CN107818274A - The reflowable weldering decoder modules of stack PCB - Google Patents

The reflowable weldering decoder modules of stack PCB Download PDF

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Publication number
CN107818274A
CN107818274A CN201610823426.6A CN201610823426A CN107818274A CN 107818274 A CN107818274 A CN 107818274A CN 201610823426 A CN201610823426 A CN 201610823426A CN 107818274 A CN107818274 A CN 107818274A
Authority
CN
China
Prior art keywords
pcb
patent application
bottom side
smt
main pcb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610823426.6A
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Chinese (zh)
Inventor
C.冯
L.王
J.卢
J-M.皮奇
T.仙
E.C.布雷默
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hand Held Products Inc
Original Assignee
Hand Held Products Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hand Held Products Inc filed Critical Hand Held Products Inc
Priority to CN202310604279.3A priority Critical patent/CN116579354A/en
Priority to CN201610823426.6A priority patent/CN107818274A/en
Publication of CN107818274A publication Critical patent/CN107818274A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/0004—Hybrid readers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Abstract

The present invention relates to a kind of surface mounting technique for being used to mark reading device（SMT）Decoder component, it includes main printed circuit board（PCB）, processor chips and multiple reflowable weldering weld pads.The main PCB is the two-sided PCB for having top side and bottom side.The processor chips are located on the top side of the main PCB.The multiple reflowable weldering weld pad is located on the bottom side of the main PCB so that the decoder component is installed on surface.

Description

The reflowable weldering decoder modules of stack PCB
Technical field
The disclosure relates generally to mark reading device, and more particularly, to mark reading device and for using heap Stacked printed circuit board (PCB)（“PCB”）The method of reflowable weldering decoder module production mark reading device.
Background technology
In general, reading device is marked（Also referred to as scanner, laser scanner, cis, indicia reader, Mobile computer, terminal etc.）Generally read by printing or displayed information bearing mark（Also referred to as symbol, symbolism, bar Shape code etc.）The data of expression.Bar code（Such as, UPC code）Data are represented using thickness of lines pattern, and more complicated are translated Code system（Referred to as 2D matrix codes）Carry out storage information using complicated square pattern and arrangement.
It is one-dimensional（1D）Or linear optics barcode reader is characterised by, lines and space and/or lines and sky be present Between width in the case of, read along single axis encode data, read this in order to from along the single scanning of axis Class symbol.
Two dimension（2D）Or the image of bar code is focused on more pixel maps by area optical barcode reader using lens On picture sensor array, its imaging sensor battle array based on CMOS or based on CCD generally by converting optical signals into electric signal Row provide.
Conventional 1D and 2D indicia readers or bar code scanner/reader are known and with many different shapes and greatly It is small, as 1D the and/or 2D wireless hand-held bar code scanners for scan code.As those skilled in the art should be easy Understand, it is more reliable, less expensive and more compact, more preferable.So, hence it is evident that need or it is expected to produce more reliable, less expensive be made And/or greater compactness of indicia reader or bar code scanner.
Mark reading device generally includes imager and communicated with imager, can store the view data from imager Memory.In addition, including processor to be decoded to the view data in memory is captured and stored by imager.Place Reason device is operable to be decoded with being marked to the various forms of decodable codes represented in view data.These universal components and bag Any other various parts in reading device is marked are included generally via host system bus or printed circuit board (PCB)（PCB）Connection Together.
Conventional decoder module is generally integrated into host computer system PCB by flexible cable or board to board connector.May Additional machinery fastener is needed to fix the cable of decoder module or connector.It has been determined that these flexible cables and plate Connector is unreliable, because it is to mark the event in reading device when having found that these cables and/or connector become and disconnected Hinder source.In addition, these flexible cables and board to board connector space-consuming, and need foot on the inside of mark reading device Space is reached to include these parts and carry out required connect.
It is single-chip decoder for the flexible cable of decoder module and an alternative solution of board to board connector, as Application specific integrated circuit (ASIC) one chip solution.However, the cost of ASIC single-chip decoders is very high, and develops and set It is very long process to put.Lack another misgivings that flexibility is ASIC one chip solutions.
Therefore, it is necessary to a kind of raising reliability, relatively cheap be incorporated to and/or greater compactness of connecting decoder module Component.The disclosure is designed to solve at least one in these problems by providing the reflowable weldering decoder modules of stack PCB It is a little or whole.
The content of the invention
Therefore, in an aspect, the present invention includes a kind of surface mounting technique（SMT）Decoder component.SMT decoders Component can be used in mark reading device.SMT decoder components generally include main printed circuit board（PCB）, processor chips and Multiple reflowable weldering weld pads.Main PCB is the two-sided PCB for having top side and bottom side.Processor chips are located on the top of main PCB. So that decoder component is installed on surface on the edge for the bottom side that multiple reflowable weldering weld pads are located at the main PCB.
In the exemplary embodiment, SMT decoder components are included on the bottom side of the main PCB multiple reflowable Chamber between weldering weld pad on the periphery of the bottom side of the main PCB.
In selection example, chamber can be formed by the weld pad ring PCB with multiple reflowable weldering weld pads.Weld pad ring PCB can Be on front side with to the main PCB connector and on dorsal part have be used for it is described it is reflowable weld weld pad connection The two-sided ring PCB of part.In selection example, weld pad ring PCB can be the ring that 2 sides have connector（2 face ring PCB）, Or weld pad ring PCB can be the ring that all 4 sides have connector（4 face ring PCB）.
In other selection examples, chamber can be by least two side edges PCB shapes with multiple reflowable weldering weld pads Into.Side edges PCB can be on front side with to the main PCB connector and on dorsal part have be used for described in can The two-sided edge PCB of the connector of Reflow Soldering weld pad.
In a further exemplary embodiment, SMT decoder components may include other parts.These other parts can be located at institute State on the bottom side of main PCB in the chamber, and can be also located on the top side of the main PCB.These other parts It may include（But it is not limited to）Memory member, oscillator unit and/or passive component.For example, memory member can be（But no It is limited to）Dynamic random access memory（DRAM）Chip and/or flash memory dies.In selection example, chamber can have Close to the thickness of the highest part in other parts on the bottom side of the main PCB.
In a further exemplary embodiment, SMT decoder components may include top seal and/or lower seals.Top Portion's seal can be located at the SMT decoder components top on, have be configured to around the processor chips assembling Otch.Top seal can surround the top side that decoder module chip closes the main PCB.Lower seals can be described Between multiple reflowable weldering weld pads on the chamber of the SMT decoder components.Lower seals can close the PCB's It is any in other parts on the bottom side, including the bottom side of the PCB.The top seal and/or the bottom Portion's seal can be configured to provide heat transfer and/or structural defence to the SMT decoder components.
In a further exemplary embodiment, SMT decoder components can have the size with length, width and depth, its Size than the decoder processor chip with length, width and depth is big or small by about 20%.
On the other hand, the present invention includes a kind of mark reading device with SMT decoder modules.In general, mark Note reading device includes host computer system plate and is connected to the decoder module of the SMT assemblings of the host computer system plate.SMT decoders Component can be surface mounted to host computer system plate.
In the exemplary embodiment, mark reading device includes imaging subsystems and memory member.Imaging subsystems can It is connected to host computer system plate.Memory member can be located in SMT decoder components.Memory member can communicate with imaging subsystems And can storage table show one or more of the view data of light being incident on imaging subsystems frame.Processor Chip can be communicated with memory member by main PCB and can be with operable with least one in the frame of view data The decodable code mark of individual middle expression is decoded.
In selection example, mark reading device can be hand-held bar code scanner.
On the other hand, the disclosure includes a kind of surface mounting technique assembled for marking reading device（SMT）Decoding The method of device assembly.Methods described can generally include following steps：
Two-sided main printed circuit board is provided（PCB）, its with the top side for being configured to admission processing device chip and with by with Put the bottom side of multiple reflowable weldering weld pads for being surface mounted to host computer system plate；And
The processor chips are arranged on the top side of the main PCB.
In the exemplary embodiment, methods described can be further comprising the steps of：
On the bottom side of the main PCB chamber is formed between the multiple reflowable weldering weld pad；And
Other parts are arranged on the bottom side of the main PCB in the chamber.
It is used for the surface mounting technique for marking reading device in assembling（SMT）The method of decoder component it is another exemplary In embodiment, it may include following steps in the step of formation chamber on the bottom side of the main PCB：
The weld pad ring PCB with the multiple reflowable weldering weld pad is provided, wherein the weld pad ring PCB is that have on front side The extremely connector of the main PCB and the two-sided ring PCB with the connector for being used for the reflowable weldering weld pad on dorsal part；With And
The weld pad ring PCB is arranged on the bottom side of the main PCB, so as on the bottom side of the main PCB Form chamber；
It is used for the surface mounting technique for marking reading device in assembling（SMT）The another exemplary implementation of the method for decoder component In example, it may include following steps in the step of formation chamber on the bottom side of the main PCB：
At least two side edges PCB with the multiple reflowable weldering weld pad are provided, wherein the side edges PCB is Have with the connector to the main PCB on front side and on dorsal part and be used for the reflowable connector for welding weld pad Two-sided edge PCB；And
The side edges PCB is installed on the bottom side of the main PCB, so as in the bottom side of the main PCB Upper formation chamber.
It is used for the surface mounting technique for marking reading device in assembling（SMT）The method of decoder component it is another exemplary In embodiment, there is provided there is the step of weld pad ring PCB of multiple reflowable weldering weld pads may include deviateing offer at weld pad ring PCB Tab, wherein the step weld pad ring PCB being arranged on the bottom side of the main PCB comprises the following steps：
Weld pad ring PCB is picked up via tab；And
Weld pad ring PCB is placed on main PCB via tab；
In these embodiments, tab is attached between weld pad ring PCB and adjacent welding-pad ring PCB.
It is used for the surface mounting technique for marking reading device in assembling（SMT）The method of decoder component it is another exemplary In embodiment, the step that the weld pad ring PCB is arranged on the bottom side of the main PCB or side edges PCB installed Step on the bottom side of the main PCB comprises the following steps：
Main PCB is picked up, wherein processor chips are installed on top side, and any other part is installed on bottom side；And
Main PCB is placed on weld pad ring PCB or side edges PCB.
In selection example, it may include following steps：Using being configured to be fixed on the top side of the main PCB Lid to pick up the main PCB and to place it on weld pad ring PCB.
In other examples embodiment again, the surface mounting technique for marking reading device is assembled（SMT）Decoder The method of component may include following steps：
By top seal around processor chips closing PCB top side；And/or
It is enclosed in by lower seals on the bottom side of the main PCB between the multiple reflowable weldering weld pad Chamber；And
Via top seal and/or lower seals heat transfer and/or structural defence are provided to SMT decoder components.
Be explained further in described in detail below and its accompanying drawing the aforementioned exemplary content of the invention and the present invention it is other Exemplary goal and/or advantage and by its realization the present invention in a manner of.
Brief description of the drawings
Figure 1A and Figure 1B schematically illustrates the prior art decoder plate with flexible connector and board to board connector Sub-component；
Fig. 2A, Fig. 2 B, Fig. 2 C, Fig. 2 D, Fig. 2 E and Fig. 2 F are in perspective view（Fig. 2A and Fig. 2 B）, front view（Fig. 2 C）, side view（Figure 2D）, rearview（Fig. 2 E）And exploded view（Fig. 2 F）In schematically illustrate and be used to mark according to the selection example of the disclosure The surface mounting technique of reading device（SMT）Decoder component；
Fig. 3 and Fig. 4 schematically illustrates installs skill according to the surface for being used to mark reading device of the selection example of the disclosure Art（SMT）The block diagram of decoder component；
Fig. 5 A and Fig. 5 B schematically illustrate the surface for being used to mark reading device for the selection example according to the disclosure Mounting technique（SMT）The two-sided main printed circuit board of decoder component（PCB）Top side（Fig. 5 A）And bottom side（Fig. 5 B）；
Fig. 6 A-6H are schematically illustrated for the selection example according to the disclosure for marking the surface of reading device to install Technology（SMT）The main printed circuit board of decoder component（PCB）Various layers, including top layer（Fig. 6 A）And bottom（Fig. 6 H）；
Fig. 7 A and Fig. 7 B schematically illustrate the surface for being used to mark reading device for the selection example according to the disclosure Mounting technique（SMT）The weld pad ring of decoder component, including front side（Fig. 7 A) and dorsal part（Fig. 7 B)；
Fig. 8 schematically illustrates the surface mounting technique for being used to mark reading device for the selection example according to the disclosure （SMT）The weld pad ring PCB or side edges PCB of decoder component；
Fig. 9 illustrates that the surface mounting technique for being used to mark reading device for the selection example according to the disclosure （SMT）The form of the weld pad ring PCB or side edges PCB of decoder component connector；
Figure 10 A schematically illustrate the surface mounting technique for being used to mark reading device of the selection example according to the disclosure （SMT）Decoder component, it has the connector of 2 sides of band（That is, 2 faces）2 face weld pad ring PCB；
Figure 10 B schematically illustrate the surface mounting technique for being used to mark reading device of the selection example according to the disclosure （SMT）Decoder component, it has the connector with all 4 sides（That is, 4 faces）Weld pad ring PCB；
Figure 10 C schematically illustrate the surface mounting technique for being used to mark reading device of the selection example according to the disclosure （SMT）Decoder component, it has two side edges PCB on opposite sides；
Figure 11 is the imaging device according to the aspect of the disclosure（Such as indicia reading terminal）One embodiment schematic thing Reason form figure；
Figure 12 and Figure 13 shows the other types of imaging device of the aspect according to the disclosure；
Figure 14 is the block diagram of one embodiment of Fig. 1 imaging device；
Figure 15 A and Figure 15 B schematically illustrate according to the selection example of the disclosure be used for mark the surface of reading device to pacify Dress technology（SMT）Decoder component, it is surface-mounted to the host computer system plate with imaging subsystems；
Figure 16 schematically illustrates assembling and installs skill according to the surface for being used to mark reading device of the selection example of the disclosure Art（SMT）The flow chart of the method for decoder component；
Figure 17 A, Figure 17 B and Figure 17 C are schematically illustrated with the weldering for being used to picking up and placing the selection example according to method The weld pad ring PCB of the tab of gasket ring, methods described are used for the surface mounting technique for being used to mark reading device for assembling the disclosure （SMT）Decoder component；
Figure 18 A, Figure 18 B and Figure 18 C schematically illustrate the method that assembling is used to mark the SMT decoder components of reading device, Wherein the main PCB with processor chips be lifted and be placed on according to the weld pad ring PCB of the selection example of the disclosure or On side edges PCB；And
Figure 19 A, Figure 19 B and Figure 19 C are schematically illustrated for picking up and placing carrying according to the selection example of the disclosure The lid of the main PCB of processor chips.
Embodiment
Referring now to Figure 1A and Figure 1B, it shows the decoder plank component 10 of prior art.As shown in Figure 1A, existing skill The decoder plank component of art includes decoder plate 11, camera model 12 and system board 13.As shown in fig. 1b, prior art Decoder plank component 10 includes fastener 14, Flexible PCB cable 15 and for decoder plate 11 to be connected into system board 13 Board to board connector 16.It has been determined that cable（As Flexible PCB cable 15）And connector for substrate（As board to board connector 16）Can not Lean on, because it can be the source of failure in marking reading device when having found that these cables and/or connector become and disconnected. For example, screw（As fastener 14）It can become to loosen, so as to allow decoder plate 11 to become from board to board connector 16 and/or scratch Property PCB cables 15 disconnect.In addition, these flexible cables and board to board connector space-consuming, and in mark reading device Inner side needs sufficient space.
The disclosure includes surface-mounting technique（SMT）.SMT is that a kind of production wherein part that is used for is mounted directly or placed To printed circuit board (PCB)（PCB）Surface on electronic circuit method.So-formed electronic installation is referred to as surface-mount devices （SMD）.In the industry, it largely substitutes and the part with conductor leading is assembled in the hole in circuit board Through hole technical construction method.Two kinds of technologies can be used in same plate, and wherein through hole technology is used for the portion for being unsuitable for surface installation Part, such as high-power transformer and heat radiation power semiconductor.SMT parts are generally smaller than its through hole corresponding part because its have compared with Small lead does not have lead.It can have short pin or lead, flat contacts, the weld pad matrix of various patterns（BGA）、 Or the termination in the main body of part.This SMT technology is incorporated into decoder module so as to which decoder module is connected by the disclosure To host computer system plate.The SMT technologies can improve reliability, relatively cheap can be incorporated to and/or can realize for marking reading device （Slice code scanner, including hand-held bar code scanner）More compact decoder component.
Referring now to Fig. 2-19, SMT decoder modules 5000 are shown.SMT decoder modules 5000 can generally include two-sided master Printed circuit board (PCB)（PCB） 5100（Hereinafter referred to as main PCB 5100）With processor chips 5200.Main PCB 5100 can be Two-sided PCB, it has the top side 5102 for being configured to connect to processor chips 5200 and is configured to connect to multiple return Fluid welding weld pad 5300（That is, BGA) and SMT decoder modules 5000 included by any other part 5600 bottom side 5104.It is main Processor chips 5200 on PCB 5100 top side 5102 can be the place for being arranged to decode decodable code mark Manage device.Multiple reflowable weldering weld pads 5300 on the bottom side 5104 of main PCB 5100 can be arranged to decoder component 5000 It is surface mounted to another circuit board or the like, including the host computer system plate 1500 for application connection.Top seal 5700 Optionally it is included in around code device processor chips 5200 on the top of SMT decoder components 5000.Top seal 5700 can be used for around the exposure top side 5102 of the closing main PCB 5100 of processor chips 5200.Top seal 5700 can be directed to The radiating of processor provides the otch around processor chips 5200.Lower seals 5800 are optionally in multiple reflowable welderings Weld pad 5300（As weld pad ring PCB 5310 or the inner side of side edges 5320（Referring to Figure 10 C））Between be included in SMT decoders On the chamber 5400 of component 5000.Lower seals 5800 can close PCB bottom side 5104, include the bottom side 5104 of main PCB 5100 On other parts 5600 in it is any.Top seal 5700 and/or lower seals 5800 can be configured to decode to SMT Device assembly 5000 provides heat transfer and/or structural defence.
SMT decoder components 5000 can have size 5010, including length 5020, width 5030 and depth 5040, such as scheme Shown in 2C, Fig. 2 D and Fig. 2 E.These sizes 5010 are slightly larger than decoder processor chip 5200, relatively tight so as to provide The SMT decoder module components to gather.For example, in one embodiment, SMT decoder components can with than with length 5220, The size 5210 of the processor chips 5200 of width 5230 and depth 5240 is big or small about 50% size 5010, or may Preferably, SMT decoder components can be with than the processor chips 5200 with length 5220, width 5230 and depth 5240 Size 5210 is big or small about 30% size 5010, or may most preferably, and SMT decoder components can be with than with long Degree 5220, width 5230 and depth 5240 processor chips 5200 size 5210 is big or small about 20% size 5010.So And the disclosure is not so limited, and the size 5010 of SMT decoder components 5000 can be arranged to various applications and The decoder module chip 5010 or other parts 5600 of size and shape.For example, for use by positioned at the South Carolina The IMX257-Plus decoder module chips that the Honeywell scanning in Mil fort provides with mobile technology portion, SMT decoder components 5000 size 5010 may include about or equal to 18mm length 5020, about or equal to 15mm width 5030 and about or Depth 5040 equal to 3.2mm.
Chamber 5400 can be arranged on the bottom side 5104 of main PCB 5100 in SMT decoder components 5000, as in Fig. 2 F most Shown in good.Chamber 5400 may be provided between weld pad 5300, on the periphery 5106 of its bottom side 5104 that can be located at main PCB 5100 One side, 2 sides, 3 sides, all sides or Anywhere on.Chamber 5400 can be used in the bottom side of main PCB 5100 Include other parts 5600 on 5104.The other parts 5600 being included on top side 5102 and/or bottom side 5104 can be used In any desired part or chip of mark reading device, include but is not limited to：Memory member 5620, oscillator unit part 5630 and/or passive component 5640.In selection example, it is included in the chamber 5400 on the bottom side 5104 of main PCB 5100 Memory member 5620 may include dynamic random access memory（DRAM）Chip 5622 and/or flash memory dies 5624.Chamber 5400 can have the chamber thickness 5410 for the highest part 5610 being arranged on the bottom side 5104 of main PCB 5100, As shown in figure 2f.
With reference to figure 2, Fig. 7, Fig. 8, Fig. 9, Figure 10 A and Figure 10 B, in selection example, chamber 5400 can be via weld pad ring PCB 5310 are formed on the bottom side 5104 of main PCB 5100.Weld pad ring PCB 5310 can be stacked to master by the reflowable Weldings of SMT On PCB 5100 bottom side 5104.Weld pad ring PCB 5310 can on dorsal part 5316 include it is multiple it is reflowable weldering weld pads 5300 so as to Surface is installed by decoder component 5000.Weld pad ring PCB 5310 can be with the bottom side 5104 carried for main PCB plate 5100 Connector 5314 front side 5312 and with for it is reflowable weldering weld pad 5300 connector 5318 dorsal part 5316 it is two-sided Ring PCB 5311.Weld pad ring PCB 5310 can have connector on any or all side of ring, including as 2 sides （That is, 2 faces）The upper ring 5313 with connector, as shown in FIG. 10A, or in all 4 sides（That is, 4 faces）It is upper that there is connection The ring 5315 of part, as shown in Figure 10 B.
With reference to figure 8, Fig. 9 and Figure 10 C, in other selection examples, chamber 5400 can be via at least two side edges PCB 5320 form on the bottom side 5104 of main PCB 5100.Side edges PCB 5320 can be stacked to by the reflowable Weldings of SMT On the bottom side 5104 of main PCB 5100.Side edges PCB 5320 may include that multiple reflowable weldering weld pads 5300 are installed for surface SMT decoder components 5000.Each side edges PCB 5320 can be with the bottom side 5104 carried for main PCB plate 5100 Connector 5324 front side 5322 and with for it is reflowable weldering weld pad 5300 connector 5328 dorsal part 5326 it is two-sided Edge PCB 5321.Side edges PCB 5320 can be included on 2 of main PCB 5100 or more edges, be included in 2 On individual opposite flank, as shown in figure 10 c.This can be connected to circuit board in SMT decoder components（As host computer system plate 1500） When provide openend on the bottom side of SMT decoder components, this can provide radiating and improve thermal property.
With reference to figure 3 and Fig. 4, the various example embodiments of the block diagram of SMT decoder components 5000 are shown.These block diagrams show Go out and be used to the line of processor chips 5200 being connected to other parts 5600（Including flash memory 5624, DDR RAM memories 5622 etc.）Exemplary configuration.In addition, Fig. 4 shows the example for being connected image sub-component 900 with SMT decoder components 5000 Property embodiment.
With reference to figure 5A and Fig. 5 B, the various example embodiments of the configuration of main PCB 5100, including main PCB 5100 are shown Top side 5102（Fig. 5 A）With bottom side 5104（Fig. 5 B）.The top side 5102 of main PCB 5100 can be arranged to surface installation process Device chip 5200.The top side 5102 of main PCB 5100 can also be arranged to surface as desired and install other parts 5600. The bottom side 5104 of main PCB 5100 can be arranged to by it is reflowable weldering weld pad 5300 be surface mounted to weld pad ring PCB 5310 and/ Or side edges PCB 5320.In addition, the bottom side 5104 of main PCB 5100 can be arranged to surface installation cavity as desired Other parts 5600 in 5400.
With reference to figure 6A-6H, the various example embodiments of the configuration of the various layers of main PCB 5100 are shown.Such as institute herein Show, in an example embodiments, main PCB 5100 may include 8 printings for top side 5102 to be connected to bottom side 5104 Layer.In this example, it is possible to provide this 8 layers with the case of the 0.6mm thickness of main PCB 5100 in 15mm x 17mm sizes It is lower to obtain enough EMC allowances（margin）.However, the disclosure is not so limited, the printing layer of any desirable number can quilt It is included in main PCB 5100 and is used to top side 5102 being connected to bottom side 5104 to form SMT decoder modules 5000, including The surface of processor chips 5200 is installed on top side 5102, by weld pad ring PCB 5310 and/or the tables of side edges PCB 5320 Face is installed on bottom side 5104 and/or any other expectation part 5600 surface is installed on into top side 5102 and/or bottom side 5104 On.
Referring now to Fig. 7 A and Fig. 7 B, weld pad ring PCB 5310 example embodiments are shown.As illustrated, weld pad ring PCB 5310 be two-sided ring PCB 5311.Fig. 7 A show to carry the front side of the connector 5314 of the bottom side 5104 for main PCB 5100 5312.Fig. 7 B are shown with the connector for being the reflowable weldering weld pad 5300 that SMT decoder modules 5000 are installed for surface 5318 dorsal part 5316.
Referring now to Fig. 8 and Fig. 9, show that the schematic weld pad 5300 of exemplary draws for weld pad ring PCB 5310 dorsal part 5316 Pin is arranged（As mark, similarly configure the dorsal part 5326 available for side edges PCB 5320）.However, the disclosure is not such It is limited, and any various pin arrangements can be used as desired.
Referring now to Figure 11-15, according to the various embodiments of disclosure flag activation reading device 1000,1001,1002. These mark reading devices can generally include host computer system plate 1500 and be surface mounted to the surface installation of host computer system plate 1500 Technology（SMT）Decoder component decoder module 5000, as shown in Figure 15.These mark reading devices 1000,10001, 10002 can be also including the imaging subsystems 900 for being connected to host computer system plate 1500, and memory member 5620.Memory member 5620 can be communicated with imaging subsystems 900 and may can storage table show the image of the light being incident on imaging subsystems 900 One or more of data frame.Wherein, processor chips 5200 can be communicated by main PCB 5100 with memory member 5620 And it can be decoded with operable with being marked at least one middle decodable code represented in the frame of view data.
Figure 11 shows the imaging device for being used in decodable code mark is read use of the aspect according to the disclosure（Such as mark Remember reading terminals 1000）One embodiment.Indicia reading terminal 1000 can be used to read decodable code mark, such as It is arranged in the non-backlight substrate 1007 for being for example attached to product 1009（Such as paper）On bar code 1005.Decodable code mark can Including but not limited to：
One-dimensional linear symbolism, such as 39 yards of bar code, 25 yards of I, bar code 128, UPC/EAN；With stack linear code, Such as PDF-417,16K and bar code 49（Generally it is also shown as two-dimensional symbologies）, in both cases, with lines and space Width include information；
True two-dimensional matrix code, such as bar code 1, DataMatrix, MaxiCode, QR-Code and Aztec Code, its In with the pre-position that two-dimensional coordinate is fastened exist or lack mark to include information；And/or
Human-readable font, such as OCR and typed text.
Many marks in these marks have by one or more international standard agencies（By AIM before such as And recently by ISO/IEC）The specification definition developed and approved.
Referring also to Figure 11, indicia reading terminal 1000 can also can be used to read decodable code mark, all as shown in electricity Sub-device 1200（Such as backlight screen 1250, such as such as display, monitor, LCD display or generally in mobile phone, honeybee The other screens used in cellular telephone, satellite phone, smart phone, telemetry device, personal digital assistant and other devices） On bar code 1150.Marked while shown as single decodable code is once read, but will be appreciated that image can be with operable with simultaneously Capture one or more decodable codes mark on single object or on multiple objects.
For example, in one embodiment, terminal 1000 may include to be arranged in touching in the common side of hand-held outer case 1014 Send out device 1220, display 1222, point gear 1224 and keyboard 1226.Display 1222 and point gear 1224 are visual in combination For the user interface of terminal 1000.In one embodiment, display 1222 may be incorporated into touch sensitive panel be used for navigate and virtual cause Dynamic device selection, in the case, the user interface of terminal 1000 can be provided by display 1222.
Referring now to Figure 12, in other embodiments, the hand-held outer case 1015 of indicia reading terminal 1001 can lack display Device and keyboard, and can be in the gun-type form factor with trigger 1221, as shown in Figure 12.In other embodiments, mark The hand-held outer case 1016 of note reading terminals 1002 may include display 1223 and keyboard 1227, and can be in have trigger 1222 gun-type form factor, such as shown in Figure 13.
Description using the nomenclature associated with indicia reading terminal and can generally include hand-held mark reading below Terminal, fixation mark reading terminals, but those skilled in the art will realize that may be incorporated into terms of the disclosure with use In the other electronic installations for the imager that image capture and/or mark are read, it can be configured as（Such as）Mobile phone, honeybee Cellular telephone, satellite phone, smart phone, telemetry device, personal digital assistant, camera and other devices.
Figure 14 illustrates indicia reading terminal（Such as indicia reading terminal 1000,1001 or 1002）One embodiment Block diagram.Generally, indicia reading terminal may include illumination subsystems 800, sight subsystem 600, full photoimaging subsystem 900 （Image sensor IC 1040 including full photoimaging optics 200 and with image sensor array 1033）, hand Hold formula shell 1014,1015 or 1016, memory member 1085 and processor 1060.As described in more detail below, Quan Guangcheng As optics 200 allows scene S（Fig. 1）4D field informations capture on image sensor array 1033.For example, full light Image forming optics 200 may include main lens 220 and microlens array 250.Microlens array may include thousands of lenticules, and And microlens array may be arranged between main lens and image sensor array.Scene or its read from image sensor array 1033 The analog signal of the part gone out can be amplified by gain block 1036, is converted into digital form by analog-digital converter 1037 and be sent to DMA unit 1070.Digital image data can be then sent in volatile memory 1080 by DMA unit 1070.Processor 1060 can be addressed so as to following article to the one or more frames for the view data being stored in volatile memory 1080 The described frame for being used for mark decoding is handled.The image captured by full light image optics is referred to as full light image.It is logical Cross the data that full photoimaging optics captures on the image sensor and be referred to as full light image data.
Referring again to Figure 14, terminal 1000,1001,1002 may include imaging sensor 1032, and it includes having by picture More pixel image sensor arrays 1033, associated column circuitry 1034 and the row circuit system of the pixel of plain row and column arrangement System 1035.Amplifier circuitry 1036（Amplifier）Be in analog signal form by what is read from image sensor array 1033 Image information be converted into can be with the phase of imaging sensor 1032 in the analog-digital converter 1037 of image information of digital signal form Association.Imaging sensor 1032, which can also have, to be used to control（Such as）The exposure cycle of imaging sensor 1032, it is applied to amplification The associated timing and control circuits 1038 of the gain of device 1036 etc..The circuit block 1032,1036,1037 and 1038 can It is packaged into common image sensor integrated circuit 1040.Image sensor IC 1040 may be incorporated into the institute than above-mentioned part State the few part of quantity.Image sensor IC including image sensor array 1033 and imaging lens arrangement 200 1040 may be incorporated into hand-held outer case.
In an example, image sensor IC 1040 can be for example by being purchased from Micron Technology public affairs The MT9V022 of department（752 × 480 pel arrays）Or MT9V023（752 × 480 pel arrays）Image sensor IC carries For.In an example, image sensor array 1033 can be mixing monochrome and color image sensor array, and it has not The first subgroup monochrome pixel with color filter element and the second subgroup colour element with the quick filter elements of color.One In individual example, image sensor IC 1040 may be incorporated into Bayer（Bayer）Pattern filter, so as in imaging sensor battle array Define that red pixel is located at red pixel location, green pixel is located at green pixel opening position and blue pixel at row 1033 At blue pixel location.The frame provided using this image sensor array for being incorporated to Bayer pattern may include to be located at red picture The red pixel value of plain opening position, the green pixel values positioned at green pixel opening position and the blueness at blue pixel location Pixel value.In the embodiment for being incorporated to Bayer pattern image sensor array, processor 1060 is further processed making frame Frame pixel position interpolated pixel values using green pixel values among green pixel position before, to form picture number According to monochrome frame.Alternatively, processor 1060 before frame is further processed using red pixel value in red Interpolated pixel values among location of pixels, to form the monochrome frame of view data.Alternatively, processor 1060 can pass through frame Blue pixel value interpolated pixel values among blue pixel location are utilized before by further processing.Terminal 1000,1001, 1002 imaging subsystems may include imaging sensor 1032 and the figure for full light image to be projected to imaging sensor 1032 As the full optical lens component 200 on sensor array 1033.
In the process of the operation of these terminals, picture signal can read from imaging sensor 1032, be converted and stored into System storage（Such as RAM 1080）In.The memory member 1085 of these terminals may include RAM 1080, non-volatile deposit Reservoir（Such as EPROM 1082）With storage storage arrangement 1084（Such as can be by flash memory or hard disk drive storage There is provided）.In one embodiment, these terminals may include processor 1060, and it may be adapted to reading and is stored in memory 1080 View data and this view data is subjected to various image processing algorithms.These terminals may include to be used to send from figure by route As sensor 1032 reads, be subjected to the direct memory access (DMA) unit for the image information for being transformed into RAM 1080（DMA）1070. In another embodiment, these terminals can use the system bus for providing bus arbitration mechanism（Such as pci bus）, therefore disappear Except the needs to central dma controller.Those of skill in the art will be appreciated that and be provided between imaging sensor 1032 and RAM 1080 The system bus architecture of valid data transmission and/or the other embodiments of direct memory access (DMA) part in the scope of the present disclosure and In spirit.
Referring also to Figure 14 and referring to the other side of terminal, imaging lens arrangement 200 is applicable to positioned at light field or sky Between S（Figure 11）The image of interior decodable code mark 1005 is projected on image sensor array 1033.
Terminal may include the illumination subsystems 800 for the illumination of target and the projection of lighting pattern 1260.In shown reality Apply in example, lighting pattern 1260 can project to be similar to but the region more than being defined by the visual field 1240, but can also be incident upon and be less than In the region in the region defined by the visual field 1240.Illumination subsystems 800 may include light source group 500, and it includes one or more light Source.Light source assembly 800 can also include one or more light source groups, and each of which includes for example one or more light sources.Exemplary In embodiment, such light source can exemplarily include light emitting diode (LED).It can be used in various embodiments with various The LED of the combination of any or wavelength or optical filter in wavelength and optical filter.In other embodiments, other classes also can be used The light source of type.These light sources can exemplarily be attached to printed circuit board (PCB).This can be with image sensor array 1033 The identical printed circuit board (PCB) that can exemplarily be mounted thereon of image sensor IC 1040.
Referring again to Figure 14, indicia reading terminal 1000,1001,1002 may include at least one optical filter 225, and it can Operate so that from the illumination of decodable code mark reflection by while suppressing to be reflect off surrounding's ring of decodable code mark It is at least some in the light of border.For example, full photoimaging subsystem 900 can also include at least one optical filter 225.
These terminals can also include being used to project aiming pattern（It is not shown）Aim subsystem 600.Aim subsystem 600 It may include light source group 620 and finder lens 630.Aim subsystem 600 can be coupled to aiming light source group work(via interface 610 is aimed at Rate input block 1208 is used to provide electrical power to the light source group 620 of aim subsystem 600.Power incoming unit 1208 can be via Interface 1108 is coupled to host computer system plate 1500（Or system bus）For being communicated with processor 1060.
In one embodiment, in addition to light source group 500, illumination subsystems 800 can also include illuminating lens component 300. In addition to illuminating lens component 300 or illuminating lens component 300 is substituted, illumination subsystems 800 may include alternative light shaping Optics, such as one or more diffusing globes, speculum and prism.In use, these terminals（Such as terminal 1000, 1001 and 1002）It is able to can be solved relative to carrying in a manner of lighting pattern 1260 is projected on decodable code mark 1005 by operator The target of code labeling 1005（For example, a piece of paper, packaging, another type of substrate, screen etc.）Orientation.In Figure 11 example, Decodable code mark 1005 is provided by 1D bar code symbols.Decodable code mark 1005 can be distinguished also by 2D bar code symbols or optical character Know (OCR) character to provide.Light source group electrical power input unit 1206 can provide energy to light source group 500.In one embodiment, Electrical power input unit 1206 may act as controlled voltage source.In another embodiment, electrical power input unit 1206 may act as by Control current source.In another embodiment, electrical power input unit 1206 may act as the controlled voltage and controlled current source of combination.Electricity Power incoming unit 1206, which can change, to be provided to the electrical power of light source group 500（Energization level）Level, for example, to change The level exported by the illumination of the light source group 500 of illumination subsystems 800 is used to produce lighting pattern 1260.
On the other hand, these terminals may include power supply 1402, its electricity to the electric component connectable to terminal 1000 Net 1404 is powered.Power supply 1402 can be coupled to various power supplys（Such as battery 1406）, serial line interface 1408（Such as USB, RS232）And/or AC/DC transformers 1410.
In addition, on power incoming unit 1206, power incoming unit 1206 may include what is persistently charged by power supply 1402 Charging capacitor.Power incoming unit 1206 can be configured to export energy in the range of energization level.First illumination and In the case of spectrum assignment configuration effectively, average energization level of the illumination subsystems 800 during exposure cycle can be higher than illumination With the effective level that is averagely powered of spectrum assignment configuration.
These terminals can also include multiple peripheral units, including（Such as）Trigger available for activation flop signal 1220 so as to Active Frame reading and/or some decoding process.These terminals are adaptable into causing the activation of trigger 1220 to activate Trigger signal simultaneously originates decoding trial.Specifically, terminal 1000 can with operable, so as to the activation in response to trigger signal, Can be by reading image information from image sensor array 1033（Generally in the form of analog signal）To capture a succession of frame simultaneously And then it is being transformed into memory member 1080（It can buffer one or more of this succession of frame in preset time）In it Storage image information afterwards.Processor 1060 can be operable such that one or more of this succession of frame is subjected to decoding and attempted.
For attempting to bar code symbol（For example, one-dimensional barcode code sign）Decoded, processor 1060 can be handled pair Ying Yuyi arranges location of pixels（For example, a line, a row or a pair of linea angulata group location of pixels）Frame view data to determine light and shade Each identified light and shade unit grid pattern simultaneously can be converted into character or character by the space pattern of cell via table lookup String.In the case where decodable code mark expression is 2D bar code symbologies, decoding trial may include following steps：Use feature Detection algorithm positioning view finding device pattern；The matrix intersected with finder pattern is positioned according to the predetermined relationship with finder pattern Line；The pattern of light and shade cell is determined along matrix line；And each bright pattern is converted into character or word via table lookup Symbol string.
These terminals may include for various peripheral units to be coupled into each of System Addresses/data host system board 1500 Kind interface circuit, to be communicated with the processor 1060 for being also coupled to host computer system plate 1500.These terminals may include to be used to incite somebody to action Imaging sensor timing and control circuits 1038 coupled to the interface circuit 1028 of host computer system plate 1500, for by lighting source Group power incoming unit 1206 is coupled to the interface circuit 1106 of host computer system plate 1500 and for trigger 1220 to be coupled to The interface circuit 1120 of host computer system plate 1500.These terminals can also include coupled to host computer system plate 1500 and via interface 1122 displays 1222 to be communicated with processor 1060, and via the interface 1124 and processing for being connected to host computer system plate 1500 The point gear 1224 that device 1060 communicates.These terminals can also include coupled to host computer system plate 1500 and via interface 1126 The keyboard 1226 to be communicated with processor 1060.These terminals can also include via interface 1110 coupled to host computer system plate 1500 Range detector unit 1210.In one embodiment, range detector unit 1210 can be acoustics range detector unit. The various interface circuits of these terminals can share circuit block.Such as, it is possible to provide to circuit 1038 and to power incoming unit 1206 provide the shared microcontroller of control input, to coordinate between image sensor array control and illumination subsystems control Regularly.
A succession of frame that the view data of the processing can be captured and subject to can be full frame（Including being passed corresponding to image Each pixel of sensor array 1033 or the maximum number read during the operation of these terminals from image sensor array 1033 The pixel value of the pixel of amount）.A succession of frame that the view data of the processing can be captured and subject to can also be including corresponding In " the window frame " of the pixel value of the full frame of the pixel less than image sensor array 1033.Above-mentioned processing can be captured and subject to A succession of frame of view data can also include the combination of full frame and window frame.Full frame can be read will pass through to corresponding to complete The pixel selection of the imaging sensor 1032 of the image sensor array 1033 of frame is addressed and captured.Window frame can be read so as to Selected by the pixel to the imaging sensor 1032 with the image sensor array 1033 corresponding to window frame or pixel coverage Property addressing and capture.In one embodiment, multiple pixels are subjected to addressing and read to determine the picture size of frame.Therefore, entirely Frame can be considered with the first relatively large picture size, and window frame can be considered have relatively relative to the picture size of full frame Small picture size.The picture size of window frame can become according to the number for the pixel that the capture for window frame is subjected to addressing and reads Change.
These terminals can capture the frame of the view data under the referred to as speed of frame rate.Representative frame rate be 60 frames/ Second（FPS）, it is converted into 16.6 ms frame time（Frame period）.Another representative frame rate is 30 frames/second（FPS）, it is converted into The frame time of 33.3 ms/ frames（Frame period）.The frame rate of terminal 1000 can be increased by the reduction of frame picture size（And Frame time reduces）.
With reference to figure 15A and Figure 15 B, the example embodiments of SMT decoder modules component 5000 are shown, it is surface mounted to Host computer system plate 1500（Figure 15 A）And in the process that host computer system plate 1500 is surface mounted to via reflowable weldering weld pad 5300 In（Figure 15 B）.In these examples, SMT decoder modules component 5000 is surface mounted to main frame system by image sub-component 900 System plate 1500.As can be found in, the process of the SMT decoder modules component 5000 of surface installation is different from Figure 1A and Figure 1B Shown prior art, because the surface of SMT decoder modules component 5000 is installed and do not need any fastener, Flexible PCB Cable, board to board connector, analog etc. are connected to host computer system plate 1500.
Referring now to Figure 16-19, show that assembling is used to mark the surface of reading device 1000,10001,10002 to install skill Art（SMT）The method 6000 of decoder component 5000.Method 6000 may include to be used to assemble shown and/or described implementation herein Example in it is any in SMT decoder components 5000 the step of, its can be used for as shown in this article and/or it is described mark read dress Put any in 1000,10001,10002 various embodiments.Method 6000 may include to be used to assemble surface mounting technique dress Any known or usual step put.The method 6000 of assembling SMT decoder components 5000 can generally include following steps：
There is provided with the top side 5102 for being configured to admission processing device chip 5200 and with being arranged to be surface mounted to The two-sided main printed circuit board of the bottom side 5104 of multiple reflowable weldering weld pads 5300 of host computer system plate 1500（PCB）5100 Step 6100；And
The step 6200 processor chips 5200 being installed on the top side of main PCB 5100.
In selection example, the surface mounting technique for marking reading device 1000,10001,10002 is assembled （SMT）The method 6000 of decoder component 5000 can also be included on the bottom side 5104 of main PCB 5100 in multiple reflowable weldering welderings The step 6300 of chamber 5400 is formed between pad 5300.In this embodiment, it may include other parts 5600 are arranged on main PCB Step 6310 on 5100 bottom side 5104 in chamber 5400.
In other selection examples of method 6000, on the bottom side 5104 of main PCB 5100 formed chamber 5400 the step of 6300 may include to provide the step 6310 with multiple reflowable weld pad ring PCB 5310 for welding weld pads 5300, wherein weld pad ring PCB 5310 be on front side 5312 with the connector 5314 to main PCB 5100 and on dorsal part 5316 with for can The two-sided ring PCB 5311 of the connector 5318 of Reflow Soldering weld pad 5300.In these embodiments, method 6000 may include to weld Gasket ring PCB 5310 is arranged on the bottom side 5104 of main PCB 5100, so as to form chamber on the bottom side 5104 of main PCB 5100 5400 step 6320.
With reference to figure 17A, Figure 17 B and Figure 17 C, in the selection example of method 6000, there is provided there are multiple reflowable welderings The weld pad ring PCB 5310 of weld pad 5300 step 6310 may include the step for providing the tab 6333 for deviateing weld pad ring PCB 5310 Rapid 6330.As shown in these embodiments, step weld pad ring PCB 5310 being arranged on the bottom side 5104 of main PCB 5100 Rapid 6320 may include following steps：Weld pad ring PCB 5310 step 6332 is picked up via tab 6333（Referring to Figure 17 B)；And The step 6334 being positioned over weld pad ring PCB 5310 via tab 6333 on main PCB 5100.In these embodiments, in group During dress, tab 6333 is attached between weld pad ring PCB 5310 and adjacent welding-pad ring PCB 6335, wherein the two weld pads Ring PCB, which is placed on the panel 6336 of main PCB 5100, to be used to assemble.
With reference to figure 18A, Figure 18 B and Figure 18 C, in other selection examples of method 6000, by weld pad ring PCB 5310 The step 6320 being installed on the bottom side 5104 of main PCB 5100 may include following steps：Pick up main PCB 5100（Wherein handle Device chip 5200 is arranged on top side 5102 and any other part 5600 is arranged on bottom side 5104）Step 6340；With And main PCB 5100 is positioned over the step 6342 on weld pad ring PCB 5310.As shown in these examples, with institute in Figure 17 The example shown is on the contrary, in this embodiment, main PCB 5100 is lifted and is placed on weld pad ring PCB 5310.
Referring now to Figure 19 A, Figure 19 B and Figure 19 C, in the selection example of method 6000, pick up main PCB 5100 and incite somebody to action The step 6340 and 6342 that main PCB is positioned on weld pad ring PCB 5310 may include to pick up main PCB 5100 simultaneously using lid 6345 The step 6344 being placed on weld pad ring PCB 5310.As indicated, lid 6345 can be configured to be fixed on main PCB 5100 So that main PCB 5100 is picked up and placed on top side.Lid 6345 is used connectable to the pin assignment plate ring of main PCB 5100 Picked up in easily.Lid 6345 may include breach 6346, and it is used for passage during Reflow Soldering and is also easy to after SMT Remove.Lid 6345 can be made up of the LCP materials that can transmit SMT temperature.SMT can be picked up and is positioned on the top of lid 6345.
In other selection examples of method 6000, on the bottom side 5104 of main PCB 5100 formed chamber 5400 the step of 6300 may include to provide the step 6350 with multiple reflowable at least two side edges PCB 5320 for welding weld pads 5300, its Middle side edges PCB 5320 is that have on front side 5322 to the connector 5324 of main PCB 5100 and on dorsal part 5326 Two-sided edge PCB 5321 with the connector 5328 for reflowable weldering weld pad 5300.In these embodiments, method 6000 may include side edges PCB 5320 being installed on the bottom side 5104 of main PCB 5100, so as at the bottom of main PCB 5100 The step 6360 of chamber 5400 is formed on side 5104.
Referring again to Figure 18 A, Figure 18 B and Figure 18 C, in other selection examples of method 6000, by side edges PCB 5320 steps 6360 being installed on the bottom side 5104 of main PCB 5100 may include following steps：Pick up main PCB 5100（Wherein Processor chips 5200 are installed on top side 5102 and any other part 5600 is installed on bottom side 5104）The step of 6370；And main PCB 5100 is positioned over the step 6380 on side edges PCB 5320.
Referring again to Figure 19 A, Figure 19 B and Figure 19 C, in the selection example of method 6000, main PCB 5100 is picked up simultaneously The step 6370 and 6380 that main PCB is positioned on side edges PCB 5320 may include to utilize lid 6345（See above）To pick up Play main PCB 5100 and the step 6390 being placed on side edges PCB 5320.
In other selection examples, the SMT decoders for marking reading device 1000,10001,10002 are assembled The method 6000 of component 5000 can be further comprising the steps of：
The step 6400 of the top side 5102 of main PCB 5100 is closed around processor chips 5200 by top seal 5700； And/or
By lower seals 5800 close main PCB 5100 bottom side 5102 on positioned at it is multiple it is reflowable weldering weld pads 5300 it Between chamber 5400 step 6500；And
Via top seal 5700 and/or lower seals 5800 to SMT decoder components 5000 provide heat transfer and/or The step 6600 of structural defence.
To supplement the disclosure, the application is incorporated to following commonly assigned patent, patent application publication in a manner of being cited in full text Case and patent application：
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U.S. Patent No. 9,064,165；U.S. Patent No. 9,064,167；
U.S. Patent No. 9,064,168；U.S. Patent No. 9,064,254；
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US Design Patent the D730,901st；
US Design Patent the D730,902nd；
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US Design Patent the D734,339th；
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In the entitled Laser Scanning Module Employing an Elastomeric U- that on 2 7th, 2012 propose Hinge Based Laser Scanning Assembly U.S. Patent Application No. 13/367,978（Feng et al.）；
In the U.S. Patent Application No. 29/458,405 for the entitled Electronic Device that on June 19th, 2013 proposes （Fitch et al.）；
In the U.S. Patent Application No. 29/ for the entitled Electronic Device Enclosure that on July 2nd, 2013 proposes No. 459,620（London et al.）；
In the entitled Electronic Device Case proposed on the 26th of September in 2013 U.S. Patent Application No. 29/468,118 Number（Oberpriller et al.）；
In the entitled Indicia-reader Having Unitary Construction that on January 8th, 2014 proposes Scanner U.S. Patent Application No. 14/150,393（Colavito et al.）；
In the U.S. for the entitled Indicia Reader for Size-Limited Applications that on March 7th, 2014 proposes State's patent application the 14/200,405th（Feng et al.）；
In the entitled Hand-Mounted Indicia-Reading Device with Finger that on April 1st, 2014 proposes Motion Triggering U.S. Patent Application No. 14/231,898（Van Horn et al.）；
In the U.S. Patent Application No. 29/486,759 for the entitled Imaging Terminal that on April 2nd, 2014 proposes （Oberpriller et al.）；
In the entitled Docking System and Method Using Near Field that on April 21st, 2014 proposes Communication U.S. Patent Application No. No. 14/257,364 (Showering)；
In the U.S. for the entitled Autofocus Lens System for Indicia Readers that on April 29th, 2014 proposes No. 14/264,173 (Ackley et al. of patent application）；
In the U.S. Patent Application No. 14/ for the entitled MULTIPURPOSE OPTICAL READER that on May 14th, 2014 proposes No. 277,337 (Jovanovski et al.）；
The entitled TERMINAL HAVING ILLUMINATION AND FOCUS CONTROL's that on May 21st, 2014 proposes No. 14/283,282 (Liu et al. of U.S. Patent Application No.）；
In the entitled MOBILE-PHONE ADAPTER FOR ELECTRONIC TRANSACTIONS that on July 10th, 2014 proposes U.S. Patent Application No. No. 14/327,827 (Hejl)；
In the U.S. for the entitled SYSTEM AND METHOD FOR INDICIA VERIFICATION that on July 18th, 2014 proposes Patent application the 14/334,934th (Hejl)；
In the U.S. for the entitled LASER SCANNING CODE SYMBOL READING SYSTEM that on July 24th, 2014 proposes Patent application the 14/339,708th（Xian et al.）；
It is special in the U.S. for the entitled AXIALLY REINFORCED FLEXIBLE SCAN ELEMENT that on July 25th, 2014 proposes Profit application the 14/340,627th（Rueblinger et al.）；
In the entitled MULTIFUNCTION POINT OF SALE APPARATUS WITH that on July 30th, 2014 proposes OPTICAL SIGNATURE CAPTURE U.S. Patent Application No. 14/446,391（Good et al.）；
In the entitled INTERACTIVE INDICIA READER proposed on the 6th of August in 2014 U.S. Patent Application No. 14/452, No. 697 (Todeschini)；
It is special in the entitled DIMENSIONING SYSTEM WITH GUIDED ALIGNMENT proposed on the 6th of August in 2014 U.S. Profit application the 14/453,019th（Li et al.）；
In the entitled MOBILE COMPUTING DEVICE WITH DATA COGNITION proposed on the 19th of August in 2014 SOFTWARE U.S. Patent Application No. 14/462,801（Todeschini et al.）；
It is special in the entitled VARIABLE DEPTH OF FIELD BARCODE SCANNER proposed on the 10th of September in 2014 U.S. Profit application the 14/483,056th（McCloskey et al.）；
In the entitled IDENTIFYING INVENTORY ITEMS IN A STORAGE that on October 14th, 2014 proposes FACILITY U.S. Patent Application No. 14/513,808（Singel et al.）；
In the U.S. for the entitled HANDHELD DIMENSIONING SYSTEM WITH FEEDBACK that on October 21st, 2014 proposes State's patent application the 14/519,195th（Laffargue et al.）；
In the entitled DIMENSIONING SYSTEM WITH MULTIPATH INTERFERENCE that on October 21st, 2014 proposes MITIGATION U.S. Patent Application No. 14/519,179（Thuries et al.）；
In the United States Patent (USP) Shen for the entitled SYSTEM AND METHOD FOR DIMENSIONING that on October 21st, 2014 proposes Please be No. 14/519,211（Ackley et al.）；
In the entitled HANDHELD DIMENSIONER WITH DATA-QUALITY that on October 21st, 2014 proposes INDICATION U.S. Patent Application No. 14/519,233（Laffargue et al.）；
In the entitled HANDHELD DIMENSIONING SYSTEM WITH MEASUREMENT- that on October 21st, 2014 proposes CONFORMANCE FEEDBACK U.S. Patent Application No. 14/519,249（Ackley et al.）；
In the entitled METHOD AND SYSTEM FOR RECOGNIZING SPEECH USING that on October 29th, 2014 proposes WILDCARDS IN AN EXPECTED RESPONSE U.S. Patent Application No. 14/527,191（Braho et al.）；
In the entitled ADAPTABLE INTERFACE FOR A MOBILE COMPUTING that on October 31st, 2014 proposes DEVICE U.S. Patent Application No. 14/529,563（Schoon et al.）；
In the United States Patent (USP) for the entitled BARCODE READER WITH SECURITY FEATURES that on October 31st, 2014 proposes Apply for No. 14/529,857（Todeschini et al.）；
In the entitled PORTABLE ELECTRONIC DEVICES HAVING A SEPARATE that on November 3rd, 2014 proposes LOCATION TRIGGER UNIT FOR USE IN CONTROLLING AN APPLICATION UNIT United States Patent (USP) Shen Please be No. 14/398,542（Bian et al.）；
In the U.S. for the entitled DIRECTING AN INSPECTOR THROUGH AN INSPECTION that on November 3rd, 2014 proposes State's patent application the 14/531,154th（Miller et al.）；
In the entitled BARCODE SCANNING SYSTEM USING WEARABLE DEVICE that on November 5th, 2014 proposes WITH EMBEDDED CAMERA U.S. Patent Application No. No. 14/533,319 (Todeschini)；
In the entitled CONCATENATED EXPECTED RESPONSES FOR SPEECH that on November 7th, 2014 proposes RECOGNITION U.S. Patent Application No. 14/535,764（Braho et al.）；
In the entitled AUTO-CONTRAST VIEWFINDER FOR AN INDICIA READER that on December 12nd, 2014 proposes U.S. Patent Application No. No. 14/568,305 (Todeschini)；
It is special in the U.S. for the entitled DYNAMIC DIAGNOSTIC INDICATOR GENERATION that on December 17th, 2014 proposes No. 14/573,022 (Goldsmith) of profit application；
On December 22nd, 2014 propose entitled SAFETY SYSTEM AND METHOD U.S. Patent Application No. 14/578, No. 627（Ackley et al.）；
In the U.S. for the entitled MEDIA GATE FOR THERMAL TRANSFER PRINTERS that on December 23rd, 2014 proposes Patent application the 14/580,262nd (Bowles)；
In the entitled SHELVING AND PACKAGE LOCATING SYSTEMS FOR that on January 6th, 2015 proposes DELIVERY VEHICLES U.S. Patent Application No. No. 14/590,024 (Payne)；
In the entitled SYSTEM AND METHOD FOR DETECTING BARCODE PRINTING that on January 14th, 2015 proposes ERRORS U.S. Patent Application No. No. 14/596,757 (Ackley)；
In the entitled OPTICAL READING APPARATUS HAVING VARIABLE that on January 21st, 2015 proposes SETTINGS U.S. Patent Application No. 14/416,147（Chen et al.）；
In the entitled DEVICE FOR SUPPORTING AN ELECTRONIC TOOL ON A that on 2 5th, 2015 propose USER'S HAND U.S. Patent Application No. 14/614,706（Oberpriller et al.）；
In the U.S. Patent Application No. 14/ for the entitled CARGO APPORTIONMENT TECHNIQUES that on 2 5th, 2015 propose No. 614,796（Morton et al.）；
In the U.S. Patent Application No. 29/516,892 for the entitled TABLE COMPUTER that on 2 6th, 2015 propose （Bidwell et al.）；
In the entitled METHODS FOR TRAINING A SPEECH RECOGNITION SYSTEM that on 2 11st, 2015 propose U.S. Patent Application No. No. 14/619,093 (Pecorari)；
In the entitled DEVICE, SYSTEM, AND METHOD FOR DETERMINING THE that on 2 23rd, 2015 propose STATUS OF CHECKOUT LANES U.S. Patent Application No. No. 14/628,708 (Todeschini)；
In the United States Patent (USP) Shen for the entitled TERMINAL INCLUDING IMAGING ASSEMBLY that on 2 25th, 2015 propose Please be No. 14/630,841（Gomez et al.）；
In the entitled SYSTEM AND METHOD FOR RELIABLE STORE-AND-FORWARD that on March 2nd, 2015 proposes DATA HANDLING BY ENCODED INFORMATION READING TERMINALS U.S. Patent Application No. 14/635, No. 346 (Sevier)；
In the U.S. Patent Application No. 29/519,017 for the entitled SCANNER that on March 2nd, 2015 proposes（Zhou et al.）；
In the U.S. Patent Application No. for the entitled DESIGN PATTERN FOR SECURE STORE that on March 9th, 2015 proposes No. 14/405,278（Zhu et al.）；
In the entitled DECODABLE INDICIA READING TERMINAL WITH COMBINED that on March 18th, 2015 proposes ILLUMINATION U.S. Patent Application No. 14/660,970（Kearney et al.）；
In the entitled REPROGRAMMING SYSTEM AND METHOD FOR DEVICES that on March 18th, 2015 proposes INCLUDING PROGRAMMING SYMBOL U.S. Patent Application No. 14/661,013（Soule et al.）；
In the U.S. Patent application for the entitled MULTIFUNCTION POINT OF SALE SYSTEM that on March 19th, 2015 proposes No. 14/662,922（Van Horn et al.）；
In the entitled VEHICLE MOUNT COMPUTER WITH CONFIGURABLE that on March 20th, 2015 proposes IGNITION SWITCH BEHAVIOR U.S. Patent Application No. 14/663,638（Davis et al.）；
In the entitled METHOD AND APPLICATION FOR SCANNING A BARCODE that on March 20th, 2015 proposes WITH A SMART DEVICE WHILE CONTINUOUSLY RUNNING AND DISPLAYING AN APPLICATION ON THE SMART DEVICE DISPLAY U.S. Patent Application No. No. 14/664,063 (Todeschini)；
In the entitled TRANSFORMING COMPONENTS OF A WEB PAGE TO VOICE that on March 26th, 2015 proposes PROMPTS U.S. Patent Application No. 14/669,280（Funyak et al.）；
In the U.S. Patent Application No. 14/ for the entitled AIMER FOR BARCODE SCANNING that on March 31st, 2015 proposes No. 674,329 (Bidwell)；
In the U.S. Patent Application No. No. 14/676,109 (Huck) for the entitled INDICIA READER that on April 1st, 2015 proposes；
In the U.S. for the entitled DEVICE MANAGEMENT PROXY FOR SECURE DEVICES that on April 1st, 2015 proposes Patent application the 14/676,327th（Yeakley et al.）；
In the entitled NAVIGATION SYSTEM CONFIGURED TO INTEGRATE MOTION that on April 2nd, 2015 proposes SENSING DEVICE INPUTS U.S. Patent Application No. No. 14/676,898 (Showering)；
In the entitled DIMENSIONING SYSTEM CALIBRATION SYSTEMS AND that on April 6th, 2015 proposes METHODS U.S. Patent Application No. 14/679,275（Laffargue et al.）；
In the U.S. Patent Application No. 29/ for the entitled HANDLE FOR A TABLET COMPUTER that on April 7th, 2015 proposes No. 523,098（Bidwell et al.）；
In the entitled SYSTEM AND METHOD FOR POWER MANAGEMENT OF MOBILE that on April 9th, 2015 proposes DEVICES U.S. Patent Application No. 14/682,615（Murawski et al.）；
In the U.S. for the entitled MULTIPLE PLATFORM SUPPORT SYSTEM AND METHOD that on April 15th, 2015 proposes State's patent application the 14/686,822nd（Qu et al.）；
The entitled SYSTEM FOR COMMUNICATION VIA A PERIPHERAL HUB's that on April 15th, 2015 proposes U.S. Patent Application No. 14/687,289（Kohtz et al.）；
In the U.S. Patent Application No. 29/524,186 for the entitled SCANNER that on April 17th, 2015 proposes（Zhou et al.）；
In the U.S. Patent Application No. 14/ for the entitled MEDICATION MANAGEMENT SYSTEM that on April 24th, 2015 proposes No. 695,364（Sewell et al.）；
It is special in the U.S. for the entitled SECURE UNATTENDED NETWORK AUTHENTICATION that on April 24th, 2015 proposes Profit application the 14/695,923rd（Kubler et al.）；
The entitled TABLET COMPUTER WITH REMOVABLE SCANNING DEVICE's that on April 27th, 2015 proposes U.S. Patent Application No. 29/525,068（Schulte et al.）；
In the entitled SYMBOL READING SYSTEM HAVING PREDICTIVE that on April 29th, 2015 proposes DIAGNOSTICS U.S. Patent Application No. 14/699,436（Nahill et al.）；
In the entitled SYSTEM AND METHOD FOR REGULATING BARCODE DATA that on May 1st, 2015 proposes INJECTION INTO A RUNNING APPLICATION ON A SMART DEVICE U.S. Patent Application No. 14/702, No. 110（Todeschini et al.）；
In the U.S. Patent Application No. 14/ for the entitled TRACKING BATTERY CONDITIONS that on May 4th, 2015 proposes No. 702,979（Young et al.）；
In the U.S. Patent Application No. for the entitled INTERMEDIATE LINEAR POSITIONING that on May 5th, 2015 proposes No. 14/704,050（Charpentier et al.）；
In the entitled HANDS-FREE HUMAN MACHINE INTERFACE RESPONSIVE TO that on May 6th, 2015 proposes A DRIVER OF A VEHICLE U.S. Patent Application No. 14/705,012（Fitch et al.）；
In the entitled METHOD AND SYSTEM TO PROTECT SOFTWARE-BASED that on May 6th, 2015 proposes NETWORK-CONNECTED DEVICES FROM ADVANCED PERSISTENT THREAT U.S. Patent Application No. 14/ No. 705,407（Hussey et al.）；
In the entitled SYSTEM AND METHOD FOR DISPLAY OF INFORMATION that on May 8th, 2015 proposes USING A VEHICLE-MOUNT COMPUTER U.S. Patent Application No. No. 14/707,037 (Chamberlin)；
It is special in the U.S. for the entitled APPLICATION INDEPENDENT DEX/UCS INTERFACE that on May 8th, 2015 proposes No. 14/707,123 (Pape) of profit application；
In the entitled METHOD AND APPARATUS FOR READING OPTICAL INDICIA that on May 8th, 2015 proposes USING A PLURALITY OF DATA SOURCES U.S. Patent Application No. 14/707,492（Smith et al.）；
In the entitled PRE-PAID USAGE SYSTEM FOR ENCODED INFORMATION that on May 13rd, 2015 proposes READING TERMINALS U.S. Patent Application No. No. 14/710,666 (Smith)；
In the U.S. Patent Application No. 29/526,918 for the entitled CHARGING BASE that on May 14th, 2015 proposes（Fitch Et al.）；
In the U.S. for the entitled AUGUMENTED REALITY ENABLED HAZARD DISPLAY that on May 19th, 2015 proposes Patent application the 14/715,672nd（Venkatesha et al.）；
On May 19th, 2015 propose entitled EVALUATING IMAGE VALUES U.S. Patent Application No. 14/715, No. 916 (Ackley)；
In the entitled INTERACTIVE USER INTERFACE FOR CAPTURING A that on May 27th, 2015 proposes DOCUMENT IN AN IMAGE SIGNAL U.S. Patent Application No. 14/722,608（Showering et al.）；
In the U.S. Patent Application No. 29/ for the entitled IN-COUNTER BARCODE SCANNER that on May 27th, 2015 proposes No. 528,165（Oberpriller et al.）；
In the entitled ELECTRONIC DEVICE WITH WIRELESS PATH SELECTION that on May 28th, 2015 proposes CAPABILITY U.S. Patent Application No. 14/724,134（Wang et al.）；
In the entitled METHOD OF PROGRAMMING THE DEFAULT CABLE that on May 29th, 2015 proposes INTERFACE SOFTWARE IN AN INDICIA READING DEVICE U.S. Patent Application No. 14/724,849 (Barten)；
In the U.S. for the entitled IMAGING APPARATUS HAVING IMAGING ASSEMBLY that on May 29th, 2015 proposes Patent application the 14/724,908th（Barber et al.）；
Entitled APPARATUS AND METHODS FOR MONITORING ONE OR MORE PORTABLE DATA TERMINALS U.S. Patent Application No. 14/725,352（Caballero et al.）；
In the U.S. Patent Application No. 29/528,590 for the entitled ELECTRONIC DEVICE that on May 29th, 2015 proposes （Fitch et al.）；
In the U.S. Patent Application No. 29/528,890 for the entitled MOBILE COMPUTER HOUSING that on June 2nd, 2015 proposes Number（Fitch et al.）；
In the entitled DEVICE MANAGEMENT USING VIRTUAL INTERFACES CROSS- that on June 2nd, 2015 proposes REFERENCE TO RELATED APPLICATIONS U.S. Patent Application No. No. 14/728,397 (Caballero)；
In the U.S. Patent Application No. for the entitled DATA COLLECTION MODULE AND SYSTEM that on June 8th, 2015 proposes No. 14/732,870 (Powilleit)；
In the U.S. Patent Application No. 29/529,441 for the entitled INDICIA READING DEVICE that on June 8th, 2015 proposes Number（Zhou et al.）；
In the entitled INDICIA-READING SYSTEMS HAVING AN INTERFACE WITH that on June 10th, 2015 proposes A USER'S NERVOUS SYSTEM U.S. Patent Application No. No. 14/735,717 (Todeschini)；
In the entitled METHOD OF AND SYSTEM FOR DETECTING OBJECT that on June 12nd, 2015 proposes WEIGHING INTERFERENCES U.S. Patent Application No. 14/738,038（Amundsen et al.）；
The entitled TACTILE SWITCH FOR A MOBILE ELECTRONIC DEVICE's that on June 16th, 2015 proposes U.S. Patent Application No. No. 14/740,320 (Bandringa)；
In the U.S. Patent Application No. for the entitled CALIBRATING A VOLUME DIMENSIONER that on June 16th, 2015 proposes No. 14/740,373（Ackley et al.）；
In the entitled INDICIA READING SYSTEM EMPLOYING DIGITAL GAIN that on June 18th, 2015 proposes CONTROL U.S. Patent Application No. 14/742,818（Xian et al.）；
In the U.S. for the entitled WIRELESS MESH POINT PORTABLE DATA TERMINAL that on June 18th, 2015 proposes Patent application the 14/743,257th（Wang et al.）；
In the U.S. Patent Application No. 29/530,600 for the entitled CYCLONE that on June 18th, 2015 proposes（Vargo et al.）；
In the entitled IMAGING APPARATUS COMPRISING IMAGE SENSOR ARRAY that on June 19th, 2015 proposes HAVING SHARED GLOBAL SHUTTER CIRCUITRY U.S. Patent Application No. No. 14/744,633 (Wang)；
In the entitled CLOUD-BASED SYSTEM FOR READING OF DECODABLE that on June 19th, 2015 proposes INDICIA U.S. Patent Application No. 14/744,836（Todeschini et al.）；
It is special in the U.S. for the entitled SELECTIVE OUTPUT OF DECODED MESSAGE DATA that on June 19th, 2015 proposes Profit application the 14/745,006th（Todeschini et al.）；
On June 23rd, 2015 propose entitled OPTICAL PATTERN PROJECTOR U.S. Patent Application No. 14/747, No. 197（Thuries et al.）；
It is special in the U.S. for the entitled DUAL-PROJECTOR THREE-DIMENSIONAL SCANNER that on June 23rd, 2015 proposes Profit application the 14/747,490th（Jovanovski et al.）；And
In the entitled CORDLESS INDICIA READER WITH A MULTIFUNCTION that on June 24th, 2015 proposes COIL FOR WIRELESS CHARGING AND EAS DEACTIVATION U.S. Patent Application No. 14/748,446 （Xie et al.）.
In specification and/or accompanying drawing, it has been disclosed that exemplary embodiments of the invention.The present invention is not limited to such example Property embodiment.The use of term "and/or" includes any and all combinations of one or more of associated cited item.This A little accompanying drawings are to schematically show and be therefore not necessarily drawn to scale.Unless otherwise stated, particular term with general and Descriptive sense rather than use for limitative purposes.

Claims (15)

  1. A kind of 1. surface mounting technique for being used to mark reading device（SMT）Decoder component, it includes：
    Two-sided main printed circuit board with top side and bottom side（PCB）；
    Processor chips on the top side of the main PCB；
    Multiple reflowable weldering weld pads on the bottom side of the main PCB；And
    Via the decoder component of the multiple reflowable weldering weld pad surface installation.
  2. 2. SMT decoder components as claimed in claim 1, it is also included on the bottom side of the main PCB, described more It is individual it is reflowable weldering weld pad between, the chamber on the periphery of the bottom side of the main PCB.
  3. 3. SMT decoder components as claimed in claim 2, it also includes：
    Weld pad ring PCB, it has the multiple reflowable weldering weld pad so as to described in the formation on the bottom side of the main PCB Chamber, the weld pad ring PCB be on front side with to the main PCB connector and on dorsal part have be used for described in can return The two-sided ring PCB of the connector of fluid welding weld pad；Or
    At least two side edges PCB, it has the multiple reflowable weldering weld pad so as on the bottom side of the main PCB Form the chamber, the side edges PCB is that have use with the connector to the main PCB on front side and on dorsal part In the two-sided edge PCB of the connector of the reflowable weldering weld pad.
  4. 4. SMT decoder components as claimed in claim 3, wherein, the weld pad ring is that have connector on 2 sides Weld pad ring PCB, or the weld pad ring PCB with connector on all 4 sides.
  5. 5. SMT decoder components as claimed in claim 2, it also includes on the bottom side of the main PCB in the chamber In other parts, other parts include memory member, oscillator unit and/or passive component；
    Wherein described memory member includes dynamic random access memory（DRAM）Chip and/or flash memory dies；And And
    Wherein described chamber has the thickness close to the highest part in other parts on the bottom side of the main PCB Degree.
  6. 6. SMT decoder components as claimed in claim 5, it also includes：
    Top seal on the top of the SMT decoder components, it, which has, is configured to surround the processor The otch of chip assembling, the top seal close the top side of the main PCB around the processor chips；And/or
    Lower seals on the chamber of the SMT decoder components between the multiple reflowable weldering weld pad, it is described Lower seals close the bottom side of the PCB, are included in appointing in other parts on the bottom side of the PCB Meaning；
    Wherein described top seal and/or the lower seals are configured to provide heat biography to the SMT decoder components Lead and/or structural defence.
  7. 7. SMT decoder components as claimed in claim 1, it has the size with length, width and depth, wherein described Size is bigger than the size of the processor chips with length, width and depth or small about 20%.
  8. 8. one kind mark reading device, it includes：
    Host computer system plate；And
    It is connected to the surface mounting technique of the host computer system plate（SMT）Decoder component decoder module；
    Wherein, the SMT decoder components are surface mounted to the host computer system plate.
  9. 9. mark reading device as claimed in claim 8, wherein, the SMT decoder components include：
    Two-sided main printed circuit board with top side and bottom side（PCB）；
    Processor chips on the top side of the main PCB；And
    Multiple reflowable weldering weld pads on the bottom side of the main PCB, it is used to install on the decoder component surface To the host computer system plate for being used for application connection.
  10. 10. mark reading device as claimed in claim 8, wherein, the SMT decoder components include：
    Chamber, its on the bottom side of the main PCB, it is the multiple it is reflowable weldering weld pad between, described in the main PCB On the periphery of bottom side；
    Other parts on the bottom side of the main PCB in the chamber, it includes memory member, oscillator unit And/or passive component.
  11. 11. mark reading device as claimed in claim 10, wherein, the SMT decoder components include：
    Weld pad ring PCB, it has the multiple reflowable weldering weld pad so as to described in the formation on the bottom side of the main PCB Chamber；Or
    At least two side edges PCB, it has the multiple reflowable weldering weld pad so as on the bottom side of the main PCB Form the chamber.
  12. 12. mark reading device as claimed in claim 10, wherein, the SMT decoder components include：
    Top seal on the top of the SMT decoder components, it, which has, is configured to surround the processor chips The otch of assembling, the top seal close the top side of the main PCB around the processor chips；And/or
    Lower seals on the chamber of the SMT decoder components between the multiple reflowable weldering weld pad, it is described Lower seals close the bottom side of the PCB, including appointing in other parts on the bottom side of the PCB What；
    Wherein described top seal and/or the lower seals are configured to provide heat biography to the SMT decoder components Lead and/or structural defence.
  13. 13. mark reading device as claimed in claim 9, it includes：
    It is connected to the imaging subsystems of the host computer system plate；
    Memory member in the SMT decoder components, the memory member communicated with the imaging subsystems and Can storage table show one or more of the view data of light being incident on imaging subsystems frame；
    Wherein, the processor chips are communicated and operable with image by the main PCB with the memory member The decodable code mark of at least one middle expression in the frame of data is decoded；And
    Wherein described mark reading device is hand-held bar code scanner.
  14. A kind of 14. surface mounting technique assembled for marking reading device（SMT）The method of decoder component, it include with Lower step：
    Two-sided main printed circuit board is provided（PCB）, it is with the top side for being configured to admission processing device chip and with being configured For the bottom side for the multiple reflowable weldering weld pads for being surface mounted to host computer system plate；And
    The processor chips are arranged on the top side of the main PCB.
  15. 15. method as claimed in claim 14, its is further comprising the steps of：
    On the bottom side of the main PCB chamber is formed between the multiple reflowable weldering weld pad；And
    Other parts are arranged on the bottom side of the main PCB in the chamber.
CN201610823426.6A 2016-09-14 2016-09-14 The reflowable weldering decoder modules of stack PCB Pending CN107818274A (en)

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US20050073017A1 (en) * 2003-10-01 2005-04-07 Deok-Hoon Kim Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof
US20070274032A1 (en) * 2000-01-06 2007-11-29 Super Talent Electronics Inc. Thin Flash-Hard-Drive with Two-Piece Casing
CN101197384A (en) * 2006-12-08 2008-06-11 育霈科技股份有限公司 Imagine sensor package and forming method of the same
US20080135728A1 (en) * 2006-12-08 2008-06-12 Advanced Chip Engineering Technology Inc. Image sensor module
CN103679107A (en) * 2012-09-25 2014-03-26 霍尼韦尔国际公司 Integrated circuit chip imager based on stacked packaging

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5628031A (en) * 1993-07-19 1997-05-06 Elonex Ip Holdings Ltd. Personal digital assistant module implemented as a low-profile printed circuit assembly having a rigid substrate wherein IC devices are mounted within openings wholly between opposite plane surfaces of the rigid substrate
US20070274032A1 (en) * 2000-01-06 2007-11-29 Super Talent Electronics Inc. Thin Flash-Hard-Drive with Two-Piece Casing
US20050073017A1 (en) * 2003-10-01 2005-04-07 Deok-Hoon Kim Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof
CN101197384A (en) * 2006-12-08 2008-06-11 育霈科技股份有限公司 Imagine sensor package and forming method of the same
US20080135728A1 (en) * 2006-12-08 2008-06-12 Advanced Chip Engineering Technology Inc. Image sensor module
CN103679107A (en) * 2012-09-25 2014-03-26 霍尼韦尔国际公司 Integrated circuit chip imager based on stacked packaging

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