CN214294085U

CN214294085U - Impression mould for manufacturing printed circuit board based on impression technology

Info

Publication number: CN214294085U
Application number: CN202022663190.9U
Authority: CN
Inventors: 周华梅; 石新红; 付海涛; 陈祝华
Original assignee: Shanghai Meadville Science and Technology Co Ltd
Current assignee: Shanghai Meadville Science and Technology Co Ltd
Priority date: 2020-11-17
Filing date: 2020-11-17
Publication date: 2021-09-28
Anticipated expiration: 2030-11-17

Abstract

The utility model provides an impression mould is used in printed wiring board preparation based on impression technique, impression mould includes: a substrate; a pattern layer to be imprinted, which is formed on at least one side of the substrate, and in which a pattern to be imprinted is prepared; presetting a metal coating formed on one surface of the pattern layer to be imprinted, which is far away from the substrate; and the anti-sticking treatment layer is formed on one surface of the preset metal coating layer, which is far away from the pattern layer to be imprinted. The utility model discloses utilize half addition technology (mSAP) of improvement type to prepare impression mould, form preset metal coating and carry out anti-sticking to handle and form anti-sticking to impression mould surface and handle the layer of handling, use the impression technique in the preparation of PCB board, through PCB technology preparation metal line, be suitable for jumbo size PCB board, can greatly improve the homogeneity of the inconsistent circuit of complicated characteristic dimension, the straightness accuracy is high, the process stability is good, can guarantee batch production, satisfy the mould easily at PCB impression in-process hardness, requirements such as tensile strength.

Description

Impression mould for manufacturing printed circuit board based on impression technology

Technical Field

The utility model belongs to the technical field of printed circuit board makes, especially relate to an impression mould is used in printed circuit board preparation based on impression technique.

Background

The imprinting technology is a micro-nano manufacturing technology, utilizes a mold to manufacture a microscopic pattern on a base material, and is widely applied to the fields of optical devices, LED manufacturing and the like. The pattern transfer mode is high in resolution, high in precision, high in efficiency and low in cost, is suitable for the densification of electronic circuits, and can enable the circuit to be thinner in shape, the insulating medium to be thinner and the electrical performance to be better. The imprinting technology is characterized in that firstly, a mold of a characteristic pattern, namely an imprinting template, is manufactured, then, after imprinting glue is coated on a substrate, the template and the substrate are oppositely placed, conditions such as the size, the temperature, the time and the like of additional mechanical pressure are adjusted according to different properties of the imprinting glue, so that the imprinting glue in a viscous flow state or a liquid state gradually fills a pattern structure on the template, and then, the imprinting glue is solidified and demoulded to form an imprinting pattern.

However, the printed wiring board has not been studied so far, and there are mainly the following: first, the size of template is mostly 6 cun, 8 cun, 12 cun in the existing market, and the template is greater than almost nothing of 12 cun. The PCB test boards are large in size, the normal size is about 20 inches, and a large-size template required by the PCB manufacturing field cannot be provided in the current market; secondly, the materials for manufacturing the template at present usually comprise silicon wafers, quartz wafers, silicon carbide, silicon nitride and the like, but the materials are brittle and cannot meet the requirements of hardness, tensile strength and the like in the PCB imprinting process; thirdly, the current template manufacturing process mainly comprises electron beam, ion beam, X-ray and other photoetching methods, the template manufacturing efficiency is very low according to the methods, the cost is relatively expensive, and the template manufacturing method is difficult to meet the requirements of the mold for industrial production; the process size of wet etching and the like is also small, and the size requirement of a PCB test board cannot be met; and other non-traditional methods such as atomic force etching, self-assembly technology and the like are used for manufacturing the imprinting template, so that the operation is simple, the cost is relatively low, but the order degree in a large area range is difficult to control, and the method is only suitable for the research field. Fourth, present template figure is mostly cycle repetition figure in the microcosmic, and circuit board figure design is complicated, can not be cycle repetition figure in the microcosmic, leads to template preparation more complicated, and the characteristic dimension is inconsistent, and the control of impression glue degree of depth and homogeneity is difficult.

Therefore, the manufacture of high-quality and high-precision imprinting templates is a core problem of applying the imprinting process to printed wiring boards. How to provide an imprinting mold for manufacturing a printed circuit board based on an imprinting technology, so as to solve the above problems in the prior art.

SUMMERY OF THE UTILITY MODEL

In view of the above prior art's shortcoming, the utility model aims at providing a printed wiring board preparation is with impression mould based on impression technique for it is more complicated to solve current template preparation, and template preparation size is limited, the material requires highly and large tracts of land printed wiring board is difficult to effectively prepare scheduling problem based on impression technique.

In order to achieve the above objects and other related objects, the present invention provides an imprint mold for manufacturing a printed circuit board based on an imprint technique, the imprint mold including:

a substrate;

a pattern layer to be imprinted, which is formed on at least one side of the substrate, wherein a pattern to be imprinted is prepared in the pattern layer to be imprinted;

presetting a metal coating formed on one surface of the pattern layer to be imprinted, which is far away from the substrate;

and the anti-sticking treatment layer is formed on one surface of the preset metal coating layer, which is far away from the pattern layer to be imprinted.

Optionally, the preset metal plating layer is an amorphous nickel-phosphorus alloy material layer, wherein the phosphorus content is 1% -4%.

Optionally, the thickness of the preset metal coating is between 3 and 5 μm.

Optionally, the flatness Ra of the preset metal plating layer is less than or equal to 300 nm.

Optionally, the preset metal plating layer is an electroless metal plating layer.

Optionally, the anti-stick treatment layer comprises a reticulated self-assembled monolayer film.

Optionally, the expansion coefficient of the substrate before the glass transition temperature of the substrate is between 0.1ppm and 20 ppm; the coefficient of expansion after the glass transition temperature is between 0.1 and 100 ppm.

Optionally, the substrate has a glass transition temperature greater than 200 ℃.

Optionally, the substrate has a thickness greater than 1 mm; the size of the substrate is larger than or equal to 15 inches.

Optionally, the substrate comprises any one of a polymaleimide triazine resin substrate and a ceramic substrate; wherein the ceramic substrate comprises Al₂O₃Any one of a substrate, a BeO substrate, and an AlN substrate.

As above, the utility model discloses an impression mould is used in printed wiring board preparation based on impression technique utilizes improvement type semi-addition technology (mSAP) preparation impression mould, preset metallic coating and carry out anti-sticking to handle and form anti-sticking processing layer to impression mould surface formation, use the impression technique in the preparation of PCB board, through PCB technology preparation metal circuit, be suitable for jumbo size PCB board, can greatly improve the homogeneity of the inconsistent circuit of complicated characteristic dimension, the straightness accuracy is high, the process stability is good, can guarantee batch production, satisfy the mould easily at PCB impression in-process hardness, requirements such as tensile strength.

Drawings

Fig. 1 shows a process flow chart of the preparation of the imprinting mold for manufacturing the printed circuit board based on the imprinting technology.

Fig. 2 is a schematic diagram illustrating the formation of a pattern layer to be imprinted on a substrate in the preparation of an imprint mold according to an embodiment of the present invention.

Fig. 3 is a schematic diagram illustrating the formation of a predetermined metal coating in the preparation of an imprint mold according to an embodiment of the present invention.

Fig. 4 is a schematic view illustrating the formation of an anti-sticking treatment layer in the preparation of an imprint mold according to an embodiment of the present invention.

Fig. 5 is a schematic structural diagram of a substrate to be imprinted according to an embodiment of the present invention.

Fig. 6 is a schematic diagram illustrating an example of the present invention, in which the imprint mold forms an imprint pattern.

Fig. 7 is a schematic diagram illustrating the provision of a mold core plate in the preparation of the imprint mold for double-sided imprinting of a pattern according to an embodiment of the present invention.

Fig. 8 is a schematic diagram illustrating the formation of a medium-pressure film in the preparation of the imprinting mold for a pattern to be imprinted on both sides according to an exemplary embodiment of the present invention.

Fig. 9 is a schematic diagram illustrating an example of the present invention for obtaining an imprint mold by removing a film during the preparation of the imprint mold for dual-sided pattern to be imprinted.

Description of the element reference numerals

100 impression mould

100a stamping surface

101 substrate

102 to be imprinted with a graphic layer

103 predetermined metal plating

104 anti-sticking treatment layer

200 substrate to be imprinted

201 substrate

202 dielectric layer

203 imprinting pattern

300 mould core plate

301. 302 copper layer

303 dry film

304 pattern layer to be imprinted

400 substrate to be imprinted

S1-S4

Detailed Description

The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

As in the detailed description of the embodiments of the present invention, the cross-sectional views illustrating the device structure are not partially enlarged in general scale for convenience of illustration, and the schematic views are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.

For convenience in description, spatial relational terms such as "below," "beneath," "below," "under," "over," "upper," and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that these terms of spatial relationship are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the figures. Further, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may also be present. In addition, "between … …" as used in the present invention includes both endpoints.

In the context of this application, a structure described as having a first feature "on" a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features are formed in between the first and second features, such that the first and second features may not be in direct contact.

It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and only the components related to the present invention are shown in the drawings rather than being drawn according to the number, shape and size of the components in actual implementation, and the form, amount and ratio of the components in actual implementation may be changed at will, and the layout of the components may be more complicated.

As shown in fig. 1, the utility model provides a preparation method of an imprinting mold for manufacturing a printed circuit board based on an imprinting technology, which comprises the following steps:

s1, providing a substrate;

s2, preparing a pattern layer to be imprinted on at least one side of the substrate, wherein the pattern layer to be imprinted is prepared with a pattern to be imprinted;

s3, preparing a preset metal plating layer on one surface of the pattern layer to be imprinted, which is far away from the substrate;

and S4, performing anti-sticking treatment on the surface of the preset metal plating layer to form an anti-sticking treatment layer.

The following will explain in detail the method for manufacturing an imprint mold for manufacturing a printed circuit board based on imprint technology according to the present invention with reference to the accompanying drawings, wherein it should be noted that the above sequence does not strictly represent the preparation sequence of the method for manufacturing a printed circuit board based on imprint technology, and those skilled in the art can change the steps according to the actual process. Fig. 1 shows only the steps of the method for manufacturing a printed wiring board according to an example of the present invention.

Firstly, as shown in S1, S2 and fig. 2 in fig. 1, a substrate 101 is provided, a pattern layer 102 to be imprinted is prepared on at least one side of the substrate 101, a pattern to be imprinted is prepared in the pattern layer 102 to be imprinted for preparing an imprint mold 100, and the substrate 101 is preferably a substrate suitable for PCB fabrication and capable of being imprinted for multiple times.

As an example, the template body includes a substrate 101 and a pattern layer to be imprinted 102 formed on at least one surface of the substrate 101, and the pattern layer to be imprinted 102 has the pattern to be imprinted formed therein. That is, the pattern layer to be imprinted may be formed as a unit, or the pattern layer to be imprinted may be formed on both surfaces of the substrate opposing each other.

The substrate 101 may be a polymaleimide triazine treeA grease substrate or a ceramic substrate; wherein the ceramic substrate may be Al₂O₃Ceramic substrates of the type BeO, AlN and the like. The substrate has good performance, high hardness and small expansion and contraction, and the expansion coefficient of the substrate before the glass transition temperature is between 0.1ppm and 20ppm, for example, 0.5ppm, 5ppm and 6 ppm; the coefficient of expansion after the glass transition temperature is 0.1 to 100ppm, and may be, for example, 10ppm, 20ppm or 50 ppm. The glass transition temperature of the substrate is greater than 200 deg.C, and may be 300 deg.C, 500 deg.C. The substrate has a thickness of greater than 1mm, such as 2mm, 3mm, 5 mm; warping is not easy to generate, and the method is beneficial to depth control of the imprinted pattern. The size of the substrate is larger than or equal to 15 inches.

In addition, the thickness of the pattern layer to be imprinted 102 is between 10 μm and 50 μm, such as 20 μm, 25 μm, and 30 μm, which can be selected according to actual requirements; the material of the pattern layer 102 to be imprinted may be a copper material layer. The substrate and the pattern layer to be imprinted, which are designed according to the specifications, are favorable for ensuring the rigidity and the dimensional stability of the imprinting mold (such as the nickel template), and the problems that the use times of the template are influenced due to the warping and deformation of the substrate in the imprinting and demolding processes, the imprinted patterns have different depths, the difficulty is increased for the uniformity of subsequent PCB electroplating and surface copper removal, and the like are solved.

As an example, the step of forming the pattern layer to be imprinted includes: forming a pad layer on the substrate 101, as shown in fig. 7, the copper layers 301 and 302 serve as the pad layer described herein, and the pad layer may be selected to be a Cu layer and may have a thickness of 1 Oz; forming a graphical dry film on the cushion layer, wherein a graphical window for exposing the cushion layer is formed in the graphical dry film; and preparing electroplated metal lines in the window to obtain the pattern layer to be imprinted 102.

Next, as shown in S3 in fig. 1 and fig. 3, a predetermined metal plating layer 103 is prepared on a side of the pattern layer to be imprinted 102 away from the substrate 101.

As an example, the preset metal plating layer 103 is formed on the surface of the pattern to be imprinted, that is, a metal layer, that is, the preset metal plating layer 103 is formed on the surface of the pattern layer 102 to be imprinted, so that imprinting is realized based on the preset metal plating layer 103 and the structure to be imprinted. In an example, the thickness of the predetermined metal plating layer 103 is between 3 μm and 5 μm, and may be, for example, 3.5 μm, 4 μm, or 4.5 μm. In one example, the predetermined metal coating is an amorphous nickel-phosphorus alloy containing 1-4% by mass of phosphorus, which is low in phosphorus and has a very high coating state HV. Of course, a nickel layer may be used in other examples. In addition, the flatness of the plating layer is very high, and Ra is less than or equal to 300nm, such as 50nm, 100nm and 200 nm.

In an optional example, the predetermined metal plating layer 103 is prepared by an electroless plating process, and has good chemical stability. In addition, in an example, the predetermined metal plating layer 103 is preferably a nickel layer, which can be well matched with the imprint pattern layer and the subsequent anti-sticking treatment layer, and is beneficial to being matched with a dielectric layer material for use. The nickel coating template has the advantages of smooth surface, small roughness, uniform and compact thickness of a nickel layer, strong deep plating capability, strong corrosion resistance and good coating bonding force. In addition, the nickel template has the advantages of high hardness, low surface energy, small interfacial tension and the like, and shows non-wettability and chemical inertness to the polymer adhesive layer. The die can not be damaged by breaking and tearing in the subsequent demoulding process. It is not easily adhered to the template even under high temperature polymer. Wherein, based on the utility model discloses an inconsistent complicated circuit of characteristic dimension, chemical nickel coating are very even, as long as the plating solution can soak and obtain, the solute exchange is abundant, and the cladding material will be very even, can reach the effect of profile modeling almost, electroplates and can't carry out the full surface to some work pieces that the shape is complicated and execute the plating, but chemical nickel can execute the plating to any shape work piece. The phosphorus-containing electroless nickel layer is amorphous, preferably low in phosphorus, without any crystal gaps on the surface of the plating layer, while the electroplated layer is typically crystalline, with a slower plating rate. The binding force of the chemical layer is generally higher than that of the electroplated layer, and the chemical plating is more environment-friendly than the electroplating because most of the chemical plating uses food-grade additives and does not use harmful substances such as cyanide and the like.

In a specific example, for the modified semi-additive process (mSAP) based fabrication, a metallic nickel template is obtained by the procedures of lamination → exposure → development → electroplating → stripping → nickel deposition. Manufacturing a metal template by using a PCB mSAP process, wherein the template pattern can be microscopically irregular and is not repeated periodically; firstly, preparing a copper template by an mSAP process, and plating a layer of nickel on the copper by a chemical nickel plating process to form a nickel template; the template is manufactured by using the PCB mSAP process, so that the template can be produced in batch, the efficiency is high, the cost is low, and irregular complex patterns can be manufactured. The size and the depth of the die are controlled to be uniform.

Finally, as shown in S4 in fig. 1 and fig. 4, an anti-adhesion treatment is performed on the surface of the predetermined metal plating layer 103 to form an anti-adhesion treatment layer 104. To obtain an imprint mold 100, the surface of the anti-sticking treatment layer constituting an imprint face 100 a. The stamping surface 100a refers to a surface of the stamping die 100 having a pattern, that is, a surface of the stamping die 100 contacting with a structure to be stamped. The utility model discloses mSAP technology preparation based on PCB impression mould, impression mould 100 adopts impression technology preparation printed circuit board, has realized the application of impression technique in PCB. For example, in the case of a nickel template coated with nickel, after the metal nickel template is manufactured, the anti-sticking treatment of the surface of the template is required.

In the nanoimprint process, the imprint mold 100 transfers a pattern to a substrate to be imprinted (such as a dielectric layer mentioned later) in a direct contact manner, retains the pattern through curing of the dielectric layer, and obtains a structural pattern corresponding to the template on the dielectric layer after demolding. For two contact surfaces of the template-dielectric layer and the dielectric layer-substrate, in order to ensure successful imprinting, the adhesion between the template and the dielectric layer must be much smaller than that between the substrate and the dielectric layer, so that the phenomenon of degumming cannot occur during demolding. The adhesion between imprint template and the dielectric layer is decided by the surface energy of template and dielectric layer, and the low surface energy helps the drawing of patterns, thereby the utility model discloses the construction antiseized handle layer 104 is favorable to realizing effective drawing of patterns.

In one example, the anti-sticking treatment layer 104 is selected to be a fluorosilane self-assembled layer. The fluorine-containing organosilane derivative is used for surface modification of the template, and forms a fluorosilane self-assembled monolayer film on the surface of the template, so that the free surface energy of the template can be effectively reduced. Further, in an alternative example, a fluorine-containing organosilane derivative is used for surface modification of this nickel template by a liquid phase deposition method. The utility model discloses a fluorine silane self-assembly individual layer membrane combines metal nickel template itself has hardness height, surface energy advantage such as lower, interfacial tension is little, can not damage because of breaking, tearing at follow-up drawing of patterns in-process, effectively realizes the preparation of printed circuit board. In addition, the metal coating (such as metallic nickel) has low surface energy and small interfacial tension, and shows non-wettability and chemical inertness to the polymer glue layer. It is not easily adhered to the template even under high temperature polymer. Considering that the stencil is repeatedly used 200 times or more, the surface metal plating layer may be damaged by the repeated use. Therefore, the utility model discloses in, adopted on the metal nickel template with the liquid phase deposition method with the template direct dip after the surface hydroxylation in the fluorine-containing organosilicon derivative through the dilution, finally form netted self-assembly individual layer membrane, obtain the anti-adhesion material that the one deck is similar to special fluorine dragon nature. Therefore, the anti-sticking effect is better, the anti-sticking agent can be used repeatedly, and pollutants are less. And the anti-sticking treatment is combined with the preset metal coating, so that the anti-sticking effect is better.

In one example, the step of forming the reticulated self-assembled monolayer film comprises: hydroxylating the surface of the preset metal coating, and placing the template on H₂SO₄And H₂O₂The mixed solution is soaked, and hydroxylation is formed on the surface through physical adsorption; the hydroxylated template was directly immersed in about 1% fluorine-containing solution and then allowed to stand at 65 ℃ for 1 h. Halogen element is hydrolyzed, chlorine atoms around Si are substituted to form Si-OH bonds, and finally the Si-OH bonds on the template and fluorine-containing organosilicon derivatives such as F₁₇And (3) dehydrating through hydrogen bonding of-FDTS, and finally combining into a net-shaped self-assembled monolayer film in a Si-O-Si covalent bond mode.

Wherein the imprint mold 100 is prepared based on a modified semi-additive process (mSAP). At present, the templates are mostly small in size such as 4 inches, 6 inches, 8 inches and 10 inches, and the templates are needed to be customized. But almost none of this scale size (>510mm 410mm) like PCB. The template manufactured by the PCB process has the advantages of large size, batch production, high efficiency, low cost and capability of manufacturing irregular complex patterns. The utility model discloses can make jumbo size template > 15 cun (15 cun, 18 cun, 20 cun … … 28 cun etc.) based on PCB mSAP technology, bigger or littleer even, can match with PCB board size, be far away more than traditional template size. For example, for a nickel template, including the substrate 101, the pattern layer to be imprinted 102(Cu layer), and the predetermined metal plating layer 103 (nickel layer) formed on the surface of the pattern layer to be imprinted, a nickel template is obtained by a process of lamination → exposure → development → plating → stripping → nickel plating based on a modified semi-additive process (mSAP). The method comprises the following steps of preparing a template main body consisting of a substrate and a pattern layer to be imprinted by adopting an mSAP process, wherein the specific process steps can be carried out by adopting the existing process, and then a nickel plating process is carried out. Manufacturing a metal template by using a PCB mSAP process, wherein the template pattern can be microscopically irregular and is not repeated periodically; firstly, preparing a copper template by an mSAP process, and plating a layer of nickel on the copper by a chemical nickel plating process to form a nickel template; the template is manufactured by using the PCB mSAP process, so that the template can be produced in batch, the efficiency is high, the cost is low, and irregular complex patterns can be manufactured. The size and the depth of the die are controlled to be uniform.

As an example, referring to fig. 5 to 6, a substrate 200 to be imprinted is provided, and the substrate 200 to be imprinted is imprinted based on the imprint mold 100, so as to transfer the pattern on the imprint mold 100 to the substrate 200 to be imprinted, and obtain an imprinted pattern 203. The to-be-imprinted substrate 200 includes a substrate 201 and a dielectric layer 202 formed on a surface of the substrate 201, and the imprint pattern 203 is formed in the dielectric layer 202.

By way of example, the dielectric layer material is an epoxy resin-based polymer film-shaped resin containing Si spheres, and the Si sphere size is 0.1-5 μm, such as 0.8 μm and 3 μm. Wherein, in the process of forming the stamping pattern, the semi-curing conditions are controlled as follows: semi-curing at 100-140 deg.C (such as 110 deg.C and 120 deg.C) for 5-15 min (such as 8min and 12min), and controlling the pressure of vacuum pump to be 0.5-5 MPa (such as 0.8MPa, 2MPa and 3MPa), wherein the mold is easily removed; the curing conditions were controlled as follows: curing at 160-200 deg.C (such as 170 deg.C and 180 deg.C) for 30-60 min (such as 40min and 50min), high uniformity of imprinted pattern, high straightness, and good process stability, and can ensure batch production. In a preferred embodiment, the epoxy resin matrix is selected to have two types of functional groups, which is characterized by a two-stage cure. The achievement of the effects under the above conditions can be facilitated by two types of functional groups. Wherein, what plays a role in the semi-curing and curing process is: the first functional group is easy to demould under semi-curing conditions; the second functional group can easily lead the obtained imprinted pattern to have good uniformity, high steepness and good process stability under the curing condition, and can ensure batch production. In one example, the step of forming the imprint pattern includes: carrying out imprinting treatment on the dielectric layer based on the imprinting mold so as to form a semi-solidified pattern in the dielectric layer; carrying out demolding treatment to remove the imprinting mold; and carrying out curing treatment on the semi-cured pattern to form the stamping pattern.

As an example, the step of forming the imprint patterns 203 includes: firstly, performing imprinting treatment on the dielectric layer 202 based on the imprinting mold 100 to form a semi-cured pattern in the dielectric layer; the anti-sticking treatment is followed by stamping, and semi-solidified patterns are formed by controlling pressure, temperature and time, wherein the solidification degree can be between 40% and 60%, and can be 50%. Then, a mold release process is performed to remove the imprint mold 100. And after demolding, curing the semi-cured pattern to completely cure the material so as to form the imprint pattern 203.

As an example, as shown in fig. 7-9, an example of a double layer imprinting is provided, in which the specific process is: as shown in fig. 7, providing a mold core 300, laminating copper layers 301 and 302, wherein the thickness can be 1Oz, then, as shown in fig. 8, pressing a film to form a dry film 303, wherein a pattern window is formed in the dry film, electroplating metal in the window to form a pattern 304 to be imprinted, and then removing the film, as shown in fig. 9, wherein the circuit patterns on the two sides of the imprinting mold can be the same or different; in addition, a predetermined metal plating layer is further formed thereon and an anti-sticking treatment is performed to form an anti-sticking treatment layer, which is not shown in the figure.

The utility model discloses in can use the impression technique on PCB, prepare out the graphic line who satisfies the designing requirement, prepare out the circuit figure that the precision is high, good reproducibility. The metal nickel template is prepared by utilizing an improved semi-additive process (mSAP), and the template is manufactured by utilizing a PCB mSAP process, so that the method can be used for batch production, has high efficiency and low cost, and can be used for manufacturing irregular complex patterns. The size and the depth of the die are controlled to be uniform. The metal nickel template can be obtained through the processes of laminating → exposing → developing → electroplating → stripping → nickel chemical treatment and the like, the line width and the space of the nickel template accord with the design requirements, the depth is uniform, and the subsequent imprinting and PCB wet processing are facilitated; after anti-sticking treatment, the surface of the nickel template is subjected to imprinting, demolding and curing to obtain a pattern with uniform depth; the printed board can be used for preparing an intact circuit through Desmean, PTH, electroplating, surface copper removing and other processes, the line width is uniform and consistent, and the design requirement can be met. Can make thinner circuit (50 mu m, 40 mu m, 30 mu m, 10 mu m are thinner even) based on the impression technique, based on the utility model discloses a scheme is favorable to solving that the PCB figure is complicated changeable, is the aperiodic repetitive pattern in microcosmic, and the big problem of the template preparation degree of difficulty to, because the PCB board size is great, do not have supporting impression and anti-sticking treatment facility in the market, based on the utility model discloses a scheme can effectively solve above-mentioned problem. The utility model discloses use the impression technique in PCB makes, need not to do complicated upgrading to existing equipment, be favorable to mass production's realization, promote the development of whole technology.

Additionally, the utility model provides an impression mould for based on the technology of impression technique preparation printed wiring board, wherein, an impression mould is preferred to be adopted for the printed wiring board preparation the utility model discloses an above-mentioned technology preparation, wherein, the above-mentioned description can be referred to the characteristic of specific structure and relevant description, no longer gives unnecessary details here, the impression mould includes the template main part and predetermines the metallic coating, the template main part has treats the impression figure, predetermine the metallic coating and form treat the surface of impression figure, predetermine the surface of metallic coating and still be formed with anti-sticking processing layer.

Wherein the imprint mold includes:

a substrate 101;

a pattern layer to be imprinted 102 formed on at least one side of the substrate 101, wherein a pattern to be imprinted is prepared in the pattern layer to be imprinted 102;

a preset metal plating layer 103 formed on one surface of the pattern layer to be imprinted 102 far away from the substrate 101;

and the anti-sticking treatment layer 104 is formed on one surface of the preset metal plating layer 103 far away from the pattern layer 102 to be imprinted.

As an example, the predetermined metal plating layer 103 is an amorphous nickel-phosphorus alloy material layer, wherein the phosphorus content is 1% to 4%; the planeness of the preset metal coating is that Ra is less than or equal to 300 nm; the thickness of the preset metal coating is between 3 and 5 mu m.

As an example, the anti-stick treatment layer 104 comprises a reticulated self-assembled monolayer film.

As an example, the expansion coefficient of the substrate 101 before the glass transition temperature is between 0.1ppm and 20 ppm; the expansion coefficient after the glass transition temperature is 0.1-100 ppm; the glass transition temperature of the substrate is greater than 200 ℃; the thickness of the substrate is more than 1 mm; the size of the substrate is larger than or equal to 15 inches.

As an example, the substrate 101 includes at least one of a polymaleimide triazine resin substrate and a ceramic substrate; wherein the ceramic substrate comprises Al₂O₃Any one of a substrate, a BeO substrate, and an AlN substrate.

To sum up, the utility model discloses an impression mould is used in printed wiring board preparation based on impression technique, based on the mSAP technology preparation in the PCB technology the impression mould, the utility model discloses utilize half addition technology (mSAP) of improvement type preparation impression mould, predetermine metallic coating and carry out anti-sticking to impression mould surface formation and form anti-sticking treatment layer, use the impression technique in the preparation of PCB board, through PCB technology preparation metal line, be suitable for jumbo size PCB board, can greatly improve the homogeneity of the inconsistent circuit of complicated characteristic dimension, the straightness is high steep, and process stability is good, can guarantee batch production, satisfies the mould easily and at requirements such as PCB impression in-process hardness, tensile strength. Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value.

The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims

1. An imprint mold for manufacturing a printed wiring board based on an imprint technique, the imprint mold comprising:

a substrate;

2. The imprint mold for manufacturing a printed wiring board based on an imprint technique according to claim 1, wherein the predetermined metal plating layer is an amorphous nickel-phosphorus alloy material layer, and the phosphorus content is 1% to 4%.

3. The imprint mold for manufacturing a printed wiring board based on an imprint technique according to claim 1, wherein the predetermined metal plating thickness is between 3 and 5 μm.

4. The imprint mold for manufacturing a printed wiring board based on an imprint technique according to claim 1, wherein the predetermined metal plating flatness Ra is 300nm or less.

5. The imprint template for manufacturing a printed wiring board based on an imprint technique according to claim 1, wherein the predetermined metal plating layer is an electroless metal plating layer.

6. The imprint template for manufacturing a printed wiring board based on an imprint technique according to claim 1, wherein the anti-sticking treatment layer includes a net-like self-assembled monolayer film.

7. The imprint mold for manufacturing a printed wiring board based on an imprint technique according to claim 1, wherein an expansion coefficient of the substrate before a glass transition temperature is between 0.1ppm and 20 ppm; the coefficient of expansion after the glass transition temperature is between 0.1 and 100 ppm.

8. The imprint template for manufacturing a printed wiring board based on an imprint technique according to claim 1, wherein a glass transition temperature of the substrate is greater than 200 ℃.

9. The imprint mold for manufacturing a printed wiring board based on an imprint technique according to claim 1, wherein a thickness of the substrate is more than 1 mm; the size of the substrate is larger than or equal to 15 inches.

10. The imprint mold for manufacturing a printed wiring board based on an imprint technique according to any one of claims 1 to 9, wherein the substrate includes any one of a polymaleimide triazine resin substrate and a ceramic substrate; wherein the ceramic substrate comprises Al₂O₃Any one of a substrate, a BeO substrate, and an AlN substrate.