TWI239438B - System including power conditioning modules - Google Patents

Abstract

In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of includes vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device. The electrical circuitry may be disposed on the first interface, the second interface, or both interfaces. Moreover, the electrical circuitry includes at least one voltage regulator and at least one capacitor.

Description

1239438

V. Description of the invention 0) [Field of invention] 3 Ming is related to a method and device for electric power adjustment and integration, in particular, the present 4 bar & buried electric power adjustment technology and thermal capture and shift technology: Erguan Silicon, germanium, gallium arsenide). ， 土 & (cluing [Science and Technology] With the rapid increase of semiconductor devices (for example, electronic and electrical devices). In addition, due to this continuous increase in power adjustment and thermal rejection capabilities, with the microprocessor The need to adjust speed and transistor consumption is continuously integrated into the microprocessor (for example, point processors and video or image processing must be able to meet or respond to the fish level in a timely manner. The microprocessor and the increasingly versatile integration of the capture and removal of this heat-generating energy are already successful. The supply is used to satisfy the finite wire length between the reactor and this consumer device, but often the devices will have electricity. The demand for this consumer device has changed as mentioned earlier. The power consumption (for example, · microprocessor), the number of power-on crystals, and the demand for additional power also continue to increase. The system requirements to support such devices also continue to increase. For example, the purpose is to increase the 'electric power (average power pong =. In addition, with more and more work ^ said: these functions are usually done using floating) This power adjustment system also varies rapidly in terms of power consumption and the increase in space velocity and the number of transistors. Among microprocessors, this type of microprocessor has another rapidly increasing demand. Power, please, however, this power The supply is separated by a distance of 2. The power supply and the container and inductor may be delayed due to the time of power transmission. (For example, • in the microprocessor), the temporal change will be 1239438 V. Description of the invention (2) : The increase in processing power and increase with more and more multi-processors. In view of this, the power adjustment power or ς: will get closer to the consumer device at this setting. Put these functions System: (such as: electric regulator, capacitor, DC direct current (dc ~ positive =) is placed next to a suitable consumer device, these powers to meet. And A can be installed. Figure 1 shows this Power rate adjustment system, unified-seed transmission system usually includes separate capacitors, I voltage adjustment and two structure. One (AC-DC) or DC-DC (Dc-DC) converter is simple == Straight = The capacitor is usually set "Integrator of this integrated circuit device, separate the integrated circuit device is electrically connected. In this way, the device can be stored via this capacitor in the event of a crash," said a dog supplier of work that meets this increased demand. When necessary, the gate = / 'therefore the input voltage. This type of capacitor is usually called "/ / ,, a relatively constant input and is an analog circuit design, digital circuit design, work = aSS) capacitors' common components. Rate device circuit design

The regulator is used to receive high voltage (for example-power, and output a relatively stable low voltage (for example, w output power. The voltage regulator tends to provide this low voltage 4 to 2)) to the voltage level or The current variation of this consuming device is usually combined with a greatly increased immunity (im㈣nity). The regulator is usually used in the design of digital electronic power adjustment systems, and it is more likely to place devices with fast time varying power requirements Nearby: AC-DC and DC-κ converters are

1239438 V. Description of the invention (3) It is used to convert a specific supply temple of a convenient source ^, / 媪, and η 十, and the application voltage should be converted to an appropriate form, and the right supply is used as an example. 14% of the accumulated snow, ^, the device is consumed when the connection is repeated. In many examples, the dead power circuit will provide a single phase ramp, 11nv, pull + flat ^ relative A voltage (for example: 48V DC or 9 'integrated circuit device can require very different Supply voltage (for example: 丨 to 衣 n clothes, toilet 乂 乂 乂 gt gt 赭 赭 赭 赭 笼 π π, 认 ^ 1 to 5V DC). In this case, narrowing can change this Power and willingness to offer cold. Public ", the system in the system / converter is installed as close to this consumer device as possible, to provide stable power during the power consumption fluctuations generated by the I: For example, US patent numbers US59 0 1 040; US6191945 and US6285550.)-In addition to power considerations, the increased power consumption of these devices will also affect the thermal management system (ie, capture and / or reject thermal energy). System) is a burden. In view of this, the thermal energy management system will use a system such as a heat sink, a fan, a cold plates system using cooling water, and / or a combination of the above. To complete the know-how From, for example, thermal capture, removal, and rejection of integrated circuit devices. This type of conventional thermal management design is to place these thermal capture and rejection components & in this integrated circuit device package Above or near. (Refer to 'for example, US Patent No. "9 1 945 & US6 2855 50." For example', please refer to Figure 1. The heat sink usually includes a metal plate with straight tail wings. 'By using natural convection to transfer thermal energy from this consumer to the surrounding gas. The heat sink is usually placed directly on top of the package of this integrated circuit device. The heat dissipation device is used to increase the contact area of the device and the surrounding gas, thereby reducing the temperature rise of a given power.

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Jonathan is a heat sink in the common motor drive device. The patent number of the common layer is a heat sink I _ ^ _ same use-a blower (typically slave: 2 heat transfer wheels-a kind of technology) And a heat sink. The blower ^ turn sheet is the use of electronic parts, using a faster speed than natural convection; ^ heat transfer gas between the heat sink and the surrounding gas. The X machine is used to strengthen a certain knowledge system to strengthen the thermal energy management, reduce the consumption device and the dissipate jealousy; another technology of the second dagger will involve this device, this device, and this kind of Codes US6 1 9 1 945 and US6285550 reduce the number of layers and the thickness of the layers. (Please inflammation; a heat sink, a clear reference. For example, in the United States in general, the "knowledge system" is to capture and reject components as much as possible to meet the needs of power adjustment and thermal management. The typical and known layout is shown. Please Refer to an integrated circuit device. The heat dissipation device of this thermal energy consumption device. When part of the actual (via this heat dissipation device) is relatively =, adjust these power and thermally capture the vicinity of this integrated circuit device, to achieve this. This approach will lead to As shown in Figure 1f and Figure 1, this consumption device is an official component or a contact. In this embodiment, the heat capture, removal, and rejection are T%. In addition, the power adjustment circuit (capacitor, voltage regulator DC (AC-DC) and DC-DC (DC-DC) converter) is next to the consumer device, so as to reduce the power supply and the integrated device. Although this kind of conventional power adjustment and thermal energy management technology can indeed divide the power consumption and heat capture and reject demand of existing devices, however, the technology may not Meet future power devices and other conventional means

Page 11 1239438 V. Description of the Invention (5) and the expected increase in heat capture, removal, rejection. What is proposed is a novel power adjustment technology: this Maoming's-eye consumption and heat capture, removal, and / or; "time appropriate" In addition, one object of the present invention is: 2 expected increase. And埶 能 理 枯 术 -7 n + Nai k Seven, an improved power adjustment and ... This s technology, hunting to adapt to the existing and increase the power of thermal capture, removal, rejection requirements at the same time 4 consumption is The county government is very comprehensive, and it is called Ran Ran. An object of the present invention is to provide an improved power adjustment and thermal energy tube that can be applied to space-restricted application devices. And Shan, ^ π Niu Liumuzhu, portable computer) in the capture of the 拒 ', rejection, Erdu f one purpose is to adjust these powers to meet power consumption and heat capture, shift; in the product, and at the same time In addition, one aspect of the present invention is: ;;;;: Expected to increase. And the insertion of the woman tow # is provided for an improved power adjustment ... capturing, rejecting, ... This consumption device (for example, two positive and ",, capture, rejection ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Transmitting power adjustment delay born defects, decrease of physical fields and additional interface compartment born by this

: Thermal impedance. So ‘this system’: ‘force and body efficiency can be improved at the same time. Qianmen Zhengzheng's enthusiasm for the integration of the thermal capture and rejection elements of the present invention is a stack of the object architecture: the rate adjustment and the use of tight and enhanced: power adjustment defects caused by the two strong signal transmission delay , And strengthen the thermal properties of a full packaging device.再 Setting U: This kind of conventional power adjustment technology may be suitable for some applications. One of the purposes of the device is to provide a power adjustment technology.

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V. Description of the Invention (6) One of the requirements that satisfies the expected power consumption in all application devices is to provide an improved function. &Quot; Twenty two examples, the present invention can be implemented in devices in space-restricted application devices. The purpose of the Department of Orthopedics is to provide an improved power supply, an expected increase in the number of tasks, and an application pen with severe space requirements. For the second hole, the second interface using the first interface is summarized.] According to the present invention, the fixed circuit device has a first interface. In addition, in order to provide the first main feature of the corresponding interface on the electrical interface, the present invention is based on integrated circuits: rate. This power adjustment module: -Interface and second interface, of which, the first and second power adjustment modules are connected to the first_person I & a total of a constant I " surface and the second interface * set \ pad ' And these pads are welded together, and each of these pads will be a single power interface with a plurality of interfaces, which are connected to the group and also connected to the power controller. The power of the opposite interface is placed on the first interface and placed on the second interface and placed on a semiconducting device. This, or at the same time, is placed on a voltage regulator. In addition, this power adjustment module is in a more specific substrate. To adjust the circuit, the first circuit can be placed on two interfaces of the first dielectric body. Another circuit can be used for 11 circuits and at least one capacitor. It is also possible to respond to this special gift of the present invention. There are two embodiments on the second interface. This power adjustment module has one less power pad and is placed on the semiconductor.

1239438 V. Description of the invention (7) At least one power perforation in the body substrate. The power hole is electrically connected to the power welding pad, and is used to provide electrical connection between the second interface and at least one of the voltage regulator and the valley device. In addition, the power via is also electrically connected to a power conduit placed in the semiconductor substrate. This combination of power pads, perforations, and tubes is used to provide electrical connection between the second interface and at least one of these voltage regulators and capacitors. In another example, the power adjustment module may also have at least one output power conduit that is coupled to the circuit to provide adjustment power to the integrated circuit device. This output power conduit can be connected to an input power placed on the first interface. And, this input power is an input corresponding to this integrated circuit device. In response to this feature of the invention, the power adjustment module also has a current sensor which is placed in the semiconductor substrate and is used to provide information indicating the current consumption of the integrated circuit device and / or the circuit. In addition, a controller that is coupled to the current sensor can also receive this information and adjust the integrated circuit device and / or the power adjustment module. In addition, the power adjustment module is placed in the semiconductor substrate. Use the temperature information of the near area. In addition, the sensor can also receive this information and / or the power adjustment module can also have a temperature sensor to provide an indication that the temperature sensor is attached to a controller, which is coupled to the temperature to adjust the temperature. This integrated circuit f is cooled. According to the first integration and thermal energy management module of the present invention, one of the main features of the present invention is that it is used to dissect an integrated circuit. Power adjustment

1239438 V. Description of the invention (8) Adjustment. The thermal energy management module has a power side and a second interface. Among them, the first interface is: :: it 'It has the first interface and this power adjustment element also has a semiconductor. Brother-in-law interface. In addition, a hole is placed in the semiconductor substrate to pass through several interfaces to the power of the integrated circuit device. This = way to adjust the regulator and at least one capacitor to be applied. In addition, J has at least one first interface of the voltage adjustment element, and the input circuit can also be placed on this interface. — "The surface, or both of these mouths, should be in accordance with this feature of the present invention, which can even have an energy management element # 1 ^ Drought and heat management module surface, in the basin, Has a first interface and a second interface ;; work: interface? : For the second interface. This thermal energy management, ‘in addition, this place—that is, with a fluid with a liquid phase—captures energy. The system has a microfluid placed in it, which is the base fluid. At least-part of the containment, and structure to allow in addition, this thermal energy management module may also have an electrical connection to provide electrical connection to the oven-put t, a "face hole" bite cutting The first interface and the first one that are popular

S. In addition, the plurality of interface perforations W of the thermal energy management element are connected to the corresponding interface perforations of the power adjustment element. Use two 2 "do not connect to this power adjustment element M 帛 ^ ^ /, pen connection-the product is called Γ 仵The first interface of the brother and the thermal management element of the thermal energy management unit, the surface. In this regard, the first principle of this thermal energy management is connected to the second interface of the power rate adjustment element. The younger ... The adjustment and thermal management module can also have a micro-channel structure. This circuit is used in _plus /, there is a circuit and one, we are not in the right way, and it is placed on the semiconductor, page 15 1239438 V. Description of the invention (9) The power to be applied to this integrated circuit device. This circuit can be placed on the first interface, the second interface, or both interfaces. In addition, this circuit has at least one voltage regulator and at least A capacitor. The micro-channel structure has at least one micro-channel, which is placed in the bottom of the semiconductor to capture thermal energy. The earth may also have a current sense according to this feature of the invention These current sensors, temperature-sensing power adjustment and thermal management modules, current sensors and / or temperature sensors, and use this micro-channel to conclude, 'This controller can adjust which tube this output Fluid flow rate. The power adjustment and thermal management module can be placed here with a temperature sensor and a control reactor and / or controller. This controller can be coupled to these electricity to receive current or temperature indication. Thermal energy capture rate. At this point the fluid flow in the microchannel and / or this—an embodiment corresponding to this feature of the present invention can manage the module will have a perforation-less-a power perforation! At least one power pad and hole are electrically connected to at least one door of the power penetrator with a power welding pad. Li Dian Yu's face and these voltage regulators and conductance officers are placed in this abundance Touch Gan-丄, ^ ^ work is connected to the power ^ base. This power conduit system 'provides electrical room. Yu and at least one of these voltage regulators and capacitors are implemented in another In the example, there is at least one output power duct. The full power is set to the integrated circuit. A power δ cycle and thermal management module will have its M connected to this circuit to provide regulation. This output power duct can be connected to

Page 16 1239438 V. Description of the invention (10)-An input power pad is placed on this power _. In addition, this wheel-in power pad can correspond to the power output of the first interface of the piece. %; See the integration of integrated circuits [the detailed description of the preferred embodiment] The present invention is about a technology for adjusting and consuming integrated circuit devices) To apply power and x, for example, a technique and system are By stacking this power, you can adjust the above or below of the technology invented by Thunderbolt, so as to the second one of this consumer device, one of the consumer circuits: optimization or enhancement. Several implementations of the present invention; the power adjustment of γ into the == device, such as: portable or handheld applications 5 placed between f limits These embodiments can provide applications. Take advantage of this power-adjusted system. (M * reduced volume), yield, 22% is also related to an adjustment of the consumer device to apply work circuit ^ J consumer device thermal capture, removal and / or rejection and power adjustment application of strong support system. This technology and system of the present invention is based on the environmental constraints of the clothing (for example) and this consumer device and system: _ 'to optimize or strengthen the power adjustment and thermal energy management capabilities. However, in several embodiments, the technology and system of the present invention can also be used in space-constrained applications. 1 will require a high degree of heat capture. In addition, these realities: the two systems and the system can also be hum: the combined power adjustment circuit and thermal energy management components are in the same substrate, a substrate with a footprint, and / or 1239438 of this consumer device

An embodiment of a thermal energy management system that can adjust and thermal energy management technology elements, which includes, for example, temperature, pressure, or fluid flow in a production tube, or fluid flow in a microchannel structure. 5. Description of the invention (11) Base in. In this way, these provide an effective, compact, and feedback signal for the present invention that also uses a controller to receive the parameters, and a heat capture, removal, and motion. In addition, the present invention also includes a controller and / or the controller. This controller sets and / or adjusts the heat capture of the electrical components and removes the barrel to provide working fluid to trap the fluid dynamics of the barrel 'to meet the expectations of this consumption rate change to further reduce this trace' these thermal energy Management base or structure. In this regard, the micro-channel structure is used to capture the thermal energy of the circuit. In addition, the present invention is a multi-sentence arrangement or arrangement to strengthen or adjust the cost-effective power according to the power adjustment capability of the embodiment. A thermal energy management number sensor (for example, to adjust a π, that is, or reject a component, may facilitate power adjustment. Yes, the road's heat and / or capture and transfer flow, and the power consumption of the device during the installation period can be considered, remove this with an electrical circuit in response to this change in capacity to reject heat or adjust this and / or this management Adjustment and heat and this function These thermal energy consumption flow sensors provide information indicating the current consumption to a piece of information. It is expected that the consumption energy and sub-adjustment of these thermal energy management. For example, when using 唧, this controller can Adjust the fluid flow in some micro-channels. A power adjustment element is integrated into the total management element in response to the power rate adjustment module presented by the power management system. A power and thermal adjustment module can be used to provide a power and thermal energy management module. The needs or requirements of a system effectively optimize this: In addition, the present invention This power and thermal energy

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5. Description of the invention (12) The setting or arrangement of the ^^ group can enhance or optimize the heat capture and ^ = ability of this system. In this regard, these power _, ',,, and other components can manage the consumption of each other or with this: the right j to set this thermal energy management component and work 4 = two = = set: :: case' The present invention can be implemented more In terms of thermal management: To further heat capture and rejection capabilities, you can use the power management module and consumption for example. Please refer to FIG. 2, FIG. 3 and FIG. 4 collectively. In one embodiment, a power adjustment module 100 can be placed in a device (for example: Nai Yi-, a body circuit device, such as: a microprocessor) and The printed circuit board paste (as shown in Figure 3), or placed in the penetrating hole 2 筮 4 筮%-λ day is straight to the device 200 and the thermal management module 300 (not shown in Figure 4) between. The position of the power adjustment module 100, relative to 200 & and the thermal energy management module 300, can be selected according to the system's 100: rate, thermal and space considerations. The power adjustment module 100 series includes a semiconductor substrate 100, 2 1) = to 104h, interface pads 106an〇6p, power and location perforations 108a and 108b, power and location pads 11〇a & 11〇b And k halves, the body substrate 102 has a first interface to match the device 2⑽ or an interface two and a second interface to the substrate or circuit board 400 (for example, a system printed circuit board such as ·· A master or daughter board) matching or interface.半导体 This semiconductor substrate 102 can be made from several known materials, for example: silicon or germanium. In certain cases, the materials we use should preferably be the same as the base of page 19 1239438 V. Description of the invention (13) The device 200 can have similar characteristics (for example, thermal expansion). This architecture can provide enhanced operational reliability. Similar thermal expansion characteristics of the adjustment module 100 and the device 200 can minimize power adjustment, and minimize the potential of electrical connection defects between the 00 and the device 200. = During operation, It is caused by the difference in thermal expansion coefficient. In addition, 疋 = materials can also have the same manufacturing technology and facilities / equipment / purpose, potentially reducing manufacturing costs. These interface perforations 10 "to 10411 are used to provide the electrical connection of the device 200, which will not be provided to the power adjustment module 旦 丄 for the power adjustment of the day adjustment device 2G0. However, the power adjustment module J Senai is used to provide electrical interconnection of other signals utilized by the device 200, dreams, and address signals. For example, when the device 200 is a micro-processing device 10 〇 In the day I perforated mail 〇 4h can, through the power adjustment module (Dram test processing stealth and, for example, dynamic random access memory-a power post or Ϊstate random access memory ( SRAM) provides the emotion (πρ path) between the memory devices. In this way, the system 10 (for example, dynamic random access memory C or static random access memory (off) memory device) The signal trace on the printed circuit board 400 is installed to the entire U module, and the interface perforation ⑽ "1.4 is advanced to the transmission operation. Z: " The surface perforation 10" to 10411 can be produced by conventional processing techniques. When the number of signals transmitted or transmitted by using 2000 is large Our best path = anisotropic etching to form a narrow path in the substrate 102, and the product / L of these paths (for example, using chemical vapor deposition (VCD) or low 1239438, invention description (14) Chemical Vapor Deposition (LPCVD) technology) A highly conductive material (such as: gold, copper, aluminum) or highly doped polycrystalline silicon to make a highly conductive interconnect. For further details, please refer to Figure 2 The power of this embodiment may further include the interface pads 10 仏 to 10613, so as to promote greater conductivity between the work 100 and the device 200 or the circuit board 40. =, and say 'these interface pads 106aM 〇6p can provide greater tolerance when matching 100 or circuit board 400 and / or device 200. Pulling some interface pads 1G6U1 () 6p can use the conventional technology through high ^ (ϋ: such as gold, copper, aluminum) is completed. In a preferred embodiment, 2 :: holes, to 104h and interface pads 106a to 1061) are best able to use phase. In fact, pads 106 & To 106] 3 can use the same or the same type as the two-chip ruler package (CSP) set used by the ball grid array. Fang \ Material is completed. The term " solder pad ", such as Zhongge Linger, DP Λ, «1 ^ 々 疋 uses the ball, the ruler packaging (CSP) 'and other such devices ~ Spherical (ba 1 1) connection technology. Please continue to refer to Figure 2 '㈣Adjustment Module' may also include ancient site perforations 108a and 108b to provide a supply voltage, supply = reference voltage, and / or location (supplied) Voltage to circuit nV # 2 = point perforation 108a and 10813 can be designed and manufactured by using a method that intersects with the interface perforation 107. It should be noted that although the present invention only introduces two powers and daggers: those skilled in the art should be able to add extra power and location perforation as needed and other conditions. In addition, it should be noted that the power and location of the perforation

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108a and 108b can also provide other voltages required by the circuit 112 to provide the functions described in the report or other desired functions. Machine, hunting This power adjustment module i 〇 〇 can also have power and location 帛 塾] i 〇 a and 100b, so as to strengthen the power of the power adjustment module 100 and the printed circuit board 400. These power and location pads 1103 and 1113 'are the same as the interface pads 10 仏 to 106p, but they provide greater tolerance in the matching or interface power adjustment module 100 and the circuit board 400 牯. Mismatch. In addition, these power and spot pads 1103 and 1101) can also be designed and manufactured using the same methods as the interface pads 1063 to 10613. The power adjustment module 100 may also include a circuit 112. This circuit 112 is used to transmit the adjustment power to the device 200. In particular, the circuit η 2 can provide appropriate adjustments of the voltage parameters (for example, supply voltage and location) and current parameters (for example, supply, peak, and typical operating current) required by the device 2 0 to enable the device The available voltage and current can fall within the range and tolerance required for proper and reliable operation during normal operation, startup and / or shutdown. This circuit can also have a voltage regulator, a bypass capacitor, a direct current direct current (DC-DC) converter, and / or a parent current direct current (AC-DC) converter, which can use conventional techniques and designs (for example In other words, the conventional complementary metal-oxide-semiconductor (CMOS) or bipolar transistor (BJT) design and manufacturing technology) are arranged, structured, designed, and interconnected. A brief overview of these elements has been introduced in the background of the invention and will not be repeated for simplicity. It is important that by setting the circuit 112, such as: the voltage adjustment next to the device 200, bypass capacitors, ferrous beads, DC-DC conversion

1239438 V. Description of the invention (16) = and / or AC direct-clean L (AC-DC) converter, and the above-mentioned power adjustment can be satisfied. In addition, the horizontal and vertical gaps consumed by the circuit i i 2 are considerably reduced compared to the conventional case shown in FIG. 1 and US Patent No. US628 5550. In addition, the power adjustment module 1 is used. 〇Setting, ^ Above or near the thermal management module 300 can also promote the effective capture and rejection of the thermal energy generated by the circuit 112 in the power adjustment module. The circuit 112 shown in FIG. 2 is placed on the first interface of the substrate 102. The embodiment can also promote the location of electrical power and device 200. However, it should be noted that the circuit 112 can also be placed on the top of FIG. 4. This architecture can, for example, enhance the thermal energy capture and rejection capabilities and reliability of circuits that are relatively fast. The signal between the mouth strength device 2J0 and the signal track on the printed circuit board 400 is conductive. In addition, this structure not shown in Figure 4 can also be adapted to the packaging of the device 2000: / Six pick-ups can reduce the power adjustment mode The embodiment of FIG. 4 with the heat of 11 pW between the group 100 and the consumer device 200 can also be adapted to the manufacturing limitation of the circuit 11Z of the power adjustment module 100. ^ In addition, this circuit 112 can also be placed at the same time as the power adjustment requirements of the U device 200. η 'of the power adjustment module 100 can be considered. It should be noted that & : The additional separated power and power adjustment element for the filtering function can also be placed: the rate is similar to that of the conventional system to place it. In this case, the positive plate group 100 will not perform all the power adjustment functions of the system 10

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V. Description of the invention (17) File: The rate module 100 will only be equipped with a bleb > Forcing these separate electric power adjustment elements can use the earth :: voltage and current start and / or after meal function. For example, using 糸, you can first use a main power supply

After Ik, it will provide regional power adjustment for the power of device 200. This main power supply can provide the system (the starting point of the device, Figure Λ)), b. The power adjustment mode Many of the advantages of group 10 ° may converge on the corpus callosum;, :: f: additional separation of the electric power adjustment element and the bss force of the normal system's power adjustment footprint. These reference voltages and currents used by the circuit 112 can be provided or wound to the circuit A 1-74 * / diagram of the circuit 1 12. In one embodiment, for this electrical example, please refer to point 5 108a and 108b extend, '. And two = and 11413, and the power and ground specific power adjustment circuit design is regulated by $ 1 2' as consistently implemented ^ 1 n «^ 1 nou. In this embodiment, the power and ground (I and II need to be extended to the entire length of the semiconductor substrate 102, because the power and location ducts 114 & and 1141) can be connected at. These power and location conduits and materials (for example, gold, copper, inscriptions, or high doping :: 来 来 ～ 儿 H, and using conventional semiconductor processing or fabrication techniques # (example h 1 known Lithography, Afterglow, and Shenji Processing) Shen 1239438

Referring to FIG. 6, the formation of the power and location conduit U4a & n4b can also be more oriented to the interface of the semiconductor substrate 102 (but still located inside the substrate 102). In this embodiment, the power and ground perforations 108a and 10 讣 can also extend to the entire or almost the entire length of the semiconductor substrate 102. Since the power and location ducts 114a and 114b will be connected closer to the substrate 1 〇2 The interface surface of the circuit 112. These power and place conduits in FIG. 6 14a and 14b can be extended by power and place perforations 108a and 108b (not shown in FIG. 6) and connected to the circuit 12 which is also an interface made on the substrate 102 nearby. These power and location conduits 11 4a and 11 4b can be fabricated using conventional processing and fabrication techniques, using conductive materials (for example, gold, copper, aluminum, or highly doped polycrystalline silicon). Figures 4 and 7 Another method of supplying power and location to the circuit 112: In these embodiments, power and location are provided to the circuit 1 12 using the conventional winding connection technology, which uses the custom shown in Figure 4 Know the winding 丨 j 2 and the connection pads 1 2 2. Those skilled in this art should understand that the method of supplying power and location to the circuit 丨 2 via the circuit board 4 00 (or power supply, not shown) can also be used Utilize many other technologies. All technologies that provide power and location connections on the circuit, whether known or derived in the future, should fall within the scope of the present invention. ~ ^ As mentioned previously, the circuit 11 2 is a conventional method for adjusting power and transmitting this required power to the device 200. This circuit 11 2 (for example, a voltage regulator, a bypass capacitor, a direct current direct current (DC-DC) converter, and / Or exchange straight (AC - DC) converter) can also be provided using conventional techniques and

Page 25 1239438 V. Description of the invention (19) Design (for example, complete the necessary χ # transistor (CMOU q car with the function of the conventional complementary metal oxide semi-two = circuit design) plus preparation, and shutdown period, The appropriate electric power and the technology that is similar to providing the circuit board 40ϋ to the circuit 112 can also be used to adjust the power and location of the technology. Dream 2f =, not shown in the figure) In this regard, please refer to Figure 5, In one; solid on nine \ winding / device 200. on

^ f ilea ^ ^ ^ " J and perforation 11 8b at the output site, for the purpose of supply, should include perpetual effect = 1 ί dental holes 11 8a, 2000. Then the μ signal path can be mentioned ;: Positive: The circuit between the rate and / or place to the device and U6b is connected to the two power and place conduits-subject to the power and input of the exhibition 200. iieaiueb ^ continued i test Figure 5 ’output power and output location conduit to connect the wire above the interface of the base 102, matching or specific input of the second rate and location at!% =. In this implementation, the duct il6u116b will be wound to the device without proper strategy because of the output power and the proper power and location of the location 200 / ie the connection. This output power is / round in. For example, the power adjustment module 100 to the device 200. 'S soil points can also be wound using the method shown in Figure 6; θ = ί Figure ^, the power and location of the conduits 116a, 116b, and 116c f: Λ I t clothing technology is formed on the substrate 1 〇2 Internal and corresponding to: set = or, a predetermined welding output i〇6X, i〇6y, and, in the Λ detailed example, 'output power and location perforation are not necessary

1239438 V. Description of the invention (20), because the output power and location conduits 丨 丨 and 丨 丨 ⑼ are directly welded above the interface of the base 102, matching or corresponding to the power and location input of the device 200. Pads 106x M06y, and 1062. These power and location conduits and 11 6b can be fabricated from conductive materials (for example, gold, copper, inscriptions, or high-strength polycrystalline silicon). In addition, the output power and location of the power withered module 1000 can also be wound to the device 200 using the method shown in Figure 7. In this embodiment, the output power and location are provided to the device 2 0 using a conventional winding connection technology. In short, the conventional winding 120 (and connection pads, not shown) is used to interconnect the output of the power adjustment module 100 to the appropriate input of the device 200. It should be noted that the power adjustment module 丨 〇〇 can be produced using a two-stage process, where the perforations 104 and 108 (and other components, for example, the power and place conduits 114 and 116) are The circuit 112 is formed first, and then the circuit 112 is processed by a conventional complementary metal-oxide semiconductor transistor (CM0s) or bipolar transistor. In fact, it should be understood that any manufacturing technology (and the materials used in it) for manufacturing the function module 100, which is not known by Nayeon or developed in the future, should belong to the present invention. Furthermore, it should be noted that with reference to all the embodiments in the description, skilled artisans should also be able to understand and understand that there are still many other technologies that can provide the adjustment or output power and location of the pen circuit 112 to the device 2000. In fact, it should be understood that any technology for designing and manufacturing solder joints, perforations, conduits, circuits, and wire connections, whether now known or developed in the future, should fall within the scope of the present invention. ; In addition, it should be understood that these bases

1239438 V. Description of the invention (21) " " " -------- =, soldering: any material used in the perforations, conduits, circuits, and winding connection Known or future development should also fall within the scope of the present invention. The present invention is particularly suitable for use in space-constrained environments. To this end: set the power adjustment element to the same basic foot as the integrated circuit device = so that the gap around the integrated circuit device can provide other uses: 2: :: drop: Ϊ static or dynamic memory can be set To get closer to microprocessing, ⑼1 = ;; :: mobile time to communicate with memory. This can also result in 400 pf units / force adjustment module 1 00 can also be installed in the device 200 and the circuit board. In this embodiment, in addition to the power shown in FIG. 2, this structure is more appropriate, because, among other things, the teeth can also promote the use of the device 200 (but not the power for 4 weeks) ^ Two Institutes (I use AM): the electrical connection of the number 'for example, dynamic random; the location of ㈣ ... standing ^ static random access memory (SRAM) memory seismic module door power module 100 can also Set at 2 °° of the device and the active electrical energy of the heat pipe / (shown in Figure ^ 7. In view of the cut-off power r of the power adjustment module 100, for example, the circuit J 丨 2) is the emperor: : Separation is formed between the electrical layer and the circuit board 400; Separation '^ As mentioned earlier, this can be made by wire-wound connection 12g (as the fourth more = point no ,, or other now known or future Developed interconnect technology forces θ, and, these should all fall within the scope of the present invention. U σ ^ Where the 'thermal energy management element' is best to be set away from

Page 28 1239438 ------- 5. Description of the invention (22) _ 一 Other components of the system. In this regard, thermal energy allows gas to be in the system1. Traveling over the components can be-; group 1. . And the thermal energy generated by the device 200. This framework = promotes = removes the use in space-constrained environments, = y = facilitates the power adjustment function of the system 10 in. In this ;; enough storage device) other system requirements, the main π, said to + 屺 丨 think limb or lean material storage in Μ. ^ ^ ^ ^ Cm monthly conditions are placed near the device 200, a sufficient volume (using To place the fan) in the field. The group 300 can also implement a more compact thermal management module in 4 cases compared to the 4 cases. For example, as follows: Heat capture element capture and movement: =, and good use / use of micro-shirts ^ 会More favorable. Then ^ = °°, or the thermal energy generated by the circuit 112 can also be used θ F ,, ^ can be used a thermal energy rejection element with respect to the device 2GG, it should be understood that, or away from the 'to reject. Facts are within the scope of any of the currently known devices or f systems. A Mao exhibition should belong to the end of the present invention. For example, force 0, cooling, and solar energy management module 300 may also be unnecessary Crusoe processing p, so ^ Γ, date, such as. Transmeta company can show a low thermal energy curve due to its micro two-foot jump. If so, the system 10 can be a portable or handheld device) ^ Targeted in a space-constrained environment (for example, thermal capacity and space considerations. And does not care about the thermal energy management module 3 0 0 according to another desire of the present invention The present invention is an integrated power. Page 29 1239438 ^ -___ V. Invention Day ------ $ $ This official management module can integrate this power adjustment element (ie: power or f ^ And the function of this thermal energy management element (ie: thermal energy capture, removal, and / or meandering) is added to a single structure. In contrast, in the previous discussion of the Shibeiyuan example, these power adjustments and thermal energy capture, removal, And the rejected Mo Erji used various structures to push and stack the separation structure and separated from the device 2000 to form a three-layer structure. In accordance with this feature of the invention, the power I, element f, and the thermal energy management element are added in In a single structure, such as j, in addition to the benefits previously described, we can also obtain additional benefits, such as 喟 irf amplitude to reduce the overall occupied volume, and this consumption device, this power two = fork, and the heat The direct physical contact between the management module and the module can also be used to promote thermal capture and rejection of the power adjustment structure and / or the consuming device. In addition, this feature of the present invention is also the unique packaging structure of the 忐 official management module—the consuming device ：： Yes because of the consumption device and the power adjustment module for the thermal management of the integrated power adjustment and thermal management module: the heat capture and rejection components outside the jaw can also be omitted. ^ A features, Because in some examples, this power adjustment 桓 = :: can reach the operating temperature of the device 20 0. In addition, the miniaturization of this thermal energy management module can also achieve rate adjustment and thermal energy management In the high-space-restricted environment, the module's thermal energy capture and thermal energy rejection of the thermal management element of a 100 ~: When the mold is used to enable these thermal energy capture functions to be separated from these power adjustment functions, This single surname is considered to be in the single I 'structure (ie, the power tone shown in Figure 8;

Page 30 1239438

Fifth, the invention description (24) and the thermal energy management module 1 0 0 0) can be installed inside (please refer to, for example, it can be completed by using a heat sink placed at the device / packaging place. 2 Body circuit device package (Figure 11) ° These thermal energy rejection functional surfaces, or placed in the device / package, please refer to Figures 8 and 9, the power adjustment and thermal management module 1000 can have power adjustment elements 1 1 0 0. This power adjustment element 丨 i〇〇 can be substantially similar to the power adjustment module 100 shown in FIGS. 2 to 7 and can have, for example, the aforementioned perforations, pads, and circuits . For the convenience of explanation, the details and functions of the power adjusting element 11 00 will not be repeated here. This power adjustment and thermal energy management module] 0 0 0 may also include a thermal energy management element 1200. The thermal energy management element 1200 is used to capture and remove the thermal energy generated by the device 2000 and / or the power adjustment module 1 1 00, so that the device 2000 and / or the power adjustment module 1 100 The temperature will not exceed a given temperature. This thermal management element 1 200 can also be used to reject this thermal energy. In this way, in operation, the thermal moon & management element 12 00 can capture the thermal energy generated by the device 2000 and the power adjustment module 丨 丨 〇〇 and remove this thermal energy so that it can pass through convection Or a heat rejection element (for example, a conventional heat sink) is spread to the surrounding environment. The power adjustment and thermal energy management module 1 0 0 0 may also have a substrate 10 2 &, which forms a main part of the power adjustment module 1 0 0, and a substrate 1 2 b, in which a thermal energy management element 1 2 0 is formed A part of 0. The two substrates can be connected by, for example, an anodic or fusion connection, an eutectic connection, or an adhe si connection between glass and semiconductor structures. . In addition, metal structures can also be used

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, Welding (welding), welding (soldering), eutectic bond (entectlc bondmg), or adhesive (adhesive) to combine the substrate 1023 and the secretion can form a power adjustment and thermal energy tube; mold in no structure In the printed circuit board 400 and the device 2000 input /: the path provided to provide electrical connection between the two sides of the path is used in two steps to fabricate. Baixian, a separated and combined interface perforation will be formed in each substrate of the power modulation element 1100 and the thermal energy management element 1200. Subsequently, when the two substrates are connected, an interface perforation in the substrate 02a will match the corresponding interface perforation in the substrate 102b, thereby forming an interface perforation of the module 1000. One is to strengthen the electrical continuity between these interface holes in the substrates 102a and 102b. The intermediate interface pads can be placed on the surfaces of the mating interfaces in the substrates 102a and 1021}. After the two pads are connected, the pads on each matching interface will contact the corresponding pads on the other matching interface. This architecture can provide greater tolerance when matching and interfacing with the power adjustment element 1100 and the thermal energy management element 1200 '. And so, the power adjustment and thermal energy management module can be strengthened, which is not perfect on the connection substrate. When aligned, the electrical interface between the exposure interfaces is continuous. In addition, in those examples where power and location perforations are used to provide external power to the power adjustment module 110, we can use the previously described production techniques' to form these power and location perforations. However, in those examples where windings are used to connect the external power supplied to the power adjustment module 丨 丨 〇 00, power and location perforations are not necessary. Please continue to refer to FIGS. 8 and 9. In one embodiment, the thermal energy management module 1 2 0 0 may have a micro-channel thermal energy exchanger 2, which has a plurality of micro-channels.

Page 32 1239438 V. Description of the invention (26) Channel 1 220. The micro-channel heat exchanger 121o may also include a drum 1 230, a fluid inlet 1 240, a fluid outlet 125o, and a pipe 126o, for supplying fluid to the microchannel 1 220. only

Please refer to Figs. 10A and 10B. The micro-channel thermal energy exchanger 121 may be Niu Ruilai, a semiconductor substrate made by metal, a metal substrate made by machine, or a glass substrate made by machine. Figures 10A and 10B are top and cross-sectional views of an example microchannel structure 1 220, respectively. The base of the thermal management element 1200 may have a pattern of micro-channels km-1 and 1 22 0-2 engraved in the interface. These micro-channels 1 220 — and 122 — 2 can also be arranged above the interface of the thermal energy management element 12 0 0 in response to the thermal energy removal needs of the power adjustment element 1 1 100. The density of the microchannel structure 22o can be increased in the area where the source of excess thermal energy is higher than predicted or measured. Alternatively, the windings of the microchannel 22 = —1 and 1 220 — 2 can also be designed to convert the microchannel thermal energy. Exchange cry 1210, decrease and / or minimize temperature gradient from inlet to outlet. The width, depth, and shape of these channels 1 2 2 0 — 1 and 1 2 2 0 — 2 can also be designed and manufactured to improve the temperature consistency of the device or meet the device 200 and or the power adjustment element 11 〇〇 Hot spots above. In fact, the formation and arrangement of the microchannel structure 1220 / can also be applied through the US patent application ("Electroosmotic Microchannel Cooling System" filed by Kenny et al. Case) to aid design or decision. In addition, microchannel thermal energy exchange =% 1210 and microchannels 1220 — 1 and 1220 — 2 many different types of arrangements, 'layouts, and architectures will be filed in U.S. patent applications filed on January 19, 2000 by Kenny et al. Description and introduction in the case. X

Kenny et al. U.S. patent application filed on January 19, 2002 (issued

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The name is "Electroosmotic Microchannel Cooling System" "Application" ^. This U.S. patent filed by Kenny et al. Has not yet been filed, and will be referred to as the "VKenny patent application" "in this specification The case, as a whole, will also provide a reference to this manual. A Kenny patent application It should be noted that the microchannel 2 2 0 can also be inside the 1 1 00 interface. In addition, the microchannel structure 丨 2 ^ extended to the first and first matching interface of the power adjustment element thermal management module 1 2 0 0 can also be in time, in the middle, the micro channel thermal energy exchanger 1 21 〇 can be more six + The thermal energy generated by Fang in this example 2 0 0 and the power adjustment element 丨 00 is installed in the capture and removal device thermal energy exchanger 1210 and the device 200 and the power adjustment factor is the physical contact. More intimate between cattle 1 100 = a micro-pass 迢 thermal energy exchanger 1210 is also available, using micro channels 1 220-1 and 1 220-2, with at least one fluid path, as shown in Figure 10A. These independent paths can be connected to different drums 1230 and / or different thermal energy rejection elements 4 and 0 according to the requirements and / or design of the application device. As mentioned previously, many different types of arrangements, layouts, and architectures of the microchannel heat exchanger 1210 and microchannels 122〇_1 and 1222012 have been described and introduced in the £ 611117 patent application. Further reference. This drum 1 2 3 0 can be any type of drum device, which can provide the flow and pressure required to capture the heat of the device 2 0 and / or the power adjustment element. In this regard, the cartridge can be an electroosmotic type cartridge device 'as described and described in the Kenny patent application. This electroosmotic type cartridge device is not described in detail here, and its corresponding discussion will refer to the Kenny patent application.

Page 34 1239438

V. Description of the invention (28) The power adjustment and thermal energy management module 1000 in Figs. 8 and 9 can promote effective packaging of the rate adjustment element 1 100 in the vicinity of the device 2000, and provide the thermal energy management element 1 20 0 capture and removal of power adjustment element 1100 and / or device 20 = additional benefit of thermal energy generated. In addition, by placing these power adjustment units, the prime components can be placed in a single module below the device 200, and the one or two surfaces of the device 20 (^, for example, the upper surface) can be provided as other modes. Access (such as optical or RF telecommunications) and / or memory device placement. This placement step also allows the surface of the device 200 to be used for other functions, including, for example, additional thermal management elements ( The heat tank as shown in Figure 3) or the second thermal energy management element (as shown in Figures 17A and 17B). · In addition, the power adjustment and thermal management modules of Figures 8 and 9 can also be promoted as Effective packaging of a separation device. In this regard, please refer to Figures 11 and 12A. Module 1 0 0 0 can be added to a typical electronic package 1 3 0 0 with pin 1 3 0, which can be adjusted to accommodate thermal energy management. Element 12 00 body 0 The device 200 shown in the embodiment of FIG. 11 can use a conventional downward-facing, spherically connected fixing structure to an electrical interconnection array. In addition, the device 200 can also use Similar to previous The method described above (please refer to the embodiments shown in Figures 2 to 7) is fixed to the power adjustment and thermal management module 1 100 0. In the device 2000, a fixed structure facing downward and spherically connected can be used. Provides several additional benefits, including: providing intimate contact between device 2 and thermal management, thermal capture capabilities of the 1200 (and fluid-filled microchannel 122), and providing back access to the device 200 For other functions, as described earlier.

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V. Description of the invention (29) Brother 1 2 A in the example of Figure A +, upward, winding connection: :: 200 can also be used-a kind of conventional surface 200 and packaging linden wood between 1 300 It may be unnecessary to construct a 'where' wire-wound connection. In this embodiment, these interconnects are connected to the device 2GG. "The winding connection technology can provide electrical properties, including, for example: children;? Xuan Guan embodiment will also provide several major advantages 呪, add power adjustment and thermal energy capture components to the outside of the package 2, f to Keep the power adjustment element 1100 close to the device 2000.? Οπ Another embodiment can also get another benefit, that is, providing the device— \ rate adjustment element 1 1 0 0 and thermal management element 1 2 0 0 The intimate connection, so that the thermal energy generated by the device 2000 and / or the power adjustment element 1 1 0 0 can be efficiently and effectively captured (using the fluid in the micro channel 12 2 2 0), and the packaging 1 3 3 0 0 Another advantage of removing the embodiment of FIG. 12A is that the operating surface f of the device 200 can be optically accessed, which can be applied to other devices, such as photoelectric devices (such as modulators), A display device, an optical imaging device (such as a CCD), and / or an optical switch. When the device 2000 is intended to be implemented in a rough environment, a sealed package 1300 may be a more advantageous option. As shown in FIG. 12B, A cover 1 320 can be attached to the package 1300, whereby For a sealed environment, the integrated power adjustment and thermal management capabilities of the module 1000 are in close contact with the device 2000. This cover 1 320 may be opaque (as is common with optoelectronic devices), or this cover 1 3 2 0 It may also be transparent in the infrared or visible spectrum (as is common with display devices or imaging devices). Integrating power adjustment and thermal management functions in this package allows the optimal operation of thermal sensing devices, such as imaging arrays. In the device 2 0 0 Fixed directly to the substrate (for example, printed circuit board 4)

Page 36 1239438 V. Description of the invention (30)), the net 1 is used to supply fluid to the heat option. Please refer to FIG. 13, the formed channel or pipe 1260 is provided to the microchannel thermal energy transfer (solder), and / or the embedded pipe 1 260 is directly fixed (not shown) and fluid to promote the module 1 0 0 0 is implemented on the wafer. It should be noted that there are many different techniques, such as ‘to allow pipeline segments and and connect to positioning. These can also be welded (solder) and can also be connected to the pipe in the top hole of the module 1000, so as to connect one or two surfaces. In fact, the fluid inlet of the exchanger 1210 or the future development will be in the internal channel of Figure 13 and the thermal energy management module 1 00. As shown in Figure 13 in the base, embedded or shaped channel or, or its knot can be either an adhesive surface or a bottom fitting embedded through and the output should belong to the structure and also be packaged, this formed port的 The production channel in the base of the module 1000. The management element 1 2 0 0 may be more advantageous. The selection of an action fluid is based on the power embedded in the base or shaped by the power regulation and thermal management module 1 0 00. Down changer 1210. Press fit, welding, and adhesive can fix these channels to the fluid inlet and outlet of the micro-channel thermal energy exchanger 2 (not shown).苐 13 The structure of pick-place in the pick-place component S lane 1 2 60 can be connected to the module 1 000. We can form an open coupling in the module 1 000. The module 1000 is inserted, press fit, or adhesive. Alternatively, we can form openings and use one or more channels or pipes 1260 open above these openings to fix to microchannel heat using all techniques, whether now known within the scope of the present invention. It can be applied to the consumption device and power adjustment, and the packaging fluid is fixed to the substrate. The working fluid can be provided to the power adjustment and

Page 37 1239438 V. Description of the invention (31) The micro channel of the thermal energy management module The thermal energy transfer channels (or embedded pipelines) are directly connected to the solid fluid inlet and outlet, or the package channel (or internal diffused pipeline) is connected to this In this package, the interconnections between these channels (or pipes) and microfluidics are formed or internalized. In addition, the power adjustment and heat supply module 100 is inserted into the tea number information for more timely cooling and power adjustment. Please rate and adjust the thermal energy management module 1 Q 〇 can be said that 'temperature, pressure, and flow sensor 1270 is used to provide display information (for example, operating temperature) will be wound to the controller 128 〇, closed loop control with 1 000 functions. In particular, when the sensor 1 270 is configured as a 1 2 0 0 series, this temperature can be utilized for the operation of the positive thermal energy management element 12 00 and the power adjustment. In these cases, the power is operated in a thermal energy control mode, in which the feedback signal from the controller 1 280 is measured by one or more temperature sensors. The information provided by this control is used to make decisions, such as ^ converters. These accessories can be used to locate the fluid inlet and outlet of the microchannel heat exchanger. The embedded pipes and channels in the fluid inlets and outlets of these packages can provide the basal channel thermal energy exchanger fluid inlet and outlet energy management module 1 0 0 0 can also have lifts or devices to achieve more effective and reference Figures 14 and 15 show that the function of the present invention additionally includes a sensor 1270 (such as a reactor) and a controller 1280. These sense the operating conditions of the module 20 and module 1 0 0. The signal of the sensor 1270 is then provided. When the power adjustment and thermal energy management module has a temperature measurement sensor, the data provided by the sensor is controlled to change or adjust the component 1100 and / or the device 200 to adjust and Thermal management module 1 〇〇〇 is scattered throughout the module 1 0 0, one temperature change can be provided as a controller 1 2 0 0 can use the sensor 1 2 7 〇, module 1 〇〇〇 and / or device

1239438 V. Description of the invention (32) The average temperature of 2000 and the temperature space relative to the module 1000 and / or the device 2000. Based on this information, the controller 1280 can adjust the fluid flow rate of the microchannel 丨 2 2 0 through the microchannel heat exchanger 1 2 1 0. In addition, this controller 12 can also control the operation of the cylinder 23o, or adjust the fluid distribution in different channel forms through the microchannel thermal energy converter, thereby adjusting the fluid flow rate in the microchannel 122o. > In addition, the 'controller 1 2 0 0', after deciding a temperature sensitive state, can also warn that the device 2 0 0 may exceed (or have exceeded) its rated operating temperature. . In this way, the device 200 can activate a low power mode, thereby reducing /, operating / JDL degree and power consumption. Furthermore, consuming less power will also reduce the thermal energy generated by the device 200 and the power adjustment element 丨 丨 oo. This device, 200, can enter a shutdown procedure based on information related to its operating temperature and use 乂 as a measure of consistency retention. Other actions in response to temperature fluctuations are described in the Kenny patent application, which can also provide further reference. Crying sensor 1 270 (for example, temperature, pressure, and / or flow sensing: placement or location within substrates 102 & 102b can be based on several considerations. For example, comparing temperature sensors to For the prediction or measurement of heat sources of these microchannels 122o and circuit 112 and / or device 2000, lateral placement may be a very advantageous choice. In addition, temperature sensors are placed at different depths of the substrates 102a and 102b ( (Vertical position) may also be a very advantageous choice. Figures 110a, 10b, 14, and 15 show the induction in the power adjustment element and thermal management element, 1200, in various positions 127。 These sensors aw are used to provide the operating conditions of the device 2000 and the module 1000 in a specific area (for example, temperature) to the controller 128.

Page 39 1239438 1 'V. Description of the invention (33) The detailed discussion, operation, and various considerations of the sensor 1 270 are described in the Kenny patent application, which can also provide further reference. It should be noted that although the embodiments of Figures 9 and 15 only introduce one 唧: (that is, 唧 洵 1 230) ', but the power adjustment and thermal energy management module 10000 ^ can have more than one 唧 tube mechanism. The additional pumping mechanism can also provide a more immediate and direct fluid in a specific area of the module ⑽0. This is particularly important in situations where the device 200 and or the power adjustment element are expected. For example, more than one canister can have a thermal energy converter 121 ° with separate and independent microchannels 122. Road Si :: II ^ shown in the figure. In addition, using more than a tube machine to provide ϋ ::; Ming Yu K, in the patent application, it can also ΗοΠί; let's say the power adjustment and thermal energy management module of Figure 15 to provide the power of device 2 (30 Adjust work and set 200

At 1 = rate adjustment 70 pieces of 1100 cooling power maintained within acceptable temperature range :. Second whole: Thermal Management Module_Operation ⑽: Execution: 1 The change may be caused by the change in the soap rate used by the device 2000. i Use the flavor of the fluid cartridge ± p dagger force (for example, the Li-producing f system to increase the fluid flow rate), so as to maintain the fox of the device 200 at an acceptable temperature Within range. ^ Set / 〇〇 a Wei 2 1 Bu, this power adjustment and thermal management module 1 0 0 0 can also have a thunder and grasp sense-', which is used to measure the current consumption of the device 2 0 0. Please refer to page 16, pictured on page 40, 1239438 V. Description of the invention (34) The current sensor 1 290 can be embedded in the semiconductor substrate 102, so as to provide the surface device 2 0 0 and / or the circuit 11 2 current Consumed information to control crying 2 8 0. Subsequently, the controller mo can use the detected current consumption to adjust the operation of the thermal energy management element 1220. For example, in response to a change in the current demand detected by the current sensor 1290, the controller 280 can increase or decrease the fluid flow with 1230, so as to adjust the fluid cooling of the thermal energy management element 2200. ability. In this embodiment, by detecting and analyzing the current change of the device 200, the controller 1 280 can anticipate the temperature change of the device 200 and / or the device 1100. / And Li Yang e week, please continue to refer to Figure 16, the current sensor 29 can also detect the current through the power adjustment τ ο 1 〇 (for example, the voltage adjustment device) circuit. This current through the circuit 112 may represent the current and / or power consumption and demand of the device 200. This controller can also use the appropriate action taken by Induction Cry 1 to increase or decrease the temperature change caused by the "other :! f adjustment: the current consumption change of piece 1100. The extended control state can also use this information to determine the method The heat generated by the change captures and rejects the demand. For the motor consumption—based on the current measurement through these voltage adjustment devices, we, the power consumption of the voltage regulator and the power consumption of the device 20 ,: "制 益 1 280 can determine the overall power consumption and adjust the thermal energy capture and removal capabilities of the control unit 1210 accordingly. ^ Canton exchange can capture and remove the ability can also be changed by micro; Tao ;; Second, the heat flow of 10: (for example, 'adjust which tube 123. the output flow rate) and the body positive control benefits 1 280 can also, The capture and removal device 200 and the mold

Page 41 1239438 V. Description of the invention (35) _ After the group of 1,000 thermal energy, adjust the thermal energy rejection device 1 2 1 0 埶 can be inserted to recruit Fen M ▲ f In the patent application for transportation heat energy exchange, it can also The reference level for further steps is shown in Kenny. In the embodiment of Figure 16, the inductor 29 is a voltage regulator integrated. It should be noted that =: can be consumed by the device 2.0 during power consumption: =: / or consumed. Subsequently, the controller i 2: = is set to: channel action, for example, adjusting the micropower rejection capability, as previously described. In addition, it should be noted that the execution of the controller 1 280 can be implemented in the device 20. In this case == also used, for example, the sensor 127〇 (for example , Set 00 is a profit) and / or current sensor 1 290 information, $ θ # π + force motor circuit) electrical activity information, so as to determine and analog current output 2 0 0 can adjust the power adjustment year 11 〇 疋, power consumption. With this, the device 2 can also be adjusted: rate transmission ability. In addition, the ability to divide, and / or reject. Partial or all functions of capturing and moving using the thermal energy of Λ cattle 1 200 / Operation can control the use of the control button 1 280, said the use of clock rate, to provide the available information (for example to use. And the advantage of the existing computing resources in the clothes 20, also for the implementation of repeated or cocoa For devices that predict the power consumption of the device and the function of the device, we also use the dynamic model of the entire system. Page 42 1239438

V. Description of the invention (36) What generates thermal energy to capture and refuses to manage is the temperature temporal or spatial change / enhancement strategy of the soil 2 0, so that the device controller 1 280 can also implement complex control: The device 200 and / or and / or the controller 1 280 may determine the thermal method, so that the device 2000 responds, and the device 200 and / or the power, 12 // every piece 1 2 0 0 is appropriate. The operation procedure of action or catching and rejection is to: use the end-use to develop a thermal energy capture and operation within the range of thermal energy, and, or better flow. In addition, the device 200 and / or the controller 128. It is also possible to use the information of 200 operations to predict the power consumption of the device 2000, the door, and the eight devices. For example, if the device 200 is a workman who is crying with a knife and a knife. If there is any processing benefit at τ, then this floating-point processing ^, which may occupy a small part of the surface of the microprocessor, :: temporarily exceed the power consumption of the other parts of the microprocessor. In class J :: The temperature of the microprocessor subsystem will quickly rise to a level above the recommended operating temperature. As such, the device 200 and / or the controller 128 may preferably predict the dense power consumption of the device 200 and thereby provide the necessary energy capture capability, which is dynamic for the dense power consumption area of the device 200. According to another feature of the present invention, the present invention is a closed loop power adjustment and thermal energy management system. Please refer to FIG. 7A. In one embodiment, the closed-loop power adjustment and thermal energy management system 2000 has a power regulation and thermal energy management module 1000, as previously described, and is equipped with thermal energy capture. And rejected the bus module 1 4 0 0. In this embodiment, the power adjustment and thermal energy management module

Page 43 1239438 V. Description of the invention (37) 1000 is placed on the surface of the printed circuit board 400, device 200 is placed on the surface of the power adjustment and thermal management module 1 000, and the thermal energy capture and rejection module 丨 4 〇〇 is placed on the surface of the device 200. In this architecture, the power adjustment element 1 100 of the power adjustment and thermal management module is placed near the device 200 to provide the power adjustment benefits previously described. In addition, the micro-channel heat exchanger 丨 2 丨 〇 is placed near the power adjustment element 11 〇 to promote enhanced thermal energy capture, removal, and rejection, so as to maintain the temperature of the power adjustment element 1 丨 〇 Within an acceptable range. Subsequently, the thermal energy captured by the thermal energy management element 丨 200 will provide (via the fluid flow) to the thermal energy rejection element 1410 of the thermal energy capture and rejection module 丨 400. ^ This thermal energy capture and rejection module 1 400 uses thermal energy rejection element 1410 (as shown by a heat sink with a straight tail fin) and thermal energy capture element 1420 to reject the thermal energy generated by the thermal management element 12 00. This thermal energy rejection element 1 4 1 0 can utilize many different types of thermal energy rejection techniques, including designing with fluid flow paths on high surface area structures such as fluid channels in straight tail fins, as described in the Kenny patent application. Description and introduction. All of the thermal capture, removal, and rejection techniques described and introduced in the Kenny patent application can also provide further reference. The thermal energy capture element 1420 has a microchannel thermal energy exchanger 143, which can promote the regionalized thermal energy capture, removal, and rejection of the thermal energy generated by the device 200 (with the thermal energy rejection element 1 4 1 0). . This micro-channel thermal energy exchanger 1 430 has a plurality of micro-channels 1 440 (with fluid in operation) to complete the effective thermal energy capture of the device. This micro-channel thermal energy exchanger 43 0, including micro-channel 1 440, can be used with the micro-channel thermal energy converter 121 0 and micro-channel 122

Page 44 1239438 V. Description of the invention (38) It is produced by the same method and materials.

# 一 ， 2 Μ = ί ^ The forced heat exchanger 1 430 can also respond to the device 20Q capture removal request, so that, for example, it is arranged at the interface of the thermal capture element 142 0. Material 捅, storage 彳 ^ / Λ ^ — The density of 1 round of U Express 1 440 can be increased in the corresponding expected or volume 2: i2 area. In addition, the winding of the micro-channel 1 440 can also be equal to δ and even ′, so as to reduce the temperature of the micro-channel thermal energy exchanger 1 420 d and σ: and reduce f / or minimize it. The width, depth, and shape of the microchannel 144 can be further designed and manufactured to improve the device temperature and performance in the device 2000. Consistently, the shape and layout of the microchannel 1440 can also be assisted by the thermal model tool described in the Lnny… Lishenqing case. In addition, many different types of arrangements, layouts, architectures, and design techniques of Microcom 迢 Heat Exchanger 1 420 and Micro Channel 144〇 are also explained and introduced in the Kenny patent application, which can also provide further reference. Similar to the previous description of the thermal energy management module i 2 00, the micro-channels of the micro-channel thermal energy exchanger 1420 can also be placed on the two interfaces of the thermal energy capture element 1420 at the same time. Exclude, and / or refuse. In addition, it should be noted that the microchannel thermal energy exchanger 43 can also be structured as an array of microchannel pillars. In this regard, a vertical channel array is laterally interconnected to one interface (or two interfaces) of the thermal energy capture element 1420. This architecture can further enhance the capture, removal, and / or rejection of thermal energy generated by the device 2000 and / or power adjustment and thermal energy management module 1000. Qing continued to refer to FIG. 17A. In this embodiment, π is a tube 1230 that is placed between the thermal energy capture and rejection module 1400 and the thermal energy rejection element 1410. This, that is, the cartridge 1 230 may be an electroosmotic cartridge device, as in the Kenny patent application.

Page 45 1239438 V. Description of Invention (39). In addition, many different types of architectures and designs are also acceptable, including those described in the Kenny patent application, and may provide further references. The ‘main 疋’ system 2000 can also utilize multiple cymbals and / or independent fluid cooling circuits to provide independent control of the thermal capture capabilities of the module 1000 at different locations. This feature is also detailed in the Kenny patent application and may provide further reference. Please refer to FIG. 17B. In certain cases, it may be a very advantageous option to place the thermal energy rejection element 141o away from the other elements of the system 2000. This kind of mining structure can promote the use of the system 2000 in a space-constrained environment, and can provide sufficient power adjustment and thermal energy management in a small footprint. When the heat-rejecting element 1410 is disposed away from the ground, the pipe 1260 can provide the device 2000 and the power adjusting element 1 2 10 to heat the fluid path of the fluid to the heat-rejecting element 1410. In this embodiment, the heat-rejecting element i4i〇, which is far away from the setting, can be placed in an area having a sufficient volume (for placing a straight-tailed array, which can have a fan), and will not interfere with the device 200. Other system requirements for nearby weeks and side systems (such as memory or data storage devices). In fact, as mentioned earlier, in certain cases, thermal energy rejection function: not necessary. The power adjustment and thermal energy management module 1000 in Figs. 8 to 17B shows the power adjustment element placed on the surface of the thermal energy management element. In the example, the thermal energy management element 1100 is a second embodiment placed in the power adjustment element ΐ20θθ. Embodiment 2 The thermal energy management element _ can more effectively capture and remove the thermal energy generated by the device 200 because the microchannel and Near the coffee shop. 1239438 V. Description of the invention (40) In addition, the thermal energy capture and removal of the circuit 112 of the power adjustment element 1100 can also be kept relatively unchanged. In this way, the thermal energy management element 200 can capture and remove the thermal energy generated by the device 200 and the power adjustment element 1100 more effectively. Therefore, in this embodiment, we can not add a thermal energy element because of the thermal energy capture and removal functions performed by the thermal energy management element 丨 丨 ⑽ (for example, a thermal tank, not shown in the figure) . It should be noted that, like the embodiment shown in FIG. 8, the micro channel 丨 2 2 0 (shown in FIG. 18) can also be extended to the interface of the power adjustment element 丨 丨 〇 〇. In addition, the micro-channel structure 1 22 0 can also be formed on the thermal management module 12 00 = the first and second matching interfaces at the same time. In this case, the microchannel thermal energy exchanger 1210 can even more effectively capture and remove the thermal month b of the device 2000 and the power adjustment element 1 100, partly because of this microchannel thermal energy exchanger 1 2 1 O Closer physical contact with the device 200 and the power adjustment element 1100. In addition to the thermal considerations, the circuit of the power adjustment element will still be in close proximity to this device to provide all the power adjustment benefits previously described. The power adjustment and thermal management module of Fig. 18 can also use the 8th The power adjustment and thermal energy management module 1000 shown in the figure is produced and implemented in the same way. In addition, the power adjustment and thermal energy management module 1000 in Fig. 18 can also have the power shown in Figs. 8 to 17B. All specifics, additions, attributes, and embodiments of the adjustment and thermal energy management module 丨 〇〇. In this regard, the power adjustment and thermal energy management module 1 of FIG. 8 may have, for example, A controller, measuring or detecting device 200 and / or power adjustment element, 100 parameter sensors for operating conditions (for example, temperature, pressure, and flow), and monitoring I set to 200 and / or The power adjustment element 1 1 100 is a current sensor that consumes current.

Page 47 1239438 V. Explanation of the invention (41) " " " '------ In addition, the power adjustment and thermal energy management module 1000 of Fig. 18 can also be a tube to provide a working fluid. These microchannels (including, for example, electroosmotic cartridges with tiny footprints) are used to help limit environmental forces in space: into this branch group. In addition, the power adjustment and thermal energy management module 1000 of FIG. 18 may also have a plurality of independent micro-channels, thereby allowing the device 200 and / or the power adjustment element 丨 00 to specify the area for independent thermal energy capture and removal. In addition, the power adjustment and thermal management module of Fig. 18 can also be implemented as the packaging structure of Figs. 11, 12A, and 12B, which is basically the same as the example of implementation of Fig. 8 K. In fact, all the features and attributes of the power adjustment and thermal energy management module 1 0 0 0 shown in Figs. 8 to 17B will be equally applied to the power adjustment and thermal energy management module in Fig. 18 as described previously. in. For simplicity, the features and attributes of these embodiments will not be repeated. Spirit & Please continue to refer to Figure 18. The power adjustment and thermal management module 1000 can also use all the same techniques described in Figures 2 to 17B to perform signal winding on the device 2000. In addition, power and location can also use the same technology to wind wires on circuit 112 and device 2000. For example, the embodiment of FIG. 18 may use the winding technology described in FIG. 6, wherein the output power and the place conduit are formed in the substrate using conventional manufacturing techniques and are wound to the corresponding device 2000. Predetermined pad for power and location input. In this case, the output power and location conduit is directly wound to the power and location input of the device 2000. In another embodiment, the micro-channel structure of the power adjustment element and the thermal energy management element is formed in the same substrate instead of the two substrates 10 2a and 10 2 b, as described previously and the first Figures 8 and 18 show. Please consider Figure 19A, microchannel structure 1 2 2 0 and power adjustment element 11 〇 〇 production

Page 48 1239438 V. Description of the invention (42) In the same substrate. In this embodiment — the adjustment element does not need to consume the power, components, and power of the interface, a printed circuit board, and the cost of combining two separate (for example, can be reduced. In addition, because of the earth bottom, and & Therefore, the thermal energy generating circuit of the device dissipating the surface is adjacent to this embodiment, which is placed relative to the embodiment of FIG. 9, and can also capture and remove the thermal energy of the device. The thermal energy capture of the circuit 112 and ": about work: adjustment Element embodiments may not be needed, for example n is enough, and hunting this, this removes, captures, and rejects the ability. "Brother, the additional heat of the heat sink or fan, please continue to refer to Figure 19A, in this 1 200 The micro-channel structure 1 220 can also utilize the production technology of A ° trial heat as described in the Kenny patent application and / or the Kenny patent application and provide further reference. Subsequently, the power ^ technology / plus ^ production 'It can also use the conventional complementary metal oxide circuit 00 circuit 112, the interface, power, and location of the perforations can also be made after the formation of. Welding workers to connect this perforation 11 2 Micro channel 1 220 is produced after the production. In addition, it should be noted that the power adjustment and thermal management module with a plurality of bases (that is, 10 & and 10) is included in the electricity. 1 0 0 0 All the features, attributes, supporting solutions, and embodiments are also fully applicable to the embodiment of FIG. 19A. In this regard, the 'power adjustment and thermal energy management module 1000 of FIG. 19A may have, for example, "Parameter sensors (for example," temperature, pressure, flow) and current sensors. In addition, the power adjustment and thermal energy management module of Figure 19A Figure 100 () Page 49 1239438 V. Description of the invention " · '~~ "' It is also possible to have a tube and a plurality of independent micro-channels to achieve independent thermal energy capture and removal of the designated area of the device 200 and / or the power adjustment element 1100. In addition, FIG. 18A The power adjustment and thermal energy management module 1000 can also be implemented into the packaging structure of Figures 11, 12A, and 12B. In fact, the power adjustment and thermal energy management modules 1 00 shown in Figures 8 to 18, as previously All the features and attributes mentioned above will also The power adjustment and thermal energy management module suitable for Fig. 19A is shown in Fig. 19A. Please continue to refer to Fig. 19A. The power adjustment and thermal energy management module 1000 can use any of the winding technologies described above in the installation 2 Signal winding is performed on 〇. In addition, power and location can also be wound on circuit 112 and device 200 using the same technology (including the technology described earlier in Figure 6). It should be noted that power adjustment Components 丨 丨 〇〇Circuits 2 In those cases where microchannel processing can be performed without causing damage, the circuits 丨 2 can also be fabricated before the fabrication of the Microcom structure. In this way, these interfaces, power, and locations are perforated. It can be fabricated before or after the microchannel structure is formed. Connecting the perforated welding rods (if any) can be made after the other components of the power adjustment and thermal management module 1 00 0 are completed. In the embodiment of FIG. 19A, the micro-channel structure of the power adjustment element 丨 丨 〇 and thermal management = 1200 is fabricated in a substrate. In another example, the entire microchannel structure (or part of this structure) can be fabricated on the back side of the device 200. Please refer to Figs. 19B and 19C. The micro channel structure 1 220 of the microchannel structure can be completely manufactured in the device 2000 (Figure 19B), or partly in the device 200 and the power adjustment element 1100 ( (Figure 19C). In addition, the discussions in Figure 19A can be applied to Figures 19B and 19 in their entirety and equivalently.

Page 50 1239438 V. Description of Invention (44) The power adjustment and thermal energy described in the figure will not be repeated. … The lira group. For the sake of simplicity 'these discussions. Component 1 = sign is to use this module and / or m adjustment element 1100, thermal energy capture and rejection module 22 as described previously: 70 pieces of 1410, and thermal energy capture element 142. ) As a system = has a regional power adjustment function and thermal energy capture:, remove and / or reject, ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,). As a system = a regional power adjustment function and thermal energy capture :, removal and / or rejection, ,,,,,,,,,,,,,,,,, force For example, please refer to FIG. 20. In one embodiment, the device 200 is placed on the printed circuit board 400, and the device 420 is placed on the surface of the device 200, thereby pushing _ ¥ 9λ / ,, Fortunately, the vultures are used to promote the capture of thermal energy in the area generated by the device. This power adjustment and thermal energy management module 1000 is placed on the surface of thermal energy capture element 1 420. In this embodiment, it is a very advantageous option to set the power adjustment element ιιο to the thermal energy capture element 1 420 and the thermal energy management element 1 200, which can enhance the capture of the thermal energy generated by the power adjustment element 1 i 00. In addition, the thermal energy rejection element 1410 (for example, a heat tank with a straight tail fin) can also be placed on the surface of the thermal energy management element 1 2 0 to obtain the thermal energy management element 1200 and the thermal energy capture element 1420 (mainly by The device 200 generates enhanced rejection function that captures thermal energy (mainly generated by the power adjusting element 11000). ^ In the embodiment shown in FIG. 20, the power adjustment element ^ t4 2 0 0 〇 is completed by the winding connection structure described previously (see, for example, FIGS. 4 and 7). Please continue to refer to FIG. 20, this canister (not shown) can be an electroosmotic type 17 namely canister ', which is provided in the thermal energy management module 200 and / or the thermal energy capturing element 1 420. In addition, ‘this tube is not necessarily set to thermal energy ^

1239438 V. Description of the invention (45) '" The management module 1 2 0 0 or the thermal energy capture element 1 420 may be a stand-alone device. As mentioned earlier, this. The instant tube may also have a plurality of tube mechanisms, which include ... a mechanism having the structure described in the patent application. Figure 21 shows another example of the use of modules and / or components as design components. Please refer to FIG. 21. In this embodiment, the power adjustment and thermal energy management module 1000 is placed on the surface of the device 2000, and the thermal energy capturing element 4200 is placed on the power adjustment and thermal energy management module. The surface of the power adjustment element 1100 of the group 丨 0 0 0. For two, the thermal energy rejection element 1410 is placed on the surface of the thermal energy capture element 1420 to strengthen the thermal energy management element 1200 (mainly generated by the device 200) and the thermal moon b capture element 1 4 2 0 (mainly Rejection ability of thermal energy captured by power adjustment element (丨 丨 〇〇). In addition, these power adjustment and thermal energy management functions can also be added (in whole or in part) to other modules or components, or even to the consumption device itself. In this regard, these functions can be combined with a consumer device to promote a more compact and cost-efficient system. Please refer to FIG. 22. In the real palladium example of the present invention, the 'power adjustment and thermal energy management module' 0 0 0 is placed in the device 2 0. The capture element 1 420 can also be placed in the device 2 2. 〇 Surface, thereby strengthening the rejection ability of the thermal energy captured by the thermal energy management element 1 200 (generated by the device 20 () and the power adjustment element 1 100). In addition, the thermal energy rejection element 丨 4 丨 〇 can directly capture and reject the thermal energy generated by the device 2000, due to the proximity of the thermal energy rejection element 丨 4 丨 〇 and the f 2 00. However, in cases where the thermal rejection element 丨 4 丨 provides additional heat capture and rejection capabilities is not necessary, the thermal rejection element 141 〇 can also be omitted.

Page 52 1239438 V. Description of the invention (46) It should be noted that the power adjustment and thermal energy management module i 〇〇〇 can also be placed on the back of the device 2000 or the power adjustment element 1 1 〇 and / or thermal energy The management element 1220 can also be placed on the front side and the back side of the device 200 at the same time. Furthermore, the power adjusting element 1 1 0 0 can also be placed on the front side of the device 2 0, and the thermal energy management element 1 2 0 0 can also be placed on the back side of the device 2 0 0. ^ Please refer to FIG. 23. In another embodiment of the present invention, the system 2000 has a power adjustment module 丨 00 placed in the device 200, and the thermal energy capture and rejection module 1 400 can It is placed on the surface of the device 200 to provide the thermal management of the device and the power generating element 1100. As in the embodiment shown in FIG. 22, the power adjustment module 100 in FIG. 23 can be placed on the back side of the device 200 or on the front side of the device 200. In addition, the power adjustment module 丨 〇〇 can also be placed on the front and back sides of the device 20 () at the same time. It should be noted that in all the embodiments shown in Figures 20 to 23, these two components and modules, as well as a consumer device with power adjustment and / or thermal management functions / components, may also have a second The various features, attributes, alternatives, and benefits of the corresponding components and modules shown in Figures 19 to 19 are as described previously. For simplicity, these features, attributes, and benefits will not be repeated. In addition, in a case where it is not necessary for the thermal energy rejection element 1410 to provide thermal energy capture and rejection capabilities, the thermal energy rejection element 4 1 0 may be omitted. Another feature of the present invention is a system having a plurality of consuming devices, wherein ‘each consuming device has a power adjustment and thermal energy management module t ′ for receiving the power of the main power supply and the action flow of the fluid cartridge mechanism, respectively. Please refer to Fig. 24. In this embodiment, the main power supply 3100 = 疋 is used to support the initial power adjustment of an external power source (not shown). the Lord

1239438 V. Description of the invention (47) ----- ~, the output of the power supply 3100 is used to provide power adjustment and thermal energy management modules 100 (^ to 1 0 0 0. each power adjustment element). From 100 to 100, these power adjustment elements 100a to 100c are used to provide regional power adjustments of the consumption devices 200a to 200c, respectively. These power adjustment elements 11o ( ^ To 11 〇〇C JT is any of the embodiments shown in Figures 8 to 9 and previously described. ^ This main power supply 3100 is the use of power bus 31 10 to provide initial adjustment power to each Power adjustment element 11〇asU〇c. This power bus 31 10 can be wound in parallel to each thermal energy management element 12 00 & 1 20 0 C 〇 This main power supply 3100 can have a separate element (similar to the first (Shown in Figure 1), or it can be a power adjustment module 丨 丨 〇〇 (shown in Figure 2). In addition, the main power supply 3 1 0 0 can also have additional power supply circuits' which are placed in the device separately Adjacent areas from 200a to 200c. These extra power The application circuit can be used to provide additional start-up power adjustments before the power adjustment elements 1110 (^ to 1100 () are provided. Please continue to refer to Figure 24. The fluid cartridge mechanism 3200 can provide the operating fluid to each Power adjustment and thermal energy management modules 1000a to 1000 (: Thermal energy management elements 1200a to 1200c. These thermal energy management elements 1200a to 1200c can capture and remove devices 200a to 200c and / or The thermal energy generated by the power adjustment elements ii00a to 1100c. These thermal energy management elements 12003 to 1200 (;: can be any of the embodiments described in the first seven or the eighth to the nineteenth. Figures. The system 300 in Fig. 24 may also have a zone of thermal energy rejection elements (not shown), which is placed on or near the surfaces of the devices 200a to 200c. In addition, the system 300 may also, or select Has a global thermal rejection element (not shown in the figure)

Page 54 1239438 V. Description of the Invention (48)) is used to reject the thermal energy of one or more thermal energy management elements 1 2 0 0 a to 1 2 0 0 c. In addition, these heat rejection elements can also have all the features of the heat rejection elements and heat rejection modules shown in Figures 2 to 19 and previously described. This fluid pumping mechanism uses a fluid bus 3 2 10 to exchange working fluid and various thermal energy management elements 1 2 0 0 a to 1 2 0 0 c. That is, which cylinder mechanism 3200 uses the fluid bus 3210 to provide cooling fluid to each of the thermal energy management elements 1 20 0a to 1 20 0c; and the fluid bus 3210 is used to provide the thermal month t * management element 1 2 The circuit of the heating fluid from 0 0 a to 1 2 0 0 c is controlled by the fluid η, that is, the barrel mechanism 320 0. This fluid bus 3210 can also be wound in parallel or in series to the respective thermal energy management elements 12 00a to 1 200c. It should be noted that the system 300 of FIG. 24 can be implemented by using the power adjustment module shown in FIGS. 2 to 7 and previously described. In this case, these management operations or functions can be performed by various methods, including the methods described previously and shown in Figs. 2 to 7, 20, and 21. In this way, according to the type of thermal energy management technology used, the fluid cartridge mechanism 3200 and the fluid sink 2 3 2 1 0 are no longer necessary. ^ Various embodiments of the invention have been described above. Those who are familiar with this skill-^ And, without reaching the scope and spirit of the present invention, learn about this invention to make various changes, adjustments and changes, due to the system of features and thermal management features. In this regard, it ’s good to see that ’and therefore, it should fall on the cattle of the present invention: Wai should also be predictable

1239438

Other (including the consumption devices shown in Figures 22 and 23 and previously described) In addition, these power adjustment and thermal management features can also be combined in this core, and components, or devices. It should also be possible to add features using this method = ^: and should fall within the scope of the present invention. In addition, Kenny ’s patent application for the tower ’s micro-channel thermal energy exchanger, micro-channel, sensor, and package machine should be different types of arrangement, layout, architecture, design, and technology. f Further reference. In fact, the full text of the Kenny patent application is a reference to the Maben case.

1239438 on page 56 Brief description of the diagram. Figure 1 shows the power of an integrated circuit and heat capture / rejection (e.g., a microprocessor). Figure 2 is a block diagram according to the present invention. . Section view. Featured, a separate power adjustment module Figure 3 is added to the square application device of an embodiment, Figure 2 power adjustment ^ Figure 5 is based on the power and ground conduction-this kind of separation Block diagram of the top view of the power adjustment module. Figure 7 of the temple sign and the interface of each power adjustment module is added to a Gala lay ^ Ο p,-,. ^…, The block diagram of the moon dagger official module. Figure 8 is a cross-sectional view of a port module according to a feature of the present invention. Force rate correction and thermal energy management Figure 9 is added to a block product body circuit application device of the hybrid thermal energy management module, Figure 8 power adjustment and Figure 10A are according to the present invention-a feature, a micro Top view of aisle architecture. … The figure of this S element is a cross-sectional view of the framework along the line AA tangent shown in Figure 10A. The vulture τ t is forced into the eleventh picture system to be added to a 雔 green r H · square "ace-d0wn) integrated circuit ^ shore ⑽ packaged ^^^ facing the bottom 1 ^ circuit application device A block of an embodiment, page 57, 1239438, a brief description of the diagram > Figure. Figure 12A is added? _ Above (bee-d0Winl line UUal-n-lino packaging, block-oriented diagram.) Integrated circuit application device Figure 1 2B of another embodiment in the figure is a dual-in ~ Hne package cover added to a dual-line application device in Figure 12A i package, facing up (faCe ~ down) integrated electrical example A block diagram of a printed circuit ^^ power adjustment and thermal management module (fixed root of Figure 14; =), a cross-sectional view of an embodiment. A cross-sectional view of this embodiment. This power adjustment and Another 15th figure of the thermal energy management module is added to an H circuit application device of the thermal energy management module, and the second figure of the power adjustment of the 12th figure is a block diagram according to the present invention; η a block diagram. Figure., Another Γ ::: / of the power adjustment and thermal management module is added to a product In the road application device, the maintenance ... Figure 17B is a block diagram and a cross-sectional view of the ^ solid / embodiment added. ^ Μ ^-An embodiment of the integrated circuit application device, slave type, and capture 7L pieces Equipped with a separate 18th figure is a square dragon figure and according to the present invention. The surface view. The cross-sectional view of the management module. A power adjustment and thermal energy tube Figures 19A, 19B and 19C are added to a power adjustment and thermal energy tube. In an integrated circuit application device, this diagram is according to the present invention, "; = block diagram. Closed loop power adjustment and thermal energy management. Page 58 1239438

Figure 21 of an embodiment of the system is based on the present figure; & Another implementation of the system is a closed loop power adjustment and thermal energy management system. Figure 22 is according to the present invention? Illustration. Another implementation of the system is a closed loop power adjustment and thermal energy management system. Figure 23 is based on the second block diagram. > ’, block diagram. Figures 2 and 4 of another embodiment of the last power adjustment system are block diagrams based on a feature of the generator and thermal energy management system, a closed loop power adjustment system, and first (including power and hot rattling). . Component symbol description 2 Straight tail fins 4 Thermal energy dispersing device 6 Device 10, 3000 System 102 '102a, 102b Substrate 106a-106p Interface pads 108a, 110a, 114a Power 11 0 b Ground pad 11 4 b grounding conduit and grounding conduit 11 8 b output ground perforation 122 connection welding pad 1 bypass capacitor 3 voltage rectifier 5 electrical connection 7 printed winding base 1 0 0 power adjustment module 1 04a--1 〇 4h interface perforation 106x, 106y, 106z Predetermined pads 108b Ground perforation 1 1 2 Circuit 116a, 116b, 116c Output power 118a Output power perforation 1 2 0 Conventional winding

Page 59 1239438

I ... Private and road boards 300 '1000' l00a--l00c Thermal energy management module 1100 Power adjustment element 1260 Pipe 1200, 1200a--1200c Thermal energy management element 1280 Controller 1300 Packaging 1 2 1 0 , 1 4 3 0 microchannel heat exchanger 1 220, 1 220 — 1, 1 220 — 2, 1 440 microchannel

1 2 3 0 Cartridge 1 2 4 0 Fluid inlet D 1250 Fluid outlet 1320 Cover 1 2 7 0 '1 2 9 0 Sensor 1 4 1 0 Thermal energy rejection element 1 400 Thermal energy capture and rejection module 1 42 0 Thermal energy capture element 3 1 0 0 Main power supply 3 11 0 Power bus 3 2 0 0 Fluid pump mechanism 3 2 1 0 Fluid bus

Claims (1)

6. The scope of patent application is wide, the circuit of the module 3. For example, the scope of patent application is 1s. The adjustment module further includes: the system described in item 1, wherein the first power plane is placed on the second power rate welding pad of the first power adjustment module with a rate pad. The power punch is electrically connected to the work-part. The tertiary power supply is connected to the second interface and the circuit to 4 · If the item No. 丨 of the patent application is electrically connected to the-power tube, it is in the "first, middle" / Hai power perforation 2 =, and among them, the The power conduit is provided with at least one part of the circuit which is electrically connected to the second and third rate tooth holes and 4 first power adjustment modules. 5 · If the system described in the first patent application system, the adjustment module further includes: A power at least one power pad is placed on the surface of the first power adjustment module; at least one power perforation is used for the second dipole, wherein the power perforation is electrically connected to the upper two interfaces and the first power adjustment die Set at least one of the circuits and the fourth. Scoop; at least one output power conduit is coupled to the first power adjustment module to provide the power adjustment circuit. 6. Electrical system according to item 5 of the scope of patent application, wherein the power output duct is connected to an input power welding pad, which is placed in the first power modulation J ^ mold 1239438 6. Application for patent Range circuit device, the first power adjustment and thermal energy management module has a first interface and a second interface, the first power adjustment and thermal energy management module includes: a semiconductor substrate; a plurality of interface perforations for Providing an electrical connection between the first interface and the second interface; and a circuit placed in the semiconductor substrate to adjust the power to be applied to the first integrated circuit device; A microchannel structure having at least one microchannel placed in the semiconductor substrate for capturing thermal energy, wherein the microchannel structure is structured to allow a fluid to flow through; a second power adjustment and thermal energy management module, which Coupled to the second integrated circuit device, the second power adjustment and thermal energy management module has a first interface and a second interface. The second power adjustment and thermal energy management module includes: a semiconductor substrate; A plurality of interface perforations for providing electrical connection between the first interface and the second interface; and A circuit placed in the semiconductor substrate to adjust the power to be applied to the first integrated circuit device; a microchannel structure having at least one microchannel placed in the semiconductor substrate to capture thermal energy, wherein, The micro-channel structure is structured to allow a fluid to flow through; a fluid cartridge mechanism coupled to the first and second power adjustments and thermal energy Page 64 1239438 VI. Scope of Patent Application The official management module is used to provide the fluid I and the thermal energy management module. 1 5 · The rate adjustment and thermal energy management module described in item 14 of the scope of patent application is more inclusive: # n ^ ^ ^ _ ngn ^ γ is the same as the first power aging and the hot moon. It is placed between the microchannel structure of the fluid which is called the management module. 1 6 · The system described in item 5 of the scope of the patent application, the power adjustment and thermal management module of the μ brother further includes: ^ gf-a current sensor, placed on the semiconductor substrate to be used for different purposes Information about current consumption; and &r;-a batch of at ι 口 口 ,, 『龙 51』, used to receive the electric current to decouple the current sensing two fluid flow rate. Consume this information, and adjust the meat loser 17 accordingly, as described in item 15 of the scope of patent application, ^ ^ rate adjustment and thermal management module further includes: β @ 埶 自 ， 瞢 μ ρ, — ^ I # rV 'r- ua " A-rate adjustment and hot-moon scraper sensor, placed in the first tenth step, is used to provide information indicating a temperature for the purpose of & >-γ control is, coupled to the temperature sensor is 〃 Hu 敫 蛑 basket one ginseng with female counselor 4 camp plane '纟 Zhou Zhengbian brother power ~ Bei Xun, and 3 members corresponding to the temperature ^ k -k, >., In the suspect 4> Claw body> Claw movement. The microchannel structure of the positive and thermal management module T 18 4fn ^ ^, +, j ^ system 'where' 5 Xuan control L as described in Shen Qing patent scope No. 丨 7, m # 士-, / f The adjustment side is the same as the output, and the volume of the information corresponding to the temperature is indicated. 1 QJ * rb rfc}, less system, in which 'this temperature sense 9 · as described in the 17th patent scope of Shenyan' m ^ ΊZ ^ A reference adjustment and thermal energy management core group response state and the controller system In this first work + And the second power adjustment. 1239438 The semiconductor substrate. The first work power adjusts the first work and the system described in item 14 of the scope of patent application, wherein the circuit of the rate adjustment and thermal energy management module is placed in the first thermal energy management module. Second interface. 2 1 · The system as described in item 20 of the scope of patent application, wherein the rate adjustment and thermal energy management module further includes: at least one power conduit placed in the semiconductor substrate; Two interfaces, where the power pad is electrically connected to the power conduit to provide at least one of the circuits electrically connected to the human face and the first power adjustment and thermal energy management module. The system described in item 20 of the patent scope, wherein the first advisement rate adjustment and thermal energy management module further includes: χ at least one output power pad placed on the first interface; and two: output power perforation t, the power output perforation is coupled to the circuit and output power welding of the power adjustment and thermal management module of the brother 23. The system according to item 22 of the scope of patent application, wherein the output power welding pad is An input corresponding to one of the first integrated circuit devices. 24. The system according to item 14 of the scope of patent application, wherein the circuit of the first power adjustment and thermal energy management module is placed on the first interface of the first power adjustment and thermal energy management module. . 25. The system according to item 24 of the scope of patent application, wherein the first power adjustment and thermal energy management module further includes: 1239438 VI. Patent application scope At least one power pad is placed on the second interface of the first and second; and at least one power perforation of the blade rate adjustment and thermal management module, wherein # perforation is used to provide electrical connection to The second ::: is sexually connected to at least a part of the power path. Lifeng Shoulder and Thermal Management Module "The system described in item 25 of this patent claim," ,, ... j Electrically connect a power conduit 'to the semiconductor substrate placed at the rate and the power penetrating group And the thermal energy management is connected between the power unit and at least a part of the first power electrical regulating circuit. The system of the thermal-government unit as described in item 26 of the patent application scope, wherein The :: weekly adjustment and thermal energy management module further includes at least-the output power guide: J the first power adjustment and thermal energy management module of the = 楛 ^ whole power to the first. 帛 ^ 27 items for adjustment The system, wherein, if the output power is connected to an input power pad, placed on the first power adjustment and, the first interface of the S-module, where, the The input power corresponds to the power input of the first integrated circuit device. D 2 9. The system described in item 14 of the scope of the patent application, wherein the first power adjustment and thermal energy management module and the first integrated circuit The circuit device is included in a package with an electrical interface "30. The scope of the system as patented in item 29, wherein the packaging system having an optical interface. 1239438 VI. Scope of Patent Application 3 1. The system described in item 14 of the scope of patent application, wherein the first integrated circuit device has an optical interface. 3 2. —A thermal energy management system for capturing the thermal energy generated by the first and second integrated circuit devices. The system includes a first thermal energy management element coupled to the first integrated circuit device for Capturing the thermal energy generated by the first integrated circuit device, wherein the first thermal energy management element captures the thermal energy generated by the first integrated circuit device by using a fluid having a liquid phase during operation; a second The thermal energy management element is coupled to the second integrated circuit device to capture the thermal energy generated by the second integrated circuit device. The second thermal energy management element utilizes one of the liquid phases during operation. The fluid captures thermal energy generated by the second integrated circuit device; and a fluid cartridge mechanism coupled to the first and second thermal energy management elements for providing the fluid to the first and second thermal energy management elements. 3 3. The system according to item 32 of the scope of patent application, further comprising a fluid bus, wherein the fluid bus is connected to the fluid cartridge mechanism to the first and second thermal energy management elements. 34. The system according to item 33 of the scope of patent application, wherein the first and second thermal energy management elements are connected in parallel to the fluid cartridge mechanism. 3 5. The system according to item 33 of the scope of patent application, wherein the first and second thermal energy management elements are connected in series to the fluid drum mechanism. 36. The system according to item 33 of the scope of patent application, wherein the first thermal energy management element system comprises: a substrate, wherein the substrate system has a microchannel disposed in one of the microchannels. Page 1239438 yarn, one of the body flows through; and the channel used to produce a small part of the microchannel, the fluid VI, the scope of patent applications, and the structure to allow the tube to be connected to the micropass Flow 3 7. The system described in item 36 of the scope of patent application, wherein the tube of the first thermal energy management element is an electroosmotic type tube. The fluid is 38. The system described in item 36, wherein the tube of the organizing element is connected to the fluid tube mechanism 33. The system described in item 38 of the scope of patent application, wherein the tube mechanism has an electroosmotic crack 0 is the tube. 40. The system as described in item 32 of the scope of patent application, further comprising: a first power adjustment element connected to the first integrated circuit device, the first power adjustment element having a first interface and a A second interface, the power adjusting element includes: a semiconductor substrate; a plurality of interface holes are perforated to provide an electrical connection between the first interface and the second interface; a plurality of bonding pads are disposed on the first interface, each The first plurality of know pads are connected to the first interface, and one of the interface holes corresponds to a through-hole; and a circuit is placed in the semiconductor substrate to adjust the power to be applied to the first integrated circuit device. Wherein, the circuit has at least one voltage regulator and at least one capacitor. 4 1 · The system described in item 40 of the scope of patent application, wherein the first power adjustment element and the first integrated circuit device are included in 1239438 VI. Scope of patent application One of the above packages. 4 2. The system according to item 41 of the scope of patent application, wherein the package has an optical interface. 4 3. The system according to item 32 of the scope of patent application, wherein the first integrated electrical device has an optical interface. Chapter 70