TWI227447B - Semiconductor device adapted for imaging bar code symbols - Google Patents
Semiconductor device adapted for imaging bar code symbols Download PDFInfo
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- H—ELECTRICITY
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
- G06K7/10544—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation by scanning of the records by radiation in the optical part of the electromagnetic spectrum
- G06K7/10712—Fixed beam scanning
- G06K7/10722—Photodetector array or CCD scanning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
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Abstract
Description
1227447 (ο 玖、發明說明 上係關於適於成像光學碼符號之半導俨 二特別是條碼符號，及關於包含此半導體裝置的條：讀 •本發明特別關於使用固態感測g以偵測複數圖像元 勺成像系統，包含光學碼成像機及照相機。本發明的特 點特別可以用在基於線性感測器及基於二維感測器 持式讀取機》更特別地’本發明係關於形式 像機。 4自〕成 光學碼係由具有不同光反射或發光性質之影像區域组 成的圖案，其典型上依據預定的規則而組合。術語「條碼 」有時候用於說明某種光學碼。光學碼的光學性質及圖案 係選擇為將它們的外觀與使用它們的背景環境加以區別 「用於識別光學碼或從光學碼擷取資料的裝置有時候稱為 「光學碼讀取機」，其條碼掃描器係一型式。光學碼每… 機使用在很多不同環境中的固定與可攜式設備二者，，士 在商店中用於結帳、在製造場所中用於工作流及存貨控制 、在運輸車輛中用於追蹤包裹的處理。光學碼可以〜例士 一藉由自很多條碼的印刷排列讀取一目標條碼而當作^ 料輸入的快速、一般化裝置。在某些用途中，取士 予碼讀取 機連接至一可攜式資料處理裝置或資料收集及傳輸裝置 。通常，光學碼讀取機包含一以人工方式對準目標碼合、 持式感測器。 手 大多數傳統碼讀取機設計成為讀取一維條碼拉 4、 付說。條碼 係由固定或可變寬度的空間分離之可變寬度矩 k々馬。石馬與 (2) 1227447 空間具有不同的光反射特徵。一 、·隹條碼之一例係用於識別 一例如一產品存貨的UPC/ΕΑΝ碼。 條碼可以使用固態成像 罝項取。例如，可以使用彩像 感測器，影像感測器具有一個- " 個一維陣列之電池或光感測器 ，其對應於裝置之視野中的 ^ 〕〜像7^件或像素。此影像感測 益可乂係—维或區域電荷耦合裝置仰…及相關電路，用 、產生％子仏號’其對應於一視野之二維陣列的像素資訊 。也已知用於偵測條碼反射影像的-維線性陣列，例如， 授予Daniels〇n等人的美國專利6，m，915號，其以引用的方 式併入本文中。 在此技蟄中白知使用電荷耦合裝置影像感測器及物鏡 、’·心成於光學碼峭取機。過去，此系統已使用原始設計用於 相當卬貴的視訊成像系統之複雜的物鏡總成。此系統可以 具有單一敏銳的焦點及一有限的景深，其與傳統瞄準、照 射及信號處理與解碼算法一起限制系統的多功能及工作 範圍。 一習知的成像系統主要設計成為用於讀取光學碼。此讀_ 取系統涉及若干小零件的組合與對準。這些零件可能包含 一透鏡、一孔徑及一諸如電荷耦合裝置晶片的2D影像感 測器陣列。此結構績示於—例如—w〇的/6498〇號，其以引、 用的方式併入本文中。適用於手安裝式碼讀取機的微型成. 像機揭示於Patel等人於2〇〇〇年1〇月日申請的美國專利 申請案09/684，514號，其以引用的方式併入本文中。 一成像系統的設計依待製造成像系統的封裝體之尺寸 (3) 1227447 而定。使用現成元件的傳击 有限，而難以微小化。此 y統由於現成元件的選擇 光學現象，在選擇元件# 由於叹4微型成像機之各種 个弘 < 评7C件時必須一 質之間的各種代價。此外，_ 、 70尺寸與掃描影像品 能由於光學現象而限制其他元成像機的某些元件之選擇可 <選用於微型成像機。 發明概要 因此，本發明之—目的係提 之半導體裝置、一種拽创^# 用於成像光學碼符號 禋微型成像機及一 之條碼讀取機。 I =此半導體裝置 本發明之又—目的係提供—種半 機，其提供適當的掃描影 置或微型成像 一即，形式因子—減至最小。 尺寸與形狀 用於成像光學碼符號的半爱 ,. 把裝置或微型成傻趟曲 上使用在將半導體裝置併入 成像機典型 些手持式裝置典型上具有有 嵩式應用。這 八π噶限的電池容量。 本發明之一目的俏趄处 0係棱供一種適用於成像條碼符 導體裝置或微型成像^ 4 <半 成像機，微型成像機使用數 於影像的捕捉與處理。 4日〕功率 本發明之一目的係增加一成像系統的工作範固。 使用固態成像機6ί1值# & # β 的傳統成像系統苦於目標影像能夠愈 成像機透鏡相隔以正確解碼目標成像機之距離的限制2 別地’在傳統成像系統中’固態成像機之像素陣列 配置成為垂直於聚焦透鏡的光學轴線。因此，固態成像= 之像素全邵聚焦於目標影像的相同空間平面。 -10- 1227447 (4) 全部像素聚焦於 工作範圍，即，成 傳統成像系統具有 成像系統與目標影 影像。 為了提供照射及 光二極體（LEDs)。| 極體光源之不一貫 訊衝擊。此外，發； 在於發光二極體容 製成更精巧，且比 比，發光二極體係 產生的光較不聚焦 少發光二極體產生 式隙缝於發光二極 體投射於一物件上 因此，本發明之 線厚度減小的投射 的光量。 在用於本發明的 ，一成像陣列的像 瞬時視野及孔徑的 素寬度或間距的成 器陣列長度。依據 相同的空間平面嚴重限制成像系統的 像系統與目標影像之間的距離。如果一 單一固定的焦點透鏡’則可能必須進行 像之間的調整，以適當接收及解碼目標 幫助瞄準，成像系統可以使用雷射或發“ 务光二極體可能優於雷射，因為發光二 的性質不會產生雷射所產生的斑紋雜 电二極體比雷射更具有成本效益，原因鲁 易製造及包裝。此外，發光二極體可以 雷射更易於表面安裝。然而，與雷射相 不理想的點光源。特別地，發光二極體 ’其產生線厚度增加的投射光。為了減 · 之光的線厚度，很多設計者安置一機械 體前方’然而，機械式隙縫使發光二極 的光量減少。 一目的係提供一種發光二極體，其具有 _ 光，而不會嚴重減少發光二極體所投射 % 微型成像機中，與大尺寸的成像機相比 、 素寬度或間距減小，且維持每一像素的 · 面積。依據此實施例，一具有4微米像 痛 像機可以具備小於或等於2毫米的偵測 此實施例之一特點，藉由使像素列以半 -11 - 12274471227447 (ο 玖, the description of the invention is about semi-conductors suitable for imaging optical code symbols, especially bar code symbols, and about bars containing this semiconductor device: read • This invention is particularly about using solid-state sensing g to detect complex numbers The image element imaging system includes an optical code imaging machine and a camera. The features of the present invention can be particularly used in linear sensor-based and two-dimensional sensor-based handheld readers. More particularly, the present invention relates to the form Camera. 4 from] optical code is a pattern composed of image areas with different light reflection or luminescence properties, which are typically combined according to predetermined rules. The term "bar code" is sometimes used to describe an optical code. Optical The optical properties and patterns of codes are chosen to distinguish their appearance from the background environment in which they are used. "The device used to identify or retrieve data from an optical code is sometimes called an" optical code reader. " Scanners are of the same type. Optical codes are used for both fixed and portable devices in many different environments. They are used in stores for checkout, The site is used for workflow and inventory control, and used for tracking the processing of parcels in transportation vehicles. The optical code can be used as a quick and easy way to input a target barcode by reading a target barcode from the printing arrangement of many barcodes. Generalized device. In some applications, the taxi code reader is connected to a portable data processing device or data collection and transmission device. Generally, optical code readers include a manual alignment of the target code. Hand-held sensors. Most traditional code readers are designed to read one-dimensional bar codes. 4. Pay to say. Bar codes are variable width moment k々horse separated by a fixed or variable width space. Shima The space has different light reflection characteristics from (2) 1227447. 1. An example of a bar code is a UPC / ΕΑΝ code used to identify, for example, a product inventory. Bar codes can be obtained using solid-state imaging items. For example, color images can be used Sensor, image sensor has one-"one-dimensional array of battery or light sensor, which corresponds to ^ in the field of view of the device] ~ 7 pieces or pixels. This image sensing can be beneficial. Department-dimension Or a regional charge-coupled device Yang ... and related circuits, use, to generate pixel information corresponding to a two-dimensional array of a field of view. It is also known as a one-dimensional linear array for detecting the reflection image of a barcode, for example, U.S. Patent No. 6, m, 915, issued to Daniels et al., Which is incorporated herein by reference. In this technology Bai Zhi uses a charge-coupled device image sensor and objective lens, and the heart is made into optics. Code picking machine. In the past, this system has used a complex objective lens assembly originally designed for a rather expensive video imaging system. This system can have a single sharp focus and a limited depth of field, which is similar to traditional aiming, irradiation and The signal processing and decoding algorithms together limit the system's versatility and working range. A conventional imaging system is mainly designed to read optical codes. This reading system involves the assembly and alignment of several small parts. These parts may include a lens, an aperture, and a 2D image sensor array such as a charge-coupled device wafer. The performance of this structure is shown in, for example, w / 6/6498, which is incorporated herein by reference. A miniature camera suitable for a hand-mounted code reader. The camera is disclosed in US Patent Application No. 09 / 684,514 filed by Patel et al. On October 10, 2000, which is incorporated by reference In this article. The design of an imaging system depends on the size of the package to be manufactured (3) 1227447. Attacks using off-the-shelf components are limited and difficult to miniaturize. This system is due to the selection of off-the-shelf components due to the optical phenomenon. When selecting components # due to the various types of micro-imagers, it is necessary to evaluate the quality of various components. In addition, _, 70 size and scanned image products can restrict the selection of certain components of other meta imagers due to optical phenomena. ≪ Selected for mini imagers. SUMMARY OF THE INVENTION Therefore, the purpose of the present invention is to mention a semiconductor device, a micro-imager for imaging optical code symbols, a miniature imager, and a barcode reader. I = this semiconductor device Another object of the present invention is to provide a kind of semi-computer that provides a suitable scanning position or micro imaging-that is, the form factor-is minimized. Dimensions and shapes are used for imaging optical code symbols. The device or miniature is used to incorporate a semiconductor device into an imaging machine. Some handheld devices typically have a loose application. These eight π ka limit the battery capacity. One of the objects of the present invention is to provide a suitable device for imaging a bar code symbol, a conductor device, or a miniature imaging device. A < semi-imager, which uses a number of image capture and processing. 4th] Power An object of the present invention is to increase the working range of an imaging system. The traditional imaging system using a solid-state imaging machine 6ί1 value # &# β suffers from the limitation of the distance between the target image and the distance between the camera lens to correctly decode the target imaging camera. Arranged perpendicular to the optical axis of the focusing lens. Therefore, solid-state imaging = all pixels of the solid-state imaging focus on the same spatial plane of the target image. -10- 1227447 (4) All pixels are focused on the working range, that is, a conventional imaging system has an imaging system and a target image. To provide illumination and light-emitting diodes (LEDs). | Inconsistent signal shock from polar body light sources. In addition, the light-emitting diode body is made more compact, and the ratio of light generated by the light-emitting diode system is less focused than the light-emitting diode generation type gap when the light-emitting diode is projected on an object. Therefore, the present invention The amount of projected light with reduced line thickness. In the present invention, the length of the array of the imaging array's instantaneous field of view and the element's width or pitch of the aperture is the length of the array. According to the same spatial plane, the distance between the imaging system and the target image of the imaging system is severely restricted. If a single fixed focus lens is used, then adjustments between images may be necessary to properly receive and decode the target to help aim. The imaging system can use lasers or lasers. “Light diodes may be better than lasers because The nature does not produce laser streaky heterodiodes that are more cost-effective than lasers, which are easy to manufacture and package. In addition, light-emitting diodes can make lasers easier to surface mount. However, they are similar to lasers. Unsatisfactory point light source. In particular, light-emitting diodes 'produce light with increased line thickness. In order to reduce the line thickness of light, many designers place a front of a mechanical body'. However, the mechanical gap makes the light-emitting diodes The aim is to provide a light-emitting diode that has _ light without severely reducing the% projected by the light-emitting diode. In a miniature imager, the element width or pitch is reduced compared to a large-sized imager. It is small and maintains the area of each pixel. According to this embodiment, a camera with 4 micron pain can have a detection of less than or equal to 2 mm. One of the embodiments Features, by making the pixel row in half -11-1227447
像 像 因 射 像 殼 不 增 〇 - 訊 消 益 小 提 擎 透 焦 配 矩 於 位 素彼此交錯，則可產生一維成像機，其具備約3微米的 素見度或間Μ及約〇·75毫米的偵測器陣列長度。 在另—實施例中，提供一種成像機，其具有很小的形式 子’且能夠以成像機提供之很小的人工照射或無人工照 而操作，以提供很低功率的操作。依據此實施例，—成 機晶片安裝在一成像機外殼的成像機板内部。成像機外 -在成像機晶片周圍形成一黑室，使成像機能夠操作，而 耑要外密封。依據此實施例之一特點，孔徑的尺寸可以 加’以使成像引擎提供人工照射的需求減至最小或消除鲁 衣據此貫施例之另一特點，提供一種具有一增益的低雜 成像機，以使成像引擎提供人工照射的需求減小及/或 除。依據此實施例之又一特點，可以提供一種具有一增 之低雜訊成像機，以使成像？丨擎提供人工照射的需求減 及/或消除。依據此實施例之再一特點，可以提供一種 供非線性響應的成像機，諸如對數成像機，以使成像引— 提供人工照射的需求減小及/或消除。 依據又一實施例，一成像機包含一影像感測器及一聚焦籲 鈿。影像感測器具有一在第一平面中的像素陣列，且聚 透鏡具有一在第二平面中的光學軸線。第一與第二平面 置成為俾使它們不互相垂直，以增加成像機的工作範圍。 依據另一實施例，一裝置包含_具有一正方形部分及一 · 形部分的發光二極體，其中矩形部分的高度及寬度不等、 正方形部分的高度。裝置也包含一黏合墊，其中黏合墊 於正方形部分上。依據此實施例之一特點，發光二極體 -12.The image does not increase due to the imaging shell. The small focal length and the moments of the focal point are interleaved with each other, so that a one-dimensional imaging machine can be produced, which has a prime visibility of about 3 microns, or an interval between M and about 0. Detector array length of 75 mm. In another embodiment, an imager is provided which has a small form factor and can be operated with little or no artificial illumination provided by the imager to provide very low power operation. According to this embodiment, the finished wafer is mounted inside the imager board of an imager housing. Outside the Imager-A black chamber is formed around the imager's wafer to enable the imager to operate without external sealing. According to a feature of this embodiment, the size of the aperture can be increased to minimize the need for the artificial engine to provide artificial irradiation or to eliminate another feature of the embodiment according to Lu Yi, which provides a low-noise imaging machine with a gain. In order to reduce and / or eliminate the need for the imaging engine to provide artificial irradiation. According to still another feature of this embodiment, it is possible to provide an imaging device with an increased low noise to make imaging? The engine provides a reduction and / or elimination of the need for artificial exposure. According to still another feature of this embodiment, an imaging machine for non-linear response, such as a logarithmic imaging machine, can be provided to reduce and / or eliminate the need for imaging guides to provide artificial exposure. According to yet another embodiment, an imaging machine includes an image sensor and a focus call. The image sensor has a pixel array in a first plane, and the condenser lens has an optical axis in a second plane. The first and second planes are placed so that they are not perpendicular to each other to increase the working range of the imager. According to another embodiment, a device includes a light emitting diode having a square portion and a square portion, wherein the height and width of the rectangular portion are different, and the height of the square portion. The device also includes an adhesive pad, wherein the adhesive pad is on a square portion. According to a feature of this embodiment, the light emitting diode -12.
1227447 ⑹ 也包含一第二正方形部分，其中矩形部分具有一第一及一 第二側部，其中正方形部分位於矩形部分的第一側部，且 第二正方形部分位於矩形部分的第二側部。一第二黏合墊 位於第二正方形部分。依據另一實施例，一發光二極體晶 粒包含一矩形發光二極體，而一黏合墊環繞發光二極體。 上述標的可以又界定如下： 一成像機包括一用於產生對應於目標影像的電子信號 之固態影像感測器，其中影像感測器包含一陣列，其具備 數目小於或等於1024的像素，且每一像素具有小於或等於 4微米的寬度或間距；及一孔徑，用於接受自目標反射的 光及用於使反射光到達影像感測器上，其中較佳地，影像 感測器係一維影像感測器，像素的數目小於或等於1024像 素，且每一像素的寬度等於3微米，使陣列的長度小於或 等於1.5毫米，或者，其中在影像感測器中的像素數目小 於或等於約500像素，每一像素的寬度等於3微米，且其中 像素配置於二相鄰列中，一列與另一列偏置半像素，使障 列的長度小於或等於0·75毫米。較佳地’上述影像感測器 係二維影像感測器’俾使陣列之最長的長度小於2毫米° 特別地，上述影像感測器可以係互補式金氧半導體偵測器 陣列。上述影像感測器較佳為適於使用再流動焊接技術安 裝在印刷電路板上。上述成像機可以又包括照射/瞄準發 光二極體；照射/瞄準透鏡；及一成像透鏡，其中成像透 鏡安置於孔徑中’其中裝置包含於一模製封裝體中。較佳 地，成像機的尺寸小於或等於5毫米乘3毫米乘2·25毫米。 •13- 1227447 ⑺ 特點中，提供一種成像機，包一 其包含一成像機晶片；一透鏡，其中 ·奴， 中，與成像機曰μ 、中透~併人成像機外殼 μ象機印片對立，且其中成像機 等於3·3立 八 $外成的植私小於或 於一室中万么刀（〇·2立方忖）°較佳地，成像機晶片封閉 地，：二使，像機能夠操作，而不需要外密封。有利 佳實施例中，成像外殼…一用…万笔“-較 一極體，及/或成像外殼包含一孔徑發九 為俾使能夠掃描一目標影像，、 魴祛絀，L 1 1而要成像機的照射。 上述成像機晶片係具有一增益 俾使能夠掃描一目標影像，而不需==像機， 成像機晶片可以係對數響 冑L·、射。上述 的愛部^… 應成像機1便增加—目標影像 ::與…之間的對比，俾使能夠掃描 ，而不需要成像機的照射。 〜像 依據另-特點’提供一種成像機，包括— 其包含一成像機晶片；及一透 奴’ 殼，與成像機晶片對立，且其中成併入成像機外 更成像的w放大’俾使能夠掃描—目工 不需要成像機的照射。較佳地 y 等於⑴方公分（㈣立方仆成像機外设的體積小於或 又’提供-種成像機，包括— 像機晶片；及—诱镜，Α ώ * 其包含一成 機曰片對、 #中透鏡併入成像機外殼，與成像 機印片對互，且其中成像機晶片對於一目標象 非線性強度響應’俾使能夠掃描目標影像，而 -J4- 1227447 ⑻ 不需要成像機的照射，其中較佳地，非線性代表係目標影 像的對數代表。此處，又，成像機外殼的體積較佳為小於 或等於3.3立方公分（0.20立方吋）。 依據又一特點，提供一種成像機，包括一安裝在印刷電 路板上的成像感測器；及一孔徑，其中成像機的體積小於 或等於3.3立方公分。較佳地，成像機的體積小於或等於 20.6乘14.2乘11.4毫米。成像機可以又包括發光二極體，以 照射一目標影像，及/或諸發光二極體，以照射一在目標 影像上的目標，幫助成像機瞄準。 此外，提供一種成像機，包括二維影像感測器，其包含 一部分，該部分具有在一第一平面中之水平的元件影像列 ;及具有一光學軸線的聚焦光學器材，其中影像感測器的 定向係俾使第一平面不垂直於光學軸線，以致於就不同的 影像元件列，提供不同的焦距。較佳地，聚焦光學器材包 含一物鏡，其對稱地含有一實質上不平行於第一平面的平 面。成像機可以又包括發光二極體，以提供一目標影像的 照射。 依據另一特點，提供一裝置，包含一具有一正方形部分 及一矩形部分的發光二極體，其中矩形部分的高度及寬度 不等於正方形部分的高度；及一黏合墊，其中黏合墊位於 正方形部分上。在一特定實施例中，矩形部分較佳為具有 一第一側部及一第二側邵，其中發光二極體又包括一第二 正方形部分，其中正方形部分位於矩形部分的第一側部， 且第二正方形部分位於矩形部分的第二側部，且其中一第 (9) (9)^27447 一黏合墊位於第二正方形部分。 墊，复提供一種裝置，包括-矩形發光二極體；及-黏合 :出：中黏合墊環繞發光二極體，藉以提供由發光二極體 咐出的均勻光功率。 Ba 光學：：：明2供一種用於成像包括不多於1024像素的 的展：广半導體裝置，其中每-像素具有大於… 佳地，二不大於4微米且不小於2微米的短尺寸，其中較 集表面’广於早列。此外’半導體裝置可以具有-收 依據本發明之另一特二:不多於1024像素n 一用 棱供一種條碼讀取機，其包本 述:::::機的視野成像之感測器，感測器包括單-: 。：=:的係一種用於讀取目標影像之微型成像機 -^ ^ 电系，，无係取佳化，以減小成像機之 :多尺寸或體積。依據一實施例，像素寬度或間距及 视野:；Λ大的成像機減小，以維持每-像素之可比擬的 減小的像素光度或間距允畔 時视野保持常數，且減小成像的面積w素的瞬 中，提供裝置與技術，其使寸。在其他實施例 及/ <喵仏^ 风像機照射一目標的需求減小 尺寸。提：減小成像機所消耗的總功率及/或它的總 減小之=:種工作範園増加的成像機，諸如產生線厚度 <先的發光二極體。 Λ 1砰細說明及配合圖，可了解本發明的目的及優 -16 - (10)12274471227447 ⑹ also includes a second square portion, wherein the rectangular portion has a first and a second side portion, wherein the square portion is located on the first side portion of the rectangular portion, and the second square portion is located on the second side portion of the rectangular portion. A second adhesive pad is located on the second square portion. According to another embodiment, a light-emitting diode crystal includes a rectangular light-emitting diode, and a bonding pad surrounds the light-emitting diode. The above target may be further defined as follows: An imaging machine includes a solid-state image sensor for generating an electronic signal corresponding to a target image, wherein the image sensor includes an array having a number of pixels less than or equal to 1024, and each A pixel has a width or pitch of less than or equal to 4 micrometers; and an aperture for receiving light reflected from a target and for allowing the reflected light to reach an image sensor, preferably, the image sensor is one-dimensional Image sensor, the number of pixels is less than or equal to 1024 pixels, and the width of each pixel is equal to 3 microns, so that the length of the array is less than or equal to 1.5 mm, or wherein the number of pixels in the image sensor is less than or equal to about 500 pixels, the width of each pixel is equal to 3 microns, and the pixels are arranged in two adjacent columns, and one column is offset by half a pixel from the other, so that the length of the barrier column is less than or equal to 0.75 mm. Preferably, the above-mentioned image sensor is a two-dimensional image sensor, so that the longest length of the array is less than 2 mm. In particular, the image sensor may be a complementary metal-oxide semiconductor detector array. The image sensor is preferably suitable for mounting on a printed circuit board using reflow soldering technology. The above-mentioned imaging machine may further include an irradiation / aiming light-emitting diode; an irradiation / aiming lens; and an imaging lens, wherein the imaging lens is disposed in the aperture ', and the device is contained in a molded package. Preferably, the size of the imager is less than or equal to 5 mm by 3 mm by 2.25 mm. • 13- 1227447 ⑺ In the feature, an imaging machine is provided, which includes an imaging machine wafer; a lens, in which the slave, medium, and the imaging machine are μ, mid-pass ~ and the imaging machine housing μ image printer Opposite, and in which the imager is equal to 3.3 mm and the external plant is less than or equal to 10,000 knives (0.2 cubic meter). Preferably, the imager wafer is closed: The machine can operate without the need for an external seal. In an advantageous embodiment, the imaging housing ... one-use ... ten thousand pens-compared to a polar body, and / or the imaging housing contains an aperture to enable scanning of a target image. Irradiation of the imager. The above imager wafer has a gain so that it can scan a target image without the need for a camera. The imager wafer can be logarithmic. The above mentioned love department ^ ... should be imaged Machine 1 is increased-the contrast between the target image :: and ..., enabling scanning without the need for irradiation by the imager. ~ Image according to another-features' to provide an imager, including-which contains an imager wafer; And a transparent slave's shell, which is opposed to the imager's wafer, and which is incorporated into the outside of the imager to enlarge the 'magnification' so that scanning can be performed—the worker does not need the exposure of the imager. Preferably y is equal to square centimeters ( The volume of the peripheral equipment of the Cube Servo imaging machine is smaller than or 'provided'-a kind of imaging machine, including-camera chip; and-temptation lens, Α * , And the imager print pair, and where The imager wafer responds to a target image with a non-linear intensity response to enable scanning of the target image, and -J4- 1227447 ⑻ does not require the imager to illuminate, and preferably, the non-linear representation is the logarithmic representation of the target image. Here, In addition, the volume of the imager housing is preferably less than or equal to 3.3 cubic centimeters (0.20 cubic inches). According to another feature, an imager is provided, which includes an imaging sensor mounted on a printed circuit board; and an aperture, The volume of the imager is less than or equal to 3.3 cubic centimeters. Preferably, the volume of the imager is less than or equal to 20.6 by 14.2 by 11.4 mm. The imager may further include a light emitting diode to illuminate a target image, and / or Light-emitting diodes to illuminate a target on a target image to help the imaging machine aim. In addition, an imaging machine is provided that includes a two-dimensional image sensor including a portion having a level in a first plane Element image row; and focusing optics having an optical axis, wherein the orientation of the image sensor is such that the first plane is not perpendicular to the optical axis So that different focal lengths are provided for different image element rows. Preferably, the focusing optics includes an objective lens that symmetrically contains a plane that is not substantially parallel to the first plane. The imager may further include a light emitting diode According to another feature, there is provided a device including a light emitting diode having a square portion and a rectangular portion, wherein the height and width of the rectangular portion are not equal to the height of the square portion; and An adhesive pad, wherein the adhesive pad is located on a square portion. In a specific embodiment, the rectangular portion preferably has a first side portion and a second side portion, wherein the light emitting diode further includes a second square portion, The square portion is located on the first side portion of the rectangular portion, the second square portion is located on the second side portion of the rectangular portion, and one of the (9) (9) ^ 27447 adhesive pads is located on the second square portion. The pad provides a device including: a rectangular light emitting diode; and-bonding: out: the middle bonding pad surrounds the light emitting diode, thereby providing uniform light power commanded by the light emitting diode. Ba Optics :: Ming 2 is used for imaging exhibitions including no more than 1024 pixels. Each semiconductor device has a short size greater than… preferably, no more than 4 microns and no less than 2 microns. Among them, the set surface is wider than earlier. In addition, the semiconductor device may have another feature according to the present invention: not more than 1024 pixels n, a bar code reader for a bar code reader, which includes the description of the field of view: The sensor includes single- :. : =: Is a miniature imaging machine for reading target images-^ ^ Electrical system, no system is optimized to reduce the size of the imaging machine: multi-size or volume. According to an embodiment, the pixel width or pitch and field of view are: Λ large imagers are reduced to maintain a comparable reduced pixel luminosity or pitch per pixel when the field of view is kept constant and the imaging area is reduced In the instant of the prime, we provide equipment and technology, which make the difference. In other embodiments, the need to illuminate a target with a wind camera reduces the size. Note: Reduce the total power consumed by the imager and / or its total reduction =: a variety of working imagers, such as generating line thickness < first light emitting diode. Λ 1 Bang detailed description and cooperation diagram, you can understand the purpose and advantages of the present invention -16-(10) 1227447
其中： 圖1A與1B個別纟會示—微型成傻娃 圖2A-2C個別繪示另—似 機的頂視圖及側視圖； 微1型成俊n = 圖3繪示又一微型成像機· 機的頂、前及側視圖 圖4繪示一微型成像機的電元《 請示-工作範圍增加的成::機； 圖6A繪不一傳統發光二極體； 圖6Β繪示一可以用於本發：的發光…. 圖_示另一可以用於本發明的發：-二. 圖_示又-可以用於本發明的發 圖6丑緣示再一可以用於本 先—极姐， 月的發光二極體； 請示-依據本發明的半導體裝置。 j下列說明中’為了解釋而非限制之目的 細郎’以供完整了解本發明。然 出特- 以明白’本發明能夠在偏離 ：技藝的人可 實施。在其他狀況中，省格眾人皆知之方法、：… 的詳細說明，以免模糊本發明的說明。 5與電路 圖⑽1B個別緣示一微型成像機的頂視圖及 成像機併入一模製的光學封裝體"Ο。用以如此做 與技術揭示於Mazz等人於2001年6月15日申請 ^ # 製的成像機光學封裝體及基於線性偵私為杈 的知描引擎」的 吴國專利申請案09/880,906號，其以引用的方式併入本文中 。模製的A學封裝體包含—成像/解碼器積體電路(ic”2( -17- 〇i) 1227447 、照射/瞄準發央-4τ r m 'n- 1 ” (LEDs) 130、成像透鏡 i4〇及照射 / 如準透鏡1 5 0。依攄太政πη ^ , 體電路12 Λ勺較佳實施例，成像/解碼器積 製迭、S習知的互補式金氧半導體（CMOS)技術而 =二路，Λ像/解碼器積體電路12。可以包括具有相關 馬屯路《電荷镇合裝置成像機。 收=時’成像/解碼器積體電路120經由成像透鏡14〇接 :::。為了幫助解碼目標影像，照射發光二極 射/瞒準透鏡150,將光投射於目標影像 、.路的適當視野中之目標影像的位置係借助 於使用照射/瞄準發 - 炉与符 Λ先一極組130，將一瞄準圖案投射於目 ,产隹上。照射/瞄準發光二極體經由照射/瞄準透鏡150 机 π〜像。可以認知，照射/瞒準透鏡150可以 俾使來自照射/瞄準發光二極體的光以任何習知 • 、π圖案散射於目標影像上。 έ成2系統的體積係藉由將成像/解碼器積體電路120之 =j益陣列的像素寬度或間距定標而定標。可以認知，像 素度或間距意指在一影像感測器上之影像元件—即，像 :、广間的間隔。當像素寬度或間距減小時，焦距減小， 、隹持可比擬的视野。如果孔徑的尺寸保持常數，則每像 '、收集相同數量的光，且成像機敏感度無損失。如果孔徑 勺^小不限制成像機的大小，則在2D成像系、统中，三尺 寸王部皆由像素的定標因子定標。在1D成像系統中，二 尺寸由像素的定標因子定標。 成像引擎設計成為就每一像素，提供類似的焦點深度及 -18- (12) 1227447 類似的光通過量。此導致犧牲像素動態範園與像素量子效 率。像素動態範圍的效應係一階’但是對於諸如條Z成$ 的應用而言，動態範圍不很重要。對於相當士 两大的像素而言 ’例如，大於5又，像素量子效率的效應係二階。 可以認知，一光學系統自一點光源收集的光係由方程 表示： ^aperture π s ^ 在此方程式中，Aaperture係孔徑的面積’ s係與光源的距 離。藉由在單一像素的瞬時視野積分，則像素收集的光之 數量由方程式代表：Among them: Figures 1A and 1B show each one individually—Miniature into a silly baby Figure 2A-2C shows another individual—Top and side views of a similar machine; Micro Type 1 Chengjun n = Figure 3 shows another miniature imaging machine · machine Top, front, and side views Figure 4 shows the electrical elements of a micro-imaging machine "Please note-the working range increased into :: machine; Figure 6A shows a traditional light-emitting diode; Figure 6B shows a can be used for this Hair: the glow of light .. Figure_ shows another hair that can be used in the present invention: -II. Luminescent diode; request-semiconductor device according to the invention. j In the following description, 'for the purpose of explanation and not limitation, Selang' is provided for a complete understanding of the present invention. However, it is special-to understand that the present invention can be deviated from: the skill can be implemented. In other cases, the methods known to everyone: to save the detailed description of the method, so as not to obscure the description of the present invention. 5 and Circuits Figure 1B shows a top view of a miniature imaging machine and the imaging machine is incorporated into a molded optical package " 0. Wu Guo Patent Application No. 09 / 880,906 for the purpose of doing so and the technical disclosure in the optical package of the imaging system and the tracing engine based on linear detection in the application of ^ # filed on June 15, 2001 by Mazz et al. , Which is incorporated herein by reference. The molded A-ology package contains—imaging / decoder integrated circuit (ic ”2 (-17- 〇i) 1227447, irradiation / aiming hair center-4τ rm 'n-1” (LEDs) 130, imaging lens i4 〇 and irradiation / such as quasi-lens 150. In accordance with the preferred embodiment of π ^ ^, body circuit 12 Λ spoon, imaging / decoder integration, S conventional complementary metal-oxide-semiconductor (CMOS) technology and = Two-way, Λ image / decoder integrated circuit 12. It may include an imaging machine with a related Matunlu "charge ballasting device. Receiving time" imaging / decoder integrated circuit 120 is connected via the imaging lens 14 ::: In order to help decode the target image, the light-emitting diode / concealed lens 150 is irradiated, and the light is projected on the target image and the position of the target image in the appropriate field of view. A polar group 130 projects an aiming pattern on the eye and the eye. The irradiated / aimed light-emitting diode passes through the irradiated / aimed lens 150 to the image. It can be recognized that the irradiated / hidden lens 150 can cause the The light aimed at the light-emitting diode is scattered on the target image in any known •, π pattern. Έ 成 2 The volume of the system is calibrated by scaling the pixel width or pitch of the imaging / decoder integrated circuit 120 = j benefit array. It can be recognized that the pixel degree or pitch refers to the image element on an image sensor — That is, the interval between images: and wide. When the pixel width or pitch decreases, the focal length decreases, and the field of view is comparable. If the size of the aperture remains constant, the same amount of light is collected for each image, and There is no loss in the sensitivity of the imaging machine. If the aperture is small and does not limit the size of the imaging machine, in the 2D imaging system and system, the three-dimensional king is all calibrated by the pixel's calibration factor. In the 1D imaging system, the two dimensions are determined by Pixel scaling factor. The imaging engine is designed to provide similar depth of focus and -18- (12) 1227447 for each pixel. This results in sacrificing pixel dynamic range and pixel quantum efficiency. Pixel dynamics The effect of range is first order, but for applications such as Z to $, dynamic range is not very important. For pixels that are quite equal to two large, for example, greater than 5 and the effect of pixel quantum efficiency is second It can be recognized that the light system collected by an optical system from a point light source is represented by the equation: ^ aperture π s ^ In this equation, the area of the aperture of the Aaperture system is the distance from the light source. By integrating the instantaneous field of view in a single pixel , The amount of light collected by the pixel is represented by the equation:
Aaperture HS：Aaperture HS:
Apixeipov 當一成像系統的像素間距或寬度減小時，孔 /.A ^ (^aperture) 的面積及像素的瞬時視野（a——可以保持常數，且維持 焦點深度。此確保在物件空間t，當感測器尺寸減小時， 所有事物-即，孔徑尺寸、公稱隹g、# 了 A %…、距每—像素的視野及 坪時視野-係相同。於是’成像引擎的尺寸可以定炉，對 於調碼讀取性能實際上沒有衝擊。 517 鑑於以上的討論，圖1八與16繪示的微型成像機且有一 具備4微米間距及512像素的互補式金氧半導體侦測器陣 歹|卜此導致約2毫米之小而有利的偵測器長度。系統的焦 距約為3毫米。因此，圖以㈣繪示的掃描引擎的總尺寸 可以在5x3x2.25立方毫米的位階。 像素寬度或間距的實際限制約為3微米。在系統中， 藉由使二或更多列像去$ 4n # @ . ' ^』诼素互相偏置，例如，交錯，可以使偵 -19-Apixeipov When the pixel pitch or width of an imaging system decreases, the area of the hole / .A ^ (^ aperture) and the instantaneous field of view of the pixel (a-can be kept constant and the depth of focus is maintained. This ensures that in the object space t, when When the sensor size is reduced, everything-namely, the aperture size, nominal 隹 g, #% A ..., the field of view from each pixel and the field of view-are the same. So 'the size of the imaging engine can be fixed, for In fact, the code reading performance has no impact. 517 In view of the above discussion, the miniature imaging machine shown in Figures 18 and 16 has a complementary metal oxide semiconductor detector array with a 4 micron pitch and 512 pixels. This results in a small and favorable detector length of about 2 mm. The focal length of the system is about 3 mm. Therefore, the total size of the scanning engine shown in the figure can be in the order of 5x3x2.25 cubic millimeters. Pixel width or pitch The practical limit is about 3 microns. In the system, by offsetting two or more columns to $ 4n # @. '^ 』Primes are offset from each other, for example, interleaving can make the detection -19-
1227447 (13) 測器足印（f00tPrint)進一步減至最小。例如，5〇〇像素而間 距為3微米的陣列之長度係1.5亳米。藉由將陣列伟置成為 偏置半像素之二相鄰列’則像素寬度或間距維持為3微米 ，但是偵測器陣列所得的長度係〇·75毫米。因為陣列偏置 半像素，所以像素值可以結合，以獲得相當於1.5微米像素 的解析度。像素寬度或間距維持在用於吸收光子之合理的 位準’但疋偵測器足印及系統的總體積可能戲劇性減小。1227447 (13) The footprint of the device (f00tPrint) is further reduced to a minimum. For example, an array of 500 pixels with a spacing of 3 microns is 1.5 mm in length. By setting the array as two adjacent columns of offset half pixels, the pixel width or pitch is maintained at 3 microns, but the length obtained by the detector array is 0.75 mm. Because the array is offset by half a pixel, the pixel values can be combined to achieve a resolution equivalent to 1.5 micron pixels. The pixel width or pitch is maintained at a reasonable level for absorbing photons' but the total footprint of the detector footprint and the system may decrease dramatically.
成像偵測器陣列、讀出電子器材、類比至數位轉換器及 解碼邏輯可以全部整合成為單一晶片。層像/解碼晶片安 装於一具有二發光二極體晶粒的載體或一小雷射上。載體 吁以係FR4基材，係一種工業上認可的有機基材，且含有 /導線框架或焊料塊’用於接合至較大的電路板。載體由 /模製塑膠片-其内模製有光學表面-遮蓋。模製塑膠 係光學品質，且可以忍受在自動化電路板組合所遭到的 度。裝置係完整的掃瞄器，包含光_機械與電子器材， 可以如同表面安裝的積體電路而處理，且與再流動焊接The imaging detector array, readout electronics, analog-to-digital converter and decoding logic can all be integrated into a single chip. The layer image / decoding chip is mounted on a carrier with two light emitting diode grains or a small laser. The carrier is an FR4 substrate, which is an industrially recognized organic substrate, and contains / lead frames or solder bumps' for bonding to larger circuit boards. The carrier is covered by a / moulded plastic sheet with an optical surface molded therein. Molded plastic is of optical quality and can tolerate the levels encountered in automated circuit board assembly. The device is a complete scanner, including optical, mechanical and electronic equipment, which can be treated like a surface-mounted integrated circuit and soldered to reflow
術相容。® 1A與1B所示的裝置係完整的成像機，其可术 compatible. ® The devices shown in 1A and 1B are complete imagers.
只藉由焊料連結而機械式接合至電路板。因此，圖1A 1B所示的微型成像機不需要螺絲咬 T 4任何類似的機械支 ，於是減小設有此成像引擎之裝罢^ <衮置的尺寸與複雜彳生。 圖2A-2C個別繪示另一微型成後 吸像機的頂、前及側祝圖 圖2A-2C繪示的微型成像機具有犯τ 育很小的形式因子，jL能 以很小的人工照射或不需要人工防α a射而操作，以用於很 功率的操作。微型成像機包含成 篆機外殼2 1 〇，其 < 以 -20、 (14)1227447Mechanically bonded to the circuit board by solder bonding only. Therefore, the miniature imaging machine shown in Figs. 1A and 1B does not need any similar mechanical support of the screw bit T4, so the size and complexity of the installation of the imaging engine are reduced. Figures 2A-2C individually show the top, front and side of another miniature rear camera. Figure 2A-2C shows the miniature imaging machine with a small form factor, which can be reduced by a small amount of labor. Irradiation or operation without artificial anti-α a radiation for very high power operation. The micro-imager includes a housing 2 1 0, which < starts with -20, (14) 1227447
專精於此 材料製造 一可用的 成像機晶 230上。成 殼210中。 機晶片封 使成像機 裝置-例 為了達 提供發光 合成為一 的話-可 ’為了達 尺寸可增 藉由使照 減小功率 達成成 式可以利 應成像機 的量化位 捉之影像 用於增加 很小。此：Specializing in this material manufacture a usable imager crystal 230. Into the shell 210. The chip seal enables the imager device-for example, to provide luminous synthesis as one-can be increased in order to achieve the size can be achieved by reducing the power of the photo to achieve a formula that can be used to respond to the imager's quantization capture image for increasing the small. this:
,y ^ V JkU /SQ 。在成像機外殼21〇内部，成像機晶片22〇使用2 黏合與安裝技術安裝在一成像機板23〇。此外， 片220可以使用板上晶片技術安裝在成像機板 ^像機晶片220配置在透鏡240正後方的成像機外 透鏡240可以由任何適當的透明材料製造。成像 閉在一黑室25〇中，其形成於成像機外殼2 1 〇中， 晶片220能夠操作而不需要外密封，其簡化主機 如，照相機、終端機或微電腦—的設計。 成成像機晶片220所捕捉之景象中的對比，可以 二極體26(^發光二極體260可以係離散的，或整 陣列。用於使光分散的其他光學器材—如果需要 以安置於成像機外殼210中，以照射景象。或者 成成像機晶片220所捕捉之景象的對比，孔徑的 加。孔徑的尺寸增加將導致工作範圍減小，彳=是 射一目標影像的需求減至最小及/或消除，可以 的使用。 像機晶片220所捕捉之景象的對比之其他替代方 用具有一增益的低雜訊成像機，或利用一對數響 。如果成像機的雜訊下限低於類比至數位轉換器 準，則類比信號可以放大，以增加小量的光所捕 的對比。一非線性轉移-諸如對數的轉移-可以 影像的黑部分之間的對比，而對於亮部分的影響 小，用於達成對比的上述技術中之任何技術可以 •21-, y ^ V JkU / SQ. Inside the imager housing 21o, the imager wafer 22o is mounted on an imager board 23o using 2 bonding and mounting techniques. In addition, the sheet 220 may be mounted on the imager board using on-chip technology. The imager wafer 220 is disposed outside the imager immediately behind the lens 240. The lens 240 may be made of any suitable transparent material. The imaging is enclosed in a black room 25, which is formed in the imager housing 21, and the wafer 220 can be operated without the need for an external seal, which simplifies the design of a host such as a camera, a terminal, or a microcomputer. The contrast in the scene captured by the imager wafer 220 can be a diode 26 (the light emitting diode 260 can be a discrete or an entire array. Other optical equipment used to disperse the light-if needed to be placed in the imaging The camera housing 210 is used to illuminate the scene. Or the contrast of the scene captured by the imaging machine wafer 220 is increased by the increase of the aperture. The increase in the size of the aperture will reduce the working range. Can be used. Can be used. Other alternatives to the contrast of the scene captured by the camera chip 220 are low noise imagers with a gain, or use a logarithmic response. If the noise limit of the imager is lower than the analog to The digital converter is accurate, and the analog signal can be amplified to increase the contrast captured by a small amount of light. A non-linear transfer-such as a logarithmic transfer-can contrast the black parts of the image, and has little effect on the bright parts. Any of the above techniques used for comparison can
1227447 ⑼ 結 合 9 以改進成像機的響應。自動增益控制 可以用於 達 成 寬 的 景 象内動態範圍。 應 該 知道’圖2A-C繪示的成像機可以從 圖所纟會示 者 進 一 步 修 改。注意，透鏡240並非基本元件且， 可以省略 ，及/ 或 其 他 光學元件可以一起使用或取代透鏡24〇。例如 光 學 外 殼 可以含有一或更多鏡，以將光引導至 成像機晶 片 上 幫 助 改進景象中的對比。此外，光學外殼 可以含有 _ — 稜 鏡 或 其 他衍射元件，以將光引導至成像機晶片22〇上 〇 再 者 1 成 像機可以含有一馬達，以插入一清晰 的塑膠或 玻 璃 片 於 透 鏡與成像機之間的光學路徑，其導致 將透鏡聚 焦 於 二 不 同 的位置。為了減少成像機外殼與透鏡的成本， 這 些 元 件 可 以由模製塑膠製造。此外，一用於缚 模的螢光 幕 可 以 形 成 黑室與透鏡的孔徑。 因 此 ，圖2A-2C繪示的微型成像機可以係 小的形式 因 子 1 例 如 ，SE900形式因子，最大尺寸約為2〇 ( 5x14.2x11.4 立 方 毫 米 (0·811χ0·559χ0·449吋），導致 3·3立方公： 今（〇·20立方对） 的 成 像 機體積。SE900形式因子係在成像機 工業中用 於 製 造 成 像 裝置的形式因子。成像機含有光學及電子器相 其 足 以 產 生一送往所連接的微電腦或顯示器之信號流， 係 類 比 或 數 位式。成像機晶片2 2 0的成像機可以 係電荷镇 合 裝 置 或 互 補式金氧半導體。 成 圖 3繪示另一微型成像機。圖3繪示的微型 成像機包 含 像 機 外殼3 1 0。成像機外殼3丨〇内部係一接 合至印刷 電 路 板 30的影像感測器320。影像感測器32〇可 以係互補 式 金 -22- 12274471227447 合 Combine 9 to improve the response of the imager. Automatic gain control can be used to achieve a wide dynamic range within a scene. It should be known that the imaging machine shown in Figs. 2A-C can be further modified from those shown in the figure. Note that the lens 240 is not a basic element and may be omitted, and / or other optical elements may be used together or instead of the lens 24. For example, the optical envelope may contain one or more mirrors to direct light onto the imager's wafer to help improve contrast in the scene. In addition, the optical housing may contain 稜鏡-稜鏡 or other diffractive elements to direct light to the imager wafer 220. Furthermore, the imager may include a motor to insert a clear plastic or glass sheet into the lens and imaging The optical path between the cameras, which results in focusing the lens to two different positions. To reduce the cost of the imager housing and lenses, these components can be made of molded plastic. In addition, a fluorescent screen for mode binding can form the aperture of the black room and lens. Therefore, the miniature imaging machine shown in Figs. 2A-2C can be a small form factor 1. For example, the SE900 form factor has a maximum size of about 20 (5x14.2x11.4 cubic millimeters (0 · 811x0 · 559x0 · 449 inches) Resulting in 3.3 cubic meters: the volume of the imager today (0 · 20 cubic pairs). The SE900 form factor is a form factor used in the imager industry to manufacture imaging devices. The imager contains optics and electronics which are sufficient to produce a The signal flow sent to the connected microcomputer or display is analog or digital. The imager of the imager chip 2 2 0 can be a charge ballast device or a complementary metal oxide semiconductor. Figure 3 shows another miniature imager The miniature imager shown in FIG. 3 includes a camera housing 3 10. The imager housing 3 is an image sensor 320 that is bonded to the printed circuit board 30. The image sensor 32 can be a complementary metal -22- 1227447
氧半導體影像感測器。印刷電路板設在成像機外殼3 1 〇的 附近或後方。一孔徑34〇併入成像機外殼3丨〇，以允許影像 感測器3 2 0捕捉景象。成像機外殼3丨〇的前面包含複數發光 二極體3 5 0，用於景象照射及用於瞄準。可以認知，在成 像機外殼前面之發光二極體3 5 〇的佈線圖可以係任何習知 的設計，其企圖照射於一目標，及幫助使用者瞄準一設有 圖3之成像機的裝置。圖3之成像機的尺寸約為 20·6χ14·2χ11·4立方毫米（寬度/深度/高度），導致成像機的體 積約為3 ·3 方公分（〇·2〇立方吋）。當然，較小的尺寸係可 能的，例如，如果使用數目較少的像素或較小的像素。 圖4繪示一微型成像機的電子器材。圖4的成像機包含一 2D區域感測器410，其係經由時脈驅動器及電荷泵42〇而 控制。時脈驅動器及電荷泵42〇係依據從計時產生器43〇 接收的信號而控制。一由2D區域感測器4 1 0捕捉的影像提 供至相關的雙取樣區塊（CDS) 440。因為像素並非總是在它 們重置時返回相同的值，所以相關的雙取樣用於移除未返 回它們的正常重置值之像素所引起的偏置。因此，相關的 雙取樣涉及捕捉像素之二值。第一值係具有所欲的影像一 例如，條碼-之像素的值，第二值係重置以後之像素的值 。比較每一像素之二值’以移除尚未返回它們的正常重置 值之像素所引起的偏置。在執行相關的雙取樣以後，影像 通過一弱交流耦合’傳送到相關的雙取樣影像之區塊直流 内容。在弱交流耦合以後，一自動增益控制（AGC) 442將信 號放大，該信號接著提供至類比至數位轉換器444。依據 -23- 1227447 (17)Oxygen semiconductor image sensor. The printed circuit board is provided near or behind the imager housing 3 1 0. An aperture of 34 ° is incorporated into the imager housing 3o0 to allow the image sensor 320 to capture the scene. The front of the imager housing 3 丨 0 contains a plurality of light emitting diodes 3 50 for illumination of the scene and for aiming. It can be appreciated that the wiring diagram of the light emitting diode 350 in front of the imager housing may be of any conventional design, which attempts to illuminate a target and help the user aim at a device provided with the imager of FIG. 3. The size of the imager in Figure 3 is approximately 20 · 6 × 14 · 2 × 11 · 4 cubic millimeters (width / depth / height), resulting in an imager with a volume of approximately 3 · 3 cm² (0 · 20 cubic inches). Of course, smaller sizes are possible, for example, if a smaller number of pixels or smaller pixels are used. FIG. 4 illustrates electronic equipment of a miniature imaging machine. The imager of FIG. 4 includes a 2D area sensor 410, which is controlled by a clock driver and a charge pump 42. The clock driver and the charge pump 42 are controlled based on the signals received from the timing generator 43. An image captured by the 2D area sensor 410 is provided to a related double sampling block (CDS) 440. Because pixels do not always return the same value when they reset, correlated double sampling is used to remove offsets caused by pixels that do not return their normal reset values. Therefore, correlated double sampling involves capturing two values of pixels. The first value is the pixel value of the desired image-for example, the barcode-and the second value is the pixel value after reset. Compare the two values of each pixel 'to remove the offset caused by pixels that have not returned their normal reset values. After performing the relevant double sampling, the image is transmitted to the block DC content of the relevant double sampling image through a weak AC coupling '. After weak AC coupling, an automatic gain control (AGC) 442 amplifies the signal, which is then provided to an analog-to-digital converter 444. Basis -23- 1227447 (17)
本發明之一較佳實施例，類比至數位轉換器444係9位元類 比至數位轉換器。 . 數位資料係由類比至數位轉換器444提供至膠合（ghie) 邏輯場可程式閘陣列（FPGA)區塊450。膠合邏輯/場可程式 閘陣列450將數位資料封包，以致於它可由微處理器46〇 讀取且與微處理器460連接，以提供全部照相機控制。微 處理器460包含埋放在與微處理器相同的積體電路上之動 態隨機存取記憶體，其使系統的速率增加，且可以減小所 得的成像機 < 尺寸與成本。微處理器46〇經由一外部資料 與位址匯流排，在儲存於快閃記憶體47〇中的程式控制下 操作。 目標影像可以使用照射模組475照射，照射模組475在本 發明（-較佳實施例中係由65G毫微米紅色發光二極體提 供。發光二極體配置成$ < 4焊使均勻照射於目標影像。為了In a preferred embodiment of the present invention, the analog-to-digital converter 444 is a 9-bit analog-to-digital converter. The digital data is provided by the analog-to-digital converter 444 to the ghie logic field programmable gate array (FPGA) block 450. Glue logic / field programmable gate array 450 encapsulates digital data so that it can be read by microprocessor 46 and connected to microprocessor 460 to provide full camera control. The microprocessor 460 includes dynamic random access memory embedded in the same integrated circuit as the microprocessor, which increases the speed of the system and can reduce the size and cost of the resulting imager. The microprocessor 46o operates under a program control stored in the flash memory 47o via an external data and address bus. The target image can be irradiated with the irradiation module 475, which is provided by the present invention (-in the preferred embodiment, a 65G nanometer red light-emitting diode. The light-emitting diode is configured as $ < 4 for uniform irradiation To the target image.
幫助成像機的使用者，瞄M 『田準杈組480可以用於提供唯一 瞒準圖案。瞒準模组、 千误、且480可以包含一雷射二極體及一 光學元件（DOE)，以提供咍 μ ,、往门a 杈供隹一的瞄準圖案。設有微型成 機的主機裝置及微型成僮媸、时μ、 ^ 主成像機足間的叉互作用係使用 介面490而提供。因為.泠％ ^ ^ 為此處說明的成像機係微型，即， 式因子小，所以主機奘 办 置可以係可攜式無線電電話（ 電話）、個人數位助理卬ηΔ、# ^ Τ % (PDA)寺。使用配合圖4說明的 ，可以完成一微型成傻換 件 成像機，其能夠以SE1223形式因 〇 SE1223形式因子係力士你 炎造 “在成像機工業中用於製造成像裝 形式因子。 衣置的 -24-To help the user of the imaging machine, the M ^ Tian Zhuan Group 480 can be used to provide a unique concealed pattern. The concealment module, error, and 480 can include a laser diode and an optical element (DOE) to provide a single aiming pattern for the μ μ and the gate a. A host device with a miniature camera and a miniature fork, a time μ, and a fork interaction between the main imaging machine feet are provided using the interface 490. Because %% ^ ^ is the miniature of the imaging machine described here, that is, the factor is small, the host device can be a portable radiotelephone (telephone), personal digital assistant 卬 ΔΔ, # ^% (PDA ) Temple. Using the description with Fig. 4, a miniature dumb replacement imaging machine can be completed, which can be in the form of SE1223 due to the SE1223 form factor, which is used in the imaging machine industry to manufacture form factors for imaging equipment. -twenty four-
1227447 (18) 一成像機的工作範圍可以藉由以一不垂直於聚焦透鏡 光學轴線的角安置影像感剛器之一平面而增加。圖$纟会示 一工作範圍增加之成像機。特別地，成像機包含一影像感 測器510及一聚焦透鏡520。影像感測器包括複數水平列之 面對透鏡520的像素。雖然未繪示於圖5，但是可以認知， 此處繪示的成像機可以具有類似於針對圖1 _4討論於上者 的額外元件。 如圖5所示，一平行於成像機5 i 〇之像素前方的平面相對 於聚焦透鏡5 2 0的光學軸線而以一角0傾斜。因此，例如 ’成像機5 1 0之一水平像素列PR丨聚焦於第一空間平面工， ，另一水平像素列PR2聚焦於與第一空間平面丨，不同的第 —2間平面2 *。藉由相對於聚焦透鏡5 2 〇的光學軸線〇 a， 以一非垂直角0安置成像機51〇之影像感測器，則成像機 能夠藉由詢問聚焦於不同空間平面的各水平列像素，讀取 及解碼與成像機相隔不同距離的目標影像。讀取及解碼與 成像機相隔不同距離的目標影像之能力減小使用者必須 人工調整成像機與目標影像之間的距離以成功讀取及解 碼目標影像之挫折。繪示於圖5的成像機可用於以人工或 自動模式讀取一維或二維條碼。 圖6A繪示一傳統發光二極體的頂視圖。發光二極體6〇〇 包含一黏合墊610,電力經由彼而供應至發光二極體6〇〇 。傳統發光二極體—諸如繪示於圖6八者係正方形，尺寸 2為350微米乘350微米。如圖6八所示’黏合墊61〇典型上 t置於發光二極體6〇〇的中間。黏合墊6ι〇之如此安置阻礙 -25- 1227447 (19)1227447 (18) The working range of an imager can be increased by placing a plane of the image sensor at an angle that is not perpendicular to the optical axis of the focusing lens. Figure $ 纟 shows an imager with increased working range. Specifically, the imager includes an image sensor 510 and a focusing lens 520. The image sensor includes a plurality of horizontal rows of pixels facing the lens 520. Although not shown in FIG. 5, it is recognized that the imager shown here may have additional elements similar to those discussed above with respect to FIGS. 1-4. As shown in FIG. 5, a plane parallel to the front of the pixel of the imager 5 i 0 is inclined at an angle 0 with respect to the optical axis of the focusing lens 5 2 0. Therefore, for example, one horizontal pixel column PR 丨 of the imager 5 1 0 is focused on the first spatial plane, and the other horizontal pixel column PR2 is focused on the second 2nd plane 2 * different from the first spatial plane. By arranging the image sensor of the imager 510 at a non-vertical angle 0 with respect to the optical axis 0a of the focusing lens 5 2 0, the imager can focus on each horizontal row of pixels focused on different spatial planes, Read and decode target images at different distances from the imager. The ability to read and decode target images at different distances from the imager reduces the user's frustration of having to manually adjust the distance between the imager and the target image to successfully read and decode the target image. The imager shown in Figure 5 can be used to read one- or two-dimensional bar codes in manual or automatic mode. FIG. 6A illustrates a top view of a conventional light emitting diode. The light emitting diode 600 includes an adhesive pad 610 through which power is supplied to the light emitting diode 600. Traditional light-emitting diodes—such as those shown in Figure 6 are squares with dimensions of 350 microns by 350 microns. As shown in FIG. 6A, the 'adhesive pad 61o' is typically placed in the middle of the light emitting diode 600. The placement of the adhesive pad 6ι〇 hinders -25- 1227447 (19)
約30%之自發光二極體6〇〇射出的光功率。此外，如前述 ，傳統發光一極體產生比雷射少的聚焦光，其結果係線厚 度增加的投射光。 圖6B-6E繪示新穎的發光二極體之三不同實施例。大體 上，新穎的發光二極體具有一晶粒面積，其幾乎與傳統發 光一極體的晶粒面積相同，以維持與傳統發光二極體實質 上相同的射出功率。然而，新穎的發光二極體晶粒在聚焦 方向-即，產生線厚度的方向-係薄的，而在另一方向係 長的。現在參考圖6B，發光二極體615具有一正方形部分 62 0及一長方形部分625。更一般地，及另言之，新穎的發 光二極體具有至少一具備一黏合墊的主要部分及一自主 要部分延伸的長形部分。主要部分不需要係正方形，且長 形部分不需要係矩形；例如，圖6B的實施例中之陶角可 以係圓形。再參考圖6B，正方形部分620具有一黏合藝63〇 。如圖6B所示，發光二極體620具有〇\乘〇7的尺寸，其中 Dy係長形部分625的寬度。因為驅動發光二極體的電壓係 經由黏合墊而供應，所以當發光二極體部分與黏合塾的距 離越遠時，自發光二極體射出之光功率的數量減小。 此 ，在圖6B中，對於越靠近黏合墊630右方的部分而今，自 長形部分625的部分射出之光功率的數量減小。 圖6 C繪示另一新穎的發光二極體之頂視圖。特別地 發光二極體635具有由一矩形部分642連結的正方形部八 640及647。正方形部分640具有一位於其上的黏合载 土· Ό 外 3 ，正方形部分647具有一位於其上的黏合墊65〇。藉由安置 •26-About 30% of the light power emitted from the light emitting diode 600. In addition, as mentioned above, conventional light-emitting monopoles produce less focused light than lasers, with the result that the projected light has an increased line thickness. 6B-6E illustrate three different embodiments of the novel light emitting diode. In general, the novel light-emitting diode has a grain area that is almost the same as that of a conventional light-emitting diode to maintain substantially the same output power as a conventional light-emitting diode. However, the novel light-emitting diode grains are thin in the focusing direction-i.e., the direction in which the line thickness is produced-and long in the other direction. Referring now to FIG. 6B, the light emitting diode 615 has a square portion 620 and a rectangular portion 625. More generally, and in other words, the novel light emitting diode has at least one main portion provided with an adhesive pad and an elongated portion extending from a main portion. The main part does not need to be square, and the long part does not need to be rectangular; for example, the ceramic angle in the embodiment of Fig. 6B may be round. Referring again to FIG. 6B, the square portion 620 has an adhesive technique 63. As shown in FIG. 6B, the light-emitting diode 620 has a size of 0 ×× 7, where Dy is the width of the elongated portion 625. Because the voltage for driving the light emitting diode is supplied through the bonding pad, the farther the distance between the light emitting diode part and the bonding pad, the smaller the amount of light power emitted from the light emitting diode. Therefore, in FIG. 6B, for the portion closer to the right of the adhesive pad 630, the amount of optical power emitted from the portion of the elongated portion 625 is reduced. FIG. 6C illustrates a top view of another novel light emitting diode. In particular, the light emitting diode 635 has square portions 640 and 647 connected by a rectangular portion 642. The square portion 640 has an adhesive support soil Ό outside 3 on it, and the square portion 647 has an adhesive pad 65 on it. With Placement
1227447 (20) 黏合塾6 4 5與6 5 0於矩形部分6 4 2的每一側’則與圖6 B纟會示 的發光二極體615相比，自矩形部分射出之光功率的數量 更均勻。 圖6 D繪示又一新穎的發光二極體之頂視圖。一黏合墊 670安置於發光二極體655的矩形部分660附近。 因此，黏合墊6 7 0不阻礙自長形部分射出的任何光。此 外，圖6 C的黏合墊之安置可能導致在矩形部分中心的光 之數量減小，而圖6D的黏合墊670之安置確保自發光二極 體晶粒6 5 5的矩形部分6 6 0中心射出的光更均勻分佈。 圖6E繪示再一新穎的發光二極體之頂視圖。發光二極 體晶粒6 7 5之一矩形部分6 8 0由一黏合墊6 8 5環繞於所有的 侧部。藉由以黏合墊6 8 5環繞發光二極體晶粒6 7 5之矩形部 分6 80，與圖6B - 6D繪示的發光二極體晶粒相比，自發光 二極體晶粒675的整個矩形部分68〇射出的光達成均勻的 分佈。依據本發明之一實施例，圖6]3_6]〇的Dy可以小於或 等於50微米。為了維持與傳統發光二極體相同的射出功率 ，圖6B-6E的Dx選擇為俾使發光二極體的晶粒面積與傳統 發光一極體的晶粒面積相同。 圖7繪示一依據本發明用於成像光學碼符號-特別是條 碼符號-的半導體裝置之高度示意圖。此半導體裝置較佳 為當作使一條碼讀取機的視野成像之感測器，且可與上述 某些或所有元件一諸如微型成像機中的元件一及上述發 光二極體一起使用。 Μα 半導體裝置1包括的傻夺9 丁 t4；. J 1豕京2不多於1024。較佳地，像素的 -27-1227447 (20) Bonding 塾 6 4 5 and 6 50 0 on each side of the rectangular portion 6 4 2 ′ compared with the light emitting diode 615 shown in FIG. 6B 纟, the amount of light power emitted from the rectangular portion More uniform. FIG. 6D illustrates a top view of another novel light emitting diode. An adhesive pad 670 is disposed near the rectangular portion 660 of the light emitting diode 655. Therefore, the adhesive pad 670 does not hinder any light emitted from the elongated portion. In addition, the placement of the adhesive pad of FIG. 6C may result in a reduction in the amount of light in the center of the rectangular portion, and the placement of the adhesive pad 670 of FIG. 6D ensures the center of the rectangular portion 6 6 0 of the self-emitting diode die 6 5 5 The emitted light is more evenly distributed. FIG. 6E illustrates a top view of yet another novel light emitting diode. One of the rectangular portions 6 8 0 of the light emitting diode crystals 6 7 5 is surrounded by an adhesive pad 6 8 5 on all sides. By surrounding the rectangular portion 6 80 of the light emitting diode grain 6 7 5 with an adhesive pad 6 8 5, compared with the light emitting diode grain shown in FIGS. 6B-6D, The light emitted from the entire rectangular portion 68 ° achieves a uniform distribution. According to an embodiment of the present invention, Dy of FIG. 6] 3-6] 0 may be less than or equal to 50 microns. In order to maintain the same output power as the conventional light-emitting diode, Dx in FIGS. 6B-6E is selected so that the grain area of the light-emitting diode is the same as that of the conventional light-emitting diode. FIG. 7 is a schematic height view of a semiconductor device for imaging optical code symbols, especially bar code symbols, according to the present invention. This semiconductor device is preferably used as a sensor for imaging the field of view of a bar code reader, and can be used with some or all of the above components, such as the components in a miniature imager, and the above-mentioned light emitting diode. The Mα semiconductor device 1 includes 9 nd t4; J 1 豕 2 and not more than 1024. Preferably, the -27-
1227447 數目係在25 6與1024之間。一較佳實施例可以包括-例如 -512像素。像素2各具有一大於2比1的展弦比，及不大於4 微米且不小於2微米的短尺寸《雖然通常可以提供相對於 彼此以半像素交錯的像素列，如上述，但是目前較佳為將 像素配置於單列，如圖7所示。由圖7，顯然，像素的配置 係長的尺寸垂直於列’而列的形成係使像素的短尺寸相鄰 。多於2比1的展弦比對於碩取條碼符號的半導體裝置而言 將提供較優的結果，因為儘管半導體裝置之小尺寸，條碼 符號的條與中間的空間之區別可以更好。 上述此半導體裝置可以形成用於使一條碼讀取機的視 野成像之感測器。此感測器特別小，但是仍然能夠可靠地 使一條碼符號成像。因為本發明的單一半導體裝置足以使 一條碼符號成像，所以感測器（於是，條碼讀取機）可以# 常小，其特別適用於條碼謂取機的可攜式及/或微型應用°The number 1227447 is between 25 6 and 1024. A preferred embodiment may include-for example-512 pixels. Pixels 2 each have a aspect ratio of greater than 2 to 1, and a short size of no more than 4 microns and no less than 2 microns. "Although it is generally possible to provide pixel columns interleaved with each other in half pixels, as described above, it is currently preferred. To arrange the pixels in a single column, as shown in FIG. 7. From FIG. 7, it is clear that the arrangement of pixels has a length dimension perpendicular to the column ', and the formation of the column makes the short dimensions of the pixels adjacent to each other. A aspect ratio of more than 2 to 1 will provide better results for a semiconductor device that uses barcode symbols, because despite the small size of the semiconductor device, the difference between the bar of the barcode symbol and the space in the middle can be better. The semiconductor device described above can form a sensor for imaging the field of view of a bar code reader. This sensor is particularly small, but still reliably images a bar code symbol. Because the single semiconductor device of the present invention is sufficient to image a bar code symbol, the sensor (thus, the bar code reader) can be # often small, which is particularly suitable for portable and / or micro applications of bar code readers.
-28--28-
Claims (1)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US35380801P | 2001-10-26 | 2001-10-26 | |
| US10/118,562 US6811085B2 (en) | 2001-10-26 | 2002-04-09 | Miniature imager |
| US10/219,690 US6837431B2 (en) | 2002-04-09 | 2002-08-15 | Semiconductor device adapted for imaging bar code symbols |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWI227447B true TWI227447B (en) | 2005-02-01 |
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ID=27382186
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091124088A TWI227447B (en) | 2001-10-26 | 2002-10-18 | Semiconductor device adapted for imaging bar code symbols |
Country Status (6)
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|---|---|
| JP (1) | JP2003197888A (en) |
| CN (1) | CN100423017C (en) |
| DE (1) | DE10250163A1 (en) |
| FR (1) | FR2831712A1 (en) |
| GB (1) | GB2382446B (en) |
| TW (1) | TWI227447B (en) |
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| JP4254628B2 (en) * | 2004-06-21 | 2009-04-15 | 株式会社デンソーウェーブ | Optical information reader |
| JP2006074361A (en) * | 2004-09-01 | 2006-03-16 | Keyence Corp | Optical reader by cmos sensor and optical read control method |
| TWI382753B (en) * | 2007-12-17 | 2013-01-11 | Omnivision Tech Inc | Reflowable camera module with integrated flash |
| US8317104B2 (en) * | 2010-08-05 | 2012-11-27 | Hand Held Products, Inc. | Image engine with integrated circuit structure for indicia reading terminal |
| US9280693B2 (en) * | 2014-05-13 | 2016-03-08 | Hand Held Products, Inc. | Indicia-reader housing with an integrated optical structure |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4910401A (en) * | 1982-01-20 | 1990-03-20 | The Boeing Company | LWIR sensor system with improved clutter rejection |
| US5576529A (en) * | 1986-08-08 | 1996-11-19 | Norand Technology Corporation | Hand-held optically readable information set reader focus with operation over a range of distances |
| JPS6398147A (en) * | 1986-10-15 | 1988-04-28 | Toshiba Corp | Line solid state image sensor |
| LU87259A1 (en) * | 1988-06-27 | 1990-02-28 | Ceca Comm Europ Charbon Acier | METHOD AND DEVICE FOR PROCESSING ELECTRIC SIGNALS FROM ANALYSIS OF A LINE OF AN IMAGE |
| US5099317A (en) * | 1988-09-28 | 1992-03-24 | Kabushiki Kaisha Toshiba | Video camera apparatus using a plurality of imaging devices |
| US5814803A (en) * | 1994-12-23 | 1998-09-29 | Spectra-Physics Scanning Systems, Inc. | Image reader with multi-focus lens |
| US5602391A (en) * | 1995-02-23 | 1997-02-11 | Hughes Electronics | Quincunx sampling grid for staring array |
| US6166831A (en) * | 1997-12-15 | 2000-12-26 | Analog Devices, Inc. | Spatially offset, row interpolated image sensor |
| US6198577B1 (en) * | 1998-03-10 | 2001-03-06 | Glaxo Wellcome, Inc. | Doubly telecentric lens and imaging system for multiwell plates |
| US6176429B1 (en) * | 1998-07-17 | 2001-01-23 | Psc Scanning, Inc. | Optical reader with selectable processing characteristics for reading data in multiple formats |
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2002
- 2002-10-18 TW TW091124088A patent/TWI227447B/en not_active IP Right Cessation
- 2002-10-24 GB GB0224775A patent/GB2382446B/en not_active Expired - Fee Related
- 2002-10-25 FR FR0213400A patent/FR2831712A1/en active Pending
- 2002-10-25 CN CNB021469350A patent/CN100423017C/en not_active Expired - Fee Related
- 2002-10-28 DE DE10250163A patent/DE10250163A1/en not_active Withdrawn
- 2002-10-28 JP JP2002312659A patent/JP2003197888A/en active Pending
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| FR2831712A1 (en) | 2003-05-02 |
| CN1439996A (en) | 2003-09-03 |
| GB2382446A (en) | 2003-05-28 |
| GB2382446B (en) | 2006-03-01 |
| CN100423017C (en) | 2008-10-01 |
| GB0224775D0 (en) | 2002-12-04 |
| DE10250163A1 (en) | 2003-06-05 |
| JP2003197888A (en) | 2003-07-11 |
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