1255473 '九、發明說明： Λ 【發明所屬之技術領域】 本發明涉及一種電容式傳聲器。更具體地說，本發明 涉及一種其中音孔形成在PCB的表面上的平行六面體型電 容式傳聲器。 【先前技術】 典型的電容式傳聲器包括一偏壓元件，它通常由駐極 春體、形成能夠響應於聲壓而變化的電容C的一對膜片/背板 以及用於中間轉換輸出信號的JFET(結型場效應電晶體） 構成。 第一圖為傳統的一般電容式傳聲器的示意圖。 如第一圖所示，典型的電容式傳聲器10具有一圓筒形 金屬外殼，它在其中包括極環、膜片、墊片、背板、具有 由絕緣材料製成的環形的第一基底、由導電材料製成的第 Φ二基底以及PCB等。該典型的電容式傳聲器具有圓柱形外 觀，並且在PCB中形成有兩個連接端子。 同時，在表面安裝過程中，主PCB的端子必須與電容 式傳聲器的端子正確連接。但是，上述傳統的圓筒形電容 式傳聲器其結構不適用於表面安裝裝置（SMD)。因為端子表 面形成為低於外殼的彎曲表面，所以在表面安裝過程中可 能會產生焊接故障。具體地說，如果在其中設有多個端子 ，則難以確認連接端子的方向。因此，產生這樣一個問題， 即，在連接端子的極性在表面安裝過程中已經改變或者因 5 1255473 : 為連接端子的表面偏離而只有一部分連接端子的表面被連 - 接的情況下，該連接端子被不充分連接，因此增加了連接 故障。 【發明内容】 有鑑於習用電容式傳聲器之各項缺失，本發明人有感 其產業需求，遂竭盡心智，悉心研究克服，憑從事該項產 業多年之經驗累積，進而研發出一種金屬線材先經鍍銅成 籲為鍍銅金屬線，再由鍍銅金屬線鑄上一層銅，可達到降低 成本並提高合金銅線導電性之合金銅線製造方法。 本發明之主要目的，係有關於一種平行六面體型電容 式傳聲器，其中可以很容易地確認部件的方向並且在PCB 的表面上形成有音孔。 為達上述之目的，本發明是這樣實現的：該電容式傳 聲器包括：外殼，它具有開口表面和封閉底面並且形成為 0方盒形狀；可插入到所述外殼中的金屬環；背板，它形成 為盤狀並且具有從中穿過的音孔；形成為環形的薄墊片； 圓柱形絕緣環，它具有開口頂部和底部；膜片構件，它可 以插入到所述絕緣環中並且與所述背板相對，並且所述墊 片設置在所述膜片構件和所述背板之間；環形導電環，用 於使所述膜片構件與印刷電路板（PCB)電連接；以及形成為 方板狀的所述PCB，它具有安裝在其一個表面上的部件（ IC，MLCC)和形成在其另一個表面上的伸出端子，並且在其 中央部分形成有音孔，這晨’金屬壤、背板、替片、絕緣 1255473 =環、膜片構件、導電環和pcB順序 ‘後通過使所述外殼的端部捲曲來 =殼中，然 +衣配该電容式傳聲器。 【實施方式】 為使貴審查委員瞭解本發明 茲藉由下述具體之實施例，並合、寸3及功效’ 做—詳細朗，說明如后：。所附之圖式，對本發明 包括:第根據本發明的電容式傳聲器— 千仃/、面體型外殼，用來將部 通過形成在其PCB的表面上的伸出=到其中並且適於 發明的這個電容式傳聲器1〇〇〜主PCB連接。本 狀。因此，在表面安裝時可很容易地調= 行六面體形 且這能夠解決主PCB的連接端子和 的方向，並 面會偏離或者其方向會偏移的問題==的連接表 在於，通過 二：Γ在外殼上形成音孔，然後接觸形成該音孔處的 容式傳地進m本發明的該平行六面體電 知方案進行詳細說明。 ㊉至弟"貫 [第—實施方案] 1 根據本發明的平行六面體型電容式傳聲 貝、知方案的分解立體圖。 外第三圖’根據本發明的電容式傳聲器10◦包括： Μ ’它具有開口表面和封閉底面並且形成為方盒形 7 1255473 狀’金眉核103 ’它形成為環形並且可插入到外殼⑽中 ’用於將为板104和外勢]道、s ·匕 …且…： 月板104,它形成為盤 狀亚且具有仗中穿過的音孔1G4a;形成為環形的薄塾片 106，圓柱形絕緣環1女 株nd m ^ 具有開口頂部和底部；臈片構 牛no，㈣¥笔環112’用於使臈片構件ιι〇與印刷電路 反—CB ’ 114)電連接’·以及形成為方板狀的PCB114，它具 有安裝在其-個表面上的部件（ICMLa)和形 —八 鍊面^伸出端子.並且具有穿過該PCB形成的音—孔 14a 1裏’膜片構件11〇包括用於與導電環m電連接 的極環ma和通過聲麵動的膜片11〇b。背板1〇4包括用 來將形成有駐極體的有機薄麟接在其上的金屬板。 [第二實施方案] ^ 一，四圖為根據本發明的平行六面體型電容式傳聲器的 第二實施方案的分解立體圖。 和芩照第四圖，根據本發明的電容式傳聲器200包括： 籲外殼202’它具有開口表面和封閉底面並且形成為方盒形 狀；金屬環203，它可插入到方盒形外殼2〇2中，並且具有 方形外周表面和圓形内圓周表面；背板204,它形成為；形 亚且具有從中穿過的音孔施；墊片，它具有方形外 周^面和圓形内圓周表面；方盒形絕緣環208,它具有開口 頁。I5和底，膜片構件21〇 ’它可以插入到絕緣環2⑽中並 且面對著背板204，墊片206介於膜片構件21 〇和背板2〇4 之間；導電環212,用於使膜片構件21〇與PCB214電連接， 並且具有方形外周表面和圓形内圓周表面；以及形成為方 (S) 8 1255473 • 板狀的PCB214，它具有安裝在其一個表面上的部件 (IC，MLCC)和形成在其另一個表面上的伸出端子216，並且 具有穿過該PCB形成的音孔214a。這裏，膜片構件210包 括用於與導電環212電連接的極環210a和通過聲壓振動的 膜片210b。背板204包括用來將形成有駐極體的有機薄膜 溶接在其上的金屬板。 [第三實施方案] 第五圖為根據本發明的平行六面體型電容式傳聲器的 籲第三實施方案的分解立體圖。 參照第五圖，根據本發明的電容式傳聲器300包括： 外殼302，它具有開口表面和封閉底面並且形成為方盒形 狀；金屬環303，它可插入到方盒形外殼302中，並且具有 方形外周表面和方形内圓周表面；背板304，它形成為方形 並且具有從中穿過的音孔304a ;墊片306，它具有方形外 周表面和方形内圓周表面；方盒形絕緣環308，它具有開口 0頂部和底部；膜片構件310，它可以插入到絕緣環308中， 並且具有方形外周表面和其膜片的方形内圓周表面，導電 環312，用於使膜片構件310與PCB314電連接，並且具有 方形外周表面和方形内圓周表面；以及形成為方板狀的 PCB314，它具有安裝在其一個表面上的部件（1C， MLCC)和形成在其另一個表面上的伸出端子316,並且具有 穿過該PCB形成的音孔314a。這裏，膜片構件310包括用 於與導電環312電連接的極環310a和通過聲壓振動的膜片 310b。背板304包括用來將形成有駐極體的有機薄膜熔接 1255473 在其上的金屬板。 [第一Λ第三實施方案的操作] 弟八圖為本發明的第一、第二 的侧剖視圖。接〜 貝也力木的7L件 地表示這此部件1弟一實施方案的那些附圖標記來代表性 Α刀二千的附圖標記。 〜3::、:::方第一至第三實施方案的電容式傳聲器_ 103、背板104、執盒形外殼1〇2，其中順序佈置有金屬環 電環112 *形成：片106、絕緣環108、膜片構件no、導 有音孔114a的PCB。之後，如此梦脱、， 構成該電容式傳敖^ L 俊如此衣配亚且 . μ年裔，從而使外殼的端部捲曲。在PCB114 比面更^有伸出端子’並且⑽的這些伸出端子 聲器100〜_大安出壯/而在方法中可以將該電容式傳 女衣在形成有音孔的主PCB (例如， 電話的PCB)上。铲此嫂石^ 了&式 釦接祕她； 二鳊子U6可以為用於Vdd連接的端子 寿接知子以及根據附加功能所需的端子。 卜第至第二貫施方案的方形部件根據這些部件 的=造和裝配的方便性，可以具有相互接觸的形成為圓形 的H。安裝在PCB中的IC包括結型場效應電晶體（jfet) 三放大器、類比—數位（A/D)轉換器或作為用於定制該放大 為和類比〜數位（A/D)轉換器的1C的一 ASIC。 下面將進行第一至第三實施方案的電容式傳聲器的操 作。 ’、1255473 'Nine, invention description: Λ Technical Field of the Invention The present invention relates to a condenser microphone. More specifically, the present invention relates to a parallelepiped type capacitive microphone in which sound holes are formed on the surface of a PCB. [Prior Art] A typical condenser microphone includes a biasing element, which is usually composed of a pair of diaphragms/back plates that form a capacitor C that changes in response to sound pressure and an intermediate conversion output signal. JFET (junction field effect transistor) is constructed. The first picture is a schematic diagram of a conventional general condenser microphone. As shown in the first figure, a typical condenser microphone 10 has a cylindrical metal casing including a pole ring, a diaphragm, a gasket, a backing plate, a first base having an annular shape made of an insulating material, a Φ second substrate made of a conductive material, a PCB, or the like. The typical condenser microphone has a cylindrical appearance and is formed with two connection terminals in the PCB. At the same time, the terminals of the main PCB must be properly connected to the terminals of the condenser microphone during surface mounting. However, the above conventional cylindrical condenser microphone has a structure which is not suitable for a surface mount device (SMD). Since the terminal surface is formed to be lower than the curved surface of the outer casing, a welding failure may occur during the surface mounting process. Specifically, if a plurality of terminals are provided therein, it is difficult to confirm the direction of the connection terminals. Therefore, there arises a problem that the polarity of the connection terminal has changed during surface mounting or because 5 1255473 : the surface of the connection terminal is deviated and only the surface of a part of the connection terminal is connected - the connection terminal It is not fully connected, thus increasing the connection failure. SUMMARY OF THE INVENTION In view of the lack of conventional condenser microphones, the inventors have felt their industrial needs, exhausted their minds, carefully studied and overcome them, and developed a metal wire prior to the accumulation of experience in the industry. The copper plating is made of a copper-plated metal wire, and a copper layer is cast by a copper-plated metal wire to achieve an alloy copper wire manufacturing method which reduces the cost and improves the conductivity of the alloy copper wire. The main object of the present invention relates to a parallelepiped type condenser microphone in which the direction of the member can be easily confirmed and a sound hole is formed on the surface of the PCB. To achieve the above object, the present invention is achieved in that the condenser microphone comprises: an outer casing having an open surface and a closed bottom surface and formed in a square box shape; a metal ring insertable into the outer casing; a back plate, It is formed in a disk shape and has a sound hole therethrough; a shim formed into a ring shape; a cylindrical insulating ring having an open top and a bottom; a diaphragm member which can be inserted into the insulating ring and The backing plate is opposite, and the spacer is disposed between the diaphragm member and the backing plate; an annular conductive ring for electrically connecting the diaphragm member to a printed circuit board (PCB); and formed into a square plate-shaped PCB having a component (IC, MLCC) mounted on one surface thereof and an extended terminal formed on the other surface thereof, and a sound hole formed in a central portion thereof, this morning 'metal The soil, the backing plate, the slab, the insulation 1255743 = ring, the diaphragm member, the conductive ring and the pcB sequence 'after crimping the end of the outer casing = the casing, then the condenser microphone. [Embodiment] In order to make the present invention understand the present invention, the following specific examples, the combination, the inch 3, and the effect are described in detail, as follows: BRIEF DESCRIPTION OF THE DRAWINGS The present invention includes: a condenser microphone according to the present invention - a millimeter/face-type outer casing for passing a portion through an extension formed on a surface of a PCB thereof and suitable for invention This condenser microphone is connected to the main PCB. The form. Therefore, it is easy to adjust the hexahedron shape during surface mounting and this can solve the direction of the connection terminal and the main PCB, and the surface will be deviated or the direction will be offset. The cymbal is formed on the outer casing, and then the capacitive hexahedron is formed in the present invention. Ten-Dimensional [First Embodiment] An exploded perspective view of a parallelepiped-type capacitive sound transmission according to the present invention. The external third diagram 'The condenser microphone 10 according to the present invention comprises: Μ 'It has an open surface and a closed bottom surface and is formed in a square box shape 7 1255473-like 'Golden eyebrow core 103' which is formed in a ring shape and can be inserted into the outer casing (10) In the 'for the plate 104 and the external potential', s · 匕 ... and ...: the moon plate 104, which is formed into a disk-like sub-shape and has a sound hole 1G4a passing through the cymbal; a thin cymbal 106 formed into a ring shape , cylindrical insulating ring 1 female plant nd m ^ has open top and bottom; 臈 构 牛 牛 no, (4) ¥ pen ring 112 ' used to make the 构件 构件 ι 〇 〇 印刷 印刷 印刷 印刷 印刷 印刷 印刷 印刷 印刷 印刷 印刷 印刷 印刷 印刷 印刷 印刷 印刷And a PCB 114 formed in a square plate shape having a component (ICMLa) mounted on one surface thereof and a shape-eight-chain surface extension terminal. and having a sound-hole 14a 1 formed through the PCB The sheet member 11A includes a pole ring ma for electrically connecting to the conductive ring m and a diaphragm 11b for moving through the surface. The back sheet 1〇4 includes a metal plate for connecting an organic thin liner on which an electret is formed. [Second Embodiment] ^ One, four figures are exploded perspective views of a second embodiment of a parallelepiped type condenser microphone according to the present invention. And referring to the fourth figure, the condenser microphone 200 according to the present invention comprises: a housing 202' having an open surface and a closed bottom surface and formed in a square box shape; a metal ring 203 which can be inserted into the square box housing 2〇2 And having a square outer peripheral surface and a circular inner circumferential surface; a backing plate 204 formed in a shape and having a sound hole therethrough; a spacer having a square outer peripheral surface and a circular inner circumferential surface; A square box shaped insulating ring 208 having an open page. I5 and bottom, the diaphragm member 21'' can be inserted into the insulating ring 2 (10) and facing the backing plate 204, the spacer 206 is interposed between the diaphragm member 21 〇 and the backing plate 2〇4; the conductive ring 212 is used The diaphragm member 21 is electrically connected to the PCB 214, and has a square outer peripheral surface and a circular inner circumferential surface; and is formed as a square (S) 8 1255473 • a plate-shaped PCB 214 having components mounted on one surface thereof ( The IC, MLCC) and the projecting terminal 216 formed on the other surface thereof have a sound hole 214a formed through the PCB. Here, the diaphragm member 210 includes a pole ring 210a for electrically connecting to the conductive ring 212 and a diaphragm 210b for vibration by sound pressure. The backing plate 204 includes a metal plate for bonding an organic film on which an electret is formed. [Third Embodiment] Fig. 5 is an exploded perspective view showing a third embodiment of a parallelepiped type condenser microphone according to the present invention. Referring to a fifth diagram, a condenser microphone 300 according to the present invention includes: a casing 302 having an open surface and a closed bottom surface and formed in a square box shape; a metal ring 303 which can be inserted into the square box casing 302 and has a square shape a peripheral surface and a square inner circumferential surface; a backing plate 304 formed in a square shape and having a sound hole 304a therethrough; a spacer 306 having a square outer circumferential surface and a square inner circumferential surface; and a square box insulating ring 308 having a top and bottom of the opening 0; a diaphragm member 310 that can be inserted into the insulating ring 308 and has a square outer peripheral surface and a square inner circumferential surface of the diaphragm thereof, and a conductive ring 312 for electrically connecting the diaphragm member 310 to the PCB 314 And having a square outer peripheral surface and a square inner circumferential surface; and a PCB 314 formed in a square plate shape having a member (1C, MLCC) mounted on one surface thereof and an extended terminal 316 formed on the other surface thereof, And has a sound hole 314a formed through the PCB. Here, the diaphragm member 310 includes a pole ring 310a for electrically connecting with the conductive ring 312 and a diaphragm 310b for vibrating by sound pressure. The back sheet 304 includes a metal plate on which an organic film formed with an electret is welded 1255473. [Operation of the First and Third Embodiments] FIG. 8 is a side cross-sectional view showing the first and second aspects of the present invention. The 7L parts of the 〜 也 力 力 表示 表示 表示 表示 表示 表示 这 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 〜3::, :::: the condenser microphone _ 103 of the first to third embodiments, the back plate 104, and the box-shaped outer casing 1〇2, wherein the metal ring electric ring 112 is sequentially arranged. The insulating ring 108, the diaphragm member no, and the PCB with the sound hole 114a. After that, such a dream, it constitutes the capacitive transmission 敖 ^ L Jun is so equipped with the Asian, so that the end of the shell is curled. In the case of the PCB 114, there are more protruding terminals 'and these (10) of the protruding terminal sounds 100 to _ large and strong / and in the method can be the capacitive female clothing in the main PCB formed with the sound hole (for example, On the phone's PCB). Shovel this shovel ^ & type buckle to secret her; two scorpion U6 can be used for Vdd connection terminal Shouzhizi and the terminals required according to additional functions. The square members of the second to second embodiments may have a circular H formed in contact with each other in accordance with the convenience of construction and assembly of these members. ICs mounted in the PCB include junction field effect transistor (jfet) triple amplifiers, analog-to-digital (A/D) converters, or 1C for customizing the amplification and analog to digital (A/D) converters. An ASIC. The operation of the condenser microphones of the first to third embodiments will be performed below. ’,
將根據本發明的電容式傳聲器3〇〇的伸出端子丨16連 接在主PCB的連接端子上。向這些伸出端子施加Vdd和GND 1255473 能量。因此，在根據本發明的電容式傳聲器100〜300中， ‘ 膜片110b通過導電環112和極環110a與PCB114電連接， 並且背板104通過外殼102與PCB114電連接。 在這種情況下，來自外部聲源的聲音通過PCB的音孔 114a流入該傳聲器的内部並且傳遞給膜片110b。 因此，膜片110b可以在聲壓的作用下振動。然後，可 以改變在膜片110b和背板104之間的間隙。由膜片110b 和背板104所產生的靜電電容將改變，因此可以實現電信 籲號（電壓）根據聲波的變化。該信號沿著上面的電連接路徑 被傳送給安裝在PCB114中的1C，從而被放大然後通過伸出 端子116輸出給外部電路。 [第四實施方案] 第七圖為根據本發明的電容式傳聲器的第四實施方案 的分解立體圖。 參照第七圖，本發明的電容式傳聲器400包括：外殼 0 402,它具有開口表面和封閉底面並且形成為方盒形狀；金 屬環403，它形成為環形並且可插入到方盒形外殼402中； 背板404，它形成為盤狀並且具有從中穿過的音孔404a ; 形成為環形的薄墊片406 ;環形遮罩環408，用於隔離膜片 構件410 ;膜片構件410，它插入到該遮罩環408上；整體 基底412，它具有用於在膜片構件410和PCB414之間形成 電連接的導電層412b，並且該導電層形成在具有開口頂部 和底部的圓柱形絕緣體412a的内表面中；以及形成為方板 狀的PCB414,它具有安裝在其一個表面上的部件（IC，MLCC) 1255473 和形成在其另一個表面上的伸出端子416，並且具有步 1該PCB中央部分中用於傳送聲音的音孔414a。 ^成在 這裏，膜片構件410包括用於與導電層412b電連接白、 極環410a和通過聲壓振動的膜片41〇b。背板4〇4包括用1 將形成有駐極體的有機薄膜熔接在其上的金屬板。整體^ 底412具有這樣一種結構，從而採用PCB技術將中空圓桎 形絕緣體412a用作PCB，然後在該中空圓柱形絕緣體ο。 的兩側和内圓周表面中形成外徑小於其周邊外徑的金屬板 ®的導電層412b。 ： 同樣，根據本發明的整體基底412如此構成，從而執 行常規的絕緣功能的第一基底和執行導電功能的第二基底 可以由一個整體基底構成。金屬板的外徑應該小於絕緣體 的外徑從而不會與外殼接觸。這裏，絕緣體優選地可以由 破璃環氧樹脂基底、樹脂基底或基於PVC的絕緣印刷電路 板構成。 鲁 雖然沒有具體顯不出’絕緣體412a執行絕緣功冑b ’並 且還可通過在其與膜片構件410接觸的一個側面上以及其 輿PCB414接觸的另一侧面上形成金屬電鑛層，然後利用通 孔或孔來連接頂部和底部金屬電錢層從而使金屬電鍍層被 電連接來提供導電功能。 [第五實施方案] 第八圖為根據本發明的電容式傳聲器的第五實施方案 的分解立體圖。 參照第八圖，本發明的電容式傳聲器5〇〇包括：外殼 12 ,1255473The projecting terminal 丨16 of the condenser microphone 3A according to the present invention is connected to the connection terminal of the main PCB. Apply Vdd and GND 1255473 energy to these extended terminals. Therefore, in the condenser microphones 100 to 300 according to the present invention, the 'membrane 110b is electrically connected to the PCB 114 through the conductive ring 112 and the pole ring 110a, and the back plate 104 is electrically connected to the PCB 114 through the outer casing 102. In this case, sound from an external sound source flows into the inside of the microphone through the sound hole 114a of the PCB and is transmitted to the diaphragm 110b. Therefore, the diaphragm 110b can vibrate under the action of the sound pressure. Then, the gap between the diaphragm 110b and the backing plate 104 can be changed. The electrostatic capacitance generated by the diaphragm 110b and the backing plate 104 will change, so that the telecommunications call number (voltage) can be changed according to the sound wave. This signal is transmitted along the upper electrical connection path to 1C mounted in the PCB 114, thereby being amplified and then outputted to the external circuit through the extension terminal 116. [Fourth embodiment] Fig. 7 is an exploded perspective view showing a fourth embodiment of the condenser microphone according to the present invention. Referring to a seventh diagram, a condenser microphone 400 of the present invention includes a housing 0 402 having an open surface and a closed bottom surface and formed in a square box shape, and a metal ring 403 formed in a ring shape and insertable into the square box housing 402. a backing plate 404 formed in a disk shape and having a sound hole 404a therethrough; a shim 406 formed in a ring shape; an annular mask ring 408 for isolating the diaphragm member 410; a diaphragm member 410 inserted To the mask ring 408; an integral substrate 412 having a conductive layer 412b for forming an electrical connection between the diaphragm member 410 and the PCB 414, and the conductive layer is formed on the cylindrical insulator 412a having an open top and bottom In the inner surface; and a PCB 414 formed in a square plate shape having a component (IC, MLCC) 1255473 mounted on one surface thereof and a protruding terminal 416 formed on the other surface thereof, and having the center of the PCB The sound hole 414a for transmitting sound in the portion. Here, the diaphragm member 410 includes a diaphragm 41b for electrically connecting the conductive layer 412b with white, the pole ring 410a, and by sound pressure vibration. The back sheet 4〇4 includes a metal plate on which an organic film on which an electret is formed is welded. The unitary bottom 412 has such a structure that the hollow circular beak insulator 412a is used as a PCB by PCB technology, and then in the hollow cylindrical insulator. A conductive layer 412b of a metal plate® having an outer diameter smaller than the outer diameter of the periphery thereof is formed on both sides and the inner circumferential surface. Also, the integral substrate 412 according to the present invention is constructed such that the first substrate performing the conventional insulating function and the second substrate performing the conductive function can be constituted by one integral substrate. The outer diameter of the metal plate should be smaller than the outer diameter of the insulator so as not to come into contact with the outer casing. Here, the insulator may preferably be composed of a glass epoxy substrate, a resin substrate or a PVC-based insulated printed circuit board. Although Lu does not specifically show that the 'insulator 412a performs the insulating work b' and can also form a metal electric ore layer on the other side which is in contact with the diaphragm member 410 and the other side of the 舆 PCB 414, and then utilizes Through holes or holes are used to connect the top and bottom metal money layers so that the metal plating layers are electrically connected to provide a conductive function. [Fifth Embodiment] An eighth diagram is an exploded perspective view of a fifth embodiment of a condenser microphone according to the present invention. Referring to the eighth figure, the condenser microphone 5 of the present invention comprises: a casing 12, 1255473
具有開口表面和封閉底面並且形成為方盒形狀，·金 甘入到方盒形外殼502中，並且具有方形外 =面^膜片的方形内圓周表面；背板504，它形成為方 亚且/、有從中穿過的音孔5G4a;塾片5G6，它呈有方 形内_面；環形遮罩環5G8,用來隔離 ,、 1〇’膜片構件510,它可以插入到遮罩環5〇8中， =且具有方形外周表面和其膜片的方形内圓周表面·整體 土底512 ’它具有用於在膜片構件51 ◦和ρ(：Β5ΐ4之間形^ 電連接的導電層512b，並且該導電層形成在具有開口頂部 =底部的方盒形絕緣體512a的内表面中；以及形成為方板 、CB514匕具有女裝在其—個表面上的部件⑽，紅cC) 和形成在其另一個表面上的伸出端子516,並且具有形成在 該PCB中央部分中用於傳送聲音的音孔514a。 這晨，膜片構件510包括用於與導電層㈣電連接的 極環51〇a和通過聲壓振動的膜片_。背板5〇4包括用來 將形成有駐極體的有機薄贿接在其上的金屬板。整體基 底512具有這樣一種結構，從而採肖pcB技術將中空圓柱 $、、巴、’彖體512a用作PCB，然後在該中空圓柱形絕緣體512& 的兩側和内關表面巾形成外徑小於其周邊外徑的金屬板 的導電層512b。 同樣’根據本發_整體基底512如此構成，從而執 行常規的絕緣功能的第—基底和執行導電功能的第二基底 可以由-個整體基底構成。金屬板的外徑應該小於絕緣體 的外從’從而不會與外殼接觸。這裏，絕緣體優選地可以 13 、丄255473 由破螭環氧樹月 路板構成。 旨基底、樹脂基底或基於 PVC的絕緣印刷電 m有具義^，絕緣體512a執行絕緣功能，並 乂通過在其與膜片構件51G接觸的一個側面上以及 :、、CB514接觸的另1面上形成金屬電鑛層，然後利用 孔來連接頂部和底部金屬電鍍層從而使金屬電鍍層 可以被電連接來提供導電功能。 [弟六貫施方案] 弟九®為根據本發μ電容式傳聲施 的分解立體圖。 “、、第九圖’本發明的電容式傳聲器600包括：外殼 它具有開σ表面和封閉底面並且形成為方^形狀；金 屬環議’它可插入到方盒形外殼_中並且具有方形外周 表面和_内圓周表面；f板刪，它形成為盤狀並且具有 從中穿過的音孔6〇4a;塾片606，它具有方形外周表面和 圓幵V内圓周表面’圓形遮罩環隱’絲隔離膜片構件㈣ 丑且具有方形外周表面和圓形内圓周表面；膜片構件㈣， _中’並且具有方形外周表面和其膜片 的οι内ia周表面，整體基底612’它具有用於在膜片構件 〇 # PCB614之間形成電連接的導電層6i2b，並且該導電 層形成在具有開U頂部和底料及方料周表面和圓形内 圓周表面的絕緣體612a的内表面中；以及形成為方板狀的 B614 b具有女裝在其—個表面上的部件⑽，慰c)和形 成在其另-個表面上的伸出端子616，並且具有形成在該 14 1255473 • pCB中央部分中的音孔614a。 這裏，膜片構件61〇包括用於與導電層612b電 ^ 610b〇tfe 604 將形成有駐極體的有機薄膜炫接在其上的金屬板。整體基 底612具有這樣一種結構’從而採訂CB技術將中空圓二 形絕緣禮6123用作PCB，然後在該中空圓柱形絕緣^ 612a 的雨侧和内圓周表面中形成外徑小於其周邊外捏的金屬板 ㈣電層6l2b。 φ 同樣，根據，發_整體基底612如此構成，從而執 行常規的絕緣功能的第一基底和執行導電功能的第二基底 -可·以由一個整體基底構成。金屬板的外徑應該小於絕緣體 的外徑，從而不會與外殼接觸。這裏，絕緣體優選地由玻 璃環氧樹脂基底、樹脂基底或基於PVC的絕緣印刷電路板 構成。 雖然沒有具體顯示出，絕緣體612a執行絕緣功能，並 且還可以通過在其與膜片構件61〇接觸的—個侧面上以及 =與PCB614接觸的另—側面上形成金屬電鑛層，然後利用An open inner surface and a closed bottom surface are formed in a square box shape, and the gold is inserted into the square box-shaped outer casing 502, and has a square outer circumferential surface of the square outer surface; the back plate 504 is formed as a square and /, there is a sound hole 5G4a passing through; a cymbal 5G6, which has a square inner surface; a ring mask ring 5G8 for isolating, 1 〇 'membrane member 510, which can be inserted into the mask ring 5 〇8, = and has a square outer circumferential surface and a square inner circumferential surface of its diaphragm. The integral soil 512' has a conductive layer 512b for electrically connecting between the diaphragm members 51 and ρ(: Β5ΐ4 And the conductive layer is formed in the inner surface of the square box-shaped insulator 512a having the open top=bottom; and formed as a square plate, CB514匕 having a component (10) on the surface thereof, red cC) and formed in The other terminal protrudes from the terminal 516 and has a sound hole 514a formed in the central portion of the PCB for transmitting sound. This morning, the diaphragm member 510 includes a pole ring 51A for electrically connecting to the conductive layer (4) and a diaphragm_ for vibration by sound pressure. The backing plate 5〇4 includes a metal plate for attaching an organic thin bribe formed with an electret thereto. The unitary substrate 512 has such a structure that the hollow cylinders $, , bar, and the body 512a are used as PCBs, and then the outer diameters of the two sides of the hollow cylindrical insulators 512 & A conductive layer 512b of a metal plate having a peripheral outer diameter. Similarly, the first substrate constituting the whole substrate 512 according to the present invention, thereby performing the conventional insulating function, and the second substrate performing the conductive function may be constituted by a single substrate. The outer diameter of the metal plate should be smaller than the outer diameter of the insulator so as not to come into contact with the outer casing. Here, the insulator may preferably be composed of a ruthenium epoxy tree moon plate. The substrate, the resin substrate or the PVC-based insulating printed electric m has an insulating function, and the insulating body 512a performs an insulating function and passes through one side of the side in contact with the diaphragm member 51G and the other side of the CB 514. A metal electric ore layer is formed and then the holes are used to join the top and bottom metal plating layers so that the metal plating layers can be electrically connected to provide a conductive function. [Different scheme] The younger version is an exploded perspective view of the μ-capacitance sound transmission according to the present invention. ", ninth diagram" The condenser microphone 600 of the present invention comprises: a casing having an open σ surface and a closed bottom surface and formed into a square shape; the metal ring can be inserted into the square box casing _ and has a square outer circumference a surface and an inner circumferential surface; a plate cut, which is formed in a disk shape and has a sound hole 6〇4a passing therethrough; a buckle plate 606 having a square outer peripheral surface and a circular V inner circumferential surface 'circular mask ring The hidden 'silk isolating diaphragm member (4) is ugly and has a square outer peripheral surface and a circular inner circumferential surface; the diaphragm member (four), _ middle' and has a square outer peripheral surface and a οι inner ia circumferential surface of the diaphragm thereof, the integral base 612' There is a conductive layer 6i2b for forming an electrical connection between the diaphragm members PCB# PCB614, and the conductive layer is formed in the inner surface of the insulator 612a having the U top and the primer and the peripheral surface and the circular inner circumferential surface. And the B614b formed into a square plate shape has a component (10) on the surface thereof, and a protruding terminal 616 formed on the other surface thereof, and has a formation at the 14 1255473 • pCB In the central part The sound hole 614a. Here, the diaphragm member 61 includes a metal plate for splicing the organic film on which the electret is formed with the conductive layer 612b. The integral substrate 612 has such a structure' Thus, the CB technique is used to use the hollow circular insulating mask 6123 as a PCB, and then a metal plate (four) electric layer 612b having an outer diameter smaller than that of the outer periphery thereof is formed in the rain side and the inner circumferential surface of the hollow cylindrical insulating member 612a. φ Also, according to the hair-integrated substrate 612, the first substrate performing the conventional insulating function and the second substrate performing the conductive function may be constituted by one integral substrate. The outer diameter of the metal plate should be smaller than that of the insulator. The outer diameter is thus not in contact with the outer casing. Here, the insulator is preferably composed of a glass epoxy substrate, a resin substrate or a PVC-based insulated printed circuit board. Although not specifically shown, the insulator 612a performs an insulating function and can also pass Forming a metal electric ore layer on one side of the contact with the diaphragm member 61 and on the other side of the contact with the PCB 614, and then utilizing
Git來連接頂部和底部金屬電制，從而使金屬電鑛 破電連接來提供導電功能。 弟四至第六實施方案的操作] 作。下面將進行第四至第六實施方案的電容式傳聲器的操 視圖=圖為本發明的第四至第六實施方案的組件的側刹 木用第四實施方案的那些附圖標記來代表性地表示 .1255473 • 這些部件的附圖標記。 參第十圖，第四至第六實施方案的電容式傳聲器400 〜600分別具有方盒形外殼402，其中順序佈置有金屬環 403、#板刪、塾片4G6、遮罩環408、膜片構件41〇、整 體基底412和形成有音孔41知的方板狀。之後，如此 、袭配構成該電容式傳聲器’從而使外殼的端部捲曲。 在PCB414的恭露表面上形成有伸出端子，並且MR的 暴露表面比幫曲表面更突出，從而在SMD方法中可以將這 •些電容式傳聲器400〜600安裝在主pcB (例如，可搗式電 話的PCB)上。這些端子416可以為用於Vdd連接的二‘二 接地端子以及根據附加功能所需的端子。 另外，第四至第六實施方案的方形部件根據這些部件 的製造和裝配的方便性，可以具有相互接觸的形成為圓形 的邊緣。女衣在PCB中的ic包括結型場效應電晶體 (JFET)、放大器、定制的類比—數位（A/D)轉換器或放大哭 鲁以及類比-數位（A/D)轉換器（ASIC)。 如下將進行第四至第六實施方案的電容式傳聲器的操 作。 $ ’ 將根據本發明的電容式傳聲器300的伸出端子416連 ， 接在主PCB的連接端子上。向這些伸出端子施加Vdd和gND 能量。因此，在根據本發明的電容式傳聲器4〇〇〜6〇〇中， 背板404通過外殼402和金屬環403與PCB414電連接，並 且膜片構件410通過整體基底412的導電層412b與PCB4〇 電連接。 16 1255473 : 在這種情況下，來自外部聲源的聲音穿過PCB的音孔 i 414a流入該傳聲器的内部並且傳遞給膜片410b。後面腔室 的聲音通過背板404的音孔404a傳送給膜片410b。因此， 膜片410b可以在聲壓的作用下振動。然後，可以改變在膜 片41 Ob和背板404之間的間隙。由膜片410b和背板404 所產生的靜電電容改變，因此可以實現電信號（電壓）根據 聲波的變化。該信號沿著上面的電連接路徑傳送給安裝在 PCB414中的1C，從而被放大然後通過伸出端子416輸出給 籲外部電路。 工業實用性 如上所述，根據本發明的電容式傳聲器，因為在表面 安裝裝置（SMD)的過程期間可以確認部件的方向，所以可以 容易地相互調節部件的連接端子。因此，這可以防止主PCB 的連接端子和電容式傳聲器的連接端子的連接表面偏離， 並且還降低了由於連接端子的連接或方向（極性）變化而導 ^致的連接故障。另外，本發明的電容式傳聲器其優點在於， 可以通過在PCB的表面上而不是在外殼的表面上形成音孔 而容易地進行安裝。 本發明顯係利用自然法則之技術思想之發明，亦有實 質功效增進與產業上的高度利用性，完全合於發明專利之 法定要件，爰依法提出發明專利申請。 【圖式簡單說明】 1255473 ‘第一圖為傳統的一般電容式傳聲器的示意圖； :第二圖為根據本發明的平行六面體型電容式傳聲器的立體 圖， 第三圖為根據本發明的電容式傳聲器的第一實施方案的分 解立體圖； 第四圖為根據本發明的電容式傳聲器的第二實施方案的分 解立體圖； 第五圖為根據本發明的電容式傳聲器的第三實施方案的分 籲解立體圖； 第六圖為本發明的第一、第二和第三實施方案的元件的侧 剖視圖； 第七圖為根據本發明的電容式傳聲器的第四實施方案的分 解立體圖； 第八圖為根據本發明的電容式傳聲器的第五實施方案的分 解立體圖； 第九圖為根據本發明的電容式傳聲器的第六實施方案的分 ®解立體圖；以及 第十圖為本發明的第四、第五和第六實施方案的侧剖視圖。 【主要元件符號說明】 電容式傳聲器··· • 100 外％5C · · · · • · · · 102 金屬環...... • 103 背板· · · · • · · · 104 音孔....... 104a 薄墊片· · · • · · · 106 圓柱形絕緣環· · · • 108 膜片構件·· • · · · 110 18 1255473 環形導電環.....112 : 伸出端子......116 極環.......110a 電容式傳聲器· · · · 200 金屬環.......203 音孔.......204a 方盒形絕緣環· · · · 2 0 8 導電環.......212 •伸出端子......216 極環.......210a 電容式傳聲器· · · · 300 金屬環.......303 音孔.......304a 絕緣環.......308 導電環.......312 伸出端子......316 極環.......310a 電容式傳聲器· · · ·400 金屬環.......403 音孔.......404a 環形遮罩環.....408 整體基底......412 導電層......412b 伸出端子......416 印刷電路板（PCB) · · 114 音孔..... • · · 114a 膜片..... • · · 110b 外殼..... • · · 202 背板..... • · · 204 墊片..... • · · 206 膜片構件··· • · · 210 PCB..... • · · 214 音孑L..... • · · 214a 膜片..... • · · 210b 外殼..... • · · 302 %板..... • · · 304 墊片..... • · · 306 膜片構件··· • · · 310 PCB..... • · · 314 音孔..... • · · 314a 膜片..... • · · 310b 外殼..... • · · 402 背板..... • · · 404 薄墊片· · · · • · · 406 膜片構件··· • · · 410 PCB..... • · · 414 絕緣體· · · · • · · 412a 曰孑L..... • · · 414a 19 1255473 Λ 極環.......410a ^ 電容式傳聲器· · · · 500 金屬環.......503 音孑L....... 504a 環形遮罩環.....508 整體基底......512 導電層......512b 伸出端子......516 Φ極環.......510a 電容式傳聲器· · · · 600 金屬環.......603 音孔.......604a 圓形遮罩環.....608 整體基底......612 導電層......612b 伸出端子......616 極環.......610a 膜片........410b 外殼........502 背板........504 墊片........506 膜片構件......510 PCB........514 絕緣體.......512a 音孔........514a 膜片........510b 外殼........602 背板........604 墊片........606 膜片構件......610 PCB........614 絕緣體.......612a 音孔........614a 膜片........610b 20Git is used to connect the top and bottom metal to make the metal ore electrically connected to provide electrical conductivity. The operation of the fourth to sixth embodiments]. The operation of the condenser microphone of the fourth to sixth embodiments will be described below. The side brakes of the assembly of the fourth to sixth embodiments of the present invention are representatively represented by those of the fourth embodiment. Represents .1255473 • Reference numerals for these parts. Referring to the tenth diagram, the condenser microphones 400 to 600 of the fourth to sixth embodiments each have a square box-shaped outer casing 402 in which a metal ring 403, a plate cut, a cymbal 4G6, a mask ring 408, and a diaphragm are sequentially disposed. The member 41A, the entire base 412, and a square plate shape in which the sound hole 41 is formed. Thereafter, the capacitive microphone is constructed to cause the end of the outer casing to curl. An extension terminal is formed on the courtesy surface of the PCB 414, and the exposed surface of the MR is more protruded than the flex surface, so that the condenser microphones 400 to 600 can be mounted on the main pcB in the SMD method (for example, On the phone's PCB). These terminals 416 can be two 'two ground terminals for Vdd connections and terminals required for additional functionality. Further, the square members of the fourth to sixth embodiments may have edges which are formed in a circular shape in contact with each other in accordance with the convenience of manufacture and assembly of these members. The ics of women's clothing in PCBs include junction field effect transistors (JFETs), amplifiers, custom analog-to-digital (A/D) converters or amplified crying and analog-to-digital (A/D) converters (ASICs). . The operation of the condenser microphone of the fourth to sixth embodiments will be performed as follows. The extension terminal 416 of the condenser microphone 300 according to the present invention is connected to the connection terminal of the main PCB. Vdd and gND energy are applied to these protruding terminals. Therefore, in the condenser microphones 4A to 6A according to the present invention, the back plate 404 is electrically connected to the PCB 414 through the outer casing 402 and the metal ring 403, and the diaphragm member 410 passes through the conductive layer 412b of the integral substrate 412 and the PCB 4. Electrical connection. 16 1255473: In this case, sound from an external sound source flows through the sound hole i 414a of the PCB into the inside of the microphone and is transmitted to the diaphragm 410b. The sound of the rear chamber is transmitted to the diaphragm 410b through the sound hole 404a of the back plate 404. Therefore, the diaphragm 410b can vibrate under the action of the sound pressure. Then, the gap between the diaphragm 41 Ob and the back plate 404 can be changed. The electrostatic capacitance generated by the diaphragm 410b and the backing plate 404 is changed, so that the electrical signal (voltage) can be changed in accordance with the acoustic wave. This signal is transmitted along the upper electrical connection path to 1C mounted in the PCB 414, thereby being amplified and then outputted to the external circuit through the extension terminal 416. Industrial Applicability As described above, according to the condenser microphone of the present invention, since the direction of the components can be confirmed during the process of the surface mounting device (SMD), the connection terminals of the components can be easily adjusted to each other. Therefore, this can prevent the connection surface of the connection terminal of the main PCB and the connection terminal of the condenser microphone from deviating, and also reduce the connection failure due to the connection or the direction (polarity) of the connection terminal. Further, the condenser microphone of the present invention is advantageous in that it can be easily mounted by forming a sound hole on the surface of the PCB instead of the surface of the casing. The invention obviously utilizes the invention of the technical idea of the natural law, and also has the improvement of the actual effect and the high utilization of the industry, fully conforms to the statutory requirements of the invention patent, and submits the invention patent application according to law. BRIEF DESCRIPTION OF THE DRAWINGS 1255473 'The first figure is a schematic diagram of a conventional general condenser microphone; the second figure is a perspective view of a parallelepiped type condenser microphone according to the present invention, and the third figure is a capacitance type according to the present invention. An exploded perspective view of a first embodiment of a microphone; a fourth perspective view of a second embodiment of a condenser microphone according to the present invention; and a fifth diagram of a third embodiment of a condenser microphone according to the present invention 6 is a side cross-sectional view of an element of the first, second, and third embodiments of the present invention; and a seventh perspective view is an exploded perspective view of a fourth embodiment of the condenser microphone according to the present invention; An exploded perspective view of a fifth embodiment of the condenser microphone of the present invention; a ninth diagram is a perspective view of a sixth embodiment of the condenser microphone according to the present invention; and a tenth diagram is the fourth and fifth aspects of the present invention And a side cross-sectional view of the sixth embodiment. [Main component symbol description] Capacitive microphone ··· • 100 Outside %5C · · · · • · · · 102 Metal ring... • 103 Backplane · · · · • · · · 104 sound holes. ...... 104a shims · · · · · · · 106 cylindrical insulating ring · · · · 108 diaphragm components ·· · · · · 110 18 1255473 ring conductive ring ..... 112 : extension Out terminal...116 pole ring.......110a condenser microphone · · · · 200 metal ring ....203 sound hole....204a square box Insulation ring · · · · 2 0 8 Conductive ring ....212 • Extension terminal ... 216 pole ring .... 210a condenser microphone · · · · 300 metal ring .......303 sound hole.......304a Insulation ring.......308 Conductive ring.......312 Extension terminal......316 pole ring .......310a Capacitive microphone · · · · 400 metal ring .... 403 sound hole .... 404a ring mask ring ..... 408 overall base.. ....412 Conductive layer...412b Extension terminal...416 Printed circuit board (PCB) · · 114 sound hole..... • · · 114a diaphragm.... • • · 110b Enclosure..... • · · 202 Backplane..... • · · 204 Gaskets..... • · · 206 Diaphragm Components··· • · · 210 PCB..... • · · 214 孑 L..... • · · 214a Diaphragm..... • · · 210b Enclosure.. ... • · · 302 % plate..... • · · 304 spacers..... • · · 306 Diaphragm components ··· • · · 310 PCB..... • · · 314 Hole..... • · · 314a Diaphragm..... • · · 310b Enclosure..... • · · 402 Backplane..... • · · 404 Spare · · · · • · · 406 Diaphragm Parts··· • · · 410 PCB..... • · · 414 Insulator · · · · · · · 412a 曰孑L..... • · · 414a 19 1255473 Λ Polar ring. ...410a ^ Capacitive microphone · · · · 500 metal ring .... 503 sound 孑 L....... 504a ring mask ring ..... 508 overall base. .....512 Conductive layer...512b Extension terminal......516 Φ pole ring.......510a Capacitive microphone · · · · 600 metal ring.... ...603 sound hole.......604a circular mask ring....608 integral base...612 conductive layer...612b extended terminal.... ..616 pole ring.......610a diaphragm........410b shell........502 backplane........504 gasket... ..... 506 Diaphragm member...510 PCB........514 Insulator.......512a Sound hole........514a Diaphragm....... .510b Enclosure........602 Backplane........604 Shims........606 Diaphragm Components...610 PCB..... ...614 Insulator.......612a Sound hole........614a Diaphragm........610b 20