TWI265622B - Semiconductor package security features using thermochromatic inks and three-dimensional identification coding - Google Patents
Semiconductor package security features using thermochromatic inks and three-dimensional identification codingInfo
- Publication number
- TWI265622B TWI265622B TW094110072A TW94110072A TWI265622B TW I265622 B TWI265622 B TW I265622B TW 094110072 A TW094110072 A TW 094110072A TW 94110072 A TW94110072 A TW 94110072A TW I265622 B TWI265622 B TW I265622B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor package
- security features
- identification coding
- dimensional identification
- package security
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/57—Protection from inspection, reverse engineering or tampering
- H01L23/573—Protection from inspection, reverse engineering or tampering using passive means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Printing Methods (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/816,408 US7154170B2 (en) | 2004-03-31 | 2004-03-31 | Semiconductor package security features using thermochromatic inks and three-dimensional identification coding |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200605311A TW200605311A (en) | 2006-02-01 |
TWI265622B true TWI265622B (en) | 2006-11-01 |
Family
ID=34964091
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094110072A TWI265622B (en) | 2004-03-31 | 2005-03-30 | Semiconductor package security features using thermochromatic inks and three-dimensional identification coding |
Country Status (5)
Country | Link |
---|---|
US (2) | US7154170B2 (zh) |
KR (1) | KR20070006821A (zh) |
CN (1) | CN100524729C (zh) |
TW (1) | TWI265622B (zh) |
WO (1) | WO2005098948A1 (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG106050A1 (en) * | 2000-03-13 | 2004-09-30 | Megic Corp | Method of manufacture and identification of semiconductor chip marked for identification with internal marking indicia and protection thereof by non-black layer and device produced thereby |
US7154170B2 (en) | 2004-03-31 | 2006-12-26 | Intel Corporation | Semiconductor package security features using thermochromatic inks and three-dimensional identification coding |
US9677014B2 (en) | 2011-01-19 | 2017-06-13 | Exxonmobil Chemical Patents Inc. | Process and apparatus for converting hydrocarbons |
EP2898029B1 (en) | 2011-12-30 | 2019-01-23 | Tetra Laval Holdings & Finance SA | Laminated color forming composition |
CN102717759A (zh) * | 2012-06-29 | 2012-10-10 | 北京汽车股份有限公司 | 一种车用堵孔贴片及其制作方法 |
US20140258156A1 (en) * | 2013-03-05 | 2014-09-11 | Achilleas Tziazas | System and method to authenticate integrated circuits |
KR20150047337A (ko) * | 2013-10-24 | 2015-05-04 | 삼성전자주식회사 | 화상 형성 작업을 수행하는 방법, 장치 및 기록매체 |
GB201408261D0 (en) * | 2014-05-09 | 2014-06-25 | Harper Paul I | Headlamp adaptor and means for applying the same |
KR102314403B1 (ko) * | 2014-11-14 | 2021-10-19 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조방법 |
US11340287B2 (en) * | 2018-07-25 | 2022-05-24 | Intel Corporation | Capacitor with visual indicator |
US11063000B2 (en) * | 2019-01-29 | 2021-07-13 | Infineon Technologies Ag | Semiconductor package authentication feature |
DE102019110191A1 (de) | 2019-04-17 | 2020-10-22 | Infineon Technologies Ag | Package aufweisend einen Identifizierer auf und/oder in einem Träger |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63244652A (ja) | 1987-03-30 | 1988-10-12 | Nec Corp | 集積回路 |
US4922242A (en) * | 1987-11-12 | 1990-05-01 | Raychem Corporation | Apparatus exhibiting PTC behavior useful for displaying information |
US5223958A (en) * | 1988-12-30 | 1993-06-29 | Hyperdesign, Inc. | Heat activated amusement device employing microencapsulated thermochromic liquid crystal |
US5673028A (en) * | 1993-01-07 | 1997-09-30 | Levy; Henry A. | Electronic component failure indicator |
US6229514B1 (en) * | 1995-11-13 | 2001-05-08 | Array Printers Publ. Ab | Display device and method for visualizing computer generated image information |
US6396927B1 (en) * | 1995-05-25 | 2002-05-28 | Verify First Technologies, Inc. | Variable density verification |
JPH11154210A (ja) | 1997-11-20 | 1999-06-08 | Mitsubishi Paper Mills Ltd | Icカード |
GB2345264B (en) * | 1998-12-29 | 2001-01-24 | Rue De Int Ltd | Improvement in security features |
GB2347646B (en) * | 1999-03-12 | 2001-01-31 | Rue De Int Ltd | Improvements in security elements |
EP1066978A3 (en) | 1999-07-09 | 2001-03-28 | Scientific Games International Limited | Security of printing articles |
DE10039377A1 (de) * | 1999-09-03 | 2001-03-08 | Merck Patent Gmbh | Thermochromes flüssigkristallines Medium |
US6731221B1 (en) * | 1999-12-20 | 2004-05-04 | Intel Corporation | Electrically modifiable product labeling |
US6580413B1 (en) * | 2000-05-19 | 2003-06-17 | The United States Of America As Represented By The Secretary Of The Army | Method and apparatus for the low cost formation and control of images on conformal materials |
FR2809388B1 (fr) * | 2000-05-23 | 2002-12-20 | Saint Gobain Vitrage | Vitrage comprenant au moins une couche a proprietes thermochromes |
JP4873776B2 (ja) | 2000-11-30 | 2012-02-08 | ソニー株式会社 | 非接触icカード |
US6929356B2 (en) | 2001-03-21 | 2005-08-16 | Canon Kabushiki Kaisha | Container of consumable supplies for a printer and printer utilizing the container |
US6800106B2 (en) * | 2003-02-25 | 2004-10-05 | William K. Cogar, Sr. | Thermochromic filter apparatus for computer |
US7154170B2 (en) | 2004-03-31 | 2006-12-26 | Intel Corporation | Semiconductor package security features using thermochromatic inks and three-dimensional identification coding |
-
2004
- 2004-03-31 US US10/816,408 patent/US7154170B2/en not_active Expired - Fee Related
-
2005
- 2005-03-29 KR KR1020067020468A patent/KR20070006821A/ko not_active Application Discontinuation
- 2005-03-29 CN CNB2005800101181A patent/CN100524729C/zh not_active Expired - Fee Related
- 2005-03-29 WO PCT/US2005/010531 patent/WO2005098948A1/en active Application Filing
- 2005-03-30 TW TW094110072A patent/TWI265622B/zh not_active IP Right Cessation
-
2006
- 2006-02-27 US US11/363,962 patent/US7157301B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7154170B2 (en) | 2006-12-26 |
US7157301B2 (en) | 2007-01-02 |
US20060145324A1 (en) | 2006-07-06 |
US20050224791A1 (en) | 2005-10-13 |
WO2005098948A1 (en) | 2005-10-20 |
CN100524729C (zh) | 2009-08-05 |
CN1938852A (zh) | 2007-03-28 |
KR20070006821A (ko) | 2007-01-11 |
TW200605311A (en) | 2006-02-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |