1253889 A7 B7 五、發明説明（1) 發明所屬之技術領域 本發明是關於一種印刷配線基板之製造方法。 先前技術 如在建立法欲製造多層配線板，爲了配線的高密度化 必須將下層基板之表面成爲平坦化。然而，印刷基板的電 路圖案一般藉由依鈾刻除去銅箔之不要部分的消除法所製 造之故，因而電路圖案部分會形成從基材表面隆起的凹凸 狀。 如此，爲了平坦化這種表面凹凸狀地形狀的印刷基板 ’習知就提案一種如將熱硬化性樹脂塡補在電路圖案間並 加熱硬化，然後平面硏磨樹脂表面的方法。 然而，作爲如上述地將樹脂塡補在電路圖案間的方法 ，有如藉由絲網印刷來塗布樹脂，或將半硬化狀態的樹脂 片予以疊層的方法。但是，在藉由絲網印刷來塗布樹脂時 ，在印刷之際無法避免空氣被捲入樹脂內，使得被捲入的 空氣成爲氣泡而在樹脂層有生成空隙的問題。又，在將樹 脂片予以疊層之情形，則進入樹脂片與基板之間的空氣成 爲氣泡，而同樣地在樹脂層有生成空隙的問題。此些空隙 是在後續過程的加熱階段破裂，或是有劣化基板的電氣式 特性之虞，較不理想。 作爲除去成爲空隙原因的樹脂中的氣泡的方法，近年 來提案一種在減壓環境空氣中沖壓樹脂層的技術。樹脂中 的氣泡是利用在減壓環境氣氛中被沖壓，移動至樹脂層表 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） I ：--------裝-- (請先閲讀背面之注意事項再填寫本頁) 訂 續. 經濟部智慧財產局員工消費合作社印製 -5- 經濟部智慧財產局員工消費合作社印製 1253889 A7 B7 五、發明説明（2) 面後不久被放出至外部，惟這時候，樹脂的粘度愈低則氣 泡是愈容易移動在樹脂中，而有效地被除去。但是在另一 方面，若降低樹脂的粘度，則在沖壓樹脂層之際，有樹脂 會從電路圖案間流出的問題。 本發明是鑑於上述事項而創作者，其目的是在於提供 一種可充分地除去樹脂中的氣泡，且整體上可得到良好的 樹脂硬化狀態的印刷配線基板之製造方法。 發明內容 爲了解決上述課題而創作的本發明，屬於在電路圖案 所形成的印刷配線基板上能塡補圖案間地形成熱硬化性的 樹脂層，而在減壓該樹脂層的減壓室內一面推壓平滑板一 面進行加熱硬化之後，將覆蓋上述電路圖案且硬化的上述 樹脂藉由硏磨而露出上述電路圖案的印刷配線基板之製造 方法，其特徵爲：在上述減壓室內加熱硬化上述樹脂層的 過程中依序地實行以下過程，在上述減壓室內經由上述平 滑板而加壓上述樹脂層之狀態下，保持該樹脂層在不會硬 化的非硬化溫度的過程（過程1 )，及在上述加壓狀態下加 熱上述樹脂層成爲上述樹脂層硬化的硬化溫度的過程（過 程2)，及在保持上述加壓狀態下及上述硬化溫度的狀態下 外氣流進上述減壓室內的過程（過程3 )，及在保持上述硬 化溫度的狀態下減少對於上述平滑板的加壓的過程（過程4 )，及冷卻上述樹脂層的過程（過程5 )。 在本發明的過程1中，階段地上昇加壓力也可以。又 本紙張尺度適用中國國家標準（CNS ) A4規格（210X29*7公釐） (請先閲讀背面之注意事項再填寫本頁)1253889 A7 B7 V. Technical Description OF THE INVENTION (1) Field of the Invention The present invention relates to a method of manufacturing a printed wiring board. Prior Art In order to manufacture a multilayer wiring board in order to increase the density of wiring, the surface of the lower substrate must be flattened. However, the circuit pattern of the printed circuit board is generally made by the elimination method of removing the unnecessary portion of the copper foil by uranium, and thus the circuit pattern portion is formed into a concave-convex shape which is raised from the surface of the substrate. As described above, in order to planarize such a printed circuit board having a concave-convex shape, it is known to provide a method of planarly honing a resin surface by filling a thermosetting resin between circuit patterns and heat-hardening. However, as a method of filling the resin between the circuit patterns as described above, there is a method of coating a resin by screen printing or laminating a resin sheet in a semi-hardened state. However, when the resin is applied by screen printing, air cannot be prevented from being caught in the resin during printing, and the entrapped air becomes a bubble and a void is formed in the resin layer. Further, when the resin sheets are laminated, the air entering between the resin sheet and the substrate becomes air bubbles, and similarly, there is a problem that voids are formed in the resin layer. These voids are ruptured during the heating phase of the subsequent process, or are degraded by the electrical characteristics of the substrate, which is less desirable. As a method of removing bubbles in a resin which is a cause of voids, a technique of punching a resin layer in a reduced-pressure ambient air has been proposed in recent years. The bubbles in the resin are stamped in a decompressed atmosphere, and moved to the resin layer. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) I :--------Installation-- (Please read the notes on the back and fill out this page.) Renewal. Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed - 5 - Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed 1253889 A7 B7 V. Invention Description (2) It was released to the outside shortly after, but at this time, the lower the viscosity of the resin, the easier the bubble was moved in the resin and effectively removed. On the other hand, if the viscosity of the resin is lowered, there is a problem that the resin flows out of the circuit pattern when the resin layer is punched. The present invention has been made in view of the above-mentioned circumstances, and an object of the invention is to provide a method for producing a printed wiring board which can sufficiently remove bubbles in a resin and obtain a good resin cured state as a whole. DISCLOSURE OF THE INVENTION The present invention has been made in order to solve the above problems, and it is preferable to form a thermosetting resin layer between the patterns on the printed wiring board formed by the circuit pattern, and to push down the decompression chamber of the resin layer. A method for producing a printed wiring board in which the resin pattern is formed by honing and exposing the circuit pattern by heat-hardening the pressure-smoothing sheet, and the resin layer is heated and cured in the decompression chamber. In the process of sequentially performing the process of pressing the resin layer through the smoothing plate in the decompression chamber, maintaining the non-hardening temperature of the resin layer (process 1), and a process of heating the resin layer in a pressurized state to a curing temperature of the resin layer (process 2), and a process of external airflow into the decompression chamber while maintaining the pressurized state and the hardening temperature (process) 3), and a process of reducing the pressurization of the smoothing plate in a state in which the hardening temperature is maintained (process 4), During the cooling of the resin layer (process 5). In the process 1 of the present invention, it is also possible to step up and apply pressure. Also, the paper size applies to the Chinese National Standard (CNS) A4 specification (210X29*7 mm) (please read the notes on the back and fill out this page)
-6- 1253889 A7 B7 五、發明説明（3) (請先閲讀背面之注意事項再填寫本頁) ，樹脂層是將液狀樹脂塡補圖案間而附著於印刷配線基板 上，或是將半硬化狀態的樹脂片重疊於印刷配線基板，或 在其上面重疊相對向於樹脂層之面被粗面化的金屬箔也可 以。這時候，金屬箔是藉由與電路圖案異種的金屬可形成 〇 經濟部智慧財產局員工消費合作社印製 依照本發明，在減壓基板上的樹脂層的減壓室內一面 推壓平滑板一面進行加熱硬化的過程中，首先，在減壓室 經由平滑板加壓樹脂之狀態下，保持該樹脂層在不會硬化 的非硬化溫度（過程1 )。作爲此時的非硬化溫度，爲樹脂 的粘度過度降低而不會有樹脂從電路圖案間流出程度的溫 度較理想，例如在環氧系樹脂以1〇〇至14(TC左右較理想。 又，作爲保持在非硬化溫度的時間，爲樹脂層之溫度實質 上不會使表面附近的溫度與內部溫度之溫度差成爲問題的 時間較理想。在配線基板上塡補圖案間地形成熱硬化性樹 脂層時，即使該樹脂層在電路圖案的形成部分鼓出，在過 程1使得樹脂層軟化而經由平滑板被加壓而被壓壞，使整 體樹脂層變薄並擴大至平滑板與基板之間隙。又，即使在 樹脂層內含有氣泡，對於樹脂層的加壓是在被減壓的減壓 室內進行之故，因而樹脂中之氣泡也被除去。又此時，樹 脂是適當地被軟化之故，因而氣泡是可容易地移動樹脂中 〇 如此地，樹脂層被平坦化’而樹脂中的氣泡被充分地 除去，之後，在仍保持加壓狀態下加熱樹脂層成爲樹脂層 硬化的硬化溫度（過程2)。由此’樹脂層是仍在未含有氣 本纸張尺度適用中國國家標準（CNS ) A4規格（21〇><297公釐） \~ 1253889 A7 ______B7_ 五、發明説明（4) (請先閲讀背面之注意事項再填寫本頁) 泡的狀態下被硬化。又，即使在樹脂發生利用硬化的收縮 的情形，樹脂是在藉由平滑板被沖壓的狀態之故，因而也 可平坦地保持樹脂層表面。 然後，在保持加壓狀態下及硬化溫度的狀態下，將外 氣流進上述減壓室內（過程3)。如此，樹脂層的表面是藉 由所流進的外氣被冷卻之故，因而樹脂層表面的硬度變高 ，可抑制樹脂的過剩流出。 之後，在保持樹脂的硬化溫度的狀態下，減少對於平 滑板的加壓力（過程4)。由此，可更防止樹脂的過剩流出 〇 然後，中止加熱而冷卻樹脂層（過程5 )。 利用依序地實行以上過程，在電路圖案上僅留下極薄 樹脂層，而可得到電路圖案間以幾乎未含有氣泡的樹脂層 所塡補的平坦基板。之後，以不會傷及電路圖案的強度進 行硏磨，則電路圖案上的極薄樹脂層是容易地被硏磨，而 可得到露出電路圖案的平滑基板。 經濟部智慧財產局員工消費合作社印製 又，在將平滑板推向基板上的樹脂層之際，將相對向 於樹脂層之面被粗面化的金屬箔介於平滑板與樹脂層之間 ，則樹脂層是更容易變薄而擴大，而且，該樹脂層之表面 是倣照金屬箔的粗面化表面而成爲微細的凹凸狀。結果， 可更容易地進行殘留樹脂層的硏磨。 又，在介於平滑板與樹脂層之間的金屬箔，由與電路 圖案異種的金屬所形成之情形，則藉由僅熔解金屬箔而不 會影響到電路圖案的金屬的選擇性蝕刻就可除去金屬箔。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -8- 1253889 A7 B7_ 五、發明説明（5) 實施方式 (請先閲讀背面之注意事項再填寫本頁) 如第1圖所示地，在本實施形態中，作爲基材，使用 在如厚度1 〇 〇至2 0 0 // m的玻璃環氧基板1 1的雙面貼上銅 箔1 2所形成的貼銅之疊層板1 0。在該貼銅之疊層板1 0的 所需部位，使用周知之鑽等開孔加工貫通孔1 3 (參照第2 圖），進行化學鍍及電解鍍，在也包含貫通孔1 3的內周面 的全區域形成鍍銅層1 4，將基板表面的導體層厚度作爲大 約20 // m (參照第3圖）。之後將樹脂充塡在貫通孔1 3內 並使之硬化，硏磨溢出於基板表面的樹脂使之平坦化。之 後，在該平滑基板上利用周知的光蝕刻法形成電路圖案1 5 (參照第4圖）。 經濟部智慧財產局員工消費合作社印製 然後，如第5圖所示地，在配線基板利用如絲網印刷 等附著厚度成爲大約30至80 // m的液狀熱硬化性環氧樹脂 ，而藉由樹脂層1 6完全地塡補電路圖案1 5。之後，以1 40 °C加熱，將樹脂層1 6成爲半硬化狀態。這時候，在樹脂層 1 6中有含有微小氣泡的情形。又，樹脂層1 6表面是成爲電 路圖案1 5部分鼓出的平緩起伏狀態。之後，如第6圖所示 地，將一面藉由針狀鍍被粗面化的厚度1 8 // m的鎳箔1 7， 承載於樹脂層1 6上成爲粗面與樹脂層相對向之狀態。 如上述地，準備1 3組將樹脂層1 6及鎳箔1 7重疊於配 線基板上的疊層體，介裝作爲脫模薄膜的特氟隆片1 8互相 重疊各疊層體。又從其外側介裝特氟隆片1 8重疊厚約1 mm 的平滑不銹鋼板1 9。又，在第6圖表示以不銹鋼板1 9夾住 本紙張尺度適用中國國家標準（CNS ) A4規格（21〇X：297公釐） " -9 - 1253889 A7 B7 五、發明説明（6) 一組疊層體的槪略圖。對於該疊層體依序實行以下的過程 (參照第7圖）。 首先，在被減壓的減壓室（未圖示）內，對於樹脂層 16以140 °C進行加熱30分鐘，而階段地上昇對於不銹鋼板 19的加壓力，最後成爲30 kg /cm2的加壓力（過程1)。 這樣，處於平緩起伏狀態的樹脂層1 6表面，是被平坦化成 爲推向平滑的不銹鋼板1 9而壓壞狀之同時，整體樹脂層1 6 會薄薄地擴展在基板上。又，樹脂層1 6中的氣泡是浮在樹 脂層1 6之表面附近而從樹脂內部被除去。 然後，在仍保持對於不銹鋼板1 9的加壓力的狀態下， 對於樹脂層16以180 °C進行加熱，將樹脂層16進行主硬化 (過程2)。由此，樹脂層1 6是仍未含有氣泡的狀態下被 硬化。又，樹脂層16達到18 0 °c，開始主硬化之後，仍保 持上述加壓狀態及溫度下將外氣流進減壓室內（過程3 )。 藉由流進該外氣，樹脂層1 6所露出的表面溫度會降低，而 硬度會上昇，可抑制樹脂從電路圖案過剩地流出。 然後，在整體樹脂層1 6幾乎硬化時，減少對於不銹鋼 板19的加壓力（過程4)。由此，防止樹脂層被多餘地壓 壞，又可防止樹脂流出的情形。之後，充分地硬化樹脂層 1 6之後，冷卻整體樹脂層1 6 (過程5 )。 然後，藉由鎳專用的鈾刻液除去附著於樹脂層1 6表面 鎳箔17 (參照第8圖及第9圖）。如此，銅的電路圖案1 5 上的殘留樹脂層是成爲5 // m以下之同時，其表面是成爲被 粗化的狀態。最後，藉由陶瓷拋光輥除掉電路圖案1 5上的 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁) 裝- 訂 經濟部智慧財產局員工消費合作社印製 -10- 1253889 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（7) 樹脂層1 6的一次平滑表面硏磨，及藉由平面硏削機作成面 內平均粗度精確度作成3 // m以下的二次精修硏磨，將基板 成爲平坦化（參照第1 0圖）。在該表面硏磨之際，留在電 路圖案1 5上的樹脂層1 6是極薄至5 // m之外，其表面被粗 化之故，因而容易進行硏磨。 争 如此地，依照本實施形態的印刷配線基板之製造方法 ，在減壓室內加熱硬化樹脂層的過程中，利用依序地實行 上述過程1至過程5，可得到在樹脂內不包含氣泡，且整體 上良好的樹脂硬化狀態。 本發明是並不被限定在藉由上述記述及圖式所說明的 實施形態者，例如如下的實施形態也包含在本發明的技術 上範圍，又，除了下述以外也可在不超越要旨的範圍內可 做各種變更加以實施。 (1 )在上述形態中，利用將液狀樹脂以絲網印刷附著 於基板上而形成樹脂層的構成，惟並不被限定於此，也可 使用塗敷或簾狀塗膜法等。又，作爲疊層半硬化狀態的樹 脂片的構成也可以。這時候，也在減壓室內加熱硬化樹脂 層的過程中，與上述實施形態同樣地，利用依序地實行過 程1至過程5，可得到在樹脂內未含有氣泡且整體上良好的 樹脂硬化狀態。 (2)在上述實施形態中，藉由消除法形成電路圖案， 惟藉由附加法形成的構成也可以。 (3 )在上述實施形態中，作爲樹脂層的材料使用熱硬 化性環氧樹脂，惟並不被限定於此，使用尿素樹脂，密胺 (請先閲讀背面之注意事項再填寫本頁) -裝· 訂 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公着） -11 - 1253889 A7 p—____ B7 五、發明説明（8) 甲醛樹脂，酚醛樹脂，丙烯樹脂，不飽和聚酯樹脂等的熱 硬化性樹脂也可以。 (請先閲讀背面之注意事項再填寫本頁) (4 )在上述貫施形態，作爲金屬范材料使用鎳，惟並 不被限定於此，使用銅等的其他金屬也可以。 (產業上的利用可能性） 如上所述地，依照本發明，可製造可充分地除去樹脂 中的氣泡，且可得到整體上良好的樹脂硬化狀態的印刷配 線基板。 圖式簡單說明 第1圖是表示貼銅之疊層板的剖視圖。 第2圖是表示貼銅之疊層板形成貫通孔的配線基板的 剖視圖。 第3圖是表示貼銅之疊層板形成鍍層的配線基板的剖 視圖。 經濟部智慧財產局員工消費合作社印製 第4圖是表示貼銅之疊層板形成電路基板的配線基板 的剖視圖。 第5圖是表示形成本發明的第1實施形態的樹脂層的 配線基板的剖視圖。 第6圖是表示第1實施形態的減壓沖壓時的佈置的配 線基板的剖視圖。 第7圖是表示第1實施形態的硬化樹脂之際的溫度-壓 力-真空度的關係的圖表。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -12- 1253889 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明（9) 第8圖是表示第1實施形態樹脂硬化後的配線基板的 剖視圖。 第9圖是表示第1實施形態除去金屬箔後的配線基板 的剖視圖。 第1 〇圖是表示第1實施形態硏磨之後的配線基板的剖 視圖。 主要元件對照表 10 疊層板 11 玻璃環氧基板 12 銅箔 13 貫通孔 14 鍍銅層 15 電路圖案 16 樹脂層 17 鎳箔 18 特氟隆片 19 不銹鋼板 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁)-6- 1253889 A7 B7 V. INSTRUCTIONS (3) (Please read the precautions on the back and fill out this page). The resin layer is attached to the printed wiring board by filling the liquid resin between the patterns, or half. The resin sheet in a hardened state may be superposed on the printed wiring board, or a metal foil which is roughened with respect to the surface of the resin layer may be superposed thereon. At this time, the metal foil is formed by a metal different from the circuit pattern. The Ministry of Economic Affairs, the Intellectual Property Office, the employee consumption cooperative, printed according to the present invention, and the smoothing plate is pressed against the decompression chamber of the resin layer on the decompression substrate. In the heat hardening process, first, the resin layer is maintained at a non-hardening temperature which does not harden in a state where the resin is pressurized by a smoothing plate in a decompression chamber (Process 1). The non-hardening temperature at this time is preferably such a temperature that the viscosity of the resin is excessively lowered without causing the resin to flow out between the circuit patterns, and for example, the epoxy resin is preferably from 1 〇〇 to 14 (about TC). The time during which the temperature of the resin layer is maintained is such that the temperature of the resin layer does not substantially cause a temperature difference between the temperature in the vicinity of the surface and the internal temperature to be a problem. The thermosetting resin is formed between the complementary patterns on the wiring substrate. In the case of the layer, even if the resin layer bulges at the formation portion of the circuit pattern, the resin layer is softened in Process 1 and is pressed by the smoothing plate to be crushed, so that the entire resin layer is thinned and expanded to the gap between the smoothing plate and the substrate. Further, even if bubbles are contained in the resin layer, the pressurization of the resin layer is performed in the reduced pressure chamber, and the bubbles in the resin are also removed. At this time, the resin is appropriately softened. Therefore, the bubble is thus easily movable in the resin. Thus, the resin layer is flattened' and the bubbles in the resin are sufficiently removed, and then, while still being pressurized, The resin layer becomes the hardening temperature of the resin layer hardening (Process 2). Thus the 'resin layer is still in the air-free paper scale applicable to the Chinese National Standard (CNS) A4 specification (21〇><297 mm) ~ 1253889 A7 ______B7_ V. Inventive Note (4) (Please read the note on the back and fill in this page.) The bubble is hardened. Also, even in the case where the resin is hardened by shrinkage, the resin is smoothed. The plate is pressed, so that the surface of the resin layer can be held flat. Then, the external air is introduced into the decompression chamber while maintaining the pressurized state and the hardening temperature (process 3). Thus, the resin layer The surface is cooled by the external air flowing in, so that the hardness of the surface of the resin layer becomes high, and excessive outflow of the resin can be suppressed. Thereafter, the addition of the smoothing plate is reduced while maintaining the hardening temperature of the resin. Pressure (Process 4). Thereby, excess flow of the resin can be further prevented, and then the heating is stopped to cool the resin layer (Process 5). By sequentially performing the above process, only the circuit pattern is left An extremely thin resin layer is obtained, and a flat substrate which is complemented by a resin layer containing almost no bubbles between circuit patterns can be obtained. Thereafter, honing is performed without injuring the strength of the circuit pattern, and an extremely thin resin layer on the circuit pattern is obtained. It is easy to be honed, and a smooth substrate with a circuit pattern exposed can be obtained. The Ministry of Economic Affairs, the Intellectual Property Office, the employee consumption cooperative, prints the resin layer on the substrate while pushing the smoothing plate toward the resin layer on the substrate. When the metal foil whose surface is roughened is interposed between the smoothing plate and the resin layer, the resin layer is more easily thinned and enlarged, and the surface of the resin layer is finely patterned in accordance with the roughened surface of the metal foil. As a result, the residual resin layer can be more easily honed. Further, in the case where the metal foil interposed between the smoothing plate and the resin layer is formed of a metal different from the circuit pattern, only the melting is performed. The metal foil can be removed by selective etching of the metal foil without affecting the metal of the circuit pattern. This paper scale is applicable to China National Standard (CNS) A4 specification (210X297 mm) -8- 1253889 A7 B7_ V. Invention description (5) Implementation method (please read the note on the back and then fill in this page) As shown in Figure 1 In the present embodiment, as the substrate, a copper-clad stack formed by attaching a copper foil 1 2 to both sides of a glass epoxy substrate 1 1 having a thickness of 1 〇〇 to 200 μm is used. Laminate 10. The through hole 13 (see FIG. 2) is drilled at a desired portion of the copper-clad laminate 10 using a known drill or the like, and electroless plating and electrolytic plating are performed, and the through hole 13 is also included. A copper plating layer 14 is formed over the entire circumference, and the thickness of the conductor layer on the surface of the substrate is approximately 20 // m (refer to Fig. 3). Thereafter, the resin is filled in the through hole 13 and hardened, and the resin overflowing the surface of the substrate is honed to be flattened. Thereafter, the circuit pattern 15 is formed on the smooth substrate by a known photolithography method (see Fig. 4). Printed by the Ministry of Economic Affairs, the Intellectual Property Office, and the employee's consumer cooperative. Then, as shown in Fig. 5, a liquid thermosetting epoxy resin having a thickness of about 30 to 80 // m is attached to the wiring substrate by using, for example, screen printing. The circuit pattern 15 is completely filled by the resin layer 16. Thereafter, the resin layer 16 was semi-hardened by heating at 1 40 °C. At this time, there is a case where fine bubbles are contained in the resin layer 16. Further, the surface of the resin layer 16 is a gently undulating state in which the circuit pattern 15 is partially bulged. Thereafter, as shown in Fig. 6, a nickel foil 107 having a thickness of 1 8 // m which has been roughened by needle plating is carried on the resin layer 16 so that the rough surface and the resin layer face each other. status. As described above, 13 sets of a laminate in which the resin layer 16 and the nickel foil 17 are superposed on the wiring board are prepared, and the Teflon sheets 18 as the release film are interposed so as to overlap each of the laminates. Further, a Teflon sheet 18 is attached from the outside to form a smooth stainless steel plate 19 having a thickness of about 1 mm. In addition, in Figure 6, the paper is clamped to the standard of the paper with the stainless steel plate 19. The Chinese National Standard (CNS) A4 specification (21〇X: 297 mm) " -9 - 1253889 A7 B7 5. Inventive Note (6) A sketch of a set of laminates. The following process is carried out sequentially on the laminate (see Fig. 7). First, in the decompression chamber (not shown) to be depressurized, the resin layer 16 was heated at 140 ° C for 30 minutes, and the pressure applied to the stainless steel plate 19 was increased stepwise, and finally 30 kg / cm 2 was added. Pressure (process 1). Thus, the surface of the resin layer 16 in the gently undulating state is flattened to be pushed toward the smooth stainless steel plate 19, and the entire resin layer 16 is thinly spread on the substrate. Further, the bubbles in the resin layer 16 float in the vicinity of the surface of the resin layer 16 and are removed from the inside of the resin. Then, while the pressure applied to the stainless steel plate 19 is still maintained, the resin layer 16 is heated at 180 °C to perform main hardening of the resin layer 16 (Process 2). Thereby, the resin layer 16 is cured in a state where bubbles are not yet contained. Further, the resin layer 16 reaches 18 ° C, and after the main hardening is started, the external air current is introduced into the decompression chamber while maintaining the above-mentioned pressurized state and temperature (Process 3). By flowing the outside air, the surface temperature exposed by the resin layer 16 is lowered, and the hardness is increased, and the excessive flow of the resin from the circuit pattern can be suppressed. Then, when the entire resin layer 16 is hardened, the pressing force to the stainless steel plate 19 is reduced (Process 4). Thereby, the resin layer is prevented from being excessively crushed, and the resin is prevented from flowing out. Thereafter, after the resin layer 16 is sufficiently cured, the entire resin layer 16 is cooled (Process 5). Then, the nickel foil 17 adhering to the surface of the resin layer 16 is removed by nickel-specific uranium engraving (see Figs. 8 and 9). As described above, the residual resin layer on the copper circuit pattern 15 is 5 // m or less, and the surface thereof is roughened. Finally, the paper size on the circuit pattern is removed by the ceramic polishing roller. The size of the paper on the paper is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm). (Please read the note on the back and fill out this page.) Intellectual Property Bureau Staff Consumer Cooperative Printed -10- 1253889 A7 B7 Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed 5, Invention Description (7) A smooth surface honing of the resin layer 16 and made by a plane boring machine The in-plane average roughness accuracy is made into a secondary finishing honing of 3 // m or less, and the substrate is flattened (see Fig. 10). At the time of the surface honing, the resin layer 16 remaining on the circuit pattern 15 is extremely thin to 5 // m, and the surface thereof is roughened, so that honing is easy. In the process of manufacturing a printed wiring board according to the present embodiment, in the process of heating and curing the resin layer in the decompression chamber, the above processes 1 to 5 are sequentially performed, and it is possible to obtain no bubbles in the resin. A good resin hardening state as a whole. The present invention is not limited to the embodiments described by the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention, and may be used without departing from the gist of the present invention. Various changes can be made to implement within the scope. (1) In the above-described embodiment, the liquid resin is attached to the substrate by screen printing to form a resin layer. However, the resin layer is not limited thereto, and a coating or curtain coating method may be used. Further, the structure of the resin sheet in a semi-hardened state may be used. In the process of heating and curing the resin layer in the decompression chamber, in the same manner as in the above embodiment, by performing the processes 1 to 5 in sequence, it is possible to obtain a resin-hardened state which does not contain bubbles in the resin and which is excellent overall. . (2) In the above embodiment, the circuit pattern may be formed by the erasing method, but the configuration may be formed by an additional method. (3) In the above embodiment, a thermosetting epoxy resin is used as the material of the resin layer, but it is not limited thereto, and a urea resin or a melamine is used (please read the back of the back sheet and fill out this page) - Packing and binding paper scale applicable to China National Standard (CNS) A4 specification (210X297 public) -11 - 1253889 A7 p-____ B7 V. Invention description (8) Formaldehyde resin, phenolic resin, acrylic resin, unsaturated polyester resin A thermosetting resin such as may be used. (Please read the following precautions and fill out this page.) (4) In the above-described form, nickel is used as the metal material, but it is not limited to this, and other metals such as copper may be used. (Industrial Applicability) As described above, according to the present invention, it is possible to produce a printed wiring board which can sufficiently remove bubbles in the resin and obtain a resin cured state which is excellent overall. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a laminate of copper. Fig. 2 is a cross-sectional view showing a wiring board in which a copper-clad laminate is formed with a through hole. Fig. 3 is a cross-sectional view showing a wiring board on which a copper-clad laminate is formed into a plating layer. Printed by the Ministry of Economic Affairs, the Intellectual Property Office, and the employee's consumer cooperative. Fig. 4 is a cross-sectional view showing the wiring board on which the copper-clad laminate is formed to form a circuit board. Fig. 5 is a cross-sectional view showing a wiring board on which a resin layer according to the first embodiment of the present invention is formed. Fig. 6 is a cross-sectional view showing the wiring board in the arrangement at the time of pressure reduction pressing in the first embodiment. Fig. 7 is a graph showing the relationship between the temperature-pressure-vacuum degree of the cured resin of the first embodiment. This paper scale applies to China National Standard (CNS) A4 specification (210X297 mm) -12- 1253889 Ministry of Economic Affairs Intellectual Property Office Staff Consumer Cooperative Printed A7 B7 V. Invention Description (9) Figure 8 shows the resin of the first embodiment. A cross-sectional view of the cured wiring substrate. Fig. 9 is a cross-sectional view showing the wiring board after the metal foil is removed in the first embodiment. Fig. 1 is a cross-sectional view showing the wiring board after honing in the first embodiment. Main components comparison table 10 Laminated board 11 Glass epoxy substrate 12 Copper foil 13 Through hole 14 Copper plating layer 15 Circuit pattern 16 Resin layer 17 Nickel foil 18 Teflon sheet 19 Stainless steel sheet This paper scale applies to China National Standard (CNS) A4 size (210X297 mm) (Please read the note on the back and fill out this page)
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