TWI252137B - A dust cleaner applied to a process chamber - Google Patents

A dust cleaner applied to a process chamber Download PDF

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Publication number
TWI252137B
TWI252137B TW093116156A TW93116156A TWI252137B TW I252137 B TWI252137 B TW I252137B TW 093116156 A TW093116156 A TW 093116156A TW 93116156 A TW93116156 A TW 93116156A TW I252137 B TWI252137 B TW I252137B
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TW
Taiwan
Prior art keywords
dust
chamber
dust collecting
process chamber
negative pressure
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TW093116156A
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Chinese (zh)
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TW200539960A (en
Inventor
Kun-Ming Lin
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Au Optronics Corp
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Application filed by Au Optronics Corp filed Critical Au Optronics Corp
Priority to TW093116156A priority Critical patent/TWI252137B/en
Priority to US11/088,813 priority patent/US20050269032A1/en
Publication of TW200539960A publication Critical patent/TW200539960A/en
Application granted granted Critical
Publication of TWI252137B publication Critical patent/TWI252137B/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28GCLEANING OF INTERNAL OR EXTERNAL SURFACES OF HEAT-EXCHANGE OR HEAT-TRANSFER CONDUITS, e.g. WATER TUBES OR BOILERS
    • F28G13/00Appliances or processes not covered by groups F28G1/00 - F28G11/00; Combinations of appliances or processes covered by groups F28G1/00 - F28G11/00
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00Cleaning by methods involving the use of air flow or gas flow
    • B08B5/04Cleaning by suction, with or without auxiliary action

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning In General (AREA)

Abstract

A dust cleaner applied to a process chamber having a hot plate comprises a dust-collecting cabin, and a vacuum pipe. The dust-collecting cabin comprising a dust-collecting gap and a vent is disposed above the hot plate, and the vacuum pipe is connected with the vent. The suction force in the vacuum pipe will draw out the particles on the hot plate through the dust-collecting gap of the cabin and drain them out of the process chamber through the vent and the vacuum pipe.

Description

1252137 五、發明說明α) 【發明所屬之技術領域】 本發明是有關於一種除塵裝置, 對製程反應室之加熱板表面進行清潔之除塵裝置種可自動 【先前技術】 在液晶平面顯示器的製程中,其中 程,主要是透過影像蝕刻等製程技庫^形成過 板上,來製成所需的配線電路。τ重後地應用在玻璃基 上述的影像蝕刻技術,主要程序即為、先、事美把本& ^以曝光及顯影,依需:i;;r=(:rebake) 進行固烤(Post bake),最後/刀&域的光阻劑’再 電路圖案。 仃飿刻,而形成所需要的 其中,光阻劑原為一種黏 光阻劑的塗佈完成後,尚須1 中的溶劑,使其乾燥成為固化 附著力。 稠狀的高分子化合物,故在 以進行前期烘烤,以去除其 薄膜,以增加對基板表面的1252137 V. INSTRUCTION DESCRIPTION α) [Technical Field] The present invention relates to a dust removing device, and the dust removing device for cleaning the surface of the heating plate of the process reaction chamber can be automatically [prior art] in the process of liquid crystal flat panel display In the process, the process is mainly formed by a process library such as image etching to form a desired wiring circuit. After τ heavy application in the glass-based image etching technology, the main program is, first, the United States to the present & ^ exposure and development, as needed: i;; r = (: rebake) for solid baking (Post Bake), the last / knife & field of photoresist 're-circuit pattern. The engraving is required for the formation. After the photoresist is originally applied as a photoresist, the solvent in 1 is required to dry to become a curing adhesion. a thick polymer compound, so it is pre-baked to remove its film to increase the surface of the substrate.

而在光阻顯影成像後 其目的在除去剩餘之溶齊1及更高的溫度,進行固烤, 間結合更緊密,以掸 7氣,使未溶解之光阻劑分子 著力,& A~ 0九阻對熱之穩定性及底層物質之附 ’々’成馮更%定的社播 …構體,以利進行後續的蝕刻製程。After the photoresist development imaging, the purpose is to remove the remaining melting temperature 1 and higher, to perform solid baking, and the bonding is more tight, so that the undissolved photoresist molecules are focused, & A~ 0 nine resistance to the stability of the heat and the attachment of the underlying material '々' into a more condensed ... body structure, in order to facilitate the subsequent etching process.

1252137 五、發明說明(2) 請參閱圖一 A,i你么曰& π 古$叙y ,、係為目則習知的烘烤機1之示意圖,其罝 個光阻劑烘烤反應室1〇,當玻璃基板在重佈光F且劑 :或、=顯影成像處理後反應室1 進仃烘烤。 r 圖一B係為光阻劑烘烤立 ΐ ;上侧並分別具有-開蓋式結㈣及m,當;离0 Λ入進行洪烤作業日夺,即打開前側的開蓋式。 12^,由此處送入玻璃基板13,進烤 構 ;!者業的進行,加熱板表面會逐漸殘留有髒污微 劑的粉末或是作業環 於光略,便可能 庄思維持加熱板的清潔。 曰双肩 斜德=多閱圖一A ’其係為習知之清潔技術示意圖,當要 Γ ;;ΠΓ;:ί將光阻劑洪烤反應室10從棋烤機1 ,以人員手持吸塵器具16吸取加熱板η表面 或以!塵布沾取酒精加以擦栻,以維持其清潔。 :、而’隨著玻璃基板的尺寸*求逐漸的加大 也必須隨之加大’烘烤機的高度也越來越高。,、、、板面私1252137 V. Description of invention (2) Please refer to Figure 1A, i 曰 曰 & π 古 $ y y , , is a schematic diagram of the baking machine 1 , which is a conventional photoresist baking reaction In the chamber, the reaction chamber 1 is baked after the glass substrate is re-coated with light F and the agent: or = development image processing. r Figure 1B is a photoresist baking ΐ; the upper side has an open-cap type knot (4) and m, respectively; when it is off from 0, it is opened for the bake operation, that is, the open side of the front side is opened. 12^, from here to the glass substrate 13, into the baking structure;! The industry's progress, the surface of the heating plate will gradually leave the powder of the dirty micro-agent or the operating ring in the light, it may be Zhuangsi to maintain the heating plate Clean.曰 曰 = = = 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 ' 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多 多Draw the surface of the heating plate η or to! Wipe the cloth with alcohol to keep it clean. :, and 'As the size of the glass substrate is gradually increased, it must be increased. The height of the baking machine is also increasing. ,,,, board private

12521371252137

1252137 五、發明說明(4) 2 ·人員清掃時,因高度及角度皆受到限制,容易產生 清潔的死角,並且人員亦為發塵源之一,這些因素會使得 清潔效率不佳,增加使落塵微粒沾染在光阻層的機會,造 成良率下降。 因此,對於從事此相關清潔領域之研發人員而言,莫 不致力於解決習知技術之缺點,以期能夠獲得同時提昇效 率及安全性的清潔技術。 【發明内容】 本發明之一目的在於提供一製程反應室之除塵裝置, 能自動對加熱板表面進行清潔。 本發明之另一目的在於提供一製程反應室之除塵裝 置,能提高加熱板表面的清潔效率。 為達成上述之目的,本發明所揭露之除塵裝置,係適 用於一具有加熱板之製程反應室。其包括一集塵艙,一負 壓管路。 集塵艙係設於該加熱板上方,具有至少一集塵口以及 一排氣口。集塵艙之形狀可後所需,設計為各種形狀大 小。並因製程反應室中係長時間維持高溫作業,故集塵艙 係以财熱材料製成,如金屬、陶瓷等材料。1252137 V. INSTRUCTIONS (4) 2 · When cleaning personnel, the height and angle are limited, it is easy to produce a clean dead corner, and the personnel are also one of the dust sources. These factors will make the cleaning efficiency poor and increase the dust. The chance of particles contaminating the photoresist layer causes a drop in yield. Therefore, R&D personnel engaged in this related cleaning field are not committed to solving the shortcomings of the prior art, in order to obtain clean technology that simultaneously improves efficiency and safety. SUMMARY OF THE INVENTION One object of the present invention is to provide a dust removal device for a process chamber that automatically cleans the surface of the heating plate. Another object of the present invention is to provide a dust removal device for a process chamber which improves the cleaning efficiency of the surface of the heater plate. In order to achieve the above object, the dust removing device disclosed in the present invention is suitable for a process chamber having a heating plate. It consists of a dust chamber and a negative pressure line. The dust collecting chamber is disposed above the heating plate and has at least one dust collecting port and one exhaust port. The shape of the dust collection compartment is available in a variety of shapes and sizes. Because the process chamber is maintained at a high temperature for a long time, the dust collection chamber is made of financial materials such as metals and ceramics.

1252137 五、發明說明(5) 負壓管路係與集塵艙之排氣口相連接。並可在製程反 應室之二側分別設置一導引結構,導引結構可以為滑執、 導桿或與其等效之結構,利用導引結構與集塵艙之二端互 相配合,並藉由一驅動單元驅動集塵艙依導引結構所提供 之導引路徑移動。 集塵艙須時常改變作業位置,導致負壓管路將不斷伸 縮折曲,故負壓管路係以撓性管製成,以防止管路發生破 裂。 在製程反應作業中,當加熱板表面逐漸附著髒污微 粒,而需要進行清潔時,藉由負壓管路所產生之吸力,將 加熱板表面之癖污微粒,由集塵艙之集塵口吸入,並由集 塵艙之排氣口排入至負壓管路内,藉由負壓管路將髒污微 粒輸送到製程反應室外,並且在清潔的過程中,利用驅動 單元持續改變集塵艙的作業位置,全面清潔加熱板。 為使本發明之優點及精神能有更進一步的被揭示,茲 配合圖式作一詳細說明如后。 【實施方式】 ’ 請參閱圖三A及三B,其係為本發明之第一實施例之結 構示意圖。1252137 V. INSTRUCTIONS (5) The negative pressure piping is connected to the exhaust port of the dust collection compartment. A guiding structure may be respectively disposed on two sides of the process reaction chamber, and the guiding structure may be a sliding handle, a guiding rod or an equivalent structure thereof, and the guiding structure is matched with the two ends of the dust collecting chamber, and by A drive unit drives the dust collection chamber to move according to a guiding path provided by the guiding structure. The dust compartment must change the working position from time to time, resulting in the negative pressure pipeline will continue to stretch and bend, so the negative pressure pipeline is made of flexible pipe to prevent the pipeline from breaking. In the process reaction operation, when the surface of the heating plate gradually adheres to the dirt particles and needs to be cleaned, the dirt generated on the surface of the heating plate is sucked by the suction force generated by the negative pressure pipe, and the dust collecting port of the dust collecting chamber is used. Inhaled, and discharged into the negative pressure pipeline from the exhaust port of the dust collection chamber, the dirty particles are transported to the outside of the process reaction chamber by the negative pressure pipeline, and the dust collection is continuously changed by the driving unit during the cleaning process. The working position of the cabin, the heating plate is completely cleaned. In order to make the advantages and spirit of the present invention further disclosed, a detailed description will be made in conjunction with the drawings. [Embodiment] Please refer to Figs. 3A and 3B, which are schematic views of the structure of the first embodiment of the present invention.

第10頁 1252137Page 10 1252137

本實施例之# 劑烘烤反應室内:之除跑,係設置於-光阻 可加熱空氣,烘烤^劑烘烤反應室10具有一加熱板11 坡螭基板表面的光阻劑。 本除塵裝置包括有一集 引結構23以及一驅動單元μ 上方,為金屬材料所事成, 具有一為狹縫狀開d之集塵 氣口 2 1 2。 木 塵艙21、一負壓管路22、一導 。集塵搶2 1設置於加熱板1 1的 其係為一柱狀艙體21a,下方 口 2 11,二側並分別設有二排 負壓管路22係為w^ 垃认、主初士 L 马&性官’其分別與二排氣口 2 1 2相連 接,於清潔時提供歿夬水、店 ^ ^ ^ 0 ^ 1 π ^ 及力末源。而在實務中,考慮光阻劑烘 烤反應至1 0係為一馆作4士…a .^ 貝保持穩疋狀態的腔室,若負壓管路2 2 ”、、书汗、,二將影響光阻劑烘烤反應室1 0内的溫度平衡, 故可於,£ &路2 2内安裝一電磁閥(圖中未示)或與其等效 之開關衣置使負壓管路2 2為常閉狀態,僅於進行清潔時 導通。 導引結構23係為二滑槽23a、23b,設置於光阻劑烘烤 反應f之二侧,並與集塵艙二端滑動配合。 驅動單兀24設置於集塵艙21芝一端,驅動集塵艙21依導引 結構23所提供之導弓丨路徑χ方向移動。The agent baking reaction chamber of the present embodiment: in addition to running, is disposed in the - photoresist heatable air, and the baking agent baking reaction chamber 10 has a heating plate 11 to polish the surface of the substrate. The dust removing device comprises a collecting structure 23 and a driving unit μ, which is made of a metal material, and has a dust collecting port 2 1 2 which is a slit-shaped opening d. The dust chamber 21, a negative pressure line 22, and a guide. Dust collection 2 1 is set on the heating plate 1 1 is a columnar cabin 21a, the lower port 2 11, two sides and respectively have two rows of negative pressure pipeline 22 is w^ L Ma & Sex Official' is connected to the two exhaust ports 2 1 2, providing water, shop ^ ^ ^ 0 ^ 1 π ^ and end source when cleaning. In practice, consider the photoresist baking reaction to 10 0 for a library for 4 士 ... a . ^ shell to maintain a stable state of the chamber, if the negative pressure pipeline 2 2 ”,, book sweat, two It will affect the temperature balance in the photoresist baking reaction chamber 10, so a solenoid valve (not shown) or equivalent switch can be installed in the <2> 2 2 is a normally closed state, and is only turned on during cleaning. The guiding structure 23 is a two-slot 23a, 23b disposed on the two sides of the photoresist baking reaction f, and is slidably engaged with the two ends of the dust collecting chamber. The driving unit 24 is disposed at one end of the dust collecting chamber 21, and drives the dust collecting chamber 21 to move in the direction of the guiding bow path provided by the guiding structure 23.

第11頁 1252137Page 11 1252137

五、發明說明(7) 、_而在光阻剤烘烤作業中,加熱板1 1 > 巧微粒14。如圖三C所示,當加熱板需要表:會逐漸附著辦 通負壓管路22 ’其所產生之吸力將加執要二行清潔時’導 粒14 ’由集塵艙21之集塵口211吸入H11表面之辦污微 氣口 212排入至負壓管路22内,並藉由負:J塵艙21之排 微粒1 4排出光阻劑烘烤反應室1 〇外。' i s路2將辨巧 元2 4持續驅動集塵艙 改變集塵口 2 11位 21 置 並且在清潔的同時,利用驅動單 在滑槽2 3 a、2 3 b内以X方向滑動 以全面清潔加熱板11。 請參閱圖四A,其係為本發明之第二實施例之結構示 意圖。 本實施例之製程反應室之除塵装置中,與上述第一實 施例相同的元件以相同的標號表示。本實施例中特別的 是,設置於力c熱板11上方之集塵艙21為一平板狀艙體 2 1 b,其底面、積與加熱板11面積相同,並具有複數個集塵 口 2 11,二侧旅分別設有二排氣口 2 1 2。 請參閱圖四B,當加熱板11需要進行清潔時,導通負 壓管路2 2,其所產生之吸力蔣加熱板1 1表面之髒污微粒 14,由集塵搶之集塵口 211吸入,並由集塵艙21之排氣 口 212排入負壓管路22内’藉由負壓管路22將髒污微粒145. Invention Description (7), _ In the photoresist baking operation, the heating plate 1 1 > As shown in Figure 3C, when the heating plate needs a table: it will gradually adhere to the negative pressure line 22', and the suction force generated by it will be added to the two lines of cleaning when the 'guide grain 14' is collected by the dust collection chamber 21. The venting micro gas port 212 of the port 211 sucking into the surface of the H11 is discharged into the negative pressure line 22, and is discharged from the reaction chamber 1 by the negative particles 14 of the negative: J dust chamber 21. 'is road 2 will continue to drive the dust box to change the dust collection port 2 11 position 21 and while cleaning, use the drive single to slide in the X direction in the chute 2 3 a, 2 3 b to comprehensive Clean the heating plate 11. Please refer to FIG. 4A, which is a schematic structural view of a second embodiment of the present invention. In the dust removing device of the process chamber of the present embodiment, the same elements as those of the above-described first embodiment are denoted by the same reference numerals. In this embodiment, in particular, the dust collecting chamber 21 disposed above the force c hot plate 11 is a flat box body 2 1 b having a bottom surface and a same area as the heating plate 11 and having a plurality of dust collecting ports 2 11, the two side brigade has two exhaust ports 2 1 2 respectively. Referring to FIG. 4B, when the heating plate 11 needs to be cleaned, the negative pressure pipeline 22 is turned on, and the suction particles generated by the suction heating plate 11 are sucked by the dust collection 211. And discharged into the negative pressure line 22 from the exhaust port 212 of the dust collecting chamber 21'. The dirty particles 14 are collected by the negative pressure line 22.

第12頁 1252137Page 12 1252137

由於集塵艙21之底面積與加熱 不須移動集塵艙21,即可將加熱板 面積大小相同 微粒14吸起,達到清潔除塵的目的。^面不同位置的髒、、亏 綜觀上述說明 顯具有以下優點·· 1 ·利用本發明 依賴人員使用梯子 業環境的危險性。 2 ·因本發明之 光阻劑烘烤反應室 亦不須耗費時間等 潔過程所需浪費的 3 ·本發明之製 面髒污微粒抽離製 於加熱板各個位置 面積之集塵艙來吸 外,與習知技術相 的清潔時間,故可 不須顧慮影響產出 潔。 ,本發明 之製程反 及吸塵器 製程反應 從機台拉 待加熱板 時間’而 程反應室 程反應室 進行清潔 取髒污, 較’本發 隨時視加 效率,故 之製裎反應室 應室之险_ y <除塵裝 〃、來進行進行 室之除 出,及 降溫至 之除塵 ’並利 作業, 故沒有 明之裝 熱板表 可確實 之除塵裝置,明 ^ 便不再需要 b潔,可降低作 塵骏置 開蓋進 室溫, 阻烘烤 裝置可 用驅動 或是利 凊潔死 置可大 面髒污 4呆持加 可省略 行清潔 故可有 機的產 有效將 X3U 早元的 用與加 角的困 幅減少 情況進 熱板表 人員須垌 專動作, 效減少讀 出效率。 加熱板表 作動,q 熱板相同 擾,此 所需耗費 行清潔, 面之清Since the bottom area and the heating of the dust collecting chamber 21 do not need to move the dust collecting chamber 21, the particles of the same size of the heating plate can be sucked up to achieve the purpose of cleaning and dust removal. ^Dirty and deficient at different positions. The above description has the following advantages: 1. The use of the present invention relies on the danger of the ladder environment. 2) The photoresist baking reaction chamber of the present invention does not need to be time-consuming and wastes the cleaning process. 3. The dirty particles of the surface of the present invention are extracted from the dust collecting chamber of each position of the heating plate to be sucked. In addition, the cleaning time with the prior art can eliminate the need to affect the output. The process of the invention is opposite to the process of the vacuum cleaner, and the process of pulling the heating plate from the machine is carried out. The process chamber of the reaction chamber is cleaned and dirty, and the efficiency is higher than that of the present invention. Risk _ y <dust removal, to carry out the removal of the room, and to reduce the dust to the 'dusting operation, so there is no clear hot plate table can be sure of the dust removal device, Ming ^ no longer need b clean, can Reduce the dust to open the cover and enter the room temperature, the resistance baking device can be driven or the cleaning can be used to make the large surface dirty 4 stay plus can be omitted to clean the organic product can effectively use X3U early yuan The increase in the angle of the angle is reduced. The personnel in the hot plate table must perform special actions to reduce the reading efficiency. The heating plate is actuated, and the q hot plate is the same, which requires cleaning and cleaning.

1252137 五、發明說明(9) 以上所述僅為本發明之實施例,其並非用以限制本發 明之實施範圍,任何熟習該項技藝者在不違背本發明之精 神所作之修改均應屬於本發明之範圍,因此本發明之保護 範圍當以下列所述之申請範圍為依據。1252137 V. INSTRUCTIONS (9) The above is only an embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification made by those skilled in the art without departing from the spirit of the present invention The scope of the invention is therefore based on the scope of the application described below.

第14頁 1252137 圖式簡單說明 圖一 A係為烘烤機示意圖。 圖一 B係為光阻劑烘烤反應室之示意圖。 圖二A、圖二B係為習知之清潔技術示意圖。 圖三A、圖三B係為本發明之第一實施例之結構示意圖。 圖三C係為本發明之第一實施例之清潔過程示意圖。 圖四A係為本發明之第二實施例之結構示意圖。 圖四B係為本發明之第二實施例之清潔過程示意圖。Page 14 1252137 Brief description of the diagram Figure 1 is a schematic diagram of the baking machine. Figure 1 B is a schematic diagram of a photoresist baking reaction chamber. Figure 2A and Figure 2B are schematic diagrams of conventional cleaning techniques. FIG. 3A and FIG. 3B are schematic diagrams showing the structure of the first embodiment of the present invention. Figure 3C is a schematic view of the cleaning process of the first embodiment of the present invention. Figure 4A is a schematic structural view of a second embodiment of the present invention. Figure 4B is a schematic view of the cleaning process of the second embodiment of the present invention.

圖式之圖號說明: 2 1 a柱狀艙體 2 1 b平板狀艙體 21 1集塵口 2 1 2排氣口 22負壓管路 2 3導引結構 2 3 a滑槽 2 3b滑槽 2 4驅動單元Description of the figure: 2 1 a columnar cabin 2 1 b flat tank 21 1 dust collecting port 2 1 2 exhaust port 22 negative pressure pipe 2 3 guiding structure 2 3 a chute 2 3b sliding Slot 2 4 drive unit

1烘烤機 1 0光阻劑烘烤反應室 1 1加熱板 1 2 a開蓋式結構 1 2 b開蓋式結構 1 3玻璃基板 1 4髒污微粒 15人員 1 6吸塵器具 21集塵艙1 baking machine 1 0 photoresist baking reaction chamber 1 1 heating plate 1 2 a open lid structure 1 2 b open lid structure 1 3 glass substrate 1 4 dirty particles 15 personnel 1 6 vacuum cleaner 21 dust chamber

第15頁Page 15

Claims (1)

1252137 六、申請專利範圍 1. 一種製程反應室之除塵裝置,該製程反應室具有一加熱 板,該除塵裝置包括: 一集塵艙,係設於該加熱板上方,具有至少一集塵口 及一排氣口;以及 一負壓管路,係與該集塵艙之排氣口相連接; 當該除塵裝置在進行清潔時,係藉由該負壓管路所產 生之吸力,將該加熱板表面附著之髒污微粒由該集塵艙之 集塵口吸入,再經由該排氣口和該負壓管路排至該製程反 應室外。 2. 如申請專利範圍第1項所述之製程反應室之除塵裝置, 其中該製程反應室之二侧分別設有一導引結構,該集塵艙 之二端係與該導引結構互相配合,並利用一驅動單元驅動 該集塵艙依該導引結構所提供之導引路徑移動。 3. 如申請專利範圍第1項所述之製程反應室之除塵裝置, 其中該集塵口係為一狹縫開口。 4. 如申請專利範圍第1項所述之製程反應室之除塵裝置, 其中該集塵艙係為一平板狀搶體,其底面積與該加熱板的 面積相同,並具有複數個集塵口。 5. 如申請專利範圍第1項所述之製程反應室之除塵裝置, 其中該負壓管路係為一撓性管。1252137 6. Patent application scope 1. A dust removal device for a process chamber, the process chamber has a heating plate, and the dust removal device comprises: a dust collection chamber, which is disposed above the heating plate and has at least one dust collecting port and a venting port; and a negative pressure line connected to the exhaust port of the dust collecting chamber; when the dust removing device is performing cleaning, the heating is generated by the suction force generated by the negative pressure line The dirt particles adhering to the surface of the board are sucked by the dust collecting port of the dust collecting chamber, and then discharged to the outside of the process reaction chamber through the exhaust port and the negative pressure line. 2. The dust removing device of the process chamber according to claim 1, wherein the two sides of the process chamber are respectively provided with a guiding structure, and the two ends of the dust collecting chamber cooperate with the guiding structure. And driving the dust collecting chamber according to the guiding path provided by the guiding structure by using a driving unit. 3. The dust removing device of the process chamber according to claim 1, wherein the dust collecting port is a slit opening. 4. The dust removing device of the process chamber according to claim 1, wherein the dust collecting chamber is a flat body, the bottom area of which is the same as the area of the heating plate, and has a plurality of dust collecting ports. . 5. The dust removal device of the process chamber according to claim 1, wherein the negative pressure line is a flexible tube. 第16頁 1252137 六、申請專利範圍 6.如申請專利範圍第1項所述之製程反應室之除塵裝置, 其中該製程反應室係為光阻劑烘烤反應室。 7 ·如申請專利範圍第1項所述之製程反應室之除塵裝置, 其中該集塵艙係以耐熱材料製成。 8. —種具有除塵功能之製程反應室,其包括: 一加熱板,可加熱空氣以進行製程中所需反應; 一集塵艙,係設於該加熱板上方,具有至少一集塵口 以及一排氣口;以及 一負壓管路,係與該集塵艙之排氣口相連接; 當該製程反應室在進行清潔時,藉由該負壓管路所產 生之吸力,將該加熱板表面附著之髒污微粒由該集塵艙之 集塵口吸入,並經由該排氣口和該負壓管路排至該製程反 應室外。 9. 如申請專利範圍第8項所述之具有除塵功能之製程反應 室,其中該製程反應室更包括: 一導引結構,該集塵艙之二端係與該導引結構互相配 合; 一驅動單元,可驅動該_塵艙依該導引結構所提供之 導引路徑移動。Page 16 1252137 VI. Patent Application Range 6. The dust removal device of the process chamber according to claim 1, wherein the process reaction chamber is a photoresist baking reaction chamber. 7. The dust removing device of the process chamber according to claim 1, wherein the dust collecting chamber is made of a heat resistant material. 8. A process chamber having a dust removal function, comprising: a heating plate for heating air to perform a reaction required in the process; a dust collecting chamber disposed above the heating plate and having at least one dust collecting port An exhaust port; and a negative pressure line connected to the exhaust port of the dust collecting chamber; when the process chamber is being cleaned, the heating is generated by the suction generated by the negative pressure line The dirt particles adhering to the surface of the board are sucked by the dust collecting port of the dust collecting chamber, and are discharged to the outside of the process reaction chamber through the exhaust port and the negative pressure line. 9. The process chamber having a dust removal function according to claim 8, wherein the process chamber further comprises: a guiding structure, the two ends of the dust collecting chamber and the guiding structure cooperate with each other; The driving unit can drive the dust chamber to move according to the guiding path provided by the guiding structure. 第17頁 1252137 々、申請專利範圍 1 〇.如申請專利範圍第8項所述之具有除塵功能之製程反應 室,其中該集塵口係為一狹缝開口。 11.如申請專利範圍第8項所述之具有除塵功能之製程反應 室,其中該集塵艙係為一平板狀艙體,其底面積與該加熱 板的面積相同,並具有複數個集塵口。 1 2.如申請專利範圍第8項所述之具有除塵功能之製程反應 室,其中該負壓管路係為一撓性管。 1 3 ·如申請專利範圍第8項所述之具有除塵功能之製程反應 室,其中該製程反應室係為光阻劑烘烤反應室。 1 4.如申請專利範圍第8項所述之製程反應室之除塵裝置, 其中該集塵艙係以耐熱材料製成。Page 17 1252137 々 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 申请 制 制 制 制 制 制 制 制 制 制 制 制 制 制 制 制 制 。 。 。 。 。 。 。 。 。 。 。 。 11. The process chamber having a dust removal function according to claim 8, wherein the dust collection chamber is a flat tank having a bottom area equal to the area of the heating plate and having a plurality of dust collection spaces. mouth. 1 2. The process chamber having a dust removal function according to claim 8, wherein the negative pressure line is a flexible tube. 1 3 The process chamber having a dust removing function as described in claim 8 wherein the process chamber is a photoresist baking reaction chamber. The dust removing device of the process chamber according to claim 8, wherein the dust collecting chamber is made of a heat resistant material. 第18頁Page 18
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US6082379A (en) * 1999-09-07 2000-07-04 Advanced Micro Devices, Inc. Mechanism for cleaning an integrated circuit wafer hot plate while the hot plate is at operating temperature
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