TWI231895B - Heat dissipating module, computer, and method for mounting a heat dissipating apparatus to a motherboard - Google Patents

Abstract

Disclosed is a heat dissipating module, computer, and method for mounting a heat-dissipating apparatus to a motherboard. The heat-dissipating module consists of a heat dissipating apparatus and a locking apparatus that are designed to dissipate heat generated from an electronic unit in the motherboard of a computer. The heat dissipating apparatus is modularized and inserted into the casing of a computer, and the apparatus consists of a heat dissipating board and a first through hole. When the heat dissipating apparatus is inserted into the casing, the heat dissipating board can be in contact directly with the heat generating surface of the electronic unit and the first through hole is aligned with a second through hole of the motherboard and a third though hole of the casing. The locking apparatus is inserted from the outer casing into the third through hole, and extended to the second and first through hole, so as to fix the heat dissipating apparatus to the motherboard.

Description

! 231895

The technical field is related to a heat dissipation module and an assembly method thereof, especially a method of assembling a heat dissipation device on a motherboard of a computer. V. Description of the invention d) (~) Inventive technology The present invention adopts modularization (II) Inventive technology, which has been equipped as standard in recent years. As the price on the note is gradually increased due to the note-type method, the process of writing is When the problem is handled centrally, it must be performed by a heating device. For a P early, it is not easy to disassemble the device if there is no computer to send it back. It will affect the background of the note-writing: Dianyue® Technology Day Crescent & many computer peripherals have already been completed. The way of organization is installed in the computer system. This type of computer is easy to carry, the overall production is becoming lighter and lighter, and rationalization 'makes notebook computers gradually widely used. Computers are required to be lightweight and compact, so that all necessary equipment is rough-set for easy removal, installation or replacement by users. The cooling devices of the notebook computer are all made in the notebook computer, that is, they are fixed to the motherboard with screws or other fastening devices, and the CPU (CPU) is in close contact. Therefore, when the heat dissipation device occurs, the upper cover and keyboard of the computer must be removed one by one in order to replace, repair and reassemble the components. Such a complicated group of cubes can only learn from the professional technicians of the computer assembly structure. As far as consumers are concerned, even if there is only a small failure of the heat dissipation device, it can be carried out by itself-some simple inspections and replacements, but the entire maintenance center needs to be , Causing inconvenience in maintenance. Moreover, when there is a processor (CPU), an existing assembly method of the heat sink is provided. In addition, since the conventional cooling device of the notebook computer is not a modular combination, so the overall production and assembly speed of the computer needs to be and must be increased.

1231895 V. Description of the invention (2) Improvement. (3) Invention of the heat dissipation device of the present invention is convenient to install the heat dissipation device of the heat dissipation device. The speed of the heat dissipation device processing unit is required. The heat dissipation device in the computer must be assembled briefly, disassembled and assembled to the end. Mingzhi is assembled to replacement Mingzhi is reassembled to, and the choice is explained: The purpose of the computer is to achieve the purpose of the computer. The convenience of the computer is to provide the function of the motherboard. To provide the motherboard with low production is to provide the motherboard. It is to provide a computer motherboard with the required method of dissipating a cooling module, and a method of dissipating a cooling module, which can cost. A method on a cooling module, a method on a cooling module, a heating module, a computer, and a cooling module, a computer, and a product, a computer, and a central In order to achieve the above, the computer, and the user can disperse the heat in a computer according to the modularized device. The inside of the casing is inserted into the surface of the casing and touched on the casing. For one of the first purposes, the present invention provides an electronic component cooling module on a motherboard. The cooling module includes a cooling device, which can be removed from the computer casing. After a heat dissipation plate and a first through hole are placed on the side of the body, the heat dissipation plate can be aligned with the electronic element and the first through hole can be aligned with a through hole on the motherboard; the fastening device can be removed from the housing. Thermal module, which (mainly a CPU and a snap-fit one slot is inserted into the 炱, and one of the second through holes is generated when one of the heat dissipation device heat is generated

Page 5 1231895

5. Description of the invention (3) The third through hole is inserted into the outside, and the third device is fixed on the motherboard through the third device. Through-hole, and the method for assembling the heat-dissipating device to the motherboard of the computer proposed by the heat-dissipating method includes the following steps: align the second and third through-holes of the heat-dissipating device with each other; The through hole passes through the first through hole to fix the heat sink on the computer motherboard. (4) Detailed description of the invention: The heat dissipation module of this and the Ming mainly includes-a heat dissipation device and a buckle device 'bismuth matching diagram for illustration. -And I first, ^ turn off the heat sink device-for further instructions, please refer to the figure for cooperation. Stereoscopic view 120 of the heat sink device 10 in the embodiment of the present invention: The heat sink device 10 includes a heat sink U, a spring 12 and a Λ pipe (He ^ PiPe) 50 and a heat sink fan 14. The heat sink is in close contact with the electronic components that generate heat. The electronic components are mainly for the first time bomb / heat generation. 〇 h ^ processor (CPU). The shrapnel 120 is set ^ Λ ® ^ ^ ^ ^ ^ ^ ^-^ 1 Shepherd's Sheep Fan, buckled with the equipment ^ • drink shape and material, choose the bell A, and the 120 shape of this shrapnel is tightly connected Which = ^ 5 () will ensure that both the heat dissipation plate 12 and the CPU 14 are in the 疋 state, and γ ^ ^ / u is connected to the heat dissipation plate 12 and the heat dissipation fan. The heat dissipation fan 14 and the heat dissipation plate 12 are in thermal communication, and further:

1231895 V. Description of the invention (4) The heat generated during the operation of the electronic components is discharged to the outside of the computer via the cooling fan 14. In the above-mentioned embodiment of the present invention, the shrapnel 1 2 0 is designed to project at the four corners. However, this only For illustration, the elastic sheet can also be designed into other shapes suitable for closely fitting the heat sink to the CPU. In addition, the arrangement of the first through holes 1 2 2 can also be increased or decreased, or its position can be changed according to actual needs, or only a single through hole can be provided, as long as the fixed purpose can be achieved. The principle of setting the second and third through holes and the fastening device 40 described later is the same. In order to further explain the relationship between the combination of the heat dissipation device 10 of the present invention, the motherboard 20 and the casing 30 of the computer 'and the description of the aforementioned fastening device 4 0, please refer to FIG. 3 and FIG. 4 further, in which FIG. Shown is a three-dimensional exploded view of an embodiment of the present invention, in which a heat sink device 10 is assembled to a computer motherboard 20, and FIG. 4 is an embodiment of the present invention. The fastening device 40 is formed by the bottom of the computer casing 30. A perspective view of the third through hole 322 penetrated. Figure 3 only shows the main board and a part of the housing 30 in the computer, the CPU 22 on the main board 20, the heat sink 10 and the fastening device 40. The other structures of computer input devices (such as keyboards) and output devices (such as screens) are not directly related to the technical features of the invention, so the & device of the double body 30 is not shown here. It is mainly used for The main board 20 is accommodated therein; through its side edges, the heat sink 10 is inserted into the housing. In addition, through holes 22 are arranged around the CPU 22 on the motherboard 20, and four second through holes 222 are provided upright. Coffee 22 is electrically connected; on the main board 20, heat is generated when the computer is running, which has a heat output of 1231895 V. Description of the invention (5) Green surface. In addition, corresponding to the arrangement of the first through holes 122 and the second through holes 222, a plurality of third through holes 3 2 2 are also provided on the housing 30. The first, second, and third through holes 122, 222, and 322 have the same shape and include a circular portion 1 222, 2222, 3222, and an extension portion 1224, 2224, and 3224. When the heat sink 10 is inserted into the case 30 from one of the slots 32 on the side of the computer case 30, the heat sink 12 of the heat sink 10 can contact the heat generating surface of the CPU 22 on the motherboard 20 In addition, the first through hole 122 can be aligned with the second through hole 222 on the motherboard 20 and the third through hole 322 on the housing 30. In addition, the heat dissipation module of the present invention further includes four fastening devices 40. The enlarged structure is shown in FIG. Each of the fastening devices 40 includes a larger-diameter portion 41, a smaller-diameter portion 42, and a protruding portion 44 protruding radially from the smaller-diameter portion 42. However, the shapes of the smaller diameter portion 42 and the protruding portion 44 of the fastening device 40 can be exactly the same as the circular portions 1 222 of the first, second, and third through holes 2 2 2 2 2 322, The shapes of 2222, 3222 and extensions 1 224, 2 2 2 4, 3 2 2 4 are matched. In this way, during assembly, the diameter portion 42 and the protruding portion 44 of the buckle device 40 can be inserted into the second through hole 322 from the computer's housing 30/22, and sequentially pass through the second through hole. 222 and the first through hole 122, and the larger diameter portion 41 is left outside the casing 30. At this time, the locking device 40 is rotated by an angle. For example, in this embodiment, it is preferable to rotate 90 degrees in the direction of arrow X in FIG. Plate 20. Preferably, the bottom of the housing 30 of the computer of the present invention shown in FIG. 4 and a movable latch 34 can be moved in the direction of the arrow γγ in FIG.

1231895 V. Description of the invention (6)

A protrusion 346 is provided at the front end of the moving latch 34. In addition, a bolt hole 46 is provided in the sixth diameter portion 41 of the fastening device 40. With this, Cen X A

The Tianqikou device 4 Q is inserted into the through holes 322, 222, and 122 and rotated 90 degrees to fasten the spring 120, and the block 346 can be locked into the latch hole 46, so that the fastening device 40 can be fixed to the aforementioned 90 degree angle. = Gladiator to prevent heat from disguising. And the fastening device 40 are separated from each other. When the user wants to disassemble the heat sink, he only needs to move the activity 34, and then rotate the fastening device 40 reversely by 90 degrees to remove it. The shapes of the above-mentioned through hole and the fastening device are only designed to meet other requirements, so that the fastening device 4 is made. It is also possible to use, for example, a bolt, and the shrapnel Ϊ = buckle is designed to have a through hole corresponding to the female thread. The first through hole 122 is related to the method of assembling a motherboard on the motherboard, the device is assembled to a computer, and the heat dissipation module described in the above 2 and the computer are connected

Then, let af be installed in the case 3 of the computer. In the middle, I⑴k Ai Zheng hot plate 12 is just in contact with the main surface. Among them, the thermal output of the aforementioned heat dissipation element 22 is the motherboard 2 of the computer. The upper part is provided with: first and second through holes 122, 30 for accommodating the main board 20 in its interior 1 and the housing of the computer. The method is at least eight τ κ 丨 Touru ·, the third fork has a third passage The hole 322 is inside the housing 30, so that (_a) the second heat sink 10 is inserted into the computer ^ ^ ^ ^; (b > ^ ^ ^ i22'222'322 outside, insert the third through hole 322, and jm : The shell of the brain 3. 122, and the scattered teeth are fixed on the motherboard 20 through the second and first through holes 222 and the thermal device 10.

1231895 V. Description of the invention (7) It is better to rotate by an angle. The method steps described above are flash locks 3, 4 and the device 40 is fixed. The comprehensive assembly is assembled to the computer and disassembled at the center. Only the above can be used to limit the scope of coverage. In the above method steps, the step ′ further includes a step of buckling the device 40 so as to buckle the heat dissipating device. More preferably, the above-mentioned order further includes the step of using a movable hinge provided on the electric housing 30 to be latched into the latch hole 46 on the fastening device 40 to further engage at an angle. The heat dissipation module, computer, and method on the machine board of the present invention have the effect of making the heat dissipation module easy to install, and can effectively improve the convenience of the production and management unit replacement. The speed and the effect of effectively reducing the cost are only the preferred embodiments of the present invention. When there are unequal changes and modifications, the second is that any application for a monopoly according to the present invention should still belong to the present invention. Patent document No. 10 1231895 Brief description of the drawings Figure 1 is a schematic perspective view of the heat sink in the embodiment of the present invention. Figure 2 is a bottom perspective view of the heat sink in the embodiment of the present invention. The three-dimensional exploded view of the device on the motherboard of the computer. Figure 4 is a three-dimensional schematic view of the fastening device penetrating through the third through hole at the bottom of the computer case in the embodiment of the present invention. Cooling fan 22 electronic components (CPU 32 slot 4 0 fastening device 42 smaller diameter part 4 6 latch hole 120 spring piece 222 second through hole 346 bump 1 224, 2224, 3224 extension 12 heat dissipation plate 2 0 Mother board 30 Housing 34 Movable latch 41 Large diameter part 44 Protruding part 50 Heat pipe 1 2 2 First through hole 322 Third through hole 1 222, 2222, 3222 Round section

Page 11

Claims (1)

1231895 VI. Scope of patent application 1. A heat dissipation module for heat dissipation. The heat dissipation device can be carried out from the heat dissipation device element on its inner part, and the heat dissipation device is inserted into one of the sub-components and the heat generated by the motherboard. Align with each other; and a fastening device that can pass through the second and third plates. An electronic computer on a motherboard of a computer and having a housing for accommodating the motherboard module includes: a slot on a side of the housing is inserted into the housing and has a heat sink and A first through-hole, after the inside of the casing, the heat sink can just contact the electro-generated surface, and the first through-hole can just be a second through-hole and a third through-hole on the casing A hole is inserted into the third through hole from the outside of the housing, and a through hole is provided to fix the heat sink to the main body. 2. If the patent application has a spring sheet, 3. If the patent application has various shapes, Through the rotation, such as the application of the second and third sets, including a radial protrusion of the shape and shape of a large range of matching? The larger straight protrusion of the L package is just right, so that the heat dissipation module of the diameter section item 1, wherein the heat dissipation device and the first through hole are provided on the elastic piece. The heat dissipation module of item 1, wherein the fastening device can be used to fasten the heat dissipation device when inserted into the third, second and first through-hole angles. The heat dissipation module of item 3, wherein the first and first parts include a circular portion and an extended portion, the snap-fitting diameter portion, a smaller diameter portion, and the snap-out portion from the smaller diameter, the snap-fitting The smaller diameter part of the device and the form-fastening device protruding through the circular and extending portions of the through-holes can pass through the through-holes, and the snap-fitting device is left outside the housing, and when the Buckle Page 12 1231895 VI. Scope of patent application When the device is rotated by an angle, the protruding part can buckle the heat sink. 5 · If the heat dissipation module of the patent application scope item 3 or 4 has _movable flash lock, it can be used to movably fix the fastening device at the angle, so that the heat dissipation device and the fastening device will not be disengaged. Fastened state. μ 6 · As for the heat dissipation module in the scope of patent application item 1, wherein the fastening system is a bolt :. 7. The heat dissipation module according to item 1 of the scope of patent application, wherein the heat dissipation device has a heat dissipation fan and can be in thermal communication with the heat dissipation plate. 8. If the heat dissipation module according to item 7 of the patent application scope, wherein the heat dissipation fan is in thermal communication with the heat dissipation plate through a heat pipe, the heat dissipation module according to item 1 of the patent scope is described in which The computer is a portable computer. The heat dissipation module of the first item of the patent scope of W, ^, W, wherein the electronic component is a central processing unit (CPU). 11 · A computer comprising: an input / output device; a main board; 70 electronics, electrically connected to the main board, generating heat when the computer is running, which has a heat generating surface; a casing for The motherboard is housed inside, and has a slot through its side; and the thermal management device can be inserted into the housing from the slot, and the heat dissipation device has a heat dissipation plate. When the heat dissipation device is inserted into the After the inside of the casing, the heat dissipation plate can just match the heat generating surface of the electronic component. 1231895 VI. Contact for the scope of patent application 1 2 · For the computer of scope 11 of the patent application, where: the heat sink is provided with a first through hole; the motherboard is provided with a second through hole; A third through hole is provided; and the computer further comprises a fastening device; thereby, when the heat dissipation device is inserted into the casing, the first, second and third through holes can be aligned with each other so that the The fastening device can be inserted into the third through hole from the outside of the casing, and passed through the first and first through 15.16 holes to fix the heat sink to the motherboard. 1 3 · The computer according to item 11 of the scope of patent application, wherein the heat dissipation device has a heat dissipation fan which can be in thermal communication with the heat dissipation plate. 14. The computer according to item 13 of the scope of patent application, wherein the heat dissipation fan is in thermal communication with the heat dissipation plate through a heat pipe. For example, the computer of claim No. 12 in the patent application scope, wherein the fastening device has a shape that can be fastened to the heat dissipation device after being inserted into the third, second and first through holes' through an angle. For example, if the scope of patent application No. 15 and the third through hole include a circular portion including a larger diameter portion, a protruding portion protruding radially, the shape of the protruding portion can just match the shape of the knife The computer of the larger diameter part of the buckle β-Hai fastening device, wherein the first, second points, and an extension part, the smaller diameter part of the fastening device, and the smaller straight part of the fastening device. The small diameter part and the round part and extension part of the equal through hole can pass through these through holes, but remain outside the housing, and 1231895 VI. Scope of patent application The step of fixing the fastening device at the angle by the latch. 24. The method according to item 21 of the application for a patent, wherein the heat dissipation device has a heat dissipation plate, and when the heat dissipation device is inserted into the casing of the computer, it can communicate with an electronic component on the motherboard. The heat-generating surfaces are in contact. 25. The method of claim 24, wherein the electronic component is a central processing unit (CPU). Page 16