CN107101516A - One kind mixing layer stacked heat exchanger - Google Patents
One kind mixing layer stacked heat exchanger Download PDFInfo
- Publication number
- CN107101516A CN107101516A CN201710409362.XA CN201710409362A CN107101516A CN 107101516 A CN107101516 A CN 107101516A CN 201710409362 A CN201710409362 A CN 201710409362A CN 107101516 A CN107101516 A CN 107101516A
- Authority
- CN
- China
- Prior art keywords
- heat
- heat exchange
- floor
- microchannel
- dividing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
- F28D9/0081—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by a single plate-like element ; the conduits for one heat-exchange medium being integrated in one single plate-like element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
- F28F3/10—Arrangements for sealing the margins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/04—Tubular or hollow articles
- B23K2101/14—Heat exchangers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
- F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/06—Fastening; Joining by welding
- F28F2275/061—Fastening; Joining by welding by diffusion bonding
Abstract
The application is related to a kind of mixing layer stacked heat exchanger, it is sequentially overlapped by some microchannel heat radiation sandwich layers and constituted, and heat exchanging interlayer is provided between each adjacent microchannel heat radiation sandwich layer, heat exchanging interlayer includes heat exchange fin, first sealing strip, microchannel heat radiation sandwich layer includes heat exchange floor, second sealing strip, some heat exchange grooves are offered on heat exchange floor, exchange heat floor upper surface, lower surface is welded with dividing plate by spreading combination weldering respectively, the dividing plate of each heat exchange channel opening down with heat exchange floor lower end, or the opening up dividing plate with heat exchange floor upper end forms some heat exchanging medium passages;Some heat exchange fins are evenly equipped with by Welding respectively between the opposed separators of adjacent two microchannel heat radiation sandwich layer, and some fluid passages are constituted by the fin interval that exchanges heat.The application combines soldering and diffusion bond welds respective advantage, produces a kind of stacked heat exchanger, its scope of application is wider.
Description
Technical field
The present invention relates to a kind of heat exchanger, particularly a kind of mixing layer stacked heat exchanger.
Background technology
Heat exchanger is to be delivered to cold fluid for making heat from hot fluid.Stacked heat exchanger is generally by dividing plate, interior
Portion's runner, strip of paper used for sealing, water conservancy diversion runner composition, hot fluid and cold fluid flow in the runner of dividing plate both sides, by runner wall with
Dividing plate carries out heat exchange.Runner, strip of paper used for sealing and adjacent dividing plate constitute an interlayer, and such interlayer is stacked, pass through welding
Method integral just constitute stacked heat exchanger.And the welding method of current heat exchanger is generally carried out using soldering
Connection, and method for welding is to lay solder in every layer surface, melts cored solder using high temperature during soldering, by each interlayer adhesion
Cored solder melts when together, because of welding, if channel size is smaller (≤1mm), easily causes the blocking of runner, and can after soldering
Small overlap can be formed, for a long time using being likely to occur loosening, dropping, fluid cleanliness is influenceed.
The content of the invention
The problem of the object of the invention is exactly to solve in background technology mixes layer stacked heat exchanger there is provided one kind.
To reach above-mentioned purpose, the present invention is adopted the following technical scheme that:One kind mixing layer stacked heat exchanger, including change
Hot core body, the heat exchange core body is sequentially overlapped by some microchannel heat radiation sandwich layers and constituted, and each adjacent microchannel heat radiation sandwich layer it
Between be provided with heat exchanging interlayer, the heat exchanging interlayer include heat exchange fin, the first sealing strip, the microchannel heat radiation sandwich layer include heat exchange
Some heat exchange grooves are offered on floor, the second sealing strip, heat exchange floor, the heat exchange floor upper surface, lower surface pass through respectively
Spread combination weldering and be welded with dividing plate, the dividing plate or opening up and heat exchange rib of each heat exchange channel opening down with heat exchange floor lower end
The dividing plate of plate upper end forms some heat exchanging medium passages, on heat exchange floor both sides parallel with heat exchanging medium passage, heat exchange floor
Under between corresponding dividing plate diffusion bond be welded with the second sealing strip;Between the opposed separators of adjacent two microchannel heat radiation sandwich layer
Some heat exchange fins are evenly equipped with by Welding respectively, and some fluid passages are constituted by the fin interval that exchanges heat, with fluid
Have first close by Welding between the parallel heat exchange fin both sides of passage, the opposed separators of adjacent two microchannel heat radiation sandwich layer
Strip of paper used for sealing.
For a kind of optimization of the present invention, each fluid passage is rectangular channel.
For a kind of optimization of the present invention, each heat exchange fin is the monolithic construction being made up of a fin bending.
The present invention, with soldering and the respective advantage of diffusion bond weldering is combined, produces one kind compared with background technology
Stacked heat exchanger, its scope of application is wider;The effect of wherein fluid course is guiding fluid flow direction, bears fluid
Operating pressure, increases heat transfer area, transmits fluid heat, support;The effect of dividing plate is the mixing of fluid in the different interlayers of barrier
And crossfire, the operating pressure of fluid is born, fluid heat is transmitted;The effect of strip of paper used for sealing is subject to the operating pressure of fluid, prevents interior
Portion's fluid leakage and integrated support effect.
Brief description of the drawings
Fig. 1 is the overall structure diagram for mixing layer stacked heat exchanger.
Fig. 2 is microchannel heat sink and interlayer scheme of installation.
Fig. 3 is A enlarged drawings.
Embodiment
Embodiment 1:Reference picture 1-3.One kind mixing layer stacked heat exchanger, including heat exchange core body 1, the heat exchange core body
1 is sequentially overlapped by some microchannel heat radiation sandwich layers 2 and constitutes, and is provided with heat exchanging interlayer 3 between each adjacent microchannel heat radiation sandwich layer 2,
The heat exchanging interlayer 3 includes heat exchange fin 31, the first sealing strip 32, and the microchannel heat radiation sandwich layer 2 includes heat exchange floor 21, the
Some heat exchange grooves 211 are offered on two sealing strips 22, heat exchange floor 21, heat exchange floor 21 upper surface, lower surface lead to respectively
Cross diffusion combination weldering and be welded with dividing plate 33, the opening down dividing plate 33 or opening court with heat exchange floor 21 lower end of each heat exchange groove 211
The upper dividing plate 33 with heat exchange floor 21 upper end forms some heat exchanging medium passages, the heat exchange floor 21 parallel with heat exchanging medium passage
Both sides, heat exchange floor diffusion bond is welded with the second sealing strip 22 between corresponding dividing plate 33 about 21;Adjacent two microchannel
Some heat exchange fins 31 are evenly equipped with by Welding respectively between the opposed separators 33 of heat radiation sandwich layer 2, and pass through the fin that exchanges heat
31 intervals constitute some fluid passage 31a, heat exchange fin 31 both sides parallel with fluid passage 31a, the radiating of adjacent two microchannel
There is the first sealing strip 32 by Welding between the opposed separators 33 of interlayer 2.Each fluid passage 31a be rectangular channel or other
The passage of form.Each heat exchange fin 31 is the monolithic construction being made up of a fin bending.The upside of heat exchange core body 1 is micro-
The upside end face of channel heat radiator 2, the dividing plate 33 of the downside end face welding of its downside microchannel heat sink 2 are thick dividing plate, the thickness every
Plate is as end plate or is called side plate.
Soldering requires relatively low for temperature and pressure, and required channel size is larger (>=1mm), the layer being made of method for welding
Stacked heat exchanger bearing capacity is poor (≤10MPa), and heat exchange efficiency is relatively low, but fluid flow resistance is smaller, it is adaptable to convection current
Dynamic resistance requires more strict, the less gas of internal process pressure or liquid, is used for gas.
Diffusion bond soldering method is by by the bright and clean of the same race or foreign material of two surfacings, being not added with any weldering
Under conditions of material or coating, in the case where certain temperature and pressure are acted on simultaneously, diffused into one another using the metallic atom for contacting surface
Transfer, in face of weld formation metal ion key, through insulation after a while, makes the microstructure homogenization between face of weld, from
And reach surface to be welded and the process of metallurgical connection is fully achieved.Due to other solders being not present in welding process, be not in
Electrochemical corrosion phenomenon between foreign material, will not also be internally formed impurity in radiating core, influence fluid cleanliness.Diffusion junctions
Close weldering and require higher for temperature and pressure, channel size is up to micron order (≤1mm), and what is be welded with diffusion bond is stacked
Preferably, heat exchange efficiency is higher for heat exchanger bearing capacity, and preferably (>=10MPa), internal free from admixture does not influence inner chamber to bearing capacity
Cleannes, but fluid flow resistance is larger, it is adaptable to, internal process pressure larger gas larger to flow resistance claimed range
Or liquid, it is used for liquid.
The application is related to a kind of mixing layer stacked heat exchanger, and it is by the way that soldering and diffusion bond weldering are combined one
Rise, it is applied widely, can according to the height (0~tens MPa) of operating pressure, the height of heat exchange efficiency, the size of flow resistance,
The requirement of each factor such as the size (0.2mm~more than ten mm) of channel size, in different interlayers from different welding method point
Do not welded, then different welding methods are manufactured to the interlayer completed, welded again by soldering or diffusion bond weldering, finally
Welding forms an entirety, completes the manufacture of stacked heat exchanger, such as larger in channel size, operating pressure is relatively low, changes
The thermal efficiency is relatively low, and the less interlayer of flow resistance uses method for welding;Smaller in channel size, operating pressure is higher, heat exchange effect
Rate is higher, and the larger interlayer of flow resistance uses diffusion bond soldering method.The advantage of the present invention is relative to the single welding of tradition
The stacked heat exchanger of method, the mixing layer stacked heat exchanger scope of application is wider, and designability is strong, and controllability is strong,
The each side demand of client can be met simultaneously.
It is to be understood that:The detailed description although the present embodiment is contrasted to the present invention, these explanations, only
It is to simple declaration of the invention, rather than limitation of the present invention.Any invention wound without departing from true spirit
Make, each fall within protection scope of the present invention.
Claims (3)
1. one kind mixing layer stacked heat exchanger, it is characterised in that including heat exchange core body (1), the heat exchange core body (1) if by
Dry microchannel heat radiation sandwich layer (2), which is sequentially overlapped between composition, and each adjacent microchannel heat radiation sandwich layer (2), is provided with heat exchanging interlayer (3),
The heat exchanging interlayer (3) includes heat exchange fin (31), the first sealing strip (32), and the microchannel heat radiation sandwich layer (2) includes heat exchange
Some heat exchange grooves (211), the heat exchange floor (21) are offered on floor (21), the second sealing strip (22), heat exchange floor (21)
Upper surface, lower surface respectively by spread combination weldering be welded with dividing plate (33), respectively exchange heat groove (211) it is opening down with heat exchange floor
(21) dividing plate (33) of lower end or opening up some heat transferring mediums of dividing plate (33) formation with heat exchange floor (21) upper end lead to
Road, heat exchange floor (21) both sides parallel with heat exchanging medium passage, heat exchange floor (21) expand between corresponding dividing plate (33) up and down
Dissipating bind closes weldering and is welded with the second sealing strip (22);Lead to respectively between the opposed separators (33) of adjacent two microchannel heat radiation sandwich layer (2)
Cross Welding and be evenly equipped with some heat exchange fins (31), and some fluid passages (31a) are constituted by the fin that exchanges heat (31) interval,
Heat exchange fin (31) both sides parallel with fluid passage (31a), the opposed separators (33) of adjacent two microchannel heat radiation sandwich layer (2) it
Between have the first sealing strip (32) by Welding.
2. mixing layer stacked heat exchanger according to claim 1, it is characterised in that:Each fluid passage (31a) is square
Shape passage.
3. mixing layer stacked heat exchanger according to claim 1, it is characterised in that:It is described it is each heat exchange fin (31) be
The monolithic construction being made up of a fin bending.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710409362.XA CN107101516A (en) | 2017-06-02 | 2017-06-02 | One kind mixing layer stacked heat exchanger |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710409362.XA CN107101516A (en) | 2017-06-02 | 2017-06-02 | One kind mixing layer stacked heat exchanger |
Publications (1)
Publication Number | Publication Date |
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CN107101516A true CN107101516A (en) | 2017-08-29 |
Family
ID=59659904
Family Applications (1)
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CN201710409362.XA Pending CN107101516A (en) | 2017-06-02 | 2017-06-02 | One kind mixing layer stacked heat exchanger |
Country Status (1)
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CN (1) | CN107101516A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108145275A (en) * | 2018-01-31 | 2018-06-12 | 无锡博利达换热器有限公司 | The assembling device and method of heat exchange core body |
CN110022664A (en) * | 2019-04-04 | 2019-07-16 | 上海理工大学 | A kind of device carrying out electronic element radiating using bionical alveolar heat exchanger |
CN110579123A (en) * | 2019-09-19 | 2019-12-17 | 中国核动力研究设计院 | High-pressure compact heat exchanger structure with double-side special-shaped runners and assembling method thereof |
US20210131738A1 (en) * | 2019-11-04 | 2021-05-06 | Danfoss A/S | Plate-and-shell heat exchanger and a channel blocking plate for a plate-and-shell heat exchanger |
US20210404750A1 (en) * | 2020-06-26 | 2021-12-30 | Vacuum Process Engineering, Inc. | Integrated hybrid compact fluid heat exchanger |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0607006A1 (en) * | 1993-01-11 | 1994-07-20 | KABUSHIKI KAISHA KOBE SEIKO SHO also known as Kobe Steel Ltd. | Plate fin heat exchanger built-in type multi-stage thermosiphon |
JP2000161742A (en) * | 1998-11-27 | 2000-06-16 | Matsushita Seiko Co Ltd | Heat exchange element and its manufacture |
CN101458044A (en) * | 2008-12-31 | 2009-06-17 | 张伟君 | Highly effective complete aluminum alloy heat exchanger |
CN101672597A (en) * | 2009-09-28 | 2010-03-17 | 爱克奇换热技术(太仓)有限公司 | Core of heat exchanger |
CN101782341A (en) * | 2010-03-11 | 2010-07-21 | 宁波汇富机电制造有限公司 | Aluminum plate-fin type heat exchanger and vacuum braze welding process method thereof |
CN101832723A (en) * | 2010-04-29 | 2010-09-15 | 华南理工大学 | Plate-fin heat exchanger for gas heater |
CN102003899A (en) * | 2010-12-01 | 2011-04-06 | 杭州沈氏换热器有限公司 | Microchannel heat exchanger |
CN103644749A (en) * | 2013-12-19 | 2014-03-19 | 刘小江 | Counter flow type heat exchanger provided with flat tubes |
CN206919722U (en) * | 2017-06-02 | 2018-01-23 | 杭州微控节能科技有限公司 | Mix layer stacked heat exchanger |
-
2017
- 2017-06-02 CN CN201710409362.XA patent/CN107101516A/en active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0607006A1 (en) * | 1993-01-11 | 1994-07-20 | KABUSHIKI KAISHA KOBE SEIKO SHO also known as Kobe Steel Ltd. | Plate fin heat exchanger built-in type multi-stage thermosiphon |
JP2000161742A (en) * | 1998-11-27 | 2000-06-16 | Matsushita Seiko Co Ltd | Heat exchange element and its manufacture |
CN101458044A (en) * | 2008-12-31 | 2009-06-17 | 张伟君 | Highly effective complete aluminum alloy heat exchanger |
CN101672597A (en) * | 2009-09-28 | 2010-03-17 | 爱克奇换热技术(太仓)有限公司 | Core of heat exchanger |
CN101782341A (en) * | 2010-03-11 | 2010-07-21 | 宁波汇富机电制造有限公司 | Aluminum plate-fin type heat exchanger and vacuum braze welding process method thereof |
CN101832723A (en) * | 2010-04-29 | 2010-09-15 | 华南理工大学 | Plate-fin heat exchanger for gas heater |
CN102003899A (en) * | 2010-12-01 | 2011-04-06 | 杭州沈氏换热器有限公司 | Microchannel heat exchanger |
CN103644749A (en) * | 2013-12-19 | 2014-03-19 | 刘小江 | Counter flow type heat exchanger provided with flat tubes |
CN206919722U (en) * | 2017-06-02 | 2018-01-23 | 杭州微控节能科技有限公司 | Mix layer stacked heat exchanger |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108145275A (en) * | 2018-01-31 | 2018-06-12 | 无锡博利达换热器有限公司 | The assembling device and method of heat exchange core body |
CN110022664A (en) * | 2019-04-04 | 2019-07-16 | 上海理工大学 | A kind of device carrying out electronic element radiating using bionical alveolar heat exchanger |
CN110022664B (en) * | 2019-04-04 | 2020-12-01 | 上海理工大学 | Device for radiating electronic element by utilizing bionic alveolar heat exchanger |
CN110579123A (en) * | 2019-09-19 | 2019-12-17 | 中国核动力研究设计院 | High-pressure compact heat exchanger structure with double-side special-shaped runners and assembling method thereof |
US20210131738A1 (en) * | 2019-11-04 | 2021-05-06 | Danfoss A/S | Plate-and-shell heat exchanger and a channel blocking plate for a plate-and-shell heat exchanger |
US20210404750A1 (en) * | 2020-06-26 | 2021-12-30 | Vacuum Process Engineering, Inc. | Integrated hybrid compact fluid heat exchanger |
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