1227525 A71227525 A7
【本發明之背景】 光通訊中大量使用光纖作為通訊傳輸信號之介質，且 配合鬲通道數（High channel counts)平面波導元件 (Planner Waveguide Circuit-PLC)及高密度波長多工 (Dense wavelength DeMux/Multiplexer DwD⑷技 術發展，可利用光訊號之高速及大容量來傳送資料，以滿 足網際網路高速度及寬頻之需求。通常於高通道數之平两 波導元件使用陣列光纖元件（Fiber array)方式連接相關 光電元件。而陣列光纖通常為一具有陣列光纖溝槽基座可 容置光纖束’並藉由具有熔接金屬層之V型溝槽，使用銲 接（soldering)方式固定光纖束之方向，以確保光纖束 對準之精度〇 I· 以往使用之陣列光纖元件（F iber array)多為將光纖 I 束之裸路光纖固定於一具有預先刻製溝槽之基座上，再填 | 充入接著劑，蓋上上蓋之後以壓力及光照或加熱方式使光 I 纖黏著於該基座及上蓋中，形成陣列光纖元件（Fiber f array)。然而，由於接著劑對於抗環境老化之壽命有限， 皇| 相較於金屬焊料溶接方式遜色，故如何於陣列光纖基座表 | 面形成可熔接金屬，以俾利使用焊料熔接方式製作陣列光 ίI 纖模組’係為一關鍵技術及急須突破之難題。 叫 —4 本纸張尺度適用中_家標準（CNS)A4^^_1Q x 297公爱）------- --------訂------.—線— (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印則π[Background of the invention] In optical communications, a large number of optical fibers are used as a medium for communication transmission signals, and are matched with high channel counts (Planner Waveguide Circuit-PLC) and high-density wavelength multiplexing (Dense wavelength DeMux / The development of Multiplexer DwD⑷ technology can use the high speed and large capacity of optical signals to transmit data to meet the needs of high speed and broadband of the Internet. Usually, two waveguide elements with high channel counts are connected using the fiber array method. Relevant optoelectronic components. And the array fiber is usually an array fiber groove base which can hold the fiber bundle ', and a V-shaped groove with a welded metal layer is used to fix the direction of the fiber bundle by soldering to ensure Alignment accuracy of optical fiber bundles. I. The fiber array used in the past is mostly to fix the bare fiber of optical fiber I bundle on a base with a pre-cut groove, and then fill it. | Agent, after the cover is closed, the optical I fiber is adhered to the base and the cover by pressure and light or heating to form an array fiber element Fiber (fiber array). However, due to the limited life of the adhesive against environmental aging, Huang | Inferior to the soldering method of the metal, so how to form a weldable metal on the surface of the array optical fiber base for the benefit of use The production of array optical fiber module by solder fusion method is a key technology and a difficult problem that needs to be broken. Call—4 This paper size is applicable _ house standard (CNS) A4 ^^ _ 1Q x 297 public love) ---- --- -------- Order ------.— line— (Please read the precautions on the back before filling out this page)
— (請先閲讀背面之注意事項再填寫本頁) 1227525 B7 五、發明說明（Z ) 發明人爰因於此，本於積極發明之精神，i思一種可 、乂解决上述問喊之「陣列光纖基板表面熔接金屬層形成方 去」，幾經研究實驗終至完成此項嘉惠世人之發明。 【本發明之概述】 本發明之主要目的係在提供一種陣列光纖基座表面熔 接金屬層形成方法，俾能提供一種製程簡單，可大量實 施，成本低廉，節省製造時間之表面熔接金屬層形成方 法。 為達成上述之目的，本發明陣列光纖基座表面熔接金 屬層形成方法，係包含以下之步驟：先（A)於“或 Pyrex材質之基座一表面上形成複數個槽溝；而後（B )— (Please read the precautions on the back before filling this page) 1227525 B7 V. Invention Description (Z) Because of this, in the spirit of positive invention, I think of a kind of "array" that can and can solve the above questions. The surface of the optical fiber substrate is fused with a metal layer to form a square. "After several research experiments, this invention that benefited the world was finally completed. [Summary of the present invention] The main purpose of the present invention is to provide a method for forming a welded metal layer on the surface of an array optical fiber base, which can provide a method for forming a welded metal layer on a surface, which has a simple process, can be implemented in large quantities, has low cost, and saves manufacturing time. . In order to achieve the above object, the method for forming a welded metal layer on the surface of an array optical fiber base of the present invention includes the following steps: first (A) forming a plurality of grooves on a surface of a base made of "or Pyrex"; and then (B)
Si晶圓基座採用蒸鍍或丨賤鍍方式，於2·5χ i〇-3 T〇r壓力 下’沉積鎳鉻（Ni/Cr)合金，厚度控制為〇.2至〇.5μιη ; 若基板為Pyrex玻璃，則採用蒸鍍方式，於2 X 1〇·6 T〇r 下沉積0.2至0.5 μηι之鋁（A1)金屬層；（C)含有SnCl2之 敏化溶液處理該具複數個槽溝之基板表面，以於該表面沈 積離子Snh ; ( D )於以含2至10g/l之PdCl2&0.01至 〇·1Μ HC1之活化溶液處理該經敏化之基板表面，以於該 表面沈積觸媒原子Pd〇 ;以及（Ε )將該基板表面浸置於 一無電鎳電鍍溶液以於該基板表面沈積一鎳金屬層。 本發明之表面熔接金屬形成方法尚可視需要，選擇性 地更包含步驟（F)以一無電鍍金溶液（Electroless gold plating solution)處理該基板表面以於該基板表面 訂·· ;線· 1227525 A7 B7 五、發明說明（3 ) 化0 沈積-足夠厚度之金金屬層，讀止該鎳金屬層快速氧 由於本發明確有增進功效.，故依法申請發明專利 【圖式簡單説明】 f·1圖係本發明具槽溝基座單^之砍晶圓之上視圖。 第2圖係本發明方法各步驟中之砍晶圓橫剖面示意圖（ 【圖號説明】 100矽晶圓基板 110基座單元 200切割後之基座210具有槽溝之晶片 220鎳金屬層 230黃金層 【車父佳具體實施例之詳細説明】 員 本發明之槽溝形成方法可為任何習用之方法，較佳為 以刀刻法或蝕刻法於基板上形成（請參照第丨圖）◦例如 最常見者，係先於一矽晶圓基板1〇〇上形成複數個具槽溝 之基座單元110，以利於大量生產，待將來金屬層形成 後’再將之切剳形成光陣列之基座2 〇 〇 (請參照第2 d 圖）。本發明中該基板之刻槽表面係浸入lg/]L (6 4χΐ(Γ 3μ)之氯化亞錫溶液中，浸泡5_1〇分鐘，徐徐攪袢溶液。 基座表面上會附著亞錫離子，且表面不會產生任何物理性 剝落現象。1 g/L氯化亞錫溶液製備方式如下：於3 〇 〇毫升 18 Ω水中加入3 00毫克SnCi2結晶，並攪拌約3分鐘產生 1 υ 2 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） 1227525 員 製 A7 五、發明說明（4) 澄清、無色溶液。此SnCh溶液在使用前係儲存於氮氣 中。 敏化的基座表面隨即浸入水中二次，再置於含 6g/L(3.4xl〇_2M)氯化鈀與〇·〇2Μ HC1之活性溶液中1分 鐘，徐徐攪拌。 為了將基板表面敏化現象調整至最佳狀況，經研究 HC1與PdCh之濃度效應。結果顯示pdcl2之濃度愈高愈 好，而HC1之濃度則應儘量減少，但仍應維持在可溶解 PdCl2之情況下。製得之Pdcl2iPd含量範圍為2§/乙至 l〇g/L，以6g/L最好。由於附著於表面之Sn2+離子容易在 傳送至P d C12浸潰液過程中產生氧化及去吸附現象，與還 原反應形成競爭情況。如果在Pdcl2濃度為6g/L，1^(：1濃 度為0 · 0 2至〇 · 〇 5 Μ情況下浸泡可產生良好的鎳鍍層。但在 HC1濃度為^丨…情況下浸泡則只有部分區域有鍍層產 生。因此，配合PdCl2所使用之HC1量應降至最低，維持 在恰可溶解所有PdCl,之情況下。HC1濃度若為0.01]^是 不夠的，而建議使用〇.〇2M HC1。 ^ 適用之無電鍍鎳溶液為一般傳統之商業無電鍍鎳溶 液，其通常包含兩種溶液之組合，亦即溶液A及溶液B， 其於使用前方得以混合調配。溶液A為鎳離子來源，如氯 化鎳、硫酸鎳以及醋酸鎳，而溶液6則為次亞磷酸根（還原 劑）來源，如次亞磷酸鈉。鎳鍍層溶液中該溶液八含有硫酸 鎳，溶液B含有次亞磷酸鈉、氫氧化鈉以及醋酸。鎳溶液 係製備於將溶液A、溶液B以及水結合，溶液pHi範圍為 L _— —_ 7 本紙張尺度適財國規格⑽X 297公爱） 1227525 A7 五、發明說明（t 4.5-5.2。使用於金屬化過程之鎳溶液係製備於將溶液 A、溶液B以及1 8 Μ Ω水，以1 ·· 3 : 1 6比例結合，之後再使 用Halgne Media-Plus過濾單元（孔徑大小為0.2微米之 耐隆）過濾。此溶液之pH値為約4.85。鎳鍍層之溫度約為 8 5 °C。溫度控制非常重要，因為在高溫下，鎳會自發性地 鍍在鍍層容器壁上，而在低溫下鎳鍍層速率會大幅降低。 鍍層容器壁頂部至底部之溫度梯度大於i_2aC，如大至1〇 °c或更多，會導致自發性的鎳鍍層現象。鎳鍍層的自行催 化性質會導致鎳快速累積以及氫氣快速產生。該氫氣泡， 附著於基座表面而妨礙鍍層沉降。良好的溫度控制係將承 裝有鎳溶液之容器，置入其下方裝有水並具有攪拌棒之較 大各益中’再置放於fluoroware cage上。圍繞鎳溶液容 器之水浴可嚴密控制溫度梯度，使溶液維持在適當溫度 下。利用此方法，在6小時内所觀察到的自發性鎳鍍層現 象非系少。本發明可以在一晶圓（wafer)或Pyrex玻璃 基板形成複數個具有槽溝之晶片2丨〇 (請參照第2 &圖）， 經由化學方式沉積鎳金屬220 (甚至包含黃金層23〇)於 晶圓或Pyrex基板上2 1 〇 (請參照第2b及2c圖），再加以 切割（請參照第2d圖），用以大量生產具可熔接鎳金屬肩 之陣列光纖基座。 於鎳金屬無電電鍍之後，可以視需要選擇性地於鎳金 屬層表面鐘上一層黃金層。該黃金層之無電鍍係於潤溼該 矣二播電鍍鎳金屬之基板後，將該基板於7 〇 〇 c下浸潤於一 PH値為5·0_7·2之無電鍍金溶液（electroless gold A--- (請先閱讀背面之注意事項再填寫本頁) ·. ·-線· 經濟部智慧財產局員工消費合作社印制π 8 I227525 B7 五、發明說明（G ) h)中無電鍍金溶液（electroless gold bath) 沈浸約10分鐘，並溫和地攪拌。如此可以於鎳金屬表面形 成一厚度約0.18"扭之黃金層，無電鍍黃金所使用之溶 液’係將商用之無電鍍黃金溶液於使用前進行純化後使 用〇 為能讓貴審查委員能更瞭解本發明之技術内容，特 舉陣列光纖基板表面熔接金屬形成方法較佳具體實施例説 明如下。 實施例一 依照下述之步騾進行表面鎳金屬化：（A )提供一承 載有SnCl2水浴之容器，一承載有去離子水之容器，以及 一承載有PdCb與HC1浴之容器；（B)將濺鍍或蒸鍍之 基板浸入含有lg/L SnC12之敏化水溶液中，於室溫下浸 泡5-10分鐘，之後以去離子水潤洗至少一次；（c )此敏 化過之基板表面，浸入含6§/[ Pdcl2以及〇 〇2M HC^ 活性溶液中，於室溫下反應約丨分鐘，接著以去離子水潤 洗兩次；（D)此活性基板表面以75。〇之流動氣體乾燥， 歷時约5-10分鐘；（E)將該活性基板表面浸入該非電解 性鎳鍍層溶液約20分鐘，溫度維持在85±rc，隨後以去 離子水潤洗；（F)鍍鎳基板表面浸入無電鍍金溶液約1〇 分鐘’需攪拌’溫度維持在7 0 °C，隨後以去離子水潤洗，· 若有必要，基板表面於75°C下以流動氣體乾燥約1〇分 鐘。 本紙張尺度適用中關家標準（CNS)A4規格(210 X 297公爱） 1227525 A7 ----------B7__ 五、發明說明（7) 综上所陳，本發明無論就目的、手段及功效，在在均 顯示其迥異於習知技術之特徵，為「陣列光纖基板表面溶 接金屬形成方法」之一大突破，懇請早日賜准專利，俾嘉 惠社會，實感德便。惟應注意的是，上述諸多實施例僅係 為了便於説明而舉例而已，本發明所主張之權利範圍自應 以申請專利範圍所述為準，而非僅限於上述實施例。 (請先閱讀背面之注音？事項再填寫本頁) - 訂-丨^-------線—» 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）The Si wafer base is vapor-deposited or base-plated, and a nickel-chromium (Ni / Cr) alloy is deposited under a pressure of 2.5 × 10-3 Torr, and the thickness is controlled to 0.2 to 0.5 μιη; if The substrate is Pyrex glass, and an aluminum (A1) metal layer with a thickness of 0.2 to 0.5 μm is deposited at 2 X 10.6 Torr by evaporation method. (C) A sensitizing solution containing SnCl2 is used to treat the plurality of grooves. The substrate surface of the trench is used to deposit ions Snh on the surface; (D) the sensitized substrate surface is treated with an activating solution containing 2 to 10 g / l of PdCl2 & 0.01 to 0.1M HC1 to deposit on the surface Catalyst atoms Pd0; and (E) The substrate surface is immersed in an electroless nickel plating solution to deposit a nickel metal layer on the substrate surface. The method for forming a surface fusion metal of the present invention may optionally include step (F). The surface of the substrate is treated with an electroless gold plating solution to define the surface of the substrate...; 1227525 A7 B7 V. Description of the invention (3) Chemical deposition-a sufficient thickness of gold metal layer, read-stop rapid oxidation of the nickel metal layer. Since the present invention does have an enhanced effect. Therefore, the invention patent is applied according to the law. [Schematic description] f · 1 FIG. Is a top view of a cut wafer with a groove base according to the present invention. Figure 2 is a schematic cross-sectional view of a wafer cut in each step of the method of the present invention ([Illustration of the drawing number] 100 silicon wafer substrate 110 pedestal unit 200 diced base 210 grooved wafer 220 nickel metal layer 230 gold Layer [Detailed description of Che Fujia's specific embodiment] The groove forming method of the present invention can be any conventional method, and it is preferably formed on the substrate by knife cutting or etching (see the figure below). The most common is to form a plurality of grooved base units 110 on a silicon wafer substrate 100 to facilitate mass production. After the metal layer is formed in the future, it will be cut to form the basis of the optical array. Block 2 00 (please refer to Figure 2d). In the present invention, the grooved surface of the substrate is immersed in a solution of lg /] L (6 4χμ (Γ 3μ) in stannous chloride, soaked for 5-10 minutes, and slowly stirred Rhenium solution. The stannous ions will be attached to the surface of the base, and there will not be any physical peeling on the surface. The preparation method of 1 g / L stannous chloride solution is as follows: Add 300 mg SnCi2 to 300 ml of 18 Ω water Crystallize and stir for about 3 minutes to produce 1 υ 2 sheets of paper Applicable to China National Standard (CNS) A4 specification (210 X 297 public love) 1227525 Membership A7 V. Description of invention (4) Clear, colorless solution. This SnCh solution is stored in nitrogen before use. Sensitized base The surface was then immersed in water for two times, and then placed in an active solution containing 6g / L (3.4 × 10_2M) palladium chloride and 0.02M HC1 for 1 minute, and slowly stirred. In order to adjust the substrate surface sensitization to the maximum After researching the concentration effect of HC1 and PdCh, the results show that the higher the concentration of pdcl2, the better, and the concentration of HC1 should be reduced as much as possible, but it should still be maintained under the condition of soluble PdCl2. The range of Pdcl2iPd content obtained is 2§ / B to 10g / L, 6g / L is the best. Because the Sn2 + ions attached to the surface are susceptible to oxidation and desorption during the transfer to the P d C12 immersion solution, they compete with the reduction reaction. .If the concentration of Pdcl2 is 6g / L, the concentration of 1 ^ (: 1 is 0. 02 to 0. 〇5 Μ can produce a good nickel coating. But when the concentration of HC1 is ^ 丨 ... Plating is generated in some areas. Therefore, it is used with PdCl2 The amount of HC1 should be minimized and maintained at a level where it can dissolve all PdCl. If the concentration of HC1 is 0.01] ^ is not enough, it is recommended to use 0.02M HC1. ^ The applicable electroless nickel plating solution is generally traditional Commercial electroless nickel plating solution usually contains a combination of two solutions, namely solution A and solution B, which are mixed and prepared before use. Solution A is a source of nickel ions, such as nickel chloride, nickel sulfate and nickel acetate, and Solution 6 is the source of hypophosphite (reducing agent), such as sodium hypophosphite. In the nickel plating solution, this solution contains nickel sulfate, and solution B contains sodium hypophosphite, sodium hydroxide, and acetic acid. The nickel solution is prepared by combining solution A, solution B and water, and the pH range of the solution is L _ — —_ 7 The paper size is suitable for financial country specifications ⑽X 297 public love) 1227525 A7 V. Description of the invention (t 4.5-5.2. Use The nickel solution used in the metallization process was prepared by combining solution A, solution B, and 18 M Ω water in a ratio of 1 ·· 3: 1 6 and then using a Halgne Media-Plus filter unit (pore size of 0.2 micron Nalon) filtration. The pH of this solution is about 4.85. The temperature of the nickel coating is about 8 5 ° C. Temperature control is very important, because at high temperatures, nickel is spontaneously plated on the wall of the coating container, and at low temperatures The lower nickel plating rate will be greatly reduced. The temperature gradient from the top to the bottom of the coating container wall is greater than i_2aC, such as 10 ° c or more, which will lead to the spontaneous nickel coating phenomenon. The self-catalytic property of the nickel coating will lead to rapid nickel Accumulation and rapid generation of hydrogen. The hydrogen bubbles adhere to the surface of the base and prevent the plating from settling. Good temperature control is a large benefit of placing a container containing a nickel solution underneath, which is filled with water and has a stirring rod. in Then placed on a fluoroware cage. The water bath surrounding the nickel solution container can tightly control the temperature gradient to maintain the solution at an appropriate temperature. Using this method, the spontaneous nickel plating phenomenon observed within 6 hours is not rare. The invention can form a plurality of wafers 2 with grooves on a wafer or Pyrex glass substrate (see Fig. 2 & figure), and chemically deposit nickel metal 220 (even containing a gold layer 23) on the wafer. 2 1 0 on the wafer or Pyrex substrate (please refer to Figure 2b and 2c), and then cut (please refer to Figure 2d) to mass-produce the array optical fiber base with weldable nickel metal shoulder. No electricity on nickel metal After electroplating, a layer of gold can be selectively applied to the surface of the nickel metal layer as needed. The electroless plating of the gold layer is performed by wetting the substrate of the nickel-plated nickel metal substrate, and then placing the substrate at 700 ° C. Immerse in an electroless gold solution with a pH value of 5.0 · 7 · 2 (electroless gold A --- (Please read the precautions on the back before filling out this page) ··· -line · Consumer Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs Printed π 8 I2275 25 B7 V. Description of the invention (G) h) Electroless gold bath is immersed for about 10 minutes and gently stirred. In this way, a twisted gold layer of about 0.18 " The solution used for electroplating gold is a commercially available electroless electroplating gold solution that is used after purification before use. In order to allow your reviewers to better understand the technical content of the present invention, the method of forming a fusion metal on the surface of an array optical fiber substrate is better. Specific embodiments are described below. Example 1 Surface nickel metallization was performed according to the following steps: (A) providing a container carrying a SnCl2 water bath, a container carrying deionized water, and a container carrying a PdCb and HC1 bath; (B) Immerse the sputtered or evaporated substrate in a sensitized aqueous solution containing lg / L SnC12, soak it at room temperature for 5-10 minutes, and then rinse it with deionized water at least once; (c) the surface of the sensitized substrate , Immersed in an active solution containing 6§ / [Pdcl2 and 002M HC ^, reacted at room temperature for about 丨 minutes, and then rinsed twice with deionized water; (D) the surface of the active substrate was 75. 〇The flowing gas is dried for about 5-10 minutes; (E) The surface of the active substrate is immersed in the non-electrolytic nickel plating solution for about 20 minutes, the temperature is maintained at 85 ± rc, and then rinsed with deionized water; (F) The surface of the nickel-plated substrate is immersed in an electroless gold solution for about 10 minutes. The temperature of 'stirring' is maintained at 70 ° C, followed by rinsing with deionized water. If necessary, the substrate surface is dried at 75 ° C with flowing gas for about 10 minutes. This paper size is applicable to Zhongguanjia Standard (CNS) A4 specification (210 X 297 public love) 1227525 A7 ---------- B7__ V. Description of the invention (7) In summary, the present invention is no matter the purpose , Method and effect, all show its very different characteristics from the conventional technology. It is a major breakthrough in "method for forming metal on the surface of the array optical fiber substrate". However, it should be noted that the above-mentioned embodiments are merely examples for the convenience of description. The scope of the claimed rights of the present invention shall be based on the scope of the patent application, rather than being limited to the above-mentioned embodiments. (Please read the phonetic on the back? Matters before filling out this page)-Order-丨 ^ ------- line— »Printed on paper standards of the Ministry of Economic Affairs, Intellectual Property Bureau, Employees' Cooperatives, China Paper Standard (CNS) A4 Specifications (210 X 297 mm)