TW200636243A - Low temperature bio-chip bonding and packaging technology - Google Patents

Low temperature bio-chip bonding and packaging technology

Info

Publication number
TW200636243A
TW200636243A TW094110935A TW94110935A TW200636243A TW 200636243 A TW200636243 A TW 200636243A TW 094110935 A TW094110935 A TW 094110935A TW 94110935 A TW94110935 A TW 94110935A TW 200636243 A TW200636243 A TW 200636243A
Authority
TW
Taiwan
Prior art keywords
low temperature
bio
chip bonding
packaging technology
chip
Prior art date
Application number
TW094110935A
Other languages
Chinese (zh)
Other versions
TWI263046B (en
Inventor
Hsi-Harng Yang
Meng-Yu Wu
Wei-Hsuan Cheng
Original Assignee
Nat Univ Chung Hsing
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Univ Chung Hsing filed Critical Nat Univ Chung Hsing
Priority to TW94110935A priority Critical patent/TWI263046B/en
Application granted granted Critical
Publication of TWI263046B publication Critical patent/TWI263046B/en
Publication of TW200636243A publication Critical patent/TW200636243A/en

Links

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  • Apparatus Associated With Microorganisms And Enzymes (AREA)
  • Micromachines (AREA)

Abstract

This invention relates to a low temperature bio-chip bonding and packaging technology. It includes: (1). preparing step; (2). flowing way forming step; (3). low temperature packaging step; (4). bonding step; and (5). final product step. This invention utilizes a micro mechanical and electrical manufacturing technology; a low temperature packing structure is formed. After which, the UV curing glue contacts with mask on a first plate. The glue is solidified and the micro flowing ways are produced and well packaged inside. Therefore, this invention has the following advantages: it does not damage the enzymes or antigens on the surface of a bio-chip: it does not need any electrical voltage or current; its manufacturing procedure is easy and short; and its manufacture cost is low.
TW94110935A 2005-04-06 2005-04-06 Low temperature bio-chip bonding and packaging technology TWI263046B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94110935A TWI263046B (en) 2005-04-06 2005-04-06 Low temperature bio-chip bonding and packaging technology

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94110935A TWI263046B (en) 2005-04-06 2005-04-06 Low temperature bio-chip bonding and packaging technology

Publications (2)

Publication Number Publication Date
TWI263046B TWI263046B (en) 2006-10-01
TW200636243A true TW200636243A (en) 2006-10-16

Family

ID=37966236

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94110935A TWI263046B (en) 2005-04-06 2005-04-06 Low temperature bio-chip bonding and packaging technology

Country Status (1)

Country Link
TW (1) TWI263046B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI664045B (en) 2017-11-01 2019-07-01 綠點高新科技股份有限公司 A bonding method and a substrate device,a microchannel device and its bonding method
TWI652717B (en) 2017-11-01 2019-03-01 綠點高新科技股份有限公司 Substrate device and sticking method

Also Published As

Publication number Publication date
TWI263046B (en) 2006-10-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees