製程，其包括： ()製作光罩·製造一由複數個平行四邊形所形成 的微陣列光罩；以及 (二）製作3 D立體似六角形微結構··首先以濕式氧 化爐管（Wet Oxidation)的方式在晶格排列為<11〇>的矽 7 1271787 日日圓上生長出氧化I ,並且於該<π〇>石夕日日日圓上做正光阻 々主佈 <吏D亥正光阻覆蓋於氧化層上，並藉由紫外光 (UV-Ught )微影技術對準 i 〇>矽晶圓的 I卜晶格方向 進行微影，使所製作的微陣列光罩透過曝光顯影的方式於 〈no〉的發晶圓上微影出作為㈣遮罩的平行四邊形微陣 歹曰^，並藉由等向性❹1液及非等向性㉝刻液於<! H) >的石夕 晶圓上蝕刻出3D立體似六角形微陣列結構。 而藉由上述技術手段不僅可改善一般製模方法複雜的 缺^亚錢刻出3D立體似六角形微陣列結構的〈心的 石夕晶0 ’藉由複合材料進行翻模’使複合材料上翻模出凸 扣立體似六角形微陣列結構；且經由電禱的方式而形 :3〇立體似六角形微陣列結構相合的凹3D立體似六詩 掀陣列結構的金屬模具，如此— y 裎古决甚旦上 木即了大里歿製微結構而 间生產里，加上本發明所需的生產設 有效降低製造所需的成本與時間，又本發明的製程=可 故可效的控制微結構品質，提高微結構的實用广’ 【實施方式】 本發明係一種形成3D立體似六角形 請參看第-圖至第五圖所示，其製程包括：之4程， 〇 ) 所形 (-）製作光罩（i 〇 ):本發明係將 製作成如第一圖所示，由複數個平行四邊 成的微陣列光罩（i 2 )’其中各平行四 夾角分別為109.5度及70.5度；以及 ）的 (二）製…體似六角形微結構：首先以濕式氧 1271787 不論是凸3D立體似六角 之3D立體似六角形微陣列結構 形或凹3D立體似六角形。 a π y几早尺T的變化，可以 德疋的控制3D立體似六角形料姓德从y， 鬥政結構的形狀與尺寸。 三、生產設備成本低’本發明不需複雜又昂貴的可程 式控制褒置或生產設備，且經由本發明電鑄成形的模且， 可達到大量生產進而使製造所需的成本降低。 【圖式簡單說明】1271787 IX. Description of the invention: [Technical field to which the invention pertains] The invention relates to a process for forming a microstructure, and more particularly to a process for forming a 3D solid-like hexagonal microstructure and an application thereof, which are generally pertaining to a semiconductor process The application is applied to the technical field of micro-structure manufacturing. [Prior Art] Whether it is a liquid crystal display (LCD), a mobile phone's glory, a personal wife's PDA, etc., it needs brighter, longer lasting, more power-saving and volume. • A small light source to enhance the display. Among them, the 3D three-dimensional hexagonal microstructure belongs to the -precision component, which needs to be functional with other components, and the traditional micro-structure manufacturing method can be divided into the following: ' θ Isotr〇Pic Etching hot pressing method: this method utilizes an arcuate groove left on the ruthenium substrate after isotropic etching, and then hot pressed to form a microlens; for example, in 矽An arc-shaped groove may be formed on the mother mold of the substrate. A mixed solution of hydrofluoric acid (HF), tartaric acid (HN〇3) and vinegar I (CH3CO〇H) may be used, and the appropriate temperature and time @ may be used. The isotropic first name engraving of the Shixi substrate is completed, and then the hot pressing process is performed to complete the fabrication of the U lens array. However, this method is not easy to control the button parameters. A photoresist thermal fusion method: a thick film photoresist is exposed and developed to form a columnar microstructure, and the cohesive force and surface tension are caused by high temperature shaping and photoresist columnar microstructure fascia, etc. The convex cylinder gradually transforms into a hemispherical surface to achieve a crucible with a microlens-like array. The radius of curvature of the microlens made by this method can be controlled by thick film photoresist thickness and diameter 5 1271787, but the hemisphere The control of the surface is not easy to control accurately, so the overall stability of the process is not sufficient. ^ Second, hot press forming method: This method is made by deep electroforming (LithGgraphie GaVanoformung eight (10) curry; uga) technology to make the required mold, and then the mold is placed on the polymer plastic sheet of the hot press High-pressure high-temperature == compression molding to form a microlens array. The radius of the resulting ratio can be controlled by hot pressing temperature and pressure, but when the temperature = called plastic sheet, the lens cannot be formed. . Touching the top of the nucleus, so the hemispherical surface is not easy to technique - two droplet ejection method: it makes a plurality of micro droplets onto the photoresist layer by means of inkjet (Μ*) printing to eject microdroplets And further a microlens array. The diameter of the microlens produced by this process is .... The diameter is related to the size and it is difficult to control the exact shape of the outer surface (including size, height, focal length, etc.). (4) Second, the excimer laser processing method: by the excimer laser micro-machining technology 'Ding Wei way to make a tiny 3D 矜 surname broadcast ^. The laser light device is controlled by the ... axis shift program such as polymethyst two ^ 〇 In the manner, the outer surface of the methacrylic acid methyl ester (PMMA), polycarbocarb, and the spherical shape of the sub-material substrate is 'the resulting microstructure is thick. , plus the addition of laser light is complicated and expensive and does not meet economic benefits. Therefore, it can be seen that the manner of controlling n _ of various systems # _ is on the surface of the microstructure, and therefore, the method, the method, and the method effectively grasp the product f of the microstructure, so that the yield of the mouth of the 6 1271787 cannot be improved, plus The control of various parameters is not easy and the equipment is blamed, which relatively increases the cost and time burden of the manufacturer. SUMMARY OF THE INVENTION Therefore, the inventors have in view of the above-mentioned lack of fabrication and problems in the fabrication of microstructures, and through continuous research and experimentation, finally developed a invention that can improve the existing defects, and can not only improve the complexity of the general molding method. Missing, and not limited to the height of a single lens. The main object of the present invention is to provide a method for etching a 3D solid-like hexagonal microstructure on a wafer, which mainly aligns a specific lattice of the wafer through the mask design pattern and size, and the size of the mask. The change produces 3D three-dimensional hexagonal microstructures of different sizes, and the shape is reversed by the polymer curing material, so that different sizes of 3D three-dimensional hexagonal microstructures can be etched according to the control of different mask sizes. The process of the invention is stable, so that the 3D three-dimensional hexagonal U structure of different sizes can be precisely manufactured, the quality and efficiency of the microstructure are improved, and the quality of the microstructure can be effectively controlled to improve the quality of the product, and the product can be turned over. By increasing the output by forming a mold set, the purpose of improving the usability and functionality of the microstructure manufacturing can be achieved. In order to achieve the above object, the present invention provides a process for forming a 3D solid-like hexagonal microstructure, comprising: () fabricating a photomask, fabricating a microarray photomask formed by a plurality of parallelograms; and (2) fabricating 3 D three-dimensional hexagonal microstructures. First, an oxidation O is grown on the 矽7 1271787 yen lattice of the lattice arrangement <11〇> in the form of a Wet Oxidation tube, and the <;π〇> on the day of the eve of the day, do the positive light resistance of the main cloth < 吏D Haizheng photoresist over the oxide layer, and by the ultraviolet (UV-Ught) lithography technology to align i 〇 矽 矽The lithography is performed in the direction of the circle I, so that the fabricated microarray reticle is microscopically formed on the wafer of <no> by exposure and development as a parallelogram micro-array of (4) mask, and A 3D three-dimensional hexagonal microarray structure was etched on the Shihwa wafer of <! H) > by an isotropic ❹1 liquid and an anisotropic 33 etchant. However, the above-mentioned technical means can not only improve the complexity of the general molding method, but also the 3D stereoscopic hexagonal microarray structure of the "heart of the stone" by the composite material to make the mold on the composite material The embossing of the convex buckle is similar to the hexagonal microarray structure; and is shaped by means of electric prayer: 3 〇 three-dimensional hexagonal microarray structure is matched with a concave 3D three-dimensional 掀 掀 array structure of metal mold, so - y 裎The ancient process of the wood is the production of the micro-structure of the Dali, and the production facilities required by the invention effectively reduce the cost and time required for manufacturing, and the process of the invention = controllable and effective control micro Structural quality, and the utility of the microstructure is improved. [Embodiment] The present invention is a 3D solid-like hexagon. Please refer to the first to fifth figures. The process includes: 4 steps, 〇) (- Manufacture of a photomask (i 〇): The present invention is fabricated as shown in the first figure, a microarray mask (i 2 ) formed by a plurality of parallelograms, wherein each of the parallel four corners is 109.5 degrees and 70.5 degrees, respectively. And (2) system... Angular microstructure: firstly wet oxygen 1271787 3D stereoscopic hexagonal microarray structure or concave 3D stereo hexagonal shape. a π y a few changes in the early t, can be controlled by the German 3D three-dimensional hexagonal material surname from the y, the shape and size of the fighting structure. Third, the production equipment is low in cost. The present invention does not require complicated and expensive programmable control devices or production equipment, and the mold formed by electroforming of the present invention can achieve mass production and thus reduce the cost required for manufacturing. [Simple description of the map]
第一圖係本發明平行四邊形陣列之示意圖。 第二圖係本發明< 110 >矽晶圓及其主切邊 < 丨丨丨〉之 平面圖。 第二圖係本發明矽晶圓經過氧化爐管生長氧化層及塗 光阻之剖面圖。 土 第四圖係本發明紫外光微影中光罩與矽晶圓對準特定 晶格之示意圖。 第五圖係本發明姓刻出3D立體似六角形微結構陣列 示意圖。 第六圖係本發明翻模出凸3D立體似六角形微結構陣 列示意圖。 第七圖係本發明單一 3D立體似六角形微結構立體圖 【主要元件符號說明】 (1〇)光罩 (1 1 )平行四邊形 (1 2 )微陣列光罩 10 1271787 (2 Ο )矽晶圓 (21)氧化層 (2 2 )正光阻 (2 3 ) 3D立體似六角形微結構 (2 4 )基材 (2 5 )凸3D立體似六角形微結構The first figure is a schematic diagram of a parallelogram array of the present invention. The second drawing is a plan view of the <110 > 矽 wafer and its main trimming < 丨丨丨〉. The second figure is a cross-sectional view showing the growth of the oxide layer and the coating of the photoresist in the oxidized furnace tube of the present invention. The fourth figure is a schematic diagram of the alignment of the reticle and the ruthenium wafer in a specific crystal lattice in the ultraviolet lithography of the present invention. The fifth figure is a schematic diagram of a 3D stereoscopic hexagonal microstructure array in which the present invention is engraved. Fig. 6 is a schematic view showing a three-dimensional three-dimensional hexagonal microstructure of the present invention. Figure 7 is a perspective view of a single 3D stereoscopic hexagonal microstructure of the present invention. [Main component symbol description] (1) Mask (1 1 ) Parallelogram (1 2 ) Microarray mask 10 1271787 (2 Ο ) 矽 Wafer (21) Oxide layer (2 2 ) Positive photoresist (2 3 ) 3D three-dimensional hexagonal microstructure (2 4 ) Substrate (2 5 ) Convex 3D stereoscopic hexagonal microstructure