1230572 (1) 玖、發明說明 【發明所屬之技術領域】 本發明關於印刷佈線板及其製造方法。特別地，本發 明關於使用樹脂塗層金屬箔片製造的多層印刷佈線板及其 製造方法。 【先前技術】 _ 近年來，發展出微型化、厚度降低、重量減輕及高度 功能的電子裝置。一印刷佈線板承載各式電子元件，包括 例如筆記型電腦、行動電話及數位相機等電子裝置。在承 載渠等電子元件的印刷佈線板中，已硏發出進行高密度承 載（封裝）的各種技術。 近來，隨著承載技術的快速發展，需要提供一種低成 本的多層印刷佈線板。此係因爲多層印刷佈線板可高密度 地承載諸如大型積體電路（LSI )等半導體晶片，同時適 於局速電路。在前述印刷佈線板中，重要的是具有下列特 色。其一是以微小互連（佈線）點距形成之多層互連（佈 線）圖樣間高度可靠的電氣連接。另外則爲卓越的頻率特 ~ 性。 - 已知一種內建處理的承載技術。依據此處理，光敏樹 脂藉由銅箔蝕刻裝置，包覆於以佈線電路形成之雙面銅織 玻璃結構環氧樹脂基底（底部材料）的表面。進行曝光及 顯影，以形成具有通孔的電介質（絕緣）層。之後，該絕 緣層的表面將進行非電銅敷鍍。順利地完成抗蝕劑塗敷、 -4- (2) 1230572 蝕刻及抗蝕劑移除，藉以形成通孔導體與佈線電路層。重 複地形成光敏樹脂絕緣層、通孔導體與佈線電路層，藉以 獲得微細製造與多層結構。之後，使用鑽頭或刮刨工具形 成通孔，接著使該通孔形成電鍍層，以便與內層佈線電路 層連接。通常，使用滲入環氧樹脂之織造玻璃結構的基底 ，作爲雙面銅織玻璃結構環氧樹脂基底。附帶一提，已知 一種使用熱固樹脂與傳導膏的方法。 力一方面’下列基底已被提δ義作爲印刷佈線板的電介 質基底。該基底使用一種非織造人造纖維樹脂結構，其中 係滲入環氧樹脂。相較於使用織造玻璃結構之玻璃環氧樹 脂基底，非織造人造纖維結構較易以雷射進行鑽孔。較具 體地，在傳統織造玻璃結構中，係使用鑽頭或刮刨工具進 行鑽孔。按使用鑽頭或刮刨工具進行的鑽孔，難以形成微 小通孔；因此，上述鑽孔不適於高密度佈線。相反地，若 使用非織造人造纖維結構，則較易使用雷射機器作業；因 而，可高速地形成微小通孔。因此，已進行將非織造人造 纖維結構應用於多晶片模組的硏究，後者可將許多半導體 裝置承載於由包含非織造人造纖維結構環氧樹脂之結構組 成的電介質基底上（例如，請參閱APPLN. ΚΟΚΑΙ之No. 1 1 - 5 4 93 8日本專利文件第二頁）。 相較於傳統織造玻璃結構環氧樹脂.，在使用傳統非織 造人造纖維結構環氧樹脂的電介質基底中，較易以雷射機 器進行微小通孔的鑽孔處理。然而在處理中，由鑽孔與刮 刨所形成的通孔周圍，產生許多熔化的樹脂（以下稱之爲 -5 - (3) 1230572 樹脂污跡）與糊狀物。結果，產生了下列問題。其一是降 低了電介質基底上的銅箔敷鍍效率。另一個問題是例如多 晶片模組等元件，沾染在承載於基底上時所產生的污跡與 糊狀物；因而使得該元件的承載性下降。 【發明內容】 本發明的提出係爲解決上述問題，其目標爲提供一種 印刷佈線板，可減少經由鑽孔及刮刨所產生的污跡與糊狀 物，該印刷佈線板使用非織造樹脂結構，以便雷射機器進 行微小通孔的鑽孔。本發明的另一目標是提供一種製造該 印刷佈線板的方法。 依據本發明的一項觀點，提供一種印刷佈線板，包括 一內層基底，其具有一由有機非織造樹脂結構組成的 核心構件、一位於該核心構件表面的金屬層、與一佈線電 路；及 一樹脂塗層金屬箔片，其具有一樹脂層及層壓於該樹 脂層上的一金屬箔片，該樹脂層位於該內層基底的表面及 該印刷佈線板的最外層表面之上。 依據本發明的另一項觀點，提供一種製造該印刷佈線 板的方法，包括： 準備一有機非織造樹脂結構的核心構件； 在該核心構件的表面形成一金屬層； 將該金屬層定型，藉以形成第一佈線電路，並因而提 - 6- (4) 1230572 供一內層基底，包括該核心構件及該第一佈線電路； 將一樹脂塗層金屬箔片層壓於該內層基底的最外層表 面上’同時加熱及擠壓該樹脂塗層金屬箔片，該樹脂塗層 金屬泊片具有一樹脂層，與該內層基底的最外層表面相連 ;及 將該樹脂塗層金屬箔片定型，藉以形成第二佈線電路 〇 依據本發明，使用一種電介質（絕緣）基底，其使用 非織造樹脂結構，以便雷射機器進行微小通孔的鑽孔。如 此一來，可減少諸如鑽孔及刮刨等鑽孔處理中所產生的污 跡糊狀物。 [實施方式】 現在將參照附圖，說明依據本發明一實施例之具有一 印刷佈線板的電子裝置。 圖1顯示一電子裝置，即筆記型手提電腦〗〗。電腦i ! 包括電腦主體1 2，及依附於主體1 2之上的顯示器單元1 3。 電腦主體12具有一平面箱型外殼15。外殼15爲鎂或人 造樹脂射入鑄造。外殻1 5的上壁1 5 a具有置掌區1 6、鍵盤 安裝部分1 7及顯示器支撐部分〗8。置掌區丨6位於外殼]5的 前半部份’鍵盤安裝部分則位於置掌區1 6的後面。鍵盤1 9 置於安裝部分1 7處。顯示器支撐部分】8向上位於外殼1 5的 後端邰分。 顯示器單元1 3具有液晶顯示面板（未顯示），並經由 (5) 1230572 外殼1 5之鍵盤1 9後方的絞鏈（未顯示）與外殼1 5連接。顯 示器單元1 3可在關閉位置與開啓位置間旋轉。在關閉位置 ，顯示器單元13合攏以覆蓋置掌區16及鍵盤19。在開啓位 置，顯示器單元13立起，暴露出置掌區16及鍵盤19。 印刷佈線板2 1被置於外殼1 5中。印刷佈線板2 1置於若 干凸起22的每一上表面之上，其整個自外殼15的底壁15b 凸出，並經由螺絲2 3與凸起2 2結合。氣冷扇2 5置於外殼1 5 中，位於印刷佈線板2 1之前。外殼1 5的底壁1 5 b及置掌區 16，各配賦通風口 26及27。由通風口 26及27導入之空氣， 經扇2 5的排氣口 2 5 a向印刷佈線板2 1排出。如此一來，印 刷佈線板2 1便得以冷卻。 印刷佈線板2 1的結構及其製造方法，將參照圖2至9進 行詳細說明。 如圖2中所示，內層基底3包括一核心構件，其係由非 織造人造纖維結構環氧樹脂層壓板〗合成芳香族多氨基樹 脂構成。非織造人造纖維結構環氧樹脂層壓板1的整個表 面包覆銅金屬層2。內層基底3的厚度約50至200 μηι。內層 基底3具有兩層銅金屬層2，係由層壓與電鍍金屬箔片形成 於非織造人造纖維結構環氧樹脂層壓板1的雙面。在此例 中，金屬層2的厚度約12至35 μηι。該非織造人造纖維結構 (纖維）的表面粗if造約1 . 〇至1 . 5 μ m。 如圖3中所描繪的，內層基底3的表面係由佈線電路4 的圖樣而形成。該圖樣係經由一般程序（抗鈾劑塗層、曝 光、顯影及蝕刻）而完成。內層基底3的表面處理如下。 -8- (6) 1230572 如圖4中所描繪的，在形成佈線電路4之後，便在兩內層基 底3間保有半固化片1 0。一樹脂塗層金屬箔片，即樹脂塗 層銅箔片7，被層壓於每一內層基底3的外表面上，同時樹 脂塗層金屬箔片7的樹脂層6與基底3相連。樹脂塗層金屬 箔片7係以下列方式形成。諸如環氧樹脂等熱固樹脂塗敷 於該金屬箔片的一面，例如銅箔片5，以形成半固樹脂層6 〇 之後，兩內層基底3經由加熱及擠壓而被塑造。一 B 級狀態的半固化片作爲半固化片1 〇。該B級狀態係藉由將 非織造人造纖維結構滲入諸如環氧樹脂等熱固樹脂塗敷， 並接著進行加熱及乾燥而形成。半固化片1 0的厚度約3 5至 1 0 0 μ m 0 兩內層基底3經由半固化片1 0之樹脂的熔化與固化層 而層壓。同時，樹脂塗層銅箔片7經由樹脂層6的熔化與固 化層，而層壓於內層基底3的表面上。 之後，外部樹脂塗層銅箔片7係以佈線電路8、隱密通 孔4 1及穿孔4 2而形成。其形成程序如下。如圖5中所示， 樹脂塗層銅箔片7的銅箔片歷經蝕刻，以形成與該通孔直 徑相關的開口部分4 〇。之後，一雷射光束輻照於開口部分 4 〇之上。如此一來，如圖6中所示，使用銅箔片5作爲保角 的遮罩，並以位於銅箔片5之開口部分4 0的隱密通孔4 1形 成樹脂層6。 如圖7中所描繪的，穿孔4 2穿過樹脂塗層銅箔片7，同 時依據使用鑽頭或刮刨工具進行鑽孔，而形成內層基底3 -9- (7) 1230572 。穿孔4 2的內層周邊表面歷經預設的除污處理（移除污跡 )。此處，除污處理係相繼完成鹼性溶液處理、酸性溶液 處理及中和處理。1230572 (1) 发明 Description of the invention [Technical field to which the invention belongs] The present invention relates to a printed wiring board and a method for manufacturing the same. In particular, the present invention relates to a multilayer printed wiring board manufactured using a resin-coated metal foil and a method for manufacturing the same. [Previous technology] _ In recent years, miniaturization, thickness reduction, weight reduction, and highly functional electronic devices have been developed. A printed wiring board carries a variety of electronic components, including electronic devices such as notebook computers, mobile phones, and digital cameras. Various printed wiring boards for carrying electronic components such as canals have been developed for high-density loading (package). Recently, with the rapid development of carrier technology, it is necessary to provide a low-cost multilayer printed wiring board. This is because the multilayer printed wiring board can carry semiconductor chips such as large scale integrated circuits (LSIs) at high density, and is suitable for local-speed circuits. In the aforementioned printed wiring board, it is important to have the following characteristics. The first is a highly reliable electrical connection between multi-layer interconnect (wiring) patterns formed with tiny interconnect (wiring) dot pitches. In addition, it has excellent frequency characteristics. -A bearer technology with built-in processing is known. According to this process, the photosensitive resin is coated on the surface of the double-sided copper woven glass structure epoxy substrate (bottom material) formed by the wiring circuit by a copper foil etching device. Exposure and development are performed to form a dielectric (insulating) layer with through holes. Thereafter, the surface of the insulating layer is subjected to non-electric copper plating. The resist coating, -4- (2) 1230572 etching and resist removal were successfully completed to form a via conductor and a wiring circuit layer. A photosensitive resin insulating layer, a via-hole conductor, and a wiring circuit layer are repeatedly formed to obtain microfabrication and a multilayer structure. After that, a through-hole is formed using a drill or a scraping tool, and then the through-hole is formed into a plating layer so as to be connected to the inner wiring circuit layer. Generally, a substrate of woven glass structure impregnated with epoxy resin is used as the double-sided copper-woven glass structure epoxy substrate. Incidentally, a method using a thermosetting resin and a conductive paste is known. On the one hand, the following substrates have been referred to as dielectric substrates for printed wiring boards. The substrate uses a nonwoven rayon resin structure in which epoxy resin is impregnated. Compared to glass epoxy resin substrates using woven glass structures, nonwoven man-made fiber structures are easier to drill with lasers. More specifically, in conventional woven glass structures, drills or scrapers are used to drill holes. According to the drilling using a drill or a shaving tool, it is difficult to form a small through hole; therefore, the above drilling is not suitable for high-density wiring. On the contrary, if a nonwoven rayon structure is used, it is easier to work with a laser machine; therefore, minute through holes can be formed at a high speed. As a result, research into the application of nonwoven rayon structures to multi-chip modules has been carried out, which can support many semiconductor devices on a dielectric substrate consisting of a structure containing a nonwoven rayon structure epoxy resin (see, for example, see APPLN. ΚΟΚΑΙ No. 1 1-5 4 93 8 Japanese Patent Document 2). Compared with the traditional woven glass structure epoxy resin, in the dielectric substrate using the traditional non-woven rayon structure epoxy resin, it is easier to drill through holes with a laser machine. However, during the processing, many molten resin (hereinafter referred to as -5-(3) 1230572 resin stain) and paste were generated around the through holes formed by drilling and shaving. As a result, the following problems arise. One is to reduce the copper plating efficiency on the dielectric substrate. Another problem is that components such as multi-chip modules are contaminated with stains and pastes when they are carried on a substrate; thus, the load-carrying capacity of the components is reduced. [Summary of the Invention] The present invention is made to solve the above problems, and an object thereof is to provide a printed wiring board which can reduce stains and pastes generated by drilling and scraping. The printed wiring board uses a non-woven resin structure. So that the laser machine can drill small through holes. Another object of the present invention is to provide a method for manufacturing the printed wiring board. According to an aspect of the present invention, there is provided a printed wiring board including an inner layer substrate having a core member composed of an organic nonwoven resin structure, a metal layer on a surface of the core member, and a wiring circuit; and A resin-coated metal foil has a resin layer and a metal foil laminated on the resin layer, and the resin layer is located on the surface of the inner layer base and the outermost surface of the printed wiring board. According to another aspect of the present invention, a method for manufacturing the printed wiring board is provided, including: preparing a core member of an organic non-woven resin structure; forming a metal layer on a surface of the core member; and shaping the metal layer to thereby The first wiring circuit is formed, and thus-6- (4) 1230572 is provided for an inner layer substrate including the core member and the first wiring circuit; a resin-coated metal foil is laminated on the innermost substrate. The resin-coated metal foil is heated and extruded on the surface of the outer layer at the same time. The resin-coated metal foil has a resin layer connected to the outermost surface of the inner-layer substrate; and shaping the resin-coated metal foil. In order to form the second wiring circuit, according to the present invention, a dielectric (insulating) substrate is used, which uses a non-woven resin structure so that the laser machine can drill minute through holes. In this way, smudges produced during drilling processes such as drilling and shaving can be reduced. [Embodiment] An electronic device having a printed wiring board according to an embodiment of the present invention will now be described with reference to the drawings. FIG. 1 shows an electronic device, namely a notebook computer. The computer i! Includes a computer main body 12 and a display unit 13 attached to the main body 12. The computer main body 12 has a flat box-shaped casing 15. The case 15 is injection molded of magnesium or artificial resin. The upper wall 15a of the housing 15 has a palm rest area 16, a keyboard mounting portion 17 and a display support portion. The palm rest area 6 is located in the front half of the casing] 5 and the keyboard installation part is located behind the palm rest area 16. The keyboard 19 is placed at the mounting portion 17. The display support part] 8 is located at the rear end of the case 1 5 upward. The display unit 13 has a liquid crystal display panel (not shown) and is connected to the case 15 via a hinge (not shown) at the rear of the keyboard 19 of the case (5) 1230572 case 15. The display unit 1 3 can be rotated between a closed position and an open position. In the closed position, the display unit 13 is closed to cover the palm area 16 and the keyboard 19. In the open position, the display unit 13 stands up, exposing the palm area 16 and the keyboard 19. The printed wiring board 21 is placed in the case 15. The printed wiring board 21 is placed on each of the upper surfaces of the plurality of protrusions 22, and the whole is protruded from the bottom wall 15b of the case 15, and is combined with the protrusions 22 through the screws 23. The air-cooling fan 25 is placed in the casing 15 before the printed wiring board 21. The bottom wall 15b of the housing 15 and the palm rest area 16 are each provided with vents 26 and 27. The air introduced from the vents 26 and 27 is exhausted to the printed wiring board 21 through the exhaust port 2 5 a of the fan 2 5. As a result, the printed wiring board 21 is cooled. The structure of the printed wiring board 21 and a manufacturing method thereof will be described in detail with reference to Figs. 2 to 9. As shown in FIG. 2, the inner layer substrate 3 includes a core member composed of an aromatic polyamino resin synthesized from a non-woven artificial fiber structure epoxy resin laminate. The entire surface of the nonwoven artificial fiber structure epoxy resin laminate 1 is covered with a copper metal layer 2. The thickness of the inner layer substrate 3 is about 50 to 200 μm. Inner layer The base 3 has two copper metal layers 2 formed on both sides of a non-woven artificial fiber structure epoxy resin laminate 1 by laminating and electroplating metal foil. In this example, the thickness of the metal layer 2 is about 12 to 35 μm. The surface of the nonwoven artificial fiber structure (fiber) is roughly 1.0 to 1.5 μm. As depicted in FIG. 3, the surface of the inner layer substrate 3 is formed by the pattern of the wiring circuit 4. The pattern is completed through general procedures (anti-uranium coating, exposure, development, and etching). The surface treatment of the inner layer substrate 3 is as follows. -8- (6) 1230572 As shown in FIG. 4, after the wiring circuit 4 is formed, a prepreg 10 is held between the two inner layer substrates 3. A resin-coated metal foil, that is, a resin-coated copper foil 7 is laminated on the outer surface of each inner-layer substrate 3, while the resin layer 6 of the resin-coated metal foil 7 is connected to the substrate 3. The resin-coated metal foil 7 is formed in the following manner. A thermosetting resin such as epoxy resin is applied to one side of the metal foil, such as a copper foil 5 to form a semi-solid resin layer 60. Then, the two inner layer substrates 3 are molded by heating and pressing. A prepreg in the B state was used as the prepreg 10. The B-stage state is formed by infiltrating a nonwoven rayon structure with a thermosetting resin such as epoxy resin, followed by heating and drying. The thickness of the prepreg 10 is about 35 to 100 μm 0. The two inner layer substrates 3 are laminated through the resin melting and curing layer of the prepreg 10. At the same time, the resin-coated copper foil 7 is laminated on the surface of the inner layer base 3 via the melting and curing layer of the resin layer 6. Thereafter, the outer resin-coated copper foil 7 is formed by the wiring circuit 8, the concealed through hole 41, and the through hole 42. The formation procedure is as follows. As shown in Fig. 5, the copper foil of the resin-coated copper foil 7 is etched to form an opening portion 40 related to the diameter of the through hole. After that, a laser beam is irradiated on the opening portion 40. In this way, as shown in Fig. 6, the copper foil 5 is used as a conformal mask, and the resin layer 6 is formed with the concealed through-hole 41 located in the opening portion 40 of the copper foil 5. As depicted in FIG. 7, the perforations 42 pass through the resin-coated copper foil 7, and at the same time, the inner layer base 3 -9- (7) 1230572 is formed by drilling with a drill or a scraper tool. The inner peripheral surface of the perforation 42 is subjected to a predetermined decontamination treatment (removal of stains). Here, the decontamination treatment is sequentially completed with an alkaline solution treatment, an acidic solution treatment, and a neutralization treatment.
在完成除污處理後，便使用面板敷鍍程序形成非電銅 敷鍍薄膜，使其具有約0.5 μ m的厚度。之後，形成電鍍銅 鍍敷。如此一來，如圖8中所示，銅箔片5的表面及隱密通 孔41與穿孔42的每一內層周邊表面，均以鍍敷層43形成， 厚度約25μηι或更厚。 如圖9中所描繪的，鍍敷層43及銅箔片5加以定型，使 得以形成佈線電路8。之後，完成各項表面處理，例如焊 料抗蝕劑塗層、鍍金、焊接及修平（整理）。如此一來， 便完成內建多層佈線板。After the decontamination process is completed, a non-electric copper plating film is formed using a panel plating process to have a thickness of about 0.5 μm. After that, electroplated copper plating is formed. In this way, as shown in FIG. 8, the surface of the copper foil 5 and the peripheral surface of each inner layer of the concealed through hole 41 and the through hole 42 are each formed with a plating layer 43 with a thickness of about 25 μm or more. As shown in FIG. 9, the plating layer 43 and the copper foil 5 are shaped so that the wiring circuit 8 can be formed. After that, various surface treatments are completed, such as solder resist coating, gold plating, welding, and smoothing (finishing). In this way, the built-in multilayer wiring board is completed.
在以上述方式所形成的印刷佈線板中，使用非織造人 造纖維樹脂結構作爲內層基底3的核心構件及半固化片1 〇 的材料。該印刷佈線板具有層壓結構，使用樹脂塗層銅箔 片作爲內層基底3的最外層。結果，該印刷佈線板被照料 ，此外，該印刷佈線板的平滑度亦獲提昇。因此，可大量 減少鑽孔及刮刨所產生的糊狀物及污跡。上述糊狀物及污 跡的減少，使得以避免銅鍍敷效率及元件承載性的降低。 依據上述實施例，半固化片1 0置於兩核心構件3之間 。可使用四或六個核心構件製造一層壓板（基底）。 下列將說明依據本發明另一實施例的印刷佈線板。 如圖1 0中所示，內層基底3的核心構件爲例如織造玻 璃結構1 〇〇。織造玻璃結構1 〇〇的雙面係以包含例如銅等金 -10 - (8) 1230572 屬之佈線電路4所形成。在該實施例中，使用具有由佈線 電路4所形成之雙面織造玻璃結構100的內層基底3。半固 化片1 〇置於兩內層基底3之間。非織造人造纖維結構樹脂 層1 形成於每一內層基底3的外層表面上。 作爲樹脂塗層金屬箔片的樹脂塗層銅箔片7，層壓於 樹脂層6該面之非織造人造纖維結構樹脂層1 〇 1的外層表面 上。樹脂層6係由例如環氧樹脂所形成。樹脂塗層銅箔片7 係以佈線電路8組成。印刷佈線板係以隱密通孔4 1、穿孔 42及通孔102組成。通孔102係於佈線電路4之上形成，並 位於樹脂層6及非織造人造纖維結構樹脂層1 0 1等兩層之下 〇 在該印刷佈線板中，半固化片1 〇及非織造人造纖維結 構樹脂層1 0 1包括非織造人造纖維結構樹脂。因而，此係 用於照亮該印刷佈線板。樹脂層6包括不同於半固化片1 〇 的材料，及非織造人造纖維結構樹脂層1 0 1。所以其可大 大減少鑽孔及刮刨中所產生的糊狀物與污跡，以形成穿孔 42。鑽孔及刮刨較佳地於以機器處理該印刷佈線板的外部 周圍中完成。 該印刷佈線板具有由七片層壓板組成的多層結構，並 使用織造玻璃結構1 00作爲內層。因此，該印刷佈線板是 硬的，故可限制其彈性。樹脂層6及非織造人造纖維結構 樹脂層1 0 1包括樹脂；因此，可易於形成隱密通孔4 1、穿 孔42及通孔102。通孔102較佳地在雷射機器處理的一次輻 射中形成。 -11 - (9) 1230572 在另一實施例中，其他結構與上述實施例中相同。使 用相同的編號配賦予相同的元件’並省略內容細節。 本發明並不侷限於上述實施例’在本發明的範圍內可 進行不同的修改。例如，如圖1 1中所示，該印刷佈線板可 由兩樹脂塗層銅箔片7 ’及置於渠等箔片間的非織造人造 纖維結構樹脂層1 01加以組成。非織造人造纖維結構樹脂 層1 〇 1的厚度爲3 5 μπι。該印刷佈線板的厚度爲1 0 0 μηι。如 . 此一來，由於該印刷佈線板具有彈性，所以可將焊料抗蝕 n 劑附加於樹脂塗層銅箔片7的外側。 在渠等實施例中，使用人造纖維作爲非織造結構；如 此一來，可使用例如聚酯、多硫亞氨及多丙烯酸等有機纖 維的非織造結構。在渠等實施例中，使用環氧樹脂作爲樹 脂；如此一來，可使用例如多硫亞氨塗層等熱固樹脂塗層 。樹脂塗層銅箔片7可層壓於該印刷佈線板的至少一最外 層之上。 【圖式簡單說明】 圖1爲一截面圖，顯示依據本發明一實施例之包括一 - 印刷佈線板的手提（行動）電子裝置； _ 圖2爲一截面圖，說明圖1所顯示之印刷佈線板的製造 程序； 圖3爲一截面圖，說明依據圖2之印刷佈線板的製造程 序； 圖4爲一截面圖，說明依據圖3之印刷佈線板的製造程 • 12 - (10) 1230572 序； 圖5爲一截面圖，說明依據圖4之印刷佈線板的製造程 序； 圖6爲一截面圖，說明依據圖5之印刷佈線板的製造程 序； 圖7爲一截面圖，說明依據圖6之印刷佈線板的製造程 序； - 圖8爲一截面圖，說明依據圖7之印刷佈線板的製造程 0 序； 圖9爲一截面圖，說明依據圖8之印刷佈線板的製造程 序； 圖1 0爲一截面圖，顯示依據本發明另一實施例的印刷 佈線板；及 圖11爲一截面圖，顯示不同於圖1及圖10中所示之印 刷佈線板的印刷佈線板。 [圖號說明] 1 非織造人造纖維結構環氧樹脂層壓板 2 銅金屬層 - 3 內層基底 4、8 佈線電路 5 銅箔片 6 樹脂層 7 樹脂塗層銅范片 -13- (11) 1230572 10 半 1 ] 手 1 2 電 13 顯 15 外 15a 上 15b 底 16 置 17 鍵 18 顯 19 鍵 2 1 印 22 凸 23 螺 25 氣 25a 排 26、2Ί 通 40 開 4 1 隱 42 穿 43 鍍 1 00 m 1 0 1 非 1 02 通 固化片 提電腦 腦主體 —^ 口 a gjg —* 不益早兀 殼 壁 壁 掌區 盤安裝部分 示器支撐部 盤 刷佈線板 起 絲 冷扇 氣口 風口 口部分 密通孔 孔 敷層 造玻璃結構 織造人造纖 孔 維結構樹脂層In the printed wiring board formed as described above, a nonwoven artificial fiber resin structure is used as the core member of the inner layer base 3 and the material of the prepreg 10. This printed wiring board has a laminated structure, and a resin-coated copper foil is used as the outermost layer of the inner layer base 3. As a result, the printed wiring board is taken care of, and in addition, the smoothness of the printed wiring board is improved. As a result, the paste and stains produced by drilling and shaving can be greatly reduced. The reduction of the above-mentioned pastes and stains makes it possible to avoid reductions in copper plating efficiency and component carrying capacity. According to the above embodiment, the prepreg 10 is placed between the two core members 3. A laminate (base) can be made using four or six core members. Hereinafter, a printed wiring board according to another embodiment of the present invention will be described. As shown in Fig. 10, the core member of the inner layer substrate 3 is, for example, a woven glass structure 100. The double-sided surface of the woven glass structure 100 is formed by a wiring circuit 4 containing a metal such as copper -10-(8) 1230572. In this embodiment, an inner layer substrate 3 having a double-sided woven glass structure 100 formed by a wiring circuit 4 is used. The semi-cured sheet 10 is placed between two inner layer substrates 3. A non-woven artificial fiber structure resin layer 1 is formed on the outer layer surface of each inner layer substrate 3. A resin-coated copper foil 7 as a resin-coated metal foil is laminated on the outer layer surface of the non-woven artificial fiber structure resin layer 101 on the surface of the resin layer 6. The resin layer 6 is formed of, for example, an epoxy resin. The resin-coated copper foil 7 is composed of a wiring circuit 8. The printed wiring board is composed of a hidden through hole 41, a through hole 42 and a through hole 102. The through hole 102 is formed on the wiring circuit 4 and is located under the resin layer 6 and the non-woven artificial fiber structure resin layer 101 and the like. In the printed wiring board, the prepreg 1 and the non-woven artificial fiber structure are formed. The resin layer 1 0 1 includes a nonwoven rayon structure resin. Therefore, this system is used to illuminate the printed wiring board. The resin layer 6 includes a material different from the prepreg 10 and a non-woven artificial fiber structure resin layer 101. Therefore, it can greatly reduce the paste and stain generated in drilling and shaving to form the perforations 42. The drilling and scraping are preferably performed in a machine-processed outer periphery of the printed wiring board. This printed wiring board has a multilayer structure composed of seven sheets of laminates, and uses a woven glass structure 100 as an inner layer. Therefore, the printed wiring board is hard, so its elasticity can be limited. The resin layer 6 and the non-woven artificial fiber structure The resin layer 101 includes resin; therefore, it is easy to form the through-hole 41, the through-hole 42 and the through-hole 102. The through-hole 102 is preferably formed in one shot processed by a laser machine. -11-(9) 1230572 In another embodiment, other structures are the same as those in the above embodiment. The same numbers are assigned to the same components' and the details are omitted. The present invention is not limited to the above embodiment ', and various modifications can be made within the scope of the present invention. For example, as shown in Fig. 11, the printed wiring board may be composed of two resin-coated copper foil sheets 7 'and a nonwoven artificial fiber structure resin layer 101 interposed between foils such as channels. The thickness of the nonwoven artificial fiber structure resin layer 101 was 35 μm. The thickness of the printed wiring board was 100 μm. As a result, since the printed wiring board has elasticity, a solder resist n can be added to the outside of the resin-coated copper foil 7. In embodiments such as canals, artificial fibers are used as the non-woven structure; as such, non-woven structures of organic fibers such as polyester, polythioimide, and polyacrylic acid can be used. In embodiments such as epoxy resins, epoxy resins are used; in this way, thermosetting resin coatings such as polythioimide coatings can be used. The resin-coated copper foil 7 may be laminated on at least an outermost layer of the printed wiring board. [Brief description of the drawings] FIG. 1 is a cross-sectional view showing a portable (mobile) electronic device including a printed wiring board according to an embodiment of the present invention; _ FIG. 2 is a cross-sectional view illustrating the printing shown in FIG. 1 Manufacturing process of wiring board; Figure 3 is a cross-sectional view illustrating the manufacturing process of the printed wiring board according to Figure 2; Figure 4 is a cross-sectional view illustrating the manufacturing process of the printed wiring board according to Figure 3 • 12-(10) 1230572 FIG. 5 is a cross-sectional view illustrating the manufacturing process of the printed wiring board according to FIG. 4; FIG. 6 is a cross-sectional view illustrating the manufacturing process of the printed wiring board according to FIG. 5; FIG. 7 is a cross-sectional view illustrating the basis of the diagram 6 of the manufacturing process of the printed wiring board;-FIG. 8 is a sectional view illustrating the manufacturing process of the printed wiring board according to FIG. 7; FIG. 9 is a sectional view illustrating the manufacturing process of the printed wiring board according to FIG. 8; FIG. 10 is a cross-sectional view showing a printed wiring board according to another embodiment of the present invention; and FIG. 11 is a cross-sectional view showing a printed wiring board different from the printed wiring board shown in FIGS. 1 and 10. [Illustration of number] 1 Non-woven man-made fiber structure epoxy resin laminate 2 Copper metal layer-3 Inner layer base 4, 8 Wiring circuit 5 Copper foil 6 Resin layer 7 Resin coated copper fan sheet 13- (11) 1230572 10 half 1] hand 1 2 electric 13 display 15 outer 15a upper 15b bottom 16 set 17 key 18 display 19 key 2 1 print 22 convex 23 screw 25 gas 25a row 26, 2Ί pass 40 open 4 1 hidden 42 wear 43 plated 1 00 m 1 0 1 non-1 02 through solidified tablet to lift the brain of the computer — 口 口 a gjg — * It is not too early, the wall of the shell wall palm area disk installation part indicator support part disk brush wiring board wire cooling fan air vent air vent part Closed-hole hole cladding layer made of glass structure woven artificial fiber hole-dimensional structure resin layer
-14 --14-