TWI256717B - Chip on film package structure - Google Patents

Chip on film package structure

Info

Publication number
TWI256717B
TWI256717B TW94116934A TW94116934A TWI256717B TW I256717 B TWI256717 B TW I256717B TW 94116934 A TW94116934 A TW 94116934A TW 94116934 A TW94116934 A TW 94116934A TW I256717 B TWI256717 B TW I256717B
Authority
TW
Taiwan
Prior art keywords
chip
flexible carrier
package structure
flip
gold
Prior art date
Application number
TW94116934A
Other languages
Chinese (zh)
Other versions
TW200642062A (en
Inventor
Dyi-Chung Hu
Chien-Nan Wu
Original Assignee
Kingtron Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kingtron Electronics Co Ltd filed Critical Kingtron Electronics Co Ltd
Priority to TW94116934A priority Critical patent/TWI256717B/en
Application granted granted Critical
Publication of TWI256717B publication Critical patent/TWI256717B/en
Publication of TW200642062A publication Critical patent/TW200642062A/en

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Abstract

A chip on film (COF) package structure comprises a flexible carrier having a flip-chip area, a circuit layer pattern and a driving IC. The circuit layer pattern is formed on the flexible carrier and a plurality of internal pins with gold as surface material is formed on the flip-chip area. The driving IC is packaged in the flexible carrier and comprises a plurality of gold-tin bumps corresponding to the above-mentioned internal pins, in which the driving IC uses its gold-tin bumps to form intermetallic compound with the internal pins of the circuit layer pattern to be packaged on the flip-chip area of the flexible carrier.
TW94116934A 2005-05-24 2005-05-24 Chip on film package structure TWI256717B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94116934A TWI256717B (en) 2005-05-24 2005-05-24 Chip on film package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94116934A TWI256717B (en) 2005-05-24 2005-05-24 Chip on film package structure

Publications (2)

Publication Number Publication Date
TWI256717B true TWI256717B (en) 2006-06-11
TW200642062A TW200642062A (en) 2006-12-01

Family

ID=37614761

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94116934A TWI256717B (en) 2005-05-24 2005-05-24 Chip on film package structure

Country Status (1)

Country Link
TW (1) TWI256717B (en)

Also Published As

Publication number Publication date
TW200642062A (en) 2006-12-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees