1271135 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種印刷電路板焊墊。 【先前技術】 焊墊係印刷電路板用以焊接電子元件之連接介質，它將電 子元件與電路按照設計要求接合在一起，從而使電路功能得以 實現。根據焊墊所安裝之不同電子元件，焊墊具有不同之形 狀，例如圓形、方形、八角形、淚滴形等。目前印刷電路板上 知塾之形狀一般局限於一個特定之電子元件。 惟，在電路板之設計過程中，經常需要設計不同形狀之焊 墊以便，裝具有不同形狀之電子元件。例如在設計安裝 或0603系列表面粘著元件(電阻、電容或電感)焊墊時，如第一 圖所示，因為0805表面粘著元件之尺寸大於〇6〇3表面粘著元件 之尺寸，0805表面枯著元件所需焊墊1〇,之尺寸亦大於_3表 面粘著元件所需焊墊20,之尺寸。故需要分別設計焊墊1〇，和 墊20來女裝〇8〇5和0603兩個不同之表面粘著元件。再比如設 計^裝共模電感或0603系列表面粘著元件之焊墊時，如第三& 所示，^於共模電感與0603表面粘著元件無論形狀，尺寸^ 引腳數量均不相同，故亦需要分別設計焊塾4〇，和焊 裝此兩個不同之電子元件。 由於印刷電路板上之元件安放空間十分有限，如若 同之電子元件都單獨設計-個減之焊塾會減 雷 上之佈線空間，因是有必要提供一種改良之印刷電;板 【發明内容】 鑒，以上内容，有必要提供一種能安褒不 兀件之印刷電路板焊墊。 拓考电于 或-:=墊子：：包^ 6 1271135 二部和-第二主體部，其尹該等第-主 元件二ί开，該等第二主體部形狀與第二表面枯著 2 η 相同且用以安裝該第二表_著元件。 件，^if ，該印刷板焊墊可安裝不同之表面枯著元 件為印刷電路板大大節省了佈線空間。 【實施方式】 式之盖閱1:圖’係本發明印刷電路板焊墊之-較佳實施方 焊墊二體ίο著兀件’其包括一長方形焊墊邊框11和-對 焊塾實體1峨焊墊邊框11所包圍。該對烊塾 〇戶8〇5声二」同且位置呈軸對稱。這是由於焊墊對應安裝之 日士二，枯者疋件和0603表面點著元件均具有兩個引腳。同 對焊塾實體10之形狀主要由娜表面枯著元件和〇6_ 面粘者兀件之兩個形狀重疊而成，因此，每一焊墊 第一主體部101和一第二主體部102，其中該等第一主體部 1之形狀與0805表面粘著元件之引腳形狀大致相同且可安裝 〇如5表面枯著耕，該等第二主體部皿之形狀與瞻3表面^ 者兀件之引腳形狀大致相同且可安裝〇6〇3表面粘著元件。由於 0603表面钻著元件之兩個引腳間之距離小於0805表面钻著元 1兩個引腳間之距離，因此該等第二主體部1〇2分別位於該等 焊墊實體10之靠近之一側。該等第一主體部101之間之距離與 0805表面點著元件之引腳之間距離相同，該尊第二主體部 之間距離與0603表面粘著元件之引腳之間距離相同。 請繼續參閱第四圖，係本發明印刷電路板焊墊之另一較佳 實施方式之結構示意圖。該印刷電路板焊墊可用以安裝共模電 感或0603表面钻著元件’其包括一長方形焊塾邊框&和四個焊 墊實體30，該等焊墊實體30被該焊墊邊框31所包圍。該等焊聲 實體30形狀相同且位置呈中心對稱。這是由於該等焊塾實體3〇 1271135 對應安裝^之共模電感具有四個引腳。該等焊墊實體3〇之形狀主 要由共模電感和_表面崎元件之兩個形狀㈣而成，因 此，每一焊墊實體30包括一第一主體部3〇1和一第二主體部 30^ ’其中該等第一主體部观之形狀與共模電感之引腳形狀大 ^目同且可安裝共模電感，該等第二主體部302之形狀與0603 ί面/钻著^件之引腳形狀大致相同且可安裝_3表面枯著元 牛。該等第-主體部301之間之距離和該等第二主體部3〇2之間 =巨離分職共模錢和_3表_著元件之各⑽之間距 離相同。 本發明不㈣驗共模域，娜細叫列表面 表面他在印稱路板舰時需要用 到重疊^二之 請。=所 ===發範r所作之等效修‘= 1271135 【圖式簡單說明】 第一圖係習知技術之印刷電路板焊墊之結構示意圖。 第二圖係第一圖中焊墊改進後之印刷電路板焊墊之結構示 意圖。 第三圖係另一習知技術印刷電路板焊墊之結構示意圖。 第四圖係第三圖中焊墊改進後之印刷電路板焊墊之結構示 意圖。 【主要元件符號說明】 • 【習知】 焊墊實體 10’、20’、30’、40’ 【本發明】 焊墊實體 10、30 焊墊邊框 11、31 第一主體部 101、301 第二主體部 102、3021271135 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a printed circuit board pad. [Prior Art] A solder pad is a printed circuit board for soldering a connecting medium of an electronic component, and the electronic component and the circuit are bonded together according to design requirements, thereby realizing circuit function. Depending on the electronic components on which the pads are mounted, the pads have different shapes, such as circular, square, octagonal, teardrop, and the like. Currently, the shape of the printed circuit board is generally limited to a specific electronic component. However, in the design of the circuit board, it is often necessary to design solder pads of different shapes in order to mount electronic components having different shapes. For example, when designing or installing 0603 series surface-adhesive components (resistive, capacitive or inductive) pads, as shown in the first figure, because the size of the 0805 surface-adhesive component is larger than the size of the 粘6〇3 surface-adhesive component, 0805 The surface of the surface is required to have a pad of 1 〇, which is also larger than the size of the pad 20 required for the _3 surface adhesion component. Therefore, it is necessary to separately design the pad 1 〇, and the pad 20 to two different surface-adhesive elements of the women's 〇 8 〇 5 and 0603. For example, when designing a common mode inductor or a 0603 series surface adhesion component pad, as shown in the third & common mode inductance and 0603 surface adhesion component, regardless of shape, size ^ pin number are different Therefore, it is also necessary to separately design the soldering iron 4 and solder the two different electronic components. Since the component placement space on the printed circuit board is very limited, if the same electronic components are separately designed - a reduced soldering will reduce the wiring space on the lightning, because it is necessary to provide an improved printed electricity; board [invention] In view of the above, it is necessary to provide a printed circuit board pad that can be installed without any defects. Extension test in or -: = mat:: package ^ 6 1271135 two and - second body, its Yin the first - main element two open, the second body shape and the second surface withered 2 η is the same and is used to mount the second table. Piece, ^if, the printed board pad can be installed with different surface dead elements to save the wiring space for the printed circuit board. [Embodiment] Cover of the type: Figure ' is the printed circuit board pad of the present invention - the preferred embodiment of the pad two body ίο 兀 ' 其 其 其 其 其 其 其 其 长方形 长方形 长方形 长方形 长方形 长方形 长方形 长方形 长方形 长方形 长方形 长方形 长方形The 峨 pad border 11 is surrounded. The pair 〇 〇 〇 8 〇 5 sounds two” and the position is axisymmetric. This is due to the fact that the pads are mounted on the same day, the dry ones and the 0603 surface point components have two pins. The shape of the same pair of soldering body 10 is mainly formed by overlapping two shapes of the nano surface dry component and the 〇6_ surface adhesive component. Therefore, each pad first body portion 101 and a second body portion 102, Wherein the shape of the first main body portion 1 is substantially the same as the shape of the pin of the 0805 surface adhesive member and can be mounted, for example, the surface of the 5th body is ploughed, and the shape of the second main body member and the surface of the third body member are The pins are approximately the same shape and can be mounted with 〇6〇3 surface mount components. Since the distance between the two pins of the 0603 surface-drilled component is less than the distance between the two pins of the 0805 surface-drilling element 1, the second body portions 1〇2 are respectively located adjacent to the pad body 10 One side. The distance between the first body portions 101 is the same as the distance between the pins of the 0805 surface-pointing component, and the distance between the second body portions is the same as the distance between the pins of the 0603 surface-adhering component. Please refer to the fourth figure, which is a schematic structural view of another preferred embodiment of the printed circuit board pad of the present invention. The printed circuit board pad can be used to mount a common mode inductor or a 0603 surface drill component that includes a rectangular soldered bezel & and four pad bodies 30 surrounded by the pad frame 31 . The welding acoustic entities 30 are identical in shape and centrally symmetrical. This is due to the fact that the soldering entity 3〇 1271135 has four pins for the common mode inductor. The shape of the pad body 3〇 is mainly formed by two shapes (four) of the common mode inductance and the _ surface smear element. Therefore, each pad body 30 includes a first body portion 3〇1 and a second body portion. 30^' wherein the shape of the first main body portion is the same as the shape of the common mode inductor, and the common mode inductance can be mounted, and the shape of the second main body portion 302 and the 0603 ί face/drilling piece The pins are roughly the same shape and can be mounted with a _3 surface with a dead cow. The distance between the first body portions 301 and the second body portions 3〇2 are the same as the distance between the divisional common mold money and the _3 table_components (10). The present invention does not (4) examine the common mode domain, and Na is called the list surface. He needs to use the overlapping ^2 when printing the road board. ============================================================================== The second figure is a schematic view of the structure of the printed circuit board pad after the solder pad is improved in the first figure. The third figure is a schematic structural view of another conventional printed circuit board pad. The fourth figure is a schematic view of the structure of the printed circuit board pad after the solder pad is improved in the third figure. [Explanation of main component symbols] • [Practical] pad entities 10', 20', 30', 40' [The present invention] pad body 10, 30 pad frame 11, 31 first body portions 101, 301 second Main body 102, 302