Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kingtron Electronics Co LtdfiledCriticalKingtron Electronics Co Ltd
Priority to TW94116934ApriorityCriticalpatent/TWI256717B/en
Application grantedgrantedCritical
Publication of TWI256717BpublicationCriticalpatent/TWI256717B/en
Publication of TW200642062ApublicationCriticalpatent/TW200642062A/en
A chip on film (COF) package structure comprises a flexible carrier having a flip-chip area, a circuit layer pattern and a driving IC. The circuit layer pattern is formed on the flexible carrier and a plurality of internal pins with gold as surface material is formed on the flip-chip area. The driving IC is packaged in the flexible carrier and comprises a plurality of gold-tin bumps corresponding to the above-mentioned internal pins, in which the driving IC uses its gold-tin bumps to form intermetallic compound with the internal pins of the circuit layer pattern to be packaged on the flip-chip area of the flexible carrier.
TW94116934A2005-05-242005-05-24Chip on film package structure
TWI256717B
(en)