TWI263046B - Low temperature bio-chip bonding and packaging technology - Google Patents

Abstract

This invention relates to a low temperature bio-chip bonding and packaging technology. It includes: (1) preparing step; (2) flowing way forming step; (3) low temperature packaging step; (4) bonding step; and (5) final product step. This invention utilizes a micro mechanical and electrical manufacturing technology; a low temperature packing structure is formed. After which, the UV curing glue contacts with mask on a first plate. The glue is solidified and the micro flowing ways are produced and well packaged inside. Therefore, this invention has the following advantages: it does not damage the enzymes or antigens on the surface of a bio-chip; it does not need any electrical voltage or current; its manufacturing procedure is easy and short; and its manufacture cost is low.

Description

1263046

FIELD OF THE INVENTION The present invention relates to a low temperature biocrystalline tool that does not damage cells or enzymes on a wafer or an I package technology. It also has a cured package quality. 9. Low temperature bonding strength:: anti-:, UV-curable adhesive or Current, easy to manufacture and r: not affecting the wafer, no electricity [previous technology] easy and low cost.

The bleed out requires a cover on the substrate and the upper and lower plates are Bonded. Conventional wafer bonding methods are generally as follows: [1]·No dielectric bonding technology··Synthesis of wafer surface using chemicals Microfluidic wafer technology has been widely used for performance analysis, drug diagnosis, and other related applications. A microfluidic, from the beginning of the sample to the end of the analytical test, requires a combination of them. In biomedical applications in biomedical applications, microfluidic systems including base screening, gene sequencing, and protein analysis into microchannels for microdevices in swimming experiments to avoid liquids in microchannels' or The wafer is placed on the heater and pressure is applied to the surface of the wafer to bond the wafer, which is a high temperature bonding, such as anodic bonding (Jic Bonding) and fusion bonding (Fusion Bonding). [2] Bonding technology: Adding a dielectric layer (such as a viscose) or using a compound to diffuse a compound to bond a dielectric layer to a substrate, whether it is at a south temperature or a low temperature. The polymer type as an intermediate layer material is generally photoresist. Agent, epoxy resin, benzocyclobutene (BCB) · · · ·, etc. [3] · Low temperature bonding technology: taking sodium citrate bonding method as an example, the use of 1263046 five, invention description (2) The solvent is applied to the inter-glazed glass (Si-Ο-Si) to be bonded, that is, the formation of a chemical film is performed by the concentration of the cerium (S102). The legal method can be made by adjusting the quartz into a low-concentration hydrogen acid solution by utilizing the etchability of hydrofluoric acid (HF). The hydroquinone is bonded to the side z; the potent λ you, ^ ^ ^ * s wafer' Suppose that the cerium oxide on the surface of the quartz to be joined is dissolved, and then immediately two pieces of quartz substrate are called "1", U7^, 斫^^^^^^, , : ^ 〇 ^ Add high pressure, at this time the substrate will be smashed into a melting disappointment, sub-at the appropriate temperature

The above [1] · vulnerable or fused to activate (influence) method is to use the cells cultured on hydrogen [2] · the adhesive needs to pass through, for example, a viscose in the viscous micro-channel, [3] High-temperature legal, due to high-temperature structure, the use of (affected) wafers [4] · need to make the wafer bonding side of the bad film on the wafer is high temperature connected to the surface of the wafer, viscous hydrofluoric acid (HF), Enzyme or antibody pressure-encapsulated, silicone-based medium, easy to produce gas is not resistant to acid test, and the micro-flow channel is blocked and the residual stress of the damaged crystal is made into the chemical packaging surface, the same as the voltage or current type Cell, yeast, glue-bonded to the antigen. The high rate of bleed can be at low foam and in pressurized or size sheets. The bonding of the substrates is made by wafer. The anode has the following deletion or antibody antigen. The anode is bonded using a chemical package, and the hydrofluoric acid bonded wafer is easy to damage the wafer. In the conventional wafer bonding method, wafer bonding is performed at a temperature, but the substrate is not easily aligned, and it is easy to cause a change in the inflow of the adhesive during the gas process, which is missing. The anodic bonding method or the fused plate cracks and destroys the substrate without requiring high temperature, but it needs to be affected. Bonding requires voltage or electricity

1263046 V. INSTRUCTIONS (3) — The flow device is complex and inconvenient and can easily damage the test object (small cells, enzymes, antibodies or antigens) on the wafer. Example 0,]·It is not easy to make, the process is long, and the cost is high. The processes of the sodium citrate bonding method and the turbid acid bonding method are quite complicated, the production is not easy, the time or reaction time is long, the process is long, and the sodium citrate bonding method is easy to be spliced. ..., ☆成:接...li can only be used on a substrate having a very flat surface, and the application range is such that there is a low temperature biocrystal. [Invention] The packaging technology of the present invention, the packaging technology of the present invention, the present invention Packaging technology, its packaging technology of the present invention, its packaging technology of the present invention, the present invention includes the following steps, on a wafer, in a light curing, in a bonding, in a pressure or electricity, in It is easy to plant a low temperature in the provided cells to provide a glue to cure at a high degree of supply and to provide a flow, and to provide a process and process biocrystals necessary to develop a process simple chip joint packaging technology. t should not be damaged. The second item is UV X-mesh 4 low temperature Re-mesh No electricity Other items Injury provided _ A low temperature biochip bonding or enzyme or antibody antigen. A low temperature biowafer bonding package with good quality. A low temperature biowafer bonding does not affect the wafer. A low temperature biowafer is simple to bond. A low temperature biowafer bonding is short and low cost. The method of bonding the package to the package is to prepare a reticle and a first substrate, the reticle

1263046 V. Invention description (4) At least one die hole is provided; 2. Micro flow path micro-resistance, and the first based on the photoresist photoresist is subjected to three-coating-UV-four-contact contact curing. Bonding, through baking, that is, low temperature bonding photocurable adhesive bonding package, the first step of mounting the first low temperature organism with the first low temperature substrate; the cover, the shadow forming plate and the photomask In the optical encapsulation step, the molding step: the external light-fixing photoresist: the purple, the second wafer is connected to the cathode, and the light is spin-coated on the first substrate. The mask is shielded, the photoresist is exposed by the fork hole, and a micro-flow path is formed by the upper micro-shadow; the constitutive step·.'--the soil is less than one on the two substrates; the low temperature joint package structure; The photoresist is exposed to the ultraviolet curable adhesive and exposed to the micro-fluid; the external curable adhesive is fixed to the photoresist, that is, the substrate is completed. The structure of the package includes at least: Hole; microchannel; photoresist, spin coating a substrate on a substrate, and the photoresist is formed on a low-temperature bonding package structure, a layer of ultraviolet curing adhesive; comprising a spin coating on a second substrate to align the photoresist with the photoresist After the glue is contacted, the ultraviolet light is irradiated with ultraviolet light, and the ultraviolet curing adhesive is low-temperature curing bonded to encapsulate the micro flow channel. ▲ The above objects and advantages of the present invention are not difficult to implement from the following selection. For a detailed description of the examples and the accompanying drawings, an in-depth understanding is obtained.

1263046 V. INSTRUCTIONS (5) - The present invention will be described in detail with the following embodiments in conjunction with the drawings. [Embodiment] The research on production, production, and film is still in the initial stage of development in the world, according to the function ^^\ The area 0 knife can be divided into two major categories, the first type is the detection chip, the Japanese film, such as the gene chip (Genechip, DNAchip 〇r DNA lcroarraj), protein wafer (pr〇tei n chip, = ray) The first type is a processing wafer, such as a microfluidic wafer crucible and a micro-laboratory wafer (Lab-οη-a-chip). The development of the 5 2 1 t i wafer (MiCr〇array) is relatively mature, and the microfilm experiment to the wafer will be the ultimate goal.曰 i i i designed a variety of wafers, designed a "low temperature bio-day chip a package technology", the method part (as shown in the first figure) includes - Step 11: first prepare - mask 21 ( As shown in the second figure) and ϋ in the third figure), the * cover 21 is provided with at least one die hole 21, and the other substrate 31 is cleaned and dried, and the film is formed. Step 12: Referring to the third figure, in the second-stage:, the first substrate 31 is soft-baked together with the photoresist 41 for a predetermined time (as shown in the fourth figure: W Hai-di: the substrate 31 and the photoresist 41 are moved away from the thermal pad 91, = ΐ =, the pair = the mask 21 is shielded on the photoresist 41, and the γ is blocked by the γ, and the resistance is 4 1 Exposure, after which the photoresist 4 1 is unsubscribed //, baked 'that is shown on the photoresist 4 1 and the 彡 彡 diagram); 1 on the micro-shirt to form a micro flow channel 411 (such as the sixth 1263046

The low-temperature joint seals the surname of the surname will be a first I~constitutive step 1 3 ·• Please refer to the seventh figure, the outer light two substrate 51 is spin-coated - the layer purple is 4 t low, the dish joints the crack structure 50; Step a: encapsulating step 14: inverting the first beauty board 31, $ η 1 umbrella upside down, with the photoresist 41 facing the second board 31 together with the first resistance 41 4 1 , 1 aligning the ultraviolet curing glue After 52, the well-cured sputum (the tamping fT glue 52 is brought into contact with each other, and the ultraviolet-curable adhesive 52 is shown in the second figure), and the ultraviolet-curable adhesive 52 is cured.

V. Finishing Step 15: If the photoresist 41 is fixed, that is, the bonding is completed. This is shown in the figure of the low temperature organism of the present invention. The ultraviolet curing adhesive 52 encapsulates the first and second substrates 31 and 51. In a more detailed manner of the wafer bonding package technique, in the preliminary step u, the cleaning process portion of the first substrate 31 t is cleaned with sulfuric acid (Hew): hydrogen peroxide (H2〇2) = 3: i. The first substrate 3 j can be dried to a more desirable state by an oven having a good formula and having an oven of about 12 degrees. The substrate 31 is selected from the group consisting of an electronic wafer, an optical grade polymethyl methacrylate (commonly known as acrylic, P英文lymethy ❸ mathacrylate, PMMA for short), and a polycarbonate (PolyCarbonate, PC for short). One of the slides. In addition, in the micro-channel lithography forming step 12, the rotation of the first substrate 31 is performed by a rotary coating device 92 in a two-stage rotation mode of about 250 rpm, 10 sec, and llOO rpm, respectively, for 25 sec. The resistor 41 is spin-coated on the first substrate 31 with a preferred thickness of about 2 5 // m, and the light

Page 12 1263046 V. Inventive Note (7) — ~一^"" Resistor 4 1 is baked at 9 ° C for 9 minutes on a hot pad of 9 ° C to achieve a good exposure.乂 士 This photoresist 41 is the best choice for THB-12ON. Further, an exposure device 93 (for example, an ultraviolet aligner) is applied to the photoresist 41 through the die hole 211 ′ of the reticle 21 to apply about 35 〇ηηη to 4 〇〇nmi ultraviolet 931, and the exposure dose thereof. Approximately 32 〇mJ gives better exposure. Then, after development with γΒ-Μ developer, baking in an oven at about 12 degrees Celsius for about five minutes is a preferred way of micro-shaping the micro-channel 4丨1 on the photoresist 4 接着 followed by 'the low-temperature bonding In the package structure forming step 丨3, it is also preferable to wash the second substrate 51 with a washing liquid of cesium hydride (HJOJ: hydrogen peroxide (Η2〇2) = 3: ,, and the oven can be used at about 12 degrees. The second substrate 51 is dried to the desired shape of the rut. At the same time, the first substrate 51 is rotated by the spin coating device 92 at a speed of about 250 rPm, 1 sec and 2 rpm, respectively. The ultraviolet curing adhesive 52 can be evenly coated on the second substrate 51. The ultraviolet curing adhesive 52 of different viscosity has different bonding effect and curing time, so the external light curing adhesive 52 is Before joining, you can

Irradiation of 4 rabbit external light 931' is such that the optimum viscosity of the ultraviolet curable adhesive 52 is controlled by a predetermined dose of ultraviolet light 93. The structural part of the present invention includes: a photomask 21 having at least one die hole 2 ι; - a first substrate 31 in a cleaned and dried state; and a photoresist 41 spin-coated on the _ substrate 31 on;

1263046

5. The invention (8), a low temperature bonding package structure 50, comprising: coating a layer of ultraviolet curing adhesive 52 on a second substrate 51, the second substrate 51 being pre-purified and dried; - the first substrate 31 together The photoresist 41 is placed on a thermal pad 91 for soft baking for a predetermined time (as shown in the fourth figure), and then the first substrate 31 and the photoresist 41 are removed from the thermal pad 91, as shown in the fifth figure. As shown, the mask 21 is shielded from the photoresist 41 by the mask 21 through the die hole 21 of the mask 21, and then the photoresist 41 is baked, that is, on the photoresist 41. Micro-shadowing the micro-channel 411 (as shown in the sixth figure); and then turning the first substrate 31 together with the photoresist 4 1 to align the photoresist 515 with the photoresist _ 4 1 Thereafter, the photoresist 4 is brought into contact with the ultraviolet curing adhesive 52, and the ultraviolet curing adhesive 52 is exposed (as shown in FIG. 8). The ultraviolet curing adhesive 52 is cured to bond and encapsulate the photoresist 41. Finishing the package of the first and second substrates 31 and 51 (as shown in the ninth figure). In a preferred embodiment of the invention, the first substrate 3 is selected from the group consisting of Wafer, optical grade polymethyl methacrylate (commonly known as acrylic, Polymethy math acrylate, PMMA for short), polycarbonate (Polycarbonate, PC for short), glass slide. Of course, with sulfuric acid ( H2S04): Hydrogen peroxide (H2 02 > 3:1 formulation is the preferred washing liquid for cleaning the first and second substrates 31 and 51, and the first and second substrates 31 and 51 are also placed at about 120 degrees. The ovens can dry the first and second substrates 31 and 51 to a more ideal state. By rotating the first substrate 31 by a spin coating device 92, the photoresist 417 of the THB-120N can be evenly distributed. The spin coating is applied to the first substrate 31 to a thickness of about 25 // m, and a thermal pad 91 is further provided to bake the photoresist 41 to make the photoresist 41

Page 14 1263046 V. Description of invention (9) Can achieve better exposure

In addition, the photo-binder is preferably 'when the photo-curable adhesive 5 2 52 is in the bonding state, the electron-bonding is no longer easy, and the exposure photoresist 41 of the mask 21 is not damaged. The pre-optimized invention is irradiated with the effect of overheating due to the residuals and the degree of the film, and the optical device die hole 21 is not required to be damaged. The above-mentioned lithography coating is uniformly coated with a fixed dose of viscous ultraviolet light to generate a residual stress micro-channel resistant to multi-purpose voltage culture 93 (for example, ultraviolet light exposure machine (AUgner)) 1: shooting human-ultraviolet light 931, The preferred atmosphere of the photoresist 41 and the oven-baked microchannel 411 is rotated to the second substrate 51' to make the ultraviolet light on the substrate 51; The UV-curable UV, 931, controls the UV-curable adhesive to produce the best joint encapsulation effect. Solid-bonded biochips can successfully improve the damage, provide a lower bonding temperature environment, cause cracking of the substrate, or destroy the chemical structure of surface functionalization in the substrate, while its acid-base, high transparency , the process takes a short time, the system; | 乍 current, the enzyme or antibody antigen that does not damage the surface morphology of the wafer after bonding, is a superb creature

The invention has the advantages of low production cost, can be applied to a glass substrate without loss of reliability, and is used for tightly packaging various microfluidic wafers, and does not require complicated lifting and lowering procedures, which can greatly increase the production rate and is beneficial to manufacturers. Timeliness 'Applications such as: De ribonucleic acid (De〇xyrib〇Nucleic Aci(i

, referred to as 〇 ") wafer, nuclear acid (01 ^ 0 - 111 ^ 16 〇 ^ (1 〇 wafer, protein wafer, biochemical / medical detection wafer, sample preparation (pre-processing) wafer (Sample Chip), micro Electrophoresis (capillary electrophoresis) wafer (CE

Page 15 !263〇46 V. Invention Description i --- C h \ lp), Biosensing Chip (Bi〇sens〇r Chip), Combined Chemical Wafer 'High Speed Screening Wafer, etc. Βθ The advantages and effects of the present invention are as follows: [_丨]. The cells, enzymes or antibody antigens on the wafer are not damaged. The invention relates to the ultraviolet curable adhesive on the substrate, aligning the light on the first substrate=the hinge' and then irradiating the ultraviolet curable adhesive with ultraviolet light, and the photocuring is mostly cured at a low temperature state to bond the photoresist. The micro flow channel. No need to add: no need to activate (affect) the surface of the wafer, non-exhaustive bonding, completely without plasticizing the cells, enzymes or antibody antigens cultured on the wafer.曰 [2]. UV curing adhesive curing package, good quality. In the process of low-temperature bonding and packaging of the solidified adhesive, no bubbles are generated, the substrate is easy to align, the air tightness is good, and the ultraviolet (tetra) gel does not flow into the micro flow channel, and is accurate. It is high in the visible range and resistant to many acids and bases and organic solvents. , interface strength network [3] · low temperature bonding, high strength and does not affect. The low-temperature curing package does not cause the beauty of your gentleman, and the light-curing adhesive does not affect the wafer. + Respect the structure on the [4]. No voltage or current. The invention encapsulates the wafer by ultraviolet-curing the gel, and solidifies the package, and the outer package is excellent in the joint packaging effect. # f A motor's can reach [5] ·Easy to make, the system is irradiated, and the UV-cured adhesive surface can be flat or rough after being controlled by UV light. Use, the equipment is simple. The invention has a good viscosity, and the cured package is easy to handle, & ultraviolet light and is easy to fabricate on both substrates regardless of the wafer.

1263046

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flow chart showing a part of the structure of the present invention. FIG. 3 is a plan view showing a manufacturing process of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing an embodiment of a manufacturing process of the present invention. FIG. 5 is a schematic view showing an embodiment of a manufacturing process of the present invention. FIG. 6 is a schematic view showing an embodiment of a manufacturing process of the present invention. BRIEF DESCRIPTION OF THE PREFERRED EMBODIMENT OF THE INVENTION The eighth embodiment is a schematic diagram of an embodiment of the manufacturing process of the present invention. [The ninth drawing is a schematic view of the finished product of the present invention. [Main component symbol description] 11 preliminary steps 1 2 micro flow micro Shadow Forming Step 1 3 Low Temperature Bonding Package Structure Forming Step 1 4 Bonding Packaging Step 1 Finishing Product Step 2 1 Photomask 2 11 Mold Hole 3 1 First Substrate 41 Resistor 4 1 1 Micro Flow Path 50 Low Temperature Bonded Package Structure 5 1 Second substrate 5 2 UV curing adhesive spin coating device 9 1 thermal pad 9 3 exposure device 9 3 1 ultraviolet light

Page 18

Claims (1)

1263046 Huangzang 94110935 VI. Patent Application 1 · A low temperature joint seal for biochips: ' The method of loading includes the following steps , (1)·Preparation steps: first prepare a mask and a mask to have at least one die hole; — (Zhong 2)· #流道微影forming step: spin coating on the first substrate After the substrate and the photoresist are soft-baked, the 2 is shielded from the photoresist, and X* light is transmitted through the die hole of the photomask, and the photoresist is baked, that is, in the light. Blocking the micro-micro flow channel; the first substrate, the second substrate, the low temperature bonding package structure forming step, · spin coating a UV curable adhesive on a second substrate, forming a low temperature bonding package structure; (4) a bonding and packaging step: the photoresist is aligned with the ultraviolet curing adhesive, and the ultraviolet curing adhesive is exposed, and the ultraviolet curing adhesive is cured to bond and encapsulate the micro flow channel on the photoresist; Finishing step: the ultraviolet curing adhesive is fixed to the photoresist, that is, the first and second substrates are packaged and completed. A method of low temperature joint sealing of a biochip according to claim 1, wherein: In the preliminary step, the first substrate is preferably washed with a washing solution of sulfuric acid: hydrogen peroxide = 3:1, and the first substrate is dried in an oven of about 120 degrees; the microfluidic micro-shaping step Wherein, a rotary coating device is provided to adjust the two-stage rotation mode to approximately 250 rpm, 10 sec, and ll rpm for 25 sec to drive the first substrate to rotate, and the photoresist can be spin-coated thereon. Page 19 1263046 a preferred thickness of about 25/zm on the substrate, and the photoresist is hung by a hot plate at deg Celsius for about 3 minutes, so that the photoresist can reach a good exposure state; another exposure device is provided through the light. The die hole of the mask is applied with ultraviolet light of about 35 〇 nm to 40 ΓΗΠ for the photoresist, and the exposure dose is about 32 OmJ to obtain a better exposure effect; after developing with a developer, it is about 1 2 摄. The oven is baked for about five minutes, that is, the micro-channel is formed by micro-shaping on the photoresist; in the molding step of the low-temperature joint package structure, the formulation of sulfuric acid: hydrogen peroxide two 3:1 is preferred for the second substrate. Washing the liquid and drying the second substrate in an oven of about 120 degrees; further comprising a spin coating device to adjust the two speeds of about 250 rpm, 1 〇 36 (: with 2 〇〇〇 1 ^ melon, 25 sec rotation) The second substrate is uniformly coated on the first substrate; in addition, the ultraviolet curing glue is irradiated with a predetermined dose of ultraviolet light in advance to control the viscosity of the optimal bonding of the ultraviolet curing adhesive. θ • as described in item 2 of the scope of application The method of low temperature bonding and packaging of a biochip, wherein: the first substrate is selected from the group consisting of an electronic wafer, an optical grade polymethyl methacrylate, a polycarbonate, and a glass slide; the exposure device is ultraviolet light. The structure of a low temperature bonded package of a biochip includes: a photomask having at least one die hole; a first substrate; a photoresist coated on the first substrate, and the photoresist Formed on Page 20 1263046 -- MR 94110935 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ After the ultraviolet curing adhesive is aligned, the ultraviolet curing adhesive is irradiated with ultraviolet light, and the ultraviolet curing adhesive is cured at a low temperature to encapsulate the micro flow channel. 5 The structure of the low temperature bonded package of the biochip of claim 4, wherein: the first substrate is selected from the group consisting of an electronic wafer, an optical grade polymethyl methacrylate vinegar, a polycarbonate, and a glass slide. One of the sorcerer, the substrate, the oven is dried by the spin coating device, and the first and second substrates are cured with photoresist and ultraviolet light: photoresist: ί On the second substrate, the second substrate is further provided with a thermal pad to expose the photoresist to a better exposure state; and a first: first: the ultraviolet light is irradiated through the die hole of the photomask. The photoresist is exposed, and the developer and the oven are used to dry the micro flow channel. #兀* | Ugly on lithography