1249041 九、發明說明： 【發明所屬之技術領域】 本發明係與透鏡結構有關，特別是指一種呈陣列狀微 透鏡之製法。 5【先如技術】 隨著平面顯示器尺寸由小尺寸(對角線8.4吋以下）、中 尺寸(對角線8.4-30吋）、演進至大尺寸(對角線30-300吋）， 顯示器的背光源尺寸也越來越大，而且亮度的需求也越來 越高’因此，如何促進背光源的外部耦合係數，以及增加 ίο發光元件之量子效率，已成為工程上的挑戰；從幾何光學 的角度來看，若能破壞背光源之基板的波導現象，使發光 元件之外部耦合係數增加，則光線傳遞出基板的成效極可 能大於100〇/〇以上，因此，許多相關研究都集中於基板表面 的微結構研究。 15 例如美國弟4966831號專利案所述，主要是在感光元 件的每個像素邊緣放置間隔件(Spacer)，然後塗佈一層透明 光阻，利用微影之方式在各像素製作一個板狀結構，再藉 由熱整形將板狀結構轉換成球狀之微透鏡；但是，在上述 微透鏡之製法巾，僅適祕中、小面積之基板，而且必須 使用價格昂貴的光罩’以及光罩對準機才能進行曝光。、 又如美國帛53GG263號專㈣輯，其係先以精密機 械切削方式在-試片表面製造出若干呈陣驗之金字塔結 構’再以輯方式製絲面具有凹狀鲜塔結_金屬模 仁’接著將硬化贿輯佈在金職仁上，施以硬化處理 1249041 後，就會直接形成表面具有彎月形微透鏡的複製品，然後 以電鑄方式製作表面具有凹狀彎月形微透鏡的金屬模仁， 也可以繼續翻模形成表面具有凸狀彎月形微透鏡陣列結構 的金屬模仁，並以這最後的模仁大量翻製彎月形微透鏡； 5但上述利用精密機械切削方式之成本昂貴，不適用於中、 大面積的微結構製造，而且經由二次翻製才能形成彎月形 微透鏡，精確度較不易控制。 再如美國專利第5737126號專利案所述，係直接利用 雷射加熱一内部材料中混有半導體顆粒之玻璃，玻璃本身 10不吸收雷射光束’而半導體顆粒會吸收雷射光束，由於半 導體顆粒吸收光束而致使玻璃之局部區域熔化’再經過固 化後即形成微透鏡形狀’但是利用雷射製作微透鏡的製法 中，半導體顆粒可能會影響玻璃的光學性質，同時單位面 積内能形成的微透鏡數量不高。 15 綜上所述，目前已知的各種微透鏡之製法中，皆具有 製造完成之微透鏡尺寸較不精確、單位面積所具有的微透 鏡數量不高，或是受限於製造機器設備因素，而無法應用 於大面積基板的種種缺點。 2〇【發明内容】 因此，本發明之主要目的乃在於提供一種微透鏡之製 法，於小、中、大面積尺寸之基板皆可成形出微透鏡，而 且單位面知内所成形的微透鏡數量較高，微透鏡之尺寸較 為精確，同時生產速度較快，成本較低。 >5- 1249041 為達成前揭目的，本發明所提供微透鏡之製法，包含 有下列步驟··首先，於一基板之表面以塗佈之方式設一覆 蓋層，然後，利用雷射加工沿著一預定路徑照射該覆蓋層， 使該覆盍層形成若干相互交叉之溝槽，以及若干呈陣列狀 5排列之微透鏡，最後，加熱該基板，使該等微透鏡之表面 呈球狀；藉此，即可製造出尺寸較為精確且高密度的球狀 微透鏡，不僅可以應用於大面積基板，也可用於製作中、 小面積基板之球狀微透鏡；另外，再結合翻模技術製作具 有球狀微陣列結構的模仁，進而使用此模仁大量製造具有 10球狀微透鏡之成品。 【實施方式】 以下即配合圖示列舉若干較佳實施例，藉以對本發明 進行詳細說明，其中所用各圖式之簡要說明如下： 第一圖係本發明第一較佳實施例之示意圖； 第二圖係本發明第一較佳實施例之示意圖，顯示覆罢 層設於基板之狀態； 第三圖係本發明第一較佳實施例之示意圖，顯示 層進行雷射加工之狀態； i 第四圖係本發明第一較佳實施例之示意圖，顯示微透 顯示各微 弟五圖係本發明第一較佳實施例之示意圖 透鏡表面呈球形之狀態； 第六圖係本發明第二較佳實施例之示意圖； -6- 1249041 第七圖係本發明第二較佳實施例之示意圖，顯示覆蓋 層設於基板之狀態； 第八圖係本發明第二較佳實施例之示意圖，顯示覆蓋 層進行雷射加工之狀態； 5 第九圖係本發明第二較佳實施例之示意圖，顯示微陣 列結構之狀態； 第十圖係本發明第二較佳實施例之示意圖，顯示各微 陣列結構表面呈球形之狀態； 第十一圖係本發明第二較佳實施例之示意圖，顯示基 10板表面覆設一金屬模仁； 第十二圖係本發明第二較佳實施例之示意圖，顯示金 屬模仁之狀態； 第十三圖係本發明第二較佳實施例之示意圖，顯示金 屬模仁成形微透鏡之狀態；以及 15 第十四圖係本發明第二較佳實施例之示意圖，顯示具 有微透鏡之成品。 請參閱第一至第五圖，本發明第一較佳實施例所提供 微透鏡之製法，包含有下列步驟： 步驟一：如第一圖所示，準備一透明平面基板(10)，基 2〇板(10)的材質可為玻璃、塑膠，或是撓性薄膜。 步驟二：如第二圖所示，於基板(10)之表面以刮刀塗佈 方式塗佈一覆蓋層（12)並進行軟烤；於本實施例中，覆蓋層 (12)之材質係為熱塑性咼分子膜，並且呈透明狀。 步驟三：如第三及第四圖所示，將基板（1〇)放在一移動 -7- 1249041 平台（XY-stage)(16)，並以一準分子雷射（μ)所發出之紫外 線雷射光束照射覆蓋層（12)，該雷射光束經一光學模組聚焦 後以點狀方式照射於覆蓋層（12)，接者驅使移動平台（16)沿 第一轴向(X轴)線性位移一段距離而進行曝光後，再使曝光 5作業暫時停止，接著驅使移動平台（16)沿第二轴向(γ軸)線 性位移一間隔復沿第一轴向(X轴)反向線性位移上述相同 距離而進行曝光，如此重複作業，使雷射（14)將覆蓋層（12) 剝蝕出若干相互平行且沿第一軸(X轴)向延伸之溝槽（18), 接者驅使移動平台（16)沿第二軸向(γ軸)線性位移一段距離 10而進行曝光後，再使曝光作業暫時停止，接著驅使移動平 台（16)沿第一軸向(X軸)線性位移一間隔復沿第二軸向(γ 軸）反向線性位移上述相同距離而進行曝光，如此重複作 業，使雷射（14)將覆蓋層（12)剝蝕出若干相互平行且沿第二 軸(Υ轴)向延伸之溝槽(圖中未示），覆蓋層（12)即可形成若 I5干相互隔離，且呈陣列狀排列之方形板狀結構(2〇)。 步驟四··如第四及第五圖所示，將基板(1〇)置於一熱處 理爐(圖中未示）中或加熱板加熱，基板(1〇)加熱到板狀結構 (20)之玻璃轉換溫度以上時，各板狀結構(2〇)之表面即會產 生表面質傳的熱整形處理，使板狀結構(2〇)形成為表面呈球 2〇 狀之微透鏡(22)。 本發明之所以將微透鏡底部製成方形的原因，主要是 因為王陣列狀之微透鏡底部面積與基板面積之比值越高， 微透鏡越能促進平面型發光元件之外部耦合係數，因此， 在考慮二種分別具有不同底部形狀的微透鏡：圓形、正六 -8- 1249041 邊形底部和正方妒底：：逑二種微透鏡的圓底、正六 貝i微透鏡_底直徑、正六邊職狀邊長、正方形底 部之邊長分f，而其底部面積與基板 ”為万“)n㈤。由此可見，當間距 目同％’底部為正域形之微透鏡和底部為正方形之微透 鏡的面積比值最高，而底部為圓形之微透鏡的面積比值最 低二因此，藉由微透鏡底部面積與基板面積之比值，較佳 的選擇為正方形底部和正六邊形底部之微透鏡，並且微透 鏡之底σ卩面積與基板之表面面積的比值最好大於0.5，而再 加上考慮到雷射加工的速度和簡單性，底部為正方形之微 透鏡為最佳的選擇。 此外，微透鏡(22)之間的間距越小，促進平面型發光元 件之外部耦合係數越大，但是當板狀結構(20)間距太小時， 15在熱整形後會導致微透鏡(22)表面相互黏接而造成大小不 一，因此，由於玻璃材質基板(10)的熱膨脹係數為， 而覆蓋層（12)的熱膨脹係數約為1〇〇~2心1〇吻^)，覆蓋層（12) 表面質傳之熱整形溫度約為100〜200(°c)，假定均取上述之最大 值，則板狀結構(20)之間距d應大於〇.〇3%，其中&為板狀結構 2〇 (20)之底部邊長；然而，板狀結構(20)之間距仍應考慮雷射 加工之極限，若假設雷射波長為2，也就是說〃必須大於 i/2。當溫度上升ΔΤ時，基板(10)的尺寸增加量為ALs/，基板 (10)的線膨脹係數為（crE)s'，基板（10)的總尺寸〜4為 冬 12490411249041 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a lens structure, and more particularly to a method of forming an array of microlenses. 5 [First as technology] With the size of the flat panel display from small size (below 8.4 对 diagonal), medium size (diagonal 8.4-30 吋), to large size (diagonal 30-300 吋), display The size of the backlight is also getting larger and larger, and the demand for brightness is getting higher and higher. Therefore, how to promote the external coupling coefficient of the backlight and increase the quantum efficiency of the light-emitting element has become an engineering challenge; From the point of view, if the waveguide phenomenon of the substrate of the backlight source is destroyed and the external coupling coefficient of the light-emitting element is increased, the effect of transmitting the light out of the substrate is likely to be greater than 100 〇/〇. Therefore, many related studies have focused on the substrate. Surface microstructure study. 15 For example, in the U.S. Patent No. 4,966,831, the spacer is mainly placed on the edge of each pixel of the photosensitive element, and then a layer of transparent photoresist is applied, and a plate-like structure is formed in each pixel by means of lithography. Then, the plate-like structure is converted into a spherical microlens by thermal shaping; however, in the above-mentioned microlens manufacturing method, only a medium-sized and small-area substrate is used, and an expensive photomask and a photomask pair must be used. The camera can only be exposed. Another example is the United States 帛53GG263 special (four) series, which is based on the precision mechanical cutting method on the surface of the test piece to create a number of pyramid structures in the array of test - and then the pattern of the silk surface has a concave fresh tower knot _ metal mold Ren's then put the hardening bribe on the gold staff, and after applying the hardening treatment 1249041, it will directly form a replica with a meniscus microlens on the surface, and then the surface of the electroforming will have a concave curved shape. The metal mold core of the lens can also continue to be turned over to form a metal mold core having a convex meniscus microlens array structure on the surface, and a large number of meniscus microlenses are turned over with the final mold core; The cutting method is expensive, and is not suitable for medium and large-area microstructure manufacturing, and the meniscus microlens can be formed through secondary rectification, and the precision is less controllable. Further, as described in U.S. Patent No. 5,737,126, the use of a laser to directly heat a glass containing semiconductor particles in an internal material, the glass itself 10 does not absorb the laser beam, and the semiconductor particles absorb the laser beam due to the semiconductor particles. Absorbing a light beam to cause partial melting of the glass to form a microlens shape after solidification. However, in the method of making a microlens by laser, the semiconductor particles may affect the optical properties of the glass, and the microlens formed in a unit area. The quantity is not high. 15 In summary, various microlens methods are known to have a micro lens size that is not precisely manufactured, a small number of microlenses per unit area, or limited by manufacturing equipment. It cannot be applied to various shortcomings of large-area substrates. 2〇 [Summary] Therefore, the main object of the present invention is to provide a microlens manufacturing method, which can form microlenses in small, medium and large-area substrates, and the number of microlenses formed in the unit surface is relatively small. High, the size of the microlens is more accurate, and the production speed is faster and the cost is lower. >5-1249041 In order to achieve the foregoing, the method for manufacturing a microlens according to the present invention comprises the following steps: First, a coating layer is applied on the surface of a substrate by coating, and then laser processing is used along the surface. Irradiating the cover layer with a predetermined path, the cover layer is formed with a plurality of mutually intersecting grooves, and a plurality of microlenses arranged in an array of 5, and finally, the substrate is heated to make the surface of the microlenses spherical; Thereby, a spherical microlens with a relatively accurate size and high density can be manufactured, which can be applied not only to a large-area substrate but also to a spherical microlens for making medium- and small-area substrates; A mold having a spherical microarray structure, and further using the mold to mass-produce a finished product having 10 spherical microlenses. BRIEF DESCRIPTION OF THE DRAWINGS The present invention will be described in detail below with reference to the accompanying drawings in which: FIG. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a first embodiment of the present invention, showing a state in which a coating layer is disposed on a substrate; and a third drawing is a schematic view showing a state in which the display layer is subjected to laser processing; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a first embodiment of the present invention, showing a micro-transparent display of each of the micro-dissections, wherein the surface of the lens of the first preferred embodiment of the present invention is spherical; and the sixth embodiment is a second preferred embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 7 is a schematic view showing a second preferred embodiment of the present invention, showing a state in which a cover layer is provided on a substrate; and an eighth diagram showing a second preferred embodiment of the present invention, showing coverage a state in which the layer is subjected to laser processing; 5 is a schematic view showing a second preferred embodiment of the present invention, showing the state of the microarray structure; and the tenth embodiment is a second preferred embodiment of the present invention The figure shows the state in which the surface of each microarray structure is spherical; the eleventh figure is a schematic view of the second preferred embodiment of the present invention, showing that the surface of the substrate 10 is covered with a metal mold; the twelfth figure is the second of the present invention. BRIEF DESCRIPTION OF THE PREFERRED EMBODIMENT, showing the state of a metal mold; FIG. 13 is a schematic view showing a second preferred embodiment of the present invention, showing the state of a metal mold forming microlens; and FIG. 14 is a second embodiment of the present invention. A schematic of a preferred embodiment showing a finished product having microlenses. Referring to the first to fifth figures, the method for manufacturing the microlens according to the first preferred embodiment of the present invention comprises the following steps: Step 1: As shown in the first figure, prepare a transparent planar substrate (10), base 2 The material of the seesaw (10) can be glass, plastic or flexible film. Step 2: As shown in the second figure, a cover layer (12) is applied on the surface of the substrate (10) by knife coating and soft baked; in this embodiment, the material of the cover layer (12) is A thermoplastic ruthenium molecular film that is transparent. Step 3: As shown in the third and fourth figures, the substrate (1〇) is placed on a moving -7-1249041 platform (XY-stage) (16) and emitted by a quasi-molecular laser (μ). The ultraviolet laser beam illuminates the cover layer (12), and the laser beam is focused by an optical module and then irradiated to the cover layer (12) in a point manner, and the driver drives the moving platform (16) along the first axis (X axis) After linearly shifting for a distance and then exposing, the exposure 5 operation is temporarily stopped, and then the moving platform (16) is linearly displaced along the second axial direction (γ axis) and the interval is reversed along the first axial direction (X axis). The linear displacement is performed at the same distance as above, and the operation is repeated such that the laser (14) erodes the cover layer (12) to a plurality of grooves (18) extending parallel to each other and extending along the first axis (X-axis). Driving the mobile platform (16) to linearly shift a distance 10 along the second axis (γ axis) for exposure, and then temporarily stopping the exposure operation, and then driving the moving platform (16) to linearly shift along the first axis (X axis) Exposing along the same distance of the second axial direction (γ axis) in a second axial direction (γ axis), and thus repeating Therefore, the laser (14) is etched out of the cover layer (12) by a plurality of mutually parallel grooves extending along the second axis (the axis) (not shown), and the cover layer (12) can be formed as I5. The square plate-like structure (2〇) which is isolated from each other and arranged in an array. Step 4· As shown in the fourth and fifth figures, the substrate (1〇) is placed in a heat treatment furnace (not shown) or the heating plate is heated, and the substrate (1〇) is heated to the plate structure (20). When the glass transition temperature is higher than the glass transition temperature, the surface of each plate-like structure (2 turns) is subjected to thermal shaping treatment of the surface texture, and the plate-like structure (2 turns) is formed into a microlens having a spherical shape on the surface (22). . The reason why the bottom of the microlens is squared is mainly because the ratio of the bottom area of the array of microlenses to the substrate area is higher, and the microlens can promote the external coupling coefficient of the planar light-emitting element. Consider two kinds of microlenses with different bottom shapes: round, positive six-8-1249041 edge bottom and square bottom:: round bottom of two kinds of microlenses, positive six-shell microlens_ bottom diameter, positive hexagonal position The length of the side of the square, the length of the bottom of the square is divided by f, and the area of the bottom of the square is "ten" with the substrate "n" (five). It can be seen that when the pitch is the same as the %' bottom microlens and the bottom is square, the area ratio of the microlens is the highest, and the bottom is circular. The area ratio of the microlens is the lowest. Therefore, by the bottom of the microlens The ratio of the area to the substrate area is preferably a microlens at the bottom of the square and the bottom of the regular hexagon, and the ratio of the area of the bottom surface of the microlens to the surface area of the substrate is preferably greater than 0.5, and in addition to considering the The speed and simplicity of the shot processing, the square microlens at the bottom is the best choice. In addition, the smaller the pitch between the microlenses (22), the larger the external coupling coefficient of the planar light-emitting element is promoted, but when the pitch of the plate-like structure (20) is too small, 15 causes the microlens after the thermal shaping (22). The surfaces are bonded to each other to cause different sizes. Therefore, since the coefficient of thermal expansion of the glass substrate (10) is the same, the thermal expansion coefficient of the cover layer (12) is about 1 〇〇 2 (1), and the cover layer ( 12) The surface temperature transfer heat shaping temperature is about 100~200 (°c). Assuming that the above maximum value is taken, the distance d between the plate structures (20) should be greater than 〇.〇3%, where & The bottom side of the structure 2〇(20) is long; however, the distance between the plate structures (20) should still take into account the limits of laser processing. If the laser wavelength is assumed to be 2, that is, 〃 must be greater than i/2. When the temperature rises by ΔΤ, the size increase of the substrate (10) is ALs/, the linear expansion coefficient of the substrate (10) is (crE)s', and the total size of the substrate (10) is ~4 is winter 1249041
L + d + ALSj Q ALSi =(L + d)xATx(CTE)Si ^τ-si =L + d + ALSi = (i + c/)x [1 + ΔΓ x (CTE)sj ] 當溫度上升δγ時，板狀結構(20)的最上方尺寸增加量 5為^所(假設遠離基板(10)的另一面為自由膨脹），板狀結構 (20)的線膨脹係數為，而板狀結構(2〇)最上方的總尺 寸 為 1 + Δ/_ρ/?。 △LpR = L X ΔΤ X (CTE)prL + d + ALSj Q ALSi = (L + d) xATx(CTE)Si ^τ-si =L + d + ALSi = (i + c/)x [1 + ΔΓ x (CTE)sj ] When the temperature rises δγ When the uppermost dimension of the plate-like structure (20) is increased by 5 (assuming that the other side away from the substrate (10) is freely expanded), the linear expansion coefficient of the plate-like structure (20) is, and the plate-like structure ( 2〇) The total size at the top is 1 + Δ/_ρ/?. △LpR = L X ΔΤ X (CTE) pr
Lt_pr =L + ALpr =/-χ[1 + ΔΓχ(〇ΓΕ)ρ/?] 0 當溫度上升ΔΓ時，若板狀結構(2〇)的最上方之總尺寸 和基板(10)的總尺寸^S/相同時，各板狀結構(20)的最上 方將會兩兩相接觸，因而造成相互黏著的現象。 (ί + ίί)χ[ΐ + ΔΓχ(〇ΓΕ)5/] = ί.χ[ΐ + ΔΓχ(〇ΓΕ)ρρ] LxATx[(CTE)pr^(CTE\] 15Lt_pr =L + ALpr =/-χ[1 + ΔΓχ(〇ΓΕ)ρ/?] 0 When the temperature rises by ΔΓ, if the total size of the uppermost plate-like structure (2〇) and the total size of the substrate (10) When ^S/ is the same, the uppermost portions of the plate-like structures (20) will be in contact with each other, thereby causing mutual adhesion. (ί + ίί)χ[ΐ + ΔΓχ(〇ΓΕ)5/] = ί.χ[ΐ + ΔΓχ(〇ΓΕ)ρρ] LxATx[(CTE)pr^(CTE\] 15
1 + ΔΤχ(〇ΓΕ)5/ 若是基板(10)的線膨脹係數為9><1〇'板狀結構(20)的線 膨脹係數為200x10 、溫度差g為175〇C時，stoo334^。 所以，d〉0.0334xL日守，板狀結構(2〇)的最上方才不會相接觸； 於本實施例中，各板狀結構(2〇)之底部邊長最佳為〖至 150μιη ’各板狀結構(2〇)之間距最佳$ 〇j至一，各板狀 結構(20)之南度最佳為底部邊長之ι/4至I。。 經由上述製法以及說明，本發明係結合刮刀塗佈、雷 射加工、表面質傳熱整形的混成技術來製作球狀之微： -10- 20 1249041 鏡二即可於小、中、大面積尺寸之基板成形出微透鏡，而 且早位面積内所成形的微透鏡數量較高，微透鏡之尺寸較 為精確，同時生產速度較快，成本較低。 於上述之製法中，亦可將覆蓋層之材質改為熱塑性光 5阻，熱塑性光阻在步驟三中受到雷射光束之曝光，再藉由 顯影與乾燥加工移除曝光區域後’即可形成若干方形板狀 微透鏡結構’經過步驟四之加熱後，同樣可達到本發明之 目的；而且，上述製法中為了適用於大面積基板，係採用 刮刀塗佈方式塗佈覆蓋層，若是基板為中、小面積時，亦 10可改以旋轉塗佈方式塗佈覆蓋層。 必須加以說明的是，雷射光束也可經不同於上述光學 杈組聚焦後而呈長條狀光束地照射於覆蓋層，因此利用長 條狀之雷射光束進行曝光作業，不需如上述之點狀雷射光 束需線性位移一大段距離而形成線狀溝槽，只要一次作業 15即可完成一線狀溝槽，則本發明之作業時間將更為減低， 當然本發明亦可利用不同之光學模組設計，使該雷射光束 經聚焦後直接呈現多條平行之長條狀光束，或直接成形為 網狀光束。 ’ 本發明亦可應用於製作具有微透鏡結構之模仁，如第 2〇六至第十四圖所示，係為本發明第二較佳實施例所提供微 透鏡之製法，包含有下列步驟： 步驟一：如第六圖所示，製備一第一基板(30)，第一基 板(30)之材質可為玻璃、塑膠、撓性薄膜、金屬，或是陶究。 步驟二：如第七圖所示，於第一基板(30)之表面以刮刀 1249041 L佈方式塗佈一覆盖層(32)並進行軟烤；於本實施例中，覆 盍層(32)之材質係為熱塑性高分子膜。 步驟三：如第八及第九圖所示，將第一基板(30)放在一 移動平台(XY-stage)(36)，並以一準分子雷射(34)所發出之 5每射光束如射覆盍層(32),使覆蓋層(32)受雷射光束照射之 區域曝光，接者驅使移動平台(36)沿χ轴向來回位移，使 雷射(34)將覆蓋層(32)剝蝕出若干相互平行且沿又軸向延伸 之溝槽(38)，以及若干相互平行且沿γ轴向延伸之溝槽（圖 中未示），覆蓋層（32)即可形成若干相互隔離之微陣列結構 1〇 (40) 〇 步驟四··如第十圖所示，將第一基板(3〇)置於一熱處理 爐（圖中未示）中或加熱板加熱，第一基板(3〇)加熱到微陣列 結構(40)之玻璃轉換溫度以上時，微陣列結構(4〇)即會產生 表面貝傳的熱整形處理，使各微陣列結構(4〇)之表面呈球 15 狀。 步驟五：如第十一及第十二圖所示，進行翻模加工， 於本實施例中係先以濺鍍或蒸鍍方法在第一基板(3〇)具有 微陣列結構(40)之表面沈積一金屬薄膜(42)，再接著進行電 鑄加工’使第一基板(30)表面形成一金屬模仁(5〇)，最後分 20離第一基板(30)與模仁(5〇)，模仁(50)之表面即可具有呈陣 列狀排列之方底球狀凹窩(52)。 經由上述製法所完成之模仁(50)，如第十三及第十四圖 所示，可於模仁(50)之各凹g(52)與一透明第二基板(54)之 間塗佈一層紫外線硬化型高分子(56)，並以紫外線成形方法 -12- 1249041 μ:刀子(56) ’接著分離模仁(5〇)與第二基板(54)，即可 二f基板(54)之表面具有若干呈陣列狀排列之方底球狀 微透鏡(58)，藉以翻大量且快速製造的目的。 =外，上述具有微陣列結構之製法中，亦可將覆蓋層 5之材貝改為熱塑性光阻，熱塑性光阻在步驟三中受雷射光 束照射而曝光後，再藉由顯影與乾燥加工移除曝光區域即 可形成若干微透鏡結構，最後經過步驟四之加熱後，同樣 可達到本發明之目的；而步驟五之翻模加工，亦可改用除 氣之液態液態二甲基矽氧莞(polydimethylsiloxane，PDMS) 10洗注於第一基板(30)具有微陣列結構(40)之表面，而後加熱 固化，使第一基板(30)表面形成模仁(50)，最後再分離第一 基板(30)與模仁(50)。1 + ΔΤχ(〇ΓΕ)5/ If the linear expansion coefficient of the substrate (10) is 9><1〇' the linear expansion coefficient of the plate-like structure (20) is 200x10, and the temperature difference g is 175〇C, stoo334^ . Therefore, d>0.0334xL day-to-day, the top of the plate-like structure (2〇) will not be in contact; in this embodiment, the bottom side length of each plate-like structure (2〇) is preferably 〖to 150μιη' The distance between the plate-like structures (2〇) is preferably from 〇j to one, and the south of each plate-like structure (20) is preferably ι/4 to I of the bottom side length. . Through the above-mentioned manufacturing method and description, the present invention is combined with a blending technique of blade coating, laser processing, surface heat transfer and shaping to produce a spherical shape: -10- 20 1249041 Mirror 2 can be used in small, medium and large area sizes. The substrate is formed with a microlens, and the number of microlenses formed in the early area is relatively high, the size of the microlens is relatively accurate, and the production speed is fast and the cost is low. In the above method, the material of the cover layer can also be changed to a thermoplastic light resistance, and the thermoplastic photoresist is exposed by the laser beam in the third step, and then the exposed area is removed by development and drying processing. A plurality of square plate-shaped microlens structures 'after heating in the fourth step can also achieve the object of the present invention; and, in the above method, in order to be applied to a large-area substrate, the coating layer is applied by a doctor blade method, and if the substrate is medium In the case of a small area, the cover layer may be applied by spin coating. It should be noted that the laser beam can also be irradiated onto the cover layer by a long beam of light after being focused differently from the optical group, so that the exposure operation using the elongated laser beam does not need to be as described above. The point laser beam needs to be linearly displaced by a large distance to form a linear groove, and the operation time of the present invention is further reduced as long as a linear operation can be completed in one operation 15. Of course, the present invention can also utilize different The optical module is designed such that the laser beam is directly focused to present a plurality of parallel strips of light, or directly formed into a mesh beam. The invention can also be applied to the production of a mold having a microlens structure, as shown in Figures 2 to 14, which is a method for manufacturing a microlens according to a second preferred embodiment of the present invention, comprising the following steps Step 1: As shown in FIG. 6, a first substrate (30) is prepared. The material of the first substrate (30) may be glass, plastic, flexible film, metal, or ceramic. Step 2: As shown in the seventh figure, a cover layer (32) is coated on the surface of the first substrate (30) by a doctor blade 1249041 L and soft baked; in this embodiment, the cover layer (32) The material is a thermoplastic polymer film. Step 3: As shown in the eighth and ninth diagrams, the first substrate (30) is placed on a moving platform (XY-stage) (36), and each shot is emitted by a quasi-molecular laser (34). The beam, such as the priming layer (32), exposes the region of the cover layer (32) exposed by the laser beam, which in turn drives the moving platform (36) to move back and forth along the χ axis such that the laser (34) will cover the layer ( 32) a plurality of mutually parallel and axially extending grooves (38), and a plurality of grooves (not shown) extending parallel to each other and extending in the y-axis direction, the cover layer (32) forming a plurality of mutual Isolated microarray structure 1〇(40) 〇Step 4· As shown in the tenth figure, the first substrate (3〇) is placed in a heat treatment furnace (not shown) or heated by the heating plate, the first substrate (3〇) When heated above the glass transition temperature of the microarray structure (40), the microarray structure (4〇) will generate surface thermal transfer processing, so that the surface of each microarray structure (4〇) is spherical. 15 shape. Step 5: Performing a mold-turning process as shown in the eleventh and twelfth drawings. In this embodiment, the first substrate (3) has a microarray structure (40) by sputtering or evaporation. A metal film (42) is deposited on the surface, followed by electroforming to form a metal mold (5〇) on the surface of the first substrate (30), and finally 20 points away from the first substrate (30) and the mold core (5〇) The surface of the mold core (50) may have square bottom spherical dimples (52) arranged in an array. The mold core (50) completed by the above-mentioned manufacturing method, as shown in the thirteenth and fourteenth drawings, can be applied between the concave g (52) of the mold core (50) and a transparent second substrate (54). An ultraviolet curing polymer (56) is applied, and the ultraviolet forming method -12-1249041 μ:knife (56)' then separates the mold core (5〇) from the second substrate (54), which is a two-f substrate (54). The surface has a plurality of square-bottomed spherical microlenses (58) arranged in an array, thereby versatile and rapid manufacturing. In addition, in the above method with a microarray structure, the material of the cover layer 5 can also be changed to a thermoplastic photoresist, and the thermoplastic photoresist is exposed by the laser beam in step 3, and then developed and dried. The micro-lens structure can be formed by removing the exposed area, and finally the object of the invention can be achieved after the heating of the fourth step; and the mold-cutting process of step 5 can also be changed to the liquid liquid dimethyl oxime of the degassing liquid. Polydimethylsiloxane (PDMS) 10 is applied to the surface of the first substrate (30) having the microarray structure (40), and then heat-cured to form a mold core (50) on the surface of the first substrate (30), and finally separated first. The substrate (30) and the mold core (50).
-13- 1249041 【圖式簡單說明】 第一圖係本發明第一較佳實施例之示意圖； 第二圖係本發明第一較佳實施例之示意圖，顯示覆蓋 層設於基板之狀態； 5 第三圖係本發明第一較佳實施例之示意圖，顯示覆蓋 層進行雷射加工之狀態； 第四圖係本發明第一較佳實施例之示意圖，顯示微透 鏡之狀態； 第五圖係本發明第一較佳實施例之示意圖，顯示各微 10 透鏡表面呈球形之狀態； 第六圖係本發明第二較佳實施例之示意圖； 第七圖係本發明第二較佳實施例之示意圖，顯示覆蓋 層設於基板之狀態； 第八圖係本發明第二較佳實施例之示意圖，顯示覆蓋 15 層進行雷射加工之狀態； 第九圖係本發明第二較佳實施例之示意圖，顯示微陣 列結構之狀態； 第十圖係本發明第二較佳實施例之示意圖，顯示各微 陣列結構表面呈球形之狀態； 20 第十一圖係本發明第二較佳實施例之示意圖，顯示基 板表面覆設一金屬模仁； 第十二圖係本發明第二較佳實施例之示意圖，顯示金 屬模仁之狀態； 第十三圖係本發明第二較佳實施例之示意圖，顯示金 -14- 1249041 屬模仁成形微透鏡之狀態；以及 … 第十四圖係本發明第二較佳實施例之示意圖，顯示具 有微透鏡之成品。 5【主要元件符號說明】 10基板 12覆蓋層 14雷射 16移動平台 18溝槽 20板狀結構 22微透鏡 _ 30第一基板 32覆蓋層 34雷射 ίο 36移動平台 38溝槽 40微透鏡 42薄膜 50模仁 52凹窩 54第二基板 56硬化型高分子 58微透鏡 -15-BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a schematic view of a first preferred embodiment of the present invention; the second drawing is a schematic view of a first preferred embodiment of the present invention, showing a state in which a cover layer is disposed on a substrate; 3 is a schematic view showing a first preferred embodiment of the present invention, showing a state in which a cover layer is subjected to laser processing; and a fourth diagram showing a state of a microlens according to a first preferred embodiment of the present invention; A schematic view of a first preferred embodiment of the present invention shows a state in which the surface of each microlens lens is spherical; a sixth embodiment is a schematic view of a second preferred embodiment of the present invention; and a seventh embodiment is a second preferred embodiment of the present invention. The figure shows a state in which the cover layer is disposed on the substrate; the eighth figure is a schematic view of the second preferred embodiment of the present invention, showing a state in which 15 layers are covered for laser processing; and the ninth figure is a second preferred embodiment of the present invention. The figure shows the state of the microarray structure; the tenth figure is a schematic view of the second preferred embodiment of the present invention, showing that the surface of each microarray structure is spherical; 20th eleventh figure is the second preferred embodiment of the present invention The schematic diagram of the embodiment shows that the surface of the substrate is covered with a metal mold; the twelfth is a schematic view of the second preferred embodiment of the present invention, showing the state of the metal mold; and the thirteenth embodiment is a second preferred embodiment of the present invention A schematic view showing the state of gold-14-1249041 being a mold-forming microlens; and Fig. 14 is a schematic view showing a second preferred embodiment of the present invention, showing a finished product having microlenses. 5 [Main component symbol description] 10 substrate 12 cover layer 14 laser 16 mobile platform 18 trench 20 plate structure 22 microlens _ 30 first substrate 32 cover layer 34 laser ίο 36 mobile platform 38 groove 40 microlens 42 Film 50 mold core 52 dimples 54 second substrate 56 hardened polymer 58 microlens-15-