TWI263283B - Molding method and molding structure used to prevent vapor infiltration - Google Patents

Molding method and molding structure used to prevent vapor infiltration

Info

Publication number
TWI263283B
TWI263283B TW94112442A TW94112442A TWI263283B TW I263283 B TWI263283 B TW I263283B TW 94112442 A TW94112442 A TW 94112442A TW 94112442 A TW94112442 A TW 94112442A TW I263283 B TWI263283 B TW I263283B
Authority
TW
Taiwan
Prior art keywords
substrates
seal
molding
pieces
course
Prior art date
Application number
TW94112442A
Other languages
Chinese (zh)
Other versions
TW200638488A (en
Inventor
Wen-Ren Jiang
Shiou-Cheng Jang
Wie-Wen Yang
Chih-Hung Yeh
Original Assignee
Unividion Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unividion Technology Inc filed Critical Unividion Technology Inc
Priority to TW94112442A priority Critical patent/TWI263283B/en
Application granted granted Critical
Publication of TWI263283B publication Critical patent/TWI263283B/en
Publication of TW200638488A publication Critical patent/TW200638488A/en

Links

Landscapes

  • Liquid Crystal (AREA)

Abstract

A molding method and molding structure used to prevent vapor infiltration is disclosed, comprising the steps: first, seal is used to connect two pieces of substrates wherein between the two pieces of substrates is generated a micro gap; next, a first course of seal with low viscosity is used to fill the gap between the two pieces of substrates and to cover a circuit with part of it shown on one of the substrates; then, a second course of seal is used to cover on the first course of seal and the other circuit with part of it shown on one of the substrates. Hence, the double layer seal can be completely filled in the micro gap between the two substrates, which can ensure the reliability test of the product even when being used in the environment with high temperature and high humidity so that the quality of the product won't be affected.
TW94112442A 2005-04-19 2005-04-19 Molding method and molding structure used to prevent vapor infiltration TWI263283B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94112442A TWI263283B (en) 2005-04-19 2005-04-19 Molding method and molding structure used to prevent vapor infiltration

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94112442A TWI263283B (en) 2005-04-19 2005-04-19 Molding method and molding structure used to prevent vapor infiltration

Publications (2)

Publication Number Publication Date
TWI263283B true TWI263283B (en) 2006-10-01
TW200638488A TW200638488A (en) 2006-11-01

Family

ID=37966318

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94112442A TWI263283B (en) 2005-04-19 2005-04-19 Molding method and molding structure used to prevent vapor infiltration

Country Status (1)

Country Link
TW (1) TWI263283B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI472831B (en) * 2011-12-16 2015-02-11 Prologium Technology Co Ltd Side package structure of electric modules

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019093774A1 (en) 2017-11-08 2019-05-16 주식회사 엘지화학 Method for manufacturing smart window

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI472831B (en) * 2011-12-16 2015-02-11 Prologium Technology Co Ltd Side package structure of electric modules

Also Published As

Publication number Publication date
TW200638488A (en) 2006-11-01

Similar Documents

Publication Publication Date Title
WO2007024732A3 (en) Dual substrate electrostatic mems switch with hermetic seal and method of manufacture
WO2006072022A3 (en) Electronic device including a guest material within a layer and a process for forming the same
WO2009105367A3 (en) Integrated circuit package and method of manufacturing same
TW200735081A (en) Function element mounting module, manufacturing method thereof, and resin sealing board and substrate-structured unit for resin sealing used by the same
WO2007117153A3 (en) Solar cells and methods for manufacturing same
WO2011097089A3 (en) Recessed semiconductor substrates
WO2007076146A3 (en) Compositions comprising novel copolymers and electronic devices made with such compositions
GB2455917A (en) Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom
WO2009099669A3 (en) Mems plate switch and method of manufacture
WO2009151866A3 (en) Aggregration, standardization and extension of social networking contacts to enhance a television consumer experience
NO20074901L (en) Removable thermoplastic seal composite in wrapping film
TW200615501A (en) Thermal interface incorporating nanotubes
PL1860722T3 (en) Integrated micro-component combining functions of energy recovery and storage
WO2008057896A3 (en) Multi-component electronic package with planarized embedded-components substrate
TW200731537A (en) Semiconductor device and manufacturing method thereof
TW200638544A (en) Semiconductor and manufacturing method of the same
TW200704582A (en) Semiconductor composite device and method of manufacturing the same
WO2010008673A3 (en) Methods and systems for packaging integrated circuits with thin metal contacts
MY176738A (en) Electric contact and socket for electric parts
WO2015043969A3 (en) Diffusion soldering method using the formation of a diffusion zone as a solder connection, and electronic assembly with such a solder connection
TWI263283B (en) Molding method and molding structure used to prevent vapor infiltration
WO2009037927A1 (en) Method for manufacturing electrophoretic display panel and electrophoretic display panel
WO2007137188A3 (en) An article and method for providing a seal for an encapsulated device
WO2008093549A1 (en) Substrate module
WO2010003821A3 (en) Improved method for making enclosures filled with liquid and sealed by a membrane