1268136 九、發明說明： 【發明所屬之技術領域】 、>本發明與—風扇牆之配置結構有關，特別是與應用於 通訊設備的一風扇牆之配置結構有關。 【先前技術】 、在通訊設備中，如數據交換機内部，常因為需要配置 相田夕數里的通訊設備及電源供應設備而使數據交換機的 機箱（Chassis)内部產生極大的熱源。然而，對於多數電 子產品的積體電路晶片來說，熱源的產生不僅會影響電子 晶片操作性能，而且長期處在過高的操作溫度^境;，更 可能會使晶片的使用壽命大幅縮減。因此，如何降低通气 設備内部的環境溫度，-直是軌設備設計優劣與否的重 要關鍵之一。 β曰在電子散熱領域中，利用風扇來促進空氣對流，以達 ^幵政熱功效一直是該領域克服散熱問題常見的手段。然 而’為了應付越來越嚴重的散熱問題，增加配置風扇的數 ，以增強減周圍的對流效果’已經逐漸成為克服散熱問 題的必要手段。在通訊設備，如常用的⑽規格 ( 430x415x550 mm)的數據交換機中，在其機箱内其中二 側，架設一由複數個風扇所組成的風扇牆（FanTrayy，以 增強機箱内部的熱對流情況，已經是本領域相當常見的— 種散熱手段。請參閱第}圖⑷’其係表示習：技術中， —9U尺寸的通訊設備及其散熱模組之配置。如第1圖（a) 中所示，該通訊設備100係包含一機箱1〇，其中談機3箱ι〇 1268136 内部可配置七個通訊板20以及兩個電源供應器3〇，其中 ^玄通訊板20上更具有複數個電子晶片2{Π。在該通訊設 1〇〇的操作過程中，該電源供應器3〇及該等晶片2〇1都 :因晶片操作或電源供應器供電而產生熱能，』此需要在 1 ί 10之上方配置一風扇牆40，以藉由該風扇牆40的 2作^而使該機箱10内部的熱空氣透過該風扇牆40 ，5犄，因乳體流動的現象，機箱10外部的冷卻空氣 们0的其他通氣孔流人，而達到機箱1G内外空 請繼續參閱第U(B)所示，其係表示對 機f θ )之風扇牆40配置結構對該通訊設備100的 稍產生的流場分佈模擬圖。從第1®⑻中 了以看出，從該機箱10底邱 40的牵—H可透過該風扇牆 流動m 4 _彻物成由下往上 的。 以達到冷卻該通訊板20上晶片201之目 儘管胃知倾巾已知道刊収扇 備機箱内部之空氣對流的目的。秋而 風扇腾的配置型態與散熱效果之間的關传 ί去對於 的研究’而僅止於擴大風扇牆面積的S 有太深入 ::積越大’其所具備的散 :騰 的空間條件下，無限制的增加風肩於θ但疋在有限 設計方法。因此，目前風扇牆的設計=不切實際的 面積、增加風扇數目或增加風扇尺寸/，、而風扇牆之 在往與其付出的成本是不成 = 斤獲得的效果 J因而對於產業應用上產 1268136 生相當不利的因素。 乂、綜合以上所述，本案的發明動機即由此而產生。 :二:：探討不同的風扇牆配置方式對通訊設傷機箱内呷 化的影響；並藉由内部流場之變化，提^ 風：:ΐ方式’同時也希望藉由不同的風扇牆操 作杈式，使風扇牆發揮更佳的散熱能力。 卞 【發明内容】 本發明之第一構想在於提供一種應用於 熱機構配置，其包含一機浐rh °叹備的放 ，、匕3 械相（ChaSS1S)，該機箱包含瀨叙 個晶片模組與至少—f源供麵組，該晶 形成-對流通道，以產生敎對产.以及桓組間係 兮播^ -W ,、、、對*，収―風錢，排列於 X尖之側，以增加該機箱内部的熱對流。 根據上述構想，其中該風扇牆係架設於 入口侧及出口側其中一側，且該風扇牆上十;= 風扇係獨立控制，以使哕片邱f Α命—* 句4 &域的 流通量。 M使料部區域内之流通量形成-控制 根據上述構想 1 /4 〇 根據上述構想 根據上述構想 扇而產生。 根據上述構想，其巾_制流通量係由使 失效（disabled)而產生。 ’、中風扇 根據上述構想，其中該控制流通量係由使其中一風扇 其中該局部區域佔該風扇牆面積之 其中該風扇牆係包含2x2個風扇。 其中該控制流通量係由移除其中一風 1268136 反向旋轉而產生。 、、、根據上述構想，其中該控制流通量係由使其中一風扇 減速旋轉而產生。 " 根據上述構想，其中該控制流通量係由 改裝成風車裝置而產生。 Τ風扇 根據上述構想，其中該控制流通量係由改變該機箱的 開口率而產生。 也根據上逑構想，其中該風扇牆係為3χ3及牡4之風扇 牆其中之一。 " 本發明之第二構想在於提出—種通訊設備用之風扇牆 風：二一配置’其包含複數個呈矩陣排列的風扇，該 羽回叫盍一主面積範圍且該主面積範 量，其中额杨巾更具有-局耗域涵蓋-第面Γ 圍’該第二面積範圍具有_第二流通量。面積 根據上述構想，其中該第二面積為該主面積之ι/4 根據上述構想’其中該第二流通量係由移除至少一 扇而產生。 根據上述構想，其中該第二流通量係中 失效（disabled)而產生。 中-風 根據上述構想，其巾該第二流通量係由使立 反向旋轉而產生。 ""Ύ 其中該第二流通量係由使其中 其中该第二流通量係由使其中 根據上述構想 減速旋轉而產生。 根據上述構想 1268136 改裝成風車裝置而產生。 了解本發明得藉由下列圖式及詳細說明，俾得—更深入之 【實施方式】 在本發明下面所述的具體實施例中，复 設備之組成與第！圖⑷所述的通 I =通訊 為避免不必要的重複，下面的實施例將只針ϋΓ同。 計配置及其操作方式詳加說明，而且，各 將以配合與第1圖⑷相_元件符絲表示。…凡件 請參閱第2圖⑷赫，其係表轉照本發明的第一 具體貫施例的一改良式風扇牆配置 :2X2風扇牆配置，㈣⑷所示的風扇::置1:二) =:-個風扇’在本發明中，該移除該風扇的；域Ϊ 義為控制區域40,。請進-步參照第2圖（B)所示， 表示對應第2目⑴之風錢配置結構，對機箱内部所迭 成的流場分佈之模擬圖。從第2圖⑻中可以看出該移^ 掉風扇.的該控制區域40’内的流場相較於第i圖（β,相石 位置上的流場產生變化。從風速的分佈情況可以看出= 制區域40’内的流通量因為氣流反向（從由下往上流動= 為由上往下流動）而改變’因而在該機箱中之控制區域如， 範圍内形成-迴流（circulation)情況，因而造成該控制 區域40’範圍内冷卻效果的提昇。 根據上述情況，本發明進一步提出以下幾種可使機箱 内的流場產生迴流情況的風扇牆配置架構及風扇膽操作方 1268136 式的具體實施例：1268136 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to the configuration of a fan wall, and in particular to a configuration of a fan wall applied to a communication device. [Prior Art] In a communication device, such as a data switch, a communication device and a power supply device in the phase of the field are often required to generate a great heat source inside the chassis of the data switch. However, for integrated circuit chips of most electronic products, the generation of heat sources not only affects the operational performance of the electronic chip, but also the excessive operating temperature for a long time; it is more likely to greatly reduce the life of the wafer. Therefore, how to reduce the ambient temperature inside the ventilation equipment is one of the important keys to the design of the orbital equipment. In the field of electronic heat dissipation, the use of fans to promote air convection has been a common means of overcoming heat dissipation in this field. However, in order to cope with the increasingly serious heat dissipation problem, increasing the number of configured fans to enhance the convection effect around the surrounding has gradually become a necessary means to overcome the heat dissipation problem. In communication equipment, such as the commonly used (10) specification (430x415x550 mm) data switch, on one of the two sides of the chassis, a fan wall (FanTrayy) composed of a plurality of fans is installed to enhance the heat convection inside the chassis. It is quite common in the field - a means of heat dissipation. Please refer to the figure (4)'s diagram: in the technology, the configuration of 9U size communication equipment and its heat dissipation module. As shown in Figure 1 (a) The communication device 100 includes a chassis 1 , wherein the communication box 3 box ι〇1268136 can be configured with seven communication boards 20 and two power supply units 3, wherein the plurality of electronic boards are further provided on the communication board 20 2{Π. During the operation of the communication device, the power supply 3 and the chips 2〇1: heat generated by the operation of the wafer or the power supply of the power supply, which needs to be 1 ί 10 A fan wall 40 is disposed above the fan wall 40 to allow the hot air inside the chassis 10 to pass through the fan wall 40, 5犄, and the cooling air outside the chassis 10 due to the phenomenon of the milk flowing. We have 0 other vents, 1G and outside air reaches the chassis Please refer to section U shown in (B), which represents the system arrangement of the machine 40 f θ) of the fan wall profile FIG simulated flow field communication device 100 is slightly generated. It can be seen from the 1st (8) that the pull-H from the bottom 40 of the chassis 10 can flow through the fan wall to form a bottom-up. In order to cool the wafer 201 on the communication board 20, the purpose of the air convection inside the fan casing is known. In the autumn, the relationship between the configuration type and the cooling effect of the fan is going to the research of 'and only the S that expands the fan wall area is too deep: the bigger the product is, the more it has. Under conditions, the unlimited increase in wind shoulders is in θ but in a limited design approach. Therefore, the current design of the fan wall = unrealistic area, increasing the number of fans or increasing the size of the fan /, and the cost of the fan wall in the past is not the result of the gain of the kg J. Therefore, for industrial applications, the production of 1268136 A rather unfavorable factor.乂 In summary, the motivation for the invention in this case arises from this. : 2:: Exploring the influence of different fan wall configuration methods on the internalization of the communication damage chassis; and by changing the internal flow field, the wind::ΐ method also hopes to operate by different fan walls杈The fan wall provides better heat dissipation.卞 [Summary of the Invention] The first concept of the present invention is to provide a thermal mechanism configuration, which includes a machine 浐rh° sighing, 匕3 mechanical phase (ChaSS1S), the chassis includes a wafer module And at least -f source for the quilt, the crystal forms a convection channel to generate 敎 敎 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 Side to increase thermal convection inside the chassis. According to the above concept, wherein the fan wall is erected on one side of the inlet side and the outlet side, and the fan wall is ten; = the fan system is independently controlled, so that the 哕 邱 f — — * * * * * * * * * * * the amount. M. The amount of flow in the material portion is formed-controlled. According to the above concept 1 / 4 〇 According to the above concept, it is generated according to the above-described concept. According to the above concept, the towel throughput is caused by disabling. According to the above concept, the control flow is caused by one of the fans, wherein the partial area occupies the area of the fan wall, wherein the fan wall system comprises 2x2 fans. The control flow is generated by removing one of the winds 1268136 from the reverse rotation. According to the above concept, the control flow amount is generated by decelerating and rotating one of the fans. " According to the above concept, wherein the control throughput is generated by conversion into a windmill device. Τ Fan According to the above concept, the control flow rate is generated by changing the aperture ratio of the chassis. Also according to the captain concept, the fan wall is one of the fan walls of 3χ3 and 4th. " The second concept of the present invention is to propose a fan wall wind for a communication device: a configuration of a second one comprising a plurality of fans arranged in a matrix, the feathers being called a main area range and the main area norm, Among them, the amount of the yang towel has a _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Area According to the above concept, wherein the second area is ι/4 of the main area, according to the above concept, wherein the second amount of flow is generated by removing at least one fan. According to the above concept, wherein the second flow amount system is disabled. Mid-Wind According to the above concept, the second amount of circulation of the towel is generated by rotating in the reverse direction. "" Ύ wherein the second amount of flow is caused by the fact that the second amount of flow is caused by decelerating rotation according to the above concept. Produced according to the above concept 1268136 converted into a windmill device. The present invention can be understood from the following drawings and detailed descriptions. Further, in the specific embodiments described below, the composition of the complex device and the first! Figure I (I) Communication I = Communication To avoid unnecessary duplication, the following embodiments will only be identical. The configuration of the meter and its operation mode are described in detail, and each of them will be represented by the symbol of the phase (1) of the first figure (4). For details, please refer to Figure 2 (4), which is a modified fan wall configuration according to the first embodiment of the present invention: 2X2 fan wall configuration, (4) (4) fan: 1:1: 2) =: - a fan 'in the present invention, the fan is removed; the domain is the control area 40. Please refer to Fig. 2 (B) for the simulation of the flow field distribution of the inside of the chassis corresponding to the wind money allocation structure of the second item (1). It can be seen from Fig. 2 (8) that the flow field in the control region 40' of the moving fan is changed compared to the i-th map (β, the flow field at the position of the stone is changed. The distribution of the wind speed can be It can be seen that the flow in the zone 40' is changed by the reverse flow (flow from bottom to top = flow from top to bottom) and thus the control zone in the enclosure, for example, forms a range of recirculation (circulation) The situation, thus causing an increase in the cooling effect in the range of the control region 40'. According to the above situation, the present invention further proposes the following fan wall configuration architecture and the fan operating mode 1268136 for the flow field in the chassis to generate a reflow condition. Specific embodiment:
請參照第3圖⑷及第3圖⑻所示，其係表示將 ，⑴之2x2的風扇牆配置改變為3χ3的風扇膽配置。 Λ施例巾同樣藉由移除掉最外側的兩個風扇來達到 2迴流效果之目的。從第3圖⑻的流場分佈圖中可以 #在私除掉風扇的該控制區域4〇，内同樣因為流通量改 =形成迴流情況。而第4目⑷及第4圖⑻則是將 弟1 _ 2x2的風扇配置結構改變為㈣風扇配置。同樣Referring to Fig. 3 (4) and Fig. 3 (8), it is shown that the fan wall arrangement of 2x2 of (1) is changed to a fan arrangement of 3χ3. The towel is also used to achieve the effect of 2 reflow by removing the two outermost fans. From the flow field distribution map of Fig. 3 (8), the control area 4 of the fan can be removed by privately, and the flow rate is changed to form a reflow condition. On the 4th (4) and 4th (8), the fan configuration of the brother 1 _ 2x2 is changed to the (4) fan configuration. same
的’攸第^4圖（Β)的流場分佈圖中，也可看出類似第2圖 (Β)及第3圖（Β)的流場分佈結果。 這裡須進一步說明的是，前述2χ2、3χ3或㈣的風扇 ，面積毅設計成同樣大小，所以儘管每―種風扇牆所包 :?早一風扇大小是不-樣’但其組合出來的風扇牆面積 Ρ疋致而在才工制區域的規劃方面，由於前述迴流情況 的產生是因為控制區域40’内流通量改變所造成，若控制區 域40’若超過風扇牆面積1/4者，則產生的迴流效果將不明In the flow field distribution map of Fig. 4 (Β), the flow field distribution results similar to those of Fig. 2 (Β) and Fig. 3 (Β) can also be seen. It should be further explained here that the aforementioned 2χ2, 3χ3 or (4) fans are designed to be the same size, so even though each type of fan wall is packaged: the size of the fan is not the same, but the fan wall is combined. The area is reduced and the planning of the area is only due to the change of the flow in the control area 40'. If the control area 40' exceeds 1/4 of the fan wall area, it will be generated. The reflow effect will be unknown
顯。因此’本發明前述的實施例中’都將控制區域4〇,設計 成接近1/4 ’以達到最佳的迴流效果。 另一方面，本發明除了前述移除風扇的設計外，改鐵 該控制區域40’流通量的方法也可以透過將該控制區域J； 上的風扇透過例如斷電的方式失效（disabled)而實施。 這樣的設計可以使餘龍域4G，上的風顧而不用、，並省 去風扇移除步驟上的麻煩。較佳者，也可透過風扇牆電路 之設計達到進-步任意調整該控制區域4()，位置之目的。除 10 1268136 控制外’該控制區域4〇，上的風扇更可以替換置 的流通量之目的。例如在該控制區域40, 迴流車結構的W ’㈣到大幅提昇 過風之風扇配置結構之設料，本發明更提出透 目Π ί之控制，來達到改變控制區域4〇,流通量之 的、、第5目，其係表示一2x2風扇騰配置情況下 ::场刀佈情況。與第！圖⑻ =制區域4〇,⑽風扇係改為由上往下通：因:該 二二^下方的迴流情況更為明顯。在另一較佳實施例 中，柄明更提出透過該風扇牆上各風扇之間不同的轉速 ^而^生流通量變化的構想。請參閱第6圖之流場分佈 圖’，、係說明該圖式上方的兩個風扇減速運轉的情況下， 所產生的流場分佈情況。從圖中也可以看出控制區域仙， (兩個減速運轉的風扇區域）使得另二個未減速的風扇區 域的流量增加而加速散熱的效果。 示 ^述第1目到第6 ®的風扇牆配置或運轉方式的設計 下’該通訊設備機箱内的的晶片溫度情況整理如下表i所Obvious. Therefore, in the foregoing embodiment of the present invention, the control region 4 is designed to be close to 1/4' to achieve an optimum reflow effect. On the other hand, in addition to the foregoing design of removing the fan, the method of changing the flow of the control region 40' can also be implemented by disabling the fan on the control region J; for example, by means of power failure. . This design can make the Yulong domain 4G, without any use, and saves the trouble of the fan removal step. Preferably, the design of the fan wall circuit can also be used to arbitrarily adjust the control area 4 () for the purpose of the position. In addition to 10 1268136 control, the control area 4〇, the fan on the other can replace the flow of the purpose. For example, in the control area 40, the W' (4) of the recirculating vehicle structure to the material of the fan arrangement structure for greatly increasing the over-winding, the present invention further proposes to control the change of the control area 4, the flow amount. , Item 5, which indicates a 2x2 fan configuration:: field knife cloth. With the first! Figure (8) = system area 4〇, (10) fan system is changed from top to bottom: because: the reflux condition under the two two ^ ^ is more obvious. In another preferred embodiment, the handle further proposes a change in the flow rate through the different rotational speeds of the fans on the wall of the fan. Please refer to the flow field distribution diagram of Fig. 6, which shows the distribution of the flow field generated when the two fans above the figure are decelerating. It can also be seen from the figure that the control area, (the two decelerating fan areas), increases the flow rate of the other two unreduced fan areas and accelerates the heat dissipation. The design of the fan wall configuration or operation mode of the first to sixth ® is shown in the following table.
7風扇配置 (第 3 φ (B)) 79.9 °C 84.1 °C 11 1268136 12風扇配置 (β)) 84.9 °C 88.0 °c 88.2 °C 1反向風扇配置 圖） 0 vl-' -_h , __ 70.5 °C 72.8 °c 74.4 °C 2减連風扇配置 —(^6 岡) 82.5 °C ! 85.2 °c —— .1 ™ -----—-, 86.1 °c7 fan configuration (3rd φ (B)) 79.9 °C 84.1 °C 11 1268136 12 fan configuration (β) 84.9 °C 88.0 °c 88.2 °C 1 reverse fan configuration) 0 vl-' -_h , __ 70.5 °C 72.8 °c 74.4 °C 2 Reduced fan configuration—(^6 冈) 82.5 °C ! 85.2 °c —— .1 TM -------, 86.1 °c
μ M B u . ^ T ’溫度最高的通 。板上的日日片溫度為例。其中，晶片丨 乂 上往下排列，也就是說晶片j最靠近 從上述的列表中可以看出，在如第 χ2風扇配置結構中，由於機箱内部 产 "r5 因而、，产乾r而晶片3因為於機箱最内侧， 應用如前述實施例中之第2_6圖的改 配置結構後，晶片溫度的分佈明顯發生變化。 ’晶片Η的溫度在對應帛2_6圖的且體實 最明顯’而晶片5則因為距離風扇較遠，而 受化。不過，儘管如此，透過上述參照第Μ圖 依然可以有效改善通訊設備内的溫度分佈，而 違到提幵冷部效果之目的。 風扇= 種;較佳散熱能力的 槎輕社罢由^、左八作方式。k刖述贯施例的說明及其 盆:古Π W看出’本發明所提出的風扇牆配置結構及 用I:不僅具有更佳的散熱能力，而且可以減少風扇 二曰曰、風扇個數，具有降低成本的優勢、然而，必須 勺疋上述Λ施例僅用以說明本發明之較佳實施方 12 1268136 式，然而本發明之範圍當不受限於該上述之各 :式广發明得由熟悉技藝之人任施匠思而為 飾’然不脫如附申請範圍所欲保護者。 以修 [圖式簡單說明】 第1圖（A)及（β)係表示一通訊設備配置知 風^配置結構及該風扇牆作用下所形成的流場分#;、 =2圖⑷及⑻係表示本發明第一實施 訊設備配置-改良式的風扇牆配置結構牆= 所形成的流場分佈； …回作用下 們=:一(？ & (β)係表示本發明第二實施例之-通 所^^〜式賴4牆配置結構及該風扇牆作用下 所形成的流場分佈； 訊設及、(Β)係表示本發明第三實施例之-通 所开I成的流場=式的風扇牆配置結構及該風扇牆作用下 係表示本發明第四實施例之—通訊設備配置一 佈^以及。通風區域之風扇騰配置結構所形成的流場分 五實施例之一通訊設備配置一 所形成的流場分佈。 第6圖係表示本發明第 具轉速差之風扇牆配置結構 【主要元件符號說明】 101 11 21 通訊設備 機箱（chassis) 通訊板 13 1268136 202 晶片 31 電源供應器 41 風扇牆 40’ 控制區域μ M B u . ^ T ' The highest temperature pass. Take the temperature of the day and piece on the board as an example. Wherein, the wafers are arranged upside down, that is to say, the wafer j is closest to the above list, and in the fan arrangement structure as in the second embodiment, since the inside of the chassis is produced, the wafer is produced and dried. 3 Since the innermost side of the chassis is applied, the distribution of the wafer temperature is significantly changed after the configuration of the second embodiment of the second embodiment is applied. The temperature of the wafer turns on the corresponding 帛2_6 and is the most obvious, while the wafer 5 is affected by the distance from the fan. However, despite this, the above-mentioned reference to the figure can still effectively improve the temperature distribution in the communication equipment, and it is against the purpose of lifting the cold part. Fan = species; better heat dissipation ability 槎 light society by ^, left eight way.刖 的 刖 的 及其 及其 及其 及其 : : : : : : : : : : : : 看出 看出 看出 看出 看出 看出 看出 看出 看出 看出 看出 看出 看出 看出 看出 看出 看出 看出 看出 看出 看出 看出 看出 看出 看出 看出 看出There is an advantage of cost reduction, however, the above embodiments must be used only to illustrate the preferred embodiment of the present invention 12 1268136, but the scope of the present invention is not limited to the above: It is the decoration of the person who is familiar with the craftsmanship. Fig. 1 (A) and (β) show a communication device configuration knowledge structure and the flow field formed by the fan wall; #, =2 (4) and (8) It is a device configuration of the first embodiment of the present invention - an improved fan wall configuration structure wall = a flow field distribution formed; ... a back action =: a (? & (β) system represents a second embodiment of the present invention The configuration of the wall and the distribution of the flow field formed by the fan wall; the information and the (Β) system represent the flow field of the third embodiment of the present invention. The configuration of the fan wall and the function of the fan wall indicate that the communication device is configured according to the fourth embodiment of the present invention, and the flow field formed by the fan configuration of the ventilation area is divided into five embodiments. Configuring a formed flow field distribution. Fig. 6 shows the fan wall configuration structure of the present invention with the difference in rotational speed [Main component symbol description] 101 11 21 Communication equipment chassis communication board 13 1268136 202 wafer 31 power supply 41 fan wall 40' control area