TWI265193B - Abrasive for chemical mechanical polishing and method for producing the same - Google Patents

Abrasive for chemical mechanical polishing and method for producing the same

Info

Publication number
TWI265193B
TWI265193B TW093130784A TW93130784A TWI265193B TW I265193 B TWI265193 B TW I265193B TW 093130784 A TW093130784 A TW 093130784A TW 93130784 A TW93130784 A TW 93130784A TW I265193 B TWI265193 B TW I265193B
Authority
TW
Taiwan
Prior art keywords
shell
abrasive
mechanical polishing
chemical mechanical
suspension
Prior art date
Application number
TW093130784A
Other languages
Chinese (zh)
Other versions
TW200521215A (en
Inventor
Su-Chul Chung
Seung-Ho Lee
Hyung-Mi Lim
Dae-Sun Ryu
Gyong-Beum Ko
Original Assignee
Dongjin Semichem Co Ltd
Korea Inst Ceramic Eng & Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongjin Semichem Co Ltd, Korea Inst Ceramic Eng & Tech filed Critical Dongjin Semichem Co Ltd
Publication of TW200521215A publication Critical patent/TW200521215A/en
Application granted granted Critical
Publication of TWI265193B publication Critical patent/TWI265193B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09GPOLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00Polishing compositions
    • C09G1/02Polishing compositions containing abrasives or grinding agents
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1409Abrasive particles per se
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1436Composite particles, e.g. coated particles
    • C09K3/1445Composite particles, e.g. coated particles the coating consisting exclusively of metals
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1454Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

An abrasive for chemical mechanical polishing, which is produced by hydrothermally treating a ceria particle coated silica, is disclosed. The abrasive for chemical mechanical polishing includes a silica core, a first shell for coating the silica core; and a second shell for coating the first shell, wherein the first shell is made of ceria particles and the second shell is made of silica particles. The method for producing an abrasive for chemical mechanical polishing comprises the steps of: (a) preparing ceria particle suspension by mixing aqueous ammonia and aqueous cerous nitrate solution and stirring the solution; (b) preparing core/shell particles by adding colloidal silica slurry into the prepared ceria particle suspension and stirring the suspension; (c) washing the suspension; and (d) hydrothermally treating the washed suspension.
TW093130784A 2003-10-10 2004-10-11 Abrasive for chemical mechanical polishing and method for producing the same TWI265193B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020030070684A KR100574225B1 (en) 2003-10-10 2003-10-10 Silica/Ceria/Silica Composite Particles for CMP slurry and Process for its production

Publications (2)

Publication Number Publication Date
TW200521215A TW200521215A (en) 2005-07-01
TWI265193B true TWI265193B (en) 2006-11-01

Family

ID=34431688

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093130784A TWI265193B (en) 2003-10-10 2004-10-11 Abrasive for chemical mechanical polishing and method for producing the same

Country Status (3)

Country Link
KR (1) KR100574225B1 (en)
TW (1) TWI265193B (en)
WO (1) WO2005035688A1 (en)

Cited By (1)

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DE102011100935A1 (en) 2010-06-18 2011-12-22 Everlight Usa, Inc. Blue, red and yellow dye compounds and black ink composition containing them

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KR100614218B1 (en) * 2004-06-21 2006-08-21 고려대학교 산학협력단 Method of coating cerium dioxide on nano-sized silicon dioxide by using RF plasma and abrasive particles
KR101279970B1 (en) * 2008-12-31 2013-07-05 제일모직주식회사 CMP slurry composition for polishing metal wiring
EP2438133B1 (en) 2009-06-05 2018-07-11 Basf Se Polishing slurry containing raspberry-type metal oxide nanostructures coated with CeO2
EP2428541B1 (en) 2010-09-08 2019-03-06 Basf Se Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon films
TWI598434B (en) 2010-09-08 2017-09-11 巴斯夫歐洲公司 Aqueous polishing compositions containing n-substituted diazenium dioxides and/or n'-hydroxy-diazenium oxide salts
SG188460A1 (en) 2010-09-08 2013-04-30 Basf Se Aqueous polishing composition and process for chemically mechanically polishing substrate materials for electrical, mechanical and optical devices
CN103249790A (en) 2010-12-10 2013-08-14 巴斯夫欧洲公司 Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon films
CN102653633B (en) * 2011-03-03 2013-12-11 台湾永光化学工业股份有限公司 Blue, red, and yellow dye compounds and black ink composition composed of blue, red, and yellow dye compounds
CN103814102B (en) * 2011-09-20 2017-12-05 堺化学工业株式会社 Glass grinding composite particles
US10011752B2 (en) 2012-09-05 2018-07-03 Konica Minolta, Inc. Production method for polishing-material particles
WO2014045939A1 (en) * 2012-09-19 2014-03-27 コニカミノルタ株式会社 Method for producing polishing material particles
JP2016055352A (en) * 2013-02-05 2016-04-21 コニカミノルタ株式会社 Abrasive slurry
EP2954978B1 (en) * 2013-02-05 2020-05-20 Konica Minolta, Inc. Core/shell-type inorganic particles
JP2016056215A (en) * 2013-02-05 2016-04-21 コニカミノルタ株式会社 Method for producing abrasive material
JP2016055351A (en) * 2013-02-05 2016-04-21 コニカミノルタ株式会社 Abrasive slurry
EP2826827B1 (en) 2013-07-18 2019-06-12 Basf Se CMP composition comprising abrasive particles containing ceria
CN107078054A (en) * 2014-10-30 2017-08-18 应用材料公司 Ceria slurry based on nano-particle
JP6510812B2 (en) * 2014-12-26 2019-05-08 花王株式会社 Polishing particles for polishing silicon oxide film
KR102090984B1 (en) * 2015-03-31 2020-03-19 니끼 쇼꾸바이 카세이 가부시키가이샤 Silica-based composite fine-particle dispersion, method for producing same, and polishing slurry including silica-based composite fine-particle dispersion
JP6648064B2 (en) * 2016-04-22 2020-02-14 日揮触媒化成株式会社 Silica-based composite fine particle dispersion, method for producing the same, and polishing abrasive dispersion containing silica-based composite fine particle dispersion
JP6588050B2 (en) * 2016-04-22 2019-10-09 日揮触媒化成株式会社 Polishing abrasive dispersion containing silica composite fine particles
WO2017183452A1 (en) * 2016-04-22 2017-10-26 日揮触媒化成株式会社 Silica-based composite fine particle dispersion and method for manufacturing same
JP6829007B2 (en) * 2016-05-18 2021-02-10 日揮触媒化成株式会社 A polishing slurry containing a silica-based composite fine particle dispersion, a method for producing the same, and a silica-based composite fine particle dispersion.
CN109937187B (en) * 2016-11-14 2022-08-09 日挥触媒化成株式会社 Cerium oxide-based composite microparticle dispersion, method for producing same, and abrasive particle dispersion for polishing containing cerium oxide-based composite microparticle dispersion
JP6797665B2 (en) * 2016-12-20 2020-12-09 花王株式会社 Abrasive liquid composition
CN106675519A (en) * 2016-12-21 2017-05-17 安徽中创电子信息材料有限公司 Inorganic compound abrasive and preparation method thereof
US10319601B2 (en) 2017-03-23 2019-06-11 Applied Materials, Inc. Slurry for polishing of integrated circuit packaging
US20190127607A1 (en) 2017-10-27 2019-05-02 Versum Materials Us, Llc Composite Particles, Method of Refining and Use Thereof
JP7015200B2 (en) * 2018-03-29 2022-02-02 日揮触媒化成株式会社 Abrasive grain dispersion for polishing containing ceria-based composite fine particle dispersion, its manufacturing method, and ceria-based composite fine particle dispersion.
JP2018168063A (en) * 2018-07-12 2018-11-01 日揮触媒化成株式会社 Method for producing silica composite particle dispersion
US11718767B2 (en) 2018-08-09 2023-08-08 Versum Materials Us, Llc Chemical mechanical planarization composition for polishing oxide materials and method of use thereof
EP4065658A1 (en) * 2019-11-26 2022-10-05 Rhodia Operations Liquid dispersion and powder of cerium based core-shell particles, process for producing the same and uses thereof in polishing
CN114591687A (en) * 2022-03-18 2022-06-07 深圳市瑞来稀土材料有限公司 Rare earth polishing powder for semiconductor wafer polishing treatment and preparation method thereof
CN115926746B (en) * 2022-10-24 2024-06-07 国家纳米科学中心 Nano cerium silicon composite oxide particles, preparation method and application thereof

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JPH0280309A (en) * 1988-09-14 1990-03-20 Toshiba Ceramics Co Ltd Production of alpha type silicon nitride powder
US5855841A (en) * 1991-12-23 1999-01-05 Commonwealth Scientific And Industrial Research Organisation Process for producing dense ceramic product
BR9307095A (en) * 1992-09-25 1999-03-30 Minnesota Mining & Mfg Process for preparing abrasive grains
CN1105698C (en) * 1993-11-12 2003-04-16 美国3M公司 Abrasive grain and method for making the same
US6645265B1 (en) * 2002-07-19 2003-11-11 Saint-Gobain Ceramics And Plastics, Inc. Polishing formulations for SiO2-based substrates

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011100935A1 (en) 2010-06-18 2011-12-22 Everlight Usa, Inc. Blue, red and yellow dye compounds and black ink composition containing them

Also Published As

Publication number Publication date
WO2005035688A1 (en) 2005-04-21
KR100574225B1 (en) 2006-04-26
KR20050034913A (en) 2005-04-15
TW200521215A (en) 2005-07-01

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