1253368 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種銲錫裝置與方法，且特別是有關 於一種用於電子基板過錫爐作業之銲錫裝置與方法。 【先前技術】 一般電子基板，或稱電路板，在裝置電子零件後，通BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a soldering apparatus and method, and more particularly to a soldering apparatus and method for an electronic substrate tinning furnace operation. [Prior Art] A general electronic substrate, or circuit board, is passed through the electronic components of the device.
常須將穿過電路板的零件接腳及電路板底面之表面粘著元 件銲接於電路板底面上。在電路板銲錫作業中，使用工具 除了銲搶和吸錫科，有—較簡單快速的方法，即利用鲜 錫爐設備。銲錫爐可對電路板上數個電路接點同時進行自 動化銲錫作業，節省相當的作業時間。錫爐主要作用在於 將銲錫材料融化成液態，電子元件之銲腳先沾±助㈣， 再輪送經過錫爐上方藉由錫爐噴出的錫液附著於電子元件 各接點上。 得㈣錫爐之作業方式，只是單純將錫爐加熱，讓電 :基板由上方通過。其中存在一項問題即錫爐加熱過程 錫爐槽㈣液會伴隨氣泡或雜f，#錫㈣射至電子 若伴隨之氣泡過大，會造成元件之空銲，導致產 -成為不良品’因此线的情形會大幅降低產品的良率。 =要一種改良的設傷，以解決習知技術因空鲜影 曰良率之問題，提高過錫爐作業之良率。 【發明内容】 目的就是在提供-種銲錫裝置，用以 因此本發明之一 5 1253368 使錫液中氣泡細緻化以及均勻化。 本毛月的另一目的是在提供-種銲錫裝置，使電子基 板進行過錫爐作業時空銲情形大幅減少。 本毛月的又一目的是在提供-種銲錫裝置，使電子基 板上電子元件銲接製程之良率提升。 根據本兔明之上述目的，提出一種鲜錫裝置。鲜錫裝 置包：-錫爐槽與一音波產生裝置。錫爐槽内置一熔融錫 液9波產生裝置位於錫爐槽内部，用以細緻化炼融錫液 中之氣泡。 本^明之另一悲樣係為電子基板銲錫之方法，包含提 仏熔融錫液，細緻化該熔融錫液中之氣泡，係利用一音 波產生裝置產生一音波振動，以振動並細緻化熔融錫液中 之氣/包，以及噴射熔融錫液至一電子基板的穿孔，其中一 電子疋件之接腳位於穿孔中。音波產生裝置所產生之音波 振動頻率例如為70kHz至130kHz。 本發明藉由配備一音波產生裝置，解決存在於錫液中 之氣泡問題，亦即使氣泡細緻化後不致造成嚴重的空銲或 冷銲隋形。相較於習知的過錫爐技術，運用本發明之銲錫 裝置將使銲錫製程之良率大幅提升，而且此方式簡單而方 便’不須複雜的結構改良，因此對於電子基板製造者大有 助益。 【實施方式】 本發明係為一種銲錫裝置，使用於電子基板之過錫爐 作業中’藉由一音波產生裝置使錫液中之氣泡細緻化，不 !253368 僅達到降低產品因空銲或冷銲導致不良的情形，而且其架 没簡單方便。以下將以圖式及詳細說明清楚闡釋本創作之 精神’如熟悉此技術之人員在瞭解本創作之較佳實施例 後，§可由本創作所教示之技術，加以改變及修飾，其並 不脫離本創作之精神與範圍。圖式並非用以衡量所示之特 徵，而且在某些例子中，為了更清楚說明，會適當地擴大 及/或簡化圖式。It is often necessary to solder the component pins that pass through the board and the surface bonding components on the underside of the board to the bottom surface of the board. In the soldering of circuit boards, the use of tools in addition to welding and absorbing tin, there is a simpler and faster method, that is, the use of fresh tin furnace equipment. The soldering furnace can simultaneously automate the soldering of several circuit contacts on the board, saving considerable working time. The main function of the tin furnace is to melt the solder material into a liquid state, and the soldering feet of the electronic components are firstly touched by the helper (four), and then the tin liquid sprayed through the tin furnace above the tin furnace is attached to the contacts of the electronic components. The operation method of the (four) tin furnace is simply to heat the tin furnace to make electricity: the substrate passes through. There is a problem in that the tin furnace heating process of the tin furnace is accompanied by bubbles or miscellaneous f. #锡(四) is injected into the electrons. If the bubble is too large, it will cause the component to be welded, resulting in the production - becoming a defective product. The situation will greatly reduce the yield of the product. = An improved set of injuries is needed to solve the problem of conventional technology due to the vacant yield and improve the yield of tin furnace operations. SUMMARY OF THE INVENTION The object is to provide a soldering device for the purpose of fine-tuning and homogenizing bubbles in a tin bath in accordance with one of the inventions 5 1253368. Another purpose of this month is to provide a soldering device that greatly reduces the amount of space soldering during the operation of the electronic substrate. Another objective of this month is to provide a soldering device that increases the yield of electronic component soldering processes on electronic substrates. According to the above object of the present invention, a fresh tin device is proposed. Fresh tin equipment package: - Tin furnace trough and a sound wave generating device. A tin-melting liquid 9-wave generating device is built in the tin furnace tank to be located inside the tin furnace tank to finely refine the bubbles in the molten tin bath. Another sadness of the present invention is a method for soldering an electronic substrate, comprising extracting molten tin liquid, refining the bubbles in the molten tin liquid, and generating an acoustic vibration by using an acoustic wave generating device to vibrate and finely melt the molten tin. The gas/package in the liquid, and the perforation of the molten tin liquid to an electronic substrate, wherein the pins of an electronic component are located in the perforations. The acoustic wave vibration frequency generated by the sound wave generating device is, for example, 70 kHz to 130 kHz. The present invention solves the problem of bubbles present in the tin liquid by being equipped with an acoustic wave generating device, and does not cause serious air welding or cold welding deformation even after the bubbles are refined. Compared with the conventional tin furnace technology, the soldering device of the present invention can greatly improve the yield of the soldering process, and the method is simple and convenient, and does not require complicated structural improvement, so it is very helpful for the electronic substrate manufacturer. beneficial. [Embodiment] The present invention relates to a soldering device for use in a tin-plating furnace operation of an electronic substrate. The bubble in the tin liquid is refined by an acoustic wave generating device, and the 253368 only reduces the product due to air welding or cold. Welding causes a bad situation, and its frame is not simple and convenient. The spirit of the present invention will be clearly explained in the following drawings and detailed descriptions. As those skilled in the art understand the preferred embodiment of the present invention, § can be modified and modified by the teachings of the present invention, and is not deviated from The spirit and scope of this creation. The drawings are not intended to measure the features shown, and in some instances, the drawings may be appropriately expanded and/or simplified for the sake of clarity.
參照第1Α圖，其繪示依照本發明之銲錫裝置之一較佳 實施例的示意圖。本發明之銲錫裝置主要包含一錫爐槽 與一音波產生裝置1〇4。音波產生裝置1〇4位於錫爐槽1〇2 内，用以細緻化錫爐槽102中錫液的氣泡。 同時參照第汨圖，其繪示電子元件之接腳置於穿孔。 於一較佳實施射’―電子基板112，例如印刷電路板 (printed circuit board; PCB)置於輸送裝置ιι〇上藉由輸 送裝置11〇沿-輸送方向移動，如箭頭116所示。 >電子元件U4置於電子基板112上，電子基板ιΐ2預 開設穿孔130,電子元件"4的接腳u4a容置於穿孔⑽ 中此時尚有餘留之空間，此鲜錫空間是用來容納錫 液，理想狀況是錫液填滿此銲錫空間1 U。 錫爐槽 102中的錄α + 的錫液在加熱過程中通常會有氣泡產 生’如第1圖所示之初妒齑、、办， σ軋/包120，氣泡的大小會影響過錫 爐後電子元件114銲錫之口暂 口口貝右氣泡太大使大部份銲錫 空間132未被充填則造成*锃 战二鋅，電子兀件114將無法牢固 於電子基板112上。 本實施例中使用一容量為 15公升的錫爐槽 102。當使 1253368 用銲錫m先加熱錫爐# 1G2之材料，使輝錫材料成 融化狀態之錫液’接著驅動音波產生裝置104,使此融化狀 態之錫液產生振動，音波產生裝置1〇4之功率例如為1000w 至3000W，音波頻率例如為7驗至i3〇kHz，錫液在經過 音波振動後，錫液内的氣泡因此更為細緻均勻，如第上圖 所示之細緻化氣泡11 8。Referring to Figure 1, there is shown a schematic view of a preferred embodiment of a soldering apparatus in accordance with the present invention. The soldering apparatus of the present invention mainly comprises a tin furnace tank and a sound wave generating device 1〇4. The sound wave generating device 1〇4 is located in the tin furnace tank 1〇2 to finely define the bubbles of the tin liquid in the tin bath 102. Referring also to the second drawing, the pins of the electronic component are placed in the perforations. In a preferred embodiment, an electronic substrate 112, such as a printed circuit board (PCB), is placed on the transport unit ι by a transport device 11 〇 in the transport direction as indicated by arrow 116. > Electronic component U4 is placed on the electronic substrate 112, the electronic substrate ΐ2 pre-opens the through hole 130, and the pin u4a of the electronic component&4; is accommodated in the perforation (10), and the space is reserved for the fashion. Tin liquid, ideally, tin liquid fills this solder space 1 U. In the tin bath 102, the α + tin bath is usually bubbled during the heating process. 'As shown in Fig. 1 , the σ σ / package 120, the size of the bubble will affect the tin furnace. After the soldering of the electronic component 114, the mouth of the mouth is too large, so that most of the soldering space 132 is not filled, so that the electronic soldering element 114 will not be firmly fixed on the electronic substrate 112. In the present embodiment, a tin furnace tank 102 having a capacity of 15 liters is used. When 1253368 is used to heat the material of the tin furnace #1G2 with the solder m, the tin liquid of the tin material is melted, and then the sound wave generating device 104 is driven to vibrate the tin liquid in the molten state, and the sound wave generating device 1〇4 The power is, for example, 1000w to 3000W, and the sound wave frequency is, for example, 7 to i3〇 kHz. After the sound of the tin liquid is vibrated, the bubbles in the tin liquid are more fine and uniform, such as the fine bubbles 11 shown in the above figure.
雖圖不中音波產生裝置之放置位置位於錫爐槽之一侧 邊上，其係代表一較佳實施例，並不限定於此。例如亦可 設置於錫爐槽之-角^，並將音波產生裝置擺設為朝向錫 爐中心發射音波。亦可使用—全方位發射之音波產生裝 置’置於錫爐中心，音波產生裝置將吨射狀發射音波， 使，，’田致化範圍擴及錫爐槽之大部分區域。只要能發揮說明 書中所揭不之功能，各種裝設位置皆包含於本發明之技術 精神内。 參照第2圖，其繪示依照本發明之電子基板銲錫之方 法一較佳實施例之流程圖。本發明之另一態樣係為一電子 基板銲錫之方法。於步驟202中，提供一熔融錫液，例如 先加熱錫爐中的銲錫材料，使銲錫材料成為熔融之錫液。 於步驟204,細緻化該熔融錫液中之氣泡，例如驅動一 音波產生裝置，產生一音波振動，以振動並細緻化熔融錫 液中之氣泡’音波產生裝置的運作功率例如為丨〇〇〇w至 3000W，運作頻率例如為70kHz至130kHz。 步驟206中，喷射錫液至一電子基板的穿孔，其中一 電子元件之接腳位於穿孔中。 由本發明較佳實施例可知，應用本發明具有下列優 8 1253368 =_本1明之銲錫裝置’在進行電子基板之過錫爐作 業時’將錫液内氣泡細緻化、均勻化，使元件薛接時不致 因過大的氣泡造成空銲，因此大幅提高產品良率，而且僅 須配置音波裝置即可達到良率的提升，對於製造者而言相 當方便。Although the position where the acoustic wave generating device is placed is located on one side of the tin furnace groove, it represents a preferred embodiment and is not limited thereto. For example, it can also be placed at the corner of the tin bath, and the sound wave generating device is placed to emit sound waves toward the center of the tin furnace. It is also possible to use the omni-directional sound generating device to be placed in the center of the tin furnace, and the sound wave generating device emits sound waves in a ton of shots, so that the 'Tianzhihua range extends to most areas of the tin bath. As long as the functions disclosed in the specification can be exerted, various mounting positions are included in the technical spirit of the present invention. Referring to Figure 2, there is shown a flow chart of a preferred embodiment of a method of soldering an electronic substrate in accordance with the present invention. Another aspect of the invention is a method of soldering an electronic substrate. In step 202, a molten tin liquid is provided, for example, the solder material in the solder furnace is heated to make the solder material a molten tin liquid. In step 204, the bubbles in the molten tin liquid are refined, for example, driving a sound wave generating device to generate a sound wave vibration to vibrate and fine-tune the bubbles in the molten tin liquid. The operating power of the sound wave generating device is, for example, 丨〇〇〇 w to 3000W, the operating frequency is, for example, 70 kHz to 130 kHz. In step 206, the tin liquid is sprayed onto the perforations of an electronic substrate, wherein the pins of an electronic component are located in the through holes. It can be seen from the preferred embodiment of the present invention that the present invention has the following excellent soldering device of '8', and the soldering device of the present invention 'refines and homogenizes the bubbles in the tin liquid during the operation of the tin-plating furnace of the electronic substrate, so that the components are spliced It does not cause empty welding due to excessive air bubbles, so the product yield is greatly improved, and the sound wave device can be configured to achieve an increase in yield, which is quite convenient for the manufacturer.
雖然本發明已以較佳實施例揭露如上，然其並非用以 限疋本發明，任何熟習此技藝者，在不脫離本發明之精神 和範圍内，當可作各種之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之詳細說明如下： 第1A圖係緣示依照本發明之銲錫裝置之一較佳實施 例的示意圖。 第1B圖係繪示第1圖中電子元件之接腳置於穿孔内的 不意圖。 第2圖係繪示依照本發明之電子基板銲錫方法一較佳 實施例之流程圖。 【主要元件符號說明】 102 :錫爐槽 110 :輸送裝置 Π4 :電子元件 104 :音波產生裝置 112 :電子基板 114a :接腳 1253368While the invention has been described above by way of a preferred embodiment, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; A schematic diagram of a preferred embodiment. Fig. 1B is a view showing the pin of the electronic component in Fig. 1 placed in the perforation. Figure 2 is a flow chart showing a preferred embodiment of a soldering method for an electronic substrate in accordance with the present invention. [Description of main component symbols] 102: Tin furnace tank 110: Conveying device Π4: Electronic component 104: Sound wave generating device 112: Electronic substrate 114a: Pin 1253368
11 6 :箭頭 11 8 :細緻化氣泡 12 0 :初始氣泡 13 0 ·穿孔 132 :銲錫空間 202〜206 :步驟 1011 6 : Arrow 11 8 : Fine bubbles 12 0 : Initial bubble 13 0 · Perforation 132 : Solder space 202~206 : Step 10