TWI265176B - Curing composition for forming a heat-conductive sheet, heat-conductive sheet, production thereof and heat sink structure - Google Patents

Curing composition for forming a heat-conductive sheet, heat-conductive sheet, production thereof and heat sink structure

Info

Publication number
TWI265176B
TWI265176B TW89124110A TW89124110A TWI265176B TW I265176 B TWI265176 B TW I265176B TW 89124110 A TW89124110 A TW 89124110A TW 89124110 A TW89124110 A TW 89124110A TW I265176 B TWI265176 B TW I265176B
Authority
TW
Taiwan
Prior art keywords
heat
conductive sheet
production
forming
curing composition
Prior art date
Application number
TW89124110A
Other languages
Chinese (zh)
Inventor
Takeo Hara
Shinichiro Iwanaga
Hozumi Sato
Ryoji Setaka
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP32575799A external-priority patent/JP2001139833A/en
Priority claimed from JP2000027738A external-priority patent/JP2001214075A/en
Priority claimed from JP2000080463A external-priority patent/JP2001261722A/en
Priority claimed from JP2000098943A external-priority patent/JP2001284859A/en
Priority claimed from JP2000132588A external-priority patent/JP2001315244A/en
Application filed by Jsr Corp filed Critical Jsr Corp
Application granted granted Critical
Publication of TWI265176B publication Critical patent/TWI265176B/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

A heat-conductive sheet comprising a cured or semi-cured binder wherein a carbon fiber is orientated in the direction of the thickness of the heat-conductive sheet. This heat-conductive sheet exhibits a high anisotropic heat conductivity along the direction of the thickness thereof to thereby enable efficiently releasing heat from a heating element such as a semiconductor element or semiconductor package. Moreover, the heat-conductive sheet is excellent in not only heat resistance, durability and mechanical strength but also adherence to the heating element.
TW89124110A 1999-11-16 2000-11-14 Curing composition for forming a heat-conductive sheet, heat-conductive sheet, production thereof and heat sink structure TWI265176B (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP32575799A JP2001139833A (en) 1999-11-16 1999-11-16 Composition for highly thermal conductive sheet, highly thermal conductive sheet, preparation method of highly thermal conductive sheet and radiating structure using highly thermal conductive sheet
JP2000027738A JP2001214075A (en) 2000-02-04 2000-02-04 Composition for highly heat conductive sheet, highly heat conductive sheet, method for producing highly heat conductive sheet and heat release structure using highly heat conductive sheet
JP2000080463A JP2001261722A (en) 2000-03-22 2000-03-22 Curable composition for thermal conductive sheet, semicured thermal conductive sheet and method for producing the same
JP2000098943A JP2001284859A (en) 2000-03-31 2000-03-31 Heat-conductive sheet and application thereof
JP2000132588A JP2001315244A (en) 2000-05-01 2000-05-01 Heat conductive sheet, method for manufacturing same and radiation structure using heat conductive sheet

Publications (1)

Publication Number Publication Date
TWI265176B true TWI265176B (en) 2006-11-01

Family

ID=38122110

Family Applications (1)

Application Number Title Priority Date Filing Date
TW89124110A TWI265176B (en) 1999-11-16 2000-11-14 Curing composition for forming a heat-conductive sheet, heat-conductive sheet, production thereof and heat sink structure

Country Status (1)

Country Link
TW (1) TWI265176B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI411658B (en) * 2010-11-25 2013-10-11 Zhen Ding Technology Co Ltd Composite adhesive film, adhesive sheet and method for manufacturing the same
TWI667871B (en) * 2018-08-07 2019-08-01 國立交通大學 Fan device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI411658B (en) * 2010-11-25 2013-10-11 Zhen Ding Technology Co Ltd Composite adhesive film, adhesive sheet and method for manufacturing the same
TWI667871B (en) * 2018-08-07 2019-08-01 國立交通大學 Fan device

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees