TWI234182B - Flexible carrier and flexible circuit board - Google Patents

Abstract

A flexible carrier is provided. The flexible carrier comprises a flexible substrate, a patterning circuit, and a bridge circuit board. Wherein the patterning circuit is disposed on a surface of the flexible substrate and has a plurality of first bridge contacts and a plurality of second bridge contacts in a bridge area. The bridge circuit board is disposed on the bridge area and is connected between the first bridge contacts and the second bridge contacts. In addition, the flexible substrate, the patterning circuit, and the bridge circuit board can be integrated in a flexible circuit board in order to save manufacturing cost. The flexible carrier and the flexible circuit board can simplify the circuit structure and the manufacturing process to achieve higher productive efficiency.

Description

1234182 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a carrier and a circuit board, and in particular, to a circuit board that has a single-sided circuit structure and can provide a crossover function of the circuit. Flexible carrier and flexible circuit board. [Previous Technology] In the semiconductor industry, the production of integrated circuits (1 C) is mainly divided into three stages: the design of integrated circuits, the manufacture of integrated circuits, and the packaging of integrated circuits. Among them, bare wafers are completed through wafer (Wafer) fabrication, circuit design, photomask fabrication, and wafer dicing. Each bare wafer formed by wafer dicing is passed through the pads on the bare wafer ( After being electrically connected to an external signal, the bare chip is covered with a sealing material. The purpose of packaging is to prevent the bare chip from being affected by moisture, heat, and noise, and to provide a medium for the electrical connection between the bare chip and the external package substrate, so as to complete the package of the integrated circuit. Early packaging technologies mostly used wire bonding, and printed circuit boards (PCBs) were used as the packaging substrates for the wafers. However, their disadvantages were higher production costs and larger volumes. In recent years, with the rise of portable electronic products and flat-panel display products, the demand for semiconductor's south-density IC packaging has led to the development of integrated circuit packaging technology toward miniaturization and high-density development. In the case of a liquid crystal display panel (lcd IΓΓ1), TaPe Automatic Bonding (TAB) technology is still the mainstream in current packaging technology. However, the cost is reduced step by step, the volume of the chip packaging structure is reduced, and the

1234182 Fifth invention description (2) Jidu has recently developed chip-on-glass (Chip ○ Glass, referred to as CD1) and chip-on-film (Chip 〇n Film, referred to as Cop) and other packaging technologies. The technology is a kind of technology of extensible printed circuit board (/ HP Ch, p Bonding) ^^ (...), a flip-chip film sealing: a printed circuit board, and will drive the IC Its electrical = = t Y to achieve a more chip package structure_zhenre 丨 M «Two can have both the connection panel and the active and passive elements d, small: the purpose 'compared with other packaging technologies, flip-chip thin-film encapsulation Xiang === and $, in addition to (Flexible) and fine pitch (Fine pitch) and other excellent techniques are more flexible β 1 ^ In the solemnity, in order to cooperate with increasingly complex and dense Μ & β film The packaging technology is used to carry the flexible bearing circuit of the chip. The double-sided circuit structure is developed to form both sides of the surface. ^ ^ F From the past, the structure. This type of flexible circuit with double-sided circuits "The cross-line problem that may occur in the line of the degree, reset, can solve sIΐ and other lines Crossed and overlapping lines, ** ϊ ί, circuit structure, holes are connected to the back of the flexible substrate, and the substrate is conductive J. Although the above has a double-sided line =. But it needs to go through the steps of ΐ ί The carrier can have bugar laser drilling or mechanical drilling, etc., and 5 plus π ^ patterning system. Here, do n’t have to increase the production cost. Long, can not effectively improve the two production efficiency. ', Making the process [Inventive Content]

1234182 V. Description of the invention (3) Therefore, the object of the present invention is to provide a flexible carrier that can be raised before maintaining a single-sided line structure, effectively solving the problem of cross-line, so as to reduce the production cost and increase Productivity. Another object of the present invention is to provide a flexible circuit board, which can simultaneously provide patterned circuits and bridged circuits, so as to effectively solve the problem of crossover lines before maintaining a single-sided circuit structure. Based on the foregoing objectives, the present invention provides a flexible carrier, which includes, for example, a first flexible substrate, a patterned circuit, and a bridge circuit board. The patterned circuit is disposed on a surface of the first flexible substrate, and has a crossover area, and at least one first crossover point and at least one second crossover point are disposed in the crossover area. In addition, the bridge circuit board is disposed on the jumper area and is electrically connected between the first jumper point and the second jumper point. In a preferred embodiment of the present invention, the aforementioned bridge circuit board includes, for example, a second flexible substrate and a bridge circuit, wherein the bridge circuit is disposed on a surface of the second flexible substrate and is electrically connected to the first bridge. Between the contact point and the second crossover point. The first flexible substrate and the second flexible substrate may be made of the same material, for example. In a preferred embodiment of the present invention, the bridge circuit board can be formed by, for example, a bump, or a material such as a solder paste (Solder Paste), an anisotropic conductive adhesive (ACP), or an anisotropic conductive film (ACF). The conductive layer is electrically connected to the first jumper point and the second jumper point, respectively. In addition, the present invention further provides another flexible carrier, which includes, for example, a flexible substrate, a patterned circuit, and at least one bonding wire. Of which,

10753twf.ptd Page 10 1234182 5. Description of the invention (4) The case circuit is arranged on one surface of the flexible substrate, and has a jumper area, and at least one first jumper point and At least one second crossover point, and the bonding wire is disposed on the crossover area and is electrically connected between the first crossover point and the second crossover point. In a preferred embodiment of the present invention, the material of the aforementioned flexible substrate includes, for example, polyimide (P ο 1 y i m i d e), and the material of the patterned circuit includes, for example, copper. In addition, the present invention provides a removable circuit board, which includes, for example, a flexible substrate, a patterned circuit, and a bridge circuit. The flexible substrate has a patterned circuit region and a bridged circuit region, and the patterned circuit and the bridged circuit. They are respectively arranged in the patterned line area and the bridged line area. In addition, the patterned line has a jumper area, and a plurality of jumper points are arranged in the jumper area, while the bridge line has a plurality of connection points, and the connection points and the jumper points are mirror-symmetrical. Based on the above, the patterned circuit of the flexible carrier of the present invention is planned to have a jumper zone, and the circuits that need to cross each other form jumper points respectively in this jumper zone, and for example, bridge circuit boards Or the bonding wires are electrically connected to each other. In addition, the aforementioned flexible substrate, patterned circuit, and bridge circuit board can be integrated into a flexible circuit board to save manufacturing costs. Therefore, the flexible carrier and the flexible circuit board of the present invention can be lifted before the single-sided circuit structure is maintained, effectively solving the problem of cross-line. In order to make the above and other objects, features, and advantages of the present invention more comprehensible, preferred embodiments are described below in detail with the accompanying drawings, as follows.

10753twf.ptd Page 11 1234182 V. Description of the invention (5) [Embodiment] Please refer to Fig. 1 for a schematic diagram of the present Yanming + ^ flexible carrier. Supportable ^ A kind of substrate which can be used in the preferred embodiment, and a patterned line ^ 2 Formula 0 Example / ^ A flexible example is polyimide, and a flexible substrate. On one of the surfaces of the flexible substrate 110 made of a material, for example, the patterned circuit 120 is arranged on the surface. /, 彳 j If a copper foil is patterned, and then refer to FIG. 1, the problem of the road crossing of the present invention is the ①-bearing state 10 that needs to be bridged to solve the lined circuit 1 The top line of 20 is planned to be rewired by a chamois, and the figure is formed in the crossover area 12 2 respectively, and the lines to be crossover are two crossover points 1 2 6. After that, 5 contacts 1 2 4 and a plurality of first and multiple bonding wires 1 3 0 can be electrically connected to the stem two = wire bonding, and the second jumper 126 is used to complete the line: : Contact 124 and corresponding, in addition to the above, it is directly obtained by welding. It also proposes a variety of other crossover methods.外 Except for the crossover of the line, please refer to Figures 2A and 2B for the present invention. The basin rule * II. The top view of a flexible carrier is shown in Fig. 3. In the second embodiment, 'the first crossover point 2 24 and the first Two Yula and ^ face map. In this embodiment, the board 24 0 is bridged, where the bridge line ^ If2 2 6 is connected to the circuit board 210 and is patterned, and the second board = is arranged on the first-soft base bridge circuit board 240, such as Included-within the _ μ crossover area 222. In addition, one bridge line on the two flexible substrates 242: the flexible substrate 242 and the second substrate 242 disposed on the surface of the second flexible substrate 242), and the bridge circuit L is extended to form a plurality of contacts 2 4 6,

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The contacts 246 on the bridge circuit board 240 are electrically connected to the first cross-connect points 2 2 4 and the second cross-connect points 2 2 6 through bumps 2 30 respectively. Of course, 'within a reasonable range, the contact points 246, the first crossover point 224, and the first crossover point 2 2 6 can be configured in an array or other ways to effectively facilitate the wiring space' and mention the accumulation of the South Line degree. In addition, Figures 3A and 3B show a top view and a cross-sectional view of a flexible carrier that joins a bridge board and a patterned circuit through a conductive layer. The conductive layer 3 3 0 can be formed of a conductive material such as a solder paste, an anisotropic conductive adhesive, an anisotropic conductive film, and the like, and is formed by, for example, printing, coating, or pasting. Among them, since the layer 330 does not need to be subjected to steps such as refiow, it can provide a faster joining method than the above-mentioned frost bonding technology. In addition, because the other related components of this implementation are similar to the flexible bearings shown in the above Figures 2A and 2B, the related structure and configuration relationship please refer to the aforementioned ^ ^ device will not be repeated here. ⑪ 'It is worth mentioning that the bridge board in the flexible carrier of the present invention can be formed together when making a patterned circuit, that is, at that time, the layout board can be performed on the same flexible substrate. At the same time, a bridge circuit and a patterned circuit are formed. In this way, soil efficiency saves process steps and improves production speed. ';may have

Please refer to FIG. 4, which illustrates a schematic diagram of a flexible circuit board according to a preferred embodiment of the present invention. A flexible circuit board 400, such as a package L board 4 02 ', and a flexible substrate 4 02 can be divided into a patterned circuit f ^ and a bridge circuit area 420, wherein the patterned circuit area 41 is configured in pattern

1234182 V. Description of the invention (7) The line 4 1 2 is provided, and the bridge line 4 2 0 is provided with a bridge line 4 2 2. In addition, the patterned line 412 has a jumper area 412a, and a plurality of jumper points 414 are arranged in the jumper area 412a. The connection point 424 of the bridge line 422 is mirror-symmetrical to the jumper point 4 1 4. Following the above, when the circuit is bridged, the bridge circuit area 420 can be separated from the flexible substrate 402 by cutting, etc. to form a circuit board. After that, you can use the above-mentioned various crossover methods to assign ^ ϊίί4 to the crossover area 412a ± of the line 412, and make the line ^ I book the route. And sometimes, borrow ^ ラ Γ〇 yj 1 Λ. The bridge line area 420 is adjacent. In this way, the bridges are connected with each other, and only need to directly fold the prayable luyou, eliminating the need for cutting, and correspondingly connecting the bridge line 4 2 2. On the contrary, the patterned circuit 4 1 2 can be summarized as mentioned above. The structure of the present invention can be raised before, and the single-sided circuit can be maintained by, for example, welding, so that the crossover can be effectively solved. Bridges such as flexible circuit-boards that carry circuit structures such as circuit boards are too familiar. Having a single-sided line = winding can avoid the possibility of heavy traffic. J = the complexity of the flexible circuit diagram of the wooden carrier. degree. The circuit is heavy, so you can reduce the flexibility of the double-sided circuit structure. The flexible carrier loop of the invention and the step of the conductive through hole are compared with the carrier because it reduces the formation of the back surface inside the board. Reduce production too and can integrate all lines in the first line production efficiency. Shorten the process time and further improve the health. Although the present invention has been disclosed as a clever embodiment as above, it is not 10753twf.ptd. Page 14 12314182 5. Description of the invention (8) To limit the invention, anyone familiar with this technique However, without departing from the spirit and scope of the present invention, some modifications and retouching can be made. Therefore, the protection scope of the present invention shall be determined by the scope of the appended patent application.

10753twf.ptd Page 15 1234182 Brief Description of Drawings Figure 1 shows a schematic diagram of a flexible carrier according to a preferred embodiment of the present invention. Figures 2A and 2B respectively show a top view and a cross-sectional view of another flexible carrier according to a preferred embodiment of the present invention. Figures 3A and 3B respectively show a top view and a cross-sectional view of another flexible carrier according to a preferred embodiment of the present invention. FIG. 4 is a schematic diagram of a flexible circuit board according to a preferred embodiment of the present invention. [Illustration of diagrams] 100 Flexible carrier 110 Flexible substrate 120 Patterned circuit 122 Jumper area 124 First jumper point 126 Second jumper point 130 Welding wire 210 First flexible substrate 220 Patterned line 222 Jumper 224 First jumper point 226 Second jumper point 230 Bump 240 Bridge circuit board 242 Second flexible substrate

10753twf.ptd Page 16 1234182 Brief description of drawings 246 Contact 330 Conductive layer 400 Flexible circuit board 402 Flexible substrate 410 Patterned circuit area 412 Patterned line 412a: Jumper area 414 Bridged contact area 422 Bridge line 424 connection contact

10753twf.ptd Page 17

Claims (1)

1234182 6. Scope of patent application 1. A flexible carrier, comprising: a first flexible substrate; a patterned circuit disposed on a surface of the first flexible substrate, the patterned circuit having a jumper region, And at least one first crossover point and at least one second crossover point are arranged in the crossover area; and a bridge circuit board is disposed on the crossover area, and the bridge circuit board is electrically connected to Between the first crossover point and the second crossover point. 2. The flexible carrier according to item 1 of the patent application scope, wherein the bridge circuit board comprises: a second flexible substrate; and a bridge circuit disposed on a surface of the second flexible substrate for The first crossover connection point and the second crossover connection point are electrically connected respectively. 3. The flexible carrier according to item 2 of the scope of patent application, wherein the material of the first flexible substrate and the second flexible substrate are the same. 4. The flexible carrier described in item 1 of the scope of patent application, further comprising a plurality of bumps, the bumps are arranged between the bridge circuit board and the patterned circuit, and the bridge circuit board is The bumps are electrically connected to the first jumper point and the second jumper point respectively. 5. The flexible carrier according to item 1 of the scope of patent application, further comprising a conductive layer, the conductive layer is disposed between the bridge circuit board and the patterned circuit, and the bridge circuit board passes through The conductive layer is electrically connected to the first jumper point and the second jumper point, respectively. 6. The flexible carrier as described in item 1 of the scope of patent application, wherein the conductive layer includes solder paste, anisotropic conductive adhesive, and anisotropic conductive film 10753twf.ptd Page 18 1234182 6. One of the scope of patent application. 7. The flexible carrier according to item 1 of the scope of patent application, wherein the material of the first flexible substrate includes polyimide. 8. The flexible carrier according to item 1 of the scope of patent application, wherein the material of the patterned circuit includes copper. 9. A flexible carrier, comprising: a flexible substrate; a patterned circuit disposed on a surface of the flexible substrate, the patterned circuit having a crossover area, and at least one of the crossover area is disposed in the crossover area. A first crossover point and at least one second crossover point; and at least one bonding wire disposed on the crossover area, and the bonding wire is electrically connected to the first crossover point and the second Between jumper points. 10. The flexible carrier according to item 9 of the scope of patent application, wherein the material of the flexible substrate includes polyimide. 1 1. The flexible carrier according to item 9 of the scope of patent application, wherein the material of the patterned circuit includes copper. 1 2. A flexible circuit board comprising: a flexible substrate having a patterned circuit area and a bridged circuit area, a patterned circuit disposed in the patterned circuit area of the flexible substrate, and the patterned The circuit has a crossover area, and a plurality of crossover points are arranged in the crossover area; and a bridge line is disposed in the bridge line area of the flexible substrate, the bridge line has a plurality of connection points, and These connection contacts and these 10753twf.ptd Page 19 1234182 6. Scope of patent application The bridge junction is mirror-symmetrical IBB Page 20 10753twf.ptd