1270330 九、發明說明： 【發明所屬之技術領域】 、 本發明係關於—種軟性印刷電路板構成覆蓋膜之製作方法，尤指 、 利用特殊的覆蓋膜結構進行製作方法中的對位程序。 【先前技術】 軟性印刷電路板主要由絕緣基材、黏性物質及電路層（銅導體)所 組成。當微影製造完電路層的線路後，為防止崎路氧化及保護 線路免受魏溫濕度之影響，必須在上面加上-層覆蓋膜（隱r layer)來保護。 覆蓋膜的組成為支掠膜(絕緣基材)及黏性物質。紐電路板基板 的絕緣基材一般常用為聚醋(Polyester，PET)、聚亞醯胺 • (P〇lyimide，PI)或其他類似聚合物薄膜(Polymer film)。基於各 材質本身雜性而各有優缺點；PET的成本較低，而ρι的可靠性 較高。目前有料公征在研發可取代之㈣，如_ 赉展之PBO、ΡΙβ〇與Kuraray公司的LCP等。 為了能夠提高覆蓋膜覆蓋至電路板時的精準度，通常會分別在覆 蓋膜、電路板分別穿設對位孔，並利用此對位孔完成對位後，利 用熱塵等方法將覆蓋膜覆蓋至電路板上。然而，由於覆蓋膜的厚 度為12. 5仰至25_(類似於家尹常用的保鮮膜），所以十分柔 5 1270330 軟’而不容易平整地覆蓋至電路板上。因此，一般進行對位、覆 蓋程序，都必須透過熟練的工人來完成，而無法改用自動化，大 量生產，降低成本。 【發明内容】 本發明之主要目的在提供—種紐印刷電雜構紐蓋膜之製作 癱彳法，藉著支撐板對覆蓋膜的支撐性大於支稽膜，使覆蓋膜不因 其超薄而極度柔軟’而能在將覆蓋膜覆蓋至軟性印刷電路板所需 進行的對位程序時’姉於習知覆蓋膜結構(由支撐膜、覆蓋膜所 «)有較佳的對位精準度，同時也·此取代人工改用自動化覆 • 蓋覆蓋膜。 基於上述目的，本發明提供了在軟性印職路板構賴蓋膜之製 作方法。此方法先將覆魏處理絲殊結構後，並藉著對位處理 _ 結果將之準確地覆蓋至電路板上。 在復盍膜的處理中，首先提供已黏貼在支撐膜上的覆蓋膜（覆蓋 膜單面上具有黏性物質），再使未具有支撐膜的覆蓋膜的表面黏貼 至支撐板(其上已塗佈黏性物質，且支樓性較支撐膜好）。最後穿 透(可採用既有的模具沖孔、雷射燒孔或鐵孔機鑽孔）支摔板、覆 盍膜、支撐膜而形成覆蓋對位孔，並撕除覆蓋膜而曝露出改以支 撐板作為支撐的覆蓋膜，而完成此部份的處理。 關於電路板的部分，則先提供具有電路層之軟性印刷電路板，龙 6 1270330 穿透(可採用既有的模具沖孔、峨孔或鑽孔機鑽嫌性印刷 電路板而形油對於覆蓋·孔之電路板對位孔。 最^基於覆施孔(穿設於覆_、電物舰(穿設於軟 路層(錄板上)上晴顧。额，從已 被復盍断復盍的電路層上，撕除支撐板。 圖式得 關於本發日狀優點與精神可叫由町的發_述及所附 到進一步的瞭解。 【實施方式】 ^發明在紐_崎_紐衡先 料結構後，並藉著對位處理結果^ 1C圖弟2B圖所示），如證） 印刷電路板2(如第2Α3Γ蓋膜準確地覆蓋至軸 製作出本發鳴物1 _說明蝴 的對位處理、以第3計日日 性印刷電路板2作 至電路板的料。σ 猎著本發明覆蓋膜結構完成覆蓋 =參閱第1MD圖’第1A〜1D_本發㈣蓋膜結構之製作示意 用支擇性較糾y 所喊）的結顧度，主要是利 車乂子的如弟_所示之支撐板14取代支擇膜1〇 1270330 一來，在進行習知的對位等 太過柔軟(覆加2斤僅1??，就不會因為f知覆蓋膜本身 進行子又 Μ至25卵)而非得透過人工來 後4糾。改_本發明覆麵結構進行對位、覆蓋等程 糾，可因支撐性較好的支撐板14，_可以精確地進 时也可採用自動化作業。 具體而言，在覆蓋膜的處理中，首先提供如第1Α圖所示之已黏貼1270330 IX. Description of the Invention: [Technical Field] The present invention relates to a method for fabricating a cover film of a flexible printed circuit board, and more particularly to a aligning process in a manufacturing method using a special cover film structure. [Prior Art] A flexible printed circuit board is mainly composed of an insulating substrate, a viscous material, and a circuit layer (copper conductor). After the lithography finishes the circuit layer, in order to prevent the corrosion of the smear and protect the circuit from the humidity of the Wei temperature, it must be protected by a layer-covering film. The composition of the cover film is a pulverized film (insulating substrate) and a viscous substance. The insulating substrate of the circuit board substrate is generally used as polyester (PET), poly(p-lyimide, PI) or other similar polymer film. Each has its own advantages and disadvantages based on the complexity of each material; the cost of PET is lower, and the reliability of ρι is higher. At present, it is expected that the public procurement can be replaced by R&D (4), such as _ 之 PBO, ΡΙβ〇 and Kuraray's LCP. In order to improve the accuracy of the cover film covering the circuit board, the alignment holes are usually respectively disposed on the cover film and the circuit board, and after the alignment is completed by the alignment holes, the cover film is covered by hot dust or the like. To the board. However, since the thickness of the cover film is 12.5 to 25_ (similar to the plastic wrap commonly used by Jia Yin), it is very soft 5 1270330 soft 'not easily covered on the circuit board. Therefore, in general, the alignment and covering procedures must be completed by skilled workers, and automation cannot be used, mass production is required, and costs are reduced. SUMMARY OF THE INVENTION The main object of the present invention is to provide a method for fabricating a new type of printed electro-hetero-structured cover film. The support of the support film by the support plate is greater than that of the support film, so that the cover film is not ultra-thin. It is extremely soft and can achieve better alignment accuracy when using the cover film to cover the alignment process required for flexible printed circuit boards. At the same time, this replaces the manual replacement of the automatic cover cover film. Based on the above object, the present invention provides a method of fabricating a cover film in a soft printed board. This method firstly treats the silk structure and then accurately covers the structure on the board by the alignment processing. In the treatment of the retanning film, firstly, a cover film which has been adhered to the support film (having a viscous substance on one side of the cover film) is provided, and then the surface of the cover film having no support film is adhered to the support plate (on which Cohesive material is applied, and the branching property is better than the supporting film). Finally, the penetration (using existing die punching, laser hole burning or iron hole drilling) can be used to form a cover hole and cover the film, and the cover film can be removed to expose the film. This part is treated by a support film as a support film. Regarding the part of the circuit board, a flexible printed circuit board with a circuit layer is first provided, and the dragon 6 1270330 penetrates (the existing die punching, boring or drilling machine can be used to drill the suspicion printed circuit board and the oil is covered · Hole circuit board alignment hole. The most ^ based on the application hole (wearing on the cover _, the electric ship (wearing on the soft road layer (recording board) on the clear. The amount has been restored On the circuit layer of the 盍, the support plate is torn off. The concept and the spirit of the present day can be called from the hair of the town, and the accompanying to further understanding. [Embodiment] ^Invention in New_Saki_News After the balance of the structure, and by the alignment processing results ^ 1C picture shown in Figure 2), such as the certificate) printed circuit board 2 (such as the second Γ 3 Γ cover film accurately covered to the shaft to make this singer 1 _ description The alignment processing is performed on the third solar-terminated printed circuit board 2 to the circuit board. σ Hunting the cover film structure of the present invention completes the coverage = refer to the 1st MD diagram '1A~1D_本发(4) cover film structure The production is indicated by the degree of singularity of the corrective y, which is mainly replaced by the support plate 14 as shown by the scorpion Membrane 1〇1270330, when the conventional alignment is too soft (add 2 kg only 1??, it will not be because the cover film itself is carried out to 25 eggs) instead of artificially After the correction, the cover structure of the present invention is subjected to alignment and coverage correction, and the support plate 14 with good supportability can be accurately advanced or automated. Specifically, the cover film is used. In the processing, first provide the pasted as shown in Figure 1
社撐膜1〇上的覆蓋膜12 (覆蓋膜12單面上具有黏性物質）。支 撐膜10戯於貼紙的光面紙材，覆蓋膜12則類似於貼紙中有彩 色圖案的紙材。 偷覆盖膜12上具有黏性物質（可為樹脂(Epoxy))存在，所以可 如第1B圖所不使未具有支撐臈1〇的覆蓋膜12的表面黏貼至支撐 板14(表面上已有黏性物質，且支樓性較支撐膜10好）。由於支撐 板14(厚度為75//m至15〇m)的厚度大於支撐膜ι〇，使得支撐板 14對復蓋膜12蚊撐性大於支稽膜10。不過，支樓板14的厚度 不一疋要大於支撐膜1G，只要支樓膜1G被撕除後能有支樓性較佳 的支撐板14支持覆蓋膜12即可。 敢後如第1C圖所示穿透(可採用既有的模具沖孔、雷射燒孔或鑽 孔機鑽孔）支撐板丨4、覆蓋膜12、支撐膜10而形成覆蓋對位孔16, 並如第1D圖所示撕除覆蓋膜10而曝露出改以支撐板14作為支撐 的復盖膜12而元成此部份的處理。不過’為了輕易地如第id 圖所不撕除支撐膜10、如第3C圖所示撕除支撐板14,支撐板Η、 8 1270330 覆蓋膜12之間的黏性小於覆蓋膜12、支撐膜1〇之間的黏性。 請茶閱第2A圖〜2B圖，第2A〜2B圖為本發明軟性印刷電路板之處 理示意圖。如帛2A圖所示之習知軟性印刷電路板2主要由基板 20、在基板20上的電路層22所組成。為了進行後續的對位程序， 需先如第2B ®所示穿透(可採槪有_具沖孔、雷射燒孔或鑽 孔棧鑽孔)|邊印刷電路板2中的基板⑼而形成相對於覆蓋對位 孔16之電路板對位孔26。The cover film 12 on the cover film (the cover film 12 has a viscous substance on one side). The support film 10 is played on a glossy paper of a sticker, and the cover film 12 is similar to a paper having a color pattern in the sticker. The viscous cover film 12 has a viscous substance (which may be an epoxy resin), so that the surface of the cover film 12 without the support 臈1〇 can be adhered to the support plate 14 as shown in FIG. 1B (there is already on the surface) Viscous material, and the branching property is better than the support film 10). Since the thickness of the support plate 14 (thickness of 75/m to 15 〇m) is larger than that of the support film ι, the support plate 14 is more mosquito-carrying to the cover film 12 than the branch film 10. However, the thickness of the slab 14 is not greater than that of the support film 1G, and the support film 14 having a better support property can support the cover film 12 as long as the slab film 1G is torn off. After the daring, as shown in Figure 1C, it can be penetrated (using existing die punching, laser hole burning or drilling machine drilling) support plate 丨 4, cover film 12, support film 10 to form cover alignment hole 16 And the cover film 10 is peeled off as shown in Fig. 1D to expose the cover film 12 which is supported by the support plate 14 as a support portion. However, in order to easily peel off the support film 10 as shown in the id diagram, the support plate 14 is removed as shown in FIG. 3C, and the adhesion between the support sheets Η, 8 1270330 cover film 12 is smaller than that of the cover film 12 and the support film. Stickiness between 1 〇. Please refer to Figures 2A to 2B for the tea, and Figures 2A to 2B are schematic diagrams of the flexible printed circuit board of the present invention. The conventional flexible printed circuit board 2 as shown in Fig. 2A is mainly composed of a substrate 20 and a circuit layer 22 on the substrate 20. In order to carry out the subsequent alignment procedure, it is necessary to first penetrate as shown in 2B® (can be drilled with a punch, a laser hole or a drilled hole) | edge of the substrate (9) in the printed circuit board 2 A circuit board alignment hole 26 is formed with respect to the alignment alignment hole 16.
明’閱第3A 3C圖’第3A〜3C圖為本發明在軟性印刷電路板構成 覆蓋膜之製作方法的示隸。如第3A圖麻，將按照第丨圖、第 2_圖所準備好的覆蓋膜、電路板放置姆位置，亦即如第2B圖所 不之由電路板位孔26而套人定位板3()上的定位柱⑽，而將電 路板放置錢找她32的定位㈣上，並如帛3A _示將1D 圖所不之覆麵以«蓋對位孔16對準定錄之後，由覆蓋定位 孔套入定位柱’而在電路層22上覆蓋覆蓋膜12。最後，基於 支撐板14、覆蓋膜12之間的黏性小於覆蓋膜12、電路層a之間 =黏性’而順利地將覆蓋板_除，如第3C圖所示。 綜上所述’本發截㈣·路板構缝麵讀作方法，藉著 $㈣對覆加2的續性切支撐錢铺蓋膜㈣因 軟’峨在將覆蓋膜10覆蓋錄性印刷電路板2 覆、’相對㈣知覆細湖料支撐膜10、 里、稀成）有較佳的·精準度，同時也制此取代人工 1270330 改用自動化覆蓋覆蓋膜12。 藉由以上較佳具體實施例之詳述，係希望能更加清楚描述本發明 之特徵與精神，而並非以上述所揭露的較佳具體實施例來對本發 明之範疇加以限制。相反地，其目的是希望能涵蓋各種改變及具 相等性的安排於本發明所欲申請之專利範圍的範疇内。 【圖式簡單說明】 第1A〜1D圖為本發明覆蓋膜結構之製作示意圖。 第2A〜2B圖為本發明軟性印刷電路板之處理示意圖。 方法的 第3A〜3C圖為本發明在軟性印刷電路板構成覆蓋膜之製作 示意圖。 【主要元件符號說明】 2幸人性印刷電路板 10支撐膜 12覆蓋膜 14支樓板 16覆蓋對位孔 20基板 22電路層 26電路板對位孔 1270330 30對位板 32對位柱3A to 3C are views showing a method of fabricating a cover film on a flexible printed circuit board according to the present invention. For example, in FIG. 3A, the cover film and the circuit board are placed in accordance with the second drawing and the second drawing, that is, the positioning plate 3 is set by the circuit board hole 26 as shown in FIG. 2B. () on the positioning post (10), and put the board to find the positioning of her 32 (four), and if 帛 3A _ shows the 1D figure is not covered by the cover alignment hole 16 after the alignment is recorded by The cover hole is covered in the positioning post and the cover film 12 is covered on the circuit layer 22. Finally, the cover sheet is smoothly removed based on the adhesion between the support sheet 14 and the cover film 12 being smaller than that between the cover film 12 and the circuit layer a, as shown in Fig. 3C. In summary, the method of reading the surface of the joint surface of the haircut (four) and the road board, by means of the $ (four) to cover the continuous cutting support of the cover 2 (4) due to the soft '峨 cover film 10 covering the print The circuit board 2 is covered, and the 'relative (four) knows that the fine lake material support film 10, inner and thin) has better precision. At the same time, it replaces the artificial 1270330 and replaces the automatic cover film 12. The features and spirit of the present invention are intended to be more apparent from the detailed description of the preferred embodiments. On the contrary, the intention is to cover various modifications and equivalents within the scope of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1A to 1D are schematic views showing the fabrication of a cover film structure of the present invention. 2A to 2B are schematic views showing the processing of the flexible printed circuit board of the present invention. The 3A to 3C of the method is a schematic view showing the fabrication of a cover film on a flexible printed circuit board of the present invention. [Main component symbol description] 2 lucky printed circuit board 10 support film 12 cover film 14 support floor 16 cover alignment hole 20 substrate 22 circuit layer 26 circuit board alignment hole 1270330 30 alignment plate 32 alignment column