TW200636243A - Low temperature bio-chip bonding and packaging technology - Google Patents
Low temperature bio-chip bonding and packaging technologyInfo
- Publication number
- TW200636243A TW200636243A TW094110935A TW94110935A TW200636243A TW 200636243 A TW200636243 A TW 200636243A TW 094110935 A TW094110935 A TW 094110935A TW 94110935 A TW94110935 A TW 94110935A TW 200636243 A TW200636243 A TW 200636243A
- Authority
- TW
- Taiwan
- Prior art keywords
- low temperature
- bio
- chip bonding
- packaging technology
- chip
- Prior art date
Links
Landscapes
- Apparatus Associated With Microorganisms And Enzymes (AREA)
- Micromachines (AREA)
Abstract
This invention relates to a low temperature bio-chip bonding and packaging technology. It includes: (1). preparing step; (2). flowing way forming step; (3). low temperature packaging step; (4). bonding step; and (5). final product step. This invention utilizes a micro mechanical and electrical manufacturing technology; a low temperature packing structure is formed. After which, the UV curing glue contacts with mask on a first plate. The glue is solidified and the micro flowing ways are produced and well packaged inside. Therefore, this invention has the following advantages: it does not damage the enzymes or antigens on the surface of a bio-chip: it does not need any electrical voltage or current; its manufacturing procedure is easy and short; and its manufacture cost is low.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94110935A TWI263046B (en) | 2005-04-06 | 2005-04-06 | Low temperature bio-chip bonding and packaging technology |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94110935A TWI263046B (en) | 2005-04-06 | 2005-04-06 | Low temperature bio-chip bonding and packaging technology |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI263046B TWI263046B (en) | 2006-10-01 |
TW200636243A true TW200636243A (en) | 2006-10-16 |
Family
ID=37966236
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94110935A TWI263046B (en) | 2005-04-06 | 2005-04-06 | Low temperature bio-chip bonding and packaging technology |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI263046B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI664045B (en) | 2017-11-01 | 2019-07-01 | 綠點高新科技股份有限公司 | A bonding method and a substrate device,a microchannel device and its bonding method |
TWI652717B (en) | 2017-11-01 | 2019-03-01 | 綠點高新科技股份有限公司 | Substrate device and sticking method |
-
2005
- 2005-04-06 TW TW94110935A patent/TWI263046B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI263046B (en) | 2006-10-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |