JPH09283910A - Solder paste hole-filling printer and printing method - Google Patents
Solder paste hole-filling printer and printing methodInfo
- Publication number
- JPH09283910A JPH09283910A JP8794996A JP8794996A JPH09283910A JP H09283910 A JPH09283910 A JP H09283910A JP 8794996 A JP8794996 A JP 8794996A JP 8794996 A JP8794996 A JP 8794996A JP H09283910 A JPH09283910 A JP H09283910A
- Authority
- JP
- Japan
- Prior art keywords
- solder paste
- blind
- hole
- metal mask
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プリント基板のブ
ラインドスルーホール等非貫通穴にはんだペーストを供
給するためのはんだペースト印刷機とその印刷作業方法
に関し、特に、開口面積の違う２種類のメタルマスクと
超音波もしくはバイブレータ等振動装置を持つはんだペ
ースト印刷機を使用した、はんだペースト印刷機とはん
だペースト印刷作業方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder paste printing machine for supplying solder paste to non-through holes such as blind through holes of a printed circuit board and a printing operation method therefor, and more particularly to two kinds of metal having different opening areas. The present invention relates to a solder paste printer and a solder paste printing work method using a solder paste printer having a mask and a vibration device such as an ultrasonic wave or a vibrator.
【０００２】[0002]
【従来の技術】従来の表面実装様プリント基板へのはん
だペーストの供給方法は、プリント基板上にはんだペー
ストを供給したい形状の開口部を持つメタルマスクを置
き、この上にはんだペーストを乗せゴム製のスキージに
より刷り込み印刷を行うのが、一般的なはんだペースト
の供給方法であった。しかし、この方法はあくまでも、
平面状のプリント基板上はんだ供給部にはんだペースト
を供給する方法であり、ブラインドスルーホール等非貫
通穴などの、凹状部へのはんだペースト供給にはあまり
適してはいない。これに属する公知例としては種種ある
が、たとえば、特開５−８３６９号公報などもこのひと
つである。2. Description of the Related Art A conventional method of supplying solder paste to a surface-mounted printed circuit board is to place a metal mask having an opening having a shape desired to supply the solder paste on the printed circuit board, and place the solder paste on the metal mask to make a rubber mask. The conventional solder paste supply method is to perform imprinting printing with a squeegee. However, this method is
This is a method of supplying the solder paste to the planar solder supply portion on the printed circuit board, and is not very suitable for supplying the solder paste to a concave portion such as a blind through hole or a non-through hole. There are various kinds of known examples belonging to this, and, for example, JP-A-5-8369 is one of them.
【０００３】[0003]
【発明が解決しようとする課題】上記公知例などの従来
技術は、ほとんど平らな表面実装プリント基板にはんだ
ペーストを供給するには、メタルマスクの開口体積分の
はんだペーストを供給していれば十分であるが、ブライ
ンドスルーホールなどの凹状部へのはんだペースト供給
は、メタルマスク開口体積分のはんだペーストを例え
ば、ブラインドスルーホール内体積部に供給しても電気
的及び機械強度的接続に必要な量は確保されない。ま
た、メタルマスクの板厚を厚くするとメタルマスクの開
口面積と高さのアスペクト比が大きくなりはんだペース
トそのものの供給が困難になり結局目的を達成すること
はできない。仮に上記方法ではんだペーストの供給が行
えたとしても、ブラインドスルーホール内に確実にはん
だペーストが充填されている確立はかなり低いと考えら
れる。本発明の目的は、メタルマスクを使用する従来の
はんだペースト供給方法の基本的な性質を変えることな
くブラインドスルーホール内に高確立ではんだペースト
を供給するはんだペースト印刷機と印刷方法を提供する
ことにある。In the prior art such as the above-mentioned known example, it is sufficient to supply the solder paste for the opening volume of the metal mask in order to supply the solder paste to the almost flat surface mounting printed circuit board. However, the solder paste supply to the concave portion such as the blind through hole is necessary for electrical and mechanical strength connection even if the solder paste for the metal mask opening volume is supplied to the inner volume of the blind through hole. The quantity is not secured. Moreover, if the plate thickness of the metal mask is increased, the aspect ratio of the opening area and the height of the metal mask becomes large, and it becomes difficult to supply the solder paste itself, so that the purpose cannot be achieved. Even if the solder paste can be supplied by the above method, it is considered that the probability that the solder paste is reliably filled in the blind through hole is considerably low. An object of the present invention is to provide a solder paste printer and a printing method for supplying a solder paste with high probability in a blind through hole without changing the basic properties of the conventional solder paste supplying method using a metal mask. It is in.
【０００４】[0004]
【課題を解決するための手段】上記目的は、はんだペー
スト印刷機のプリント基板を保持する部分にバイブレー
タもしくは超音波などの振動を発生する機構を接続し振
動を与えながらはんだペーストの印刷作業を行う。ま
た、メタルマスクについてはブラインドスルーホールの
みのものと全パターンのものを作成し、上記作業ではブ
ラインドスルーホールのみのメタルマスクを使用して作
業を行い、後に全パターンのメタルマスクにより従来通
りの印刷作業を行う。これにより本発明の目的は達成で
きる。[Means for Solving the Problems] The above object is to perform a solder paste printing operation by connecting a vibrator or a mechanism for generating vibrations such as ultrasonic waves to a portion of a solder paste printer that holds a printed circuit board and applying vibration. . As for the metal mask, only blind through holes and all patterns are created.In the above work, work is performed using the blind through hole only metal mask. Do the work. Thereby, the object of the present invention can be achieved.
【０００５】[0005]
【発明の実施の形態】以下、本発明の一実施例について
図を用いて詳細に説明する。図１は、本発明に使用する
ブラインドスルーホール１（非貫通スルーホール）を持
つプリント基板２を示す。ここで形成されるブラインド
スルーホール１はこの直径より一回りほど大きい銅パッ
ト３のセンター部に形成される。図２は、本発明のペー
スト印刷作業に使用するメタルマスク４を示す。図２の
中の（ａ）図は、プリント基板２の中のブラインドスル
ーホール部のみの部分だけ開口させたメタルマスク４ａ
であり、この開口部はプリント基板２のブラインドスル
ーホール１の直径より弱冠小さい直径となっている。図
２の中の（ｂ）図は、プリント基板２の表面実装用パタ
ーン５及びブラインドスルーホール１の全ての部分を開
口させたメタルマスク４ｂであり、この開口部はプリン
ト基板２のブラインドスルーホール１の外周にある銅パ
ット３の直径より弱冠小さくかつブラインドスルーホー
ル１より弱冠大きい直径となっている。図３は、はんだ
ペースト印刷機１１の概略を示したものであり、以下詳
細を詳しく説明する。はんだペースト印刷機１１はま
ず、メタルマスクホルダー部２１、基板ホルダー部２
２、メタルマスクホルダー駆動部２３、基板ホルダー駆
動部２４、スキージ部２５、振動子部２６、制御部２７
より構成される。BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described in detail below with reference to the drawings. FIG. 1 shows a printed circuit board 2 having a blind through hole 1 (non-through through hole) used in the present invention. The blind through hole 1 formed here is formed in the center portion of the copper pad 3 which is slightly larger than this diameter. FIG. 2 shows a metal mask 4 used in the paste printing operation of the present invention. 2A shows a metal mask 4a in which only the blind through hole portion of the printed circuit board 2 is opened.
This opening has a diameter slightly smaller than the diameter of the blind through hole 1 of the printed board 2. 2B shows a metal mask 4b in which all the surface mounting patterns 5 and the blind through holes 1 of the printed circuit board 2 are opened, and the openings are blind through holes of the printed circuit board 2. As shown in FIG. The diameter is smaller than the diameter of the copper pad 3 on the outer periphery of 1 and larger than that of the blind through hole 1. FIG. 3 shows an outline of the solder paste printing machine 11, which will be described in detail below. First of all, the solder paste printer 11 includes a metal mask holder portion 21 and a substrate holder portion 2.
2, metal mask holder drive unit 23, substrate holder drive unit 24, squeegee unit 25, vibrator unit 26, control unit 27
It is composed of
【０００６】次に本発明の動作について詳細に説明す
る。本発明によるはんだペースト印刷の作業方法は、ま
ずプリント基板２をはんだペースト印刷機１１の基板ホ
ルダー部２２にセットする。基板ホルダー部２２がプリ
ント基板２を保持・固定したら次に、メタルマスク３ａ
をメタルマスクホルダー部２１にセットする。メタルマ
スク３ａとプリント基板２の保持・固定が終了したらメ
タルマスクホルダー駆動部２３及び基板ホルダー駆動部
２４を駆動させメタルマスク３ａとプリント基板２の位
置合せを行い固定する。次にはんだペースト６をメタル
マスク３ａ上に供給しスキージ部２５を駆動させプリン
ト基板２にメタルマスク３ａを介して、はんだペースト
６を供給する。この時、基板ホルダー部２２と接続され
た振動子部２６を起動させ基板ホルダー２２上にあるプ
リント基板２に微振動を与える。メタルマスク３ａは先
に説明したようにブラインドスルーホール１より弱冠小
さい開口面積を持つためプリント基板２の表面には、は
んだペースト６が接触せずブラインドスルーホール１の
中にのみ供給される。さらに振動子２６により微振動が
与えられるため、ブラインドスルーホール１内に供給さ
れたはんだペースト６は凹状の下部に集束される。次
に、プリント基板２は基板ホルダー部２２に固定した状
態で、メタルマスク３ａのみをメタルマスクホルダー部
２１より取外しメタルマスク３ｂを再度メタルマスクホ
ルダー２１に再度セットする。一度目の印刷作業と同様
にメタルマスクホルダー駆動部２３と基板ホルダー駆動
部２４を駆動させ位置合わせを行う。次にはんだペース
ト６をメタルマスク３ｂ上に供給しスキージ部２５を駆
動させプリント基板２にメタルマスク３ｂを介して、は
んだペースト６を供給する。これによりプリント基板２
はブラインドスルーホール１内のはんだペースト６充填
及び表面実装用パターン５へのはんだペースト６最適量
供給を可能にすることができる。また本発明による振動
子２６を起動させるタイミングは印刷作業途中・印刷作
業終了後のどちらでもかまわない。特に印刷作業途中で
の振動子２６の起動はメタルマスク３からのはんだペー
スト６の版ばなれを促進し良好な印刷結果を得られる余
剰効果もふくまれる。以上、本発明を前記実施例に基づ
き具体的に説明したが、本発明は前記実施例に限定され
ない範囲において、種々変形しうることは勿論である。Next, the operation of the present invention will be described in detail. In the solder paste printing operation method according to the present invention, first, the printed board 2 is set on the board holder portion 22 of the solder paste printer 11. After the substrate holder 22 holds and fixes the printed circuit board 2, next, the metal mask 3a
Is set on the metal mask holder 21. After holding and fixing the metal mask 3a and the printed circuit board 2, the metal mask holder driving unit 23 and the substrate holder driving unit 24 are driven to align and fix the metal mask 3a and the printed circuit board 2. Next, the solder paste 6 is supplied onto the metal mask 3a, and the squeegee portion 25 is driven to supply the solder paste 6 to the printed board 2 through the metal mask 3a. At this time, the vibrator unit 26 connected to the substrate holder unit 22 is activated to give a slight vibration to the printed circuit board 2 on the substrate holder 22. Since the metal mask 3a has an opening area slightly smaller than that of the blind through hole 1 as described above, the solder paste 6 does not contact the surface of the printed board 2 and is supplied only into the blind through hole 1. Further, since a slight vibration is given by the vibrator 26, the solder paste 6 supplied into the blind through hole 1 is focused on the concave lower part. Next, with the printed circuit board 2 fixed to the substrate holder portion 22, only the metal mask 3a is removed from the metal mask holder portion 21, and the metal mask 3b is set again in the metal mask holder 21. Similar to the first printing operation, the metal mask holder drive unit 23 and the substrate holder drive unit 24 are driven for alignment. Next, the solder paste 6 is supplied onto the metal mask 3b, and the squeegee portion 25 is driven to supply the solder paste 6 to the printed board 2 through the metal mask 3b. As a result, the printed circuit board 2
Can enable filling of the solder paste 6 in the blind through hole 1 and supply of the optimum amount of the solder paste 6 to the surface mounting pattern 5. Further, the timing of activating the vibrator 26 according to the present invention may be during the printing work or after the printing work is completed. In particular, the activation of the vibrator 26 during the printing operation promotes the spread of the solder paste 6 from the metal mask 3 and includes a surplus effect of obtaining a good printing result. Although the present invention has been specifically described based on the above embodiments, the present invention can of course be variously modified without being limited to the above embodiments.
【０００７】[0007]
【発明の効果】以上、説明したように本発明によれば、
ブラインドスルーホールを持つ表面実装プリント基板へ
のはんだペースト印刷作業においてブラインドスルーホ
ール内にはんだペーストを振るいこむので、高確立でブ
ラインドスルーホールへの充填を行うことができ、常に
高品質のはんだ付け接続が得られるといった効果があ
る。As described above, according to the present invention,
Solder paste is printed into the blind through-holes during the solder paste printing work on the surface mount printed circuit board with blind through-holes, so the blind through-holes can be filled with a high degree of reliability, and high-quality soldered connections are always made. Is obtained.
【図１】ブラインドスルーホールを有するプリント基板
の概略図である。FIG. 1 is a schematic view of a printed circuit board having a blind through hole.
【図２】（ａ）ブラインドスルーホール部のみ開口した
メタルマスクである。（ｂ）ブラインドスルーホール及
び表面実装パターン部全てを開口したメタルマスクであ
る。FIG. 2A is a metal mask in which only blind through holes are opened. (B) A metal mask in which all blind through holes and surface mounting pattern portions are opened.
【図３】はんだペースト印刷機の概略図である。FIG. 3 is a schematic view of a solder paste printing machine.
１…ブラインドスルーホール、 ２…プリント基板、
３…銅パット、４…メタルマスク、４ａ…ブラインドス
ルーホール部のみ開口させたメタルマスク、４ｂ…ブラ
インドスルーホール部及び表面実装パターン部全てを開
口させたメタルマスク、５…表面実装用パターン、
６…はんだペースト、１１…はんだペースト印刷機、
２１…メタルマスクホルダー部、２２…基板ホルダー
部、 ２３…メタルマスクホルダー駆動部、２４
…基板ホルダー駆動部、 ２５…スキージ部、２６…
振動子部、 ２７…制御部。1 ... Blind through hole, 2 ... Printed circuit board,
3 ... Copper pad, 4 ... Metal mask, 4a ... Metal mask opened only in blind through holes, 4b ... Metal mask opened in all blind through holes and surface mounting pattern parts, 5 ... Surface mounting pattern,
6 ... Solder paste, 11 ... Solder paste printing machine,
21 ... Metal mask holder part, 22 ... Substrate holder part, 23 ... Metal mask holder drive part, 24
... Substrate holder drive part, 25 ... Squeegee part, 26 ...
Transducer part, 27 ... Control part.
Claims (2)
の非貫通穴にはんだペーストを供給する方法において、
はんだペースト印刷作業中もしくは、はんだペースト印
刷作業終了後にプリント基板に超音波もしくはバイブレ
ータ等で微振動を与える機構を有することを特徴とする
はんだペースト印刷機。1. A method of supplying a solder paste to a non-through hole such as a blind through hole of a printed circuit board,
A solder paste printing machine having a mechanism for applying a slight vibration to the printed circuit board by ultrasonic waves or a vibrator during the solder paste printing operation or after the solder paste printing operation is completed.
いて、プリント基板のブラインドスルーホール等非貫通
穴より小さい開口径（開口面積）を持つメタルマスクと
ブラインドスルーホール等非貫通穴と同じか弱冠大きい
程度の開口径（開口面積）を持つメタルマスクの２種類
を有し、開口径（開口面積）の小さいメタルマスク・開
口径（開口面積）の同じか弱冠大きいメタルマスクの順
で１枚のプリント基板を２回はんだペースト印刷作業す
ることを特徴とするブラインドスルーホール等非貫通穴
のはんだペースト印刷方法。2. The solder paste printing machine according to claim 1, wherein a metal mask having an opening diameter (opening area) smaller than a blind through hole such as a blind through hole of a printed circuit board and a blind through hole such as a blind mask are the same or weak. There are two types of metal masks with a large opening diameter (opening area), one with a small opening diameter (opening area) and one with the same opening diameter (opening area) or a large weak mask. A solder paste printing method for a non-through hole such as a blind through hole, which comprises performing solder paste printing on the printed circuit board twice.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8794996A JPH09283910A (en) | 1996-04-10 | 1996-04-10 | Solder paste hole-filling printer and printing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8794996A JPH09283910A (en) | 1996-04-10 | 1996-04-10 | Solder paste hole-filling printer and printing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09283910A true JPH09283910A (en) | 1997-10-31 |
Family
ID=13929147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8794996A Pending JPH09283910A (en) | 1996-04-10 | 1996-04-10 | Solder paste hole-filling printer and printing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09283910A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007073918A (en) * | 2005-09-02 | 2007-03-22 | Napura:Kk | Method of filling piercing hole or non-piercing hole formed in multilayer circuit board or wafer with filler |
| DE102016006813A1 (en) * | 2016-06-03 | 2017-12-07 | Häusermann GmbH | Method for producing a multi-layer printed circuit board with contacting of inner layers and multi-layer printed circuit board and plant for production |
| KR20200072527A (en) | 2018-10-31 | 2020-06-22 | 마이크로·텍 가부시끼가이샤 | Vibration device, vibration method, screen printing device, vibration input device and material handling device |
-
1996
- 1996-04-10 JP JP8794996A patent/JPH09283910A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007073918A (en) * | 2005-09-02 | 2007-03-22 | Napura:Kk | Method of filling piercing hole or non-piercing hole formed in multilayer circuit board or wafer with filler |
| DE102016006813A1 (en) * | 2016-06-03 | 2017-12-07 | Häusermann GmbH | Method for producing a multi-layer printed circuit board with contacting of inner layers and multi-layer printed circuit board and plant for production |
| DE102016006813B4 (en) * | 2016-06-03 | 2021-04-08 | Ksg Austria Gmbh | Process for the production of a multilayer printed circuit board with contacting of inner layers as well as multilayer printed circuit board |
| KR20200072527A (en) | 2018-10-31 | 2020-06-22 | 마이크로·텍 가부시끼가이샤 | Vibration device, vibration method, screen printing device, vibration input device and material handling device |
| KR20210134084A (en) | 2018-10-31 | 2021-11-08 | 마이크로·텍 가부시끼가이샤 | Vibration device, vibration method, and vibration transfer device |
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