TWI235818B - Method for filling in gap between thermal conduction members and structure thereof - Google Patents

Method for filling in gap between thermal conduction members and structure thereof Download PDF

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Publication number
TWI235818B
TWI235818B TW91121282A TW91121282A TWI235818B TW I235818 B TWI235818 B TW I235818B TW 91121282 A TW91121282 A TW 91121282A TW 91121282 A TW91121282 A TW 91121282A TW I235818 B TWI235818 B TW I235818B
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Taiwan
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heat
conducting
patent application
gap
scope
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TW91121282A
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Chinese (zh)
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Huei-Chiun Shiu
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Huei-Chiun Shiu
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Abstract

Disclosed is a method for filling in a gap between thermal conduction members and a structure thereof, and in particular a method for filling in irregular gap between first and second thermal conduction members to reduce thermal resistance and enhance heat transfer efficiency, and can be efficiently carried out and effectively retains the first thermal conduction member, and a structure thereof. The method for filling in a gap between first and second thermal conduction members that are arranged adjacent to each other includes the following steps; (a) pre-cleaning: in which the first and second thermal conduction members are cleaned up; (b) pre-coating: in which the first thermal conduction member and/or the second thermal conduction member are covered with a pre-coating layer; (c) applying downward pressure: in which a downward pressure is applied to the first thermal conduction member to pres the first thermal conduction member tightly against the second thermal conduction member; and (d) heating: in which the first and second thermal conduction members that are tightly pressed against each other are heated to a temperature of liquid phase change for the pre-coating layers.

Description

五、發明說明(1)V. Description of the invention (1)

【發明所屬之技術領域J 本發明係關於一種「i脸私 之方法及其結構」,特別:;熱之間隙予以填滿 赦值m杜門夕π i k 指一種能夠有效的將第一、二 熱傳¥件間之不平整間隙予以填㉟,以具 :m’、加工快速、更能同時兼 二、“ 件等功效之方法及其結構者。 亥弟…、傳v 【先前技術】 按,習知包括多數的第一敖 及一第二熱傳導件(例如圓管上:(询如熱散鰭片) 熱器,其在第一、二埶二:s或板式熱管等)之散 熱傳界面。而其在將各該第一即為傳熱用之 件上時,一般均在該第_或;;ϋt定於第二熱傳導 層導熱膏,待其乾涸後,二件之鄰接處塗覆一 在;二熱傳導件上,且能因為該 面處,而具相當效果的熱傳導作用了之位於所述熱傳界 惟其部有如下述之缺失存在· 一、其在塗覆所述導熱膏時, ::件本身不乾淨,而渗附有其它染質 的不m:所:,易因該鄰接* 有因為不平整所形成的間1二匕3有氣體,甚至仍保 傳效率之缺失。 故而造成熱阻過大及影響熱 三、加工過慢且成本較高。 1235818 五、發明說明(2) 四、各該 之相鄰間隙, 之困擾。 又若該第 須施加潤滑劑 第一、二熱傳 不環保之缺失 片)間係有著 加工過程亦甚 另由於該 根本無法直接 問題。 因此,本 乃潛心研究、 缺失的本發明 【發明内容】 本發明「 結構」之主要 不平整間隙予 率、加工快速 效者。 為達上述 之間隙予以填 其間的間隙填 第—熱傳導件之相鄰間,必 導致無法彼此確實相、4 / 有彼此間 隹只相連在一起而有熱阻較大 J:導件係須予以緊迫配合時,尚必ί =再予以清洗,甚而於須將該 以谇接日守,又必須施加助:密接之各該第-熱傳導件散:: 為不穩定。 擾肖勾度亦不易控制,二=傳導件若為不同材f之物品 故有必須電鍍才可彼此焊接在一起之 且組合 導件予 ;且相 添加焊 第一 焊接 案發明 設計, 者0 人有感於上述習知缺失 終於提供一種 有待克服, 又汁合理且有效排除其 ::熱傳導件間之間隙予以填滿之方立 目的,在於有效的將第一、- 八 以填滿,撕到減小熱阻間之 、且更能同時兼具固定該第$间…、傳效 疋η亥弟一熱傳導件之功 之目的,本發明係提供— 滿之方法,彼此鄰接之第一了將熱傳導件間 滿方法來括以下步驟:—熱傳導件’ (a )預先清潔:預[Technical field to which the invention belongs J. The present invention relates to a "i face private method and its structure", in particular: the gap between heat is filled with a pardon value m Dumenxi π ik refers to a method that can effectively Pass the uneven gap between the pieces to fill in, with the method of m ', fast processing, and can simultaneously have two, "pieces and other effects and methods and structures. Haidi ..., pass v [previous technology] Press, The knowledge includes most of the first heat exchanger and a second heat conduction member (for example, on a round tube: (for example, heat dissipation fins) heat exchanger, which is at the first, second and second: s or plate heat pipe, etc.) When it is used for each of the first heat-transmitting parts, it is generally on the first or second; ϋt is set to the second heat-conducting layer heat-conducting paste, and when it is dry, the adjacent parts of the two are coated. One is on; two is heat-conducting member, and because of the surface, it can have considerable effect of heat conduction. It is located in the heat-transporting world, but its part is absent as follows: 1. When it is coated with the heat-conducting paste , :: The piece itself is not clean, but the other chromatin is infiltrated. * There is gas between the two, two, three, and three due to unevenness, and even the lack of transmission efficiency. Therefore, the thermal resistance is too large and the heat is affected. The processing is too slow and the cost is high. 1235818 V. Description of the invention (2) Fourth, the adjacent gaps should be troubled, and if the first and second lubricants to be applied are not processed, there is a processing process, and there is a direct problem. Therefore, this The present invention is the result of intensive research and lack. [Summary of the Invention] The main unevenness rate of the "structure" of the present invention and the rapid processing effect. In order to achieve the above gaps, fill in the gaps between them—the adjacent spaces of the heat conduction elements will not be able to be in phase with each other, 4 / there is only a connection between each other, and there is a large thermal resistance J: the guide element must be For urgent cooperation, it must be cleaned again, even if it is necessary to connect it to the sun, and it must be assisted: the closely-connected first heat-conducting element is scattered:: is unstable. The degree of disturbance is not easy to control. Two = If the conductive parts are items of different materials, they must be electroplated before they can be welded to each other and combined with the guides; and the phase welding is the first invention design of the welding case. Feeling that the above-mentioned lack of knowledge finally provides a kind to be overcome, and it is reasonable and effective to eliminate it :: The cubic purpose of filling the gap between the heat conduction parts is to effectively fill the first and the eighth to fill and tear The thermal resistance is reduced, and the purpose of fixing the $ th ... can be achieved at the same time. The present invention provides a method of full, the first adjacent to the other The method of filling the heat conducting members includes the following steps:-The heat conducting members are cleaned in advance:

第6頁 1235818 五、發明說明(3) ί將ί::、ί ?傳導件清潔乾淨;(b)預先覆蓋預淹 ^ 及第二熱傳導件預先覆蓋-層二:土 量,以使該第一孰傳導:緊ί:;傳導件施以下屢之力 及,(d)加敎皮於該第二熱傳導件; 熱傳導件加熱:、:U已成緊迫配合狀態之第一、二 化溫度。、、、 σ…/皿度上升至所述預塗層之液相變 結構本= = 熱傳導件間之間隙予以填滿之 至少-熱;二二熱傳導件,且其* 而該預塗層之熔化溫 表面係汉有預塗層, 為使貴審查委二熱傳導件。 內交,n ί 一委員更進一步了解本發明之特徵盥枯浙 【實施;。閱以下有關本發明之詳細說明與所附圖式: 間之間^ =填=所述’本發明係提供一種可將熱傳導件 件1㈠::ΐ 方法及其結構,包括多數第-埶傳導 二、及一第二熱傳導件2 (例如圖匕 熱器,复ir j係數良好之金屬棒或金屬板)之散 形成埶僂L孰: 件1、2間彼此鄰接之部分,即 之第二、执Πΐ面4 ’而本發明所用以對該彼此鄰接 下步驟:- w牛1、2間的間隙填滿方法,係、包括以 潔乾淨:預先清潔:預先將該第一、二熱傳導件1、2清 第7頁 1235818 五、發明說明(4) 一、^先覆蓋預塗層:使該第一或第二熱傳導件1或 2預先覆盍-層預塗層3,而其覆蓋該等預塗層3之方法 可為例如浸潰、塗覆或電鍍等方法均彳,使預塗層3佈滿 整個第一或第二熱傳導件丄或已; : 靶以下壓力量:對各該第一熱傳導件1施以下壓 之力i以使各忒第一熱傳導件1緊迫配合於該第二熱傳 、酋四、加熱:對該彼此已成緊迫配合狀態之第一、二熱 傳士件1、2加熱’並使加熱溫度上升至所述預塗層3之 液相變化溫度。 ,如此一來’請參閱第二圖、第二圖A及第三圖所示, 當加熱溫度上升至所述預塗層3之液相變化溫度時,該預 塗,3乃由固相變化為液相,同時又由於該彼此緊迫配合 之第、一熱傳導件1 、2間所產生之壓力,而迫使該已 溶化成液相之預塗層3產生變形與流動,因此得能排出該 熱傳界面4間之氣體,更進而對該不平整之熱傳界面4處 予以填隙’俾具有減小熱阻而形成優良熱傳界面4之功效 者。 再者’其更可無須使用該第一、二熱傳導件1、2於 =迫配合時所需之潤滑劑,亦可無須使用該第一、二熱傳 導件1、2於焊接時所需之助焊劑,俾達既環保又清潔, 以及加工快速且成本低之功效。甚至更不會有··在相鄰密 接之f該第一熱傳傳件(散熱鰭片)間,會有添加焊料不 易、焊接不均勻及加工過程不穩定之缺失。Page 6 1235818 V. Description of the invention (3) ί will clean :: ί? The conductive member is clean; (b) Pre-covered with pre-flood ^ and the second heat-conductive member with pre-covered-layer 2: soil amount, so that One conduction: tightly: The conductive member exerts the following repeated forces and (d) adds the skin to the second thermally conductive member; the thermally conductive member heats: the first temperature and the second temperature of the tightly matched state. 、,, σ… / the degree of liquidity rises to the liquid phase change structure of the pre-coating layer = = at least-heat to fill the gap between the heat-conducting parts; 22 heat-conducting parts, and its * and the The melting temperature surface is pre-coated to make the heat-conducting member of the Commission. Intro, n Committee members further understand the characteristics of the present invention. Please read the following detailed description about the present invention and the attached drawings: between ^ = fill = said 'The present invention provides a method and structure for heat transfer member 1㈠: ΐΐ , And a second thermally conductive member 2 (such as a graph heater, a metal rod or a metal plate with a good ir j coefficient) forms 埶 偻 L 孰: the parts adjacent to each other between parts 1, 2 are the second, Hold the surface 4 'and the present invention uses the following steps to abut each other:-a method for filling the gap between the cows 1 and 2, including cleaning: pre-cleaning: pre-cleaning the first and second heat-conducting members 1 2. Clearing page 7 1235818 V. Description of the invention (4) I. Covering the pre-coating first: The first or second heat conducting member 1 or 2 is pre-coated with a pre-coating layer 3, and it covers such The method of precoating 3 may be, for example, dipping, coating, or electroplating, so that the precoating 3 is covered with the entire first or second heat conducting member; or A heat conduction member 1 applies a pressing force i to make each first heat conduction member 1 fit tightly to the second heat transmission, heating, and heating. : Heating the first and second heat transfer members 1, 2 which have been in a tightly fitted state with each other, and increasing the heating temperature to the liquidus change temperature of the pre-coating layer 3. In this way, please refer to the second graph, the second graph A, and the third graph. When the heating temperature rises to the liquidus change temperature of the precoat layer 3, the precoat layer 3 is changed by the solid phase. It is a liquid phase, and at the same time, due to the pressure generated between the first and first heat conducting members 1 and 2 which are closely matched with each other, the pre-coat layer 3 that has been dissolved into a liquid phase is forced to deform and flow, so the heat must be discharged. The gas between the interface 4 is further filled with gaps in the uneven heat transfer interface 4 ', which has the effect of reducing the thermal resistance and forming an excellent heat transfer interface 4. Furthermore, it does not need to use the lubricants required when the first and second heat conducting members 1, 2 are forced to cooperate, and it is not necessary to use the first and second heat conducting members 1, 2 to assist in welding. Flux is environmentally friendly and clean, and is fast and cost effective. There is even no such thing as the lack of easy soldering, non-uniform soldering, and unstable processing between adjacent first f heat transfer members (radiating fins).

1235818 五、發明說明(5) 二者,更能同時解決習知 材質問題,所導致無法直接焊接 者。 四者,甚至該等散熱器所有 第一熱傳導件與第一熱傳導件之 之間),均可因為該等預塗層3 化後,可對該等接觸部分予以接 示之兩相鄰第一熱傳導件i間之 形成如第三圖所示之接合與填隙 當然,在實際應用上,所述 覆蓋在該第一及第二熱傳導件丄 至於该預塗層3材料之選擇 可炼化成液態或流體之物質,且 導件1、2為低,例如錫、鉛或 熔點之導熱膏或高分子聚合物者 度係在0 · 〇 〇 2〜〇 · 5 mm之間為最佳, 而藉由本發明方法所制成之 一圖A及第二圖所示,包括彼此 導件1 、2 ;且其中至少一熱傳 相互接合之前的表面係設有預塗 熱傳導件1表面設有預塗層3 , 預塗層3之熔化溫度係低於該第 如上所述之本發明,由於係 事後加熱,而該第一、二熱傳導 一、二熱傳導 而必須電鍍之 有接觸到的部 間,或第一、 之存在,俾在 合與填隙,如 接觸部分 狀態者。 之預塗層 、2。 ,係為一種4 〇 其溶點比該第 低熔點合金, 均可。又該預 〇 結構,請參閱 相鄰接合之第 導件之全部( 層3 (本實施 如第二圖A所 一、二熱傳導 為預先覆蓋以 件1 、2間又 即 亦 件因為不同 麻煩與缺失 分(諸如: 二熱傳導件 將之加熱溶 第二圖A所 可在加熱後 可同時預先 〜3 〇 〇 °c低溫 一、二方傳 又或蠟、低 、塗層3之厚 第二圖、第 一、二熱傳 或局部)在 例係在第一 示),而該 件 1、2。 預塗層且係 具有因為彼1235818 V. Description of the invention (5) The two can better solve the problem of conventional material at the same time, which can't directly weld. Four, even between all the first heat conducting elements and the first heat conducting elements of these radiators), because the pre-coatings can be transformed into two adjacent first The formation and joining of the heat conducting members i are shown in the third figure. Of course, in practical applications, the first and second heat conducting members are covered. As for the selection of the material of the precoat layer 3, it can be refined into a liquid state. Or fluid, and the guides 1 and 2 are low, such as tin, lead, or a thermally conductive paste or polymer with a melting point between 0 · 〇〇2 ~ 〇 · 5 mm is the best, and borrow One of the diagrams A and 2 made by the method of the present invention includes guides 1 and 2 to each other; and at least one of the surfaces before the heat transfer is joined to each other is provided with a pre-coated heat conducting member 1 and the surface is provided with a pre-coating. 3. The melting temperature of the pre-coating layer 3 is lower than that of the present invention as described above. Due to the post-heating, the first and second heat conduction and the first and second heat conduction must be plated between the contacted parts, or I. Existence, in conjunction with gap filling, such as the state of contact . Pre-coating, 2. It is a kind of 40, which has a melting point lower than the first low melting point alloy. For this pre-zero structure, please refer to all of the adjacently joined first guide members (Layer 3 (This implementation is as shown in Figure A. The first and second heat transfers are pre-covered with one or two parts, that is, they are also different because of different troubles.) Missing points (such as: two heat-conducting parts will heat it and dissolve it. The second picture A can be heated at the same time in advance ~ 300 ° c low temperature one, two-way pass, or the thickness of wax, low, coating 3 second picture , First, second heat transfer or partial) In the example is shown in the first), and the pieces 1, 2. The pre-coating and

第9頁 !235818 五、發明說明(6) $緊迫配合所產生之壓力,故能迫皮該已熔化成液相之預 ^層3產生變形與流動並排出該熱傳界面4間之氣體,更 ^進而對該不平整之熱傳界面4處予以填隙,俾具有減小 =阻之功效者。再由於其可無須使用潤滑劑與助焊劑,故 =鄭有既環保又清潔、以及加工快速且成本亦低之功效, =不會有:在相鄰密接之各該第一熱傳傳件(散熱縛 ”間,會有添加焊料不易、烊接不均句及加工過程不穩 ^之缺失。三則因此而能同時解決習知因為第一、二埶 =的不同材質問題,所導致無法直接焊接 ;鍍 第-熱傳導件間及第-與第二;: = 第一與 的部分,在加熱熔化後可對該等接觸 妾觸到 者。 卞俊觸邛7刀予以接合與填隙 綜上所述,本發明所提供之一 隙予以填滿之方法及其結構,確可=將f傳導件間之間 問題與缺失,實屬於一具有高度實严、=習知之諸多 明專利之申請要件,爰依專利法 ^之舍明,符合發 並賜准本案專利,以保障發明者之權益了,放請詳予審查 惟以上所述者,僅係本發明之一 2 一 已舍非因此即局限本發明之專利範圍,‘:2實施例而 明書及圖式内容所為之等效 牛凡運用本發明說 權利範圍内,合予陳明。 =理同包含於本發明之 1235818 圖式簡單說明 【圖式簡單說明】 第一圖 係本發明之流程圖。 第二圖 係本發明加熱前之側視圖。 第二圖A係本發明依據第二圖之局部放大圖。 第三圖 係本發明加熱後之局部放大圖。 本發明之圖號說明: 1 第一熱傳導件Page 9! 235818 V. Description of the invention (6) The pressure generated by the urgent cooperation can force the pre-layer 3, which has been melted into a liquid phase, to deform and flow and exhaust the gas between the heat transfer interface 4, Furthermore, 4 gaps in the uneven heat transfer interface are filled, and those with the effect of reducing = resistance. Since it does not require the use of lubricants and fluxes, = Zheng has the effects of environmental protection and cleanliness, fast processing and low cost, = will not have: each of the first heat transfer parts in close contact with each other ( There are some shortcomings such as the difficulty of adding solder, uneven connection, and unstable processing. Therefore, the three problems can be solved simultaneously because of the different material problems of the first and second =. Welding; plating-between the heat-conducting parts and the-and the second;: = The first and the part, after heating and melting, these contacts can be touched. As mentioned above, the method and structure for filling a gap provided by the present invention can indeed = solve the problems and defects between the f conductive members, which really belongs to the application requirements of many well-known patents with a high degree of strictness and = conventional knowledge. According to the disclosure of the Patent Law, it is in line with the issuance and granting of patents in this case to protect the rights of the inventor. Please review them in detail, but the above are only one of the inventions. Limits the patent scope of the invention, ': 2 examples The equivalent of the contents of the drawings is Niu Fan, who uses the present invention to claim the scope of the invention, which is shared by Chen Ming. = The same is included in the 1235818 of the present invention. Brief illustration of the schematic [Schematic illustration] The first diagram is the process of the present invention. Figure 2. The second figure is a side view of the present invention before heating. The second figure A is a partially enlarged view of the present invention according to the second figure. The third figure is a partially enlarged view of the present invention after heating. 1 first heat conducting element

2 第二熱傳導件 3 預塗層 4 熱傳界面2 Second heat conducting element 3 Pre-coating 4 Thermal interface

第11頁Page 11

Claims (1)

1235818 六、申請專利範圍 1 、一種可將熱傳導件間之間隙予以填滿之方法,彼 此鄰接之第 下步驟: (a ) 乾淨; (b ) 導件預先覆 (c ) 力量,以使 及 (d ) 二熱傳導件 變化溫度。 2、 如 間隙予以填 低溫可熔化 熱傳導件低 3、 如 間隙予以填 低熔點合金 4 、如 間隙予以填 點之導熱膏 5 、如 、二熱傳導件,其間的間隙填滿方法包括以 熱傳導件清潔 預先清潔:預先將該第 、預先覆蓋預塗層:使該第一或/及第二熱傳 蓋一層預塗層; 、施以下壓力量:對該第一熱傳導件施以下壓 該第一熱傳導件緊迫配合於該第二熱傳導件; 、加熱:對 加熱,並使 申請專利範 滿之方法》 成液態或流 〇 申請專利範 滿之方法, 者。 申請專利範 滿之方法, 或高分子聚 申請專利範 該彼此已成緊迫配合狀態之第一、 加熱溫度上升至所述預塗層之液相 圍第1項所述之可將熱傳導件間之 其中預塗層之材料,係為4 0〜3 0 0 °C 體之物質,且其熔點比該第一、二 圍第2項所述之可將熱傳導件間之 其中預塗層之材料,係為錫、鉛或 圍第2項所述之可將熱傳導件間之 其中預塗層之材料,係為蠟、低熔 合物者。 圍第1項所述之可將熱傳導件間之1235818 VI. Scope of patent application 1. A method for filling the gaps between the heat-conducting parts and adjoining each other: (a) clean; (b) the guides are pre-coated with (c) force to make and ( d) the temperature of the two heat conducting elements. 2. If the gaps are filled with low temperature, the heat-conducting parts can be melted. 3. If the gaps are filled with low-melting alloys. 4. If the gaps are filled with heat-conducting pastes. Pre-cleaning: pre-coating the first and pre-coating layers in advance: covering the first or / and second heat transfer layer with a pre-coating layer; Pieces are tightly fitted to the second heat conducting piece; heating: the method of heating and making the patent application method full or liquid; or the patent application method. The method of applying for a patent, or the method of applying a polymer for patent, should be the first state of tight cooperation with each other. The heating temperature can be raised to the temperature between the heat-conducting parts described in item 1 of the pre-coating liquid phase. The pre-coating material is a material with a body temperature of 40 ~ 300 ° C, and its melting point is higher than that of the pre-coating material among the heat-conducting parts described in item 2 of the first and second paragraphs, It is tin, lead, or the material that can be pre-coated among the heat-conducting parts described in item 2, which is wax or low-melt. The heat transfer element described in item 1 第頁 六、申請專利範圍 間隙予以填滿之方法,其中 之間。 〃予員塗層之厚度為U02〜0.5mm 6 、如申睛專利範圍第1 ^ 間隙予以填滿之方法,其中項所述之可將熱傳導件間之 管式熱管。 第二熱傳導件,係為一種圓 7、 如申請專利範圍第丄 間隙予以填滿之方法,苴 、厅述之可將熱傳導件間之 式熱管。 之第二熱傳導件,係為一 8、 如申請專利範圍第工 間隙予以填滿之方法,其中 ^所述之可將熱傳導件間之 傳係數良好之金屬棒。 第二熱傳導件,係為一種熱 9、 如申請專利範圍第丄 間隙予以填滿之方法,其中:所述之可將熱傳導件間之 傳係數良好之金屬板。 第一熱傳導件,係為一種熱 1 0、一種可將熱傳導件 其包括彼此相鄰接合之第一 熱傳導件在相互接合之前,其 及預塗層之溶化溫度係低於該 度介於0.002〜0·5 mm之間。 間之間隙予以填滿之結構, 一熱傳導件,且其中至少一 全部表面係設有預塗層,而 第一、二熱傳導件,且其厚 1 1、如申請專利範圍第1 〇項所述之可將熱傳導件 間之間隙予以填滿之結構,其係進一步在該第一、二熱傳 導件相互接合前的表面均設有所述之預塗層者。 1 2、如申請專利範圍第1 〇項所述之可將熱傳導件 間之間隙予以填滿之結構,其中預塗層之材料,係為40〜 1235818 六、申請專利範圍 3 0 0 °C低溫可熔化成液態或流體之物質,且其熔點比該第 一、二熱傳導件為低。 1 3、如申請專利範圍第1 2項所述之可將熱傳導件 間之間隙予以填滿之結構,其中預塗層之材料,係為錫、 鉛或低熔點合金者。 1 4、如申請專利範圍第1 2項所述之可將熱傳導件 間之間隙予以填滿之結構,其中預塗層之材料,係為蠟、 低炼之導熱嘗或高分子聚合物者。Page VI. Method for filling the gap of patent application, among them. The thickness of the coating for the coating member is U02 ~ 0.5mm 6 and the method of filling the gap as described in the patent application No. 1 ^, which can be a tube-type heat pipe between the heat-conducting parts. The second heat-conducting element is a circle. If the gap in the patent application scope 丄 is filled, the method described in 苴 and the hall can be used as a heat pipe between the heat-conducting elements. The second heat-conducting member is a method for filling the working gap as described in the scope of the patent application, where ^ is a metal rod with a good coefficient of heat transfer between the heat-conducting members. The second heat-conducting member is a method for filling the gap as described in the scope of patent application No. 其中, wherein: the metal plate with good heat transfer coefficient between the heat-conducting members. The first heat conducting member is a kind of heat 10, a kind of heat conducting member which can include the first heat conducting members adjacent to each other. Before the mutual joining, the melting temperature of the first heat conducting member and the pre-coating layer is below 0.002 ~ Between 0.5 mm. A structure filled with a gap between them, a heat conducting member, and at least one of its entire surfaces is provided with a pre-coating layer, and the first and second heat conducting members have a thickness of 11 as described in item 10 of the scope of patent application The structure capable of filling the gap between the heat conducting members is further provided with the pre-coating layer on the surfaces before the first and second heat conducting members are joined to each other. 1 2. The structure that can fill the gap between the heat-conducting parts as described in item 10 of the scope of patent application, in which the pre-coating material is 40 ~ 1235818 6. The scope of patent application is 30 ° C A substance that can be melted into a liquid or fluid, and its melting point is lower than the first and second heat conducting members. 1 3. The structure that can fill the gaps between the heat-conducting parts as described in item 12 of the scope of the patent application, in which the pre-coating material is tin, lead or a low melting point alloy. 14. The structure that can fill the gaps between the heat-conducting parts as described in item 12 of the scope of the patent application. The material of the pre-coating layer is wax, low-temperature thermal conductivity or polymer. 1 5、如申請專利範圍第1 0項所述之可將熱傳導件 間之間隙予以填滿之結構,其中之第二熱傳導件,係為一 種圓管式熱管。 1 6、如申請專利範圍第1 0項所述之可將熱傳導件 間之間隙予以填滿之結構,其中之第二熱傳導件,係為一 種板式熱管。 1 7、如申請專利範圍第1 0項所述之可將熱傳導件 間之間隙予以填滿之結構,其中之第二熱傳導件,係為一 種熱傳係數良好之金屬棒。15. The structure that can fill the gap between the heat-conducting parts as described in item 10 of the scope of the patent application, wherein the second heat-conducting part is a circular tube type heat pipe. 16. The structure that can fill the gaps between the heat-conducting parts as described in item 10 of the scope of patent application, wherein the second heat-conducting part is a plate-type heat pipe. 17. The structure that can fill the gaps between the heat-conducting elements as described in item 10 of the scope of the patent application. The second heat-conducting element is a metal rod with a good heat transfer coefficient. 1 8、如申請專利範圍第1 0項所述之可將熱傳導件 間之間隙予以填滿之結構,其中之第二熱傳導件,係為一 種熱傳係數良好之金屬板。18. The structure that can fill the gap between the heat-conducting parts as described in item 10 of the scope of patent application. The second heat-conducting part is a metal plate with a good heat transfer coefficient. 第14頁Page 14
TW91121282A 2002-09-17 2002-09-17 Method for filling in gap between thermal conduction members and structure thereof TWI235818B (en)

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