TWI250932B - Aluminum lid with high heat dissipation and lubrication features for use in drilling and method for making the same - Google Patents
Aluminum lid with high heat dissipation and lubrication features for use in drilling and method for making the same Download PDFInfo
- Publication number
- TWI250932B TWI250932B TW94113851A TW94113851A TWI250932B TW I250932 B TWI250932 B TW I250932B TW 94113851 A TW94113851 A TW 94113851A TW 94113851 A TW94113851 A TW 94113851A TW I250932 B TWI250932 B TW I250932B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- composite material
- drilling
- heat dissipation
- making
- Prior art date
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title abstract 4
- 229910052782 aluminium Inorganic materials 0.000 title abstract 4
- 238000005553 drilling Methods 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 3
- 230000017525 heat dissipation Effects 0.000 title abstract 2
- 238000005461 lubrication Methods 0.000 title abstract 2
- 239000002131 composite material Substances 0.000 abstract 4
- 239000000314 lubricant Substances 0.000 abstract 4
- 239000011162 core material Substances 0.000 abstract 2
- 239000011888 foil Substances 0.000 abstract 2
- 229920001223 polyethylene glycol Polymers 0.000 abstract 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000002202 Polyethylene glycol Substances 0.000 abstract 1
- 239000000872 buffer Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 239000004846 water-soluble epoxy resin Substances 0.000 abstract 1
Landscapes
- Drilling And Boring (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94113851A TWI250932B (en) | 2005-04-29 | 2005-04-29 | Aluminum lid with high heat dissipation and lubrication features for use in drilling and method for making the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94113851A TWI250932B (en) | 2005-04-29 | 2005-04-29 | Aluminum lid with high heat dissipation and lubrication features for use in drilling and method for making the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI250932B true TWI250932B (en) | 2006-03-11 |
TW200637723A TW200637723A (en) | 2006-11-01 |
Family
ID=37433466
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94113851A TWI250932B (en) | 2005-04-29 | 2005-04-29 | Aluminum lid with high heat dissipation and lubrication features for use in drilling and method for making the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI250932B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100478131C (zh) * | 2006-04-11 | 2009-04-15 | 合正科技股份有限公司 | 高速钻孔用散热辅助板材 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI560049B (en) * | 2014-10-15 | 2016-12-01 | Uniplus Electronics Co Ltd | A drilling entry board |
-
2005
- 2005-04-29 TW TW94113851A patent/TWI250932B/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100478131C (zh) * | 2006-04-11 | 2009-04-15 | 合正科技股份有限公司 | 高速钻孔用散热辅助板材 |
Also Published As
Publication number | Publication date |
---|---|
TW200637723A (en) | 2006-11-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MY147688A (en) | Wafer-dicing adhesive tape and method of producing chips using the same | |
CN100531517C (zh) | 一种钻孔用高散热润滑铝质盖板 | |
NZ592965A (en) | Colored and laminated metal plate for container | |
AR057426A1 (es) | Composicion que comprende una poliolefina injertada con anhidrido de acido | |
ECSP13012604A (es) | Composiciones de cementación para pozos y métodos de preparación y uso de las mismas | |
WO2008102853A1 (ja) | エポキシ樹脂組成物、プリプレグ、積層板、及びプリント配線板 | |
MY144995A (en) | Copper alloy for electronic machinery and tools and method of producing the same | |
EP1359631A4 (en) | LAMINATE FOR USE AS ARMATION OF A CELL AND SECONDARY CELL | |
CN106739374B (zh) | 柔钻环保冷冲板以及该冷冲板工艺 | |
TW200718740A (en) | Compositions effective to suppress void formation | |
TWI250932B (en) | Aluminum lid with high heat dissipation and lubrication features for use in drilling and method for making the same | |
CN105505137B (zh) | 一种pcb钻孔用盖板及其制备方法 | |
CN105537090A (zh) | 涂层铝片以及制造该涂层铝片的工艺流程 | |
MY177387A (en) | Copper foil with attached carrier foil, method for manufacturing copper foil with attached carrier foil, and copper clad laminate board for laser beam drilling obtained by using copper foil with | |
CN103722805A (zh) | 一种高导热铝基覆铜板 | |
WO2007016398A3 (en) | Multi-layer barrier film structure | |
CN104661434A (zh) | 双面铝基板制作工艺 | |
TW200505619A (en) | Constituents of solder | |
CN105583889A (zh) | 钻孔用盖板 | |
CN208745002U (zh) | 钻孔加工用覆盖片 | |
MX2019014814A (es) | Pelicula multicapa y laminados que contienen agentes de deslizamiento. | |
TWI490272B (zh) | 水溶性組成物、鑽孔用蓋板及水溶性組成物的製作方法 | |
WO2007056664A3 (en) | Blow-molded composite compositions and methods | |
CN203126051U (zh) | 多层式钻孔用盖板 | |
JP3177296U (ja) | 両面に金属材を備える穴あけ作業用蓋板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MC4A | Revocation of granted patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |