TWI265193B - Abrasive for chemical mechanical polishing and method for producing the same - Google Patents
Abrasive for chemical mechanical polishing and method for producing the sameInfo
- Publication number
- TWI265193B TWI265193B TW093130784A TW93130784A TWI265193B TW I265193 B TWI265193 B TW I265193B TW 093130784 A TW093130784 A TW 093130784A TW 93130784 A TW93130784 A TW 93130784A TW I265193 B TWI265193 B TW I265193B
- Authority
- TW
- Taiwan
- Prior art keywords
- shell
- abrasive
- mechanical polishing
- chemical mechanical
- suspension
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
- C09K3/1445—Composite particles, e.g. coated particles the coating consisting exclusively of metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Composite Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
An abrasive for chemical mechanical polishing, which is produced by hydrothermally treating a ceria particle coated silica, is disclosed. The abrasive for chemical mechanical polishing includes a silica core, a first shell for coating the silica core; and a second shell for coating the first shell, wherein the first shell is made of ceria particles and the second shell is made of silica particles. The method for producing an abrasive for chemical mechanical polishing comprises the steps of: (a) preparing ceria particle suspension by mixing aqueous ammonia and aqueous cerous nitrate solution and stirring the solution; (b) preparing core/shell particles by adding colloidal silica slurry into the prepared ceria particle suspension and stirring the suspension; (c) washing the suspension; and (d) hydrothermally treating the washed suspension.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030070684A KR100574225B1 (en) | 2003-10-10 | 2003-10-10 | Silica/Ceria/Silica Composite Particles for CMP slurry and Process for its production |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200521215A TW200521215A (en) | 2005-07-01 |
TWI265193B true TWI265193B (en) | 2006-11-01 |
Family
ID=34431688
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093130784A TWI265193B (en) | 2003-10-10 | 2004-10-11 | Abrasive for chemical mechanical polishing and method for producing the same |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100574225B1 (en) |
TW (1) | TWI265193B (en) |
WO (1) | WO2005035688A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011100935A1 (en) | 2010-06-18 | 2011-12-22 | Everlight Usa, Inc. | Blue, red and yellow dye compounds and black ink composition containing them |
Families Citing this family (34)
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---|---|---|---|---|
KR100614218B1 (en) * | 2004-06-21 | 2006-08-21 | 고려대학교 산학협력단 | Method of coating cerium dioxide on nano-sized silicon dioxide by using RF plasma and abrasive particles |
KR101279970B1 (en) * | 2008-12-31 | 2013-07-05 | 제일모직주식회사 | CMP slurry composition for polishing metal wiring |
EP2438133B1 (en) | 2009-06-05 | 2018-07-11 | Basf Se | Polishing slurry containing raspberry-type metal oxide nanostructures coated with CeO2 |
EP2428541B1 (en) | 2010-09-08 | 2019-03-06 | Basf Se | Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon films |
TWI598434B (en) | 2010-09-08 | 2017-09-11 | 巴斯夫歐洲公司 | Aqueous polishing compositions containing n-substituted diazenium dioxides and/or n'-hydroxy-diazenium oxide salts |
SG188460A1 (en) | 2010-09-08 | 2013-04-30 | Basf Se | Aqueous polishing composition and process for chemically mechanically polishing substrate materials for electrical, mechanical and optical devices |
CN103249790A (en) | 2010-12-10 | 2013-08-14 | 巴斯夫欧洲公司 | Aqueous polishing composition and process for chemically mechanically polishing substrates containing silicon oxide dielectric and polysilicon films |
CN102653633B (en) * | 2011-03-03 | 2013-12-11 | 台湾永光化学工业股份有限公司 | Blue, red, and yellow dye compounds and black ink composition composed of blue, red, and yellow dye compounds |
CN103814102B (en) * | 2011-09-20 | 2017-12-05 | 堺化学工业株式会社 | Glass grinding composite particles |
US10011752B2 (en) | 2012-09-05 | 2018-07-03 | Konica Minolta, Inc. | Production method for polishing-material particles |
WO2014045939A1 (en) * | 2012-09-19 | 2014-03-27 | コニカミノルタ株式会社 | Method for producing polishing material particles |
JP2016055352A (en) * | 2013-02-05 | 2016-04-21 | コニカミノルタ株式会社 | Abrasive slurry |
EP2954978B1 (en) * | 2013-02-05 | 2020-05-20 | Konica Minolta, Inc. | Core/shell-type inorganic particles |
JP2016056215A (en) * | 2013-02-05 | 2016-04-21 | コニカミノルタ株式会社 | Method for producing abrasive material |
JP2016055351A (en) * | 2013-02-05 | 2016-04-21 | コニカミノルタ株式会社 | Abrasive slurry |
EP2826827B1 (en) | 2013-07-18 | 2019-06-12 | Basf Se | CMP composition comprising abrasive particles containing ceria |
CN107078054A (en) * | 2014-10-30 | 2017-08-18 | 应用材料公司 | Ceria slurry based on nano-particle |
JP6510812B2 (en) * | 2014-12-26 | 2019-05-08 | 花王株式会社 | Polishing particles for polishing silicon oxide film |
KR102090984B1 (en) * | 2015-03-31 | 2020-03-19 | 니끼 쇼꾸바이 카세이 가부시키가이샤 | Silica-based composite fine-particle dispersion, method for producing same, and polishing slurry including silica-based composite fine-particle dispersion |
JP6648064B2 (en) * | 2016-04-22 | 2020-02-14 | 日揮触媒化成株式会社 | Silica-based composite fine particle dispersion, method for producing the same, and polishing abrasive dispersion containing silica-based composite fine particle dispersion |
JP6588050B2 (en) * | 2016-04-22 | 2019-10-09 | 日揮触媒化成株式会社 | Polishing abrasive dispersion containing silica composite fine particles |
WO2017183452A1 (en) * | 2016-04-22 | 2017-10-26 | 日揮触媒化成株式会社 | Silica-based composite fine particle dispersion and method for manufacturing same |
JP6829007B2 (en) * | 2016-05-18 | 2021-02-10 | 日揮触媒化成株式会社 | A polishing slurry containing a silica-based composite fine particle dispersion, a method for producing the same, and a silica-based composite fine particle dispersion. |
CN109937187B (en) * | 2016-11-14 | 2022-08-09 | 日挥触媒化成株式会社 | Cerium oxide-based composite microparticle dispersion, method for producing same, and abrasive particle dispersion for polishing containing cerium oxide-based composite microparticle dispersion |
JP6797665B2 (en) * | 2016-12-20 | 2020-12-09 | 花王株式会社 | Abrasive liquid composition |
CN106675519A (en) * | 2016-12-21 | 2017-05-17 | 安徽中创电子信息材料有限公司 | Inorganic compound abrasive and preparation method thereof |
US10319601B2 (en) | 2017-03-23 | 2019-06-11 | Applied Materials, Inc. | Slurry for polishing of integrated circuit packaging |
US20190127607A1 (en) | 2017-10-27 | 2019-05-02 | Versum Materials Us, Llc | Composite Particles, Method of Refining and Use Thereof |
JP7015200B2 (en) * | 2018-03-29 | 2022-02-02 | 日揮触媒化成株式会社 | Abrasive grain dispersion for polishing containing ceria-based composite fine particle dispersion, its manufacturing method, and ceria-based composite fine particle dispersion. |
JP2018168063A (en) * | 2018-07-12 | 2018-11-01 | 日揮触媒化成株式会社 | Method for producing silica composite particle dispersion |
US11718767B2 (en) | 2018-08-09 | 2023-08-08 | Versum Materials Us, Llc | Chemical mechanical planarization composition for polishing oxide materials and method of use thereof |
EP4065658A1 (en) * | 2019-11-26 | 2022-10-05 | Rhodia Operations | Liquid dispersion and powder of cerium based core-shell particles, process for producing the same and uses thereof in polishing |
CN114591687A (en) * | 2022-03-18 | 2022-06-07 | 深圳市瑞来稀土材料有限公司 | Rare earth polishing powder for semiconductor wafer polishing treatment and preparation method thereof |
CN115926746B (en) * | 2022-10-24 | 2024-06-07 | 国家纳米科学中心 | Nano cerium silicon composite oxide particles, preparation method and application thereof |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0280309A (en) * | 1988-09-14 | 1990-03-20 | Toshiba Ceramics Co Ltd | Production of alpha type silicon nitride powder |
US5855841A (en) * | 1991-12-23 | 1999-01-05 | Commonwealth Scientific And Industrial Research Organisation | Process for producing dense ceramic product |
BR9307095A (en) * | 1992-09-25 | 1999-03-30 | Minnesota Mining & Mfg | Process for preparing abrasive grains |
CN1105698C (en) * | 1993-11-12 | 2003-04-16 | 美国3M公司 | Abrasive grain and method for making the same |
US6645265B1 (en) * | 2002-07-19 | 2003-11-11 | Saint-Gobain Ceramics And Plastics, Inc. | Polishing formulations for SiO2-based substrates |
-
2003
- 2003-10-10 KR KR1020030070684A patent/KR100574225B1/en active IP Right Grant
-
2004
- 2004-10-09 WO PCT/KR2004/002584 patent/WO2005035688A1/en active Application Filing
- 2004-10-11 TW TW093130784A patent/TWI265193B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011100935A1 (en) | 2010-06-18 | 2011-12-22 | Everlight Usa, Inc. | Blue, red and yellow dye compounds and black ink composition containing them |
Also Published As
Publication number | Publication date |
---|---|
WO2005035688A1 (en) | 2005-04-21 |
KR100574225B1 (en) | 2006-04-26 |
KR20050034913A (en) | 2005-04-15 |
TW200521215A (en) | 2005-07-01 |
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MM4A | Annulment or lapse of patent due to non-payment of fees |