TWI226671B - Tape carrier package - Google Patents

Abstract

A kind of tape carrier package (TCP) which can prevent short circuit is electrically connected to a glass substrate. The glass substrate comprises a display area, a plurality of routings and a plurality of wirings. The wirings are electrically connected with a test unit. Prior to connecting the TCP with the glass substrate, the display area is connected with the wirings through the routings so that the test unit can perform tests on the display area. When the tests are completed, a blocking area is formed on the routings to block the electrical connection between the display area and the test unit. The TCP comprises a flexible substrate, a copper wiring pattern layer and an insulation layer. The copper wiring pattern layer is disposed on the flexible substrate and the insulation layer covers a portion of area of the copper wiring pattern layer. After completing the tests, the TCP is bonded with the glass substrate and the insulation layer is kept contact with the blocking area.

Description

1226671 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a tape and reel carrier package, and in particular to a tape and reel carrier package to avoid short circuit. [Previous technology] For a general liquid crystal monitor (LCD) process, the general pre-process method is to perform a functional test on the TFT substrate after the polarizer is attached to a thin film transistor (TFT) substrate ( function test). If the TFT substrate that has been tested is defective, it must be discarded, which often results in the attached polarizers having to be discarded, resulting in waste of the polarizers. In order to avoid waste of raw materials and save manufacturing costs, after the TFT substrate is cut for the first time and before the polarizer is attached, a 2G3D or 2G2D pre-test is performed on the TFT substrate to screen out the defects first. TFT substrate. Please refer to both Figure 1 A and Figure 1 B. Fig. 1A is a partial schematic view of a conventional liquid crystal display module, and Fig. 1B is a cross-sectional view taken along the line IB-1B 'in Fig. 1a. In FIG. 1B, the display module 10 () includes a glass substrate 11 of a TFT substrate and a tape carrier package (TCP) 120. The glass substrate 11 () is provided with a display area 160, a plurality of indium tin oxide (Indium Tin 111) pins, and is configured with a plurality of wires 132 and a plurality of wires 131. The wires 3 and 1 are The test unit 1300 is electrically connected, and the display area i 6 〇 is connected to the trace 132 through 丨 τ〇 pin 111, and the trace 丨 32 is substantially vertically aligned with the conductor 丨 31 and partially connected. The wire 131 is electrically connected to the test unit 16 so that

1226671 V. Description of the invention (2)-The test unit 160 can test the display area 160. In FIG. 1B, “the tape carrier package 120 uses the tape carrier package lead (TCP lead) 140 to connect up and down with the IT pin 111 on the glass substrate 110.” The conductive conductive adhesive (ACF) 丨 50 makes the electrical performance conductive up and down in the vertical direction. The TCP pin 14 includes a flexible substrate 1 21, a copper wire pattern layer 1 2 2 and an insulating layer 1 2 3. The material of the flexible substrate 1 21 is, for example, polyimide (pi), and a copper wire pattern layer 1 2 2 is formed on the flexible substrate 12m. The insulating layer 1 2 3 is, for example, a solder resist (SR), and covers a part of the area on the copper wire pattern layer 122. In FIG. 1A, the plurality of wires 131 and the plurality of wires 132 are illustrated by only three short arranging wires 131a, 131b, and 131c, and four longitudinally arranged wires 132a, 132b, 132c, and 132d. . The wires 1 31 a, 1 3 1 b, and 1 31 c are electrically connected to one end of the wires 1 3 2 respectively. The leads 131a, 131b, and 131c are electrically connected to one row of red sub-pixels, one row of green sub-pixels, and one row of blue sub-pixels in the display area 160 of the glass substrate 110, respectively. A conductive layer (Passivation Layer, PL) 133 is covered on the wires 131a, 131b, and 131c. The traces 132a, 132b, 132c, and 132d are located on the insulation layer 133, and the traces 132a, 132b, 132c, and 132d are covered with an insulation layer 135, which is also on the insulation layer 133. The wires 131a, 1 31b, and 131c are perpendicular to the wires 132a and 132d, 132b, and 132c, respectively, and through holes 134a and 134d, 134b, and 134c are formed at the intersections, respectively. The conducting wire 131a passes through holes 134a and 134d in the insulating layer 133, so that the conducting wire 131a and the wiring

TW1207F (AUO) .ptd Page 6 1226671 V. Description of the Invention (3) 132a and 132d can be electrically connected. The conducting wire 131b is electrically connected to the wiring 132b through the via 134b in the insulating layer 133. The conductive line 131c can be electrically connected to the wiring 132c through the through hole 134c in the insulating layer 133. Each trace 1 32 is connected to the corresponding ITO pin 111 on the corresponding glass substrate 11 〇, so each row of sub-pixels in the display area 1 60 of the glass substrate 11 〇 will be through the glass substrate A plurality of I TO pins 111 on 110 are connected to their corresponding traces 1 2 2. The multiple wires arranged vertically 1 3 2 are respectively electrically connected to three horizontally arranged wires 1 3 1 a, 1 31 b, and 1 3 1 c, and then electrically connected to the test unit 1 3 0 through the wires 1 3 1 When connected, the test unit 130 can test the display area 160 of the glass substrate 110, as shown in FIG. 1A. After the test is finished, use a laser beam (1 aserbeam) to cut the wiring 132 electrically connecting the glass substrate 11 〇 and the test unit 丨 3 〇 in a direction parallel to the wires 1 31 to make the wires 131c and IT0 A laser cutting line 139 is formed between the pins 111. At this time, the electrical connection between the glass substrate ι10 and the test unit 130 is interrupted. Please refer to Fig. 1C. Fig. 1C shows the schematic diagram of part a in Fig. 1b when it is joined. According to the above-mentioned traditional method, before the glass substrate 丨 〇 and the tape carrier package 120 are bonded, the electrical connection between the glass substrate 丨 10 and the test unit 130 needs to be interrupted. Because the laser cutting is instantaneous high temperature, during the cutting of the wiring 132b, the wiring 132b will be melted and cut a gap to achieve the purpose of electrically isolating the glass substrate 110 from the test unit 30, and A blocking region 139 is formed. However, in the process of laser melting at high temperature, the wiring 132b made of a metal material due to the high temperature makes the wiring 1321) gold.

1226671 V. Description of the invention (4) The material is melted and passes over the blocking area 139 upwards, spills onto the surface of the insulating layer 135, and forms a metal residue 1 329. Therefore, when the TCP pin 140 is bonded to the ITO pin in of the glass substrate 110, at the blocking area 139, the copper wire pattern layer 122 of the TCP pin 140 and the metal spilled onto the surface of the insulating layer 135 Residues of 1 3 2 9 will cause electrical short circuit and damage the quality of the entire display module. The influence cannot be ignored. [Summary of the Invention]

In view of this, the object of the present invention is to provide a tape carrier package (Tape Carrier Package, TCP), the extended covering of which can prevent the tape carrier package and the glass substrate from remaining after the test is completed. Contact with metal residues to reduce electrical shorts. According to the purpose of the present invention, a tape and reel carrier package (TCP) is provided for electrically connecting a glass substrate. The display area, multiple traces and multiple wires on the glass substrate are connected to a test sheet. Before the TCP is connected to the glass substrate, the collar, the electric guide, the remote pole, the α, the head, the 4 s-material rib, and the driver are connected firstly by the second line to make the test early. The display area is tested. After the test is performed, a blocking area is formed on the wiring. Tian Wucheng test unit's electrical connection ... TCP includes the display area.

The wire pattern layer and an insulating layer. The copper wire pattern layer is arranged on the second board, -on copper, and the insulating layer covers a part of the copper wire pattern layer. = f 后 ’TCP system is bonded to the glass substrate’ The insulation layer is connected to the substrate 1 According to another object of the present invention, a display module is provided, including

1226671 V. Description of the invention (5; " '" ---- ~ A glass substrate and a tape carrier package (Tape ca) rHe: r Package, TCP). The glass substrate has a display area, Multiple wires and multiple wires, and the wire system is electrically connected to a test unit. Before the Tcp is connected to the glass substrate, the display area is connected by the wires and the wires / tested to test the display area. After the test is completed, a blocking area is formed on the trace to block the electrical connection between the display area and the test unit. TCP is electrically connected to the glass substrate. TCP includes a soft substrate, a copper wire pattern layer, and An insulating layer. The copper wire pattern layer is disposed on two flexible substrates, and the insulating layer covers a part of the copper wire pattern layer. After the test, the TCP is bonded to the glass substrate, and the insulating layer is in contact with the blocking area. In order to make the above-mentioned objects, features, and advantages of the present invention more comprehensible, a preferred embodiment is given below in conjunction with the accompanying drawings to describe in detail as follows: [°] [Embodiment] Please refer to FIG. 2 , Its indication A cross-sectional view of a liquid crystal display module according to a preferred embodiment of the present invention. In FIG. 2, the display module 2000 includes a glass substrate 110 such as a TFT substrate and a tape carrier package (TCP). 220. The glass substrate 110 has a display area, a plurality of Indium Tin Oxide (I TO) pins 111, and is provided with a plurality of shorting bars 131, such as the lead 131a in the second figure , 131b and 131c, and multiple traces 132 (not shown in the figure), only 132b is described in the second figure.

TW1207F (Youda) .ptd Page 9 1226671 V. Description of the invention (6) Leads 1 3 1 a, 1 31 b and 1 3 1 c are electrically connected to a test unit (not shown in the figure), and lead 131a , 131b, and 131c are electrically connected to one end of the wiring 132, respectively. A conductive layer (Passivation Layer, PL) 133 is covered on the wires 1 3 1 a, 1 3 1 b, and 1 31 c. The trace 132b is located on the insulation layer 133, and the trace 132b is covered with an insulation layer 135 and also on the insulation layer 133. The lead 131b is perpendicular to the trace 132b, and a via 134b is formed at the intersection. The conducting wire 131b enables the auxiliary conducting wire 1 3 1 b and the wiring 1 3 2 b to be electrically connected through the via hole 134 b in the insulating layer 133. The display area 160 is connected to the trace 132 through the IT0 pin 111, and the trace 132 is arranged substantially vertically and partially connected to the lead 131, and is electrically connected to the test unit through the lead 321 to make the test The unit was able to test the display area 160. After the test is finished, use a laser beam (1 aserbeam) to electrically connect the glass substrate and the wiring 132b of the test unit in a direction parallel to the conducting wire 131, so that the conducting wire 131c and ιτο pin ill A blocking region 139 is formed therebetween, such as a laser cutting line. At this time, the electrical connection between the glass substrate 110 and the test unit is interrupted. Tape and reel carrier package 220 uses tape and reel carrier package pins (TCP lead) 240 to connect up and down with j τ〇 pin lu on the glass substrate 110, and its connection is made of anisotropic conductive adhesive (ACF 15) Make the electrical performance conductive up and down in the vertical direction. Different from the conventional one, the TCP pin 240 of the tape carrier seal 220 includes a soft substrate 221, a copper conductor pattern 222, and an insulating layer 223. The material of the flexible substrate 221 is, for example, polyimide (PI), and there is a layer of copper conductor 222 on the flexible substrate 221. The insulating layer 223 is, for example, a solder resist layer

1226671 ------- V. Description of the invention (7) Part of the 2SUt copper wire pattern layer 222, and where the insulating layer lead pin? 4 ^ f is in contact with the blocking region 139. When the tape-and-reel carrier seal = the pin of the 24G substrate board is connected, the iii = melt / process is formed on the surface of the insulating layer 135 (see Figure 2). The layer 223 blocks the direct contact between the original metal residue 1 329 and the copper wire pattern layer 222, which can effectively avoid the occurrence of electrical short circuit and reduce the possibility of damaging the quality of the display. In addition, referring to FIG. A cross-sectional view of another liquid crystal display module according to a preferred embodiment of the present invention. 3 and 2 show that the TCP pin 240 not only extends the insulating layer 223 to cover the contact area with the blocking area; it also exposes a layer of copper wire pattern that does not cover the insulating layer 223 with a thickness Its buffer layer is 27 °. The purpose of buffering sound is to reduce the thickness difference between the copper wire pattern layer 222 and the insulating layer 223. The buffer layer 270 may be a metal bump provided on the copper wire pattern layer 222 or a conductive film. On the other hand, metal projections such as nickel (Ni) or copper (Cupper, Cu) are used. The tape-and-reel carrier package disclosed in the above embodiments of the present invention increases output efficiency, further reduces the purchase and use of test equipment, and saves costs. The most important thing is that the tape carrier package (Tcp) is protected by the insulating layer (SR) on the glass wire pattern layer of copper, to prevent the copper wire pattern layer from being scratched on the blocking area formed by laser cutting. Injuries or spilled metal residues cause electrical shorts. In addition, when the insulation layer is extended to contact the blocking area, it also covers the conduction TW1207F (AUO) .ptd Page 11 1226671 V. Description of the invention (8) The hole can prevent the copper wire pattern layer originally contacting the conduction wire from being affected. Scratches or electrical shorts with molten metal residues. In summary, although the present invention ^ κ, it is not intended to be limited: the above has been disclosed from the preferred embodiment-the spirit of the invention and the invention. Anyone skilled in the art will not depart from the protection of the invention. ^ Within the range, it can be modified and retouched, so it is accurate. Please refer to the attached patent for the definition of TW1207F (AUO) .ptd Page 121226671 Simple illustration [Schematic description] Figure 1A is a partial schematic diagram of a traditional LCD module . Figure 1B is a cross-sectional view taken along the section line 1 B-1 B 'in Figure 1A. Figure 1C is a schematic diagram of the part A in Figure 1B when it is joined. FIG. 2 is a cross-sectional view of a liquid crystal display module according to a preferred embodiment of the present invention. FIG. 3 is a cross-sectional view of another liquid crystal display module according to a preferred embodiment of the present invention. Description of figure numbers I 0 0, 2 0 0: Display module II 0: Glass substrate III: ITO pins 120, 220: Tape-and-reel carrier package 1 2 1, 2 2 1: Flexible substrates 122, 222: Copper Wire pattern layers 123, 223: Insulation layer (SR) 1 3 0: Test unit 1 3 1 a, 1 3 1 b, 1 3 1 c: Wire 132, 132a, 132b, 132c: Trace 1 329: Metal residue 133 135: Insulation layer (PL) 134a, 134b, 134c, 134d: Vias

TW1207F (AUO) .ptd Page 13 1226671 Simple illustration of the diagram 139 140 150 270 Blocking area 240: TCP bow 丨 Anisotropic conductive adhesive Buffer layer

TW1207F (AUO) .ptd Page 14

Claims (1)

1226671 a 'Please rely on B 1 · A roll ▼ carrier carrier package (TCP) for electrically connecting a glass substrate, the glass substrate has a display area, a plurality of traces and a plurality of Wires, the wires are electrically connected to the two test units, and before the TCP is connected to the glass substrate, the display area is connected to the wires through the wires so that the test unit can The display area is tested, and after the test is completed, a blocking area is formed on the traces to block the electrical connection between the display area and the test unit. The tape-and-reel conductor package includes: A flexible substrate; a copper wire pattern layer disposed on the soft substrate; and an insulating layer covering a part of the copper wire pattern layer, wherein after the test is completed, the tape carrier package is connected with The glass substrate is bonded, and the insulating layer is in contact with the blocking regions. 2. The tape-and-reel carrier package according to item 1 of the scope of patent application, wherein the glass substrate further includes a plurality of pins, and the display area is connected to the traces through the pins, and the traces are connected. The wires are arranged substantially vertically and partially connected to the wires, and the wires are electrically connected to the test unit, so that the test unit can test the display area. 3. The tape-and-reel carrier package according to item 2 of the scope of patent application, wherein the pins on the glass substrate are indium tin oxide (ITO) pins. 4. The tape-and-reel carrier package according to item 1 of the patent application scope, wherein the blocking area is formed by a laser beam cutting at high temperature. 5. The tape and reel carrier package described in item 1 of the scope of patent application, Ι 申请 Ι TW1207F (友 达 _ Page 15 1226671 6. Scope of patent application ... The material of the 4 soft substrates is polyimide (polidh, p!). * + t is the tape-and-reel carrier package described in item 1 of the scope of the patent application, and / or the medium-zero insulation layer is a solder resist (SR). 7 · ▲ As described in the first patent application, the tape-and-reel carrier package has a buffer layer, and the buffer layer is disposed on the copper wire pattern layer. And it is located not covered by the insulating layer; 2 Rated buffer layer is used to reduce the thickness of the copper wire pattern layer and the insulating layer8. The tape carrier package as described in item γ of the Shenyan patent scope, The buffer layer is a metal bump. 9. The tape-and-reel carrier package according to item 8 of the scope of the patent application, wherein the material of the metal bump is nickel (Ni). Piece 10: The tape-and-reel carrier package as described in item 8 of the scope of patent application, wherein the material of the metal bump is copper (Cupper, Cu). 11. The tape-and-reel carrier package as described in item 7 of the patent application scope, wherein the buffer layer is a conductive film. Item 12. The tape-and-reel carrier package according to item 1 of the patent application range, wherein the glass substrate is a liquid crystal display panel. 13. A display module, comprising at least: a glass substrate having a display area, a plurality of traces and a plurality of wires 'these wires are electrically connected to a test unit,' the display area The traces are connected to the wires, so that the test unit tests the display area. After the test is completed, the traces form a blocking area 'to block the display area and the display area. The test unit Page 16 TW1207R AUO) .ptd 1226671 Electrical connection; and a tape carrier package (TCP), which is electrically connected to the glass substrate. The tape and conductor package includes a soft substrate; a copper wire pattern layer Are arranged on the flexible substrate; and an insulating layer is used to cover a part of the copper wire pattern layer; Wherein, after the test is completed, the tape carrier package is bonded to the glass substrate, and the insulating layer is in contact with the blocking regions. 14. The display module according to item 13 of the scope of patent application, wherein the glass substrate further includes a plurality of pins, and the display area is connected to the traces through the pins, and the traces are then The wires are arranged substantially vertically and partially connected, and the wires are electrically connected to the test unit, so that the test unit can test the display area. 15. The display module according to item 14 of the scope of patent application, wherein the pins on the glass substrate are Indiuin Tiri Oxide (ITO) pins. 16 · The display module according to item 13 of the scope of patent application, wherein the blocking area is formed by high-temperature cutting of a laser beam. 17. The display module as described in item 13 of the scope of patent application, wherein the material of the soft substrate is polyimide, called 丨 丫 化 丨 仏,? !! ). 18. The display module according to item 13 of the scope of patent application, wherein the insulating layer is a solder resist (SR). 1226671 VI. Scope of patent application 19. As shown in the figure, the tape is placed on the copper conductor and the buffer layer distance. 20. Such as the buffer layer system 21. Such as the metal bump 22. Such as the metal bump 23. Such as the buffer layer 2 4. If the liquid crystal display does not apply for a patent-type carrier sealing pattern layer to reduce patent application for a metal The material of the convex patent application is the patent application. The conductive film applies for the patented module, and the display module described in item 13 of the scope has a buffer layer. The buffer layer is equipped with, And is located in a region not covered by the insulating layer, the display module described in item 19 in a thickness difference range between the copper wire pattern layer and the insulating layer, wherein the display module described in item 0 in the range 20 Group, in which nickel (Ni) 〇 range of the display module described in item 20, wherein copper (copper, Cu) 〇 range of the display module described in item 19, of which ○ range of item 13 The display module described above is one in which the glass substrate is a liquid crystal display panel. TW1207F (AUO) .ptd Page 18