200531922 玖、發明說明： 【發明所屬之技術領域】 本發明是有關於一種微型循環流道裝置，特別是指一 種以導線架製作之微型循環流道裝置。 5 【先前技術】 現今電子技術日新月異，諸如行動電話（cell phone)、 個人數位助理（PDA)，以及筆記型電腦（Notebook)等之電子 設備，均朝向輕、薄、短、小、美，以及多功能之趨勢發 展，並使得上述電子設備所包含如微處理晶片等之電子元 10 件亦隨之小型化，同時更在運算速度與處理能量上大幅躍 升，因此相對地在運作的過程中，便相當容易產生熱量累 積，導致元件溫度升高。再加上隨著小型化之趨勢所造成 的總體電子元件密度提高，以及因高速電路所造成之高頻 電流，使得各個元件與系統受限於工作溫度而無法展現實 15 際效能之事時有所聞。因此，為能有效提供各電子元件， 特別是如微處理晶片等關鍵性元件之散熱，業界便有運用 微系統技術發展微型冷卻裝置的建議。 微系統技術是指製造體積微小、具有功能且自成系統 之結構的技術，一般如微機電系統 20 (Micro-Electro-Mechanical System，MEMS)、 微機光系統 (Micro-Optic-Mechanical System，MOMS)，以及微光機電 系統（Micro-Electro-Mecha- Optical System，MEMOS)等， 均屬於微系統技術之領域。由於微系統可廣泛地應用於資 訊電子、光電通訊、精密機械、環保監控、醫療生化等領 200531922 域，並可大幅提昇各個領域之技術水準，故為現今科技發 展之關鍵技術領域，而其中又以釐米（mm)級至微米m) 級之微型結構的製造技術扮演極為重要的角色，因此，現 行應用於製作微型冷卻裝置的微系統技術便是以釐米（m m) 5 級至微米（// m)級之微型結構為主。 現有微型結構的製造方法可分為可批造（batch process) 與非批造（non-batch process)，其中可批造的技術包含有基 體細微加工（bulk micro machining)、表面細微加工（surface micro machining)，以及微光刻電鎢模造（LIGA，a German 10 acronym for lithographie，galvanoformung，abformung)等， 其主要是沿用現有半導體之微電子技術發展而來，因此相 當成熟。然而其中前兩項技術的缺點在於無法進行高深寬 比（high aspect ratio) ’以及複雜的二度空間立體結構加 工，因此應用於製作立體微型結構時便受到相當的限制。 15 而微光刻電鎮模造則雖是以批造為目的所研發之技術’但 由於其所需設備及生產成本較高’且在壓鑄或射出成形等 技術上仍存在瓶頸’因此實際上仍無法以低成本大量批造 進行微型結構之製作。 非批造的技術則包含有微精密加工（Precision micro 20 machining)、微放電加工（electr〇-discharge micr0 machining)，以及微雷射加工（laser micro machining)等’ 其雖可進行較高深寬比’以及較複雜之三度空間立體結構 加工，但由於無法批造，因此無法藉由大量生產以降低成 本發揮微系統之優勢。 200531922 【發明内容】 本發明之主要目的是在提供—種以導線架製作之微 型循環流道裝置。 本發明之另一目的是在提供一種可批造製作之微型 5 循環流道裝置。 本發明之又一目的是在提供一種用於熱量移轉之微 型循環流道裝置。 本發明之再一目的是在提供一種可批造製作且呈現 立體狀態之微型循環流道裝置。 〇 本發明以導線架製作之微型循環流道裝置是用於將 一高溫區之熱量移轉至一低溫區，該微型循環流道裝置包 括至少一形成有一循環流道路徑之導線架、一固設於該導 線架上並涵蓋該循環流道路徑之蓋體，以及一容裝於該循 環流道路徑内以將該高溫區之熱量移轉至該低溫區之流 5 體。該循環流道路徑包含至少一鄰近該高溫區之集熱流 道、至少一鄰近低溫區之散熱流道、一由該散熱流道連通 至该集熱流道之低溫輸送流道，以及一由該集熱流道連通 至5亥散熱流道之南溫輸送流道。 本發明之功效是運用導線架之製程技術，於導線架上 Q . 1作一微型循環流道路徑，不僅能進行熱量移轉而達到降 低設置該微型循環流道裝置於其上之元件溫度的效果；更 能以較低成本製造微米級且呈平面狀態、甚至立體狀態之 微型循環流道路徑。此外，本發明能整合運用現有的、技 術已臻成熟的導線架製程的微系統技術，因而具有可大量 200531922 批造生產，以及降低生產成本之優勢。 【實施方式】 5 10 15 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之二較佳實施例的詳細說明中，將可清 楚的明白。在提出詳細說明之前，要注意的是，在以下的 敘述中，類似的元件是以相同的編號來表示。 如圖1及圖2所示，本發明以導線架製作之微型循環 流道裝置1的第一較佳實施例，是供設置於一如晶片之發 熱元件9上，以將其產生的熱量由一高溫區91移轉至一 低溫區92,該微型循環流道裝置丨包括一形成有一循環流 道路徑20之導線架2、一固設於該導線架2上並涵蓋該循 道路徑20之蓋體3，以及一容裝於該循環流道路徑 20内用於移轉熱量之流體。200531922 发明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a micro-circulation channel device, in particular to a micro-circulation channel device made of a lead frame. 5 [Previous technology] Today's electronic technology is changing with each passing day. Electronic devices such as cell phones, personal digital assistants (PDAs), and notebooks are all light, thin, short, small, and beautiful. The trend of multi-functionality has developed, and the 10 electronic components such as micro-processing chips included in the above-mentioned electronic equipment have also been miniaturized. At the same time, the operating speed and processing energy have greatly increased. Therefore, in the process of operation, It is relatively easy to generate heat, which will cause the component temperature to rise. Coupled with the increase in the overall density of electronic components caused by the trend toward miniaturization, and the high-frequency current caused by high-speed circuits, each component and system is limited by the operating temperature and cannot achieve realistic performance. Heard. Therefore, in order to effectively provide heat dissipation for various electronic components, especially key components such as micro-processing wafers, the industry has proposed the use of micro-system technology to develop micro-cooling devices. Micro system technology refers to the technology of manufacturing a small, functional and self-contained structure, such as Micro-Electro-Mechanical System 20 (MEMS), Micro-Optic-Mechanical System (MOMS) , And Micro-Electro-Mecha- Optical System (MEMOS), etc., all belong to the field of micro-system technology. As microsystems can be widely used in the fields of information electronics, optoelectronic communication, precision machinery, environmental monitoring, medical and biochemical fields, etc., and can greatly improve the technical standards of various fields, they are the key technology areas for today's scientific and technological development. The manufacturing technology of microstructures ranging from centimeters (mm) to micrometers (millimeters) plays a very important role. Therefore, the current microsystem technology used to make micro cooling devices is from centimeters (mm) to micrometers (// m) class microstructures. The existing manufacturing methods of microstructures can be divided into batch process and non-batch process. The batch process technologies include bulk micro machining and surface micro machining. machining), and microlithography electric tungsten molding (LIGA, a German 10 acronym for lithographie, galvanoformung, abformung), etc., which are mainly developed from the existing microelectronic technology of semiconductors, so they are quite mature. However, the disadvantages of the first two technologies are that they cannot perform high aspect ratio and complex two-dimensional three-dimensional structure processing, so they are quite limited when applied to the production of three-dimensional microstructures. 15 Although microlithography electrical ballast molding is a technology developed for batch manufacturing purposes, `` because it requires higher equipment and production costs '' and there are still bottlenecks in technologies such as die casting or injection molding, it still actually It is not possible to mass-produce microstructures at low cost. Non-batch technologies include Precision micro 20 machining, electr0-discharge micr0 machining, and laser micro machining, etc. 'And the more complicated three-dimensional spatial three-dimensional structure processing, but because it cannot be batched, it cannot use the advantages of micro-systems to reduce costs through mass production. 200531922 [Summary of the invention] The main object of the present invention is to provide a micro-circulation channel device made of a lead frame. Another object of the present invention is to provide a micro 5 circulation channel device which can be manufactured in batches. Another object of the present invention is to provide a micro-circulation flow path device for heat transfer. Another object of the present invention is to provide a micro-circulation channel device which can be manufactured in batches and presents a three-dimensional state. 〇 The micro-circulation channel device made by the lead frame of the present invention is used to transfer heat from a high-temperature region to a low-temperature region. The micro-circulation channel device includes at least one lead frame forming a circulation channel path, a solid A cover provided on the lead frame and covering the path of the circulation flow path, and a body accommodated in the path of the circulation flow path to transfer the heat in the high temperature region to the flow 5 body in the low temperature region. The circulation flow path includes at least one heat collecting flow path adjacent to the high temperature region, at least one heat dissipation flow path adjacent to the low temperature region, a low temperature conveying flow path communicating from the heat dissipation flow path to the heat collecting flow path, and The hot runner is connected to the south temperature conveying runner of the 5Hai cooling runner. The effect of the present invention is to use the process technology of the lead frame to make a Q.1 on the lead frame as a miniature circulation flow path, which can not only perform heat transfer to reduce the temperature of the component on which the miniature circulation flow path device is arranged. Effect; It is possible to manufacture micro-circular micro-circular flow path in a planar state or even a three-dimensional state at a lower cost. In addition, the present invention can integrate and use the existing micro-system technology of the mature lead frame process, and therefore has the advantages of mass production of 200531922 and reduction of production costs. [Embodiment] 5 10 15 The foregoing and other technical contents, features, and effects of the present invention will be clearly understood in the following detailed description of the preferred embodiment with reference to the second drawing. Before giving a detailed description, it should be noted that in the following description, similar elements are denoted by the same reference numerals. As shown in FIG. 1 and FIG. 2, the first preferred embodiment of the micro-circulation channel device 1 made of a lead frame according to the present invention is provided on a heating element 9 such as a chip, so that the heat generated by the chip is A high-temperature region 91 is transferred to a low-temperature region 92. The miniature circulating flow channel device 丨 includes a lead frame 2 forming a circulating flow path 20, and a lead frame 2 fixed on the lead frame 2 and covering the path 20 The cover 3 and a fluid contained in the circulation flow path 20 for transferring heat.
在本實施例中，該導線架2在製作之前為一包含97% 的銅金屬且厚度為⑶随之金屬薄片。如圖3所示，一 般用於製作電性連接用之導線架2，多是先取> 22咖X 的大型薄銅片，先劃分成複數區塊23後，再同時於 各-亥區塊23上以相同的圖案形成鏤空區域之後加以切 割分離’㈣各㈣塊23為單位完成最終之產品。故在 :下的說明中，雖是以單-導線架2製作單-微型流道裝 該項技藝者#能㈣推想，本發明當然也能 早V線架2同時製作多個微型流道裝置工。 如圖1所示，科線架2具有一第:基面 一 相反於該第一基面 之弟一基面22，在本實施例中，該 20 200531922 循環流道路徑20是採用蝕刻之方式，於該導線架2上形 成由該第一基面21往該第二基面22方向延伸之凹槽所構 成，並移除該導線架2之一部份，但並不以此為限，其也 可以改採如雷射等方式於該導線架2上形成該循環流道路 5 徑 20。 如圖2所示，該循環流道路徑20包含複數鄰近該高 溫區91之集熱流道201、複數鄰近該低溫區92之散熱流 道202、一由該等散熱流道202連通至該等集熱流道201 之低溫輸送流道203、一由該等集熱流道201連通至該等 10 散熱流道202之高溫輸送流道204，以及一連通該低溫輸 送流道203與該高溫輸送流道204之低溫次流道205。 該低溫輸送流道203具有一鄰近該等散熱流道202之 儲存室段2031，藉以儲存系統運作所需之流體，以及一連 通該儲存室段2031與該等集熱流道201之輸送段2032。 15 該高溫輸送流道204具有複數分別與該等集熱流道 201其中部分集熱流道201相連通之變斷面段2041、複數 分別與各該變斷面段2041相連通之喉部段2042、2042’， 以及一與所有喉部段2042、2042’相連通之混合室段 2043。該變斷面段2041之截面積大於各該集熱流道201 20 與各該輸送段2032之截面積，並往各該喉部段2042、2042’ 方向漸縮。各該喉部段2042、2042’之截面積則均小於各 該變斷面段2041之截面積，而該低溫次流道205連通於 其中之一喉部段2042’上，並藉以使部分低溫流體直接地 由該低溫輸送流道203在不經過該高溫區91的情況下， 200531922 直接由該喉部段2042,輸送至該混合室段2〇43。 該向溫輸送流道204更具有複數與該混合室段2〇43 相連通之大截面段2044，以及複數分別與各該大截面段 2044相連通之小截面段2〇45，各該小戴面段2〇45之截面 積小於各該大截面段2044之截面積，且鄰近該等散熱流 道202 ;相對於該等小截面段2〇45，該等大截面段2〇44 則达離该專散熱流道202。 如圖1及圖2所示，該蓋體3設置於該第一基面21 上，並封閉該循環流道路徑2〇 ;在本實施例中，該蓋體3 為另一導線架，但並非以此為限，該蓋體3之形狀及材質 等，只要具有一能與該導線架2接合之接合面31之材料， 均能適用於本發明中。換言之，上述蓋體3也可以為導線 架以外的其他任何適用之形狀、材質的物體。 上述流體則是容裝於該循環流道路徑2〇内，藉以將 該高溫1 91之熱量移轉至該低溫區％。在本實施例中， 該流體為蒸射或去離子水，但並不以此為限，如甲醇及 丙綱等之有機溶劑，或其他冷卻劑（或冷媒），甚至空氣也 都可以作為該微型循環流道裝置〗中用於移轉熱量之流 體。由於此非本發明之主要特徵，且為熟悉該項技術者$ 易於思及，故在此不多加贅述。 承上所述，當例如為蒸餾水或去離子水等之流體充滿 於該«流道路徑2〇内時’由於該儲存室段咖之截面 積大於該輸送段2032之截面積，該流體大部分將儲存於 謂存至& 2031 ’在本實施例中在該處之流體溫度較低且 200531922 呈液態，其溫度與環境溫度接近，並可經由該輸送段2032 流動至該等集熱流道201。由於該集熱流道201呈區域分 布，因此使得該流體容易吸收該等位於該高溫區91之發 熱元件9所產生之熱量。故當該發熱元件9產生之熱量累 5 積導致溫度升高超過工作流體之沸點時（以水為例約100 °C )，經由熱交換作用，使熱量由該流體吸收後，將使該流 體溫度升高，並進而使其呈蒸氣狀態。而且由於流道經過 設計，使得該等變斷面段2041之截面積相對於該等集熱 流道201及該輸送段2032之截面積為大，故相對壓力較 10 低，因此位於該等集熱流道201内之呈蒸氣狀態之流體便 自然地往該等變斷面段2041流動，並同時對該輸送段2032 内之低溫流體產生汲取的力量，進而使得位於該低溫輸送 流道203内之流體往該集熱流道201方向流動。 而該吸收熱量並呈蒸氣狀態之流體由該等變斷面段 15 2041流向該等喉部段2042、2042’時，由於截面積漸縮的 原因，將使該流體逐漸加速流動，並在流經各該喉部段 2042、2042’時產生高速，此時因高速流體將產生相對低 壓，因此將使得產生於該喉部段2042’之低壓對該低溫次 流道205内之流體產生一吸取力量，而將位於該低溫次流 20 道205内之液態流體吸入該喉部段2042’，並與由各該喉 部段2042、2042’流出之蒸氣狀態流體一同流入該混合室 段 2043 。 因此，位於該混合室段2043之流體溫度雖已下降， 但其僅為低溫流體與高溫流體熱平衡所造成之效果，並未 200531922 真正將熱量由流體内移出，因此仍須將該混合室段2043 内之流體藉由該高溫輸送流道204導引至該等散熱流道 202内進行散熱。由於各該小截面段2045之截面積小於各 該大截面段2044之截面積，因此流體於各該小截面段2045 5 内之毛細力大於各該大截面段2044之毛細力，因此位於 該混合室段2043内之流體能自然地藉由毛細力之吸引經 由各該大截面段2044流向各該小截面段2045，最後流入 該等散熱流道202，將流體所吸收之熱量藉由熱交換作用 傳送至該低溫區92，而完成熱量之移轉。 10 上述集熱流道201截面積較小，其目的在於藉由毛細 現象汲取該輸送段2032内之低溫流體，同時設置多數該 集熱流道201增加其分布區域所涵括之總面積，以達到更 好的集熱功效。此外，上述集熱流道201之總截面積亦相 對地大於該輸送段2032之截面積，以容置由該輸送段2032 15 流來之低溫流體，並同時達到降低其位於各該集熱流道 201内時之流速，使其能充分地進行熱交換。 當然，本發明並不以上述態樣為限，如圖4及圖5所 示，該導線架2也能於單一集熱流道201内形成有複數擾 流凸片24,藉以使該流體與該導線架2之接觸面積增加， 20 使吸附現象更為顯著。當然，該等擾流凸片24也能同時 形成於該蓋體3相對應於該集熱流道201之處，以加強該 流體於該集熱流道201内之吸附現象。 此外，圖1所示之該低溫次流道205、各該喉部段 2042、2042’，以及該混合室段2043是配套設置的，其目 11 200531922 的在導引位於該儲存室段2031内之低溫流體與由該等集 熱流道201流出之高溫流體混合，而達到快速降溫之目 的，使得該高溫流體能在流出該高溫區91後迅速降溫。 惟該低溫次流道205、各該喉部段2042、2042’，以及該混 5 合室段2043並非必要元件，若未設置上述元件仍能實施 本發明。 至於上述以導線架製作之微型循環流道裝置1之製造 方法，則如圖6所示，包含下列步驟： 步驟100，如圖7所示，製備一具有一預定圖形60之 10 光罩6;該預定圖形60所具有之圖像即為上述循環流道路 徑20(見圖2)之投影圖像。 步驟102，塗佈一光阻層62於該導線架2之第一基面 21上； 步驟104，如圖8所示，以曝光顯影之方式將該光罩 15 61之該預定圖形60轉移至該光阻層62上。經由上述步驟 100至步驟104便完成將該預定圖形60定義於該導線架2 上之步驟。 步驟106，如圖9所示，以該光阻層62為遮罩，並以 蝕刻之方式移除該導線架2對應於該預定圖形60之一部 20 份，形成該100//m寬，由該第一基面21向該第二基面 22方向延伸100" m深之半蝕循環流道路徑20,之後再移 除該光阻層62。當然，上述流道之寬深尺寸並非以此為 限，其可依系統需求進行變更。 步驟108，對該導線架2進行表面處理。在本實施例 12 200531922 中是以5%之稀硝酸溶液清洗該導線架2後，再以清水中 洗时、乾，以去除该導線架2表面沾附之雜質。 步驟110，如圖10所示，鍍設一焊材7於該導線架2 上。在本實施例中，是以電錢方式沉積6//m厚之錫^合 5 I於該導線架2上。當然’鑛設該焊材7之方式並不以電 鍍為限，也可以採用蒸鍍及濺鍍等其他方式；同時，該焊 材7之材質也能以如錫金屬及錫銦合金等及錫銅合金等其 他低熔點金屬替代。 /' 而該焊材7之厚度也非限定為6//m，由於該焊材7 1〇 是為了在後續步驟中’於該導線架2及該蓋體3(見圖〇 彼此鄰接處形成介金屬，因此其厚度在2//111至1〇“功之 耗圍較能達到所需強度。需加以說明的是，採用電鍍之方 法沉積該焊材7時，雖然難以避免使得部分該焊材7進入 該循環流道路徑20内，但由於其厚度相對於該循環流道 15 路徑2G之尺寸極小，因此將不至於影響該循環流道路# 20設計所預期之功效。 二 步驟112,如圖11所示，將該涵蓋該循環流道路徑2〇 之蓋體3貼靠於該焊材7上。 步驟114’加熱使該焊材7呈熔融狀態，同時施加— 〇 ㈣蓋體3與該導線架2相互迫近之力量，以使該蓋體3 口接於該導線架2上。因在本實施例中該焊材7為錫銅合 金’故本步驟是以熱壓機在60分鐘的時間内，施加並維 持4〇 kg/Cm2之壓力，並加熱到20(TC至250t之溫度範 圍，使該焊材7與該導線架2及該蓋體3之接觸部形成介 33 200531922 金屬，從而使該導線架2及該蓋體3彼此接合。 、、、二過上述步驟110至步驟114，便能將該涵蓋該循環 抓道路位20之盍體3如圖j所示地固設於該導線架2上， 形成該微型流道裝置i。 通常在上述製作過程中會預留一與外界連通之穿孔 (圖未示）以便在完成上述步驟後，將流體注入該循環流 道路徑20内。雖然若是設計以空氣為該流動於該微型流 道内之流體，只要在上述製作過程並非使用高真空爐，則 在製作過程中空氣自然佔據該循環流道路徑20内之空 間，而在该循環流道路徑2〇形成後，便同時存在於該循 環流道路徑20中。但若固設該蓋體3於該導線架2上時 為接近真空之低壓狀態時，則仍然必須預留一穿孔以供空 氣進入該循環流道路徑2〇内。 由上述可知，該蓋體3可以直接地採用另一導線架， 因此，如圖12所示，本實施例之另一態樣便是在步驟112 前，於該蓋冑3鄰近該導線帛2側先形成有一對應於該循 環流道路徑20之渠道33,以使得在步驟112中將該蓋體3 貼靠於該焊材7(見圖11}上時，使該循環流道路徑2〇與該 渠道33彼此相連通，以增加該循環流道路徑2〇之截面 積。而該蓋體3形成上述渠道33之方式，則同樣地可以 採用上述步驟100至步驟1〇6之方式形成。 需說明的是，上述固接該蓋體3與該導線架2之方 式雖屬於低溫焊接之技術領域，但其固接方式並不以此 為限’其他包含擴散軟焊等的低溫焊接法，也同樣能適用 14 200531922 於本發明之中。拿垂^ 爭只上’只要其他能使該蓋體3固設於該 2 卜 、、木 之方式，如膠黏、一般焊接，或以夾具固定等 方法，均能適用於本發明中。 ^一/員'主思的是’若該循環流道路徑20設計之工作溫 度低於用之接合材質的炫點溫度，則當然可以採用上述 膠黏及-般焊接等方法；其中，若是採用一般電子產業所 使用之錫t作為該焊材7(見圖n)之材質，則在上述步驟 110則能以網印或旋鍍等方式將該焊材7塗佈於該導線架2 上。右该循環流道路徑20設計之工作溫度較高 ，則除了 10 i述以低溫焊接之方法外，另外也可以採用硬焊方法進行 該蓋體3與該導線架2之接合。 如圖13所示，本實施例之另一態樣，該微型循環流 道裝置1更包括複數設置於該蓋體3上鄰近該等散熱流道 202之散熱鰭片4,藉以提昇散熱效率。在本實施例中， 15 _型循環流道裝置1是以該導線架2直接地貼靠於該發 熱兀件9上，因此該等散熱鰭片4便設置於該導線架2遠 離該發熱元件9側的該蓋體3上。當然，設置該等散熱鰭 片4之位置不以此為限，而可以因應配合設置在任何適當 的位置；例如當該微型循環流道裝置i是以該蓋體3直接 20 貼靠於該發熱元件9上時，則該等散熱鰭片4當然也可以 改設在該導線架2遠離該蓋體3的該第二基面22上，同 樣也能達到提昇該微型循環流道裝置丨散熱效率的功效。 如圖14所示，本實施例之又一態樣，該微型循環流 道裝置1更包括一與該低溫輸送流道203相連通並藉以驅 15 200531922 動该流體於該循環流道路徑2〇内流動之驅動裝置5。同樣 地，該驅動裝置5亦非必要元件，由上述可知該微型循環 w道裝置1並不需要外加之驅動力，便能將熱量由該高溫 區91移轉至該低溫區92。不過，由於該高溫區91必須達 到一定之高溫以上方能使該微型循環流道裝置1自然地達 到上述熱量移轉之功效（在此所謂的高溫通常是指接近該 流體之沸點），因此，若希望在該高溫區91溫度未達上述 高溫時即能藉由該微型循環流道裝置1進行冷卻，或者欲 對該微型循環流道裝置i進行其他之控制，則可藉由設置 該驅動裝置5加以達成。 如圖15及圖16所示，本發明以導線架製作之微型循 環流道裝置1的第二較佳實施例之主要元件與上述第一較 佳實施例大致相同，且同樣是用於將熱量由一高溫區91 移轉至一低溫區92。其差異在於，在本實施例中，該微型 循環流道裝置1包含複數彼此相鄰且形成有該循環流道路 徑20之導線架2、2,、一固設於該等導線架2、2，其中之 一導線架2上之底板8，以及一蓋設於該等導線架2、2, 其中另一導線架2,上之蓋體3;該底板8與該蓋體3均涵 蓋該循環流道路徑20。該循環流道路徑2〇可分為一主循 環流道路徑20〇1及一與該主循環流道路徑2001相連通之 次循環流道路徑2002,其中，該主循環流道路徑2〇〇ι形 成於該等導線架2、2,其中鄰近該底板8之一導線架2上， 而該次循環流道路徑20〇2則是形成於該等導線架2、2，其 中鄰近該蓋體3之另一導線架2,上。故該等導線架2、2, 16 200531922 所界定之該循環流道路徑20並非限於同一平面上，而是 呈立體狀態；且在本實施例中，該底板8與該蓋體3同樣 為與上述導線架2相同之另一導線架，但並非以此為限； 而該高溫區91與該低溫區92則分別位於該微型循環流道 5 裝置1之相反兩側。 該主循環流道路徑2001包含複數鄰近低溫區92之散 熱流道202、一與該等散熱流道202連通之低溫輸送流道 203，以及一與該低溫輸送流道203相連通之低溫次流道 205;而該次循環流道路徑2002則包含一鄰近該高溫區91 10 並與該低溫輸送流道203相連通之集熱流道201、一由該 等集熱流道201連通至該等散熱流道202並與該低溫輸送 流道203相連通之高溫輸送流道204。因此，在本實施例 中由該主循環流道路徑2001與該次循環流道路徑2002所 構成之循環流道路徑20便具有與上述第一較佳實施例之 15 循環流道路徑20所具有之功效。 該具有呈立體狀態之循環流道路徑20的微型循環流 道裝置1可以上述第一較佳實施例中所介紹之製作方法製 造，如圖17所示，以下則介紹另一亦能應用於本發明各 式微型循環流道裝置1的製作方法，其包含下列步驟： 20 步驟300，如圖18所示，以機械沖壓方式移除該導線 架2之一部份，形成該貫穿該導線架2之該主循環流道路 徑 2001 。 步驟302，對該導線架2進行表面處理。 步驟304，如圖19所示，將該涵蓋該主循環流道路徑 17 200531922 2001之底板8貼靠於該導線架2上。 5 10 15 20 步驟306,加熱該導線架2及該底板8接近熔融狀態， 同時施加一使該底板8與該導線架2相互迫近之力量，使 該底板8固設於該導線架2上。在本實施例中本步驟是以 咼真空爐在5xl〇-5T〇rr之環境下，施加4〇〇〇Pa之力量，並 加熱到至950t，維持10小時進行接合。當然，該底板8 固設於該導線架2上之方法並非以此為限，其亦可採用第 一實施例所述之任一接合方法；但需注意的是，其接合後 所適用之溫度及強纟需符合後續步驟中所發生之溫度及 壓力。 步驟308,如圖2Q所示，固設該形成有該次循環流道 路徑2GG2之另-導線架2，於該形成有該主循環流道路徑 1之V線采2上，並使該次循環流道路徑與該主 循環流道路徑細相連通；而該等導線架2、2,之固接方 式可採用前述之任一接合方法完成。 步驟310’如圖21所示，固設該蓋體3於該形成有該 次循環流道路徑細2之導線架2，上，其固接方式可採用 前述之任一接合方法完成。 ^步驟312 ’注入該流體進入該循環流道路徑20内，以 成，亥冷4卩裝置卜此步驟是藉由原先預留於該等導線架 ，、、2 ,底f8’或該蓋體3上之穿孔(圖未示)，將該流 /主入该循環流道路經内。 、k匕3该等散熱流道202之主循環流道路a 2〇〇1鄰近該底板8 又如圖22所不，在本實施例包含; 18 200531922 數散熱鰭片4之另一態樣中，該等散熱轉片是設置於該底 ^ 田然，上述主循環流道路徑2001也可以採用如 第車乂佳實施例所介紹之半餘之方式直接於該導線架2上 $ $成而非限定以該底板8封閉該主循環流道路徑2001 方式形成，而此時該等散熱鰭片4則能直接地設置於該 導線架2上。 由上述可知，本發明以導線架製作之微型循環流道裝 置 '不僅能以-導線架2與另一作為該蓋體3之導線架接 合形成該循環流道路徑2〇,也能以一導線架2及另兩分別 1〇 ㈣該底板8和該蓋體3之導線架接合形成該循環流道路 t 20 ’更可以藉由重覆上述步驟細，將多個導線架彼此 接口而形成呈現立體交錯型式之循環流道路徑2〇，使得該 微型循環流道裝置！之設計與運用更具彈性，而得以廣泛 地運用於各種電子設備。 15 综上所述，本發明以導線架製作之微型循環流道裝置 1，除能迅速有效地整合運用現有技術成熟導線架之製程 外，更能充分利用導線架可大量批造生產之優勢，使得生 產成本大幅降低，成功地達成以較低之生產成本製造微米 級之循環流道路徑20，甚至能藉由疊合多層導線架2，使 2〇 以低成本大量批造製作具有立體循環流道路徑20之微型 循ί衣流道裝置1的目的得以實現。 惟以上所述者，僅為本發明之二較佳實施例而已，當 不能以此限定本發明實施之範圍，即大凡依本發明申請專 利範圍及發明說明書内容所作之簡單的等效變化與修 19 200531922 飾，皆應仍屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1是本發明以導線架製作之微型循環流道裝置的第 一較佳實施例的一側面圖； 圖2是沿圖1中之線IMI的一剖面圖； 圖3是該第一較佳實施例之一平面圖，說明一導線架 具有複數區塊； 圖4是該第一較佳實施例之一部份側面圖，說明一循 環流道路徑形成有複數擾流凸片； 圖5是沿圖4中之線ν·ν的一剖面圖； 圖6是該第一較佳實施例之一流程圖； 圖7是該第一較佳實施例之一剖面圖，說明具有一預 疋圖形之一光罩與塗佈有一光阻層之一導線架； 圖8是該第一較佳實施例之一剖面圖，說明定義該預 定圖形於該導線架上； 圖9是該第一較佳實施例之一剖面圖，說明移除該導 線架之部份以形成該循環流道路徑； 圖10是該第一較佳實施例之一剖面圖，說明鍍設一 焊材於該導線架上； 圖11是該第一較佳實施例之一剖面圖，說明蓋設一蓋 體於該焊材上； 圖12是該第-較佳實施例再一態樣的一剖面圖，說 明5亥蓋體上形成有一渠道； β 疋該第較佳實施例另一態樣的一剖面圖，說 20 200531922 明設置於該蓋體上之複數散熱鰭片； 圖14是該第一較佳實施例又一態樣的一示意圖，說 明设置於該循環流道路徑上之一驅動裝置； 圖15是本發明以導線架製作之微型循環流道裝置的 5 第二較佳實施例的一側面圖； 圖16是沿圖15中之線χνΐ-χνι的一剖面圖； 圖是該第二較佳實施例之一流程圖； 圖18是該第二較佳實施例之一側面圖，說明形成有 一主循環流道路徑之一導線架； 馨 1〇 圖19疋该第二較佳實施例之一側面圖，說明固設一 底板於該導線架上； 圖2〇是該第二較佳實施例之一側面圖，說明固設形 成有一次循環流道路徑之另一導線架於該導線架上； 圖21疋该第二較佳實施例之一側面圖，說明蓋設一 15 蓋體於該另一導線架上；及 圖22是該第二較佳實施例另-態樣的-側面圖，說 明設置於該底板上之複數散熱鰭片。 籲 21 200531922 【圖式之主要元件代表符號說明】 1 微型循環流道裝置 205 低溫次流道 2 導線架 21 第一基面 2， 導線架 22 第二基面 20 循環流道路徑 23 區塊 2001 主循環流道路徑 24 擾流凸片 2002 次循環流道路徑 3 蓋體 201 集熱流道 31 接合面 202 散熱流道 33 渠道 203 低溫輸送流道 4 散熱鰭片 2031 儲存室段 60 預定圖形 2032 輸送段 61 光罩 204 高溫輸送流道 62 光阻層 2041 變斷面段 5 驅動裝置 2042 喉部段 7 焊材 2042, 喉部段 8 底板 2043 混合室段 9 發熱元件 2044 大截面段 91 南溫區 2045 小截面段 92 低溫區 100.102.104.106.108.110.112.114 步驟 300.302.304.306.308.310.312. 步驟In this embodiment, the lead frame 2 is made of a copper metal with a thickness of 3% followed by a thin metal sheet before fabrication. As shown in FIG. 3, generally used for making the lead frame 2 for electrical connection. Mostly, a large thin copper sheet of > 22 coffee X is firstly divided into a plurality of blocks 23, and then simultaneously in each -hai block. After forming the hollowed-out area with the same pattern on 23, it is cut and separated to complete the final product. Therefore, in the following description, although a single-micro-channel assembly is made with a single-conductor frame 2, the artist # 能 ㈣ supposes, of course, the present invention can also produce multiple micro-channel assemblies at the same time as early as the V-frame 2. work. As shown in FIG. 1, the branch line frame 2 has a first base surface and a base surface 22 opposite to the first base surface. In this embodiment, the 20 200531922 circulation flow path 20 is etched. A groove formed by the first base surface 21 in the direction of the second base surface 22 is formed on the lead frame 2, and a part of the lead frame 2 is removed, but not limited thereto. It can also be changed to form the circulating flow path 5 diameter 20 on the lead frame 2 by using a method such as laser. As shown in FIG. 2, the circulation runner path 20 includes a plurality of heat collecting runners 201 adjacent to the high temperature region 91, a plurality of heat dissipation runners 202 adjacent to the low temperature region 92, and one of the heat sinks 202 is connected to the heat sinks. A low-temperature transport runner 203 of the hot runner 201, a high-temperature transport runner 204 connected to the 10 heat-dissipating runners 202 by the heat collecting runner 201, and a low-temperature transport runner 203 and the high-temperature transport runner 204 The low temperature secondary flow channel 205. The low-temperature conveying flow channel 203 has a storage chamber section 2031 adjacent to the heat-dissipating flow channels 202, so as to store the fluid required for the operation of the system, and a conveying section 2032 connecting the storage chamber section 2031 and the heat collecting flow channels 201. 15 The high-temperature conveying flow channel 204 has a plurality of variable section sections 2041 that are respectively connected to some of the heat collecting channels 201 of the heat collecting channels 201, and a plurality of throat sections 2042 that are respectively connected to the variable section sections 2041. 2042 ', and a mixing chamber section 2043 in communication with all throat sections 2042, 2042'. The cross-sectional area of the variable section segment 2041 is larger than the cross-sectional area of each of the heat collecting channels 201 20 and each of the conveying sections 2032, and gradually tapers in the direction of each of the throat sections 2042 and 2042 '. The cross-sectional area of each of the throat sections 2042 and 2042 'is smaller than the cross-sectional area of each of the variable section sections 2041, and the low-temperature sub-flow channel 205 communicates with one of the throat sections 2042', thereby making part of the low temperature The fluid is directly sent from the low-temperature conveying flow channel 203 without passing through the high-temperature region 91, 200531922, directly from the throat section 2042, to the mixing chamber section 2043. The temperature-conveying flow channel 204 further has a plurality of large-section sections 2044 communicating with the mixing chamber section 2043, and a plurality of small-section sections 2045 communicating with each of the large-section sections 2044. The cross-sectional area of the surface section 2045 is smaller than the cross-sectional area of each of the large section sections 2044, and is adjacent to the heat dissipation channels 202. Compared to the small section sections 2045, the large section sections 2044 reach The special heat dissipation runner 202. As shown in FIG. 1 and FIG. 2, the cover body 3 is disposed on the first base surface 21 and closes the circulation flow path 20; in this embodiment, the cover body 3 is another lead frame, but It is not limited to this, as long as the shape and material of the cover body 3 have a joint surface 31 that can be joined with the lead frame 2, it can be applied to the present invention. In other words, the cover 3 may be an object of any suitable shape and material other than the lead frame. The above fluid is contained in the circulation flow path 20, thereby transferring the heat of the high temperature 191 to the low temperature region%. In this embodiment, the fluid is vaporized or deionized water, but it is not limited thereto. Organic solvents such as methanol and propionate, or other coolants (or refrigerants), and even air can be used as the fluid. A fluid for transferring heat in a miniature circulation channel device. Since this is not the main feature of the present invention and it is easy for those skilled in the art to think about it, it will not be repeated here. As mentioned above, when a fluid such as distilled water or deionized water is filled in the «flow path path 20 ', since the cross-sectional area of the storage chamber section is larger than the cross-sectional area of the transport section 2032, most of the fluid Stored in the premise & 2031 'In this example, the fluid temperature there is relatively low and 200531922 is liquid, its temperature is close to the ambient temperature, and it can flow to the collectors 201 through the conveying section 2032. . Since the heat collecting channels 201 are distributed in regions, the fluid easily absorbs the heat generated by the heating elements 9 located in the high temperature region 91. Therefore, when the accumulated heat generated by the heating element 9 causes the temperature to rise above the boiling point of the working fluid (about 100 ° C in the case of water), heat is absorbed by the fluid through heat exchange, which will cause the fluid to The temperature rises, which in turn makes it vapor. And because the flow path is designed, the cross-sectional areas of the variable section sections 2041 are larger than the cross-sectional areas of the heat collecting flow paths 201 and the conveying section 2032, so the relative pressure is lower than 10, so it is located in the heat collecting flow. The fluid in the vapor state in the channel 201 naturally flows to the variable section sections 2041, and at the same time, the drawing force of the low-temperature fluid in the conveying section 2032 is generated, so that the fluid located in the low-temperature conveying flow channel 203 Flows in the direction of the heat collecting channel 201. When the fluid that absorbs heat and is in the state of vapor flows from the variable section sections 15 2041 to the throat sections 2042, 2042 ', due to the gradual reduction of the cross-sectional area, the fluid will gradually accelerate and flow in the stream. When passing through each of the throat sections 2042, 2042 ', a high speed is generated. At this time, the high-speed fluid will generate a relatively low pressure, so that the low pressure generated in the throat section 2042' will cause an absorption of the fluid in the low-temperature sub-channel 205 The liquid fluid located in the low-temperature secondary stream 20 channel 205 is sucked into the throat section 2042 ', and flows into the mixing chamber section 2043 together with the vapor state fluid flowing from each of the throat sections 2042 and 2042'. Therefore, although the temperature of the fluid in the mixing chamber section 2043 has decreased, it is only an effect caused by the thermal equilibrium between the low temperature fluid and the high temperature fluid. The heat is not actually removed from the fluid in 200531922, so the mixing chamber section 2043 must still be The fluid inside is guided into the heat-dissipating flow channels 202 through the high-temperature conveying flow channel 204 for heat dissipation. Since the cross-sectional area of each of the small-section sections 2045 is smaller than the cross-sectional area of each of the large-section sections 2044, the capillary force of the fluid in each of the small-section sections 2045 5 is greater than the capillary force of each of the large-section sections 2044, so it is located in the mixing The fluid in the chamber section 2043 can naturally be attracted by capillary forces to flow through the large section sections 2044 to the small section sections 2045, and finally flow into the heat dissipation channels 202, so that the heat absorbed by the fluid can be exchanged by heat. Transfer to the low temperature zone 92, and complete the heat transfer. 10 The cross-sectional area of the above-mentioned collector channel 201 is small. The purpose is to draw the low-temperature fluid in the conveying section 2032 by capillary phenomenon, and at the same time, set most of the collector channel 201 to increase the total area covered by its distribution area to achieve more Good heat collection effect. In addition, the total cross-sectional area of the above-mentioned heat collecting flow path 201 is also relatively larger than the cross-sectional area of the conveying section 2032 to accommodate the low-temperature fluid flowing from the conveying section 2032 15 and at the same time to reduce its position at each of the heat collecting channels 201 The internal flow velocity enables it to fully perform heat exchange. Of course, the present invention is not limited to the above. As shown in FIGS. 4 and 5, the lead frame 2 can also form a plurality of spoiler fins 24 in a single heat collecting channel 201 so that the fluid and the fluid The increase of the contact area of the lead frame 2 makes the adsorption phenomenon more remarkable. Of course, the spoiler fins 24 can also be formed on the cover 3 corresponding to the heat collecting channel 201 at the same time, so as to enhance the adsorption phenomenon of the fluid in the heat collecting channel 201. In addition, the low-temperature sub-flow channel 205, each of the throat sections 2042, 2042 'and the mixing chamber section 2043 are provided as shown in FIG. 1, and the guide of the head 11 200531922 is located in the storage chamber section 2031. The low-temperature fluid is mixed with the high-temperature fluid flowing out of the heat collecting runners 201 to achieve the purpose of rapid cooling, so that the high-temperature fluid can quickly cool down after flowing out of the high-temperature region 91. However, the low-temperature sub-flow channel 205, each of the throat sections 2042, 2042 ', and the mixed chamber section 2043 are not necessary components, and the present invention can be implemented without the above-mentioned components. As for the manufacturing method of the microcirculation channel device 1 made by the lead frame, as shown in FIG. 6, including the following steps: Step 100, as shown in FIG. 7, preparing a 10 mask 6 having a predetermined pattern 60; The image of the predetermined pattern 60 is a projection image of the circulation flow path 20 (see FIG. 2). In step 102, a photoresist layer 62 is coated on the first base surface 21 of the lead frame 2. In step 104, as shown in FIG. 8, the predetermined pattern 60 of the photomask 15 61 is transferred to On the photoresist layer 62. The steps of defining the predetermined pattern 60 on the lead frame 2 are completed through the above steps 100 to 104. Step 106, as shown in FIG. 9, using the photoresist layer 62 as a mask, and removing 20 portions of the lead frame 2 corresponding to one of the predetermined patterns 60 by etching to form the 100 // m width, The semi-etched circulation flow path 20 extending 100 m from the first base surface 21 toward the second base surface 22 is removed, and then the photoresist layer 62 is removed. Of course, the width and depth of the flow channel is not limited to this, and it can be changed according to system requirements. In step 108, surface treatment is performed on the lead frame 2. In this Example 12, 200531922, the lead frame 2 is washed with a 5% dilute nitric acid solution, and then washed with water, and then dried to remove impurities attached to the surface of the lead frame 2. In step 110, as shown in FIG. 10, a soldering material 7 is plated on the lead frame 2. In this embodiment, a 6 // m thick tin alloy 5 I is deposited on the lead frame 2 by means of electric money. Of course, the method of ore setting the soldering material 7 is not limited to electroplating, and other methods such as evaporation and sputtering can also be used; at the same time, the material of the soldering material 7 can also be made of tin metal, tin-indium alloy, and tin. Other low-melting metals such as copper alloys. / 'And the thickness of the welding material 7 is not limited to 6 // m, because the welding material 7 1 10 is formed in the next step' on the lead frame 2 and the cover 3 (see Fig. 0 adjacent to each other) Dielectric metal, so its thickness is between 2 // 111 and 10 ”, which can achieve the required strength. It should be noted that when the welding material 7 is deposited by electroplating, it is difficult to avoid making some of the welding material. Material 7 enters the circulating flow path 20, but because its thickness is extremely small compared to the size of the circulating flow path 15 2G, it will not affect the expected effect of the design of the circulating flow path # 20. Two step 112, such as As shown in Fig. 11, the cover 3 covering the circulation flow path 20 is abutted against the welding material 7. Step 114 'heating causes the welding material 7 to be in a molten state, and at the same time-0㈣ the cover 3 and The force of the lead frame 2 approaching each other, so that the cover 3 is connected to the lead frame 2. Since the solder 7 is a tin-copper alloy in this embodiment, this step is performed by a hot press at 60 minutes. For a period of time, apply and maintain a pressure of 40kg / Cm2, and heat to a temperature range of 20 ° C to 250t, so that the welding 7 The contact part of the lead frame 2 and the cover 3 is formed with a metal 33 200531922, so that the lead frame 2 and the cover 3 are joined to each other. After the above steps 110 to 114, the The carcass 3 covering the circulation gripping position 20 is fixed on the lead frame 2 as shown in Fig. J to form the micro-flow channel device i. Generally, a perforation communicating with the outside is reserved in the above manufacturing process ( (Not shown) in order to inject fluid into the circulation flow path 20 after completing the above steps. Although if air is used as the fluid flowing in the micro flow path, as long as a high-vacuum furnace is not used in the above manufacturing process, then During the production process, air naturally occupies the space in the circulation flow path 20, and after the circulation flow path 20 is formed, it also exists in the circulation flow path 20 at the same time. However, if the cover 3 is fixedly installed in When the lead frame 2 is in a low-pressure state close to vacuum, a perforation must still be reserved for air to enter the circulating flow path 20. From the above, it can be known that the cover body 3 can directly use another lead frame. So, as As shown in FIG. 12, another aspect of this embodiment is that before step 112, a channel 33 corresponding to the circulation flow path 20 is formed on the cover 胄 3 adjacent to the wire 帛 2 side, so that in step 112 When the cover 3 is abutted on the welding material 7 (see FIG. 11), the circulation flow path 20 and the channel 33 are communicated with each other to increase the cross-sectional area of the circulation flow path 20. The manner in which the cover body 3 forms the above-mentioned channel 33 can also be formed in the manner of the above steps 100 to 106. It should be noted that although the above-mentioned manner of fixing the cover body 3 and the lead frame 2 belongs to The technical field of low-temperature welding, but its fixing method is not limited to this. Other low-temperature welding methods including diffusion soldering and the like can also be applied in the present invention. As long as other methods such as gluing, general welding, or fixing with a jig, the cover 3 can be applied to the present invention. ^ One / member's main idea is that if the working temperature of the circulating runner path 20 is designed to be lower than the temperature of the dazzling point of the bonding material used, of course, the above-mentioned methods of bonding and ordinary welding can be used; among them, if the The tin t used in the general electronics industry is used as the material of the soldering material 7 (see FIG. N). In step 110, the soldering material 7 can be coated on the lead frame 2 by screen printing or spin plating. On the right, the circulating flow path 20 is designed to have a higher working temperature. In addition to the low-temperature welding method described in 10i, the welding of the cover 3 and the lead frame 2 may also be performed by a brazing method. As shown in FIG. 13, in another aspect of this embodiment, the micro-circulation channel device 1 further includes a plurality of heat dissipation fins 4 disposed on the cover 3 adjacent to the heat dissipation channels 202 to improve heat dissipation efficiency. In this embodiment, the 15_-type circulating flow channel device 1 is directly attached to the heating element 9 with the lead frame 2, so the heat dissipation fins 4 are disposed on the lead frame 2 away from the heating element. The cover 3 on the 9 side. Of course, the positions where the heat radiating fins 4 are provided are not limited to this, but can be set at any appropriate position according to the cooperation; for example, when the micro-circulation channel device i is directly attached to the heat by the cover body 20 When the element 9 is on, the heat dissipation fins 4 can of course also be changed on the second base surface 22 of the lead frame 2 away from the cover 3, which can also improve the heat dissipation efficiency of the microcirculation channel device. Effect. As shown in FIG. 14, in another aspect of this embodiment, the miniature circulation flow channel device 1 further includes a communication with the low-temperature conveying flow channel 203 to drive the fluid through the circulation flow path 2 200531922.内 流 的 驱动 装置 5。 Within the driving device 5. Similarly, the driving device 5 is not an essential component. From the above, it can be seen that the micro-circulation channel device 1 can transfer heat from the high-temperature region 91 to the low-temperature region 92 without external driving force. However, since the high-temperature region 91 must reach a certain high temperature or higher, the microcirculation channel device 1 can naturally achieve the above-mentioned heat transfer effect (the so-called high temperature here generally refers to the boiling point of the fluid), therefore, If it is desired to cool the micro-circulation channel device 1 when the temperature in the high-temperature region 91 does not reach the above-mentioned high temperature, or if other control of the micro-circulation channel device i is desired, the driving device may be provided by 5 to achieve. As shown in FIG. 15 and FIG. 16, the main components of the second preferred embodiment of the microcirculation channel device 1 made of a lead frame according to the present invention are substantially the same as those of the first preferred embodiment, and are also used to dissipate heat. Transfer from a high temperature region 91 to a low temperature region 92. The difference is that, in this embodiment, the miniature circulation channel device 1 includes a plurality of lead frames 2, 2 adjacent to each other and forming the circulation channel path 20, and a lead frame 2, 2 fixed to the lead frames 2, 2 , One of the base plates 8 on the lead frame 2, and a cover 3 covering the lead frames 2 and 2, and the other lead frame 2 and the cover 3; the base plate 8 and the cover 3 both cover the cycle Runner path 20. The circulation flow path 20 can be divided into a main circulation flow path 2001 and a secondary circulation flow path 2002 connected to the main circulation flow path 2001. Among them, the main circulation flow path 20 ι is formed on the lead frames 2, 2 which is adjacent to one of the lead frames 2 of the bottom plate 8, and the secondary circulation channel path 202 is formed on the lead frames 2, 2 which are adjacent to the cover 3 of the other lead frame 2, on. Therefore, the circulating flow path 20 defined by the lead frames 2, 2, 16 200531922 is not limited to the same plane, but in a three-dimensional state; and in this embodiment, the bottom plate 8 and the cover body 3 are the same as The lead frame 2 is the same as another lead frame, but it is not limited to this. The high temperature region 91 and the low temperature region 92 are respectively located on opposite sides of the microcirculation channel 5 device 1. The main circulation flow path 2001 includes a plurality of cooling flow channels 202 adjacent to the low-temperature region 92, a low-temperature conveying flow channel 203 communicating with the cooling flow channels 202, and a low-temperature secondary flow communicating with the low-temperature conveying flow channel 203. Channel 205; and the secondary circulation flow path 2002 includes a heat collecting flow channel 201 adjacent to the high temperature region 91 10 and communicating with the low temperature conveying flow channel 203, and a heat collecting flow channel 201 connected to the heat dissipating flows The channel 202 is a high-temperature conveying channel 204 which is in communication with the low-temperature conveying channel 203. Therefore, in this embodiment, the circulation flow path 20 formed by the main circulation flow path 2001 and the secondary circulation flow path 2002 has the same characteristics as the circulation flow path 20 of the first preferred embodiment 15 Effect. The miniature circulation channel device 1 with the circulation channel path 20 in a three-dimensional state can be manufactured by the manufacturing method described in the first preferred embodiment, as shown in FIG. 17. A method for manufacturing various types of micro-circulation runner device 1 according to the present invention includes the following steps: Step 300: As shown in FIG. 18, a part of the lead frame 2 is removed by mechanical punching to form the lead frame 2. The main circulation flow path 2001. In step 302, surface treatment is performed on the lead frame 2. In step 304, as shown in FIG. 19, the bottom plate 8 covering the main circulation flow path 17 200531922 2001 is abutted on the lead frame 2. 5 10 15 20 In step 306, the lead frame 2 and the bottom plate 8 are heated close to the molten state, and a force for bringing the bottom plate 8 and the lead frame 2 closer to each other is applied to fix the bottom plate 8 on the lead frame 2. In this example, in this step, a vacuum furnace is used in an environment of 5 × 10-5 Torr, a force of 4,000 Pa is applied, and heating is performed to 950 t for 10 hours for bonding. Of course, the method for fixing the bottom plate 8 on the lead frame 2 is not limited to this, and it can also adopt any of the bonding methods described in the first embodiment; but it should be noted that the applicable temperature after bonding And strong pressure must meet the temperature and pressure that occur in the subsequent steps. Step 308, as shown in FIG. 2Q, the other-lead frame 2 on which the secondary circulation flow path 2GG2 is formed is fixed on the V line 2 where the primary circulation flow path 1 is formed, and the secondary circulation flow path 2 is formed. The circulation flow path is in fine communication with the main circulation flow path; and the lead frames 2, 2 can be fixed by any of the aforementioned joining methods. In step 310 ', as shown in FIG. 21, the cover 3 is fixed on the lead frame 2 where the secondary circulation flow path path 2 is formed, and its fixing method can be completed by using any of the aforementioned joining methods. ^ Step 312 'Inject the fluid into the circulating flow path path 20, so that the helium 4 卩 device is used. This step is to reserve the lead frame, 2, 2, bottom f8' or the cover. The perforation (not shown) on 3, enters the flow / main into the circulation flow path. 3, the main circulation flow path a 2 of the heat dissipation channels 202 is adjacent to the bottom plate 8 as shown in FIG. 22, which is included in this embodiment; 18 200531922 In another aspect of the number of heat dissipation fins 4 These heat-dissipating fins are set on the bottom ^ Tian Ran. The above-mentioned main circulation flow path 2001 can also be directly on the lead frame 2 in the half way as described in the second embodiment of the car. It is formed without limitation by the bottom plate 8 closing the main circulation flow path 2001, and at this time, the heat dissipation fins 4 can be directly disposed on the lead frame 2. From the above, it can be known that the micro-circular flow channel device 'made by the lead frame according to the present invention can not only form the circular flow path 20 by joining the lead frame 2 with another lead frame as the cover body 3, but also with a lead. The frame 2 and the other two are respectively 10㈣ The lead frames of the bottom plate 8 and the cover body 3 are joined to form the circulating flow path t 20 ′. It is possible to form a three-dimensional shape by repeating the above steps and connecting a plurality of lead frames to each other. Staggered circulation path 20, making this miniature circulation channel device! The design and application are more flexible and can be widely used in various electronic equipment. 15 In summary, according to the present invention, the miniature circulating flow channel device 1 made of a lead frame can quickly and effectively integrate the process of using mature lead frames of the existing technology, and it can also make full use of the advantages of mass production of lead frames. The production cost is greatly reduced, and the micron-level circulation flow path 20 can be successfully manufactured at a lower production cost. Even by stacking the multi-layer lead frame 2, 20 can be mass-produced at low cost in large quantities with a three-dimensional circulation flow. The purpose of the miniature circulation channel device 1 of the path path 20 is achieved. However, the above are only the two preferred embodiments of the present invention. When the scope of implementation of the present invention cannot be limited by this, that is, the simple equivalent changes and modifications made according to the scope of the patent application and the content of the invention specification of the present invention 19 200531922, all should still fall within the scope of the invention patent. [Brief description of the drawings] FIG. 1 is a side view of a first preferred embodiment of a microcirculation channel device made of a lead frame according to the present invention; FIG. 2 is a cross-sectional view along the line IMI in FIG. 1; FIG. 3 It is a plan view of one of the first preferred embodiments, illustrating that a lead frame has a plurality of blocks; FIG. 4 is a partial side view of one of the first preferred embodiments, illustrating that a circulating flow path is formed with complex spoilers Fig. 5 is a cross-sectional view taken along line ν · ν in Fig. 4; Fig. 6 is a flowchart of the first preferred embodiment; Fig. 7 is a cross-sectional view of the first preferred embodiment; A photomask with a pre-patterned pattern and a lead frame coated with a photoresist layer; FIG. 8 is a cross-sectional view of the first preferred embodiment illustrating the predetermined pattern defined on the lead frame; FIG. 9 is A cross-sectional view of one of the first preferred embodiments illustrates removal of a portion of the lead frame to form the circulation flow path; FIG. 10 is a cross-sectional view of one of the first preferred embodiments, illustrating the plating of a solder On the lead frame; FIG. 11 is a cross-sectional view of the first preferred embodiment, illustrating that a cover is provided on the welding Fig. 12 is a cross-sectional view of another aspect of the first preferred embodiment, illustrating that a channel is formed on the cover body; β 剖面 A cross-sectional view of another aspect of the first preferred embodiment, 20 200531922 shows a plurality of heat dissipation fins provided on the cover; FIG. 14 is a schematic view of another aspect of the first preferred embodiment, illustrating a driving device provided on the circulation flow path; FIG. 15 is A side view of the 5th preferred embodiment of the microcirculation channel device made of a lead frame according to the present invention; FIG. 16 is a sectional view taken along the line χνΐ-χνι in FIG. 15; A flowchart of an example; FIG. 18 is a side view of the second preferred embodiment, illustrating a lead frame formed with a main circulation flow path; FIG. 101 A side view of the second preferred embodiment FIG. Illustrates fixing a bottom plate on the lead frame; FIG. 20 is a side view of the second preferred embodiment, illustrating that another lead frame having a primary circulation path is fixed on the lead frame; Fig. 21 is a side view of one of the second preferred embodiments, illustrating a cover 15 The other lead frame; and FIG. 22 is another embodiment of the second preferred embodiment - aspects of - side view, indicating that the complex is provided in the bottom plate of the heat sink fins. Call 21 200531922 [Description of the main symbols of the drawings] 1 Miniature circulation channel device 205 Low-temperature secondary flow channel 2 Lead frame 21 First base surface 2, Lead frame 22 Second base surface 20 Circulating flow path 23 Block 2001 Main circulation flow path 24 Spoiler fins 2002 Secondary circulation flow path 3 Cover 201 Collecting flow path 31 Joint surface 202 Radiating flow path 33 Channel 203 Low-temperature conveying flow path 4 Radiating fins 2031 Storage chamber section 60 Scheduled pattern 2032 Transportation Section 61 Photomask 204 High-temperature conveying runner 62 Photoresistive layer 2041 Variable section section 5 Driving device 2042 Throat section 7 Welding material 2042, throat section 8 Base plate 2043 Mixing chamber section 9 Heating element 2044 Large section section 91 South temperature zone 2045 Small section 92 Low temperature area 100.102.104.106.108.110.112.114 Step 300.302.304.306.308.310.312. Step
22twenty two