1240210 玖、發明說明： 【發明所屬之技術領域】 本發明之系、統與技術係關於—種無線射頻辨識（Radic Frequency Identification，RFID)電子標籤組合系統，例如 一 RFID模組與天線的接合組合 【先前技術】 在無線射頻辨識（Radio FreqUency Identificati〇n， RFID)電子標籤的製造過程中，其中較高成本的一部分係 為RFID晶片與天線（Antenna)間的接合過程，其中rhd 晶片係於被接合至天線前被放置於可被測試的rfid模組 中，但該組合過程一般係包含多個個別的步驟，例如成表 列形式的模組之測試、模組之切割、自該表列模組中以人 工選取正常的模組、以及將該正常模組接合至捲筒（Red) 上的天線。 【發明内容】 本發明之揭示係包括關於無線射頻辨識（Radi〇 Frequency Identificati〇n，RFID)電子標籤組合之系統與技 術，根據其中一觀點，RFID電子標籤組合系統係包括— RFID模組傳送件，該傳送件可移動一具有多個rfid模组 的第一基板，並包括一 RFID天線傳送件，該傳送件則可 移動一具有多個RFID天線且相對於而對車 丁+邊弟一基板的 弟二基板，以及包括一鄰近該第一基板的接合件，以自古亥 第一基板處分隔開該RFID模組並將該RFID模組接合至^ 第二基板上的RFID天線，該些基板係可為捲筒形式基板， 17778 5 1240210 且RFID電子择獄、#、， ”糸亚列成形，此外，該系統復可包括一 RFID模組測試件，使該RFm模組可並列同時進行測試。 一本&月可提供如後所述的-或多個好處，該系統與技 術可使裝造RFID電子標籤成本的降低，rfid電子標藏组 合的複雜度降低，以芬甘立h、， ' * 及一產肊的增加，且藉由使用此過程 之單彳向和動（即針對該rfid模組與天線的捲筒形式基 板）而非同¥於X與γ二維方向移動，可降低設備成本 且改善操作速度，而該RFm模組亦可於天線接合之前進 打測試，以確保可完全運作的正常模組被採用。 該RFID晶片係可為多功能且可程式化的， 轉筒形式的模組中，且不同尺寸的咖天線亦可被 子放在個別的捲筒上，由於該RFID電子標藏可於捲筒上1240210 发明 Description of the invention: [Technical field to which the invention belongs] The system, system and technology of the present invention is about a radio frequency identification (RFID) electronic tag combination system, such as a combination of an RFID module and an antenna [Previous technology] In the manufacturing process of radio frequency identification (Radio FreqUency Identification, RFID) electronic tags, part of the higher cost is the joining process between the RFID chip and the antenna (Antenna), where the rhd chip is Before being connected to the antenna, it is placed in the rfid module that can be tested, but the combination process generally includes multiple individual steps, such as the test of the module in the form of a list, the cutting of the module, and the module from the list. In the group, a normal module is manually selected, and the normal module is connected to the antenna on the reel (Red). [Summary of the Invention] The disclosure of the present invention includes a system and technology related to Radio Frequency Identification (RFID) electronic tag combination. According to one of the viewpoints, the RFID electronic tag combination system includes-RFID module transmission parts. The transmitting member can move a first substrate having multiple RFID modules and includes an RFID antenna transmitting member, and the transmitting member can move a substrate having multiple RFID antennas and opposite to the driver + side brother. The second substrate, and a bonding member adjacent to the first substrate to separate the RFID module from the first substrate of the Guhai and bond the RFID module to the RFID antenna on the second substrate, the substrates It can be a substrate in the form of a roll, 17778 5 1240210, and RFID electronic jail, # ,, ”糸 Asian columns are formed. In addition, the system can include an RFID module test piece, so that the RFm module can be tested in parallel at the same time A & month can provide-or more benefits as described later, the system and technology can reduce the cost of manufacturing RFID electronic tags, reduce the complexity of RFID electronic tag combination,立 h,, '* and an increase in production capacity, and by using the single direction and motion of the process (that is, the roll form substrate for the RFID module and the antenna) instead of the same ¥ and 2D Directional movement can reduce equipment cost and improve operation speed, and the RFm module can also be tested before the antenna is connected to ensure that a fully functioning normal module is used. The RFID chip can be multifunctional and programmable In the module of rotating type, the antennas of different sizes can also be put on individual rolls, because the RFID electronic tag can be placed on the rolls.
被快速地組合’維持最少庫存，故而包括具有特定RFID 應用的使用者將可提供rfid電子標籤同時滿足需求，此 外，該RFID模組接合至該天線之前測試步驟將被執行， 可提供一捲筒職電子標藏，該捲筒標藏並 不_ 3有未通過測試的RFID電子標籤。 【實施方式】 以下係藉由特定的具體實例說明本發明之實施方 式，熟悉此技藝之人士可由本說明書所揭示之内容二 瞭解本發明之其他優點與功效。本發明亦可藉由其他不同 的具體實例加以施行或應用’本說明書中的各項細節亦可 基於不同觀點與應用，在不恃離本發明之精神下 修飾與變更。 種 17778 6 1240210 第1圖係為一圖示無線射頻辨識（Radi〇 Frequency Identification，RFID)電子標籤組合系統的方塊圖，該系統 係包括一可移動且具多個RFID模組之基板的RFID模組傳 送件100, RFID模組可包括一導電圖案與接合積體電路晶 片，該晶片係可包括一射頻（RF)介面、控制邏輯電路、與 一記憶體，而該模組則可被（電容或歐姆）連接至一諧調 (Tuned)天線而形成一標籤。 單一 RFID模組設計可被用於多種標籤天線，且可因 不同的RFID電子標籤應用而被程式化，使用該rfid模組 以將該RFID晶片接合至天線將可降低整體之成本且促成 存量之降低，並提升生產效率，RFID模組將可在rfid天 線之前被製造，並為之後的使用而先行存放，該rfid模 組承載基板將可為一捲筒形式基板，且該傳送件可包括一 以該捲筒形式基板捲繞於上的捲筒11〇，因此，該rfid模 組僅^需以單一方向移動即可被測試並接合至該RFID天線 (”亥單方向可包括在該標籤組合系統的三維空間中以多 個實際之方向向前與向後的移動）。 X RFID電子;^籤組合系統亦可包括一可移動且具多 個不同5L式RFID天線之基板的RFID天線傳送件⑽，該 rfid天線傳送件可相對且對準該RFID模組而移動該 天線以令该RFID模組在一自動組合過程中與該 RFID天線連、结，此一使RFm才莫組對準天線且實質上係連 結該兩者以形成RFID電子標藏的自動系統，係可大幅降 低RFID f子標籤之製造成本，同時提供該RFID電子標籤 17778 7 1240210 设计與存貨控制上之大量彈性。 4自動RFID電子標籤組合系統可為一完全機械式系 統或為利用後述之資料處理元件的系統，在完全機械式系 統中’可提供不同的標準規格以針對該RFID模組與該不 同的RFID天線間之不同間距比例（pitch Rati〇y設定該系 統，此外，該RFID天線承載基板亦可為一捲筒形式基板， 且该RFID天線傳送件可包括一以該捲筒形式基板捲繞於 上的捲筒130,以及多個例如滾子或轉輪之轉向元件14〇。 忒系統可包括一自第一基板分隔開該RFID模組且將 該RFID模組接合至該第二基板上之rfid天線的接合件 =〇,該接合件15〇係包括一切割器、定位臂、及/或一黏 著劑塗佈件，可採用該黏著劑將該已分隔模組連結至該天 線，或者亦可採用其他可替代之技術，例如可採用超音波 連結法將兩塑材連結於—起，此外，該接合件i5G亦可如 後進一步所述地組合並列之RFID電子標籤。 該接合件150可包括一額外切割器，以進行第一次切 割而部分分隔開該RFID模組，纟以一後續的最末次切割 而自忒基板充分分隔開該RFID模組與其他模組，此第— 次切割亦可較早地於該系統中而非該接合件ι 5〇中執行， 該切割器可採用例如鋼刀滾R〇Ued)切割、蓋戳印 式（stamp)切割、雷射或其他切割技術，該系統復包括 於接合至該RFID天線之前用來確認正常叩⑴模組的測^ 件160,該第一次切割可被施用於所有rfid模組，而該^ 二次切割則僅被施用於正常之rFID模組上，以留 or 17778 8 1240210 於该基板捲筒上的不良模組再行處理。 該RFID電子標籤組合 糸統亦可包括一控制系統 170,該控制系統170可為例 一 α，士 y ^ 個或多個可程式計算機的 育料處理糸統，該控制系統丨 ^ ^ ^ U 了包括一載錄有指令中之 -貝以示的計算機可讀取媒體175 =ium)’該些㈣175則可藉由該控制系統執行而促成 作業，該媒體175可為可移除的，並可包括—具有作業系 :㈣指令與資料的開機媒體，該些開機媒體係於系統開 機時被載人揮發記憶體中，該㈣175可為㈣或可讀/ 寫媒體且可為利磁性的⑼如硬旬、利光學的（例如雷 射樂）if用半‘體的（例如特定用途積體電路（AS】c))或前 述之組合。 該控制系統i70可與該傳送件、測試件、與接合件連 接’且該控制系統170可指示且接收此些元件之資訊，例 如’該控制系統170可利用該測試件16〇測試RFm模组， 而僅將正常的RFID模組接合至該以⑴天線，因此，不良 的RFID換組1 80可被略去而不接合到相對應的天線！ ％ 上。 "第2圖係一具有多個鄰近該測試件之rfid模組 的捲筒形式基板200上視圖，第3圖則係該具有多個鄰近 試件之RFID模組22〇的捲筒形式基板2〇〇側視圖， 每RFIE)杈組220可包括一導電圖案23〇與一晶片24〇， 孩組合過程的初始步驟將是送出該RFID模組220以進行 J "式"玄測°式係對製造者與已計劃之RFID應用特別設計， 17778 9 1240210 夕们RFID &組將可並列進行測試以增進其產能。 :亥測，件可包括兩測試頭謂，該兩個用於模組 式碩只質上係為該RFID模組之導電圖案㈣下方突 出的探針，該測試頭250可為不與降桩鎚兮、曾干固 的導體，較好…… 導電圖案230 、17、、、二由忒基板200而讀取並與該RFID模 組相互作用，該捲筒形式基板·可由聚脂薄膜（例如三毫 ；；ET薄膜）製成且可包括提供一傳送件而運作的扣鏈 齒孔 210 (Sprocket Hole)。 、該測試頭250可仿效該天線接置至該RFID模組，並 充刀测.式其功旎與碩取距離，且亦可在無需橫跨模組介面 下程式化該晶[例如，纟2·5 GHz的頻率下，該測試件 之測忒頭250可精確地測量該RFID電子標藏之讀取距 離，以由該模組於正負1%之間製成，測試該並列之rfid 模組係可藉由同步之方式同時傳送位元（Bit)至每一模組 而執行，例如該模組可立即地調適成二進位搜尋技術，此 日寸所有測試下之模組可有效地在同一時間被傳送至每一模 組’且该模組無需相互干涉即可進行反應，這將大量增加 於系統中測試RFID模組之速度。 第4圖係為具有鄰近一接合件之rfid模組41 〇的捲 筒形式基板400上視圖，該接合件可包括一裁切（Sheering) 工具420與一真空頭430，以自該基板400分隔開該模組 4 1 0，其第一次切割440亦可如前述般進行。 可對該基板400之底面塗佈一黏著劑450而用以將該 模組410連結至RFID天線，第5圖係該具有rfid模組 10 17778 1240210 410之基板400與該具有RFID天線且鄰近該接合件之捲筒 形式基板500的側視圖’一例如滾子或喷灑器(㈣㈣的 站著d ：k佈件5 1 0則可於該模组被分隔且接合至該天線之 前用來塗佈該黏著劑。 该接合件亦可包括一定位臂52〇，在該最末次切割之 後，該定位臂520可針對該已被進給至下方之捲筒上的天 線而向下推動該已分隔模組，該橫跨過該模組之位置的距 離可為大約5毫米或更少，該真空頭43〇與裁切工具42〇 則可向下移動以切割掉該模組，並可繼續進行直至該模組 接觸該天線，接著，一藉由該模組與天線而組合完成之標 籤530將可被完成。 下 第6圖係為該具有RFID天線之捲筒形式基板的 上視圖，天線導電圖案600係為該RFID模組接合之前的 裸露RFID天線範例，許多天線導電圖案的形式可依據多 種RFID應用而被使用，RFID電子標籤65〇則顯示與該天 線相接合的RFID模組。 使用此些系統與技術，亦可並列地組合rfid電子標 籤，一組合系統可被設計以實質同時地自天線之單一捲^ 上方的相同模組捲筒製作多種的模組接合形式，並允許硬 體於該組合系統中被共用，以可能地降低整體設備成本， 於第1圖之系統中，該接合件可包括多個接合單元，且該 傳送件可被設計同時對準與該多個接合單元不屬相同間距 (Pitch)的RFID模組與天線’此外，該傳送件係可調整以 允許不同模組對天線的間距比例。 17778 11 1240210 第7、8圖係描述相互對準以並列接合的rfid模組 則、川、720與天線760、77〇、彻，第7圖顯示一上視 圖而第8圖顯示一側視圖，並以箭頭顯示一移動方向一亥 RFHM莫組可以群組方式被測試且接合，此時每一接合件將 處理該群組的間隔比例共同部份（Pr〇p〇rti〇nate心㈨，例 如，若有三個接合件之群組中的第三接合件。 例如"亥系統中有二個接合件，則該些RFID模組可 以21個模組為一群組進行操作，最初，模組叫頂）、模 組#8(71G)、與模組#15(7()())可被定位以對應天線叫⑽）、 天線#8(770)、與天線#15(76〇)，如果三個已對準之模組經 =為正常模組，則可全部被接合至該些並列之天線，接 :凡孩些模組後，該模組與天線可被推進一位置，接著， 模組#2(750)、模組#9(74())、與模組#16(73())可被接合至其 ^對之天線’並繼續直至模組# i至模組#2 ι均完成接合； 9 j 10圖係描述第一系列的模組均被接合至其對應並列 ^ 、第7 8圖所示之對準系統，此時標籤# 1 (900)、 丁籤#8(910)與標籤#15(92〇)已被形成，且模組#2(75〇)、模 #9(^740)與；^組#16(73())已被對準至其對應的天線。 某模組已被發現係失效不良的，則該模組即不 二被至天線且可在模組之網絡排列上維持不動，因 何失效的模組將無需進行定位配置，其組合天線將 略有任何模組接合於上，可使用一些方式以處理這些 2的天線（如後所述，此些天線即便事實上在進行過程中 並未被略去，但仍將其視為已略去）。 17778 12 1240210 γ可行方式係前進或後退至即將對準適當天線且接 合的模組捲筒上之第一正常模組的位置，例如，如果模組 #10(9:0)係不良的，則天線#1〇(94〇)可被定位於位置以上 而與杈組#22接合，接著，模組#23則成為下一接合系列中 的第一順位模組。 ^另用以填補略去之天線的方式係留下該天線於適 :位置，並接著於該位置配置下—個正常模組（即該天線事 實上並未被略去），在該系列之七個位置的末端，下一系列 的正常模組可被推進至適當的天線並定位，例如，第二、 12圖係描述當一不良模組未接合且一已略去之天線被填 上後第7、8圖之對料、統，如果模組#12(12⑽）係不良的， 則模組#13(121G)接著可被接合至天線#12(122())，然後模 組#14(1230)可被接合至天線#13(124〇)，接著，天線 #14(1250)可接受模組#22(126〇)，並於完成修復後下一系 列的2i個模組與天線將重新被定位而再行開始，完整的步 驟過程則可再重複進行。 ’ 此外’相對於三個接合單元，較多或較少之數量亦可 被採用，並列操作的額外接合件係可增加產能，雖缺★亥系 統的整體複雜度可能因而增加，失效模组將引起該系統的 產能降低，且接合件的數目與模組批量的尺寸可依據預期 的失效比例而被調整’—般而言’可預期至少將有％ 模組良率。 ^ 第1 3圖係組合RFID電子輕籍夕讲和、士It is quickly combined to maintain a minimum inventory, so users including specific RFID applications will be able to provide RFID tags at the same time to meet the needs. In addition, the test steps will be performed before the RFID module is connected to the antenna, and a reel can be provided. Occupation electronic labeling, the reel labeling does not have 3 RFID electronic tags that have failed the test. [Embodiment] The following describes the embodiment of the present invention through specific specific examples. Those skilled in the art can understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention may also be implemented or applied through other different specific examples. The details in this specification may also be modified and changed based on different viewpoints and applications without departing from the spirit of the present invention. 17778 6 1240210 Figure 1 is a block diagram illustrating a Radio Frequency Identification (RFID) electronic tag combination system. The system is an RFID module that includes a movable substrate with multiple RFID modules. The transmission module 100, the RFID module may include a conductive pattern and a bonding integrated circuit chip, the chip system may include a radio frequency (RF) interface, control logic circuits, and a memory, and the module may be (capacitive Or ohms) connected to a Tuned antenna to form a tag. A single RFID module design can be used for a variety of tag antennas, and can be programmed for different RFID electronic tag applications. Using the RFID module to bond the RFID chip to the antenna will reduce the overall cost and contribute to the inventory Reduce and improve production efficiency. The RFID module can be manufactured before the RFID antenna and stored first for later use. The RFID module carrier substrate can be a roll-shaped substrate, and the transfer part can include a In the form of the reel, the substrate is wound on the reel 110. Therefore, the RFID module only needs to be moved in a single direction to be tested and bonded to the RFID antenna ("A single direction can be included in the tag combination The three-dimensional space of the system moves forward and backward in multiple actual directions). X RFID Electronics; The combination system can also include a movable RFID antenna transmission piece with multiple substrates of different 5L RFID antennas. The RFID antenna transmitting member can move the antenna relative to and align with the RFID module so that the RFID module is connected to the RFID antenna in an automatic assembly process. This enables the RFm to align the antenna and It is an automatic system that connects the two to form an RFID electronic tag in nature, which can greatly reduce the manufacturing cost of RFID f-tags, while providing a lot of flexibility in the design and inventory control of the RFID electronic tag 17778 7 1240210. 4 Automatic RFID The electronic tag combination system can be a fully mechanical system or a system using data processing elements described later. In the fully mechanical system, 'different standard specifications can be provided to address the differences between the RFID module and the different RFID antennas. The pitch ratio is set by the pitch ratio. In addition, the RFID antenna carrier substrate may also be a substrate in the form of a roll, and the RFID antenna transmitting member may include a roll 130 on which the substrate in the form of a roll is wound. And a plurality of steering elements 14 such as rollers or runners. The system may include a joint that separates the RFID module from the first substrate and bonds the RFID module to the RFID antenna on the second substrate. Piece = 〇, the joint piece 15 includes a cutter, a positioning arm, and / or an adhesive coating member, which can be used to connect the separated module to the antenna, or Other alternative technologies can also be used, for example, two plastic materials can be connected together by using the ultrasonic connection method. In addition, the joint i5G can also be combined with a parallel RFID electronic tag as described later. The joint 150 An additional cutter may be included to partially separate the RFID module for the first cut, and a subsequent last cut to fully separate the RFID module and other modules from the substrate. This first — The second cut may also be performed earlier in the system rather than the joint ι 50. The cutter may be, for example, a steel knife roll ROUed cut, stamp cut, laser or For other cutting technologies, the system includes a test piece 160 used to confirm the normal 叩 ⑴ module before joining to the RFID antenna. The first cut can be applied to all RFID modules, and the ^ second cut is It is only applied to the normal rFID module, and the defective modules left on 17778 8 1240210 on the substrate roll will be processed again. The RFID electronic tag combination system may also include a control system 170. The control system 170 may be, for example, an alpha, y ^ or more programmable computer-based breeding processing system. The control system 丨 ^ ^ U Includes a computer-readable medium containing the instructions in -Beijing 175 = ium) 'These 175 can be executed by the control system to facilitate the operation, the medium 175 can be removable, and May include-boot media with operating system: command and data, these boot media are carried in the volatile memory of the system when the system is booted, the 175 may be a ㈣ or a readable / writeable medium and may be a magnetic ⑼ Such as hard ten, optical (such as laser music) if using a semi-body (such as special purpose integrated circuit (AS) c)) or a combination of the foregoing. The control system i70 can be connected to the transmission part, test part, and joint part 'and the control system 170 can instruct and receive information of these components, such as' the control system 170 can use the test part 160 to test the RFm module Only the normal RFID module is connected to the antenna, so the bad RFID group 1 80 can be omitted without being connected to the corresponding antenna! % On. " Fig. 2 is a top view of a roll-form substrate 200 having a plurality of RFID modules adjacent to the test piece, and Fig. 3 is a roll-form substrate having the RFID module 22 of a plurality of adjacent test pieces. 200 side view, each RFIE frame group 220 may include a conductive pattern 23 and a chip 24. The initial step of the assembly process is to send out the RFID module 220 for J " style " The system is specially designed for manufacturers and planned RFID applications. 17778 9 1240210 The RFID & team will be tested side by side to increase their productivity. : The test can include two test heads. These two probes are used to protrude below the conductive pattern of the RFID module on the module type. The test head 250 can be a non-dropping pile. A hammered, once-dried conductor, preferably ... The conductive patterns 230, 17, 17, and 2 are read by the erbium substrate 200 and interact with the RFID module. The roll-form substrate can be made of a polyester film (such as Three millimeters; ET film) and can include a Sprocket Hole 210 (Sprocket Hole) that operates by providing a transfer member. 2. The test head 250 can imitate the antenna connected to the RFID module and test it with a knife. Its function and distance can be measured, and the crystal can also be programmed without crossing the module interface [for example, 纟At a frequency of 2.5 GHz, the test head 250 of the test piece can accurately measure the reading distance of the RFID electronic tag, so that the module is made between plus and minus 1%, and the parallel rfid mode is tested. The system can be executed by transmitting bits to each module simultaneously. For example, the module can be immediately adapted to binary search technology. All modules tested under this test can be effectively used in It is transmitted to each module at the same time, and the modules can react without mutual interference, which will greatly increase the speed of testing RFID modules in the system. FIG. 4 is a top view of a roll-form substrate 400 having an RFID module 41 〇 adjacent to a joint member. The joint member may include a cutting tool 420 and a vacuum head 430 to divide the substrate 400 from the substrate 400. With the module 4 10 separated, the first cut 440 can also be performed as described above. An adhesive 450 may be coated on the bottom surface of the substrate 400 to connect the module 410 to the RFID antenna. Figure 5 shows the substrate 400 with the RFID module 10 17778 1240210 410 and the RFID antenna adjacent to the module 400. The side view of the substrate 500 in the form of a roll of a joint member, such as a roller or a sprayer (a stand of d: k cloth 5 1 0, can be used for coating before the module is separated and joined to the antenna. The bonding member may also include a positioning arm 52. After the last cut, the positioning arm 520 may push the separated partition downward for the antenna that has been fed to the lower reel. The module, the distance across the module can be about 5 mm or less, the vacuum head 43 and the cutting tool 42 can be moved down to cut off the module, and can continue Until the module touches the antenna, then a tag 530 completed by combining the module and the antenna will be completed. Figure 6 below is a top view of the roll-form substrate with RFID antenna, the antenna is conductive Pattern 600 is a bare RFID antenna before the RFID module is joined. Many antenna conductive patterns can be used according to a variety of RFID applications, and the RFID electronic tag 65 displays the RFID module connected to the antenna. Using these systems and technologies, you can also combine RFID electronic tags side by side. The combined system can be designed to make multiple module bonding forms from the same module reel above a single coil of the antenna substantially simultaneously, and allow the hardware to be shared in the combined system to possibly reduce the overall equipment cost. In the system of FIG. 1, the bonding member may include a plurality of bonding units, and the transmitting member may be designed to simultaneously align the RFID module and the antenna that are not in the same pitch as the plurality of bonding units. The transmission element can be adjusted to allow the spacing ratio of different modules to the antenna. 17778 11 1240210 Figures 7 and 8 describe the RFID module, Chuan, 720, and antennas 760, 77, and 138, which are aligned with each other in parallel. Fig. 7 shows an upper view and Fig. 8 shows a side view, and an arrow shows a moving direction. RFHM groups can be tested and joined in groups. At this time, each joint will be in place. Manage the common part of the interval ratio of the group (Proportinate, for example, if there is a third joint in a group of three joints. For example, there are two joints in the Hai system, Then these RFID modules can be operated in a group of 21 modules. Initially, the module is called the top), module # 8 (71G), and module # 15 (7 () ()) can be positioned to The corresponding antenna is called ⑽), antenna # 8 (770), and antenna # 15 (76〇). If the three aligned modules are normal modules, they can all be connected to the parallel antennas. Connected: After some modules, the module and antenna can be advanced to a position, and then, module # 2 (750), module # 9 (74 ()), and module # 16 (73 ()) Can be spliced to its ^ pair of antennas, and continue until the module # i to the module # 2 are completed; 9 j 10 is a description of the first series of modules are spliced to their corresponding parallel ^, No. 7 The alignment system shown in Fig. 8 at this time, label # 1 (900), small label # 8 (910) and label # 15 (92〇) have been formed, and module # 2 (75〇), mold # 9 (^ 740) and ^ Group # 16 (73 ()) have been aligned to their corresponding antennas. If a module has been found to be defective, the module will be delivered to the antenna and it can be maintained in the network arrangement of the module. Why the failed module will not need to be positioned and configured, and its combined antenna will be omitted. If there is any module attached to it, there are some ways to deal with these 2 antennas (as described later, these antennas are still considered to be omitted even though they have not actually been omitted during the process) . 17778 12 1240210 γ The feasible way is to go forward or backward to the position of the first normal module on the module reel that will be aligned with the appropriate antenna and joined. For example, if module # 10 (9: 0) is bad, then Antenna # 1〇 (94〇) can be positioned above the position to engage with the branch group # 22, and then module # 23 becomes the first order module in the next joining series. ^ Another way to fill the omitted antenna is to leave the antenna in the proper position, and then place a normal module at that position (that is, the antenna has not actually been omitted). At the end of each position, the next series of normal modules can be advanced to the appropriate antenna and positioned, for example, the second and twelfth pictures are described when a bad module is not connected and an omitted antenna is filled in. Figures 7 and 8 are for materials and systems. If module # 12 (12⑽) is bad, module # 13 (121G) can then be connected to antenna # 12 (122 ()), and then module # 14 ( 1230) can be joined to antenna # 13 (124〇), then antenna # 14 (1250) can accept module # 22 (126〇), and after the completion of the repair, the next series of 2i modules and antenna will be re- Once positioned, start again, and complete steps can be repeated. 'In addition', compared to three joining units, a larger or smaller number can also be used. Additional joining parts operating in parallel can increase production capacity, although the overall complexity of the Hai system may be increased. Failure modules will Causes the system's production capacity to decrease, and the number of joints and the size of the module batch can be adjusted according to the expected proportion of failures-generally speaking, it can be expected that there will be at least% module yield. ^ Figure 1 3 is a combination of RFID electronic light and peace and peace
电丁知鐵之過程的流程圖描述， 基板上之RFID模組是否具有正當功At & 〇 ,止㊉功施之貢訊辨識係 17778 13 1240210 可由方塊1300而達成，對該尺^〇模組之功能取得資訊辨 識係可包括測試該RFID模組，如前所述，讀取鄰近該模 組的指示器（例如在先前之測試過程中位於或靠近不良模 組之用以視覺標示的光學掃描），或者接收來自另一來源的 資訊，測試該模組可包括在第一捲筒形式基板上測試該可 並列進行的RFID模組，以辨識該RFID模組係具有充分之 功能而可作為預期應用，此外，該RFID模組可於方塊丨3 i 〇 被程式化而作為該類預期應用。 RFID模組與RFID天線之接合作業可於方塊132〇中 依據已於該資訊中經辨識為不良RFID模組之圖案而被選 擇進行，一般而言，該不良RFID模組的位置可被預期係 為隨機的，且此將有助於模組與天線的接合作業效率，藉 由考量之後模組群組的配置，故最好的方式應為處理略去 之天線，例如，對一可預期的97%之模組良率，兩個接合 件將可被採用以批次配置4〇個模組，而可預期每批次有·一 至兩個不良模組，如果該即將進行的批次在位置#3與位置 #25有不良模組，則該略去之天線#3可被填上模組料等， 直至該兩個不良模組棄置，且模組#6與模組#26將分別並 列疋位於天線#5與天線#25之上，同理，如果該即將進行 的批次之40個模組在位置#17具有一不良模組，則天線 可被略去且於後填上模組#4卜並使模組#42成為下一批次 的第一順位。 此外，該系統可被建立而針對該多個接合件允許該模 組與天線間有差異的對準，因此，如前述之例子，模組料 17778 14 1240210 可被對準且定位於天線#3上，同時令模組#23被對準且定 位於天線#23上，接著，此一有差異的對準將可回復至正 常之對準而模組#6與模組#26將達至定位。 該已辨識的正常RFID模組可於方塊133〇被對準至 RFID天線，這可如前述使用捲筒形式基板而並列地進行， 接著，RFID電子標籤可於方塊134〇由該第一基板的已辨 識RFID模組與！^0天線而形成於該第二基板之上，這亦 可使用捲筒形式基板而並列進行，此外，該捲筒形式基板 可並排地具有RFID模組與RFID天線。 第14圖係描述一具有並排RFID模組與RFID天線之 捲筒形式基板的範例，捲筒形式基板14〇〇具有三排的多個 RFID模組，一對應捲筒形式基板141〇具有三排的多個 RFID天線，係排列而對應該rfid模組，另一對應捲筒形 式基板1 420具有二排不同的rfid天線，亦係排列而對應 该RFID模組，因此，另一並列組合該RFID電子標籤之方 式係可加寬該捲筒形式基板且於基板上並排地配置較多的 杈組與天線，多個並排rFID模組可同時被接合至該天線， 且當一不良的RFID模組係被略去時，該對應天線則可具 有在同一列已接合之模組中的接續模組，此外，該rfid 模組與RFID天線作業可依據已於該資訊中經辨識為不良 RFID模組之圖案而被選擇進行。 該具有前述RFID模組之捲筒形式基板可利用美國專 利申請號10/396,932(2003年3月25曰申請）之，，Chip Attachment in an RFID Tag”所描述之系統與技術而被製 17778 15 I24〇2i〇 造，此一於捲筒形式η 進行$於_可組人、，土 FID模組的製造可分別被 曼仃或於一可組合珂述專利所 進行。 寻利所4田述之糸統與技術的系統中 此處所描述的系統與技術的多種 電路學、積體電路學、特定設計之ASKJ: 電子 體、軟體、及/或前述之組合 S電月自硬體 '韌 括一iσ而被凡成，此些多種執行可包 理哭的糸Μ 士 q式係在包括至少一可程式處 的叮^糸統中執行及/或轉譯，該可 定或一般之目的，與接收資料及/ 工，…’ 11 "、、特 次 — 〆才日不形式連接，且僂i矣 貝料及/或指示至一儲存記憶體、至少_ 、 少—輸出裝置。 別、置、以及至 此些程式（亦被視為電腦程式、 m ^ 八季人體、軟體應用或軟體 牙式馬）包括對一可程式處理器的 ϋ比 < — 丨开钱才日不，且可以一古 階程序、及/或目標導向程式語 - 士站批ν ^ 及/或以組合/計算機含五 a被執仃，此處所使用之，，計算機 或叩 雕洋口 ^ 機了靖取媒體，，係指任何教 肢產品、電腦程式產品、用以提供計算 7权 Τ私式處理器的設備及/或裝置(例如 ：： 體、運用光學之儲存記憶體、可程式 之儲存圮fe 包括一可接收士呌曾德可M 輯裝置（plds))， 可讀取媒體。 十^機指不的計算機 圖所指出之邏輯流程並不需特定或接續 月匕達所需的結果，其他實施態樣亦 請專利範圍所保護。 羨屬方'、後述之申The flow chart of the process of Dingzhizhi describes whether the RFID module on the substrate has a proper function At & 〇, Zhixun Gongxun identification system 17778 13 1240210 can be achieved by block 1300. The function of the group to obtain information identification may include testing the RFID module, as described above, reading an indicator adjacent to the module (for example, the optical used for visual marking on or near the defective module during the previous test). Scanning), or receiving information from another source, testing the module may include testing the RFID module that can be performed in parallel on the first roll-form substrate to identify that the RFID module has sufficient functions and can be used as Intended application. In addition, the RFID module can be programmed at block 3 i 0 as this type of intended application. The joining operation of the RFID module and the RFID antenna can be selected in block 132, according to the pattern that has been identified as a bad RFID module in the information. Generally, the location of the bad RFID module can be expected to be determined. It is random, and this will help the joint operation efficiency of the module and the antenna. By considering the configuration of the module group afterwards, the best way is to deal with the omitted antenna, for example, for a predictable 97% module yield, two joints can be used in a batch configuration of 40 modules, and one to two bad modules can be expected per batch, if the upcoming batch is in position # 3 与 位置 # 25 has bad modules, then the omitted antenna # 3 can be filled with module materials, etc., until the two bad modules are discarded, and module # 6 and module # 26 will be juxtaposed separately疋 Located above antenna # 5 and antenna # 25. Similarly, if 40 modules of the forthcoming batch have a bad module at position # 17, the antenna can be omitted and the module can be filled in later. # 4 卜 and make module # 42 the first pick in the next batch. In addition, the system can be built to allow differential alignment between the module and the antenna for the multiple splices. Therefore, as in the previous example, the module material 17778 14 1240210 can be aligned and positioned at antenna # 3 At the same time, module # 23 is aligned and positioned on antenna # 23. Then, this different alignment will be restored to normal alignment and module # 6 and module # 26 will be positioned. The identified normal RFID module can be aligned to the RFID antenna at block 1330, which can be performed side by side using the roll-form substrate as described above. Then, the RFID electronic tag can be transferred from the first substrate by block 1340. Identified RFID module with! The antenna is formed on the second substrate. This can also be performed in parallel using a roll-type substrate. In addition, the roll-type substrate can have an RFID module and an RFID antenna side by side. FIG. 14 illustrates an example of a roll-form substrate having a side-by-side RFID module and an RFID antenna. The roll-form substrate 1400 has three rows of multiple RFID modules, and a corresponding roll-form substrate 141 has three rows. The multiple RFID antennas are arranged to correspond to the RFID module, and the other corresponding to the roll-form substrate 1 420 has two different RFID antennas, which are also arranged to correspond to the RFID module. Therefore, another RFID combination is arranged side by side. The electronic tag method can widen the reel-shaped substrate and arrange more branches and antennas side by side on the substrate. Multiple side-by-side rFID modules can be connected to the antenna at the same time, and when a bad RFID module When it is omitted, the corresponding antenna may have a connection module in the same row of connected modules. In addition, the RFID module and the RFID antenna operation can be identified as bad RFID modules based on the information. The pattern was chosen to proceed. The roll-form substrate with the aforementioned RFID module can be manufactured using the system and technology described in US Patent Application No. 10 / 396,932 (filed on March 25, 2003), Chip Attachment in an RFID Tag 17778 15 I24〇2i〇, this one in the roll form η can be used to make people, and the manufacturing of the local FID module can be carried out by Mann or a combination of Keshu patents. Xunli 4 Tianshu Systems and systems of systems and technologies described herein. A variety of circuits, integrated circuits, specific designs of ASKJ: electronics, software, and / or combinations of the foregoing. As long as iσ is achieved, these multiple executions can be executed and / or translated in a system that includes at least one programmable location, which can be set or general purpose, and Receiving data and / or work, ... '11 ", and special-the date is not formally connected, and the data and / or instructions are stored in a storage memory, at least _, less-the output device. Do not, set, As well as these programs (also regarded as computer programs, m ^ eight seasons human body, software Application or software) including comparison of a programmable processor < — 丨 money is only a thing of the past, and can be an ancient program, and / or target-oriented programming language-Shizhanbian ^ ^ and / or A combination / computer containing five years is used for execution. As used herein, a computer or an engraving machine is used to refer to the media, which refers to any prosthetic product or computer program product used to provide computing rights. Devices and / or devices (such as: mass storage, optical storage memory, programmable storage, including a reciprocal device that can be used with ZD-M series (plds)), and can read media. The logic flow indicated by the computer diagram of the computer is not required to specify or follow up the required results, and other implementations are also protected by the scope of patents.
【圖式簡單說明J 17778 16 1240210 第1圖係本發明之RFID電子標籤組合系統的方塊 圖； 第2圖係鄰近測試件而具有多個rFID模組之捲筒形 式基板的上視圖； 第3圖係鄰近測試件而具有多個rFID模組之捲筒形 式基板的側視圖； 第4圖係鄰近接合件而具有多個rFID模組之捲筒形 式基板的上視圖； 第5圖係具有RFID模組之基板與鄰近接合件且具有 RFID天線之捲筒形式基板的上視圖； 苐6圖係具有RFID天線之捲筒形式基板的上視圖； 第7及8圖係對準以並列接合之rFID模組與天線之 示意圖； 第9及1 〇圖係第7、8圖之對準系統於第一系列之模 組接合至其對應之並列相對天線後的示意圖； 第11及12圖係第7、8圖之對準系統於不良之模組 未接合且略去之天線已填上的示意圖； 第1 3圖係組合RFID電子標籤之流程圖；以及 第14圖係具有並排RFID模組與RFID天線之捲筒形式基 板的範例示意圖。 (元件符號說明） 100 模組傳送件 110 捲筒 120 天線傳送件 130 捲筒 140 轉向元件 150 接合件 17 17778 170 控制系統 180 不良RFID模組 200 基板 220 RFID模組 240 晶片 400 基板 420 裁切工具 440 第一次切割 510 黏者劑塗佈件 530 RFID電子標籤 650 RFID電子標籤 710 RFID模組 730 RFID模組 750 RFID模組 770 RFID天線 900 RFID電子標籤 920 RFID電子標籤 940 RFID天線 1210 RFID模組 1230 RFID模組 1250 RFID天線 1400 基板[Schematic description J 17778 16 1240210 Figure 1 is a block diagram of the RFID electronic tag combination system of the present invention; Figure 2 is a top view of a roll-form substrate adjacent to the test piece and having multiple rFID modules; Figure is a side view of a roll-form substrate with multiple rFID modules adjacent to the test piece; Figure 4 is a top view of a roll-type substrate with multiple rFID modules adjacent to the joint; Figure 5 is with RFID Top view of the substrate of the module and a roll-form substrate with an RFID antenna adjacent to the joint; Figure 6 is a top view of the roll-type substrate with an RFID antenna; Figures 7 and 8 are rFIDs aligned for side-by-side bonding Schematic diagram of module and antenna; Figures 9 and 10 are schematic diagrams of the alignment system of Figures 7 and 8 after the first series of modules are joined to their corresponding parallel opposing antennas; Figures 11 and 12 are Figure 7 Figures 8 and 8 show the schematic diagram of the unattached and omitted antennas in the defective module; Figures 1 and 3 are flowcharts of combining RFID electronic tags; and Figure 14 has side-by-side RFID modules and RFID Example schematic of a roll-form substrate for an antenna . (Description of component symbols) 100 module transfer unit 110 roll 120 antenna transfer unit 130 roll 140 steering element 150 joint 17 17778 170 control system 180 defective RFID module 200 substrate 220 RFID module 240 wafer 400 substrate 420 cutting tool 440 First cut 510 Adhesive coating 530 RFID electronic label 650 RFID electronic label 710 RFID module 730 RFID module 750 RFID module 770 RFID antenna 900 RFID electronic label 920 RFID electronic label 940 RFID antenna 1210 RFID module 1230 RFID module 1250 RFID antenna 1400 substrate
測試件 計算機可讀式媒體 RFID天線 扣鏈齒孔 導電圖案 測試頭 RFID模組 真空頭 基板 定位臂 導電圖案 RFID模組 RFID模組 RFID模組 RFID天線 RFID天線 RFID電子標蕺 RFID模組 RFID模組 RFID天線 RFID天線 RFID模組 基板 1420 基板 18 17778Test piece computer readable media RFID antenna sprocket hole conductive pattern test head RFID module vacuum head substrate positioning arm conductive pattern RFID module RFID module RFID module RFID antenna RFID antenna RFID electronic label RFID module RFID module RFID antenna RFID antenna RFID module substrate 1420 substrate 18 17778