TWI257160B - Apparatus and method for reducing electrical noise in a thermally controlled chuck - Google Patents

Apparatus and method for reducing electrical noise in a thermally controlled chuck

Info

Publication number
TWI257160B
TWI257160B TW093136225A TW93136225A TWI257160B TW I257160 B TWI257160 B TW I257160B TW 093136225 A TW093136225 A TW 093136225A TW 93136225 A TW93136225 A TW 93136225A TW I257160 B TWI257160 B TW I257160B
Authority
TW
Taiwan
Prior art keywords
fluid
chuck
temperature
temperature control
workpiece
Prior art date
Application number
TW093136225A
Other languages
Chinese (zh)
Other versions
TW200537666A (en
Inventor
Douglas E Hudson
James Pelrin
Sanjiv Patel
Chin Chien Tee
Kenneth M Cole Sr
Original Assignee
Temptronic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Temptronic Corp filed Critical Temptronic Corp
Publication of TW200537666A publication Critical patent/TW200537666A/en
Application granted granted Critical
Publication of TWI257160B publication Critical patent/TWI257160B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Temperature (AREA)

Abstract

A system and method for controlling temperature of a workpiece such as a semiconductor wafer and the chuck supporting the wafer are described. The system includes a heat exchanger used in controlling temperature of a temperature control fluid. A first fluid carrying path carries the temperature control fluid from the heat exchanger to an outlet, the outlet being connectable to the workpiece chuck to carry the temperature control fluid to the workpiece chuck. A second fluid carrying path carries the temperature control fluid from an inlet to the heat exchanger, the inlet being connectable to the workpiece chuck to carry the temperature control fluid from the workpiece chuck to the temperature control system. A dual-flow rate technique is employed such that, when the chuck temperature is in transition, the temperature control fluid is circulated at a relatively high flow rate such that temperature transition of the chuck can be realized at a fast rate. When the temperature of the chuck is being maintained at a set point temperature, the flow rate of the fluid can be reduced such that electrical noise introduced by the motion of the fluid, such as by the triboelectric effect, can be reduced. A capillary tube can be connected between the first fluid carrying path and the second fluid carrying path. First and second valves can be connected in the first and second fluid carrying paths to prevent the flow of fluid into the chuck when the chuck is at high temperature such that motion induced by flash boiling of the fluid is eliminated.
TW093136225A 2003-11-26 2004-11-25 Apparatus and method for reducing electrical noise in a thermally controlled chuck TWI257160B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US52603003P 2003-11-26 2003-11-26
US10/997,017 US20050121186A1 (en) 2003-11-26 2004-11-23 Apparatus and method for reducing electrical noise in a thermally controlled chuck

Publications (2)

Publication Number Publication Date
TW200537666A TW200537666A (en) 2005-11-16
TWI257160B true TWI257160B (en) 2006-06-21

Family

ID=34636548

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093136225A TWI257160B (en) 2003-11-26 2004-11-25 Apparatus and method for reducing electrical noise in a thermally controlled chuck

Country Status (5)

Country Link
US (1) US20050121186A1 (en)
EP (1) EP1692714A1 (en)
JP (1) JP2007512715A (en)
TW (1) TWI257160B (en)
WO (1) WO2005055291A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9155134B2 (en) * 2008-10-17 2015-10-06 Applied Materials, Inc. Methods and apparatus for rapidly responsive heat control in plasma processing devices
JP6303953B2 (en) * 2014-09-22 2018-04-04 株式会社島津製作所 X-ray tube device

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4734872A (en) * 1985-04-30 1988-03-29 Temptronic Corporation Temperature control for device under test
US4934155A (en) * 1986-03-18 1990-06-19 Mydax, Inc. Refrigeration system
EP0363098B1 (en) * 1988-10-03 1995-04-05 Canon Kabushiki Kaisha Temperature controlling device
JPH05299379A (en) * 1992-04-21 1993-11-12 Mitsubishi Electric Corp Temperature control device and method thereof
JPH07260235A (en) * 1994-03-18 1995-10-13 Hitachi Ltd Multi-room air conditioner and operating method therefor
JPH09157846A (en) * 1995-12-01 1997-06-17 Teisan Kk Temperature controller
JPH09172001A (en) * 1995-12-15 1997-06-30 Sony Corp Method and device for controlling temperature in semiconductor manufacturing apparatus
JP3172760B2 (en) * 1997-03-07 2001-06-04 東京エレクトロン株式会社 Vacuum contactor
JP3095377B2 (en) * 1997-12-24 2000-10-03 イノテック株式会社 Chiller equipment
US6091060A (en) * 1997-12-31 2000-07-18 Temptronic Corporation Power and control system for a workpiece chuck
US6415858B1 (en) * 1997-12-31 2002-07-09 Temptronic Corporation Temperature control system for a workpiece chuck
US6073681A (en) * 1997-12-31 2000-06-13 Temptronic Corporation Workpiece chuck
US6019164A (en) * 1997-12-31 2000-02-01 Temptronic Corporation Workpiece chuck
US6328096B1 (en) * 1997-12-31 2001-12-11 Temptronic Corporation Workpiece chuck
US6070413A (en) * 1998-07-01 2000-06-06 Temptronic Corporation Condensation-free apparatus and method for transferring low-temperature fluid
US6635580B1 (en) * 1999-04-01 2003-10-21 Taiwan Semiconductor Manufacturing Co. Ltd. Apparatus and method for controlling wafer temperature in a plasma etcher
WO2000074117A1 (en) * 1999-05-27 2000-12-07 Matrix Integrated Systems, Inc. Rapid heating and cooling of workpiece chucks
TW413862B (en) * 1999-08-30 2000-12-01 Mosel Vitelic Inc Piping system of etching apparatus
US6552561B2 (en) * 2000-07-10 2003-04-22 Temptronic Corporation Apparatus and method for controlling temperature in a device under test using integrated temperature sensitive diode
AU2001271904A1 (en) * 2000-07-10 2002-02-05 Temptronic Corporation Wafer chuck having with interleaved heating and cooling elements
JP2004507886A (en) * 2000-07-21 2004-03-11 テンプトロニック　コーポレイション Thermal platform for automatic testing with temperature control
US6967177B1 (en) * 2000-09-27 2005-11-22 Lsi Logic Corporation Temperature control system
US7225864B2 (en) * 2001-02-08 2007-06-05 Oriol Inc. Multi-channel temperature control system for semiconductor processing facilities
JP3973853B2 (en) * 2001-03-28 2007-09-12 大日本スクリーン製造株式会社 Heat treatment equipment
KR100397047B1 (en) * 2001-05-08 2003-09-02 삼성전자주식회사 Chiller of electrostatic chuck and chilling method thereof
JP2003297815A (en) * 2002-04-02 2003-10-17 Hitachi Kokusai Electric Inc Semiconductor manufacturing equipment
US6745575B2 (en) * 2002-07-11 2004-06-08 Temptronic Corporation Workpiece chuck with temperature control assembly having spacers between layers providing clearance for thermoelectric modules

Also Published As

Publication number Publication date
TW200537666A (en) 2005-11-16
WO2005055291A9 (en) 2005-11-17
US20050121186A1 (en) 2005-06-09
JP2007512715A (en) 2007-05-17
WO2005055291A1 (en) 2005-06-16
EP1692714A1 (en) 2006-08-23

Similar Documents

Publication Publication Date Title
JP7072383B2 (en) Substrate carrier with proportional thermal fluid delivery system
TWI533764B (en) Methods and apparatus for rapidly responsive heat control in plasma processing devices
CN102057476B (en) Fast substrate support temperature control
JP2012506128A5 (en)
JP7438985B2 (en) Temperature control system and temperature control method
TW201945878A (en) Flow rate control method, temperature control method, and processing apparatus
TW200605178A (en) Cooling systems and apparatuses thereof for temperature control of semiconductor
JP2021009590A (en) Temperature control system and temperature control method
CN103792790A (en) Thermostatic control system of photoresist and developing solvent
TWI257160B (en) Apparatus and method for reducing electrical noise in a thermally controlled chuck
CN110544663A (en) Circulating liquid system of electrostatic adsorption chuck
KR20080041893A (en) A chuck for heating and cooling
KR100404651B1 (en) Chiller of Semiconductor Manufacturing Equipment
CN109427610B (en) Wafer temperature control system, wafer temperature control method and reaction chamber
CN100361288C (en) System for fast controlling electrostatic chuck temperature
JP2003148852A (en) Temperature control device for chuck, and temperature control method for chuck
JP2006261497A5 (en)
JP2019194753A (en) Temperature control system, temperature control method, manufacturing apparatus and inspection device
TWI840571B (en) Temperature control system and temperature control method
CN101425472B (en) Electrostatic clamping disc controlling temperature by air and method for controlling temperature of substrate
JP3041410U (en) Heat exchange system
TW200731342A (en) Temperature control apparatus, exposure device, method of temperature control, and method of producing device
JP5107548B2 (en) Circulating fluid supply device
TWM445161U (en) Temperature regulation device
JP2003243380A5 (en)

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees