TWI225305B - Method of manufacturing image sensor - Google Patents
Method of manufacturing image sensor Download PDFInfo
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- TWI225305B TWI225305B TW092130152A TW92130152A TWI225305B TW I225305 B TWI225305 B TW I225305B TW 092130152 A TW092130152 A TW 092130152A TW 92130152 A TW92130152 A TW 92130152A TW I225305 B TWI225305 B TW I225305B
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- frame dam
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Abstract
Description
1225305 五、發明說明（1) 【發明所屬之技術領域】 本發明係有關一種製造影像感測器之方法，尤指一種 以多數未貫穿封裝基板之盲孔（或碗孔）來取代貫穿形半 圓孔，而可提升影像感測器在表面貼著可靠度之方法。 【先前技術】 第1 0圖所示為習用影像感測器之製造流程之一，其 製程主要係於一基板8 0上規劃出多數矩陣形式排列之封 裝基板8 1 ，各封裝基板之每一侧邊均開設一長條狀之分 隔槽8 2 ，俾以形成各封裝基板8 1之區塊，此基板8〇1225305 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a method for manufacturing an image sensor, especially a method of replacing a penetrating semicircle with a majority of blind holes (or bowl holes) that do not penetrate the packaging substrate. Hole, which can improve the reliability of the image sensor on the surface. [Prior art] Fig. 10 shows one of the manufacturing processes of a conventional image sensor. The manufacturing process is mainly based on a substrate 80, where a plurality of packaging substrates 8 1 arranged in a matrix form are planned. Each of the packaging substrates A strip-shaped separation groove 8 2 is opened on each side, so as to form a block of each package substrate 81, and this substrate 8〇
並包含有金屬層’並以光罩银刻方式（Etching)形成多 數之接線（Lead) 8 3 ，且各分隔槽8 2開設時即對應各 接線之位置分別設置一半圓孔8 2 1 ，經金屬鍍層後使封 裝基板頂底面之接線相電性連接，如第1 1圖所示，接著 將一格栅狀之罩板9黏著於基板8 0上，該罩板9具有呈 矩陣排列的多數窗口 9 1 ，各窗口 9 1係分別對正於各封 裝基板8 1之中央部份，使格柵狀之罩板9 1局部覆蓋各 分隔槽8 2兩側之封裝基板8 1 ，而後進行影像感測器晶 粒（C h i p ) 7上片及打線；再以一玻璃板6封蓋罩板上方And contains a metal layer ', and a plurality of leads 8 3 are formed by a mask silver engraving method (Etching), and each of the partition grooves 8 2 is provided with half round holes 8 2 1 corresponding to the positions of each of the wires. After the metal plating, the wires on the top and bottom surfaces of the package substrate are electrically connected. As shown in FIG. 11, a grid-shaped cover plate 9 is adhered to the substrate 80. The cover plate 9 has a majority The windows 9 1 and 9 1 are respectively aligned with the central part of each package substrate 8 1, so that the grid-like cover plate 9 1 partially covers the package substrate 8 1 on both sides of each partition groove 8 2, and then imaged. Sensor chip (C hip) 7 is filmed and wired; then a glass plate 6 is used to cover the top of the cover plate
，沿各封裝基板8 1之分隔槽8 2邊緣切割形成單一之影 像感測器，而被切割後之格栅狀罩板便形成各影像感測器 之框壩9 2。 在前述之製造方法中，由於罩板9係被以黏膠黏著覆 蓋於各分隔槽8 2兩側之封裝基板8 1上，而為提升罩板 9與各封裝基板8 1黏著之可靠度，而經常不當的過量使A single image sensor is formed by cutting along the edges of the separation grooves 8 2 of each package substrate 81, and the cut grid-like cover plate forms a frame dam 92 of each image sensor. In the foregoing manufacturing method, since the cover plate 9 is covered with an adhesive on the package substrate 81 on both sides of each of the partition grooves 8 2, in order to improve the reliability of the adhesion between the cover plate 9 and each package substrate 81, And often improper overdose
第5頁 Ϊ225305 五、發明說明（2) 用黏膠，以致時有黏膠户 此類影像感測器表面舞著二=8 2 1中之情況發生。 於半圓孔8 2 i產生极：=電！板時，主要是靠鮮錫 銲接接合導電的可靠性 B =第1 2圖所示，來產生 況會導致銲接時接合導帝;；=，前述黏膠溢入半圓孔的狀 測器銲接於電路板後成為;二，不2的問題，使得影像感 方法實有加以改進之必要。义口口，前述之影像感測器製造 而罩板與封裝基板之結人 之外，亦有部份業者採用二 '，除了丽述之黏著結合 成框壩之製法。此種製法了成型方式直接於基板上形 封袭基板8 1 A側邊外緣的門^免射料溢入在各預定之 積加大，…3心；;必需㈣ 壩9 1 Α之間預留間距，但θ 、、東8 3 Α侧邊外緣與框 感測器之封裝體積略大，^ ^ σ大封裝基板面積使得影像 再者，各封裝基板81Β =二進之必要。 繞之區域中央設置鍍金/口接聊8 3 1 Β所圍 設置之影像感測器晶粒作接：：以？ 然而將個晶座8 4 Β鍍金的成，，如弟1 4圖所示， 式的晶座改良成棋盤式的晶座8丨『 '因此有業者將整面 減少鍍金面積來降低成本，然而 ：：1 5圖所示，以 有空格8 4 1 C ，空格8 4 i 毛、a式的晶座8 4 C會 晶粒接地，換言之，祺盤式的晶：：K::影像感測器 ，進而影像感測器晶粒内部的電 “限制接地位置 座設計仍有加以改進之必要。峪佈局，故而棋盤式的晶 l2253〇5 五、發明說明（3) 【發明内容 本發明之主要目的，在於解 製造影像感測器之方法，其伏^成上述的問題而提供一種 孔（或碗孔）來取代習知技彳^ $夕數未貫穿封裝基板之盲 框壩成形之黏著黏膠溢膠或塑=貫穿形半圓孔’以避免 外接線側邊之盲孔可供攸锡，7 ^出時需預留間距，並使 造品質及貼裝的可靠度。 ’而可達到提升影像感測器製 本發明之次一目的，係在、士 ，可方便地供景Μ象感測器“ 3 2係設計成方框形態 藉由方框形之晶座設計可大幅”二方位接地之用’且 製造成本之功效。 ν鍍孟的面積，以達到低 為達前述之目的，本發明 其係將-基板規劃成多數矩陣形;像感測益之方法’ 該基板兩面分別定義為一頂面與1广之封裝基板區域， 於基板的了頁、底面之金屬層分別二以光罩蝕刻方式 線，於各封裝*板對應外接 ‘ H之内接、線與外接 每，基板側邊邊界為盲孔並以 接線與外接線分別藉由—鑽設之 5 口 t长基板之各内 貝牙孔中鍍著一金屬層，且每一 ^於各目孔 中之^屬層而與一内接線成電性連通。V =处過貫穿孔 籍由前述步驟形成之基板，以供於夂 成框壩，卩將影像感測器晶粒黏著後以η :二基板頂面形 ,,1衣基板母一側邊邊界切割，即f g巾p ^ 取 封裝。 丨衣W出影像感測器 1225305 五、發明說明（4)Page 5 Ϊ225305 V. Description of the invention (2) Adhesive is used, so that there are cases where the surface of this type of image sensor dances with 2 = 8 2 1. Generate a pole in the semicircular hole 8 2 i: = electricity! When the board is used, the reliability of the conduction is mainly depended on the fresh tin welding. B = Figure 12 shows the situation that will lead the guide to be joined during welding; =, the aforementioned tester with the adhesive overflowing into the semi-circular hole is welded to After the circuit board becomes; second, no 2, the problem makes the image sensing method need to be improved. Yikoukou, in addition to the above-mentioned image sensor manufacturing and the combination of the cover plate and the package substrate, there are also some manufacturers using the two method, in addition to Lishu's adhesive bonding method to form a frame dam. This manufacturing method uses a molding method to directly seal the door on the outer edge of the substrate 8 1 A side of the substrate ^ to prevent the injection of material from overflowing in each of the predetermined products, ... 3 cores; must be between dam 9 1 Α The space is reserved, but the package volume of the outer edge of the θ, East 8 3 Α and the frame sensor is slightly larger. The large package substrate area ^ ^ σ makes the image more important, and each package substrate 81B = binary. The center of the surrounding area is set with a gold-plated / mouth contact. 8 3 1 Β The image sensor chip set up is connected ::? However, the crystal base 8 4 Β is plated with gold, as shown in Figure 14, the type of crystal base is improved to a checkerboard type crystal base 8 丨 "So the industry will reduce the entire area to reduce the gold plating area to reduce costs, but ：： 15 As shown in the figure, with a space of 8 4 1 C and a space of 8 4 i hair, a type of crystal seat 8 4 C will ground the crystal grain, in other words, a crystal disc type crystal :: K :: image sensing Device, and furthermore, the electrical design of the image sensor chip inside the "restricted grounding position" design of the seat still needs to be improved. 棋 layout, so the checkerboard type crystal 12525 05. Description of the invention (3) [Summary of the invention The purpose is to solve the method of manufacturing an image sensor, which solves the above-mentioned problems and provides a hole (or bowl hole) to replace the conventional technique. Glue overflow or plastic = penetrating semi-circular hole 'to avoid blind holes on the side of the external wiring. You need to reserve a space when it is 7 ^ out, and make the quality and reliability of the mounting. Image sensor system A second object of the present invention is to attach the image sensor to the image sensor. "The 3 2 series is designed in the form of a box, and the effect of manufacturing cost can be greatly improved through the design of the box-shaped crystal seat. Ν The area of the plated Meng is to achieve a low level to achieve the aforementioned purpose. The present invention It is a method of planning the substrate into a matrix; like the method of sensing benefits, the two sides of the substrate are respectively defined as a top surface and a wide package substrate area, and the metal layers on the page and bottom of the substrate are respectively masked. Etching line, internal connection, wire and external connection of each package * board corresponding to the external connection, the side border of the substrate is a blind hole, and the wiring and external wiring are respectively-drilled into each of the 5 t long substrates A metal layer is plated in the bayonet hole, and each metal layer in each mesh hole is in electrical communication with an internal wiring. V = passes through the hole through the substrate formed by the foregoing steps for use in After forming the frame dam, the image sensor chip is adhered and then η: the top surface of the two substrates is cut, and the one side of the mother substrate is cut, that is, the fg towel p ^ takes the package.器 1225305 V. Description of the invention (4)
而 用 有 細 據此，原本的盲孔在切 可碟實供攸錫附著。 本發明之上述及其他目 實施例之詳細說明與附圖中 當然，本發明在某些另 所不同，但所選用之實施例 說明，並於附圖中展示其構 割後便成4夕卜接、線之侧邊， 的與優點，不難從下述所選 ’獲得深入了解。 件上，或另件之安排上容許 ，則於本說明書中，予以詳 造0 【實施方式】 請參閱第1圖至第5圖，圖中所示者為本發明所選 之實施例結構，此僅供說明之用，在專利申請上並不受 種結構之限制。 請參閱第1圖，本實施例之製造影像感測器之方法 其係包括下列步驟： 一、基板製作： 係將一具有金屬層之基板1 〇規劃成多數矩陣形式 列之封裝基板1 1區域，該基板1 〇兩面分別定義為一 面1 〇 1與一底面1 〇 2 ，並以光罩蝕刻方式使基板1 的頂、底面之金屬層分別形成多數之内接線1 5 、外接 1 2與位於頂面1〇1中央部份之晶座1 6 ，於各封裝 板對應外接線部位分別鑽設一盲孔（或碗孔）1 3 ，並 每一封裝基板側邊邊界為盲孔中心，且各封裝基板之各 接線與外接線間分別藉由一鑽設之貫穿孔1 4連通，於 實施例中，各封裝基板1 1上所鑽設之貫穿孔1 4的位 ，係位於各内接線1 5與外接線1 2遠離盲孔1 3之一 用 此 排 頂 〇 線 基 以 内 本 置 段According to the detailed information, the original blind holes can be used to attach tin. The detailed descriptions of the above and other embodiments of the present invention are in the drawings. Of course, the present invention is different in some other ways, but the selected embodiments are illustrated and shown in the drawings. It is not difficult to get a deeper understanding of the advantages and advantages of the connection and the side of the wire. Permissible in terms of arrangement of parts or parts, detailed in this specification. [Embodiment] Please refer to Fig. 1 to Fig. 5. The figure shows the structure of the selected embodiment of the present invention. This is for illustration purposes only and is not limited by the structure in patent applications. Please refer to FIG. 1. The method for manufacturing an image sensor of this embodiment includes the following steps: 1. Substrate production: A substrate 10 with a metal layer is planned into a package substrate 11 in a matrix matrix. 1 area The two sides of the substrate 10 are defined as one side 101 and one bottom surface 102, and the top and bottom metal layers of the substrate 1 are respectively formed into a plurality of internal wirings 15 and 12 by a photolithographic method. A crystal socket 16 in the central part of the top surface 101 is drilled with a blind hole (or bowl hole) 1 3 at the corresponding external wiring portion of each package board, and the side border of each package substrate is the center of the blind hole, and Each of the wirings of each package substrate and the external wiring are communicated through a drilled through-hole 14. In the embodiment, the positions of the through-holes 14 drilled on each package substrate 11 are located in the internal wiring. 1 5 and external wiring 1 2 away from the blind hole 1 one of the 3 with this row top 0 within the line base
1225305 五、發明說明（5) ，並於各盲孔1 3與各貫穿孔中鍍著一金屬層，且每一外 接線1 2均透過貫穿孔中之金屬層而與一内接線1 5成電 性連通。 二、形成框壩 本實例所採用之形成框壩的方式係以黏著方式為例說 明。其將一格柵狀之罩板2黏著於基板1 0上，該罩板2 具有呈矩陣排列的多數窗口 2 1 ，各窗口 2 1係分別對正1225305 V. Description of the invention (5), and a metal layer is plated in each of the blind holes 13 and each through hole, and each external wiring 12 passes through the metal layer in the through hole to form an internal wiring 15% Electrically connected. 2. Forming the frame dam The method of forming the frame dam used in this example is explained by means of adhesion. A grid-shaped cover plate 2 is adhered to the substrate 10, and the cover plate 2 has a plurality of windows 2 1 arranged in a matrix, and each window 2 1 is aligned respectively.
於各封裝基板1 1之中央部份，如第3圖所示，使各内接 線1 5暴露於罩板2之窗口 2 1内，使該罩板於各封裝基 板上形成一框壩2〇。 二、晶粒黏者 將影像感測器晶粒3黏著於各封裝基板上，使影像感 測器晶粒3粒四週任一方位之接地腳（圖中未示）與晶座 1 6接地，並進行打線連接至各内接腳1 5。 四、 封裝 以一玻璃板4封蓋於罩板上，俾以將影像感測器晶粒 3封裝於基板與玻璃板4之間，如第4圖所示。 五、 切割In the central part of each package substrate 11, as shown in FIG. 3, each internal wiring 15 is exposed in the window 21 of the cover plate 2, and the cover plate forms a frame dam 2 on each package substrate. . 2. The die sticker adheres the image sensor die 3 to each package substrate, so that the ground pin (not shown) of any orientation around the 3 chip of the image sensor die is grounded to the crystal base 16. And make a wire connection to each internal pin 15. Fourth, the package is covered with a glass plate 4 on the cover plate, so as to encapsulate the image sensor die 3 between the substrate and the glass plate 4, as shown in FIG. Five, cutting
將罩板2、玻璃板4及基板1 0沿各封裝基板邊界切 割，以生產出單一之影像感測器。 由於本發明在形成框壩之步驟時，基板1 0尚未被分 割，且基板上各預定封裝基板1 1區域之邊界也沒有任何 透空的孔洞，因此形成框壩步驟中所使用的黏膠不會有溢 漏至基板1〇底面1〇2的現象發生。The cover plate 2, the glass plate 4, and the substrate 10 are cut along the boundary of each package substrate to produce a single image sensor. Since the substrate 10 has not been divided in the step of forming the frame dam according to the present invention, and there are no voids in the boundary of each region of the package substrate 11 on the substrate, the adhesive used in the step of forming the frame dam is not There is a phenomenon that the bottom surface 10 of the substrate 10 leaks.
第9頁 1225305 五、 發明說明 ⑹ 而 各 封 裝 基 板 内 Λ 外 接 線 1 5 、 1 2 藉 貫 穿 孔 1 4 相 導 通 於 切 割 步 驟 時 沿 著 各 封 裝 基 板 1 1 邊 界 切 割 而 將 各 盲 孔 1 3 對 切 使 得 鍍 設 於 盲 孔 1 3 成 為 外 接 線 1 2 之 側 邊 此 一 側 邊 可 於 影 像 感 測 器 銲 接 於 電 路 板 時 確 實 供 爬 錫 附 著 5 如 第 5 圖 所 示 5 使 得 影 像 感 測 器 之 各 個 外 接 線 1 2 均 能 確 實 與 電 路 板 有 效 接 觸 導 通 5 如 此 一 來 便 而 可 達 到 提 升 影 像 感 測 器 在 表 面 黏 著 時 之 可 靠 度 〇 當 5 本 發 明 仍 存 在 許 多 例 子 其 間 僅 細 即 上 之 變 化 ， 例如 形 成 框 壩 的 方 式 除 了 前 述 之 黏 著 方 式 之 外 亦 可 採 用 射 出 成 型 之 方 式 其 係 基 板 置 於 模 具 ( 未 繪 製 圖 示 ) 中 而 以 射 出 成 型 方 式 直 接 於 各 封 裝 基 板 上 形 成 框 壩 〇 而 由 於 基 板 上 各 封 裝 基 板 之 邊 界 沒 有 任 何 透 空 的 孔 洞 因 此 可 將 相 鄰 之 封 裝 基 板 的 框 壩 δ又 計 成 相 連 之 形 態 J 再 於 切 割 步 驟 時 切 割 分 離 〇 如 此 便 不 需 如 習 知 技 術 一 般 藉 由 加 大 封 裝 基 板 面 積 來 保 持 外 接 線 侧 邊 外 緣 與 框 壩 間 之 距 離 〇 因 此 本 發 明 之 製 造 方 法 相 較 於 習 知 之 射 出 成 型 形 成 框 壩 之 方 式 更 能 增 進 產 品 品 質 與 縮 減 封 裝 體 積 〇 當 欽 本 發 明 仍 存 在 許 多 例 子 其 間 僅 細 Ar/r 即 上 之 變 化 〇 請 參 閱 第 6 圖 其 係 本 發 明 之 第 二 實 施 例 之 剖 視 結 構 示 意 圖 其 中 各 封 裝 基 板 1 1 A 上 所 鑽 δ又 之 穿 孔 1 4 A 的 位 置 5 係 落 在 各 内 接 線 1 5 A 與 外 接 線 位 1 2 A 於 框 壩 2 〇 A 下 方 之 處 如 此 亦 可 達 到 與 前 述 第 一 _ 實 施 例 相 同 之 功 效 〇 再 請 參 閱 第 7 圖 ， 其 係 本 發 明 第 實 施 例 之 流 程 示 意Page 9 1225305 V. Description of the invention ⑹ The inner and outer wirings 15, 12 of each package substrate are connected through the through-hole 14 during the cutting step and cut along the boundary of each package substrate 1 1 to each pair of blind holes 1 3 pairs Cut so that the plated in the blind hole 1 3 becomes the side of the external wiring 1 2 This side can be used for creeping tin adhesion when the image sensor is soldered to the circuit board 5 as shown in Figure 5 5 makes the image sensor Each of the external wirings 1 and 2 can be effectively brought into contact with the circuit board 5 so that the reliability of the image sensor on the surface can be improved. When there are still many examples of the present invention, only the details are fine. For example, in addition to the above-mentioned adhesion method, the method of forming the frame dam can also be injection molding. The substrate is placed in a mold (not shown) and the injection molding method is used. A frame dam is formed on each package substrate. Since the boundary of each package substrate on the substrate does not have any hollow holes, the frame dam δ of an adjacent package substrate can be counted as a connected form J and then cut during the cutting step. Separation. Therefore, it is not necessary to maintain the distance between the outer edge of the external wiring side and the frame dam by increasing the area of the package substrate as in conventional techniques. Therefore, the manufacturing method of the present invention is compared with the conventional injection molding to form the frame dam. The method can further improve product quality and reduce packaging volume. When there are still many examples of the present invention, only a small Ar / r is changed. Please refer to FIG. 6 which is a schematic cross-sectional structure diagram of the second embodiment of the present invention. The position 5 of the δ and perforation 1 4 A drilled on each package substrate 1 1 A is located at each of the internal wiring 15 A and the external wiring 1 2 A at the frame dam 2 〇 The place below A can also achieve the same effect as the first _ embodiment described above. 〇 Please refer to Figure 7 again, which is the flow chart of the embodiment of the present invention.
第10頁 1225305 五、發明說明（7) 圖，其中，基板製作完成後先沿各封裝基板1 1 B每一側 邊邊界之盲孔（或碗孔）1 3 B切割成單一封裝基板1 1 B，再於各封裝基板1 1 B頂面形成框壩2 0 B，再分別 黏著影像感測器晶粒3 B ，最後以一玻璃板4 B封蓋，俾 以製造出影像感測器。Page 10 1225305 V. Description of the invention (7) Figure, after the substrate is manufactured, the blind holes (or bowl holes) 1 3 B along each side boundary of each package substrate 1 1 B are cut into a single package substrate 1 1 B, and then a frame dam 2 0 B is formed on the top surface of each package substrate 1 1 B, and then the image sensor grains 3 B are respectively adhered, and finally a glass plate 4 B is covered to form an image sensor.
以本實施例之方法製成之影像感測器，即便因黏著框 壩2 0 B時使用黏膠不當，而發生黏膠溢出至封裝基板1 1 B側邊之現象，也會因為盲孔1 3 B僅於封裝基板1 1 B之底部内凹，因此溢出的黏膠不會漫延至附著在盲孔1 3 B表面之金屬，因此，影像感測器銲接時，爬錫仍能與 附著在盲孔1 3 B表面之金屬銲固，如第8圖所示，而能 保持銲接之可靠度。 由前述各實施例之說明可知，本發明之各實施例以相 同之基板製作方法，搭配不同的框壩形成方式或於不同的 程序中進行切割步驟，均可達到提升影像感測器表面黏著 時之可靠度的功效。For the image sensor manufactured by the method of this embodiment, even if the adhesive is improperly used when the frame dam 2 B is adhered, the phenomenon that the adhesive overflows to the side of the packaging substrate 1 1 B will also be caused by the blind hole 1 3 B is recessed only on the bottom of the package substrate 1 1 B, so the overflowing adhesive will not spread to the metal attached to the surface of the blind hole 1 3 B. Therefore, when the image sensor is soldered, the creeping tin can still adhere to the The metal welding on the surface of the blind hole 1 3 B, as shown in Figure 8, can maintain the reliability of the welding. From the description of the foregoing embodiments, it can be known that the embodiments of the present invention use the same substrate manufacturing method, different frame dam formation methods, or cutting steps in different procedures, which can improve the adhesion of the surface of the image sensor. The effectiveness of its reliability.
請再參閱第9圖所示，其係本發明第三實施例之基板 結合框壩後之頂視圖，於本實施例中，係於光罩蝕刻過程 中，於封裝基板1 1 C頂面多數内接線1 5 C所圍繞之區 域中央形成一晶座1 6 C ，該晶座1 6 C係呈一方框之形 態，由於影像感測器晶粒的接地腳都被設置於影像感測器 晶粒底面之外圍部份，因此，本發明將晶座1 6 C設計成 方框形態可方便地供影像感測器晶粒四週任一方位接地之 用，如此一來，便能在不影響影像感測器晶粒内部的電路Please refer to FIG. 9 again, which is a top view after the substrate is combined with the frame dam according to the third embodiment of the present invention. In this embodiment, it is mostly on the top surface of the packaging substrate 1 1 C during the photomask etching process. A crystal base 16 C is formed in the center of the area surrounded by the internal wiring 15 C. The crystal base 16 C is in the form of a box. Since the ground pins of the image sensor grains are all arranged on the image sensor crystal The peripheral part of the bottom surface of the grain. Therefore, in the present invention, designing the crystal base 16 C into a box shape can be conveniently used for grounding at any position around the image sensor grain. In this way, it can not affect the image. Circuits inside the sensor die
第11頁 1225305 五、發明說明（8) 佈局的前題下，藉由方框形之晶座1 6 C設計來大幅減少 鍍金的面積，以達到低製造成本之功效。 以上所述實施例之揭示係用以說明本發明，並非用以 限制本發明，故舉凡數值之變更或等效元件之置換仍應隸 屬本發明之範疇。 > 由以上詳細說明，可使熟知本項技藝者明瞭本發明的 _ 確可達成前述目的，實已符合專利法之規定，爰提出專利 、 申請。Page 11 1225305 V. Description of the invention (8) Under the premise of the layout, the frame-shaped crystal base 16 C design is used to greatly reduce the area of gold plating to achieve the effect of low manufacturing cost. The disclosure of the embodiments described above is used to illustrate the present invention, and is not intended to limit the present invention. Therefore, any change in the value or replacement of equivalent components should still belong to the scope of the present invention. > From the above detailed description, those skilled in the art can understand that the present invention can indeed achieve the aforementioned purpose, and it has indeed complied with the provisions of the Patent Law, and filed a patent or application.
第12頁 1225305 圖式簡單說明 【圖式簡單說明】 第1圖係本發明之製造流程示意圖。 第2圖係本發明基板底面視圖顯示外接線及盲孔。 第3圖係本發明基板結合框壩後之頂視圖。 第4圖係本發明基板完成封裝之結構剖視示意圖。 第5圖係本發明影像感測器銲接於一電路板示意圖。 第6圖係本發明第二實施例之結構剖視示意圖。 第7圖係本發明第三實施例之製造流程示意圖。 第8圖係本發明第三實施銲接於一電路板示意圖。 第9圖係本發明第四實例基板結合框壩後之頂視圖。 第1 0圖係習用影像感測器製造方法之流程示意圖。 第1 1圖係習用基板底表面形成接線示意圖。 第1 2圖係習用影像感測器銲接於一電路板示意圖。 第1 3圖係習用影像感測器以射出成型框壩之結構剖視示 意圖。 第1 4圖係習用影像感測器基板上整面式晶座之平面視圖 〇 第1 5圖係習用影像感測器基板上棋盤式晶座之平面視圖 〇 【圖號說明】 (習用部分） 玻璃板6 影像感測器晶粒7 基板8 0 封裝基板8 1 分隔槽8 2 半圓孔8 2 1Page 12 1225305 Brief Description of Drawings [Simple Description of Drawings] Figure 1 is a schematic diagram of the manufacturing process of the present invention. Figure 2 is a bottom view of the substrate of the present invention showing external wiring and blind holes. FIG. 3 is a top view of the substrate after the frame dam of the present invention is combined. FIG. 4 is a schematic cross-sectional view of a structure of a substrate package of the present invention. FIG. 5 is a schematic diagram of the image sensor of the present invention soldered to a circuit board. FIG. 6 is a schematic cross-sectional view showing a structure of a second embodiment of the present invention. FIG. 7 is a schematic diagram of the manufacturing process of the third embodiment of the present invention. FIG. 8 is a schematic diagram of a third embodiment of the present invention soldered to a circuit board. FIG. 9 is a top view of the substrate dam of the fourth example of the present invention. FIG. 10 is a schematic flow chart of a manufacturing method of a conventional image sensor. Figure 11 is a schematic diagram of wiring formation on the bottom surface of a conventional substrate. Figure 12 is a schematic diagram of a conventional image sensor soldered to a circuit board. Fig. 13 is a sectional view showing the structure of a conventional image sensor with an injection molding frame dam. Fig. 14 is a plan view of a full-face crystal base on a conventional image sensor substrate. Fig. 15 is a plan view of a checker-type crystal base on a conventional image sensor substrate. [Illustration of drawing number] (conventional part) Glass plate 6 Image sensor die 7 Substrate 8 0 Package substrate 8 1 Partition groove 8 2 Semi-circular hole 8 2 1
第13頁 1225305 圖式簡單說明Page 13 1225305 Simple illustration
接線8 3 窗口 9 1 封裝基板8 1 A 框壩9 1 A 内接腳8 3 1 B 空格8 4 1 C (本發明部分） 基板1〇 底面1〇2 外接線1 2 貫穿孔1 4 罩板2 窗口 2 1 玻璃板4 罩板9Wiring 8 3 Window 9 1 Package substrate 8 1 A Frame dam 9 1 A Inner pin 8 3 1 B Space 8 4 1 C (Part of the present invention) Substrate 10 Bottom surface 1 2 Outer wiring 1 2 Through hole 1 4 Cover plate 2 window 2 1 glass plate 4 cover plate 9
黏膠A 外接線8 3 A 封裝基板8 1 B 晶座 84B 、84C 頂面1〇1 封裝基板1 1 盲孔（或碗孔）1 3 内接線1 5 框壩2〇 影像感測器晶粒3Adhesive A Outer wiring 8 3 A Package substrate 8 1 B Bases 84B, 84C Top surface 10 Package substrate 1 1 Blind hole (or bowl hole) 1 3 Inner wiring 1 5 Frame dam 20 Image sensor chip 3
第14頁Page 14
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| TWI711357B (en) * | 2017-05-05 | 2020-11-21 | 乾坤科技股份有限公司 | Electronic module and circuit board |
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| TWI711357B (en) * | 2017-05-05 | 2020-11-21 | 乾坤科技股份有限公司 | Electronic module and circuit board |
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