1243795 玖、發明説明： 【發明所屬之技術領域】 本發明是有關於一種微型循環流道裝置，特別是指一 種以導線架製作之微梨循環流道裝置。 5 【先前技術】 現今電子技術日新月異，諸如行動電話（cell phone)、 個人數位助理（PDA)，以及筆記型電腦（Notebook)等之電子 設備，均朝向輕、薄、短、小、美，以及多功能之趨勢發 展，並使得上述電子設備所包含如微處理晶片等之電子元 IQ 件亦隨之小型化’同時更在運鼻速度與處理能重上大幅躍 升，因此相對地在運作的過程中，便相當容易產生熱量累 積，導致元件溫度升高。再加上隨著小型化之趨勢所造成 的總體電子元件密度提高’以及因高速電路所造成之高頻 電流，使得各個元件與系統受限於工作溫度而無法展現實 15 際效能之事時有所聞。因此’為能有效提供各電子元件， 特別是如微處理晶片等關鍵性元件之散熱，業界便有運用 微系統技術發展微型冷卻裝置的建議。 微系統技術是指製造體積微小、具有功能且自成系統 之結構的技術，一般如微機電系統 20 (Micro-Electro-Mechanical System, MEMS)、微機光系统 (Micro-Optic-Mechanical System，MOMS)，以及微光機電 系統（Micro-Electro-Mecha- Optical System，MEMOS)等， 均屬於微系統技術之領域。由於微系統可廣泛地應用於資 訊電子、光電通訊、精密機械、環保監控、醫療生化等領 4 1243795 域，並可大幅提昇各個領域之技術水準，故為現今科技發 展之關鍵技術領域，而其中又以釐米（mm)級至微米（// m) 級之微型結構的製造技術扮演極為重要的角色，因此，現 行應用於製作微型冷卻裝置的微系統技術便是以釐米（mm) 5 級至微米（// m)級之微型結構為主。 現有微型結構的製造方法可分為可批造（batch process) 與非批造（non-batch process)，其中可批造的技術包含有基 體細微加工（bulk micro machining)、表面細微加工（surface micro machining)，以及微光刻電鑄模造（LIGA，a German 10 acronym for lithographie，galvanoformxmg，abformung)等， 其主要是沿用現有半導體之微電子技術發展而來，因此相 當成熟。然而其中前兩項技術的缺點在於無法進行高深寬 比（high aspect ratio)，以及複雜的三度空間立體結構加 工，因此應用於製作立體微型結構時便受到相當的限制。 15 而微光刻電鑄模造則雖是以批造為目的所研發之技術，但 由於其所需設備及生產成本較高，且在壓鑄或射出成形等 技術上仍存在瓶頸，因此實際上仍無法以低成本大量批造 進行微型結構之製作。 非批造的技術則包含有微精密加工（precision micro 20 machining)、微放電加工（electro-discharge micro machining)，以及微雷射加工（】aser micro machining)等， 其雖可進行較高深寬比，以及較複雜之三度空間立體結構 加工，但由於無法批造，因此無法藉由大量生產以降低成 本發揮微系統之優勢。 1243795 【發明内容】 本發明之主要目的是在提供—種以導線架製作之微 型循環流道裝置。 本發明之另-目的是在提供一種可批造製 循環流道裝置。 本發明之又一目的是在提供一種用於熱量移轉之微 型循環流道裝置。 本發明之再一目的是在提供一種可批造製作且呈現 立體狀態之微型循環流道裝置。 本發明以導線架製作之微型循環流道裝置是用於將 回/皿區之熱1移轉至一低溫區，該微型循環流道裝置包 括至少一形成有一循環流道路徑之導線架、一固設於該導 線架上並涵蓋該循環流道路徑之蓋體，以及一容裝於該循 袠机道路徑内以將該咼溫區之熱量移轉至該低溫區之流 體。該循環流道路徑包含至少一鄰近該高溫區之集熱流 道、至少一鄰近低溫區之散熱流道、一由該散熱流道連通 至孩集熱流道之低溫輸送流道，以及一由該集熱流道連通 至該散熱流道之高溫輸送流道。 本發明之功效是運用導線架之製程技術，於導線架上 製作一微型循環流道路徑，不僅能進行熱量移轉而達到降 低設置該微型循環流道裝置於其上之元件溫度的效果；更 能以較低成本製造微米級且呈平面狀態、甚至立體狀態之 微型循環流道路徑。此外，本發明能整合運用現有的、技 術已療成熟的導線架製程的微系統技術，因而具有可大量 1243795 批造生產，以及降低生產成本之優勢。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之二較佳實施例的詳細說明中，將可清 5 楚的明白。在提出詳細說明之前，要注意的是，在以下的 敘述中，類似的元件是以相同的編號來表示。 如圖1及圖2所示，本發明以導線架製作之微型循環 流道裝置1的第一較佳實施例，是供設置於一如晶片之發 熱元件9上’以將其產生的熱量由一高溫區移轉至一 10 低溫區92,該微型循環流道裝置1包括一形成有一循環流 道路徑20之導線架2、一固設於該導線架2上並涵蓋該循 環流道路徑20之蓋體3，以及一容裝於該循環流道路徑 20内用於移轉熱量之流體。 在本實施例中，該導線架2在製作之前為一包含97% 15 的鋼金屬且厚度為之金屬薄片。如圖3所示，一 般用於製作電性連接用之導線架2，多是先取如2及瓜X 26cm的大型薄銅片，先劃分成複數區塊23後，再同時於 各孩區塊23上以相同的圖案形成鏤空區域，之後加以切 割分離，而以各該區塊23為單位完成最終之產品。故在 2〇 卩下的說明中，雖是以單-導線架2製作單—微型流道裝 置时1，但熟習該項技藝者當能輕易推想，本發明當然也能 以單一導線架2同時製作多個微型流道裝置i。 如圖1所示，該導線架2具有一第一基面21以及一 相反於該第一基面21之第二基面22,在本實施例中，該 1243795 循環流道路徑20是採用蝕刻之方式，於該導線架2上形 成由該第一基面21往該第二基面22方向延伸之凹槽所構 成，並移除該導線架2之一部份，但並不以此為限，其也 可以改採如雷射等方式於該導線架2上形成該循環流道路 5 徑 20。 如圖2所示，該循環流道路徑20包含複數鄰近該高 溫區91之集熱流道201、複數鄰近該低溫區92之散熱流 道202、一由該等散熱流道202連通至該等集熱流道201 之低溫輸送流道203、一由該等集熱流道201連通至該等 10 散熱流道202之高溫輸送流道204，以及一連通該低溫輸 送流道203與該高溫輸送流道204之低溫次流道205。 該低溫輸送流道203具有一鄰近該等散熱流道202之 儲存室段2031，藉以儲存系統運作所需之流體，以及一連 通該儲存室段2031與該等集熱流道201之輸送段2032。 15 該高溫輸送流道204具有複數分別與該等集熱流道 201其中部分集熱流道201相連通之變斷面段2041、複數 分別與各該變斷面段2041相連通之喉部段2042、2042’， 以及一與所有喉部段2042、2042’相連通之混合室段 2043。該變斷面段2041之截面積大於各該集熱流道201 20 與各該輸送段2032之戴面積，並往各該喉部段2042、2042’ 方向漸縮。各該喉部段2042、2042’之截面積則均小於各 該變斷面段2041之截面積，而該低溫次流道205連通於 其中之一喉部段2042’上，並藉以使部分低溫流體直接地 由該低温輸送流道203在不經過該高溫區91的情況下， 1243795 直接由該喉部段2042’輸送至該混合室段2043。 該高溫輸送流道204更具有複數與該混合室段2043 相連通之大截面段2044，以及複數分別與各該大截面段 2044相連通之小截面段2045，各該小截面段2045之截面 積小於各該大截面段2044之截面積，且鄰近該等散熱流 道202 ;相對於該等小截面段2045，該等大截面段2〇44 則遠離該等散熱流道202。 如圖1及圖2所示’該蓋體3設置於該第一基面21 上’並封閉该循環流道路徑20 ;在本實施例中，該蓋體3 為另一導線架，但並非以此為限，該蓋體3之形狀及材質 荨，只要具有一能與該導線架2接合之接合面31之材料， 均能適用於本發明中。換言之，上述蓋體3也可以為導線 架以外的其他任何適用之形狀、材質的物體。 上述流體則是容裝於該循環流道路徑2〇内，藉以將 該高溫區91之熱量移轉至該低溫區92。在本實施例中， 该流體為蒸餾水或去離子水，但並不以此為限，如甲醇及 丙酮等之有機溶劑，或其他冷卻劑（或冷媒），甚至空氣也 都可以作為該微型循環流道裝置i中用於移轉熱量之流 體。由於此非本發明之主要特徵，且為熟悉該項技術者所 易於思及，故在此不多加贅述。 承上所述，當例如為蒸餾水或去離子水等之流體充滿 於該循環流道路徑20内時，由於該儲存室段2〇31之截面 積大於該輸送段2032之截面積，該流體大部分將儲存於 該儲存室段2031，在本實施例中在該處之流體溫度較低且 1243795 呈液態，其溫度與環境溫度接近，並可經由該輸送段2032 流動至該等集熱流道201。由於該集熱流道201呈區域分 布，因此使得該流體容易吸收該等位於該高溫區91之發 熱元件9所產生之熱量。故當該發熱元件9產生之熱量累 5 積導致溫度升高超過工作流體之沸點時（以水為例約100 °C)，經由熱交換作用，使熱量由該流體吸收後，將使該流 體溫度升高，並進而使其呈蒸氣狀態。而且由於流道經過 設計，使得該等變斷面段2041之截面積相對於該等集熱 流道201及該輸送段2032之截面積為大，故相對壓力較 10 低，因此位於該等集熱流道201内之呈蒸氣狀態之流體便 自然地往該等變斷面段2041流動，並同時對該輸送段2032 内之低溫流體產生汲取的力量，進而使得位於該低溫輸送 流道203内之流體往該集熱流道201方向流動。 而該吸收熱量並呈蒸氣狀態之流體由該等變斷面段 15 2041流向該等喉部段2042、2042’時，由於截面積漸縮的 原因，將使該流體逐漸加速流動，並在流經各該喉部段 2042、2042’時產生高速，此時因高速流體將產生相對低 壓，因此將使得產生於該喉部段2042’之低壓對該低溫次 流道205内之流體產生一吸取力量，而將位於該低溫次流 20 道205内之液態流體吸入該喉部段2042’，並與由各該喉 部段2042、2042’流出之蒸氣狀態流體一同流入該混合室 段 2043 。 因此，位於該混合室段2043之流體溫度雖已下降， 但其僅為低溫流體與高溫流體熱平衡所造成之效果，並未 1243795 真正將熱量由流體内移出，因此仍須將該混合室段2043 内之流體藉由該高溫輸送流道204導引至該等散熱流道 202内進行散熱。由於各該小截面段2045之截面積小於各 該大截面段2044之截面積，因此流體於各該小截面段2045 5 内之毛細力大於各該大截面段2044之毛細力，因此位於 該混合室段2043内之流體能自然地藉由毛細力之吸引經 由各該大截面段2044流向各該小截面段2045，最後流入 該等散熱流道202，將流體所吸收之熱量藉由熱交換作用 傳送至該低溫區92，而完成熱量之移轉。 10 上述集熱流道201截面積較小，其目的在於藉由毛細 現象汲取該輸送段2032内之低溫流體，同時設置多數該 集熱流道201增加其分布區域所涵括之總面積，以達到更 好的集熱功效。此外，上述集熱流道201之總截面積亦相 對地大於該輸送段2032之截面積，以容置由該輸送段2032 15 流來之低溫流體，並同時達到降低其位於各該集熱流道 201内時之流速，使其能充分地進行熱交換。 當然，本發明並不以上述態樣為限，如圖4及圖5所 示，該導線架2也能於單一集熱流道201内形成有複數擾 流凸片24,藉以使該流體與該導線架2之接觸面積增加， 20 使吸附現象更為顯著。當然，該等擾流凸片24也能同時 形成於該蓋體3相對應於該集熱流道201之處，以加強該 流體於該集熱流道201内之吸附現象。 此外，圖1所示之該低溫次流道205、各該喉部段 2042、2042’，以及該混合室段2043是配套設置的，其目 η Ϊ243795 的在導引位於該儲存室段2031内之低溫流體與由該等集 熱流道201流出之咼溫流體混合，而達到快速降溫之目 的，使得該高溫流體能在流出該高溫區91後迅速降溫。 5 10 15 20 惟該低溫次流道205、各該喉部段2042、2042,，以及該混 合室段2043並非必要元件，若未設置上述元件仍能實施 本發明。 至於上述以導線架製作之微型循環流道裝置2之製造 方法’則如圖6所示，包含下列步驟： 步驟1〇〇,如圖7所示，製備一具有一預定圖形⑼之 光罩6;該預定圖形6〇所具有之圖像即為上述循環流道路 徑2〇(見圖2)之投影圖像。 步驟102,塗佈一光阻層62於該導線架2之第一基面 21 上； & ㈣Π)4’_8所示’以曝光顯影之方式將該光罩 61之該預定圖形60轉移至該綠層62上。經由±述㈣ 100至步驟1〇4便完成將該預定圖形6〇定義於該導線架2 上之步驟。 步驟1〇6’如圖9所示，以該光阻層62為遮罩，並以 姓刻之方式移除該導線架2對應於該預定圖形6q之一部 份，_斷.寬’由該第一基面2ι向該第 22方向延伸卿01深之半㈣環流道路徑20,之後^移 除該光阻層/2。當然，上述流道之寬深尺寸並非以此為 限’其可依糸統需求進行變更。 步驟⑽，對該導線架2進行表面處理。在本實施例 12 1243795 中是以5%之稀硝酸溶液清洗該導線架2後，再以清水沖 洗邮乾，以去除該導線架2表面沾附之雜質。 步驟110，如圖1〇所示，鍍設一烊材7於該導線架2 上。在本實施例中，是以電鐘方式沉積6//m厚之錫銅合 金於該導線架2上。當然，錢設該焊材7之方式並不以電 鍍為限，也可以採用蒸鍍及濺鍍等其他方式；同時，該焊 材7之材質也能以如錫金屬及錫銦合金等及錫銅合金等其 他低熔點金屬替代。 八 、而"亥焊材7之厚度也非限定為ό // m，由於該焊材7 是為了在後續步驟中，於該導線架2及該蓋體3(見圖υ 彼此鄰接處形成介金屬，因此其厚度在至之 耗圍較能達到所需強度。需加以說明的是，採用電錢之方 法沉積該焊材7時，雖然難㈣免使得部分該焊材7進入 該循環流道路# 2G内，但由於其厚度㈣於該循環流道 路佐20之尺寸極小，因此將不至於影響該循環流道路徑 2〇設計所預期之功效。 v驟112如圖11所示，將該涵蓋該循環流道路徑2〇 之蓋體3貼靠於該焊材7上。 v驟114，加熱使該焊材7呈炼融狀態，同時施加一 使該蓋體3與該導線架2相互迫近之力量，以使該蓋體3 固接於該導線架2上。因在本實施例中該焊材7為錫銅合 金’故本步驟是以熱壓機在6〇分鐘的時間心施加並維 持40 kg/cm2之壓力，並加熱到2〇(^至25〇。〇之溫度範 圍’使該焊材7與該導線架2及該蓋體3之接觸部形成介 13 1243795 金屬’從而使該導線架2及該蓋體3彼此接合。 經過上述步驟11〇至步驟114，便能將該涵蓋該循環 流道路徑20之蓋體3如圖1所示地固設於該導線架2上， 形成該微型流道裝置i。 通常在上述製作過程中會預留一與外界連通之穿孔 (圖未示）’以便在完成上述步驟後，將流體注入該循環流 道路仅20内。雖然若是設計以空氣為該流動於該微型流 道内之流體’只要在上述製作過程並非使用高真空爐，則 在製作過程中空氣自然佔據該循環流道路徑2〇内之空 間，而在該循環流道路徑2〇形成後，便同時存在於該循 環流道路徑20中。但若固設該蓋體3於該導線架2上時 為接近真空之低壓狀態時，則仍然必須預留一穿孔以供空 氣進入該循環流道路徑2〇内。 由上述可知，該蓋體3可以直接地採用另一導線架， 因此’如圖12所示，本實施例之另一態樣便是在步驟ι12 前，於該蓋體3鄰近該導線架2側先形成有一對應於該循 環流道路徑20之渠道33,以使得在步驟112中將該蓋體3 貼靠於該焊材7(見圖11)上時，使該循環流道路徑2〇與該 ‘道33彼此相連通，以增加該循環流道路徑2〇之截面 積。而該蓋體3形成上述渠道33之方式，則同樣地可以 採用上述步驟iOO至步驟1〇6之方式形成。 需說明的是，上述固接該蓋體3與該導線架2之方 式，雖屬於低溫焊接之技術領域，但其固接方式並不以此 為限’其他包含擴散軟焊等的低溫焊接法，也同樣能適用 14 1243795 於本發明之中。事實上口要1 導線苹2上之方4 亥盍體3固設於該 ^ 方式，如膠黏、—般焊接，或以夾具固定等 方法，均此適用於本發明中。 5 10 15 20 但須注意的是，若該循環流道路徑2〇設計之 度低於選狀接合材㈣熔點溫度，料射以採用^ 膠黏及-般焊接等方法；其中，若是採用—般電子產業所 使用之錫㈣為該焊材7(見圖1υ之材f，則在上述步驟 110則能以網印或旋料方式將該焊材7塗佈於該導線架2 上。若該循環流道路徑2G設計之工作溫度較高，則除了 上，以低溫焊接之方法外，另外也可以制硬焊方法進行 該蓋體3與該導線架2之接合。 如圖13所示，本實施例之另一態樣，該微型循環流 道裝置1更包括複數設置於該蓋體3上鄰近該等散熱流道 202之散熱鰭片4,藉以提昇散熱效率。在本實施例中， 該微型循環流道裝置！是以該導線架2直接地貼靠於該發 熱元件9上，因此該等散熱鰭片4便設置於該導線架之遠 離該發熱元件9側的該蓋體3上。#然，設置該等散熱讀 片4之位置不以此為限，而可以因應配合設置在任何適當 的位置；例如當該微型循環流道裝置1是以該蓋體3直接 貼靠於該發熱元件9上時，則該等散熱鰭片4當然也可以 改設在該導線架2遠離該蓋體3的該第二基面22上，同 樣也能達到提昇該微型循環流道裝置1散熱效率的功效。 如圖14所示，本實施例之又一態樣，該微型循環流 道裝置1更包括一與該低溫輸送流道203相連通並藉以驅 15 1243795 動該流體於該循環流道路徑2〇内流動之驅動裝置5。同樣 :二動裝置5亦非必要元件，由上述可知該微型_ =道裝置1衫需要外加之驅動力，便《熱量由該高溫 5 10 15 20 區91移轉至該低溫區92。不過，由於該高溫區91必須達 到-定之高溫以上方能使該微型循環流道裝置！自然地達 到上述熱量㈣之功效（在此所謂的高溫料是指接近該 流體之沸點），因此，若希望在該高溫區％溫度未達上述 南溫時即能藉由該微型循環流道裝置1進行冷卻，或者欲 對該微型循環流道裝進行其他之㈣，則可藉由設置 該驅動裝置5加以達成。 $如圖15及圖16所示，本發明以導線架製作之微型循 U蒇置1的第二較佳實施例之主要元件與上述第一較 佳實施例大致相同，且同樣是用於將熱量由-高溫區91 移轉至—低溫區92。其差異在於，在本實施例中，該微型 循壤流道裝置1包含複數彼此相鄰且形成有該循環流道路 徑2〇之導線架2、2,、-固設於該等導線架2、2,其中之 -導線架2上之底板8，以及一蓋設於該等導線架2、2, w中另導線宋2’上之蓋體3 ;該底板8與該蓋體3均涵 蓋該循環流道路徑20。該循環流道路徑20可分為一主循 環流道路徑2002及一與該主循環流道路徑2〇〇1相連通之 次循環流道路徑2002，其中，該主循環流道路徑 2001 形 成於該等導線架2、2,其中鄰近該底板8之一導線架2上， 而該次循環流道路徑2002則是形成於該等導線架2、2,其 中鄰近該蓋體3之另一導線架2,上。故該等導線架2、2， 16 1243795 所界定之該循環流道路徑20並非限於同一平面上，而是 呈立體狀態；且在本實施例中，該底板8與該蓋體3同樣 為與上述導線架2相同之另一導線架，但並非以此為限； 而該高溫區91與該低溫區92則分別位於該微型循環流道 5 裝置1之相反兩側。 該主循環流道路徑2001包含複數鄰近低溫區92之散 熱流道202、一與該等散熱流道202連通之低溫輸送流道 203，以及一與該低溫輸送流道203相連通之低溫次流道 205;而該次循環流道路徑2002則包含一鄰近該高溫區91 10 並與該低溫輸送流道203相連通之集熱流道201、一由該 等集熱流道201連通至該等散熱流道202並與該低溫輸送 流道203相連通之高溫輸送流道204。因此，在本實施例 中由該主循環流道路徑2001與該次循環流道路徑2002所 構成之循環流道路徑20便具有與上述第一較佳實施例之 15 循環流道路徑20所具有之功效。 該具有呈立體狀態之循環流道路徑20的微型循環流 道裝置1可以上述第一較佳實施例中所介紹之製作方法製 造，如圖17所示，以下則介紹另一亦能應用於本發明各 式微型循環流道裝置1的製作方法，其包含下列步驟： 20 步驟300，如圖18所示，以機械沖壓方式移除該導線 架2之一部份，形成該貫穿該導線架2之該主循環流道路 徑 2001 。 步驟302，對該導線架2進行表面處理。 步驟304，如圖19所示，將該涵蓋該主循環流道路徑 17 1243795 2001之底板8貼靠於該導線架2上。 步騾306,加熱該導線架2及該底板8接近熔融狀態， 同時施加一使該底板8與該導線架2相互迫近之力量，使 該底板8固設於該導線架2上。在本實施例中本步驟是以 5 高真空爐在5xl(T5T〇rr之環境下，施加4000Pa之力量，並 加熱到至950°C，維持1〇小時進行接合。當然，該底板8 固設於該導線架2上之方法並非以此為限，其亦可採用第 一實施例所述之任一接合方法；但需注意的是，其接合後 所適用之溫度及強度需符合後續步驟中所發生之溫度及 _ 10 壓力。 步驟308,如圖20所示，固設該形成有該次循環流道 路徑2002之另一導線架2,於該形成有該主循環流道路徑 2001之導線架2上，並使該次循環流道路徑2002與該主 循環流道路徑2001相連通；而該等導線架2、2,之固接方 15 式可採用前述之任一接合方法完成。 步驟310，如圖21所示，固設該蓋體3於該形成有該 次循環流道路徑2002之導線架2,上，其固接方式可採用 鲁 前述之任一接合方法完成。 _ 步驟312，注入該流體進入該循環流道路徑2〇内，以 20 完成該冷卻裝置1。此步驟是藉由原先預留於該等導線架 2、2’、該底板8，或該蓋體3上之穿孔（圖未示），將該流 體注入該循環流道路徑20内。 由於上述包含該等散熱流道202之主循環流道路徑 2001鄰近邊底板8 ’故如圖22所示，在本實施例包含複 18 1243795 數散熱‘鰭片4之另一態樣中，該等散熱縛片是設置於該底 板8上。當然，上述主循環流道路徑2〇〇1也可以採用如 第一較佳實施例所介紹之半蝕之方式直接於該導線架2上 形成，而非限定以該底板8封閉該主循環流道路徑2〇〇1 5 之方式形成；而此時該等散熱鰭片4則能直接地設置於該 導線架2上。 由上述可知，本發明以導線架製作之微型循環流道裝 置1不僅能以一導線架2與另一作為該蓋體3之導線架接 合形成該循環流道路徑20,也能以一導線架2及另兩分別 _ 1〇 作為該底板8和該錢3之導線架接合形成該循環流料 . 徑20;更可以藉由重覆上述步驟3〇8，將多個導線架彼此 接合而形成呈現立體交錯型式之循環流道路徑2〇，使得該 微型循環流道裝置1之設計與運用更具彈性，而得以廣泛 地運用於各種電子設備。 15 练上所述，本發明以導線架製作之微型循環流道裝置 1，除能迅速有效地整合運用現有技術成熟導線架之製程 外，更能充分利用導線架可大量批造生產之優勢，使得生 鲁 產成本大幅降低，成功地達成以較低之生產成本製造微米 · 級之循環流道路徑20，甚至能藉由疊合多層導線架2，使 ° 以低成本大量批造製作具有立體循環流道路徑20之微型 擔環流道裝置1的目的得以實現。 惟以上所述者，僅為本發明之二較佳實施例而已，當 不能以此限定本發明實施之範圍，即大凡依本發明申請專 利範圍及發明言兒明書内容所作之簡單的等效變化與修 19 ^243795 年普應仍屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 5 圖1是本發明以導線架製作之微型循環流道裝置的第 幸乂佳實施例的一側面圖； 、 10 15 圈2是沿圖i中之線π·π的一剖面 圖3是該第一較佳實施例之一平面圖，㈣一導線 具有複數區塊； 、7' 圖4是該第一較佳實施例之一部份側面圖，說 環流道路鄉μ魏㈣w ; 月―4 圖5是沿圖4中之線ν_ν的一剖面圖； 圖6是該第一較佳實施例之一流程圖； ^圖7是該第一較佳實施例之一剖面圖，說明具有一預 疋圖形之一光罩與塗佈有一光阻層之一導線架； 圏8是該第一較佳實施例之一剖面圖，說明定義該預 定圖形於該導線架上； 〆、 圖9是該第一較佳實施例之一剖面圖，說明移除該導 線架之部份以形成該循環流道路徑；1243795 发明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a miniature circulation channel device, and particularly to a micro pear circulation channel device made of a lead frame. 5 [Previous technology] Today's electronic technology is changing with each passing day. Electronic devices such as cell phones, personal digital assistants (PDAs), and notebooks are all light, thin, short, small, and beautiful. The trend of multifunctional development has made the electronic device IQ components such as micro-processing chips included in the above-mentioned electronic equipment also miniaturized with it. At the same time, the nose transport speed and processing energy have greatly increased, so the process is relatively in operation Medium, it is quite easy to generate heat, which will cause the component temperature to rise. Coupled with the increase in the overall density of electronic components caused by the trend toward miniaturization, and high-frequency currents caused by high-speed circuits, it is not always possible for individual components and systems to be limited in operating temperature to achieve realistic performance. Heard. Therefore, in order to effectively provide heat dissipation for various electronic components, especially key components such as micro-processing wafers, the industry has proposed the use of micro-system technology to develop micro-cooling devices. Micro system technology refers to the technology of manufacturing a small, functional and self-contained structure, such as Micro-Electro-Mechanical System (MEMS), Micro-Optic-Mechanical System (MOMS) , And Micro-Electro-Mecha- Optical System (MEMOS), etc., all belong to the field of micro-system technology. Microsystems can be widely used in the fields of information electronics, optoelectronic communication, precision machinery, environmental monitoring, medical and biochemical fields, etc., and can greatly improve the technical standards of various fields. Therefore, microsystems are the key technology areas of current technology development, and among them, It also plays a very important role in the manufacturing technology of micro-structures from the centimeter (mm) to the micrometer (// m) level. Therefore, the current micro-system technology used to make micro cooling devices is from the centimeter (mm) 5 to Microstructures at the micron (// m) level are predominant. The existing manufacturing methods of microstructures can be divided into batch process and non-batch process. The batch process technologies include bulk micro machining and surface micro machining. machining), and microlithography electroforming molds (LIGA, a German 10 acronym for lithographie, galvanoformxmg, abformung), etc., which are mainly developed from the existing microelectronic technology of semiconductors, so they are quite mature. However, the disadvantages of the first two technologies are that they cannot perform high aspect ratio and complex three-dimensional spatial three-dimensional structure processing, so they are quite limited when applied to the production of three-dimensional micro-structures. 15 Although microlithography electroforming mold technology is developed for batch manufacturing purposes, it still has bottlenecks in technology such as die casting or injection molding because of the high equipment and production costs required, It is not possible to mass-produce microstructures at low cost. Non-batch technologies include precision micro 20 machining, electro-discharge micro machining, and aser micro machining, etc., which can perform higher aspect ratios. , And the more complicated three-dimensional spatial three-dimensional structure processing, but because it cannot be batched, it cannot use the advantages of microsystems to reduce costs through mass production. 1243795 [Summary of the invention] The main object of the present invention is to provide a micro-circulation channel device made of a lead frame. Another object of the present invention is to provide a batch-flowable circulation channel device. Another object of the present invention is to provide a micro-circulation flow path device for heat transfer. Another object of the present invention is to provide a micro-circulation channel device which can be manufactured in batches and presents a three-dimensional state. The miniature circulating flow channel device made by the lead frame of the present invention is used to transfer the heat 1 in the return / plate area to a low temperature area. The miniature circulating flow channel device includes at least one lead frame forming a circulation flow path, a A cover fixed on the lead frame and covering the circulation flow path, and a fluid contained in the circulation path to transfer the heat in the high temperature region to the low temperature region. The circulation flow path includes at least one heat collecting flow path adjacent to the high temperature region, at least one heat dissipation flow path adjacent to the low temperature region, a low temperature conveying flow path communicating with the heat collecting flow path from the heat collecting flow path, and The hot runner is connected to the high-temperature transport runner of the heat dissipation runner. The effect of the present invention is to use the process technology of the lead frame to make a micro-circulation flow path on the lead frame, which can not only perform heat transfer and reduce the temperature of the component on which the micro-circulation flow device is arranged; more The micro-circular flow path can be manufactured at a low cost in a micrometer level and in a planar state or even a three-dimensional state. In addition, the present invention can integrate the existing micro-system technology of a mature lead frame process, and thus has the advantages of mass production of 1,243,795, and reduction of production costs. [Embodiment] The foregoing and other technical contents, features, and effects of the present invention will be clearly understood in the following detailed description of the preferred embodiment with reference to the second drawing. Before giving a detailed description, it should be noted that in the following description, similar elements are denoted by the same reference numerals. As shown in FIG. 1 and FIG. 2, the first preferred embodiment of the micro-circulation channel device 1 made of a lead frame according to the present invention is provided on a heating element 9 like a chip, so that the heat generated by the chip is A high-temperature region is transferred to a 10 low-temperature region 92. The miniature circulating flow channel device 1 includes a lead frame 2 forming a circulating flow channel path 20, and is fixed on the lead frame 2 and covers the circulating flow channel path 20. The cover body 3 and a fluid contained in the circulation flow path 20 for transferring heat. In this embodiment, the lead frame 2 is a thin metal sheet with a thickness of 97% 15 of steel metal before fabrication. As shown in Figure 3, lead frames 2 are generally used to make electrical connections. Most of them are large thin copper sheets such as 2 and melons X 26cm, which are divided into multiple blocks 23 and then simultaneously in each child block. The hollow area is formed on the same pattern on 23, and then cut and separated, and the final product is completed by using each block 23 as a unit. Therefore, in the description below 20 °, although the single-mini-flow channel device 1 is made by using the single-lead frame 2, those skilled in the art can easily imagine that the present invention can also use a single lead frame 2 at the same time. A plurality of miniature flow channel devices i are produced. As shown in FIG. 1, the lead frame 2 has a first base surface 21 and a second base surface 22 opposite to the first base surface 21. In this embodiment, the 1243795 circulation flow path 20 is etched. In this way, a groove formed by the first base surface 21 in the direction of the second base surface 22 is formed on the lead frame 2, and a part of the lead frame 2 is removed, but this is not the case. However, it can also be changed to form the circulating flow path 5 diameter 20 on the lead frame 2 by means such as laser. As shown in FIG. 2, the circulation runner path 20 includes a plurality of heat collecting runners 201 adjacent to the high temperature region 91, a plurality of heat dissipation runners 202 adjacent to the low temperature region 92, and one of the heat sinks 202 is connected to the heat sinks. A low-temperature transport runner 203 of the hot runner 201, a high-temperature transport runner 204 connected to the 10 heat-dissipating runners 202 by the heat collecting runner 201, and a low-temperature transport runner 203 and the high-temperature transport runner 204 The low temperature secondary flow channel 205. The low-temperature conveying flow channel 203 has a storage chamber section 2031 adjacent to the heat-dissipating flow channels 202, so as to store the fluid required for the operation of the system, and a conveying section 2032 connecting the storage chamber section 2031 and the heat collecting flow channels 201. 15 The high-temperature conveying flow channel 204 has a plurality of variable section sections 2041 that are respectively connected to some of the heat collecting channels 201 of the heat collecting channels 201, and a plurality of throat sections 2042 that are respectively connected to the variable section sections 2041. 2042 ', and a mixing chamber section 2043 in communication with all throat sections 2042, 2042'. The cross-sectional area of the variable section section 2041 is larger than the wearing area of each of the heat collecting channels 201 20 and each of the conveying sections 2032, and gradually tapers in the direction of each of the throat sections 2042 and 2042 '. The cross-sectional area of each of the throat sections 2042 and 2042 'is smaller than the cross-sectional area of each of the variable section sections 2041, and the low-temperature sub-flow channel 205 communicates with one of the throat sections 2042', thereby making part of the low temperature The fluid is directly transferred from the low-temperature conveying flow channel 203 to the mixing chamber section 2043 directly from the throat section 2042 'without passing through the high-temperature zone 91. The high-temperature conveying flow channel 204 further has a plurality of large-section sections 2044 communicating with the mixing chamber section 2043, and a plurality of small-section sections 2045 communicating with each of the large-section sections 2044, and a cross-sectional area of each of the small-section sections 2045. It is smaller than the cross-sectional area of each of the large-section sections 2044 and is adjacent to the heat-dissipating flow channels 202; compared with the small-section sections 2045, the large-section sections 2044 are far away from the heat-dissipating flow channels 202. As shown in FIG. 1 and FIG. 2, the cover 3 is disposed on the first base surface 21 and closes the circulation flow path 20. In this embodiment, the cover 3 is another lead frame, but is not As a limitation, the shape and material of the cover 3 can be applied to the present invention as long as the cover 3 has a joint surface 31 that can be joined with the lead frame 2. In other words, the cover 3 may be an object of any suitable shape and material other than the lead frame. The above fluid is contained in the circulation flow path 20, thereby transferring the heat of the high temperature region 91 to the low temperature region 92. In this embodiment, the fluid is distilled water or deionized water, but is not limited thereto. Organic solvents such as methanol and acetone, or other coolants (or refrigerants), and even air can be used as the micro-circulation. The fluid in the flow channel device i is used for transferring heat. Since this is not the main feature of the present invention, and it is easy for those skilled in the art to think about it, it will not be repeated here. As mentioned above, when a fluid such as distilled water or deionized water is filled in the circulation flow path 20, since the cross-sectional area of the storage chamber section 2031 is larger than the cross-sectional area of the transport section 2032, the fluid is large. Part of it will be stored in this storage chamber section 2031. In this embodiment, the fluid temperature there is low and 1243795 is liquid, its temperature is close to the ambient temperature, and it can flow to the heat collecting channels 201 through the conveying section 2032. . Since the heat collecting channels 201 are distributed in regions, the fluid easily absorbs the heat generated by the heating elements 9 located in the high temperature region 91. Therefore, when the accumulated heat generated by the heating element 9 causes the temperature to rise above the boiling point of the working fluid (about 100 ° C in the case of water), heat is absorbed by the fluid through heat exchange, which will cause the fluid to The temperature rises, which in turn makes it vapor. And because the flow path is designed, the cross-sectional areas of the variable section sections 2041 are larger than the cross-sectional areas of the heat collecting flow paths 201 and the conveying section 2032, so the relative pressure is lower than 10, so it is located in the heat collecting flow. The fluid in the vapor state in the channel 201 naturally flows to the variable section sections 2041, and at the same time, the drawing force of the low-temperature fluid in the conveying section 2032 is generated, so that the fluid located in the low-temperature conveying flow channel 203 Flows in the direction of the heat collecting channel 201. When the fluid that absorbs heat and is in the state of vapor flows from the variable section sections 15 2041 to the throat sections 2042, 2042 ', due to the gradual reduction of the cross-sectional area, the fluid will gradually accelerate and flow in the stream. When passing through each of the throat sections 2042, 2042 ', a high speed is generated. At this time, the high-speed fluid will generate a relatively low pressure, so that the low pressure generated in the throat section 2042' will cause an absorption of the fluid in the low-temperature sub-channel 205 The liquid fluid located in the low-temperature secondary stream 20 channel 205 is sucked into the throat section 2042 ', and flows into the mixing chamber section 2043 together with the vapor state fluid flowing from each of the throat sections 2042 and 2042'. Therefore, although the temperature of the fluid in the mixing chamber section 2043 has decreased, it is only an effect caused by the thermal equilibrium between the low temperature fluid and the high temperature fluid. The 1243795 does not actually remove heat from the fluid, so the mixing chamber section 2043 must still be The fluid inside is guided into the heat-dissipating flow channels 202 through the high-temperature conveying flow channel 204 for heat dissipation. Since the cross-sectional area of each of the small-section sections 2045 is smaller than the cross-sectional area of each of the large-section sections 2044, the capillary force of the fluid in each of the small-section sections 2045 5 is greater than the capillary force of each of the large-section sections 2044, so it is located in the mixing The fluid in the chamber section 2043 can naturally be attracted by capillary forces to flow through the large section sections 2044 to the small section sections 2045, and finally flow into the heat dissipation channels 202, so that the heat absorbed by the fluid can be exchanged by heat. Transfer to the low temperature zone 92, and complete the heat transfer. 10 The cross-sectional area of the above-mentioned collector channel 201 is small. The purpose is to draw the low-temperature fluid in the conveying section 2032 by capillary phenomenon, and at the same time, set most of the collector channel 201 to increase the total area covered by its distribution area to achieve more Good heat collection effect. In addition, the total cross-sectional area of the above-mentioned heat collecting flow path 201 is also relatively larger than the cross-sectional area of the conveying section 2032 to accommodate the low-temperature fluid flowing from the conveying section 2032 15 and at the same time to reduce its position at each of the heat collecting channels 201 The internal flow velocity enables it to fully perform heat exchange. Of course, the present invention is not limited to the above. As shown in FIGS. 4 and 5, the lead frame 2 can also form a plurality of spoiler fins 24 in a single heat collecting channel 201 so that the fluid and the fluid The increase of the contact area of the lead frame 2 makes the adsorption phenomenon more remarkable. Of course, the spoiler fins 24 can also be formed on the cover 3 corresponding to the heat collecting channel 201 at the same time, so as to enhance the adsorption phenomenon of the fluid in the heat collecting channel 201. In addition, the low-temperature sub-flow channel 205, each of the throat sections 2042, 2042 ', and the mixing chamber section 2043 are provided as shown in FIG. 1, and the guide of the object η 243795 is located in the storage chamber section 2031. The low-temperature fluid is mixed with the high-temperature fluid flowing out of the heat collecting runners 201 to achieve the purpose of rapid cooling, so that the high-temperature fluid can quickly cool down after flowing out of the high-temperature region 91. 5 10 15 20 However, the low-temperature sub-runner 205, each of the throat sections 2042, 2042, and the mixing chamber section 2043 are not essential components, and the present invention can be implemented without the above-mentioned components. As for the manufacturing method of the above-mentioned miniature circulating flow channel device 2 made by the lead frame, as shown in FIG. 6, the method includes the following steps: Step 100, as shown in FIG. 7, preparing a photomask 6 having a predetermined pattern ⑼. ; The image possessed by the predetermined pattern 60 is the projection image of the circulation flow path 20 (see FIG. 2). In step 102, a photoresist layer 62 is coated on the first base surface 21 of the lead frame 2; &) Π) 4'_8 ', the predetermined pattern 60 of the photomask 61 is transferred to the On the green layer 62. The steps of defining the predetermined pattern 60 on the lead frame 2 are completed through the description of 100 to step 104. Step 106. As shown in FIG. 9, the photoresist layer 62 is used as a mask, and a portion of the lead frame 2 corresponding to the predetermined pattern 6q is removed by means of a last name engraving. The first base surface 2m extends the half-circle circular flow path path 20 of the depth of Qing 01 to the 22nd direction, and then the photoresist layer / 2 is removed. Of course, the width and depth dimensions of the flow channel are not limited to this, and it can be changed according to system requirements. In step ⑽, the lead frame 2 is surface-treated. In this example 12 1243795, the lead frame 2 is cleaned with a 5% dilute nitric acid solution, and then the post-dries are rinsed with water to remove impurities attached to the surface of the lead frame 2. In step 110, as shown in FIG. 10, a gallium 7 is plated on the lead frame 2. In this embodiment, a 6 // m-thick tin-copper alloy is deposited on the lead frame 2 by an electric clock. Of course, the method of setting the soldering material 7 is not limited to electroplating, and other methods such as evaporation and sputtering can also be used; at the same time, the material of the soldering material 7 can also be made of tin metal, tin-indium alloy, and tin. Other low-melting metals such as copper alloys. 8. The thickness of " Hai welding material 7 is also not limited to ό // m, because the welding material 7 is formed in the next step on the lead frame 2 and the cover 3 (see Figure υ adjacent to each other to form Dielectric metal, so its thickness can reach the required strength. It should be noted that when the welding material 7 is deposited by electricity, it is inevitable that some of the welding material 7 will enter the circulating flow. Road # 2G, but because its thickness is extremely small compared to the size of the circulating flow path Zuo 20, it will not affect the expected effect of the design of the circulating flow path 20. v 112 as shown in Figure 11, The cover 3 covering the circulation flow path 20 is abutted on the welding material 7. v114, heating makes the welding material 7 in a melting state, and at the same time, applying a cover 3 and the lead frame 2 to each other Approaching force to fix the cover 3 to the lead frame 2. In this embodiment, since the solder 7 is a tin-copper alloy, this step is applied by a hot press at a time of 60 minutes. And maintain a pressure of 40 kg / cm2, and heat it to a temperature range of 20 (^ to 25.0) to make the solder 7 and the lead frame 2 The contact portion of the cover body 3 is formed with a metal 13 1243795 so that the lead frame 2 and the cover body 3 are joined to each other. After the above steps 110 to 114, the cover body covering the circulation flow path 20 can be formed. 3 is fixed on the lead frame 2 as shown in Fig. 1 to form the miniature flow channel device i. Generally, a perforation (not shown) communicating with the outside world is reserved in the above manufacturing process to complete the above steps. After that, the fluid is injected into the circulation flow path only 20. Although it is designed to use air as the fluid flowing in the micro flow channel, as long as the high-vacuum furnace is not used in the above production process, air naturally occupies the circulation during the production process. The space in the flow path 20 is formed in the circulation flow path 20 after the circulation flow path 20 is formed. However, if the cover 3 is fixed on the lead frame 2, it is close to the circulation path 20. When the vacuum is in a low pressure state, a perforation must still be reserved for air to enter the circulating flow path path 20. From the above, it can be known that the cover 3 can directly use another lead frame, so 'as shown in Figure 12 , This embodiment In another aspect, before step 12, a channel 33 corresponding to the circulation flow path 20 is formed on the side of the cover 3 adjacent to the lead frame 2 so that the cover 3 is pasted in step 112. When leaning on the welding material 7 (see FIG. 11), the circulating flow path 20 and the 'channel 33 are communicated with each other to increase the cross-sectional area of the circulating flow path 20. The cover 3 is formed. The manner of the above-mentioned channel 33 can be similarly formed by using the above steps 100 to 106. It should be noted that the above-mentioned manner of fixing the cover 3 and the lead frame 2 belongs to the technical field of low-temperature welding. However, the fixing method is not limited to this. Other low-temperature welding methods including diffusion soldering and the like can also be applied in the present invention 14 1243795. In fact, the mouth 1 wire, the square 2 on the wire 2 and the helical body 3 are fixed in this way, such as gluing, welding, or fixing with clamps, etc., are all applicable to the present invention. 5 10 15 20 However, it should be noted that if the design of the circulation channel 20 is lower than the melting point temperature of the selected joining material, the material is shot by ^ gluing and ordinary welding methods; among them, if- The tin alloy used in the general electronics industry is the soldering material 7 (see the material f of FIG. 1), and the soldering material 7 can be coated on the lead frame 2 by screen printing or spinning in the above step 110. If The working temperature of the circulating flow path 2G design is relatively high. In addition to the low temperature welding method above, the brazing method can also be used to join the cover 3 and the lead frame 2. As shown in FIG. 13, In another aspect of this embodiment, the micro-circulation flow channel device 1 further includes a plurality of heat dissipation fins 4 disposed on the cover 3 adjacent to the heat dissipation channels 202 to improve heat dissipation efficiency. In this embodiment, The miniature circulation channel device! The lead frame 2 is directly abutted on the heating element 9, so the heat dissipation fins 4 are arranged on the cover body 3 of the lead frame away from the heating element 9 side. . # Of course, the position for setting the thermal reader 4 is not limited to this, but can be matched according to Placed in any appropriate position; for example, when the micro-circulation channel device 1 is directly abutted on the heating element 9 with the cover 3, the heat-dissipating fins 4 can of course also be arranged on the lead frame 2 On the second base surface 22 far from the cover body 3, the effect of improving the heat dissipation efficiency of the microcirculation channel device 1 can also be achieved. As shown in FIG. 14, in another aspect of this embodiment, the microcirculation flow The channel device 1 further includes a driving device 5 which communicates with the low-temperature conveying flow channel 203 and drives 15 1243795 to move the fluid in the circulation flow path 20. Similarly, the two-moving device 5 is not an essential component. It can be known from the above that the micro-device = 1 device requires additional driving force, so the heat is transferred from the high temperature 5 10 15 20 zone 91 to the low temperature zone 92. However, because the high temperature zone 91 must reach-above the set high temperature Can make the micro-circulation channel device! Naturally achieve the effect of the above-mentioned heat (the so-called high-temperature material refers to the boiling point of the fluid), so if it is desired that the% temperature in the high-temperature region does not reach the aforementioned south temperature Can use the micro-circulation channel Set 1 for cooling, or if you want to install other micro-circulation runners, you can achieve it by setting the drive device 5. As shown in Figure 15 and Figure 16, the present invention uses a micro-cycle made of lead frames. The main components of the second preferred embodiment with U set to 1 are substantially the same as those of the first preferred embodiment described above, and are also used to transfer heat from the -high temperature region 91 to the -low temperature region 92. The difference lies in that In this embodiment, the miniature circulation channel device 1 includes a plurality of lead frames 2, 2, which are adjacent to each other and form the circulation flow path 20, and are fixed to the lead frames 2, 2, among which -The bottom plate 8 on the lead frame 2, and a cover body 3 covering the other lead song 2 'in the lead frames 2, 2, and w; both the bottom plate 8 and the cover body 3 cover the circulation flow path 20. The circulation flow path 20 can be divided into a main circulation flow path 2002 and a secondary circulation flow path 2002 connected to the main circulation flow path 2001. The main circulation flow path 2001 is formed in The lead frames 2, 2 are formed on one of the lead frames 2 adjacent to the bottom plate 8, and the secondary circulation path 2002 is formed on the lead frames 2, 2, where another lead is adjacent to the cover 3. Rack 2, up. Therefore, the circulation flow path 20 defined by the lead frames 2, 2, 16 1243795 is not limited to the same plane, but in a three-dimensional state; and in this embodiment, the bottom plate 8 and the cover body 3 are the same as The lead frame 2 is the same as another lead frame, but it is not limited to this. The high temperature region 91 and the low temperature region 92 are respectively located on opposite sides of the microcirculation channel 5 device 1. The main circulation flow path 2001 includes a plurality of cooling flow channels 202 adjacent to the low-temperature region 92, a low-temperature conveying flow channel 203 communicating with the cooling flow channels 202, and a low-temperature secondary flow communicating with the low-temperature conveying flow channel 203. Channel 205; and the secondary circulation flow path 2002 includes a heat collecting flow channel 201 adjacent to the high temperature region 91 10 and communicating with the low temperature conveying flow channel 203, and a heat collecting flow channel 201 connected to the heat dissipating flows The channel 202 is a high-temperature conveying channel 204 which is in communication with the low-temperature conveying channel 203. Therefore, in this embodiment, the circulation flow path 20 formed by the main circulation flow path 2001 and the secondary circulation flow path 2002 has the same characteristics as the circulation flow path 20 of the first preferred embodiment 15 Effect. The miniature circulation channel device 1 with the circulation channel path 20 in a three-dimensional state can be manufactured by the manufacturing method described in the first preferred embodiment, as shown in FIG. 17. A method for manufacturing various types of micro-circulation runner device 1 according to the present invention includes the following steps: Step 300: As shown in FIG. 18, a part of the lead frame 2 is removed by mechanical punching to form the lead frame 2. The main circulation flow path 2001. In step 302, surface treatment is performed on the lead frame 2. In step 304, as shown in FIG. 19, the bottom plate 8 covering the main circulation flow path 17 1243795 2001 is abutted on the lead frame 2. In step 306, the lead frame 2 and the bottom plate 8 are heated to be close to a molten state, and at the same time, a force is applied to bring the bottom plate 8 and the lead frame 2 closer to each other, so that the bottom plate 8 is fixed on the lead frame 2. In this embodiment, this step is performed in a 5 high vacuum furnace under the environment of 5xl (T5Torr), applying a force of 4000Pa, and heating to 950 ° C for 10 hours for bonding. Of course, the bottom plate 8 is fixed The method on the lead frame 2 is not limited to this. It can also use any of the bonding methods described in the first embodiment; however, it should be noted that the applicable temperature and strength after bonding must comply with the subsequent steps. Occurred temperature and _ 10 pressure. Step 308, as shown in FIG. 20, another lead frame 2 formed with the secondary circulation flow path 2002 is fixed, and the conductor formed with the primary circulation flow path 2001 is fixed. Frame 2, and connect the secondary circulation flow path 2002 with the main circulation flow path 2001; and the lead frame 2, 2, and the fixing method 15 can be completed by using any of the aforementioned joining methods. 310, as shown in FIG. 21, the cover body 3 is fixed on the lead frame 2, where the secondary circulation flow path 2002 is formed, and its fixing method can be completed by using any of the aforementioned joining methods. _ Step 312 , Inject the fluid into the circulation flow path path 20 to complete the cooling at 20 However, the device 1. This step is to inject the fluid into the circulation flow path 20 through the perforations (not shown) originally reserved in the lead frames 2, 2 ', the base plate 8, or the cover 3. Since the above-mentioned main circulation flow path 2001 including the cooling flow channels 202 is adjacent to the bottom plate 8 ′, as shown in FIG. 22, in another embodiment of the present embodiment that includes multiple 18 1243795 cooling fins 4 The heat dissipation fins are arranged on the base plate 8. Of course, the above-mentioned main circulation flow path 2000 can also be directly on the lead frame 2 by using the half-etching method described in the first preferred embodiment. It is formed, but not limited to be formed in a manner that the bottom plate 8 closes the main circulation flow path 200015; at this time, the heat dissipation fins 4 can be directly disposed on the lead frame 2. As can be seen from the above, According to the present invention, a miniature circulating flow channel device 1 made of a lead frame can not only form a circulating flow path 20 by joining a lead frame 2 with another lead frame serving as the cover 3, but also using a lead frame 2 and two other _ 10 are used as the lead frame of the bottom plate 8 and the money 3 to form the circulating stream. 20; It is also possible to repeat the above-mentioned step 308 and join a plurality of lead frames to each other to form a three-dimensionally staggered circulation flow path 20, making the design and application of the micro-circulation flow path device 1 more flexible. It can be widely used in various electronic devices. 15 As mentioned above, in addition to the micro-circulation channel device 1 made of the lead frame of the present invention, in addition to the rapid and effective integration of the process using the mature lead frame of the existing technology, it can be fully used. Utilizing the advantages of mass production of lead frames, the production and production costs have been greatly reduced, and micron-level circulation flow paths 20 have been successfully manufactured with lower production costs, and even multilayer lead frames 2 can be laminated. Therefore, the purpose of mass-producing and manufacturing the mini-circular flow path device 1 with the three-dimensional circulation flow path 20 at a low cost is achieved. However, the above are only the two preferred embodiments of the present invention. When the scope of implementation of the present invention cannot be limited by this, that is, the simple equivalent of the patent application scope and the contents of the invention statement Changes and revisions 19 ^ 243795 Universal should still fall within the scope of this invention patent. [Brief Description of the Drawings] 5 FIG. 1 is a side view of the second embodiment of the micro-circulation channel device made of a lead frame according to the present invention; 10 15 turns 2 are along the line π · π in FIG. A sectional view 3 is a plan view of the first preferred embodiment, and a conductor has a plurality of blocks; 7 'FIG. 4 is a partial side view of the first preferred embodiment. ㈣w; month ― 4 FIG. 5 is a cross-sectional view along the line ν_ν in FIG. 4; FIG. 6 is a flowchart of the first preferred embodiment; ^ FIG. 7 is a cross-sectional view of the first preferred embodiment Illustrates a photomask with a pre-patterned pattern and a lead frame coated with a photoresist layer; 圏 8 is a cross-sectional view of the first preferred embodiment illustrating the definition of the predetermined pattern on the lead frame; 〆 9 is a cross-sectional view of the first preferred embodiment, illustrating the removal of a part of the lead frame to form the circulation flow path;
圖是該第一較佳實施例之一剖面圖，說明鍍設一 焊材於該導線架上； 20 圖U是該第一較佳實施例之一剖面圖，說明蓋設一蓋 體於該焊材上； 圖12疋该第一較佳實施例再一態樣的一剖面圖，說 明該蓋體上形成有一渠道； 圖13是該第一較佳實施例另一態樣的一剖面圖，說 20 1243795 明設置於該蓋體上之複數散熱鳍片； 圖14疋该第一較佳實施例又一態樣的一示意圖，說 明設置於該循環流道路徑上之—驅動裝置； 圖15疋本發明以導線架製作之微型循環流道裝置的 5 第二較佳實施例的一側面圖； 圖16疋沿圖15中之線XVI-XVI的一剖面圖； 圖17是該第二較佳實施例之一流程圖； 圖18是該第二較佳實施例之一側面圖，說明形成有 一主循環流道路徑之一導線架； 10 圖19是該第二較佳實施例之一側面圖，說明固設一 底板於該導線架上； 圖20是該第二較佳實施例之一側面圖，說明固設形 成有一次循環流道路徑之另一導線架於該導線架上； 圖21是該第二較佳實施例之一側面圖，說明蓋設^ 15 盍體於該另一導線架上；及 圖22是該第二較佳實施例另一態樣的一側面圖，説 明設置於該底板上之複數散熱鰭片。 21 1243795 【圖式之主要元件代表符號說明】 1 微型循環流道裝置 205 低溫次流道 2 導線架 21 第一基面 2， 導線架 22 第二基面 20 循環流道路徑 23 區塊 2001 主循環流道路徑 24 擾流凸片 2002 次循環流道路徑 3 蓋體 201 集熱流道 31 接合面 202 散熱流道 33 渠道 203 低溫輸送流道 4 散熱鰭片 2031 儲存室段 60 預定圖形 2032 輸送段 61 光罩 204 南溫輸送流道 62 光阻層 2041 變斷面段 5 驅動裝置 2042 喉部段 7 焊材 2042, 喉部段 8 底板 2043 混合室段 9 發熱元件 2044 大截面段 91 南溫區 2045 小載面段 92 低溫區 100.102.104.106.108.110.112.114. 步驟 300.302.304.306.308.310.312. 步驟The figure is a cross-sectional view of the first preferred embodiment, illustrating the plating of a solder material on the lead frame; FIG. U is a cross-sectional view of the first preferred embodiment, illustrating the placement of a cover on the lead frame; On the welding material; FIG. 12 is a cross-sectional view of another aspect of the first preferred embodiment, illustrating that a channel is formed on the cover; FIG. 13 is a cross-sectional view of another aspect of the first preferred embodiment Let's say 20 1243795 shows a plurality of heat-dissipating fins provided on the cover; Fig. 14 is a schematic view of another aspect of the first preferred embodiment, illustrating a driving device provided on the circulation flow path; 15 疋 A side view of the 5th preferred embodiment of the microcirculation channel device made of a lead frame according to the present invention; FIG. 16 疋 A sectional view along the line XVI-XVI in FIG. 15; FIG. 17 is the second A flowchart of one of the preferred embodiments; FIG. 18 is a side view of the second preferred embodiment, illustrating a lead frame formed with a main circulation flow path; FIG. 19 is one of the second preferred embodiments A side view illustrating a base plate fixed on the lead frame; FIG. 20 is a side view of the second preferred embodiment Illustrates that another lead frame having a primary circulation path formed thereon is fixed on the lead frame; FIG. 21 is a side view of one of the second preferred embodiments, illustrating that the ^ 15 body is placed on the other lead frame And FIG. 22 is a side view of another aspect of the second preferred embodiment, illustrating a plurality of heat dissipation fins provided on the base plate. 21 1243795 [Description of the main components of the diagram] 1 Miniature circulation channel device 205 Low-temperature secondary flow channel 2 Lead frame 21 First base surface 2, Lead frame 22 Second base surface 20 Circulation flow path 23 Block 2001 Main Circulating flow path 24 Spoiler fins 2002 Secondary circulation flow path 3 Cover 201 Collecting flow path 31 Joint surface 202 Radiating flow path 33 Channel 203 Low-temperature conveying flow path 4 Radiating fins 2031 Storage chamber section 60 Predetermined pattern 2032 Conveying section 61 Photomask 204 South temperature conveying channel 62 Photoresist layer 2041 Variable section 5 Drive device 2042 Throat section 7 Welding material 2042, Throat section 8 Base plate 2043 Mixing chamber section 9 Heating element 2044 Large section section 91 South temperature zone 2045 Small load section 92 Low temperature area 100.102.104.106.108.110.112.114. Step 300.302.304.306.308.310.312. Step