TWI260055B - LED package with fluorescent glue layer - Google Patents

Abstract

This invention discloses a LED package to emit colorless light (white light) with a thin layer of fluorescent material arranged in the light pass of a blue chip or UV chip. Colorless light shall emit when the blue chip or UV chip emits so as to save the cost of more expensive fluorescent material as well as to enhance the luminous intensity.

Description

1260055 V. DESCRIPTION OF THE INVENTION (2) 4 · Detailed Description of the Art Figure 3 · This embodiment of the art _ shows at least one blue light wafer] n 11 on the wafer 10 + and + f or 卜 卜 晶片 wafer 1 0 The surface electrode of the cymbal 10 is placed on the metal to be electrically coupled to the wire 1-3. The bottom electrode of the cymbal 10 is contacted with the coupling two, the metal 12, and the cymbal 11. Metal Η·12 has a notch u/Λ Electrically bonded to the metal material of the light-transmitting colloid 2 61 through the fixing s ^ ^, providing a non-fluorescent material without fluorescent material (10) non-concave cup package " cover layer Fluorescent material, complete Fig. 4 · The second embodiment of the present technology differs from the previous one in that the prior art only has a fluorescent material 263 disposed on the colloid 261, thus saving the use of the luminescent material. The female embodiment is shown in Fig. 5. The third embodiment of the present invention shows that the metal 11.12 is fixed by the colloid 17, the wafer 1 is placed on the metal surface, and the surface electrode of the wafer 10 is electrically coupled to the metal 12 by the wire 13; the electrode of the wafer 10 In the contact surface, the direct electrical property is lightly bonded to the metal u. The 12 has a notch 14 or a through hole, and the fixing colloid 17 is provided for fixing. The top surface of the cymbal 10 is covered with a layer of luminescent material 262 ′. The colorless light LED is not recessed, and the luminescent material of the cap is between the wafer 10 and the wafer 10 is air 266.

1260055

6 · The fourth embodiment of the art Figure 5 different disciplines 仏a M, this technology can also use Z-shaped metal feet or other 'foot' package. The rest of the principle is the same as that shown in Fig. 5. Fig. 7 · The fifth embodiment of the present invention can also be used for the sealing of the circuit board substrate 27, the rest of which is described above. The figure shows that at least one blue optical chip 1 or the violet optical chip 10 is disposed on the metal 21 on the circuit board. The surface of the wafer 10 is electrically coupled to the metal 2 2 on the circuit board; the chip J 〇 The bottom private pole is directly electrically coupled to the metal 21 in a contact coupling manner. The light-transmissive colloid without the fluorescent material 26 1 package protects the aforementioned wafer 1 打 and the wire 13 ° colloid 261 is covered with a layer of fluorescent material 262 to complete the colorless light LED without concave cup. Fig. 8 is a sixth embodiment of the present invention. In contrast to Fig. 7, only the cap phosphor collide 262 is capped over the periphery of the wafer 1b, and between the cap phosphor material 262 and the wafer 10 is air 266. Fig. 9 is a seventh embodiment of the present invention. In contrast to Fig. 4, the addition of the opaque material to the periphery of the light-transmitting colloid 2 61 can reduce or isolate the colored light from the periphery and interfere with the colorless light emitted from above. Figure 1 0 · Embodiment 8 of the present technology

Page 6 1260055 Brief description of the drawing 5. Brief description of the drawing Fig. 1. Top view of the prior art Fig. 2. Side view of Fig. 1. Fig. 3. First embodiment of the art Fig. 4. Embodiment 2 of the art Fig. 5. TECHNICAL FIELD OF THE INVENTION FIG. 6 is a fourth embodiment of the present technology. FIG. 7 is a fifth embodiment of the present invention. FIG. Embodiment 9 FIG. 12· The embodiment of the present invention FIG. 13 is a first embodiment of the present invention. FIG. 14 is a second embodiment of the present invention. FIG. 21. 22 Line 13 Notch 1 4

Page 9 1260055 Graphical description Pass-through 15 Fluorescent colloid 1 6. 262. 263. 264 Fixing gel 17 Translucent colloid 261 Air 266 Circuit board substrate 27 Opaque material 28 Φ

Page 10

Claims (1)

L26〇〇55 Case No. 90132676 曰led Please patent the LED non-recessed cup seal with fluorescent material layer | The LED non-recessed cup package contains: Modified to surface-adhesive or UV LED chip, at least one Each of the two electrodes has two electrodes, a metal, electrically coupled to the first electrode of the two electrodes, a blue first metal, electrically coupled to the second electrode of the two electrodes; the first metal And on the second metal, the package and the electrically coupled portion of the package; and the layer of the photoresist material disposed in the path of the light emitted by the wafer, the light illuminating the layer of the fluorescent material to generate Colorless light, and the colloid layer is contained between the tantalum layer and the aforementioned wafer as the medium 5 medium. 2. A led non-recessed cup seal having a first material layer as described in item 1, wherein the glue system is a light transmissive gel and is disposed partially or wholly over the first metal and the second metal. 3. The LED non-recessed cup package having a phosphor layer as described in claim 2, wherein the layer of phosphor material is a partial region covering the outer surface of the gel. 4. The LED non-recessed cup package having a phosphor layer as described in the second paragraph of the patent application, wherein the layer of the phosphor material is referred to as covering the entire surface of the outer surface of the gel. Page 11 ^260055 /, 申 凊 范 凊 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如 如The layer of phosphor material referred to herein is a cap-type phosphor material. The cup-shaped package described in claim 5, wherein the cap-type gel upper surface is described. The LED non-glare material having a layer of a fluorescent material is an LED non-cup seal having a layer of a fluorescent material as described in the above-mentioned patent application scope, wherein the coupling refers to Wire-type coupling. 8. A non-concave cup package having a layer of phosphor material as described in claim 1 of the patent application, wherein said coupling refers to contact coupling. 9. The LED non-recessed cup package having a layer of phosphor material as described in claim 1, wherein the coupling refers to a partial-wire type, partial-contact type hybrid light combination. 10. The LED non-recessed cup package having a layer of phosphor material as described in claim 1, wherein the two electrodes are two-surface electrodes, respectively coupled by wire bonding to the first metal and Second metal. 11 · If there is no led layer with fluorescent material layer as described in item 1 of the patent application garden Page 12 1260055 Revision _-Case No. 90132R7R_Yearly, the patent application scope is a concave cup package, wherein the two electrodes refer to double bottom electrodes, which are respectively coupled to the first metal and the second metal by contact. 12. The LED non-recessed cup package having a phosphor layer according to claim 1, wherein the two electrodes are a surface electrode and a bottom electrode, respectively coupled by wire bonding and contact coupling. The aforementioned first metal and second metal. 1 3. The LED non-recessed cup package with a phosphor layer as described in claim i, further comprising: an opaque material covering the periphery of the colloid 9 to reduce or isolate light from the periphery . An LED non-concave cup encapsulation method with a phosphor material layer is a surface-adhesive LED. The LED non-recessed cup encapsulation method comprises: (1) preparing a blue or ultraviolet LED chip, at least one, each having Two electrodes; (2) preparing a first metal electrically coupled to the electrodes of the two electrodes; (3) preparing a second metal electrically coupled to the electrodes of the two electrodes; $__ (4 Preparing a colloid, disposed above the first metal and the second metal, 'encapsulating the wafer and its electrical | horse joint portion; and (5) preparing a layer of the phosphor material, and placing the light on the wafer In the path, the outgoing light excites the aforementioned layer of phosphor material to produce a colorless color, 1260055 Amendment No. 90132676 VI. Scope of Application The intermediate between the phosphor material layer and the aforementioned wafer is used as an intermediate medium. 1ΒΪ第14页