1249826 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種與BGA或LGA等進行電連接的使用螺 旋接觸元件的連接裝置，特別是關於一種可以防止螺旋接 觸70件的變形或灰塵的侵入的使用螺旋接觸元件的連接裝 置。 ’ 【先前技術】 先前已開發出在封裝的上面或下面設置了例如bga(㈣ Grid Array :球狀接觸元件）或LGA(Land GHd :平面 狀接觸元件）等多個接觸元件的半導體等電子零件。爲了 檢查這種電子零件的性能，需要用於將上述接觸元件與設 於外部的電路基板上的接觸塾片連接的專用的治具，例如 先行技術文獻中已有以下的專利文獻丨等。 專利文獻1中記載有半導體檢查裝置，上述半導體檢查 裝置是將作爲被檢查零件的半導體與外部的電路基板等電 連接的裝置。上述半導體檢查裝置具有保持半導體的插 座，半導體能夠在插座上自由拆裝。在半導體的背面側設 有以格子狀或矩陣狀配置的多個球狀接觸元件。在上述插 座的底面設有絕緣基板，在該絕緣基板上具有與上述球狀 接觸元件相面對的多個凹部，在上述凹部内配置有沿朝向 上逑球狀接觸元件的方向成凸狀突出的螺旋接觸元件。 上述半導體檢查裝置中’當關閉設於插座側的蓋體後， 由於上述蓋體的内面將上述半導體向#近上述絕緣基板的 方向㈣’因此上述螺旋接觸元件就被上述球狀接觸元件 96018-941129.doc 1249826 的外表面向凹部内推入。此時，由於上述螺旋接觸元件在 捲繞成螺旋狀的同時與上述球狀接觸元件的外表面接觸， 因此各個球狀接觸元件與各個接觸墊片及經由上述各螺旋 接觸元件而被電連接。另外，通過敞開上述蓋體，就可以 利用上述螺旋接觸元件的彈性將上述半導體推回，並且可 以從插座内取出上述半導體。 [專利文獻1]日本特開2001-015236號公報 但是’上述專利文獻1所示的半導體檢查裝置中，當將 蓋體一直敞開後，設於上述插座内的絕緣基板上的螺旋接 觸元件就會保持向外部露出的狀態。 此時，當任何物體不小心地向上述插座内落下時，過大 的力就會作用而使上述螺旋接觸元件變形，從而有在螺旋 接觸元件和BGA或LGA之間産生接觸不良的問題。 另外’在將上述蓋體敞開的狀態下，灰塵容易侵入插座 内部’當灰塵附著在螺旋接觸元件上時，就會有難以輕易 地排除的問題。此外，當使用例如鑷子等工具將上述灰塵 強制性地去除時，與上述相同地，有可能因過大的力使上 述螺旋接觸元件産生變形。 【發明内容】 本發明係用於解決上述先前的問題的方案，目的在於提 供防止螺旋接觸元件的變形和灰塵的侵入而可以減少接觸 不良等問題的發生的使用螺旋接觸元件的連接裝置。 本發明係一種使用螺旋接觸元件的連接裝置，具有設置 了多個通孔的基板、及設於各個通孔上的螺旋接觸元件， 96018-941129.doc 1249826 並且設於電子零件上的多個外部連接部經由上述螺旋接觸 元件被連接，其特徵為： 在上述電子零件和基板之間，保護薄片係與上述基板相 面對地設置，該保護薄片上設有將各個螺旋接觸元件與各 個外部連接部直接或間接地連接的中繼機構。 本發明中，由於保護薄片可以保護上述基板，因此可以 防止設於基板上的螺旋接觸元件的變形和灰塵的侵入。 例如’上述中繼機構可以使用作爲形成於上述保護薄片 上的孔的請求項1上述的螺旋接觸元件。 或者，上述中繼機構是將在保護薄片的一方的面側與上 述螺旋接觸元件相面對地設置的平坦面，及在另一方的面 側與上述外部連接部相面對地設置的凸狀體—體化形成的 連接構件。 上述機構中’即使在基板的上部具有保護薄片，也可以 實現設於電子零件上的外部連接部和設於基板上的螺旋接 觸元件的電連接。 、另外，較佳為上述螺旋接觸元件具有形成於與上述外部 連接部相面對的位置上的筮 1上的第1螺旋接觸元件、及與上述電 子苓件的不具有外部連接 ^ ^ , 扪位置相面對而形成的第2螺 方疋接觸π件，上述第2螺旋 接觸元件。 觸讀支持上述保護薄片的 此時，上述第2螺旋接觸元件的 比上述第！螺旋接觸元件的高度尺寸高。土為成形為 另外，上述保護薄片較佳 " 與上述基板交又成垂直的 96018-941129.doc 1249826 方向上可自由移動地被支持者。 上述構成中，第2螺旋接勰；A 1 ^疋筏觸兀件可以彈性地支持 片，在安裝了電子零件時，保護薄 、' 俅邊溥片移動，而可以適宜的 ^力使第i螺旋接觸元件與設於電子零件上的外部連 :接觸°如此’即可以使上述第1螺旋接觸元件和外部 連接部之間的接觸狀態良好。 另卜“明係一種使用螺旋接觸元件之連接裝置，且 插座，其設置有安裝有具有多個外部連接: 件的裝填部；基板，盆嗖於μ、+、姑α古 电于^ 八 述裝填部内且設置有多個與 ^述外部連接部接觸而進行電連接的螺旋接觸元件，其特 被為： 在上述基板的上部侧且與上述多個螺旋接觸元件相面對 Γ位置上’設有具備多個半圓狀的半小孔並且在上述裝填 邛内相對移動的一對移動構件； 、 在上述電子零件被安裝在裝填部中之前的初始狀態下， 一方的移動構件的半小孔和另一方的移動構件的半小孔被 ,同也排列’防止上述螺旋接觸元件的完全露出； ^達到上述電子零件被安Μ料部巾的裝填狀態時， 上述移動構件相互朝相對方向移動，上述一方的移 動構件的半小孔β μg 述另一方的移動構件的半小孔被一體 =而形成多個小孔，藉此即可以將上述螺旋接觸元件 ’〔外連接部經由上述小孔連接。 ,上述的發明中，在安裝電子零件前的初始狀態下不形 ’、孔’而在安裝電子零件的同時形成小孔。由此，就可 96018-941129.doc 1249826 ' 〇 #也進行螺旋接觸元件的保護和連接時的連接動作。 另外’由於初始狀態下可以使螺旋接觸元件的露出度降 低口此可以有4地防止灰塵在螺旋接觸元件上的附著。 上述移動構件，可以採用如下構成：例如在上述移動構 件上’具有於與上述移動構件的移動方向正交的方向上隔 開特定的空間而排列的多個長方形的保護部、即在上述保 蒦。p的邊緣部沿著上述移動方向以特定的間距排列的半小 孔上述一方的移動構件的保護部被可自由移動地配置在 上述另一方的移動構件的空間内。 卜也可以採用如下構成：上述插座中，可自由轉動 地支持有將上述電子零件推心接近上職板的方向的蓋 ^…當從電子零件安裝在上述裝填部中的裝填狀態下關閉 述盍體時’使上述電子零件向與上述基板接近的方向移 =，上述螺旋接觸元件經由上述小孔而與上述外部連接部 連接。 上述機構中’能夠可靠地進行螺旋接觸元件和 的外部連接部的電連接 較佳的構成為設置有於使上 的移k冑㈣構件向相互接赶 的私動方向上施加彈性力的^施力構件。 上述機構中，在未裝填電子零 護螺旋接觸元件。 牛的初始“下’能夠倍 :外，較佳的構成為設置有將上述—對移動構件可自由 移動地支持的第2施力構件。 上述機構中，由於可以使電子愛 冤子零件的外部連接部可靠地 96018-941129.doc -10- 1249826 離開螺旋接觸元件，並且提升移動構件，因此可以將連接 裝置可靠地恢復到初始狀態或安裝狀態。 本發明中，由於不會將螺旋接觸元件主動地向外部露 出，因此過大的外力就難以作用於螺旋接觸元件。如此， 就可以防止螺旋接觸元件的變形。 另外，保護薄片可以防止灰塵的侵入。而且，積留在保 護薄片上的灰塵可以容易地去除。 【實施方式】 圖1係表示本發明的使用螺旋接觸元件的連接裝置的外 觀的立體圖。 圖1所示的使用螺旋接觸元件的連接裝置（檢查裝置 係將在連接面上設置了由BGA或LGA等構成的多個外部連 接部la的半導體等電子零件丨作爲檢查物件的裝置。 如圖1所示，連接裝置10由插座u、經由設於該插座u 的一方的邊緣部的折葉部13而被自由轉動地支持的蓋體U 構成。上述插座U及蓋體12由絕緣性的樹脂材料等形成。 在上述插座11的另一方的邊緣部形成被鎖定部14，在蓋體 12的邊緣部形成鎖定部15。 ' 在上述插座U的中心，設有沿圖示22方向形成凹狀的裝 填。IU1A，半導體等t子零件丨就被安裝在該裝 内。 Λ 圖2係表示保護薄片的整體的俯視圖，圖3係將保護薄 的局部（圖2的Α部）放大表示的俯視圖，圖4Α及圖表示 爲本發明的連接裝置的實施方式丨的圖3的β_β線剖面=， 96018-941129.doc 1249826 圖4A係安裝電子零件前的剖面圖，圖4b係安裝電子 > 後的剖面圖。 j圖2所示’表示有呈現於上述裝填部uA的最上部的保 漠薄片20 °上述保護薄片2〇例如由聚亞酸胺或等較薄 的絕緣薄膜或基板等形成。在上述保護薄片2〇上貫穿設有 與排列在電子零件i的連接面上的上述多個外部連接部& 相對向的多個小孔（中繼機構）21。圖2所示的構成中，在保 護薄片20的内側排列成2列的小孔21形成四邊形，沿另外2 列排列的小孔21在上述四邊形的外側沿著各邊平行排列。鲁 上述小孔21的排列與設於電子零件丨的連接面（下面）的 外部連接部la的排列一致。即，此時的電子零件丨係將在， 連接面的内側排成2列的外部連接部丨a排列成四邊形狀， · 並且將在其外侧排成2列的外部連接部la按照沿著上述四 邊形的各邊平行排列的方式排列的構成。 但疋，小孔21的排列可以根據形成於上述電子零件工的 連接面上的外部連接部以的配置而進行各種變更，並不限 定於如圖3所示的配置。 φ 如圖3所示，當將上述小孔21的局部放大觀察時，可以 從上述小孔21中看到設於保護薄片2〇的下部的螺旋接觸元 件40 〇 如圖4所示，上述保護薄片2〇被設於上述裝填部llA的最 上°卩。在上述裝填部11A的最下部，設有設置了多個凸塊 連接部51的連接基板5〇，在上述保護薄片2〇和連接基板5〇 之間設有中繼基板30。 96018-941129.doc -12- 1249826 上述螺旋接觸元件40被設於上述中繼基板3〇上。上述中 繼基板30由玻璃環氧樹脂或pWB等形成，在其内部以規則 的矩陣狀形成有沿板厚方向貫穿上述中繼基板3G的多個通 孔31上述通孔31的縱橫方向（X、Y方向）的間距尺寸與上 述電子零件1的外部連接部la的縱橫方向的間距尺寸相 同另外，上述通孔31的直徑尺寸被設成大於上述電子零 件1的外部連接部la的直徑尺寸的直徑尺寸。 如圖4A所示，在各個通孔31的上下的開口邊緣部，形成 有環狀的上部連接部32a和下部連接部32b，另外，在上述 通孔31的内面形成有圓筒形狀的連接部32〇。上述上部連 接P32a下#連接部32b及上述連接部32c例如由鍍銅形 成，上部連接部32a和下部連接部32b經由上述連接部32〇 電導通。 在上述各個通孔3 1的上部連接部32a上分別設有螺旋接 觸元件40。如圖3所示，上述螺旋接觸元件4〇在外周側具 有環狀的基部41，具有從上述基部41向通孔31的中心方向 成螺旋狀延伸的接觸部42。此外，上述接觸部42通過立體 化地從基部41成凸狀突出而成形頭端部43。 設於上述通孔3丨的上部連接部32a上的螺旋接觸元件4〇 中，與上述小孔21相面對並且圖示21方向的高度尺寸（自 然長度）爲H1的部分是第1螺旋接觸元件4〇a，與上述小孔 21以外的部分（電子零件1的連接面）相面對而且圖示Z1方 向的高度尺寸（自然長度）爲H2的部分是第2螺旋接觸元件 40B。第1螺旋接觸元件4〇A被按照高度尺寸低於上述第2 96018-941129.doc -13- 1249826 螺旋接觸元件40B的方式製成（H1<H2)。此外，保護薄片 20由設於上述中繼基板30的上部側的高度尺寸.H2的第2 螺旋接觸元件40B彈性地支持。 如圖3所示，具有上述小孔21的部分中，可以從上述保 護薄片20的外部穿過上述小孔21看到第}螺旋接觸元件 40A。另一方面，如圖4A所示，不具有上述小孔21的部分 中，由於保護薄片20覆蓋著設於其下部的第2螺旋接觸元 件40B，因此就不能從外部看到上述螺旋接觸元件4〇。如 此，灰塵就必須穿過上述小孔21才能侵入内部，因此就可 以使灰塵難以附著在上述第！、第2螺旋接觸元件4〇A、 40B 上。 另外，保護薄片20可以防止其他的物體的侵入。如此， 例如即使當將鑷子等插入裝填部丨丨A内時，也可以防止上 述鑷子等的頭端與第！、第2螺旋接觸元件4〇A、4〇B接觸 而使之變形的事故的發生。 而且，在上述下部連接部32b上，也與上述相同地設有 沿圖示Z2方向成凸狀突出的螺旋接觸元件4〇。 在上述連接基板5〇上，沿著上述縱橫的間距尺寸以規則 的矩陣狀形成有多個凸塊連接部5丨，在各個凸塊連接部5工 上分別形成有向外部延伸的圖形線（未圖示）。如圖4A、圖 4B所不，上述凸塊連接部51被形成於與在保護薄片20上形 成的小孔21及在上述電子零件丨上形成的各個外部連接部 la這兩者相面對的位置上。 圖4A所示的構成中，上述中繼基板30搭載於連接基板50 96018-941129.doc 1249826 之上’設於中繼基板3 〇的下部側的各個螺旋接觸元件4〇以 導通狀態與上述連接基板5〇的各個凸塊連接部51接觸。此 外’上述中繼基板3〇被設於下部側的多個螺旋接觸元件4〇 的彈力f彈性地支持在連接基板5〇之上。 如圖4B所示，當上述電子零件1安裝在插座丨丨的裝填部 11A内而關閉盍體12時，首先，作爲上述電子零件1的下面 的接觸面將上述保護薄片2〇向圖示Z2方向推壓。此時，保 護薄片20被彈性地支持上述保護薄片2〇的上部側的高度尺 寸爲H2的第2螺旋接觸元件40B的彈力向上述電子零件1的 連接面推壓，同時被向與連接基板5〇接近的圖示Z2方向移 動。 而且，當使鎖定部15與被鎖定部14鎖合時，上述保護薄 片20和中繼基板3〇的對向間隔在上述高度尺寸m以下，由 於上述高度尺寸H1的第1螺旋接觸元件4〇a的頭端部43與 上述外部連接部la接觸，因此就可以使外部連接部“和凸 塊連接部51經由上述中繼基板3〇而連接。 即，設於保護薄片20上的多個小孔21允許電子零件 的外部連接部la和中繼基板30側的第i螺旋接觸元件4〇a的 接觸，作爲將上述外部連接部la和凸塊連接部51直接地連 接的中繼機構發揮作用。 如此，就可以經由設於連接基板5〇上的圖形線（未圖示） 向裝填在裝填部1 i A中的上述電子零件丨的多個外部連接部 la輸入^唬，或者將信號從上述外部連接部&中輸出。 圖5A、圖5B作爲本發明的實施方式2表示與圖4八、6類 96018-941129.doc -15- 1249826 似的uj面圖’圖5八係安裝電子零件前的剖面圖，圖係 安裝電子零件後的剖面圖。 實施方式2所示的連接裝置係與上述實施方式1所示的連 接裝置大致相同的構成。但是’實施方式2所示的連接裝 置中’在由設於保護薄片2〇上的連接構件構成中繼機構這 一點上是不同的。 I7在連接基板50上以矩陣狀排列有多個凸塊連接部 51。另外，在上述連接基板5〇上，設有在上下㊣面以矩陣 狀態配置了第i、請旋接觸元件4〇a、柳的中繼基板 3〇，上述中繼基板30被設於其下部側的螺旋接觸元件⑽彈 t也支持此外，通過设於上述下部側的螺旋接觸元件^ 與上述凸塊連接部51接觸，將兩者電連接。另外，設於中 、薩基板3 0的上邓側的第丨螺旋接觸元件a 薄片2。上的中繼機構相面對，其他的第2螺旋接觸元= 彈性地支持保護薄片20。 圖A圖5B所示，上述中繼機構由連接構件22構 成’其將在作爲保護薄片20的一方的面的下面側與上述螺 旋接觸元件40相面對地設置的平坦面❿和從作爲上述保 護薄片20的另-方的面的上侧面與上述外部連接部^相面 對地設置的凸狀體22b 一體化地形成。 而且，上述連接構件22形成於與上述實施方式}中設於 保護薄片20上的小孔21相同的位置上。但是，連接構件a 的排列可以根據形成於上述電子零件i的連接面上的外部 連接部la的配置而進行各種變更’並不限定於如圖3所示 96018-941129.doc -16- 1249826 的配置。 在實施方式2所示的連接裝置中，設置了多個連接構件 22的保護薄片22是將具有上述第1、第2螺旋接觸元件 40A、40B的中繼基板3〇的表面大致完全覆蓋的構成。如 此’即使任何的物體侵入裝填部丨丨A，上述物體也不會與 上述第1、第2螺旋接觸元件40A、40B直接接觸。如此就 可以防止上述第1、第2螺旋接觸元件4〇A、4犯的變形。 另外’由於不是在保護薄片20上具有小孔21的構成，因 此利用上述只施方式1也可以有效地防止灰塵侵入保護薄 片20的内部的情況，如此，可以更有效地防止灰塵粘附在 上述第1、第2螺旋接觸元件40A、40B上之類的問題。而 且，知入裝填部11A的灰塵可以停留在上述保護薄片2〇 上，利用輕輕吹動空氣等簡單的清掃操作，就可以容易地 排除上述灰塵。如此，由於不需要在清掃時插入鑷子等， 也不會有過大的力作用於上述第丨、第2螺旋接觸元件 4〇A、40B上，因此，就可以防止上述幻、第㈣旋接觸 兀件40A、40B的變形。如此，可以消除或者減少上述第工 螺旋接觸元件40A和外部連接部ia的接觸不良。 而且，各個第2螺旋接觸元件40B由於可以用均等的彈力 支持保護薄片20，因此可以將上述第i螺旋接觸元件4〇a與 外部連接部la接觸時的接點壓力設爲適宜的壓力。在這一 點上，也可以使上述第丨螺旋接觸元件4〇A和外部連接部h 之間的接觸狀態良好。 如圖5B所示，當將上述電子零件i安裝在插座^的裝填 9601.8-941129.doc -17- 1249826 部11A中時，設於上述電子零件〗的下面的接觸面的各外部 ， 連接部la就會與設於上述保護薄片20的各連接構件22的頭 端接觸，並且將保護薄片20向圖示Z2方向推入。此時，保 護薄片20反抗高度尺寸爲H2的第2螺旋接觸元件40B，被 向與上述連接基板50接近的圖示Z2方向移動，其中第2螺 旋接觸元件40B彈性地支持上述保護薄片20並設於中繼基 板3 0的上部側。 此外，當上述保護薄片20和中繼基板30的對向間隔被縮 小至上述高度尺寸H1時，連接構件22的平坦面22a就會與 _ 上述鬲度尺寸H1的第1螺旋接觸元件40A的頭端部43接 觸。此時，外部連接部la和凸塊連接部5丨就經由上述中繼 基板30的連接構件22而連接。 即，設於保護薄片20上的多個連接構件22使電子零件！ 側的外部連接部1 a和中繼基板30側的第1螺旋接觸元件4〇a 接觸’作爲將上述各外部連接部1 a和各凸塊連接部5丨夾隔 上述中繼基板3 0而間接地連接的中繼機構發揮作用。 上述實施方式1及2中，雖然對於裝填部丨丨a内的保護薄 _ 片20及中繼基板30的定位沒有特別表示，但是例如通過在 上述連接基板50的任意的位置上設置多個向圖示Z1方向突 出的定位銷，在中繼基板30及保護薄片2〇上分別預先形成 與上述疋位鎖對應的定位孔，就可以容易地進行凸塊連接 部5 1和中繼基板3〇的下部側的螺旋接觸元件4〇的定位及中 繼基板30的上部側的第！螺旋接觸元件4〇A和保護薄片2〇的 中繼機構（小孔21或連接構件22)的定位。 96018-941129.doc -18- 1249826 另外，在利用此種定位銷衫位孔進行㈣件的^ 情況下’可以使保護薄片20沿與中繼基板3〇垂直交又的圖 示垂直方向(z方向)自由移動，同時’可以容易地更換γ 如此，就可以提供通過將與電子零件丨的外部連接部h的 排列對應的保護薄片20設置在上述褒填部UA中，來進行 各種各樣的電子零件1的連接的連接裝置。 圖6及圖7表示作爲本發明的實施方式3的螺旋接觸元件 的連接裝置，圖6A係表示安裝電子零件前的初始狀態的俯 視圖’圖6B係表示安裝電子零件後的安裝狀態的俯視圖，φ 圖7A係圖6A的A-A線的剖面圖，圖7B係圖6b__b線的剖 面圖，圖7C係表示電子零件的外部連接部和螺旋接觸元件 接觸的連接狀態的與圖6B類似的剖面圖。 如圖6及圖7所示，實施方式3的連接裝置1〇具有插座 11、經由設於該插座U的一方（圖示左端）的邊緣部的折葉 部13被自由轉動地支持的蓋體12。上述插座u及蓋體^由 絕緣性的樹脂材料等形成。在上述插座丨丨的另一方（圖示 右端）的邊緣部上形成被鎖定部14，在蓋體12的邊緣部上籲 形成有鎖定部15。另外，在蓋體12的内面，突出形成有推 壓凸部12 a。 在上述插座11中設有由包圍四方的4個壁面形成的沿圖 不Z2方向成凹狀陷入的裝填部i丨A，從而可以將半導體等 電子零件1安裝在該裝填部11A内。在上述插座11的裝填部 11八的Z2側的底部設有中繼基板30。上述中繼基板30可以 才木用與上述實施方式1及2所示的基板相同的構成。即，如 96018-941129.doc -19- 1249826 圖7A所示，在中繼基板30上以矩陣狀配置多個通孔31，並 且在各個通孔31的上側設有螺旋接觸元件4〇。另外，既可 以是在各個通孔31的下側設置了與上述相同的螺旋接觸元 件的構成，也可以是如圖7A所示的構成，即，不形成上述 螺旋接觸元件，而形成沿圖示22方向突出的凸狀突起34。 而且，上述螺旋接觸元件40與上述相同，在外周側具有 環狀的基部，並且具有從上述基部沿通孔31的中心方向延 伸的螺旋狀的接觸部42。此外，上述螺旋接觸元件4〇的接 觸部42以隨著從上述基部朝向頭端部而呈凸狀突出的立體 的形狀形成。 如圖7A所示，在上述中繼基板3〇的下部設有連接基板 50。而且，圖7B、圖7C中，將通孔31及上述連接基板5〇 的構成等省略。 在上述連接基板50的表面，以與設於上述中繼基板3〇的 下面的上述螺旋接觸元件或凸狀突起34相面對的矩陣狀配 置有凸塊連接部5 1。 在設於上述中繼基板3〇的下面的部分爲螺旋接觸元件的 情況下，通過向上述凸塊連接部51彈性推壓螺旋接觸元件 而連接。另一方面’在採用如圖7A所示的凸狀突起34的情 況下’則經由錫焊或導電性粘結劑等將其與凸塊連接部5丄 連接。 如圖6及圖7所示，在形成上述裝填部11A的4個壁面中的 沿Y方向對向的兩個壁面上，形成有將圖示X方向作爲長 邊而成長方形開口的開口部lla、Ub。此外，在該開口部 96018-941129.doc -20- 1249826 1 la及1 lb上，設有沿圖示γ方向相對移動的一對移動構件 · 61 、 62 〇 如圖7Α〜圖7C所示，上述移動構件61、62從上述開口部 11a、lib突出，並且具有以凸狀的彎曲面形成的被推壓部 61A、62A、從被推壓部61八及62八沿γ方向延伸的多個保 護部 61a、61b、61c及保護部 62a、62b、62c。 上述移動構件61側的上述保護部61&、61b、61C被製成 以圖示Y方向爲長邊及以χ方向爲短邊的短栅形（或者也稱 爲長方形），並且各保護部61a、61b及61c被按照在與移動參 方向（Y方向）正交的X方向上開設特定的空間而排列的方式 設置。同樣，上述移動構件62側的上述保護部62&、62b、 62c也被製成以圖示¥方向爲長邊及以χ方向爲短邊的短栅 形（或者也稱爲長方形），並且各保護部62a、62b及62c被按 照在X方向上開設特定的空間而排列的方式設置。 在上述移動構件61中，並且在設於χ方向的兩端的保護 郤6 1 a 61 c的内側的邊緣部及設於中央的保護部61 b的兩 個邊緣部（沿Y方向延伸的兩個邊緣部）上，沿長度方向（圖春 不Y方向）以肖定的間距尺寸形成彳由半圓形構成的多個半 ’J孔63a同樣，在上述移動構件62中，並且在上述保護 口P 62a 62c的内側的邊緣部及上述保護部的兩個邊緣 部（沿Y方向延伸的兩個邊緣部）上，沿長度方向（圖示丫方 向）以特疋的間距尺寸也形成有由半圓形構成的多個半小 孔63b而且’上述特定的間距尺寸被設定爲在電子零件1 的下面以矩陣狀設置的多個外部連接部_縱向及横向的 96018-941129.doc • 21 - 1249826 間距尺寸。 此外，如圖7A、B所示，上述保護部61a、61b、61c和 上述保護部62a、62b、62c被沿著X方向交替配置。即，在 方的移動構件61侧的保護部61 a和保護部61 b之間的空間 内配置另一方的移動構件62側的保護部62b，在一方的移 動構件61側的保護部61b和保護部61c之間的空間内配置另 一方的移動構件62侧的保護部62c。另外，同時，在上述 另一方的移動構件62側的保護部62a和保護部62b之間的空 間中配置上述一方的移動構件61側的保護部6U，在上述 另一方的移動構件62側的保護部62b和保護部62c之間的空 間内配置上述一方的移動構件61側的保護部61b。 如圖7A所示，在上述插座11的γ方向的内壁上，設置由 板簧等形成的第1施力構件S1、S1，上述移動構件61和移 動構件62被向相互接近的方向施力。 在上述保濩部61a、61b、61c及保護部62a、62b、62c的 下方的位置上，設有上述中繼基板3〇。在上述中繼基板3〇 的側方的位置、並且在上述插座丨丨的底部設有第2施力構 件S2、S2。利用上述第2施力構件S2、S2，將上述移動構 件61、62沿圖示z 1方向自由移動地並且彈性地支持。 對上述實施方式3所示的使用螺旋接觸元件的連接裝置 的動作進行說明。 如圖6A及圖7A所示，在未將電子零件1安裝在上述裝填 部11A中的初始狀態下，利用上述第1施力構件81、S1的彈 力’將上述移動構件61和移動構件62設定爲相互最接近的 96018-941129.doc -22- 1249826 狀態。而且，該狀態下，使上述被推壓部61A、62A從上. 述開口部lla、lib中向裝填部11A侧突出，上述被推壓部 61A和上述被推壓部62A的對向距離被設定爲電子零件1的 Y方向的寬度尺寸以下。 另外，初始狀態下，形成於一方的保護部61a、61b、 61c上的多個半小孔63a和形成於另一方的保護部62a、 62b、62c上的多個半小孔63b被按照相互錯開排列的方 式’以半個周期量的間距沿圖示γ方向錯位設置。由此， 就可以防止在中繼基板30上以矩陣狀配置的上述多個螺旋籲 接觸元件40的整體經由形成於上述保護部61&、61b、 及保護部62a、62b、62c上的半小孔63a、63b而被直接露 下面，如圖7B所示，當將電子零件丨安裝在上述裝填部 11A中時，由於電子零件1的丫方向的兩個侧部向兩側方向 推壓上述被推壓部61A、62A，因此上述移動構件61、62 在反抗上述第1施力構件81、S2的彈力的同時向相互分離 的方向進行相對移動。而且，上述移動構件61、62被移動修 至上述被推壓部61A和上述被推壓部62A之間的對向距離 與上述電子零件1的γ方向的寬度尺寸一致爲止。 如圖6B所示，當上述被推壓部6丨A和上述被推瞿部a a 之間的對向距離與上述電子零件丨的¥方向的寬度尺寸一致 時’上述半周期量的間距的錯位就不存在了。如此，上述 方的上述保護部61a、61b、61()和上述另一方的保護部 62a、62b、62c被相對移動，形成於上述一方的上述保護 96018-941129.doc -23- 1249826 部61a、61b、61c上的半小孔63a和形成於上述另一方的保 護部62a、62b、62c上的半小孔63b就被組合爲一體而以矩 陣狀形成多個小孔63。此時，如圖6B及圖7B所示，上述 以矩陣狀形成的多個小孔63被按照與以矩陣狀配置於上述 中繼基板30的表面的多個螺旋接觸元件4〇相面對的方式設 定。 這裏，當使上述盍體12向關閉的方向轉動，使蓋體〗2側 的鎖定部15與上述插座11的被鎖定部14鎖合時，上述蓋體 12的推壓凸部12a就會將上述電子零件1的上面向圖示zi方 向推壓。上述電子零件1雖然被向圖示21方向移動，但是 此時’由於電子零件1的底面將上述移動構件61、62向圖 示Z1方向推壓，因此上述電子零件1和上述移動構件61、 62在反抗上述第2施力構件S2、S2的彈力的同時，一起向 圖不Z1方向下降。 此時’如圖7C所示，配置於上述中繼基板30上的螺旋接 觸元件40就進入由上述移動構件61、62形成的小孔63内。 如此’形成各個螺旋接觸元件40的接觸部42的頭端部就會 與形成於電子零件1的底面上的各個外部連接部1 a接觸。 如此’就可以將各個外部連接部la和形成於連接基板5〇上 的各個凸塊連接部5 1電連接。 而且，當解除上述鎖定部15和被鎖定部14的鎖合，使蓋 體12敞開時，電子零件1及上述移動構件6丨、62就被上述 第2施力構件S2、S2的彈力向Z1方向托起。如此，就回到 了電子零件1的外部連接部la和上述中繼基板30上的螺旋 96018-941129.doc -24- 1249826 接觸元件40的電連接被解除的圖7B所示的安装狀態。 另外，當將上述電子零件丨從裝填部11A中取下時，由於 利用上述第m力構件S1、82的彈力使上述移動構件叫 移動構件62向相互接近的方向相對移動，因此就使其回到 圖7 A所示的初始狀態。 像如此，本申請發明的實施方式3所示的構成是在圖Μ 及圖7A所示的初始狀態中’通過設於上述移動構㈣侧的 保護部6U、61b、61e上的半小孔—和設於上述移動構件 62側的保護部62a、㈣、仏上半小孔㈣相互沿γ方向錯 位，而作爲防止中繼基板3〇上的螺旋接觸元件4〇被完全露 出的保護蓋體發揮作用。如此，就可以保護中繼基板30上 的螺旋接觸元件40。 此外、在達到了圖6B及圖7β所示的安裝狀態的情況 下，上述半小孔63a和半小孔63b可以形成作爲中繼機構發 揮乍用的〗、孔63。如此，經由上述小孔63，螺旋接觸元件 4〇和電子零件1側的外部連接部la就可以直接連接。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connecting device using a spiral contact member that is electrically connected to a BGA or an LGA or the like, and more particularly to a deformation or dust that can prevent a spiral contact 70 pieces. Invasive connection device using a spiral contact element. [Prior Art] Electronic components such as semiconductors in which a plurality of contact elements such as bga ((4) Grid Array: spherical contact element) or LGA (Land GHd: planar contact element) are provided above or below the package have been developed. . In order to examine the performance of such an electronic component, a dedicated jig for connecting the contact element to a contact piece on a circuit board provided on the outside is required. For example, the following patent documents are available in the prior art. Patent Document 1 discloses a semiconductor inspection apparatus that electrically connects a semiconductor as an inspected component to an external circuit board or the like. The above semiconductor inspection apparatus has a socket for holding a semiconductor, and the semiconductor can be detachably attached to the socket. A plurality of spherical contact elements arranged in a lattice or a matrix are provided on the back side of the semiconductor. An insulating substrate is disposed on a bottom surface of the socket, and the insulating substrate has a plurality of concave portions facing the spherical contact elements, and a convex protrusion is formed in the concave portion in a direction toward the upper spherical contact element. Spiral contact element. In the semiconductor inspection apparatus described above, after the cover provided on the socket side is closed, the inner surface of the cover body faces the semiconductor in the direction of the insulating substrate (four). Therefore, the spiral contact element is the spherical contact element 96018- The outer surface of 941129.doc 1249826 is pushed into the recess. At this time, since the spiral contact element is in contact with the outer surface of the spherical contact element while being wound in a spiral shape, each of the spherical contact elements is electrically connected to each of the contact pads and via the respective spiral contact elements. Further, by opening the lid body, the semiconductor can be pushed back by the elasticity of the above-mentioned spiral contact member, and the semiconductor can be taken out from the socket. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2001-015236. However, in the semiconductor inspection device described in Patent Document 1, when the lid body is always opened, the spiral contact member provided on the insulating substrate in the socket is Keep it exposed to the outside. At this time, when any object accidentally falls into the above-mentioned socket, an excessive force acts to deform the above-mentioned spiral contact member, thereby causing a problem of poor contact between the spiral contact member and the BGA or LGA. Further, in the state in which the above-mentioned cover is opened, dust easily intrudes into the inside of the socket. When dust adheres to the spiral contact member, there is a problem that it is difficult to easily remove it. Further, when the above dust is forcibly removed using a tool such as a tweezers, as described above, the above spiral contact member may be deformed by excessive force. SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object thereof is to provide a connecting device using a spiral contact element which can prevent deformation of a spiral contact element and intrusion of dust and can reduce occurrence of problems such as poor contact. The present invention is a connecting device using a spiral contact element, having a substrate provided with a plurality of through holes, and a spiral contact member provided on each of the through holes, 96018-941129.doc 1249826 and provided on a plurality of external parts on the electronic component The connecting portion is connected via the spiral contact element, and is characterized in that: between the electronic component and the substrate, the protective sheet is disposed facing the substrate, and the protective sheet is provided with each spiral contact element and each external connection A relay mechanism that is directly or indirectly connected. In the present invention, since the protective sheet can protect the above substrate, deformation of the spiral contact member provided on the substrate and invasion of dust can be prevented. For example, the above-mentioned relay mechanism can use the above-described spiral contact element as the request item 1 formed on the above-mentioned protective sheet. Alternatively, the relay mechanism is a flat surface that faces the spiral contact element on one surface side of the protective sheet, and a convex surface that faces the outer connection portion on the other surface side. A body-formed connecting member. In the above mechanism, even if the protective sheet is provided on the upper portion of the substrate, electrical connection between the external connection portion provided on the electronic component and the screw contact member provided on the substrate can be realized. Further, preferably, the spiral contact element has a first spiral contact element formed on the crucible 1 at a position facing the external connection portion, and has no external connection with the electronic component, 扪The second spiral square formed to face each other contacts the π piece, and the second spiral contact element. At the time of receiving and supporting the protective sheet, the second spiral contact element is more than the above! The height of the spiral contact element is high. The soil is formed into another, and the protective sheet is preferably " perpendicular to the substrate; 96018-941129.doc 1249826 is freely movable in the direction of the supporter. In the above configuration, the second screw joint; the A 1 ^ 疋筏 contact member can elastically support the sheet, and when the electronic component is mounted, the protective thin, the 俅 溥 移动 movement, and the appropriate force can make the ith The spiral contact element is connected to the external portion provided on the electronic component: the contact is such that the contact state between the first spiral contact element and the external connection portion is good. In addition, "a connection device using a spiral contact element, and a socket provided with a mounting portion having a plurality of external connections: a substrate; a substrate, a basin, a μ, a A plurality of spiral contact elements electrically connected to the external connection portion are provided in the loading portion, and are: disposed on the upper side of the substrate and facing the plurality of spiral contact members a pair of moving members having a plurality of semicircular semi-apertures and relatively moving within the loading cassette; and an initial small state of the moving member before the electronic component is mounted in the loading portion The semi-apertures of the other moving members are arranged in the same manner to prevent the complete exposure of the spiral contact elements; ^ when the electronic components are loaded by the ampules, the moving members move in opposite directions to each other, The semi-aperture β μg of one of the moving members is described as being integrated with the semi-aperture of the other moving member to form a plurality of small holes, whereby the above-mentioned spiral contact element can be The outer connecting portion is connected via the small hole. In the above invention, the initial hole is not formed in the initial state before mounting the electronic component, and the small hole is formed while the electronic component is mounted. Thus, it can be 96018-941129. Doc 1249826 ' 〇# also protects the spiral contact element and the connection action when connecting. In addition, since the exposure degree of the spiral contact element can be lowered in the initial state, it is possible to prevent dust from adhering to the spiral contact element. The moving member may have a configuration in which a plurality of rectangular protective portions that are arranged in a direction orthogonal to a moving direction of the moving member in a direction orthogonal to the moving direction of the moving member, that is, the above-mentioned protective member The semi-small holes in which the edge portions of the p are arranged at a specific pitch along the moving direction are disposed in the space of the other moving member so as to be freely movable. The above socket is rotatably supported by a cover that pushes the electronic component closer to the upper plate. When the sub-part is mounted in the loading state in the loading state, when the body is closed, the electronic component is moved in a direction close to the substrate. The spiral contact element is connected to the external connecting portion via the small hole. Preferably, the electrical connection capable of reliably performing the spiral contact element and the external connection portion is preferably provided with a force applying member for applying an elastic force to the moving direction of the upper moving member. In the above mechanism, the electronic zero-protection spiral contact element is not loaded. The initial "lower" of the cow can be multiplied: preferably, the second force-applying member that supports the above-mentioned movable member can be freely moved. . In the above mechanism, since the external connection portion of the electronic scorpion part can be reliably removed from the spiral contact member and the moving member is lifted, the connecting device can be reliably restored to the initial state or installed. status. In the present invention, since the spiral contact member is not actively exposed to the outside, it is difficult for the excessive external force to act on the spiral contact member. In this way, deformation of the spiral contact element can be prevented. In addition, the protective sheet can prevent the intrusion of dust. Moreover, the dust accumulated on the protective sheet can be easily removed. [Embodiment] Fig. 1 is a perspective view showing the appearance of a connecting device using a spiral contact element of the present invention. The connection device using the spiral contact element shown in Fig. 1 (the inspection device is a device in which an electronic component such as a semiconductor having a plurality of external connection portions 1a made of BGA or LGA or the like is provided as an inspection object on the connection surface. As shown in Fig. 1, the connection device 10 is constituted by a socket u and a cover U that is rotatably supported via a flap portion 13 provided at one edge portion of the socket u. The socket U and the cover 12 are made of insulating. A resin material or the like is formed. The lock portion 14 is formed at the other edge portion of the socket 11, and the lock portion 15 is formed at the edge portion of the lid body 12. ' At the center of the socket U, a concave portion is formed in the direction of the figure 22 The IU1A, semiconductor, etc. t sub-assembly 安装 is mounted in the package. Λ FIG. 2 is a plan view showing the entire protective sheet, and FIG. 3 is an enlarged view of the protective thin portion (the crotch portion of FIG. 2). 4A and FIG. 3 are sectional views of the β_β line of FIG. 3 of the embodiment of the present invention, and 96018-941129.doc 1249826. FIG. 4A is a cross-sectional view before mounting electronic components, and FIG. 4b is an electronic installation. After the section view. j is shown in Fig. 2, and the protective sheet 2 is formed on the uppermost portion of the loading portion uA. The protective sheet 2 is formed of, for example, a polyimide film or a thin insulating film or a substrate. A plurality of small holes (relay mechanisms) 21 opposed to the plurality of external connection portions & arranged on the connection surface of the electronic component i are formed in the second side. In the configuration shown in FIG. 2, the protective sheet is provided. The small holes 21 arranged in two rows on the inner side of the 20 are formed in a quadrangular shape, and the small holes 21 arranged along the other two rows are arranged in parallel along the sides on the outer side of the quadrilateral. The arrangement of the small holes 21 and the connection to the electronic component 丨The outer connecting portions 1a of the surface (lower surface) are arranged in line. That is, the electronic component system at this time is arranged in a four-sided outer connecting portion 丨a on the inner side of the connecting surface, and will be on the outer side. The outer connecting portions 1a arranged in two rows are arranged in parallel along each side of the quadrilateral. However, the arrangement of the small holes 21 may be based on an external connecting portion formed on the connecting surface of the electronic component worker. Configuration The various changes are not limited to the configuration shown in Fig. 3. φ As shown in Fig. 3, when a part of the small hole 21 is enlarged, it can be seen from the small hole 21 and provided on the protective sheet 2〇. The lower spiral contact element 40 is disposed at the uppermost side of the loading portion 11A as shown in Fig. 4. At the lowermost portion of the loading portion 11A, a plurality of bump connecting portions are provided. The connection substrate 5 of 51 is provided with a relay substrate 30 between the protective sheet 2A and the connection substrate 5A. 96018-941129.doc -12-1249826 The spiral contact element 40 is provided on the above-mentioned relay substrate 3 on. The relay substrate 30 is formed of glass epoxy resin, pWB or the like, and has a plurality of through holes 31 penetrating the relay substrate 3G in the thickness direction in a regular matrix form in the vertical and horizontal directions of the through holes 31 (X). The pitch dimension of the Y-direction is the same as the pitch dimension of the external connection portion 1a of the electronic component 1 in the longitudinal and lateral directions. Further, the diameter of the through hole 31 is set larger than the diameter of the external connection portion 1a of the electronic component 1. Diameter size. As shown in FIG. 4A, an annular upper connecting portion 32a and a lower connecting portion 32b are formed in the upper and lower opening edge portions of the respective through holes 31, and a cylindrical connecting portion is formed on the inner surface of the through hole 31. 32〇. The upper connecting portion P32a lower portion #b and the connecting portion 32c are formed of, for example, copper plating, and the upper connecting portion 32a and the lower connecting portion 32b are electrically connected via the connecting portion 32. Screw contact elements 40 are respectively provided on the upper connecting portions 32a of the respective through holes 31. As shown in Fig. 3, the spiral contact element 4 has an annular base portion 41 on the outer peripheral side, and has a contact portion 42 extending spirally from the base portion 41 toward the center of the through hole 31. Further, the contact portion 42 is formed in a convex shape by a three-dimensional projection from the base portion 41 to form the head end portion 43. In the spiral contact member 4A provided on the upper connecting portion 32a of the through hole 3A, the portion facing the small hole 21 and having a height dimension (natural length) in the direction of 21 is H1 is the first spiral contact. The element 4Aa faces the portion other than the small hole 21 (the connection surface of the electronic component 1), and the portion in which the height dimension (natural length) in the Z1 direction is H2 is the second spiral contact element 40B. The first spiral contact element 4A is made in a manner that the height dimension is lower than the above-mentioned 2960018-941129.doc -13-1249826 spiral contact element 40B (H1) <H2). Further, the protective sheet 20 is elastically supported by the second spiral contact member 40B having a height dimension H2 provided on the upper side of the above-mentioned relay substrate 30. As shown in Fig. 3, in the portion having the small hole 21, the first spiral contact member 40A can be seen through the small hole 21 from the outside of the protective sheet 20. On the other hand, as shown in Fig. 4A, in the portion which does not have the above-mentioned small hole 21, since the protective sheet 20 covers the second spiral contact member 40B provided at the lower portion thereof, the above-mentioned spiral contact member 4 cannot be seen from the outside. Hey. Therefore, dust must pass through the small holes 21 to intrude into the inside, so that dust can hardly adhere to the above-mentioned first! The second spiral contact elements 4A, 40B. In addition, the protective sheet 20 can prevent the intrusion of other objects. Thus, for example, even when a tweezers or the like is inserted into the loading portion A, the head end and the first of the above-mentioned dice can be prevented! The occurrence of an accident in which the second spiral contact elements 4A, 4B contact and deform. Further, in the lower connecting portion 32b, a spiral contact member 4A projecting in a convex shape in the direction of the Z2 in the drawing is provided in the same manner as described above. On the connection substrate 5A, a plurality of bump connecting portions 5A are formed in a regular matrix along the vertical and horizontal pitch dimensions, and each of the bump connecting portions 5 is formed with a pattern line extending outward ( Not shown). 4A and 4B, the bump connecting portion 51 is formed to face both the small hole 21 formed in the protective sheet 20 and each of the external connecting portions 1a formed on the electronic component unit. Location. In the configuration shown in FIG. 4A, the relay substrate 30 is mounted on the connection substrate 50 96018-941129.doc 1249826, and the respective spiral contact elements 4 provided on the lower side of the relay substrate 3 are electrically connected to the above. The respective bump connecting portions 51 of the substrate 5A are in contact. Further, the above-mentioned relay substrate 3A is elastically supported on the connection substrate 5A by the elastic force f of the plurality of spiral contact elements 4A provided on the lower side. As shown in FIG. 4B, when the electronic component 1 is mounted in the loading portion 11A of the socket 而 to close the body 12, first, the protective sheet 2 is turned to the figure Z2 as the contact surface of the lower surface of the electronic component 1. Push in the direction. At this time, the protective sheet 20 is elastically supported by the elastic force of the second spiral contact element 40B having the height dimension H2 on the upper side of the protective sheet 2〇, and is urged toward the connection surface of the electronic component 1 while being guided to the connection substrate 5 The icon close to the figure moves in the Z2 direction. Further, when the locking portion 15 is locked to the locked portion 14, the opposing distance between the protective sheet 20 and the relay substrate 3A is equal to or less than the height dimension m, and the first spiral contact member 4 of the height dimension H1 is Since the head end portion 43 of a is in contact with the external connection portion 1a, the external connection portion "and the bump connecting portion 51 can be connected via the above-described relay substrate 3". That is, a plurality of small sheets provided on the protective sheet 20 The hole 21 allows the external connection portion 1a of the electronic component and the contact of the i-th spiral contact element 4A on the relay substrate 30 side to function as a relay mechanism that directly connects the external connection portion 1a and the bump connection portion 51. In this way, the plurality of external connection portions 1a of the electronic component package loaded in the loading portion 1 i A can be input via a pattern line (not shown) provided on the connection substrate 5A, or the signal can be input from Fig. 5A and Fig. 5B show, as an embodiment 2 of the present invention, a uj surface view similar to Fig. 4, class 6 96018-941129.doc -15-1249826. Sectional view in front of the part The connection device shown in the second embodiment is substantially the same as the connection device described in the first embodiment. However, the "connection device shown in the second embodiment" is provided in the protective sheet 2 The upper connecting members constitute a relay mechanism. I7 has a plurality of bump connecting portions 51 arranged in a matrix on the connecting substrate 50. Further, the connecting substrate 5 is provided on the upper and lower sides. In the matrix state, the i-th, the contact element 4〇a, and the relay substrate 3〇 of the Liu are disposed, and the relay substrate 30 is supported by the spiral contact element (10) provided on the lower side thereof. The spiral contact element on the lower side is in contact with the bump connecting portion 51, and is electrically connected to each other. Further, the second spiral contact element a sheet 2 is provided on the upper Deng side of the middle and the bottom substrate 30. The other second spiral contact element = elastically supports the protective sheet 20. As shown in Fig. A to Fig. 5B, the above-mentioned relay mechanism is constituted by the connecting member 22, which will be under the surface as one side of the protective sheet 20. Side and the above spiral The flat surface 设置 which is disposed facing the element 40 and the convex body 22b which is provided to face the outer connecting portion from the upper side surface which is the other side surface of the protective sheet 20 are integrally formed. The connecting member 22 is formed at the same position as the small hole 21 provided in the protective sheet 20 in the above embodiment. However, the arrangement of the connecting member a may be based on an external connecting portion formed on the connecting surface of the electronic component i. The configuration of la is variously changed, and is not limited to the configuration of 96018-941129.doc -16-1249826 as shown in Fig. 3. In the connecting device shown in Embodiment 2, a protective sheet of a plurality of connecting members 22 is provided. 22 is a configuration in which the surface of the relay substrate 3A having the first and second spiral contact elements 40A and 40B is substantially completely covered. Thus, even if any object intrudes into the loading unit 丨丨A, the above object does not directly contact the first and second spiral contact elements 40A and 40B. Thus, the deformation of the first and second spiral contact elements 4A, 4 can be prevented. In addition, since the configuration is such that the protective sheet 20 has the small holes 21, it is possible to effectively prevent dust from intruding into the inside of the protective sheet 20 by the above-described only method 1, and thus it is possible to more effectively prevent dust from adhering to the above. Problems such as the first and second spiral contact elements 40A and 40B. Further, the dust known to the loading portion 11A can stay on the protective sheet 2A, and the dust can be easily removed by a simple cleaning operation such as gently blowing air. In this way, since it is not necessary to insert a forceps or the like during cleaning, an excessive force is not applied to the second and second spiral contact elements 4A and 40B, so that the above-described magical and fourth (4) rotational contact can be prevented. The deformation of the pieces 40A, 40B. Thus, the contact failure of the above-described first helical contact element 40A and the external connection portion ia can be eliminated or reduced. Further, since each of the second spiral contact elements 40B can support the protective sheet 20 with an equal elastic force, the contact pressure when the i-th spiral contact element 4A is brought into contact with the external connection portion la can be set to an appropriate pressure. In this regard, the contact state between the second spiral contact element 4A and the external connection portion h can be made good. As shown in FIG. 5B, when the electronic component i is mounted in the 9601.8-941129.doc -17-1249826 portion 11A of the socket ^, it is provided outside each of the contact faces of the electronic component, and the connecting portion la The head end of each of the connecting members 22 provided on the protective sheet 20 is brought into contact with each other, and the protective sheet 20 is pushed in the direction of the drawing Z2. At this time, the protective sheet 20 is moved against the second spiral contact element 40B having the height dimension H2, and moved toward the direction Z2 in the vicinity of the connection substrate 50, wherein the second spiral contact member 40B elastically supports the protective sheet 20 and is provided. On the upper side of the relay substrate 30. Further, when the opposing interval between the protective sheet 20 and the relay substrate 30 is reduced to the above-described height dimension H1, the flat surface 22a of the connecting member 22 and the head of the first spiral contact member 40A having the above-described twist size H1 The end portion 43 is in contact. At this time, the external connection portion 1a and the bump connecting portion 5'' are connected via the connecting member 22 of the above-described relay substrate 30. That is, the plurality of connecting members 22 provided on the protective sheet 20 make the electronic parts! The external connection portion 1 a on the side is in contact with the first spiral contact element 4 〇 a on the side of the relay substrate 30 ′ as the external connection portion 1 a and each of the bump connection portions 5 are sandwiched by the relay substrate 30 . The relay mechanism that is connected to the ground works. In the first and second embodiments, the positioning of the protective sheet 20 and the relay substrate 30 in the loading portion 丨丨a is not particularly shown. However, for example, a plurality of directions are provided at any position of the connecting substrate 50. The positioning pin protruding in the Z1 direction is formed by arranging positioning holes corresponding to the above-described position locks on the relay substrate 30 and the protective sheet 2, respectively, so that the bump connecting portion 51 and the relay substrate 3 can be easily performed. Positioning of the lower spiral contact element 4〇 and the upper side of the relay substrate 30! The positioning of the spiral contact member 4A and the relay mechanism (small hole 21 or connecting member 22) of the protective sheet 2A. 96018-941129.doc -18- 1249826 In addition, in the case of using the locating pin hole for the (four) piece, the protective sheet 20 can be perpendicularly intersected with the relay substrate 3 (z) The direction is free to move, and 'the γ can be easily replaced. Thus, it is possible to provide various kinds of protective sheets 20 corresponding to the arrangement of the external connection portions h of the electronic component 设置 in the above-described 褒 filling portion UA. A connection device for the connection of the electronic component 1. 6 and FIG. 7 are views showing a connection device of a spiral contact element according to a third embodiment of the present invention, and FIG. 6A is a plan view showing an initial state before mounting an electronic component. FIG. 6B is a plan view showing an attached state after mounting an electronic component, and FIG. 7A is a cross-sectional view taken along line AA of FIG. 6A, FIG. 7B is a cross-sectional view taken along line 6b_b of FIG. 6B, and FIG. 7C is a cross-sectional view similar to FIG. 6B showing a connection state of contact between the external connection portion of the electronic component and the spiral contact element. As shown in FIG. 6 and FIG. 7, the connection device 1 of the third embodiment has a socket 11 and a cover that is rotatably supported via a flap portion 13 provided at an edge portion of one of the sockets U (the left end of the figure). 12. The socket u and the lid body are formed of an insulating resin material or the like. A locked portion 14 is formed on an edge portion of the other side (right end in the drawing) of the socket cymbal, and a locking portion 15 is formed on an edge portion of the lid body 12. Further, on the inner surface of the lid body 12, a pressing convex portion 12a is formed to protrude. The socket 11 is provided with a mounting portion i丨A formed by four wall surfaces surrounding the four sides and recessed in the Z2 direction, so that the electronic component 1 such as a semiconductor can be mounted in the loading portion 11A. The relay substrate 30 is provided at the bottom of the Z2 side of the mounting portion 11 of the socket 11. The above-mentioned relay substrate 30 can have the same configuration as the substrate shown in the above-described first and second embodiments. That is, as shown in Fig. 7A, a plurality of through holes 31 are arranged in a matrix on the relay substrate 30, and spiral contact elements 4 are provided on the upper side of each of the through holes 31, as shown in Fig. 7A. Further, a configuration in which the same spiral contact element as that described above is provided on the lower side of each of the through holes 31 may be employed as shown in FIG. 7A, that is, the above-described spiral contact element is not formed, and is formed along the drawing. A convex protrusion 34 protruding in the 22 direction. Further, the spiral contact member 40 has an annular base portion on the outer peripheral side and has a spiral contact portion 42 extending from the base portion in the center direction of the through hole 31, as described above. Further, the contact portion 42 of the spiral contact member 4A is formed in a three-dimensional shape that protrudes in a convex shape from the base portion toward the head end portion. As shown in Fig. 7A, a connection substrate 50 is provided on the lower portion of the above-mentioned relay substrate 3A. In addition, in FIGS. 7B and 7C, the configuration of the through hole 31 and the above-described connection substrate 5A is omitted. On the surface of the above-mentioned connection substrate 50, a bump connecting portion 51 is disposed in a matrix shape facing the spiral contact element or the convex protrusion 34 provided on the lower surface of the above-mentioned relay substrate 3A. When the portion provided on the lower surface of the above-mentioned relay substrate 3 is a spiral contact element, it is connected by elastically pressing the spiral contact element to the above-mentioned bump connecting portion 51. On the other hand, in the case where the convex protrusion 34 shown in Fig. 7A is employed, it is connected to the bump connecting portion 5B via soldering or a conductive adhesive or the like. As shown in FIG. 6 and FIG. 7, an opening portion 11a having a rectangular opening in which the X direction is a long side is formed on the two wall surfaces facing each other in the Y direction among the four wall surfaces forming the loading portion 11A. , Ub. Further, on the opening portions 96018-941129.doc -20-1249826 1 la and 1 lb, a pair of moving members 61, 62 are relatively moved in the γ direction shown in the drawing, as shown in Figs. 7A to 7C. The moving members 61 and 62 protrude from the openings 11a and 11b, and have pressed portions 61A and 62A formed in a convex curved surface, and a plurality of pressed portions 61A and 62A extending from the pressed portions 61 and 62 in the γ direction. Protective portions 61a, 61b, 61c and protective portions 62a, 62b, 62c. The protective portions 61 & 61b, 61C on the moving member 61 side are formed to have a short grid shape (or a rectangular shape) in which the Y direction is a long side and the χ direction is a short side, and each protection portion 61a is formed. 61b and 61c are arranged such that a specific space is opened in the X direction orthogonal to the movement reference direction (Y direction). Similarly, the protective portions 62&, 62b, 62c on the side of the moving member 62 are also formed to have a short grid shape (or a rectangular shape) in which the ¥ direction is a long side and the χ direction is a short side, and each The protection portions 62a, 62b, and 62c are provided in such a manner that a specific space is opened in the X direction. In the moving member 61, the inner edge portion of the protection provided at both ends of the χ direction is 6 1 a 61 c and the two edge portions of the protection portion 61 b provided at the center (two extending in the Y direction) In the edge portion), a plurality of semi-'J holes 63a each having a semicircular shape are formed in a longitudinal direction in the longitudinal direction (not shown in the Y-direction in the spring). Similarly, in the above-mentioned moving member 62, and in the above-mentioned protection port An edge portion on the inner side of the P 62a 62c and two edge portions (two edge portions extending in the Y direction) of the protection portion are formed in a half-length in the longitudinal direction (the direction of the drawing). a plurality of semi-apertures 63b of a circular shape and the above-mentioned specific pitch size is set as a plurality of external joints arranged in a matrix below the electronic component 1 _ longitudinal and lateral 96018-941129.doc • 21 - 1249826 Spacing size. Further, as shown in Figs. 7A and 7B, the protection portions 61a, 61b, and 61c and the protection portions 62a, 62b, and 62c are alternately arranged along the X direction. In other words, the protection portion 62b on the other moving member 62 side is disposed in the space between the protection portion 61a and the protection portion 61b on the side of the moving member 61, and the protection portion 61b and the protection on the side of the one moving member 61 are provided. The protection portion 62c on the other moving member 62 side is disposed in the space between the portions 61c. In addition, at the same time, the protection portion 6U on the side of the one moving member 61 is disposed in the space between the protection portion 62a and the protection portion 62b on the other moving member 62 side, and the protection on the other moving member 62 side is provided. The protection portion 61b on the side of the one moving member 61 is disposed in a space between the portion 62b and the protection portion 62c. As shown in Fig. 7A, the first urging members S1 and S1 formed of a leaf spring or the like are provided on the inner wall of the socket 11 in the γ direction, and the moving member 61 and the moving member 62 are biased in directions toward each other. The relay substrate 3A is provided at a position below the guard portions 61a, 61b, and 61c and the protection portions 62a, 62b, and 62c. The second urging members S2 and S2 are provided at the side of the above-mentioned relay substrate 3A and at the bottom of the socket 。. The moving members 61 and 62 are freely movable and elastically supported in the z1 direction by the second urging members S2 and S2. The operation of the connecting device using the spiral contact element described in the third embodiment will be described. As shown in FIG. 6A and FIG. 7A, the moving member 61 and the moving member 62 are set by the elastic force 'of the first urging members 81 and S1 in an initial state in which the electronic component 1 is not attached to the loading portion 11A. The closest to each other is the state of 96018-941129.doc -22-1249826. In this state, the pressed portions 61A and 62A protrude from the upper opening portions 11a and 11b toward the loading portion 11A, and the opposing distance between the pressed portion 61A and the pressed portion 62A is It is set to be equal to or smaller than the width dimension of the electronic component 1 in the Y direction. Further, in the initial state, the plurality of half small holes 63a formed in one of the protection portions 61a, 61b, and 61c and the plurality of small small holes 63b formed in the other protection portions 62a, 62b, and 62c are shifted from each other. The arrangement 'displaces' is set in the gamma direction offset by a half cycle amount. Thereby, it is possible to prevent the entire plurality of the spiral contact elements 40 arranged in a matrix on the relay substrate 30 from passing through the half portions formed on the protection portions 61 & 61b and the protection portions 62a, 62b, 62c. The holes 63a, 63b are directly exposed, and as shown in Fig. 7B, when the electronic component 丨 is mounted in the loading portion 11A, the two sides of the electronic component 1 in the 丫 direction push the above-mentioned Since the moving parts 61A and 62A are pressed, the moving members 61 and 62 relatively move in the direction in which they are separated from each other while resisting the elastic force of the first urging members 81 and S2. Further, the moving members 61 and 62 are moved until the opposing distance between the pressed portion 61A and the pressed portion 62A coincides with the width dimension of the electronic component 1 in the γ direction. As shown in FIG. 6B, when the opposing distance between the pressed portion 6A and the pushed portion aa coincides with the width dimension of the electronic component 丨 in the ¥ direction, the misalignment of the pitch of the half cycle amount It doesn't exist anymore. In this manner, the protective portions 61a, 61b, and 61() and the other protective portions 62a, 62b, and 62c are relatively moved, and are formed in the one of the protections 96018-941129.doc-23-1249826, 61a. The semi-small holes 63a on the 61b, 61c and the semi-small holes 63b formed in the other protective portions 62a, 62b, 62c are integrally combined to form a plurality of small holes 63 in a matrix. At this time, as shown in FIG. 6B and FIG. 7B, the plurality of small holes 63 formed in a matrix are faced by the plurality of spiral contact elements 4 配置 arranged in a matrix on the surface of the relay substrate 30. Mode setting. Here, when the body 12 is rotated in the closing direction, and the locking portion 15 on the cover 2 side is locked with the locked portion 14 of the socket 11, the pressing convex portion 12a of the cover 12 will be The upper surface of the electronic component 1 is pressed in the direction of the zi in the figure. Although the electronic component 1 is moved in the direction of the drawing 21, the electronic component 1 and the moving members 61 and 62 are pushed by the bottom surface of the electronic component 1 by the moving members 61 and 62 in the direction of the drawing Z1. While resisting the elastic force of the second urging members S2 and S2, they are lowered toward the Z1 direction. At this time, as shown in Fig. 7C, the screw contact elements 40 disposed on the relay substrate 30 enter the small holes 63 formed by the moving members 61 and 62. Thus, the head end portions of the contact portions 42 forming the respective spiral contact elements 40 are in contact with the respective outer connecting portions 1a formed on the bottom surface of the electronic component 1. Thus, each of the external connection portions 1a and the respective bump connecting portions 51 formed on the connection substrate 5A can be electrically connected. When the lock portion 15 and the locked portion 14 are released from each other and the lid body 12 is opened, the electronic component 1 and the moving members 6A and 62 are biased toward the Z1 by the elastic force of the second biasing members S2 and S2. Lift up the direction. Thus, the mounting state shown in Fig. 7B in which the electrical connection of the contact element 40 of the electronic component 1 and the external connection portion 1a of the electronic component 1 and the spiral 96018-941129.doc - 24-1249826 of the above-mentioned relay substrate 30 are released is returned. Further, when the electronic component 丨 is removed from the loading portion 11A, the moving member is moved relative to the moving member 62 by the elastic force of the m-th force members S1 and 82, so that it is returned. Go to the initial state shown in Figure 7A. As described above, the configuration shown in the third embodiment of the present invention is a half-hole through the protective portions 6U, 61b, and 61e provided on the side of the moving mechanism (four) in the initial state shown in FIG. The protective portions 62a, (4), and the upper half-holes (4) provided on the side of the moving member 62 are displaced in the γ direction, and are used as a protective cover for preventing the spiral contact elements 4 on the relay substrate 3 from being completely exposed. effect. Thus, the spiral contact member 40 on the relay substrate 30 can be protected. Further, in the case where the mounting state shown in Figs. 6B and 7β is reached, the semi-small hole 63a and the semi-small hole 63b can form a hole 63 which is used as a relay mechanism. Thus, the spiral contact member 4A and the external connection portion 1a on the side of the electronic component 1 can be directly connected via the small holes 63.
而且’在上述實施方式3中，雖然示出了移動構件Η、 62在初始狀態下被向相互接近的方向施力、在安裝狀態下 相互分離的方式，但是，本發明並不限定於此，也可以是 在初始狀恶下被向相互分離的方向施力、在安裝狀態下相 互接近的方式。 【圖式簡單說明】 #圖1係表示本發明的使用螺旋接觸元件的連接裝置的外 觀的立體圖。 96018-941129.doc -25- 1249826 圖2係表示保護薄片的整體的俯視圖。 圖3係將保護薄片的局部（圖2的a部）放大表示的俯視 圖0 圖4A係作爲本發明的連接裝置的實施方式1的圖3的 線剖面圖，係安裝電子零件前的剖面圖。 圖4B係作爲本發明的連接裝置的實施方式1的圖3的b_b 線剖面圖，係安裝電子零件後的剖面圖。In the above-described third embodiment, the moving members Η and 62 are biased in the initial direction and are separated from each other in the mounted state, but the present invention is not limited thereto. It may be a method of applying force in a direction in which the initial state is separated from each other and approaching each other in the mounted state. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the appearance of a connecting device using a spiral contact element of the present invention. 96018-941129.doc -25- 1249826 Fig. 2 is a plan view showing the entirety of the protective sheet. Fig. 3 is a plan view showing a part of the protective sheet (a portion in Fig. 2) in an enlarged manner. Fig. 4A is a cross-sectional view of Fig. 3 as a first embodiment of the connecting device of the present invention, and is a cross-sectional view before mounting the electronic component. Fig. 4B is a cross-sectional view taken along line b_b of Fig. 3 which is a first embodiment of the connecting device of the present invention, and is a cross-sectional view after mounting electronic parts.
圖5A係作爲本發明的實施方式2的與圖4A類似的剖面 圖’係安裝電子零件前的剖面圖。 圖5B係作爲本發明的實施方式2的與圖4B類似的剖面 圖’係安裝電子零件後的剖面圖。 圖6A係表示作爲本發明的實施方式3的螺旋接觸元件的 連接裝置的、安裝電子零件前的初始狀態的俯視圖。 圖6B係表示作爲本發明的實施方式3的螺旋接觸元件的 連接裝置的、安裝電子零件後的安裝狀態的俯視圖。 圖7A係圖6A的Α·Α線的剖面圖。 圖7Β係圖6Β的Β-Β線的剖面圖。Fig. 5A is a cross-sectional view showing a cross-sectional view similar to Fig. 4A as a second embodiment of the present invention before mounting an electronic component. Fig. 5B is a cross-sectional view showing a cross-sectional view similar to Fig. 4B as a second embodiment of the present invention after mounting an electronic component. Fig. 6A is a plan view showing an initial state of the connecting device of the spiral contact element according to the third embodiment of the present invention before the electronic component is mounted. Fig. 6B is a plan view showing a mounting state of the connecting device of the spiral contact element according to the third embodiment of the present invention after the electronic component is mounted. Fig. 7A is a cross-sectional view of the Α·Α line of Fig. 6A. Figure 7 is a cross-sectional view of the Β-Β line of Figure 6Β.
圖7C係表示電子零件的外部連接部和螺旋接觸元件接觸 的連接狀態的圖，係與6Β類似的剖面圖。 【主要元件符號說明】 1 電子零件 I a 外部連接部 10 電子零件的連接裝置（檢查裝置） II 插座 11A 裝填部 96018-941129.doc -26- 1249826 11a，lib 開口部 12 蓋體 12a 推壓凸部 14 被鎖定部 15 鎖定部 20 保護薄片 21 孔（中繼機構） 22 連接構件（中繼機構） 22a 平坦面 22b 凸狀體 30 中繼基板 31 通孔 34 凸狀突起 40 螺旋接觸元件 40A 第1螺旋接觸元件 40B 第2螺旋接觸元件 50 連接基板 51 凸塊（land)連接部 61，62 移動構件 61A, 62A 被推壓部 6 1 a，6 lb，6 1 c，62a，62b，62c 保 63 小孔（中繼機構） 63a，63b 半小孔 SI 第1施力構件 S2 第2施力構件 96018-941129.doc -27-Fig. 7C is a view showing a state in which the external connection portion of the electronic component and the spiral contact member are in contact with each other, and is a cross-sectional view similar to that of 6 。. [Main component symbol description] 1 Electronic component I a External connection part 10 Electronic component connection device (inspection device) II Socket 11A Filling part 96018-941129.doc -26- 1249826 11a, lib Opening part 12 Cover body 12a Pushing convex Portion 14 Locked portion 15 Locking portion 20 Protective sheet 21 hole (relay mechanism) 22 Connecting member (relay mechanism) 22a Flat surface 22b Projection body 30 Relay substrate 31 Through hole 34 Projection protrusion 40 Spiral contact element 40A 1 spiral contact element 40B second spiral contact element 50 connection substrate 51 land connection portion 61, 62 moving members 61A, 62A are pressed portions 6 1 a, 6 lb, 6 1 c, 62a, 62b, 62c 63 small hole (relay mechanism) 63a, 63b semi-small hole SI first urging member S2 second urging member 96018-941129.doc -27-