TWI258333B - Diamond composite heat spreader having thermal conductivity gradients and associated methods - Google Patents

Abstract

A diamond composite heat spreader having a variable thermal conductivity gradient can improve control of heat transfer based on a specific application. A diamond-containing region of the heat spreader can contain diamond particles such that the diamond concentration and/or the diamond particle size a varied to produce a desired thermal conductivity gradient. Regions proximate to a heat source can have a higher thermal conductivity than regions further away from the heat source. Thin diamond films can also be used in conjunction with the particulate diamond in order to provide a region of maximum thermal conductivity adjacent a heat source. By providing a variable thermal conductivity gradient, more expensive materials such as diamond film and larger diamond particles can be selectively used in regions closer to a heat source, while allowing for cheaper smaller diamond particles and materials to be used farther away from the heat source where thermal conductivity can be lower without sacrificing overall performance.

Description

1258333 发明, DESCRIPTION OF THE INVENTION: FIELD OF THE INVENTION The present invention relates to a carbon-carbon-containing composite device and system that can be used to conduct or absorb thermal energy from a heat source, and in contrast, the field of the invention includes chemistry, Physics, semiconductor technology and materials science. [Prior Art] Semiconductor products, such as a central processing unit (CPU), a laser diode (Lighter Diode), a light emitting diode (Diode Emature Diode), a microwave generating source (Microwave Generator), etc. The wafer, its power is getting higher and higher, and its wiring is getting denser. The energy density generated on the wafer is now higher than that of the electric stove for cooking rice. As the power of the wafer increases and the intensive waste heat of the internal wiring increases, it is becoming more and more difficult to eliminate, so that the temperature of the wafer: gradually exceeds the allowable upper limit and there is a burnout. In addition to waste heat, but the higher power CPU, its hot spot will be bigger; avoid η raw 'If the copper wire is still used to dissipate the dense line, and more importantly, the waste heat is eliminated as soon as possible, not only the heat transfer rate of the heat sink It is important to: It has a high thermal diffusivity, and it can not heat up as soon as possible. "Immediately rule out, the current line of wafers in the current heat sink production technology is a new development direction, = the damage is included in the dispersion, up to five times the steel, is ', in the heat conduction of pure diamonds』 Fast material; while the diamond has a thermal diffusivity of 1258333, which is ten times that of copper. Therefore, using diamond as a heat sink not only reduces the average temperature of the wafer, but also reduces the "temperature gradient" of the wafer in a shorter period of time. 'Therefore, it can effectively eliminate the "hot spots" to protect the wafer from overheating. However, although diamond is the best heat sink, it is difficult to become popular in the production technology of diamond heat sinks because of its high cost. It is divided into diamond film made of chemical vapor deposition (CVD, chemical vap〇r deposUion), natural diamond and high pressure molded diamond. In addition to the high cost, 'chemical vapor deposited polycrystalline diamond film area, large' but its thickness is limited (such as 0.5mm), so it can not effectively heat: export; high-pressure diamonds and even natural diamonds are too inadequate To cover the entire wafer of large CPUs', it is not practical to use pure diamonds as heat sinks. SUMMARY OF THE INVENTION In view of the above disadvantages of the diamond heat sink, the inventors have particularly studied a diamond composite heat sink having a heat transfer gradient and a method for manufacturing the same, with a view to alleviating or solving the above disadvantages. Correspondingly, the present invention provides a composite heat sink which can be used to extract and conduct heat energy from a heat source. On the one hand, a diamond composite heat sink has a variable heat transfer coefficient for improving heat flow through heat dissipation. The control of the sheet, the iron-containing area on the heat sink will contain diamond particles, which will change the diamond concentration and/or the diamond particles to produce a pre-heating gradient on the heat sink, where the area close to a heat source will be Other farther regions have higher thermal conductivity. 1258333, by k for a variability of heat transfer gradient, more expensive materials such as diamond film or diamond, rice knife cloth in the composite material, can be selectively used in the area of sin near heat source, at the same time, Allows less expensive materials and loosely distributed composites of diamond particles to be used in areas that are farther away from heat sources and have lower thermal conductivity, without the need for fins that are spread over diamonds. In another aspect of the present invention, a thin diamond film can also be used at the microsphere-like diamond joint to provide a connection-heat source region with maximum heat transfer coefficient. In more detail, the thermal conductivity gradient can be determined by the diamond and/or the change in the thickness, so the change can be continuous or stepped. Similar to the secret 曰 / 祁 在 其它 祁 祁 祁 祁 祁 祁 祁 祁 祁 祁 祁 祁 祁 祁 祁 祁 祁 祁 祁 祁 祁 祁 祁 祁 祁 祁 祁 祁 祁 祁 祁 祁 祁 祁 仏 仏 仏 仏 仏 仏 仏 仏 仏 仏 仏The diamond particle size is affected by changes in volume concentration. The difference in the concentration of the stone and the change in the concentration of the diamond in the different areas on the heat sink 'conforms to the corresponding change in the temperature gradient of the heat energy, so that the efficiency of the heat sink is maintained, and the right side can be right, μ,, 』 The cost. [Embodiment] X + Before the description of the present invention, it must be understood that the present invention is not limited to any of the various aspects disclosed in the text, the structure, the process steps or the materials, and at the same time And in any related field, the following terms are for illustrative purposes only and do not impose any restrictions. Definitions In the description of the present invention, the main silver φ _ y, in one claim, the following terms are used as defined below. 1258333 When describing the bonding of carbonaceous materials, "particles, and, and, grit, can be used interchangeably to illustrate A particulate form of such material, in which the particles or grit have different shapes, including round, elliptical, square, self-shaped (eUhedral), etc. and specific mesh sizes, as is well known in the industry. The sieve hole system has the number of holes per unit base surface 4@. In addition to the designation, the mesh size in the present invention is all in the US specification. Further, the 曰 = hole size is generally understood as the designated collected particles. The average mesh size, because a parent particle is a small size change in size at a particular mesh size, wherein, used, substantially, or, substantially ", mainly refers to a specific purpose, operation, structural function of the public or this Chen Yuncheng, as such purposes or structures have been obtained. Therefore, the base 4 ^ ^ 3 stone antiparticles are approximately similar to their tantalum particles, or nearly similar, or the actual shellfish do not meet. The same considerations: the charcoal particles are essentially equal particle operations, or the resulting structure has the same size, even a slight dimensional change. Among them, the used, the radiator ", Α, ,, a system ^ a material that can disperse or conduct heat and transfer heat from a heat source π pin heat sink is different from the heat sink in that the heat sink is used for heat energy The storage, until it can be transferred by other mechanisms to remove heat, on the other hand, a radiator only merges with the moon & 1罜曰 transfer heat without storing heat where the 'heat source mentioned' is its line #g. A device or object with thermal energy or large; {expected value heat, the heat source can be 5 K j to contain the device that operates to generate heat energy, and the heat source is heated to a high level by other heat sources. An object of temperature 1258333. Among them, any substance containing carbon, carbon, or carbon, is composed of carbon atoms, ratio, &, 7 β, The structural type or, the homomorphic manifests are all covered, including the right 芈, the U structure of the U. The second, the curved, the eye, and the tetrahedron. The material that the craftsman knows, the structure is determined, such as stone drill And pure diamonds, on the other side, 4 into the slave, innocent face, the carbon material can be diamond. With the 'used, the anti-hemp change makes Us should be metal, and the two can be mutually-- Elements, especially metal elements, which can be formed by chemical conversion or chemical bonding. Carbides are bonded to carbon atoms: primes such as, but not limited to, transitional elements: titanium, chromium; containing: calves, And non-transition elements and other materials, such as aluminum. Further 'some non-metallic elements such as ... brassite alloy (― aii〇y) can be included as a reactive element. Among them, the use of "wetting" Means that the molten metal flows through the surface of at least a portion of the carbonaceous particles, and the wetting is usually at least partly due to the surface tension of the molten metal. The metal helps to wet, in some respects, wetting can help the formation of chemical bonds at the interface between the carbon-containing particles and the molten metal. Among them, the "chemical bond," and "chemical bond, can be interchanged, refer to a molecular bond plays between atoms Gravity, strong enough to produce a binary solid compound at the interface between atoms. The chemical bond in the present invention is a typical diamond superabrasive grain carbide, or cubic boron nitride or boride. 1258333 "Solder alloys" and, solder alloys, and the like, may be used interchangeably when referring to an alloy comprising an effective amount of a reactive element to allow formation of a chemical bond between the alloy and the superabrasive particles. It is a metal carrier solvent containing a reaction element solute, which may be a solid or liquid solution. Further, "brazed" may be used to indicate the formation of a chemical bond between the solder and the superabrasive I. By "sintering" is meant the joining of two or more particles together to form a continuous solid block comprising a step of separating the g-gap between the particles to incorporate the particles. The condition of the I junction can occur in a metal or a carbonaceous particle such as a diamond. The sintering of the metal particles can occur differently from the composition of the material. Under various temperatures, the sintering of diamond 2 generally requires the presence of ultra-high pressure and carbon solvent as an auxiliary. As discussed below, sintering aids are usually used to aid sintering during the sintering process. In the product. Second, the "average free heat transfer path" used refers to a path that allows heat to be transferred without crossing the solid-solid interface. The free heat transfer path of the step is generally corresponding to the area or The average particle size of the diamond particles in the carbon-drilled region, or the thickness in the direction of the heat transfer gradient. Therefore, the average free heat transfer path (4) is to pass through the road 2 of the continuous diamond on the real f, so the path is about the solid - The thermal contact resistance of the solid interface is unaffected. Although the average free heat transfer path generally corresponds to the continuous diamond 'but the various impurities in the diamond towel reduce the average free heat transfer path, so the overall heat transfer The coefficient is also reduced. 1258333 Wherein, the "thermal energy outflow zone" used is a phase I designation, which is designed to be a phase I drill zone, and the thermal energy outflow zone does not need to correspond to a relatively low fox zone' 'Thermal energy will be superior: road, spring pass ¥ ' ^ ' In some embodiments, the average free heat transfer has a relative low heat transfer system, number, that is, high thermal resistance. of" Conduction gradient, which refers to the change of the heat transfer function across the radiator in the second direction to the direction of the φφ, which can be the continuity of the position, the green, the soil I (four), Even, (2) numbers, so the gradual cross-linking and gradual change in the heat transfer coefficient are included in the heat transfer gradient. The concentration, total amount, particle size, volume, and data on the number of turns can be displayed in the region.砉王目μ π ^ , " Μ 上 上 ' can be understood that the performance of the region is only for the convenience of brief description, so the bean 所 • 此 此 此 只 只 只 只 只 只 只 只 只 只 只 只 只 只 只 只 只 只 只 只 只 只 只 只 只 只The number is pretty, n ^ X, and also contains individual values or sub-regions contained in the region, as well as every-value or sub-region is clearly indicated. Generally 0 cattle to π value range such as "about 1 micron to about 5 micrometers (the work, the material to be dissolved contains not only the value of about 1 micrometer to about 5 micrometers explicitly stated) but also contains individual values and fields in this range, or therefore, included in this range of values. Individual values are 2, 3, 4, and The area is Bu 3; 2-4, 3-5, etc. The invention details a diamond composite heat sink with a variability heat conduction gradient, the month b of which promotes the control of heat transfer on the heat sink, and the nearest region near the heat source has It has a higher heat transfer coefficient than other areas of the lx heat removal source. A particulate diamond 1258333 stone area can match diamonds of different particle sizes, or volume concentration to affect the heat transfer coefficient. Thin diamond film can also be used in the connection of granular diamonds. Wherein, the heat source region is connected to the heat source region to have the largest heat transfer coefficient, and by providing a variable heat conduction gradient, the heat conduction of the heat sink can be specially designed to use a temperature variation curve, and the particulate diamond region can be like the following There are a wide range of variations discussed. Particulate diamond regions The present invention includes skirts, systems, and self-heating sources that transfer thermal energy.

The heat sink of the present invention generally comprises a series of carbonaceous particles which are closely packed, and the carbonaceous particles may be filled with a gap material or may be formed by directly sintering or kneading carbonaceous particles. "Face, the general procedure for making a radiator includes starting with a

When the mold is stacked - the series of carbon-containing particles become the high-carbon particle volume, the first series of carbon-containing particles can have the same sieve size. The n-large particle size distribution can also be used. To increase =!, degree: the specific particle size can be seen by the 18 mesh (lnm) teacher. 5 nm ) and 4 〇 0 mesh (37 nm) between the source = Γ can be selectively used in close proximity 〗 In the less expensive materials and small diamond particles to make the household ',,, source, and heat transfer can be lower in the area of the heat sink, when the size of the particles is variability / increase s ^ 丄 t ^ Wenler knows that 'larger particles that can be ramped up can provide a path with particles that are 'approximate to solid carbonaceous materials, such as pure diamonds.'... The particles actually stack in contact, in a stack Each particle 12 1258333 is in contact with at least one of the primary particles, and in another aspect of the invention, the interparticle contact can provide an effective path for virtually all carbonaceous particles in the heat sink. Control, heat transfer from a heat source via a substantially particle pair (4) With the help of the contact, the particles can be stacked to fill most of the space and minimize the space between the particles. Second, in one aspect, the particle stack contains Jiang* and the 匕S will not be the size of the carbon-containing particles The effect state is completed to complete the above functions. For example, the larger particles are piled up in the most μ. The stack of carbon particles can be fixed or compacted, that is, the vibrator is used to disturb the mold. The smaller carbonaceous particles are then added to: = voids between the large carbonaceous particles. Depending on the smaller size, the small particles of the car must be introduced in many ways to fill most of the voids. For variability, it can increase the stacking efficiency of the industry model = 1/3 to 1/2 () of the larger particle diameter, and the preferred range is from ^^2/10'. The best range is 1/7. The use of effective stacking sorrow 'volume stacking benefits will be greater than &3; if necessary, the increase in the number of vehicles can be increased to increase the stacking benefit. However, (b) the benefits will increase with the difficulty of filling And the volume capacity of the hand is about 50-80%. In alternative embodiments in which the stacked particles are different, different sizes of carbon-containing particles are mixed and stacked before the material: the gap material, so that the stacking efficiency is increased, and 'will cause - some of the larger particles are not in close contact There is a rumor ==, so 'thermal energy must cross the interface boundary, which will increase the heat dissipation as thermal resistance. To another alternative embodiment, the volume of the diamond can be used to a 13 1258333 ::: Adding to carbonaceous particles, in particular, it is easier to construct a cubic I grain. 'The diamond particles of this cube can be stacked side by side to produce one or more layers, so that the volume of the stacked diamonds is as high as 9 〇%. "Arrangement f is not important, the particles can be stacked into an orderly row, columnar" column! Day shape. In this embodiment, the arrangement of the diamond particles produces a smaller gap between the particles without the need for sintering, and in addition, the direction of arrangement of the particles f will also improve the thermal properties of the final composition, the following will be 4' The gap material is processed with a diamond particle stack as described above. : Inventive-aspect' can use a gap material to bond the carbon-containing particles into a block. However, since the stack of particles is earlier than the introduction of the gap material as described above, the original particle-to-particle state is maintained, and the stacking effect is maintained. Xingyuan exceeds the effect of hot-pressing agglomerates after mixing carbonaceous particles and interstitial materials: In the latter case, the capacity of the carbon-containing particles in the device will be less than 丄/2 volume, when the gap material fills the diamond Between the particles, the goal is to completely separate 70 between each particle 'in this case' the thermal energy must cross the non-carbonaceous material area of the very skin. Therefore, as described above, the stack of carbon-containing particles of diamond particles is earlier than the introduction of the gap material 'design - the carbon-containing heat sink factor. The heat transfer between the interface between the carbon-containing particles and the interface between the non-carbon particles and the carbon-containing particles. The characteristic, the physical contact between the void and the single ', '屯 is a thermal barrier between the interfaces, that is, the thermal contact resistance. Although the close contact of a large area of the particle surface enhances the thermal mass between the interfaces, the effect is still lower than that of the pure continuous carbonaceous material. Therefore, the interstitial filling between the interfaces is better than the simple physical contact effect. Correspondingly, the gap material must have a specific property, which on the one hand can be used as a carbon sintering aid N a at the height of 14 1258333 / dish, and the side of the fused particle can be combined with the gap material and the other side of the diamond particle chemical society people. The choice of gap material must be based on the gap material itself: 2 pieces of the mouth; the diamond heat sink with low heat transfer coefficient material will become the 1艮 element to reduce the thermal conductivity of the diamond, so the heat transfer coefficient, low heat capacity, and energy of the gap material And stacking, there must be a slap in the face, and the stone particles are chemically combined to promote heat conduction across the interface. Diamonds with A area can increase the thermal conductivity of the radiator. The gap material used to bond or sinter the carbonaceous particles may be different, and the method includes infiltration, sintering, enthalpy, and enthalpy. Permeation is when the material is: to, above the melting point, it flows into the particles; sintering is the surface of the effective adjacent particles (four), and the gap material is sintered into a body: 1 This product is a metal-based solution The medium is heated above the melting point and deposited under a stream to the surface of the carbonaceous particles. The type of gap material consists of liquid metal and cast ceramic. When chemically combining carbon-containing particles to produce a heat sink, the gap material should have at least 2 active elements to react carbon into carbides, and the presence of carbonized formation helps. The wetting of the diamond causes the interstitial material to be attracted to the interstices by capillary forces. When sintering carbonaceous particles of diamond particles to produce a heat sink, the gap i should act as a sintering aid to increase the degree of carbon sintering without affecting the formation, but requiring a carbon solvent. The gap-permeating alloy can act as a penetrating agent to combine carbon-containing particles into a single body, which is generally not chemically bonded, and only the carbon-containing particles are physically fixed and cause heat transfer inhibition, but the copper material is not limited thereby. in. 15 1258333 In further considerations, when the carbonaceous particles are diamonds, the gap material must be considered to have a permeation or sintering temperature lower than 丄i 〇 〇. . To avoid damage to diamonds, synthetic diamonds usually contain metal crystals such as iron, cobalt, nickel or alloys j. The inclusions are highly swellable at high temperatures and can return diamonds to graphite carbon, but It can be avoided with an ultra high pressure of more than 5 GPa. A gap material may comprise a diamond or carbon brass solder as a metal infiltrated β丨 or I 3 broken alloy as a ceramic permeable penetrant, and the penetrant may be “lubricated to attract capillary forces to the stacked carbonaceous particles. The general stone anti-static agent contains inscriptions, records, irons, bells and chromium. When the gap material contains carbonized formations to increase the thermal properties of the interparticle interface, the carbonized formation contains elemental sharps (Sc ), 镱 (γ), titanium (η), 鍅 (Zr), 铪 (Hf), 鈒 (7), 铌 (Nb), chromium (Cr), _ (M〇), general (10)), interesting (Ta), Tungsten (W), tantalum (Tc), bismuth (Si), butterfly (8), Ming (4)) and its alloy. The gap or wetting material may contain silver, copper, aluminum, niobium, iron, beginning, short crucible, or alloy thereof. Or the mixture, the diamond or carbon brass solder contains the sweetening composition as titanium, erbium or chromium. The ceramsite alloy is composed of spring nickel, titanium or chromium. For example: nickel-chromium alloy such as BNi2 ( NbCr—β) or (Ni-Cr-B) is a good penetrant, and other effective penetrants contain (Al-Si) > (Cu-Sn-Ti) . (Ag-Cu-Ti) ^ ( Cu~Mn-S i), (Cu-Μη-Zr) and (Cu-Ni-Zr-Ti). Most carbon-containing gap materials contain active ingredients (such as chromium, titanium, etc.) and cannot form carbides to bond carbon. It is easy to be oxidized. Therefore, the introduction of the gap material needs to be under vacuum or inert environment. 16 1258333 The gap material can be introduced in different ways. Among them, the electrodeposition in the aqueous solution is 1: between the gaps of the edge. In the solution, and is: Han Steel, recorded) 'The gold deposition method contained in the carbon-containing heat sink of the present invention. More than 50% (compared to the volume of the radiator, volume: large amount Permeation: _ product content is 5%, the non-carbon permeability can be two carbon-character, silver temple, another-side, the volume of carbon-containing particles... is copper, more than % or at least greater than 9〇%.... > greater than 8 〇

The carbon particles may comprise diamond particles, the volume of the diamond particles being large; and in the case of a penetrant, it comprises at least 2% by weight of the carbonized form, or more than 5% by volume.

The heat sink: the heat sink may comprise carbonaceous particles and a non-carbonaceous agent, and the friction agent and the carbonaceous particles may be copper, inscription, or silver. Under high pressure operation, the non-carbonaceous penetrant increases the heat dissipation volume of the heat sink, and at the same time, the stacking density of the carbonaceous particles is added. For example, the carbonaceous particles are diamond particles: the day, the high pressure, the diamond particles will At the junction point (4), the diamond's bulk density is increased, and the molten copper, aluminum, or silver is injected into the diamond particles, and the volume concentration of the diamond is greater than g 〇%. Tian Diamond granules are high-concentration and copper, aluminum, or silver-filled diamond granules have a thermal conductivity of 咼, which is 15 to 3 times better than pure copper radiators. In addition, copper, aluminum, Compared with materials such as silver, it is a material that can save costs. Among them, copper has low-temperature and low-pressure operation characteristics. Conventional diamond composite heat sinks form carbonized 17 1258333 or formed materials outside the diamond particles. In contrast, the invented diamond particles and copper, aluminum, or silver can be used in their original untreated state. The procedure for coating diamond particles prior to rubbing is dispensed with. In addition, helium is used to use relatively coarse particles 'such as 50 microns' or even 3 〇 〇 microns to reduce particle boundaries that can interfere with the flow. The other method for providing the gap material is to sinter the solid powder filled between the gaps of the carbonaceous particles, and has various methods but is not limited to the following methods such as hot pressing, vacuum sintering, vacuum sintering, microwave sintering, etc. . Rolling people is a common method, but since microwave sintering only affects the sintered material and does not affect the carbon, when the carbon-containing particles are diamond particles, it will not cause the diamond to decline; the gap material for sintering can run in the pile 1#隹$ 守守 joined, its particle size can be filled between the carbon-containing particles is better, the knife edge 80% after the order sintering can improve the contact of the particles to the difficult, but will cause pore drop (four) conductivity. The third method for providing the gap material is to pass the diamond particles to the molten material, such as Ming, Shi Xi, Β ν i笠, _ y 2 search, such as electrodeposition, and can not produce chemical bonds but will contain carbon particles. Wrapped, n I & 1 soil gap material can not fix the particles 'because the sintering of the foundry of the joints, ^ is physical, so the penetrant must contain active elements to react with carbon The bank should be formed into a chemical bond, a mouth, and a five-stone reversal formation in the form of a sulphide. The hand also makes the surface of the granules wet with the surface of the granules. ', the force is attracted to the inner space. When using diamond particles, Λ &gt; t horse (V low diamond decline, the temperature of the infiltration process must be lower than 1 1 〇〇t痞 ancient, U; pressure, In order to avoid damage to diamonds, some iron, recording, recording alloys, and most of the v, the number of copper, aluminum, silver alloy meet the above requirements 'in the penetration or over-interference of the gap material, the heated metal is not 18 1258333 Avoiding the ground will cause, Yang asks (8) the retreat of the diamond, this can be Short anti-Cao P 卩 液 廷 廷 间隙 间隙 间隙 ... 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于The dissolved strontium will protect the diamond from its decline, 〇, ◦:: 下: has a good penetration effect under 1,^^. Inclusion: Γ material can be guided by osmosis, sintering, and electrodeposition methods, gap Between the low pressure operation, the gap material is only close to 埴 = and join the particles. When operating at high pressure, there are two basic forms: tight; : π:: τ forms a chemical bond with carbon to increase the bound, ν At the same time, the carbonaceous particles will disintegrate to reduce some of the voids. If the gap material is a carbon solvent such as iron, the first or the nickel, and the singular grain of the gentleman, \ sigh eight gold days, containing carbon 曰 \, , the mouth into a continuous carbon-containing block, the heat transfer path is the carbon particle interface when the particles are sintered into a block, the carbon path, and the physical interface and non-copper is the ideal diamond radiator gap material However, the carbon solvent of the same day + I$ of 4 is not a catalyst for the conversion of graphite into diamonds, but not High-pressure sintering aids ϋ If copper is used as a gap material, it can be &quot; :, , , , - - - but the electrodeposition is too slow and difficult to fill to the dense two ', i ❿ sintering S ' will inevitably Produce Kong Yang: The two methods make the diamond stacking efficiency relatively lower (about % 0 % volumetric capacity). , Although copper is not a sintering aid, the strengthening of the ultra-high pressure carbon-copper mixture can force the carbon particles to be tightened to improve The charcoal content is from 7 〇% to 9 ◦%, and the pressure is about 4 GPa to 6 GPa. In order to increase the carbon content above 7 〇% without forming a carbon-to-carbon bridge, the excess copper must be removed by the sedimentation material, 19 1258333 The sedimentation material is ancient and its material is ceramic and sturdy: the same: it will soften under the high temperature of dissolution of copper, Ming (4) 2 〇 3) second end such as 奴 化 夕 、, 氮化 夕 ( (SlN4), and oxidation ^ ^ λ species are porous materials, such as tungsten carbide or yttrium oxide, but the pot 1 is only shown in the example - in addition, although copper can not wet the pores of the diamond, the pores between the diamond particles can not be produced properly. Pore, when copper cold fine mouth #人,_ $, which moderately shrinks the compacted diamond particles to reduce thermal contact resistance. The gap material can also be _ _ , , f1A , # A yv species / carbon / interwetting alloy with low volume capacity carbon wetting agent, 蕻ώ & 棱 棱 供 供 供 供 供 供 供 供 ' ' ' ' ' ' ' ' ' ' For example, 哉 哉 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 2^ Infiltrated alloy with good conductivity and diamond wetting properties, =:!:? Select the lowest level of relative brightness, which can avoid the process of low-refining points must be lower than 1 1 〇〇 °c, or even Can be less than 900t. Good carbon formation Yuanxin and right ancient, network thermal conductivity, such as silver, copper and aluminum, the 0/^^^ of the above-mentioned slave forming alizanes contained in the infiltrated alloy is at least 1% to 10% by weight , or to a small 7 乂 main ^ 1% radiator weight ratio. The infiltrated alloy can be coated with fine-human, '°, a gold, steel-manganese alloy can be copper-manganese (30/〇)-nickel (5%) alloy, A dazzle wop is about 850 °C 'far low In the conventional use of io,, and mouth, the other is steel Ming 鍅 (9 / 〇) and copper - 鍅 (1%), because the record does not have a good conductivity ra 妁 性 性 ' ' so the content is relatively low In general, the use of carbides to form metallic metals is the bond between copper and diamonds, and most of the carbonized formations are 埶, σ, ..., 、, 巴, 彖, therefore, carbides and diamonds. The degree of junction 20 1258333 increases with respect to the growth of thermal resistance. Since the inductive alloy with good conductivity and point is used in the present invention, the operating temperature is lowered to bring the thickness of the crucible: the second wet property and the low heat dissolver to be much smaller than the conventional method: the difference in the force is reduced. 2mm, with two: the thickness is greater than about 1 unit time to conduct a large amount of heat energy, there is a better cooling efficiency than the :: degree radiator. <Future of existing radiators>

The heat sink of the present invention can be made into various types of heat sources based on the purpose of use: (4) The widely used heat sink has a thickness of about 〇·工' and the electrician supplies are n ^ ^ mm to 1 mm, The shape may be a j-shaped shape, an elliptical plate shape or a quadrilateral shape such as a positive wafer. The heat source can be electrical or other heat generating material 4 other shapes

_This month, the package S has a cooling unit that transfers heat from the heat source, as shown in the first figure—the heat sink (12) made by the previous principle, the same as the heat source (14) of cPu and (16): The political heat s (1 2) transmits the heat energy generated by c PU to the heat sink (Work 6), and the heat sink is set to a conventional structure, which can be made of Shao or copper, as shown in Figure 1. Show that the structure includes cooling 18) to dissipate the heat energy as shown in the first b diagram, the heat sink (12) is at least partially buried in the heat source (14) and the heat sink (! 6) towel Such heat is not only from the heat sink, but also from the side of the heat sink. The heat sink can be connected by soldering it after partially embedding the heat sink (16). 21 1258333 Together, or oppressive combination, where the material creates an obstacle to the heat transfer effect. The Μ compression combination method does not produce welding as shown in Figure C, the heat (24) of the heat pipe (22), the vapor, the heat sink can be contiguous or welded to the heat pipe through the heat pipe 璧 let the bottom straight and heat The tube is joined by welding, such as 2 6 sink containing an internal fluid having a known fluid or water in the heat pipe, as shown, the contact is in contact with the internal fluid, and the heat sink is marked to maintain the heat pipe Stable

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The diamond composite 埶 埶 耿 hot sheet of the present invention may comprise a special diamond-containing material, and the heat transfer gradient may be a function of a plurality of forming methods for heat transfer of a specific material and a heat transfer path. The compositional change conductivity will also change, and most of the illusions have an effect such as the diamond volume average free heat transfer path and impurities. The volumetric concentration of the diamonds is increased to increase the overall thermal conductivity, but different sizes of the same diamond volume concentration will have different thermal conductivity, especially between the average particle size increase between the stone particles and the non-carbon material. The boundary also increases, causing a large number of solid-solid boundaries, and the increase in the boundary causes heat to pass. The average free heat transfer path is the average distance only for heat transfer paths that do not contain solid-solid boundary only stone particles. In the case of - high sorghum transmission domain, the size of the diamond particles must be increased or the diameter of the diamond film. Typically, heat conduction is multi-universal, but it prefers a small conduction path to dissipate from the surface, including..., each material can be designed to have higher heat conduction in the vicinity of the source, and ¥丨生, Asia's 22 1258333 from the heat source is calculated to have lower thermal conductivity. In the present invention, the diamond-containing material may be a diamond composite material, and other known diamond-containing diamond heat sinks may also be used, and the heat transfer gradient is designed to span the entire heat sink, wherein the temperature variation curve and the thermal conductivity are used. Discontinuous or sudden changes must be minimized. As shown in Figures 2 to 6, the thermal transfer gradient can be theoretically chosen to balance product cost. The heat transfer gradient can affect the temperature gradient. When the overall temperature gradient is lowered, the ideal heat transfer curve reduces the thermal resistance. In this way, although the heat sink can dissipate heat quickly, it can also maximize the heat storage capacity. When designing various diamond-containing materials, the heat transfer gradient can be reduced from the heat energy inflow region to the heat energy outflow region, and the heat transfer gradient changes by about 一% to 8%, preferably 10% to 60%. Please refer to the second figure, a diamond composite radiator (30), which has a drilled area throughout the radiator, "heat energy elimination zone (3 close to the heat source (3 4), and the enthalpy can flow out Ε ? Μ 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 此 最 最 最 最 最 最 最 最The continuity of the ingress zone is decreasing. The concentration change consists of a period of time. The Aihua consists of a non-successful area of different diamond particle concentrations, such as the second? ^ ^ /, map, the number of areas depends on heat dissipation. The device is self-determined, some of the examples are produced. The η祥α ^ £ domain can be turned to control the heat transfer gradient. In question, the thermal conductivity, the diamond shot and the diamond particles can be changed to include the drill. The radiation and horizontal directions of the material are formed. In some embodiments, the heat transfer gradient can be changed by the variation of the region 23 1258333 + sentence free heat transfer path in the embodiment can be changed by the rumor Talu Lu/Chemical average free heat transfer is completed, so each zone:: Cloth The average diamond particle size can be, * into the "dip + # average diamond particle size are relatively adjacent and close to the neighboring area of the lunar b into the area is small. Philippine 3 radiator can be designed to be the junction The two-dimensional direction is shown, but in fact, although the structure is constructed, the heat transfer gradient can be in the three-dimensional two, and can be a two-dimensional knot. The upward heat-exposed whole heat-conducting diamond ΓΓ, a diamond film (38) ) formed in adjacent particles =, diamonds ... formed by chemical vapor infiltration (chem 0 沉积 deposition to the surface of the diamond diamond area or = milk phase deposition or other methods, materials such as Yi U drill 'drill Carbon or other 'chemical vapor phase infiltration methods are commonly used in porous (four) ^ which will form a diamond in the gap between the diamond particles at the surface close to the particle diamond area. Therefore, the diamond film is integrated with the surface of the particle diamond area. This reduces the pure force of the boundary between the diamond film and the diamond diamond zone. Further, the gradual change of the composition makes the heat transfer gradient change moderately at the boundary. Selectively, the diamond film and the particle diamond zone are separated. Knot For example, welding to the surface of the diamond diamond zone, for example, the fourth figure, wherein the diamond film (38) is welded to the particle diamond zone (4 〇) through a solder layer (4 2 ), although compared to the chemical vapor phase infiltration method. Will produce discontinuous heat transfer changes, but the weld material can still fill the voids in the diamond diamond area, select the weld material with high thermal conductivity, or form it into a film of several micrometers thick to reduce the thermal resistance. The material used in 24 1258333 is Silver-copper-titanium alloy, gold, gold. The good heat of using diamond pure diamond is expensive and time-consuming thickness is about 〇·m to 0 · 7 m. Although it can be slightly used as CP u, the diamond film is used for 400 W/ The m film acts as a conductive connection (purely drilled, so to reduce the thickness by 1 mm to 1 mmm; the optimum thickness is reduced, but there is still gas equipment, because in its embodiment, thermal energy K, thermal energy outflow zone 〇 W / m K, the merits of the classics are 2,40 degrees, preferably 0. The effect of the south temperature is the heat transfer type of the inflow zone is 5, the diamond film has the connection 〇W/m κ ), but this is the case. For these problems, the suitable thickness is about 〇.3m 5 mm. In this way, thermal energy is particularly suitable for temporary and volatility. The thermal conductivity at the highest is 2 conductivity is about 20 〇W / 〇 OW / mK to 1 〇 Mountain As shown in the fifth figure, the heat sink (3 〇c ) contains a non-anaerobic block (4 4 ) In particular, a diamond-containing material (40 a) can be embedded in a non-3 衩 block (4 4 ), which has high thermal conductivity such as copper, anaerobic high conductivity copper (oxygeri free high c 〇nductivity 〇FHC), silver, Ming, gold and alloys of the above metals, the sixth figure shows that a non-nano block (44) has a receiving part for accommodating the material containing diamond (4 0 b ) 〇 '

Table 2 below lists the thermal properties of various materials. Thermal conductivity (W/mK) Thermal diffusivity (cm2/sec) Heat capacity (J/KgK) Density (g/cm3) Γ &quot;2400 12.7 540 3.52 800 4.29 486 4.00 ~ 4δδ ~ 1.16 385 8.96 6.0 11 1.4 0.39 - Conductivity is a calculated product of thermal diffusivity, heat capacity and density 25 1258333 wherein DiaCu (available from Kinik Corporation) is an embodiment of the present invention having a homogeneous phase composition and The thermal conductivity throughout, in which the ratio of drilled copper is about 9, due to crystal defects and impurities, the efficiency is about 3 · 7, the sintered stone is not like metal, the diamond heat transfer through the crystal vibration rather than the electron movement. The imperfections and defects of the diamond crystals block the lattice vibration, so although the theoretical data is very high, the actual measured heat dissipation of the heat sink is only twice that of copper. In addition to the above discussion, thermal expansion is also a consideration for material selection. As shown in the seventh figure, the thermal expansion coefficients of several materials correspond to the relationship of heat transfer coefficient, where the two corner regions are the largest diamond composite and diamond-containing material. Interval 'preferably, any material such as gap material, solder or adjacent areas should have a coefficient of thermal expansion close to that of diamond #, and the difference of 35 large thermal expansions will become the fatigue and pressure of the stone. The term, graphite (〇, represents the plane of the graphene perpendicular to, c,, the crystal axis, and, graphite / / c,, represents the plane of the graphene parallel to the crystal axis of "c,", which is the graphite in each direction The natural characteristics of the opposite sex' In addition, the thermal expansion coefficient of Shi Xi is also considered in the corresponding use of the device containing Shi Xi. The surname a diamond material can be formed in the same way as the above, the above-mentioned composition of the homogeneous phase, the mouth The method can also be applied to diamond-containing materials having different diamond volume concentrations and particle sizes, for example, a series of diamond particles can be stacked into a specific pattern to form a particulate diamond region. It can stack diamonds from large to small or from small to large in batches in a mold, or fill gap materials in two adjacent layers. Suitable for κ%, for each layer, there can be different average drills. 26 Ϊ258333

Therefore, the thermal conductivity is lower than that of the low pressure. The present invention uses twice as much cobalt as the P C D instead of the steel of p C D conductivity. The diamond composite radiator is high. This thicker diamond granule, and with high heat 'so the thermal conductivity will be more than mechanical properties for p ◦ D for sapphire diamonds, such as cutting tools, drill bits, d-line blocks, etc. 'Use polycrystalline diamonds in heat dissipation machinery Physical properties are not important. 'Stacking efficiency and thermal energy characteristics are the main considerations, so it is different from traditional grinding applications, especially the particle size and the penetrating agent and sintering aid used together.

In order to increase the heat transfer efficiency, the boundary of the diamond particles must be minimized, and this must be maximized to conflict with the premise. The use of large particles of diamond particles not only reduces the boundary, but also increases the stacking efficiency and further increases the thermal conductivity. Therefore, the standard of the present invention can be applied to all diamond and diamond's radiators. Embodiment 2: a circular hole having a diameter of about mm is formed on a planar substrate of an aluminum heat sink device, and the heat sink device has heat dissipation by a fan. 2 0 fin

The via coating - thermal paste is in the middle. The __ venting heat sink is formed to be heated to about 20 to open the hole, and then the diamond composite heat sink having the same diameter of about 20 mm is inserted into the hole, and the vent hole allows excess heat conductive paste to flow out. To ensure that there is no air between the two. After cooling, the heat sink can be firmly fixed on the heat sink device, and the top surface of the heat sink is grounded to shrink the residual gravel, and the heat sink is in contact with a wafer or a C P u to heat the heat through the heat sink. The bottom and sides are guided to the heat 28 1258333 sinking device. Re-cultivation example three: : . The diamond particles are cleaned with acid for 5 〇 / 6 Q and placed in a cylindrical cup. An anaerobic high-conductivity steel disc is placed on the Ding page of the diamond particles. The sample is at 20 Q 0 tons. The cubic press has a pressure of about 5 · 5 G Pa in the six-sided top, which uses six anvils close to pressurize and a current through the graphite tube to provide heating to 丄丄50. (: Above, copper is refining and permeating through the stone particles. After cooling and pressure relief, the sample is ground to remove the surface and bottom surface of the button cup and the drill steel composite, and the finished dish is 5〇8mm straight _ The diameter is 2. 7 mm thick, and the diamond volume content is about 9〇%, and has a thermal conductivity of pure copper of 1.5 to 2.5 times. Embodiment 4: The heat sink is the same as the method of the third embodiment, but infiltrated The copper contains about 1% by weight 鍅 to increase the affinity for the diamond so that the copper melt can wet the diamond. Example 5 i The heat sink is the same as in the third embodiment except that a copper-silver alloy is used to increase the material. Thermal Conductivity. Example 6 A thin roll of graphite (available from Graftech International Ltd, trade name GRAF〇IL) was placed in an aluminum container and covered with a 3 Å / 29 1258333 - equivalent stone. A flat plate presses the diamond particles into the graphite crucible, and the thin rolls of silver-copper-tin-titanium are laid flat on the diamond/graphite composition: the top surface is finally placed in a vacuum furnace at 9 5 〇t: heated for 5 minutes. , completing a composite of aluminum, diamond and graphite, the composite The thermal conductivity is comparable to that of pure copper, but its thermal expansion coefficient is only 1/3 of that of copper and 6 and is close to many 'semiconductors (such as G a N) #, so it can be combined with semiconductors to become a scattering attack. Example 7: 5 〇 / 60 The mesh of diamond particles (about 5 〇〇 microns) is mixed with copper-based solder powder (about 20 μm) to achieve a volumetric benefit of 5 〇%, and the mixture is 4 〇 MPa (400 rpm) in Shijiu Mould. Pressurize 'Asian to 750.. Heat for 1 〇 minutes, the final finished diamond metal composite disc is 3 〇mm diameter and 3mm thick. Free Example 8: Place 3 0 / 4 〇 mesh diamond particles mixed with aluminum powder Enter

In the middle, the sample is melted in a vacuum furnace for a minute, and after cooling, it forms a ~5 torr 7 7 5 〇 diamond-ming compound. One aluminum tray °C heating 5 Example 9 3 0 / 4 〇 曰 μ μ μ

The diamond particles of the division are placed in a graphite mold and are about 3 2 5 a / 'I NI NICR0BRAZLM powder (purchasing g Wa11

Colmonoy) covered, the sample is too knowledgeable. This u vacuum furnace is heated at 10 to 5 t〇rr with work 〇 30 1258333 1 0 °C to form i 2 particles to form _ knife in the nickel alloy alloy diamond metal compound Things. Infiltrated into the diamond implementation | Take two 1 (40 mesh diamond particles into a graphite mold, and cover with Shi Xitian 0, the sample is vacuumed in a furnace at 1 4 7 0 t plus 9 minutes cough Visit the door of the br under the m to penetrate into the diamond particles between the n diamond and the broken or carbon cut complex.

Example + —: The 30 0 / 40 0 mesh diamond particles were placed in a graphite mold and disturbed, then the 2 2 0 / 2 30 mesh diamond particles were placed and disturbed until the small particles of diamonds filled the large diamonds. Between the gaps, the stacked diamonds are covered with 325 mesh Γ ΒΜΖΜ ΒΜΖΜ γ 盍, and the sample is heated in a vacuum oven at 1 0 - 5 t 〇 r: r for 1 2 minutes for 1 2 minutes to allow nickel The chromium alloy dissolves to form a diamond metal complex between the diamond particles. Example 12: A 30/40 mesh diamond particle is stacked around a cathode and immersed in an acid bath containing copper ions. After the current is passed, copper will gradually deposit in the pores of the diamond particles. A diamond copper composite. 31 1258333 Example 13: A diamond particle (sda - 1 〇〇s made by De Beers) of 2 0 / 2 5 eyes is approximately aligned on an aluminum plate to form about 40 square meters. Single |, a 〇 7 mm thick 矽 wafer, placed on the surface of a single layer, the sample is heated in a vacuum furnace at 丄〇 5 5 〇 rr at 1 4 5 0 C for 15 minutes to allow the crucible to melt, Infiltrated into the diamond particles, after cooling, the composite is mechanically ground to remove excess ruthenium, and a diamond composite heat sink having a thickness of about 〇·8 mm is formed, which contains a volume concentration of 90%. The use of cubic diamond particles in this embodiment facilitates stacking. Example +4: The 4 0 / 50 mesh diamond particles were mixed with the powder of strontium and titanium, and the whole mixture was placed in a graphite mold and then placed in a heating tube of titanium, followed by a pyrophyllite (pyr〇 phyllite). On the block, the block is placed in a cubic press and applied with 5. 5 GPa and heated by a current through a titanium tube. When the crucible melts, it dissolves the titanium and penetrates into the diamond particles, allowing the diamond particles and the stone eve. The solution aid is sintered at -#. After cooling and decompression, the composite is removed from the block, and finally a thickness of about 3 mm and a diameter of 2 are formed.

Omm's diamond composite heat sink, which contains 92% by volume, is diamond-grinded with a diamond wheel and has twice the thermal conductivity of copper. Implementation of Baotu····································································································· A 1 mm thick (four) purpose drill is formed on the top and the periphery of the diamond crucible. The 5 〇/60 0 mesh diamond cobalt is transported by a ^ ^, and the stone is spread about 1 mm thick to form the first layer. On the first floor, the 8 〇 / Ί ^ υ υ 目的 钻石 钻石 钻石 钻石 钻石 钻石 、 、 、 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石 钻石...Oxygen-conducting copper penetrates under vacuum, and the diamond composite after the robber-曰+ heat dissipation has a heat transfer gradient.

Example 16: The heat sink and the tenth embodiment of the diamond particles are pre-coated with a layer of 0 in the same manner as in the middle, however, the diamond film and 1 #m of titanium to improve the steel penetrant of the heat sink and the fourteenth embodiment The method is the same, however, does not contain a diamond film. The diamond composite is placed in a chemical vapor infiltration system, and a 2,1 mm diamond film is formed on the first layer, and then the periphery of the heat sink is sinned to form an oxygen-free high-conductivity copper ring to make a change. Degree of radiator. ..., the ladder is characterized by the use of diamond film or diamond chip at the contact wafer. The larger volume at the end of the political heat film replaces the diamond with more copper. = Two improved methods can be used simultaneously or separately, depending on the heat dissipation of the chip and the price competition. On the other hand, since the diamond has the lowest average thermal expansion coefficient of the crystal material of 33 I258333, the thermal expansion rate of the copper composite (4) is also much smaller than that of the metal. Therefore, when the copper body and the semiconductor crystal are bonded, the stress at the interface is low, so that the wafer is not easily peeled off or peeled off, which is another advantage of using the heat sink of the copper body in the present invention. In summary, the diffused film with the diamond concentration gradient of the present invention can not only have good heat dissipation efficiency and durability in use, but also can save cost in production, and it can be used for efficiency. With both economic benefits and consistent inventions, it is hereby filed to file an invention patent application. [Simple description of the diagram] ° (1) Schematic part The first a diagram is a schematic diagram of heat conduction in accordance with one of the present invention and the heat sink. The "film" is an example of another heat sink embodiment in accordance with the present invention and a heat transfer diagram of a heat sink and a heat sink. ..., the figure c is in accordance with the present invention. A heat sink embodiment and a heat transfer schematic diagram of a heat sink and a heat sink. The second figure is a side section of the heat sink of the present invention. A side cross-sectional view of a dilute film containing a diamond film and abutting a heat source. A hot piece I: is a side cross-sectional view of another month of the present invention containing a diamond film and abutting a heat source. The side of the further heat sink embodiment of the present invention comprises a non-carbon material surrounded by the drilled area. 34 1258333 The sixth figure is a side cross-sectional view of another heat sink embodiment of the present invention. It consists of a non-carbon material surrounded by the drilled area. The seventh figure is a graph of the thermal expansion coefficient of various materials corresponding to thermal conductivity. (2) Component symbol (1 0) Heat sink (1 4 ) c PU heat source (1 6) Heat sink (1 8 ) fin (2 2 ) heat pipe (2 4 ) internal flow Body (2 6 ) Soldering Point ® (30 a-d) Diamond Composite Radiator (3 2 a — b ) Thermal Inrush Zone (3 4 ) Heat Source (3 6 ) Thermal Energy Outflow Zone (3 8 ) Diamond Film ( 4 0 a — b ) particulate diamond zone (4 2 ) weld layer (4 4 ) non-carbonaceous block 35

Claims (1)

Ϊ258333 I_____ i month (hurry repair (more) is replacing the page pick, patent application scope: ~ a 1 · A diamond composite heat sink, which contains · a diamond-containing material with a variability heat transfer gradient, the heat transfer gradient In the talented field, the heat inflow from the zone to the thermal energy outflow zone is decremented and determined by the change in the volume concentration of the diamond. 2 · The diamond composite as described in claim 1 of the patent scope dissipates heat. The change in the volume concentration of the diamond is continuously reduced from the influx of the heat energy to the heat energy. 3 · The diamond composite heat sink as described in claim 1 of the patent, wherein the volume concentration of the diamond is changed. For a series of discontinuous regions ό〆ΤΤ&gt; π &gt; into 'each region has different concentrations of diamond particles. 4 · Diamond composite heat sink as described in claim 1 of the patent, wherein the diamond-containing material further The utility model comprises a series of regions, wherein the heat influx zone and the heat energy outflow zone are included, and the diamond concentration in each zone is small and adjacent to the heat energy inflow zone is small. The diamond composite heat sink described in the first aspect of the patent range wherein the volume concentration of the diamond varies from 30% to 95%. 6 · The diamond composite heat dissipation as described in claim 1 a sheet, wherein the heat transfer gradient is determined by a series of variability and an average free heat transfer path across the diamond-containing shell. 7 - The diamond composite heat sink of claim 6 wherein the change The average free heat transfer path is determined by the average diamond particle size on the heat transfer gradient. 8 · The diamond composite heat dissipation as described in claim 7 is τ ^ ^ Ο Ο ο ί&quot;^— ——————~·~TM^&quot;^&quot;%^',,ν,^ I iYiyue/3Saki (more) is replacing 5 i one by one ^^** piece 'where' The diamond-containing material further includes a/series region, and the region contains a δ δ 玄 hot month b inflow region and a thermal energy effluent region, and the diamond concentration in the parent region is adjacent to the neighboring region near the thermal energy inflow region. 9. The diamond composite heat sink according to claim 1, wherein the heat influx zone Included in the diamond film. 1 0 · The heat dissipation of the diamond composite as described in item 9 of the patent application section 'Thermal energy> The thickness of the Yongjin area is 〇·1 mm to 1 1T1 m. 1 1 ·If the patent application scope The diamond composite according to item 10, wherein the thickness of the heat inflow region is 〇·3 mm to 〇·m. m piece, =2 · The diamond compound according to claim 9 Dispersion $ in the 'Drilling material into the step-containing-particle diamond area in the ^ ° 谧 谧 钻石 diamond area contains a series of diamond particles. Hot film, such as the diamond compound described in item 12 of the patent application* 苴 /,, the series of diamond particles will each contact at least ', 匕 diamond particles. In the hot film, please refer to the diamond compound* sintered in the patent scope of item 13: in::: each diamond particle and at least one other diamond heat 2 in the patent as claimed in the scope of &quot; In the composite, in the micro-diamond area, the diamond-like heat sheet, the diamond complex described in Item 15 of the patent application scope, θ, wherein the gap material is selected from the following η aluminum and its alloy. j f / and contains: copper, silver 37 1258333 1 7 The diamond composite heat sink of claim 13 wherein the thermal influx is formed directly on the particulate diamond region. 1 8 The diamond composite heat sink of claim 13 wherein the thermal influx is directly welded to the particulate diamond region. The diamond composite heat sink of the invention of claim 1, wherein the diamond-containing material is in contact with a non-carbon-containing block. The diamond composite heat sink of claim 19, wherein the non-carbonaceous block is copper. d 1 · The diamond composite heat sink of claim 1 wherein the diamond-containing material is welded to a non-carbonaceous block. 2 2 · A diamond composite heat-dissipating door as described in the scope of claim 2 wherein the heat sink comprises a series of thermal energy influx areas. 2 3. The diamond composite heat sink/, as described in the scope of the patent application. Xuanzheng Thermal Benefits includes a series of thermal energy outflow areas. 2 4 The diamond composite heat sink according to claim i, wherein the thermal conductivity of the enthalpy inflow region is 2400 〇w / Γν, and the thermal conductivity of the 玄 泰 ^ ^ 6 Ο 0 w/m κ 〇, , b ΰ ΰ • A method of making a heat sink that determines the volume of the heat sink; designing the heat sink based on the characteristics of the heat source, and including the following steps: The heat-reducing curve can be achieved by forming a heat-transfer gradient containing enthalpy, wherein the formation of diamond-containing particles having a stack of 4: a stack is included in a predetermined path, and the heat transfer gradient is included in the step 38 The month of the month is more than 0 1258333 to change the size of the diamond particles to form a particle diamond area = 6 ' as described in claim 25, wherein the L m drill; the 5 particle step is ··········································································································· Yj\ 〇2 7. As described in the patent application, item 25, stacking - having the first - average ', then with smaller diamond particles 糸 ... - 钻石 钻石 diamond particles ' after # &amp; 4 ” ' ^ , the gap between the diamond particles of the brother series, forming a younger-particle diamond area. 2 8 · As described in the patent scope of item 27, Lizhong, Hefeng further includes laying a brother and a The sapphire particles are drilled in the first particle. After that, the smaller diamond particles are filled in the gap between the second contiguous diamond particles, a gentleman # ^ m ^ m ', into a two-part diamond region. .2 9 · If the method described in claim 25, In the case of the package 3, a diamond film is formed adjacent to the particle diamond region. The method of forming the diamond film is based on the surface of the diamond region, as described in claim 29, 。. The "Qin" method is directly formed on the microparticles 3 1 · The method described in the ninth item of the patent scope, the method for forming the diamond film, the τ dry connection method directly, and the mouth δ is on the surface of the microparticle diamond region . 3 2. The method of claim 25, wherein the particulate diamond region is in contact with the non-carbonaceous block. , 39 1258333 丨靡^尔%费使(四): ----------------------..·.·----------- ------------------------- „ —............... — ·' .' 3 3 · The method of claim 3, wherein the non-carbon-containing block contains copper. The method of claim 25, wherein the method comprises The method of claim 25, wherein the method comprises sintering the particulate diamond region. 3 6 · The method of claim 25 Wherein, each of the diamond particles is brought into contact with at least one of the other diamond particles when stacked. 3 7. The method of claim 25, wherein the intended heat source is a CPU. 40