1224129 A7 B7 五、發明説明（1 ) 〔.發明背景〕 本發明關係於通孔配線板。 有關於用以於印刷配線板上形成導電電路的製程，其 中有一種製程被描述於1 9 9 4年十月之”電子材料”第 4 2 - 4 6頁中，一導電電路係使用由混合導電粉末，例 如金，銀，銅，碳等及結合劑，有機溶液及可選用之添加 劑所取得之膏料加以形成。於需要高導電性之領域中，金 粉或銀粉已經被使用。 一含有銀粉末之導電膏料係用以形成印刷配線板，電 子元件等或電子電路之配線層（導電層）及電子元件之電 極，因爲其良好導電率之故。然而，此一膏料當一電場施 加至一高溫及高濕環境中時係不利的，被稱爲遷移之電沉 積發生於電子電路或電極上，使得一短路係產生於電極或 配線之間。用以防止遷移之幾項方法已經被採用。例如在 導體之表面上施加防濕材料或加入腐鈾抑制劑（例如含氮 化合物）至導電膏料中己經被提出，但並非有足夠之效率 — I — — — — — (請先閱讀背面之注意事項再填寫本頁) 訂 f 經濟部智慧財產笱員工消費合作社印製 〔發明槪要〕 本發明想要提供一通孔配線板，其係沒有上述先前技 藝的缺點，允許容易形成通孔之電氣連接，並於連接上具 有一高度可靠性，並具有一小厚度之導電材料形成於銅箔 凸起上。 本發明提供一通孔配線板，其包含諸通孔通過一基板 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -4- 1224129 經濟部智慧財產局員工消費合作钍印製 A7 B7 五、發明説明（2 ) 並被塡充以導電材料；銅箔凸起及銅箔電路形成於該基板 之表面上；絕緣層形成於該等銅箔電路上並於銅箔凸起及 銅箔電路之必要部份；及由另一導電材料所形成之印刷電 路（跳線電路），該導電材料具有與塡充該銅箔電路部份 上之通孔不同之組成物，及銅箔凸起及絕緣層，除了不必 用以導電之部份之外；其中印刷電路板及通孔之末端係電 氣連接具有與塡充通孔不同組成物之導電材料。 〔圖式之簡要說明〕 第1圖爲依據本發明之一例子之通孔配線板之剖面圖 〇 第2圖爲使用導電膏料連接之通孔的狀態的剖面圖。 第3圖爲通孔係爲鍍銅加以連接之狀態的剖面圖。 第4圖爲導電膏料塡充通孔，作爲多層印刷配線板之 .層間連接之狀態的剖面圖。 第5圖爲傳統通孔配線板之剖面圖。 第6圖爲覆蓋鍍膜被形成於塡充通孔之導電膏料末端 上之狀態的剖面圖。 第7圖爲通孔被電鍍連接及於通孔中之空間被塡充以 樹脂組成物之狀態的剖面圖。 第8圖爲一形成於聚乙烯-對酸鹽膜。 第9圖爲形成於附銅箔黏著膜中之非通孔之剖面圖。 第10圖爲形成於一紙酚銅積層板上之導體的平面圖 本紙張尺度適用中國國家榡準（CNS) A4規格（210X297公釐） 訂 - (請先閱讀背面之注意事項再填寫本頁) -5- 1224129 A7 B7五、發明説明（3 ) .第1 1圖爲形成於一紙酚銅積層板上之測試圖案之平 面圖。 〔符號說明〕 經濟部智慧財產苟員工消費合作社印製 1 導 電 膏 料 2 鍍 銅 膜 3 基 板 4 導 電 層 5 絕 緣 層 6 跳 線 電 路 7 銅 箔 凸 起 8 銅 箔 電 路 9 上 塗 覆 層 1 0 通 孔 1 1 銅 箔 電 路 1 2 蓋 鍍 膜 1 3 樹 脂 1 4 銅 箔 1 5 測 試 圖 案 1 6聚對苯二甲酸乙烯脂 1 7通孔 1 8黏著膜 1 9銅箔 2 0銅積層板 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閲讀背面之注意事項再填寫本頁) 訂 f -6 - 經濟部智慧財產笱員工消費合作社印製 1224129 A7 _ _B7 _ 五、發明説明（4 ) 2 1導體 2 2測試圖案 〔本發明之詳細說明〕 本發明之通孔配線板包含諸通孔通過一基板並被塡充 以導電材料；銅箔凸起及銅箔電路形成於該基板之表面上 ;絕緣層形成於該等銅箔電路上並於銅箔凸起及銅箔電路 之必要部份；及由另一導電材料所形成之印刷電路（跳線 電路），該導電材料具有與塡充該銅箔電路部份上之通孔 不同之組成物，及銅箔凸起及絕緣層，除了不必用以導電 之部份之外；其中印刷電路板及通孔之末端係電氣連接具 有與塡充通孔不同組成物之導電材料。· 於一含銀粉末之導電膏料中，銀粉末含量應增加，以 取得具有良好電阻之導體。此一導電膏料係不利於它的價 格，因爲銀粉末昂貴之故。當塗銀銅粉末被使用時，遷移 可以被改良並且可以取得一不貴之導電膏料。然而，當銀 塗層均勻及厚時，遷移並不能被改良。再者，塗銀銅粉末 係不利於銲接不能直接進行於導電膏料的塗膜上。使用銀 粉末之導電膏料係不利於當其受到銲接時，造成了於銲接 時之銀的損失，使得無法取得足夠之接合。 另一方面，於使用銅粉末之導電膏料中，於固化後之 受熱的銅的氧化很高。因此，於空氣中所取得之氧及一結 合劑與銅粉末反應，以於銅粉末之表面形成氧化物膜，造 成很低之導電率。因此，已經揭示銅膏料，其由於用以防 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） " I ： n 訂 I n I (請先閲讀背面之注意事項再填寫本頁) 1224129 經濟部智慧財產笱員工消費合作社印製 A7 _B7_五、發明説明（5 ) 止銅粉末之氧化所加入之各種添加劑之故，而具有穩定導 電率。於導電率上，銅膏料係劣於銀膏料並於儲存穩定度 較差。再者，傳統銅膏料並不利，在於銲接並不能直接進 行於銅膏料之塗覆膜上。 因爲，如上所述，一已知導電膏料並不能直接受到銲 接，所以銲接已經進行於銅表面上，該銅表面係藉由使導 電膏料的塗覆膜受到一活化處理然後無電電，鍍或藉由於 電鍍溶液中，藉由使用一導電膏料之塗覆膜作爲陰極，而 執行銅電鍍。 然而，若於塗覆膜及鍍銅膜間之積層間結合並不可靠 的話，則此方法並不實用。因此，一電路形成製程可以藉 由開發一可以受到銲接而不必無電電鍍或有電電鍍之導電 膏料，而加以大量縮短。因此，開發的優點很大。 銲錫係容易地結合至部份金屬中，但並不能結合至一 黏結劑。理想上，於導電銲接中，一只由導電粉末所構成 之塗覆膜係被形成及銲接係被進行於塗覆膜上。然而，當 單獨使用導電粉末時，於形成塗覆膜之可靠性及工作效率 並不足夠。 因此，導電粉末在被作成爲黏結劑所使用之導電膏料 後才被使用。然而，當黏著劑之比例增加，因爲其重要性 係相當於形成塗覆膜中之可靠性及工作效率，所以黏著劑 覆蓋金屬之導電粉末，使得銲錫不會與導電粉末接觸。因 此，銲錫並不會黏著至導電粉末，造成低導電率。 爲了取得銲錫黏著之導電膏料，膏料組成必須儘可能 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -8 - 1224129 A7 ____B7_ 五、發明説明（6 ) (請先閱讀背面之注意事項再填寫本頁} 接觸銅箔的組成。即，組成必須當導電膏料被放置某一空 間時，導電粉末之塡充特性很高，使得黏著劑只佔用於導 電粉末粒子間所形成之空間之總體積。 然而，當如上述導電粉末的比例增加時，導電膏料的 黏性大量地增加，使得導電膏料的生產變得困難，並且， 施加導電膏料的工作效率降低。再者，因爲可以黏結導電 粉末之個個粒子之黏著劑的比例很低，.塗覆膜之強度降低 。因此，當黏結藉由使用導電膏料進行銲接時，導電膏料 應於可銲接性，導電性，工作效率及強度間，達到一良好 平衡。 使用導電膏料的方法包含藉由施加由分散導電粉末於 黏著劑所取得之導電膏料於基板之表面上，或以導電膏料 塡充該等通孔，而形成示於第2圖中之導電層。於第2圖 中，編號1表示導電膏料。 至於，另一於形成於印刷配線板中之每一通孔中，形 成導電層的方法，該方法中，導電層係藉由在通孔之每一 內表面上形成一鍍銅膜2加以形成，這係如於第3圖所示 經濟部智慧財產局員工消費合作社印製 〇 一般而言，當積層間連接係使用一塡充導電膏料，以 塡充通孔加以形成時，雖然諸通孔很小，但仍需要一高導 電性。因此，導電膏料應被儘可能地塡入孔中’使得諸孔 可以被塡充，這係例如於第4圖所示。因此’一傳統導電 膏料應增加導電粉末之比例。然而，當導電粉末的比例增 加時，使得塡入孔中之塡充特性變差。另一方面’當黏著 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -9- 經濟部智慧財產局員工消費合作社印製 1224129 A7 ___B7 五、發明説明（8 ) 稱印刷電路）而取得一多層電路板係不利的，這在於諸通 孔中之孔隙應被去除，以增加通孔1 〇連接至銅箔凸起7 ，銅箔電路8及印刷電路之可靠性。於第5圖中，編號4 表示一導電層，編號6爲一跳線電路，及編號9爲一外塗 層。 當一多層電路板藉由使用形成於每一通孔內表面上之 鍍銅膜，而分配導電性給諸通孔時，上述缺點可以藉由於 每一通孔內表面形成鍍銅膜，然後，形成一覆蓋鍍膜1 2 於塡充通孔之導電膏料1上，如於第6圖所示，而加以去 除。然而，此製程並不想要的，因爲其需要增加之步驟， 因而，造成一更高之成本。 如於第7圖所示，有另一製程，其包含於每一通孔之 內表面上形成一鍍銅膜2，以形成導電層並以一樹脂1 3 塡充該空間。此製程之缺點爲它造成了高成本，因爲其需 要增加步驟。 另一製程則包含以一無孔隙或實質無孔隙導電材料， 來塡充通孔，以確保通孔之導電性，然後，在基板表面上 ，形成絕緣層及印刷電路。此製程之缺點爲連接之可靠性 低，因爲塡充通孔及之導電材料及銅箔凸起部份係連接至 銅箔之邊緣部份。爲了避免此困擾，上述覆蓋鍍膜必須被 形成。然而，此製程並不想要的，因爲其需要增加步驟並 造成了一高成本。 另外，當一多層電路板係使用銀通孔配線板加以生產 ，配線板具有被塡充以銀導電材料（銀膏料）之通孔’並 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ---------------IT------^_wl (請先閱讀背面之注意事項再填寫本頁) -11 - 1224129 A7 __B7 五、發明説明（9 ) (請先閲讀背面之注意事項再填寫本頁) 在配線板之表面上形成絕緣層及印刷電路時，形成於通孔 中之孔隙降低了可靠性。即，當離子雜質於淸洗步驟等保 留於孔隙中時，對遷移之阻抗被降低。當使用銀通孔配線 板時，銀膏料係厚厚地形成於銀箔凸起上。於部份例子中 ，厚銀膏料阻礙了元件之安裝。 本發明解決了上述之問題。較佳實施例係如下。 (1 ) 一通孔配線板包含：通孔，通過一基板並被塡 充以導電材料；銅箔凸起及銅箔電路形成於基板之表面上 ;絕緣層，形成於銅箔電路上並於銅箔凸起及銅箔電路之 必要部份間；及印刷電路，以另一導電材料形成，該導電 材料具有不同於塡充銅箔電路一部份上之通孔之組成，及 銅箔凸起及絕緣層不同之組成，除了不必要導電之部份外 ;其中印刷電路及通孔之末端係電氣連接至一與塡充通孔 不同組成之導電材料。 (2 )依據上述項目（1 )之通孔配線板，其中該塡 充該等通孔之導電材料係爲一無孔隙或實質無孔隙之導電 材料。 經濟部智慧財產局員工消費合作社印製 (3 )依據上述項目（2 )之通孔配線板，其中該塡 充諸通孔之導電材料包含實質球形導電粉末，及形成於絕 緣層上之印刷電路板係爲一導電材料，其包含銀及銅及銀 粉末之複合導電粉末。 (4 )依據上述項目（1 )至（3 )中之任一項目所 述之通孔配線板，其中該塡充通孔之導電材料或用以形成 印刷電路之導電材料係爲一膏狀導電材料（導電膏料）。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -12- 1224129 A7 _____B7 五、發明説明（1〇 ) (請先閱讀背面之注意事項再填寫本頁) (5 )依據上述項目（4 )之通孔配線板，其中該導 電膏料包含一黏結劑及一導電粉末，及黏結劑之主要成份 爲一烷氧基原子團-包含可熔酚醛樹脂，液態環氧樹脂及 用於這些樹脂之固化劑。 (6 )依據上述項目（4 )之通孔配線板，其中該導 電膏料包含一黏著劑及一導電粉末，並具有一3:7.5 之比重。 (7 )依據上述項目（6 )之通孔配線板，其中該導 電膏料中黏結劑及導電粉末之比例（以固體計）係黏結劑 對導電粉末之容積比爲35 : 65至65 : 35。 (8 )依據上述項目（6 )或（7 )之通孔配線板， 其中黏結劑之主要成份爲烷氧基原子團-包含可熔酚醛樹 脂，液態環氧樹脂及用於這些樹脂之固化劑。 (9 )依據上述項目（5 )或（8 )之通孔配線板， 其中該烷氧基-包含可熔酚醛樹脂係爲一可熔酚醛樹脂， 其係由1至6碳原子之一或多數烷氧基所替代。 (10) 依據上述項目（5) ，（8)或（9)之通 經濟部智慧財產^g (工消費合作社印製 孔配線板，其中該烷氧基-包含可熔酚醛樹脂係爲具有烷 氧基化作用比5至95%者。 (11) 依據上述項目（5) ，（8) ，（9)或（ 1 0 )之通孔配線板，其中該烷氧基-包含可熔酚醛樹脂 具有5 0 0至2 0 0 0 0 0之重量平均分子量。 (1 2)依據上述項目（5)至（1 1 )之任一項目 之通孔配線板，其中該導電粉末係爲銀，銅及塗銀銅粉末 本紙張尺度適用中國國家標準（CNS ) A4規格（ 210X 297公釐） ~ -13 - 1224129 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（11 ) 之一或兩個或多數之混合。 (1 3)依據上述項目（5)至（1 2)之任一項目 之通孔配線板，其中該導電粉末係去聚結球形或實質球形 導電粉末。 (1 4)依據上述項目（5)至（1 3)之任一項目 之通孔配線板，其中該導電膏料中黏結劑及導電粉末比例 (以固體計）係黏結劑對導電粉末之重量比爲3 : 9 7至 17:83° (15)依據上述項目（5)至（14)之任一項目 之通孔配線板，其中該烷氧基-包含可熔酚醛樹脂及液態 環氧樹脂之混合比例係於可熔酚醛樹脂對液態環氧樹脂之 重量比爲10:90至90:10。 (1 6 )依據上述項目（4 )之通孔配線板，其中該 導電膏料包含導電粉末及一黏結劑；導電膏料中導電粉末 及黏結劑之比例（以固體計）係於導電粉末對黏結劑之體 積比有4 5 : 5 5至79 : 2 1及於導電粉末對黏結劑之 重量比爲88: 12至96. 5:3.55，及導電膏料 之固化產品之玻璃轉變點係4 0 °C至1 8 0 °C。 (1 7 )依據上述項目（1 6 )之通孔配線板’其中 該黏結劑係主要由一環氧樹脂組成及一用於該組成之固化 劑構成，該環氧樹脂之環氧當量爲1 6 0至3 3 0 g/ e q 〇 (1 8 )依據上述項目（1 7 )之通孔配線板’其中 該環氧樹脂組成包含一環氧樹脂及一撓性劑’該環氧樹脂 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -14- 1224129 經濟部智慧財產局S工消費合作社印製 A7 _____B7五、發明説明（12 ) 於一般溫度下爲液態，該環氧樹脂及撓性劑之混合比例係 爲環氧樹脂對撓性劑之重量比例爲4 〇 : 6 0至9 0 : 10° (19) 依據上述項目（16) ，（17)或（18 )項所述之通孔配線板，其中該導電粉末爲一鍍銀銅粉末 或銅合金粉末，其具有〇 . 1至；[.〇m2/g之比表面積 ’ 1至1 · 5之長寬比及1至2 0微米之平均粒子尺寸（ 粒子之平均長度），及導電粉末係實質球形導電粉末，其 中，銅粉末或銅合金粉末之外露面積係1 〇至6 0%。於 銅合金中之金屬爲少或微量之Sn，Ni ，Zn，Co， Mn，Fe，Pb，S 等。 (20) 依據上述項目（16)至（19)中任一項 目之通孔配線板，其中該導電粉末係爲銅粉末或銅合金粉 末，其表面係實質被塗覆以表面外露之銀，該導電粉末之 形狀係實質球形。 (2 1 )依據上述項目（4 )之通孔配線板，其中該 導電膏料包含導電粉末，一黏結劑及一溶劑；該導電粉末 係爲銅粉末或銅合金粉末，其表面係被實質塗覆以一部份 外露之銀；及該導電粉末具有片狀或片形，3比2 0之長 寬比，及5至3 0微米之平均粒子尺寸（粒子之平均長度 )° (22) 依據上述項目（21)之通孔配線板，其中 該銅粉末或銅合金粉末之外露區域係爲1 〇至6 0 % ° (23) 依據上述項目（21)或（22)之通孔配 (請先閱讀背面之注意事項再填寫本頁} 本紙張尺度適用中國國家標隼（CNS ) A4規格（210X 297公釐） -15- 經濟部智慧財1^員工消費合作社印製 1224129 A7 _B7_ 五、發明説明（13 ) 線板，其中該溶劑被以導電膏料之重量計，被包含於2至 2 0重量百分比之數量。 (2 4 )依據上述項目（2 1 )至（2 3 )中任一項 目之通孔配線板，其中該溶劑之沸點係爲1 5 0 °C至 2 6 0 °C。 (2 5 )依據上述項目（4 )之通孔配線板，其中該 導電膏料包含一黏結劑及導電粉末，及導電粉末大致呈球 形，4 · 5至6 . 2g/cm3之堆積密度及50至68% 之相對密度。 (2 6 )依據上述項目（2 5 )之通孔配線板，其中 該導電粉末係爲銅粉末及銅合金粉末，其表面係被實質塗 覆以具有一部份外露之銀；及導電粉末大致呈球形。 (27) 依據上述項目（25)或（26)之通孔配 線板，其中該導電粉末係爲銅粉末或銅合金粉末，其具有 1比1 · 5之長寬比，及1至20微米之平均粒子尺寸（ 粒子之平均長度），及導電粉末係實質球形導電粉末，其 中銅粉末或銅合金粉末之外露面積係爲1 0至6 0%。 (28) 依據上述項目（12)至（27)中之任一 項目之通孔配線板，其中該導電膏料中導電粉末及黏結劑 之比例（以固體計）係於導電粉末對黏結劑之重量比爲 88:12 對 96. 5:3.5。 (29) 依據上述項目（1)至（28)中任一項目 之通孔配線板，其中該述於項目（1 )中之塡充通孔之導 電材料係爲項目（5)至（1 5)中任一項目之導電膏料 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 訂 - (請先閱讀背面之注意事項再填寫本頁) -16- 1224129 A7 __ B7_______ 五、發明説明（14 ) (請先閱讀背面之注意事項再填寫本頁) 項目（1 )之晶片元件予以用銲錫附著之銅箔係連接至 塡充通孔之導電膏料的末端，藉由使用項目（1 6 )至（ 2 8 )中任一項目之導電膏料，而於銅箔凸起上進行印刷 •，及未以銲錫附著晶片元件之項目（1 )之銅箔凸起係連 接至塡充通孔之導電膏料的末端，藉由使用由銀及銅及銀 粉末並如項目（3 )之複合導電粉末所備製之導電膏料’ 而在銅箔凸起上進行印刷。 本發明之如上述實施例（1 )之態樣提供一通孔配線 板，其允許容易形成通孔之電氣連接，並於連接上具有高 可靠性，並具有小厚度之導電材料，形成於銅箔凸起上。 本發明之如上述實施例（2 )之態樣提供一通孔配線 板，其依據如於實施例（1 )所述之態樣，具有特別高之 可靠性於連接上。 本發明之如上述實施例（3 )之態樣提供一通孔配線 板，其優點在於除了如於實施例（1 )所述之態樣優點外 ，也提供了良好之導電材料塡充入通孔之特性及對形成於 絕緣層上之印刷電路之遷移的阻抗。 經濟部智慧財凌局員工消費合作社印製 如於實施例（4 ) ，（ 5 )及（6 )所述之本發明之 每一態樣均提供了 一通孔配線板，其使用導電性及塡充特 性優良之導電膏料進入通孔或非通孔中。 如於實施例（7 )至（1 5 )所述之本發明之每一態 樣均提供一通孔配線板，其使用於進入通孔或非通孔之塡 充特性優良及改良導電作用之導電膏料。 如於實施例（1 6 )所述之本發明態樣提供一通孔配 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ~ -' 1224129 A7 B7 五、發明説明（15 ) 線板，其使用銲接力優良之導電膏料。 (請先閲讀背面之注意事項再填寫本頁) 如於實施例（1 7 )至（2 0 )所述之本發明態樣提 供一通孔配線板，其使用具有優良可銲接性改良作用之導 電膏料。 如於實施例（2 1 )所述之本發明態樣提供一通孔配 線板，其使用具有優良銲接力及導電性之導電膏料。 如於實施例（2 2 )所述之本發明態樣提供一通孔配 線板，其使用於銲接力改良作用及對遷移阻抗優良之導電 膏料。 如於實施例（2 3 )及（2 4 )所述之本發明態樣提 供一通孔配線板，其使用具有如於實施例（2 1 )及（ 2 2 )所述之對遷移阻抗優良及優良工作效率之導電膏料 〇 如於實施例（2 5 )所述之本發明態樣提供一通孔配 線板，其使用銲接力優良之導電膏料。.. 如於實施例（2 6 )至（2 8 )所述之本發明態樣提 供一通孔配線板，其使用改良銲接力作用之導電膏料。 經濟部智慧財產苟員工消費合作社印製 如於實施例（2 9 )所述之本發明態樣提供一通孔配 線板，其中用於在予以銲接晶片元件之一側上之銅箔凸起 銲接的銲接可濕潤性係良好的，用於這些銅箔凸起之連接 特性係優良的，及對沒有晶片元件予以連接之側上之銅箔 凸起之連接可靠性很高。 用於本發明之材料，本發明之構成等係於以下加以詳 細說明。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -18- 1224129 A7 __B7 五、發明説明（17 ) (請先閱讀背面之注意事項再填寫本頁) 由銲接性觀點，外露部份之氧化，導電性等看來，鍍 銀銅粉末或銅合金粉末之外露面積較佳係由1 〇至6 〇 % ’更好是1 0至5 0%，最好是1 0至3 0%。 對於以銀塗覆銅粉未或銅合金粉末，其中有很多方法 ，例如替代電鍍法，電鍍法，無電電鍍法等。塗覆較佳係 以替代電鑛法加以進行，因爲替代電鑛法可以於銅粉末及 銅合金粉末及銀間提供一較強黏著力，並造成一較低之執 行成本。 基於銅粉末或銅合金粉末之重量，並由對遷移阻抗， 成本，導電率改良之觀點看來，於銅粉末或銅合金粉末上 之銀的塗覆量允許粉末範圍較佳由5至2 5 w t %，更好 是 1 0 至 2 3 w t %。 經濟部智慧財4¾員工消費合作社印製 當導電粉末具有很小數量之接觸點時，導電粉末傾向 於具有一高阻抗。爲了藉由增加導電粒子彼此之接觸面積 ，以取得一高導電率，較佳改變粒子之形狀成爲片狀或片 形，藉由對導電粉末施加一衝擊。然而，使用片狀或片形 之導電膏料具有較高之黏性，相較於使用大致球形導電粉 末之導電膏料而言，使得其塡充入孔中之特性變差。爲了 降低黏性，加入大量之溶劑係足夠的。然而，大量之溶劑 的加入造成了於導電膏料之塗覆膜之厚度的降低，在固化 相當於溶劑體積的厚度之後。爲了使塗覆膜表面成片狀或 片形，硏磨係足夠的。然而，此硏磨並不想要，因爲其降 低了膜之厚度。因此，以工作效率及導電膏料的導電性看 來，使用實質球形導電粉末之導電膏料係較佳的。 ϋ紙張尺度適用中國國家標準（CNS ) A4規格（210X29?公釐) ~ 1224129 A7 B7 五、發明説明（24 ) (請先閱讀背面之注意事項再填寫本頁) 即使在銅箔表面下，藉由過量硏磨導電材料（導電膏 料）而形成凹陷於通孔的末端，於導電性之可靠性很高， 因爲依據本發明，於通孔末端及銅箔凸起之導電材料係以 導電材料加以連接。當於通過基板之通孔形成後，形成於 通孔旁之鰭片係藉由例如鈾刻之方法加以去除時，於上述 塡充通孔及銅箔凸起之導電材料的末端間之連接的可靠性 被進一步增加。 於本發明中，銅箔凸起及銅箔電路可以藉由一方法加 以形成，該方法包含藉由使用抗蝕劑，而在雙面銅積層板 之每一銅箱上形成一圖案，並使用飽刻溶液，進行作出圖 案。 同時，當通孔被事先形成時，在以所謂帳篷法，在通 孔上形成一抗蝕圖案後，銅箔凸起及銅箔電路可以藉由蝕 刻方法加以形成。 經濟部智慧財4^7a(工消費合作社印製 至於，用於絕緣層中之材料，以抗熱性，抗濕性等觀 點，包含環氧樹脂組成之熱固性絕緣材料較佳的，但也可 以使用具有熱固特性及u V固化特性之絕緣材料也可以使 用。 當使用環境很柔和時，及印刷電路板所產生之電壓很 低時，也可以使用一 ϋ V固化絕緣材料。 於本發明中，有關於加入每一導電材料中之黏結劑， 以塡充通孔及用以印刷銅箔電路部分之導電材料，及銅箔 凸起及不必要導電部份外之絕緣層，較佳使用一熱固樹脂 組，成其包含一環氧樹脂及酚醛樹脂或者一單環氧化物或 本紙張尺度適用中國國家標準（CNS ) A4規格（210Χ 297公釐） -27- 1224129 經濟部智慧財產局員工消費合作社印製 A7 _B7五、發明説明（25 ) 一聚乙二醇，其係被加入以降低黏性，一耦合劑，一固化 劑等。 於環氧樹脂及酚醛樹脂間之比例係如下。於塡充通孔 之導電材料中，一具有高含量之環氧樹脂的組成係較佳的 ，因爲黏性降低及溶劑數量之降低係較佳的。另一方面， 於上述用以印刷於銅箔凸起及絕緣層上之導電材料中，一 具有高含量之酚醛樹脂係較佳的，以降低印刷電路之電阻 。此組成可以包含一溶劑，其比例爲1 0至2 5 W t %， 只要該溶劑於印刷時不造成滲出即可。 至於酚醛樹脂，已知酚醛淸漆型，可熔酚醛樹脂，等 之酚醛樹脂均可以使用。環氧樹脂及酚醛樹脂之比例較佳 使得環氧樹脂對酚醛樹脂之重量比例範圍由1 0 : 9 0至 90 : 10，更好是10 : 90至60 : 40。當環氧樹 脂之比例低於1 0 w t %時，對銅箔之黏著特性傾向於變 差。當環氧樹脂之比例超出9 〇w t %時，導電性會變差 〇 使用酚醛樹脂之導電膏料具有較使用環氧樹脂之導電 膏料爲高之導電率。其原因爲於固化酚醛樹脂時之收縮程 度係高於環氧樹脂，及使用酚醛樹脂之導電材料的體積減 少較大，使得接觸面積及導電粉末粒子彼此接觸的可能增 雖然，酚醛樹脂對於一需要高導電率之導電膏料係必 要的，但其加入導電膏料增加了導電膏料之黏性並劣化了 進入孔中之塡充特性。特別是，其加入變差具有小直徑之 (請先閱讀背面之注意事項再填寫本頁) 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -28- 1224129 A7 _B7_ 五、發明説明（27 ) (請先閱讀背面之注意事項再填寫本頁) 於用以印刷於絕緣層上之導電材料中之黏結劑中，高 酚醛樹脂含量係較佳的，因爲導電率係儘可能地高。於黏 結劑中，一具有高黏性之含烷氧基可熔酚醛樹脂係較佳被 使用，以防止於印刷及乾燥時之滲出。該含烷氧基可熔酚 酵樹脂之重量平均分子量範圍較佳由5 0 0 0至 200000 ，更好是由700至120000。當使用 具有高分子量之酚醛樹脂時，於使用導電材料印刷後之乾 燥時，導電材料之黏性係隨著溶劑的蒸發而快速增加。因 此，即使黏性隨著加熱而降低，當分子量高時，黏性降低 之程度係很低。因此，導電材料特徵在於可以防止其滲出 ，而可以取得具有絕緣上高可靠度之配線板。 由導電率及黏性及導電膏料塡充入孔中之特性看來， 含烷氧基可熔酚醛樹脂及液態環氧樹脂之混合比例較佳係 使得含烷氧基可熔酚醛樹脂對液態環氧樹脂之重量比爲 10 : 90 至 90 : 10，較佳係由 40 : 60 至 90 : 10° 經濟部智慧財產ΜΓΜ工消費合作社印製 環氧樹脂於一般溫度下係爲液態。於一般溫度結晶之 環氧樹脂可以藉由加入於一般溫度時爲液體之環氧樹脂， 而防止結晶化。環氧樹脂於一般溫度爲液態並係用於本發 明中，其包含例如環氧樹脂，其於一般溫度爲固體，但也 可以於一般溫度中，藉由混合於一般溫度下爲液態之環氧 樹脂，而成爲穩定之液態。於本說明書中，名詞” 一般溫 度”或”室溫”表示約2 5 t之溫度。 至於環氧樹脂，可以被使用之已知環氧樹脂，其可以 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公f) ~ ~ 1224129 A7 ___B7_ 五、發明説明（28 ) (請先閲讀背面之注意事項再填寫本頁) 是於分子中含兩或多數環氧基之例示化合物，例如，脂族 環氧樹脂，例如聚縮水甘油基醚，二羥萘二縮水甘油基醚 ，丁二醇二縮水甘油基醚，新戊基乙二醇縮水甘油基醚等 ，其係藉由反應雙酚A，雙酚AD，雙酚F，酚醛淸漆， 或甲酚酚醛淸漆與表氯醇加以取得；雜環環氧化合物，例 如二縮水甘油基海因等；及脂環氧樹脂，例如乙烯基環已 烯二氧化物，雙環二氧化戊二烯二氧化物，脂環双環氧已 二酸酯等。 若有必要，可以使用一軟化劑。至於軟化劑，也可以 使用已知者。其例如於一分子中只具有一環氧基之例示化 合物，例如，傳統環氧樹脂，例如正丁基縮水甘油基醚， 維沙酸縮水甘油基醚，苯乙烯化氧，乙基已基縮水甘油基 醚，苯基縮甘油基醚，甲苯酯縮水甘油基醚，丁基苯基縮 水甘油基醚等。 上述環氧樹脂可以單獨使用或以組合方式使用。上述 軟化劑可以單獨使用或以組合方式使用。 經濟部智慧財產局員工消費合作社印製 至於加入黏結劑中之固化劑，其可以使用之胺，例如 ，孟烯雙胺，異佛爾雙胺，m -苯二胺雙胺，二胺基二苯 甲烷，二胺基二苯颯，甲撐替二苯胺等；酸酐，例如酞酐 ，苯偏三酸酐，苯均四酸酐，丁二酸酐，四氫化酞酸酐等 等，化合物型固化劑，例如咪唑，雙氰胺等；及樹脂型固 化劑，例如聚醯胺樹脂，酚醛樹脂，尿素樹脂等等。若有 必要，上述例示固化劑可以與例如潛醯胺固化劑組合使用 。其中可以加入已知用於環氧樹脂及酚醛樹脂之固化加速 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -31 - 1224129 A7 __ B7 五、發明説明（29 ) 劑.，例如，叔胺，咪唑，三苯膦，四苯膦硼酸等。 (請先閱讀背面之注意事項再填寫本頁) 以導電膏料之固化產物之玻璃轉換點（Tg)之觀點看 來，環氧樹脂每1 0 0份重量計中，固化劑含量範圍較佳 由以重量計0 · 1至2 5份，較佳係以重量計1至2 0份 ，最好是以重量計1至1 0份。 用於本發明之黏結劑係藉由均勻地混合上述材料，可 選用與一觸變劑，耦合劑，去泡沬劑，粉末整理劑，抗固 化劑等。基於導電膏料之重量，若有必要加入的話，觸變 劑，耦合劑，去泡沬劑，粉末整理劑，抗固化劑之含量較 佳範圍由0 · 001至lwt%，最好是由〇 . 03至 0 . 5 w t % 〇 用於本發明之導電膏料之比重較範圍爲由3至7.5 ，更好是3 · 5至6 . 5。當比重小於3時，因爲導電粉 末之低比例之故，所以不能取得高導電率。另一方面，當 比重大於7 · 5時，導電粉末之比例很高，但黏結劑等之 比例很低，使得進入孔中之塡充特性變差。 爲了調整導電膏料之比重之値至上述範圍中，於導電 經濟部智慧財4¾員工消費合作社印製 體 之 間 末 粉 電 導 f至 劑5 結 6 黏： 之 5 中 3 料由 膏 係 6 好 更 佳 較 }至 計 ο 體 6 固 ： 以 ο ( 4 比由 積是 至由 7 是 9 好 : 最 3 ， 由 5 較 8 比： 量 5 重 1 之至 間 5 末 9 粉： 電 5 導由 及是 劑好 結更 黏 ， 於 3 時， %時 t % w t 3 w 8 7 於 9 少出 例超 比例 之比 末之 粉末 電粉 導電 當導 〇 當 7 。 8 差 : 變 3 會 1 率 至電 3 導 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -32- 1224129 A7 ___B7 五、發明説明（30 ) 導電膏料之黏性’黏著力及強度降低，因而，使得可靠度 變差。 於上述實施例（16) ，（21)及（25)之任一 導電膏料中，於導電膏料中之黏結劑及導電粉末間之體積 比（以固體計）較佳範圍由5 5 : 4 5至2 1 : 7 9 ，更 好是由50:50至28:72。 於黏結劑及導電粉末間之重量比較佳範圍由3 . 5 : 96 · 5 至 1 2 : 88，更好是由 5 ·· 95 至 1 0 : 90 。當導電粉末之比例低於上述範圍時，可銲接性變差。當 導電粉末之比例超出上述範圍時，導電膏料之黏性快速增 加，使得導電膏料的生產困難，及塗覆導電膏料之工作效 率降低。 於本發明中，上述導電膏料的固化產物的玻璃轉換點 (此後稱T g )係較佳由4 0 t至1 8 0 °C，更好是由 40°C至1 4 0°C。當1：2在40°(：至1 8 CTC之範圍外時 ，會不太可能直接銲接於導電膏料的塗覆膜上。 爲了調整導電膏料之固化產品的丁1至4 至 1 8 0 °C的溫度範圍中，較佳使用一黏結劑，其係主要由 環氧樹脂組成及一固化劑構成，其中環氧樹脂的環氧當量 範圍由160至330g/ecj，更好是由160至 2 5 0 g / e q 〇 至於上述環氧樹脂組成，除了環氧樹脂外，較佳使用 一含軟化劑之組成。環氧樹脂及軟化劑之混合比例係較佳 使得環氧樹脂對軟化劑之重量比由4 0 : 6 0至9 0 : 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） ——— II — 0—, (請先閱讀背面之注意事項再填寫本頁) 訂 經濟部智慧財4苟員工消費合作社印製 -33- 1224129 A7 B7 五、發明説明（33 ) (請先閱讀背面之注意事項再填寫本頁) 至於，所加入之溶劑，可以使用上述例示溶劑之兩或 多個之混合或之一。基於由導電率，工作效率，導電膏料 之黏性，塗覆膜之厚度，塡充入孔之特性等看來，基於導 電膏料之重量計，溶劑含量範圍較佳由0 · 0 1至 2 〇wt%，更好是由1至2 〇wt%，也可以2至 20wt%，最好是由2至7.5wt%。 由導電膏料於操作時及乾燥溶劑時，導電膏料之黏性 穩定度看來溶劑之沸點範圍較佳由1 5 0 t至2 6 0 t， 更好是由170 至240 °C。 用於本發明之導電膏料可以藉由均勻地混合上述成份 ，即黏結劑，導電粉末及選用地溶劑及觸變劑，耦合劑， 去泡沬劑，粉末整理劑，抗固化劑等於一或多數混合機， 混砂機，三滾軋機等以作動該分散。 本發明係以以下實例加以解釋。 例子1 經濟部智慧財產局員工消費合作社印製 黏結劑A係藉由於一自動硏鉢及三滾軋機中，以均勻 地混合重量計8 2份之雙酚A -爲主環氧樹脂（日本環氧 樹脂公司製造之商標名Epikote 827 )，重量計1 〇份脂族 縮水甘油基醚（由朝日電化工業有限公司所製造之商品名 ED — 5 0 3)及重量計8份之2 -酚—4 —甲基咪唑（ 由四國化學公司製造之商品名Curesol，2P4MZ )加以備製。 另一方面，黏結劑B係藉由於一自動硏鉢及三滾軋機 中’以均勻地混合重量計4 0份之酚樹脂（佳力寶公司製 本纸張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -36- 1224129 A7 B7 五、發明説明（34 ) 造之商標名Bell pearl S-890 )，重量計6 0份雙酚A爲主環 氧樹脂（由湯殼環氧樹脂公司所製造之商品名Epikote 827 )及重量計5份之相同如上所述之2 -酚- 4 -甲基咪唑 加以備製。 於黏結劑B中之環氧樹脂及酚樹脂之比例係使得環氧 樹脂對酚樹脂之重量比爲6 0 : 4 0。 再者，具有5 · 1微米之平均粒子尺寸之球形銅粉末 (以噴霧法爲日本噴霧金屬粉末公司所製造之商品名 S F R - C u )係被以稀釋鹽酸及淸水加以淸洗，然後， 使用每公升水含8 0 g之Ag CN及7 5 g之N a CN之 電鍍液，進行替代電鍍，使得銀比例基於球形銅粉末之重 量可能爲1 8 w t %。如此處理之銅粉末係以水加以淸洗 並乾燥，以取得鍍銀之銅粉末（鍍銀之銅粉末）。所取得 之鍍銀銅粉末之五個粒子係以一掃描歐傑電子頻譜分析設 備進行定量分析，以調查銅粉末之外露面積。結果，吾人 發現外露面積範圍由1 2至2 8%並平均爲2 1%。 然後，7 5 0克之上述鍍銀的銅粉末及具有直徑約3 mm之氧化鉻球係被加入至球磨機之4公升容器中，及該 容器被旋轉4 0分，以取得大致球形之鍍銀之銅粉末，其 具有平均1 · 2之長寬比及5 · 4微米之平均粒子尺寸（ 粒子之平均長度）。 另一方面，如上所取得4 0 0克之鍍銀之銅粉末及4 公斤之具有1 0 mm直徑之氧化鉻球被加入至球磨機之4 公升容器中，及容器被振動及旋轉4小時，以取得一片狀 本紙張尺度適用中國國家標準（CNS ) A4規格（210X29*7公釐） (請先閱讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 -37- 1224129 A7 A7 B7 五、發明説明（35 ) 或片形鍍銀銅粉末，其具有平均7 · 2之長寬比及8 · 6 微米之平均粒子尺寸（粒子之平均長度）。 導電膏料A係藉由於一攪拌及混合機及三滾軋機中，I 以均勻地混合重量計4 0份之上述取得之黏著劑A，重量| 計4 4 0份之實質球形鍍銀銅粉末，及重量計2 〇份之上| 述片狀或片形鍍銀銅粉末及重量計1 〇份之3 -甲基- 3 一甲氧基丁醇（由Kuraray有限公司製造之商品名Solfit )作 爲溶劑加以備製。 另一方面，導電膏料B係藉由於一攪拌及混合機及三 滾軋機中’以均勻地混合重量計6 5份之上述取得之黏著 劑B ’重量計2 2 0份之片狀或片形鍍銀銅粉末，及重量 計140份之具有2·1微米平均粒子尺寸之上述片狀或 片形銀粉末（Tokuriki化學硏究有限公司之商品名T C G -1 )及重量計7 5份之3 —甲基—3 -甲氧基丁醇（由 Kuraray有限公司製造之商品名Solfit)作爲溶劑加以備製。 經濟部智慧財4^7—工消費合作社印製 於導電膏料A中之實質球形鍍銀銅粉末及片狀或片形 鍍銀之銅粉末之比例係使得球形鍍銀之銅粉末對片狀或片 形鍍銀之銅粉末之重量比爲9 6 : 4。於導電膏料B中之 片狀或片形鍍銀之銅粉末及片狀或片形銀粉末之比例係使 得片狀或片形鍍銀之銅粉末對片狀或片形銀粉末之重量比 爲6 1 : 3 9。於導電膏料A中之黏結劑及導電粉末之比 例（以固體計）係黏結劑對導電粉末之重量比例爲8 : 9 2。基於導電膏料之重量，於導電膏料a中之溶劑之含 量係1 · 9 6 w t %。於導電膏料B中之黏結劑及導電粉 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -38- 1224129 A7 _B7_ 五、發明説明（38 ) 以相同上述方法加以量測。 (請先閲讀背面之注意事項再填寫本頁) 例子2 導電膏料C係藉由於一攪拌及混合機及三滾軋機中， 以均勻地混合重量計4 5份之上述例子1中取得之黏著劑 A，重量計4 3 5份之於例子1中取得之實質球形鍍銀銅 粉末，及重量計1 0份之樹枝狀銀粉末（Tokuriki化學硏磨 有公司所製造之商品名E G - 2 0 )及重量計1 0份之3 一甲基一 3 —甲氧基丁醇（由Kuraray有限公司製造之商品 名Solfit)作爲溶劑加以備製。 導電膏料D係藉由於一攪拌及混合機及三滾軋機中， 以均勻地混合重量計6 5份之上述例子1中取得之黏著劑 B，重量計2 4 0份之如例子1中所取得之片狀或片形鍍 銀銅粉末，及重量計1 0 0份之具有2 . 1微米平均粒子 經濟部智慧財產局員工消費合作社印製 尺寸之上述片狀或片形銀粉末（Tokuriki化學硏究有限公司 之商品名TC G - 1 )及重量計2 0之樹枝狀銀粉末（ Tokuriki化學硏磨有公司所製造之商品名E G — 2 0 )及重 量計7 5份之3 —甲基一 3 —甲氧基丁醇（由Kuraray有限 公司製造之商品名Solfit)作爲溶劑加以備製。 於導電膏料C中之實質球形鍍銀銅粉末及銀粉末之比 例係使得球形鍍銀之銅粉末對銀粉末之重量比爲9 6 : 4 。於導電膏料D中之片狀或片形鍍銀之銅粉末對銀粉末之 比例係使得片狀或片形鍍銀之銅粉末對銀粉末之重量比爲 6 7 : 3 3。於導電膏料C中之黏結劑及導電粉末之比例 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -41 - 1224129 A7 B7_ 五、發明説明（39 ) (請先閱讀背面之注意事項再填寫本頁) (以固體計）係黏結劑對導電粉末之重量比例爲9 : 9 1 。基於導電膏料之重量，於導電膏料C中之溶劑之含量係 1 · 96wt %。於導電膏料D中之黏結劑及導電粉末之 比例（以固體計）係黏結劑對導電粉末之重量比例爲1 5 :8 5。基於導電膏料之重量，於導電膏料D中之溶劑之 含量係1 5wt%。 再者，一通孔配線板係以相同於上述例子1之製程力口 以製造，及該通孔配線板之啓始特性被評估。結果，吾人 發現每一通孔之電阻値具有1 9 8毫歐姆每孔之最大値， 及具有1 6 3毫歐姆每孔之最小値，及1 7 5毫歐姆每孔 之平均値。5 0伏之直流電壓係以相同於例子1中所述之 方式，施加至銅箔電路及跳線電路之間，絕緣電阻被量測 並發現爲1 0 13歐姆或更大。跳線電路之片電阻被發現 7 9微歐姆•公分。 另外，通孔配線板受到相同於例子1中之方法的熱衝 擊測試，以尋找通孔之電阻値變化爲5 · 8 %，及跳線電 路之變化率爲1 . 9%。 經濟部智慧財產局B(工消費合作社印製 另一方面，通孔配線板係以相同於例子1所述之方法 受到一抗遷移測試，以找出絕緣電阻係1 〇 1 1歐姆或更多 例子3 導電膏料E係藉由於一攪拌及混合機及三滾軋機中， 以均勻地混合重量計3 5份之上述例子1中取得之黏著劑 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 1224129 A7 ______B7 五、發明説明（40 ) (請先閲讀背面之注意事項再填寫本頁) A 重量計4 3 5份之於例子1中取得之實質球形鑛銀銅 粉末’及重量計3 0份之樹枝狀銀粉末（Tokuriki化學硏磨 有公司所製造之商品名E G - 2 0 )及重量計1 3份之如 於例子2中所用之3 -甲基-3 -甲氧基丁醇作爲溶劑加 以備製。 導電膏料F係藉由於一攪拌及混合機及三滾軋機中， 以均勻地混合重量計6 0份之上述例子1中取得之黏著劑 B ’重量計2 9 5份之如例子1中所取得之片狀或片形鍍 銀銅粉末，及重量計5 0份之例子2所用之具有2 . 1微 米平均粒子尺寸之上述片狀或片形銀粉末及重量計2 0之 如於例子2中所用之樹枝狀銀粉末及重量計7 5份之如於 例子2中所用之3 -甲基- 3 -甲氧基丁醇作爲溶劑加以 備製。 經濟部智慧財產¾員工消費合作社印製 於導電膏料E中之實質球形鍍銀銅粉末及銀粉末之比 例係使得球形鍍銀之銅粉末對銀粉末之重量比爲9 4 ·· 6 。於導電膏料F中之片狀或片形鍍銀之銅粉末對銀粉末之 比例係使得片狀或片形鍍銀之銅粉末對銀粉末之重量比爲 81: 19。於導電膏料E中之黏結劑及導電粉末之比例 (以固體計）係黏結劑對導電粉末之重量比例爲7 : 9 3 。基於導電膏料之重量，於導電膏料E中之溶劑之含量係 2·5wt%。於導電膏料F中之黏結劑及導電粉末之比 例（以固體計）係黏結劑對導電粉末之重量比例爲1 4 : 8 6。基於導電膏料之重量，於導電膏料F中之溶劑之含 量係1 5 w t %。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -43- 1224129 A7 _____B7_ 五、發明説明（41 ) (請先閱讀背面之注意事項再填寫本頁) 再者，一通孔配線板係以相同於上述例子1之製程加 以製造，及該通孔配線板之啓始特性被評估。結果，吾人 發現每一通孔之電阻値具有1 8 4毫歐姆每孔之最大値， 及具有1 5 6毫歐姆每孔之最小値，及1 6 5毫歐姆每孔 之平均値。5 0伏之直流電壓係以相同於例子1中所述之 方式，施加至銅箔電路及跳線電路之間，絕緣電阻被量測 並發現爲1 0 1 2歐姆或更大。跳線電路之片電阻被發現 8 3微歐姆•公分。 另外，通孔配線板受到相同於例子1中之方法的熱衝 擊測試，以尋找通孔之電阻値變化爲3 . 9 %，及跳線電 路之變化率爲2.3%。 另一方面，通孔配線板係以相同於例子1所述之方法 受到一抗遷移測試，以找出絕緣電阻係1 0 1 1歐姆或更多 比較例1 經濟部智慧財產局員工消費合作社印製 如於第5圖所示，一具有直徑0 _ 4mm之通孔1 〇 係形成於基板3中，並被塡充以例子1中所得之導電膏材 A，以形成導電層4。於乾燥及固化後，如此處理之基板 之表面係被硏磨，以連接於通孔1 0中之導電材料至於通 孔1 0末端之銅箔凸起7。然後，絕緣層5係形成於基板 表面上，通孔之末端，銅箔凸起7的表面及銅箔電路8之 部份表面上。印刷係藉由使用於例子1中取得之導電膏材 B加以進行，以於銅箔電路及絕緣層表面間形成跳線電路 -44- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 1224129 A7 B7 五、發明説明（42 ) (請先閲讀背面之注意事項再填寫本頁) 6。上塗覆層9係藉由使用相同於上述之絕緣材料，而形 成於跳線電路6之上。如此取得之產品係乾燥於8 〇 1小時，然後熱處理於1 6 5艺 1小時，以取得通孔配 線板。 於上述製程中，絕緣層係藉由三次之印刷操作使用具 有U V -固化特性及熱固特性之絕緣材料（由大洋油墨有 限公司製造之商品名S G R - 1 0 0 )加以形成。 通孔配線板之啓始特性係被評估。結果，吾人發現每 一通孔具有以下電阻値：最大3 5 5毫歐姆每孔，最小 1 7 5毫歐姆每孔，及平均2 6 5毫歐姆每孔。 通孔配線板受到相同於例子1所述之熱衝擊測試 1 0 0 0次，以找到通孔之電阻變化率爲2 5 9 %及跳線 電路之變化率爲2.4%。 比較例2 經濟部智慈財4笱員工消費合作社印製 一通孔配線板係藉由相同於例子1中之製程加以取得 ，除了使用例子1中所得之導電膏料A作爲塡充通孔之導 電膏材及導電膏材用以形成跳線電路。 通孔配線板之啓始特徵係被評估。結果，吾人發現每 一通孔之電阻値具有2 1 3毫歐姆每孔之最大値，及具有 1 7 3毫歐姆每孔之最小値，及1 8 2毫歐姆每孔之平均 値。5 0伏之直流電壓係以相同於例子1中所述之方式， 施加至銅箔電路及跳線電路之間，絕緣電阻被量測並發現 爲1 0 12歐姆或更大。跳線電路之片電阻被發現爲2 5 0 $紙張尺度適用中國國家標準（CNS ) A4規格(210X297公釐) ~ -45 - 1224129 A7 ______B7 五、發明説明（43 ) 微歐姆•公分。 (請先閱讀背面之注意事項再填寫本頁) 另外’通孔配線板受到相同於例子1中之方法的熱衝 擊測試1 0 0 0次，以尋找通孔之電阻値變化率高至 1 2 5% ’及跳線電路之變化率高至9 5%。 另一方面，通孔配線板係以相同於例子1所述之方法 受到一抗遷移測試，以找出絕緣電阻係1 0 1 1歐姆或更多 例子4 一黏結劑係藉由均勻地混合重量計4 0份之含丁氧基 之可熔酚醛樹脂（由日立化學有限公司製造；丁氧基化率 65%，及重量平均分子量1200)，重量計55份之 如於例子1中所用之双酚A爲主之環氧樹脂，及重量計5 份之相同於例子1中所用之2 -苯基一 4 一甲基一咪唑。 酚醛樹脂對環氧樹脂之重量比例爲4 2 · 1 : 5 7.9° 經濟部智慧財產局員工消費合作社印製 然後，7 5 0克之於例子1中的鍍銀的銅粉末及3公 斤之具有直徑5 mm之氧化鉻球被裝入一球磨機中之2公 升容器中，及容器係被旋轉4 0，分以取得一實質球形鍍 銀之銅粉末具有平均1·3之長寬比及5.5微米之平均 粒子尺寸（粒子平均長度）。所取得之鍍銀的銅粉末的5 粒子係以一掃描歐傑頻譜分析儀受到定量分析’以調查銅 粉末之外露面積。結果，吾人發現外露面積之範圍由1 〇 至50%，平均爲20%。 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ·奶_ 1224129 A7 B7 五、發明説明（44 ) (請先閲讀背面之注意事項再填寫本頁) 一導電膏材係藉由於攪拌及混合機中及三滾軋機中， 均勻混合上述取得之5 0克黏結劑，4 5 0克之如上取得 之實質球形之鍍銀之銅粉末及1 5克之卡必醇乙脂作爲溶 劑加以取得。 所取得之導電膏材之黏性爲7 2 0 dPa · s。爲了 量測黏性，由布魯克菲工程實驗公司所製造之黏度計 Η B T係被使用。如上之相同黏度計Η B T被用於以下例 子中。 於導電膏材中之黏結劑及導電粉末之比例（以固體計 )係使得黏結劑對導電粉末之重量比爲1 0 : 9 0。 再者，示於第8圖之測試圖案1 5係被印於一被預收 縮於1 7 Ot之聚對苯二甲酸乙烯脂膜上，藉由使用上述 取得之導電膏材。如此處理之膜係被預乾燥於9 〇 t空氣 中2 0分，然後，被熱處理於1 7 0 °C 1小時，以取得 一配線板。 經濟部智慧財產笱員工消費合作社印^ 所取得之配線板之特徵係被評估，以找出導體的比電 阻爲1 · 4微歐姆•米。於第8圖中，編號16表示該聚 對苯二甲酸乙烯脂膜。 另一方面，如於第9圖所示，分別具有直徑0.15 mm及0 · 1mm之底通孔1 7係被形成於5 5微米厚之 黏銅箔黏著膜中，該黏著膜具有5 5微米厚之銅箔穩固地 黏著（日立化學有限公司製造之商品名MC F -3000E)。底通孔17係被塡充以如上取得之導電膏 材。然後，底通孔1 7之部份係被觀察以確認塡充分別具 -47- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） 1224129 A7 B7 五、發明説明（46 ) 份係被觀察’以確認塡充具有直徑〇 · 1 5 ^ m及〇 · 1 (請先閲讀背面之注意事項再填寫本頁) m m之非通孔的導電膏材沒有孔隙，即非通孔已經被完全 塡充以導電膏材。 例子6 一黏結劑係藉由均勻地混合重量計4 〇份之酚醛樹脂 (由佳利寶公司製造商品名Bell Perai S-895 )，重量計5 5 份之如於例子1中所用之双酚A爲主之環氧樹脂，及重量 計5份之相同於例子1中所用之2 -苯基一 4 一甲基—咪 酚醛樹脂對環氧樹脂之重量比例爲4 2 . 1 : 5 7.9° 一導電膏材係藉由於攪拌及混合機中及三滾軋機中， 均勻混合上述取得之5 0克黏結劑，4 5 0克之如上於例 子4中取得之實質球形之鍍銀之銅粉末及1 5克之卡必醇 乙脂作爲溶劑加以取得。 經濟部智慧財產笱員工消費合作社印製 所取得之導電膏材之黏性係以相同於例子4中之方法 加以量測，得到爲3 1 7 0 d P a · s。 於導電膏材中之黏結劑及導電粉末之比例（以固體計 )係使得黏結劑對導電粉末之重量比爲1 0 : 9 0。 再者，相同於例子4中之配線板係以例子4中之相同 製程加以生產，其特徵被發現爲導體的比電阻爲2 . 2微 歐姆•米，這與例子4中取得者並無很大差異。然而’已 經被塡充以導電膏材之配線板之非通孔的部份係被觀察’ -49- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 1224129 A7 B7 五、發明説明（47 ) 以找出於導電膏材及每一分別具有直徑〇·15mm及 0 · 1 m m之非通孔壁間之空間，並找出導電膏材有孔隙 (請先閱讀背面之注意事項再填寫本頁) 〇 例子7 一黏結劑係藉由均勻地混合重量計4 0份之熔酚醛樹 脂（由Gun-ei化學工業公司製造商品名爲Resitop PGA-4528 )，重量計5 5份之如於例子1中所用之双酚A爲主之環 氧樹脂，及重量計5份之相同於例子1中所用之2 -苯基 一 4 —甲基一咪唑。 酚醛樹脂對環氧樹脂之重量比例爲4 2 · 1 : 5 7.9° 一導電膏材係藉由於攪拌及混合機中及三滾軋機中， 均勻混合上述取得之5 0克黏結劑，4 5 0克之如上於例 子4中取得之實質球形之鍍銀之銅粉末及1 5克之卡必醇 乙脂作爲溶劑加以取得。 經濟部智慧財產局員工消費合作社印；^ 所取得之導電膏材之黏性係以相同於例子4中之方法 加以量測，得到爲3 1 6 0 d P a · s。 於導電膏材中之黏結劑及導電粉末之比例（以固體計 )係使得黏結劑對導電粉末之重量比爲1 0 : 9 0。 再者，相同於例子4中之配線板係以例子4中之相同 製程加以生產，其特徵被發現爲導體的比電阻爲1 · 9.微 歐姆•米，這與例子4中之取得値並無大不同。然而，已 經被塡充以導電膏材之配線板之非通孔的部份係被觀察， 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -50- 1224129 A7 __________B7_ 五、發明説明（48 ) 以找出於導電膏材及具有直徑0 · 1 5 m m及〇 . 1 m m 之非通孔壁面間有空間，即，導電膏材有孔隙。 (請先閱讀背面之注意事項再填寫本頁) 例子8 一黏結劑係藉由均勻地混合重量計1 〇份之如於例子 6中所用之相同酚醛樹脂，重量計8 5份之如於例子1中 所用之雙酚A爲主之環氧樹脂，及重量計5份之相同於例 子1中所用之2 —苯基一甲基一咪唑。 酚醛樹脂對環氧樹脂之重量比例爲1 0 . 5 : 8 5.9° 一導電膏材係藉由於攪拌及混合機中及三滾軋機中， 均勻混合上述取得之5 0克黏結劑，4 5 0克之如上於例 子4中取得之實質球形之鍍銀之銅粉末及1 5克之卡必醇 乙脂作爲溶劑加以取得。 所取得之導電膏材之黏性係以相同於例子4中之方法 加以量測，得到爲1 2 6 0 d P a · s。 經濟部智慧財4局0(工消費合作社印製 於導電膏材中之黏結劑及導電粉末之比例（以固體計 )係使得黏結劑對導電粉末之重量比爲1 0 : 9 0。 再者，相同於例子4中之配線板係以例子4中之相同 製程加以生產，其特徵被發現爲導體的比電阻爲1 1 · 5 微歐姆•米，這相較於例子4中取得者相當高。已經被塡 充以導電膏材之配線板之非通孔的部份係被觀察’以確認 塡充具有直徑0 _ 1 5mm及〇 · 1mm之非通孔的導電 膏材沒有孔隙，即非通孔已經被完全塡充以導電膏材* ° 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 1224129 A7 ____B7 ___ 五、發明説明（49 ) 例子9 (請先閱讀背面之注意事項再填寫本頁) 一黏結劑係藉由均勻地混合重量計4 5份之相同於例 子4中之含丁氧基之可熔酚醛樹脂，重量計5 0份之如於 例子1中所用之双酚A爲主之環氧樹脂，及重量計5份之 相同於例子1中所用之2 -苯基-甲基-咪唑。 酚醛樹脂對環氧樹脂之重量比例爲4 7 . 4 : 5 2.6° 一導電膏材係藉由於攪拌及混合機中及三滾軋機中， 均勻混合上述取得之5 0克黏結劑，4 5 0克之如上於例 子4中取得之實質球形之鍍銀之銅粉末及1 5克之卡必醇 乙脂作爲溶劑加以取得。 所取得之導電膏材具有5 · 2之比重及7 5 0 d P a • s之黏度。 於導電膏材中之黏結劑及導電粉末之比例（以固體計 )係使得黏結劑對導電粉末之體積比爲4 6 . 1 : 53 · 9及黏結劑對導電粉末之重量比爲1〇 : 90。 經濟部智慧財產笱員工消費合作社印製 再者，相同於例子4中之配線板係以例子4中之相同 製程加以生產，其特徵被發現爲導體的比電阻爲1 · 3微 歐姆•米。已經被塡充以導電膏材之配線板之非通孔的部 份係被觀察，以確認塡充具有直徑0 · 1 5mm及〇 · 1 m m之非通孔的導電膏材沒有孔隙，即非通孔已經被完全 塡充以導電膏材。 -52 - 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 1224129 A7 ___ B7 五、發明説明（50 ) 例子1 0 一黏結劑係藉由均勻地混合重量計6 〇份之相同於例 子5中之含甲氧基之可熔酚醛樹脂，重量計3 5份之如於 例子1中所用之雙酚A爲主之環氧樹脂，及重量計5份之 相同於例子1中所用之2 -苯基-甲基-咪唑。 酚醛樹脂對環氧樹脂之重量比例爲6 3 · 2 : 3 6.8° 一導電膏材係藉由於攪拌及混合機中及三滾軋機中， 均勻混合上述取得之4 0克黏結劑，4 6 0克之如上於例— 子4中取得之實質球形之鍍銀之銅粉末及1 5克之卡必醇 乙脂作爲溶劑加以取得。 所取得之導電膏材具有5.3之比重及78〇dPa • s之黏度。 於導電膏材中之黏結劑及導電粉末之比例（以固體計 )係使得黏結劑對導電粉末之體積比爲4 0 . 1 : 5 9 . 9及黏結劑對導電粉末之重量比爲8 : 9 2。 再者，相同於例子4中之配線板係以例子4中之相同 製程加以生產，其特徵被發現爲導體的比電阻爲1 · 歐姆•米。已經被塡充以導電膏材之配線板之非通孔的部 份係被觀察，以確認塡充具有直徑〇 · 1 5 m m及〇 · 1 m m之非通孔的導電膏材沒有孔隙，即非通孔已經被完全 塡充以導電膏材。 例子1 1 -----I!,#! (請先閱讀背面之注意事項存填寫本貢) 訂 經濟部智慧財/l^s工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -53- 1224129 A7 ___ B7_ 五、發明説明（51 ) (請先閱讀背面之注意事項再填寫本頁) 一導電膏材係藉由於攪拌及混合機中及三滾軋機中， 均勻混合上述例子9中取得之1 5克黏結劑，4 8 5克之 如上於例子4中取得之實質球形之鍍銀之銅粉末及1 5克 之卡必醇乙脂作爲溶劑加以取得。 所取得之導電膏材具有7.8之比重及 551〇dPa*s之黏度。 於導電膏材中之黏結劑及導電粉末之比例（以固體計 )係使得黏結劑對導電粉末之體積比爲1 9 . 2 : 8 0 . 8及黏結劑對導電粉末之重量比爲3 : 9 7。 再者，相同於例子4中之配線板係以例子4中之相同 製程加以生產，其特徵被評估，但並未取得適當導體，因 爲其高黏度之故，使得無法執行量測。已經被塡充以導電 膏材之配線板之非通孔的部份係被觀察到，於導電膏材及 具有直徑0·15mm及〇.1mm之非通孔的壁面間有 空間，及導電膏材有孔隙。 例子1 2 經濟部智慧財產局Μ工消費合作社印製 一導電膏材係藉由於攪拌及混合機中及三滾軋機中， 均勻混合上述例子9中取得之1 0 0克黏結劑，4 0 0克 之如上於例子4中取得之實質球形之鍍銀之銅粉末及1 5 克之卡必醇乙脂作爲溶劑加以取得。 所取得之導電膏材具有2·8之比重及390dPa • s之黏度。 於導電膏材中之黏結劑及導電粉末之比例（以固體計 -54- 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X 297公釐） 1224129 A7 _ ___B7 _ 五、發明説明（52 ) )係使得黏結劑對導電粉末之體積比爲6 5 . 8 : 3 4 . 1及黏結劑對導電粉末之重量比爲2 0 : 8 0。 (請先閲讀背面之注意事項再填寫本頁) 再者，相同於例子4中之配線板係以例子4中之相同 製程加以生產，其特徵被評估並得到導體之比電阻高至 1 0 · 9微歐姆•米，其係相較於例子4中所取得者高很 多。已經被塡充以導電膏材之配線板之非通孔的部份係被 觀察，以確認塡充具有直徑0 . 15mm及〇 · 1mm之 非通孔的導電膏材沒有孔隙，即非通孔已經被完全塡充以 導電膏材。 例子1 3 一黏結劑係藉由均勻地混合重量計6 0份之環氧樹脂 (由三井化學公司製造之商品名1 4 0 C ;環氧當量 195至215g/eci)，重量計40份之如於例子1 中所用之脂族二縮水甘油基醚，及重量計3份之相同於例 子1中所用之2 -苯基一 4 一甲基一咪唑，及重量計3份 之雙氰胺。 經濟部智慧財產局員工消費合作社印製 然後，7 5 0克之於例子1中的鍍銀的銅粉末及3公 斤之具有直徑5 mm之氧化鉻球被裝入一球磨機中之2公 升容器中，及容器係被旋轉4 0，分以取得一實質球形鍍 銀之銅粉末具有0 · I6m2/g之比表面積’平均1 · 3 之長寬比及5 · 5微米之平均粒子尺寸（粒子平均長度） 。所取得之鍍銀的銅粉末的5粒子係以一掃描歐傑頻譜分 析儀受到定量分析，以調查銅粉末之外露面積。結果’吾 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 1224129 A7 B7 五、發明説明（53 ) 人發現外露面積之範圍由1 〇至5 0% ’平均爲2 0%。 (請先閱讀背面之注意事項再填寫本頁) —*導電膏材係藉由於擾伴及混合機中及二滾車L機中’ 均勻混合上述取得之5 0克黏結劑’ 4 6 5克之如上取得 之實質球形之鍍銀之銅粉末及1 1克之卡必醇乙脂作爲溶 劑加以取得。 所取得之導電膏材係被熱處理於1 7 0 °C，以取得一 固化之導電膏材。藉由使用由精工儀器公司所製造之 TMA 1 2 0被量測於3 g之負載及5°C每分之加熱率， 所得導電膏材固化產品之T g爲6 8 °C。 於導電膏材中之黏結劑及導電粉末之比例（以固體計 )係使得黏結劑對導電粉末之體積比爲3 7 : 6 3及黏結 劑對導電粉末之重量比爲7 : 9 3。環氧樹脂對軟化劑之 重量比爲6 0 : 4 0。 經濟部智慧財4¾員工消費合作社印製 如第1 0圖所示，上述取得之導電膏材係被施加至 1 . 〇 m m厚之紙酣銅積層板之一側（日立化學有限公司 製造之商品名MCL — 4 3 7 F) ’銅箔之一部份已由該 處藉由蝕刻法去除，並被熱處理於1 7 0°C 9 0分，以取 得導電體2 1。於第1 0圖中，編號2 0表示紙酚銅積層 板。 所取得之導體2 1之表面係以濕硏磨紙# 3 0 0 0加 以硏磨至平滑及光亮，銲錫施加至該平滑光亮表面上，其 後浸入一熔化銲錫槽中。如此處理之積層板係被取出及於 室溫下冷卻。然後，於導體2 1之表面上之銲接部份係受 到一黏著測試（黏著測試係被附著然後剝開）。結果，並 -56- 本紙張尺度適用中國國家標準（CNS ) A4規格（21〇Χ297公釐） 1224129 A7 B7 五、發明説明（54 ) 未發現銲錫黏著至帶上，即，銲接已經完成於導體2 1之 表面上。 (請先閱讀背面之注意事項再填寫本頁) 例子1 4 一黏結劑係藉由均勻地混合重量計5 0份之相同於例 子1 3中所用之環氧樹脂，重量計5 0份之如於例子1中 所用之脂族二縮水甘油基醚，及重量計2份之相同於例子 1中所用之2 -苯基一 4 一甲基一咪唑，及重量計3份之 相同於例子1 3中用之雙氰胺。 一導電膏材係藉由於攪拌及混合機中及三滾軋機中.， 均勻混合上述取得之2 5克黏結劑，4 7 5克之如例子 1 3中取得之實質球形之鍍銀之銅粉末及1 1克之卡必醇 乙脂作爲溶劑加以取得。 所取得之導電膏材係被熱處理於1 7 0 t 9 0分，以 取得一固化之導電膏材。藉由使用相同於例子1 3中之方 法量測導電膏材之T g爲5 9 °C。 經濟部智慧財產笱員工消費合作社印製 於導電膏材中之黏結劑及導電粉末之比例（以固體計 )係使得黏結劑對導電粉末之體積比爲2 9 : 7 1及黏結 劑對導電粉末之重量比爲5 : 9 5。環氧樹脂對軟化劑之 重直比爲50 : 50。 再者，一導體係以相同於例子1 3中之製程加以生產 ，並受到相同於例子1 3中之帶測試，以確認沒有銲錫黏 著至帶上，即銲接已完成於導體表面上。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -57- 1224129 A7 B7 ____ 五、發明説明（55 ) 例子1 5 (请先閱讀背面之注意事項再填寫本頁) 於攪拌及混合機及三滾乳機中，1 5克之於例子1 3 所取得之黏結劑，4 8 5克之於例子1 3中取得之實質球 形鍍銀之銅粉末及1 1克之卡必醇乙脂作爲溶劑，係均勻 地混合，以進行分散。所得之導電膏材具有很高之黏性’ 很難施加。因此，導體及帶測試不再進行。 於導電膏材中之黏結劑及導電粉末之比例（以固體計 )係使得黏結劑對導電粉末之體積比爲1 9 : 8 1及黏結 劑對導電粉末之重量比爲3 : 9 7。環氧樹脂對軟化劑之 重量比爲60:40。 例子1 6 於攪拌及混合機及三滾軋機中，1 5克之於例子1 3 所取得之黏結劑，4 2 5克之於例子1 3中取得之實質球 形鍍銀之銅粉末及1 1克之卡必醇乙脂作爲溶劑’係均勻 地混合，以進行分散。所得之導電膏材具有很高之黏性’ 很難施加。因此，導體及帶測試不再進行。 經濟部智慧財產苟員工消費合作社印製 所得導電膏材係被熱處理於1 7 0°C 9 0分，以取得 一固化導電膏材。該導電膏材固化產物之T g係藉由相同 於例子1 3中之方法加以量測’並爲6 8 °C。 於導電膏材中之黏結劑及導電粉末之比例（以固體δ十 )係使得黏結劑對導電粉末之體積比爲5 8 : 4 2及黏結 劑對導電粉末之重量比爲1 5 ·· 8 5。環氧樹脂對軟化劑 之重量比爲60:40。 本紙張尺度適用中國國家標準（ CNS ) Α4規格（210X297公慶) 1224129 A7 ____B7___ 五、發明説明（56 ) (請先閲讀背面之注意事項再填寫本頁) 再者，由相同於例子1 3中之製程加以生產一導體， 並受到相同於例子1 3中之帶測試。結果，銲錫黏著至帶 上’即，銲接不能完成於導體表面上。 例子1 7 一黏結劑係藉由均勻地混合重量計1 0 0份之相同於 例子1 3中所用之環氧樹脂，重量計1 6份之如於例子中 所用之酚醛樹脂，及重量計6份之相同於例子1中所用之 2 -苯基一 4 一甲基-咪唑，及重量計4份之相同於例子 1 3中用之雙氰胺。 一導電膏材係藉由於攪拌及混合機中及三滾軋機中’ 均勻混合上述取得之3 5克黏結劑，4 6 5克之如例子 1 3中取得之實質球形之鍍銀之銅粉末及1 1克之卡必醇 乙脂作爲溶劑加以取得。 所取得之導電膏材係被熱處理於1 7 Ot 9 0分，以 取得一固化之導電膏材。藉由使用相同於例子1 3中之方 法量測導電膏材之T g爲1 8 6 °C。 經濟部智慧財產笱員工消費合作社印製 於導電膏材中之黏結劑及導電粉末之比例（以固體計 )係使得黏結劑對導電粉末之體積比爲3 8 : 6 2及黏結 劑對導電粉末之重量比爲7 : 9 3。環氧樹脂對軟化劑之 重量比爲1 0 0 : 0。 再者，一導體係以相同於例子1 3中之製程加以生產 ，並受到相同於例子1 3中之帶測試。結果，銲錫黏著至 該帶，即銲接不能完成於導體表面上。 -59- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） 1224129 A7 ____ B7___ 五、發明説明（57 ) 例子1 8 (請先閲讀背面之注意事項再填寫本頁) 一黏結劑係藉由均勻地混合重量計3 5份之相同於例 子1 3中所用之環氧樹脂，重量計6 5份之如於例子1中 所用之脂族二縮水甘油基醚，及重量計2份之相同於例子 1中所用之2 —苯基一 4 一甲基一咪唑’及重量計2份之 相同於例子1 3中用之雙氰胺。 一導電膏材係藉由於攪拌及混合機中及三滾軋機中’ 均勻混合上述取得之3 5克黏結劑，4 6 5克之如例子 13中取得之實質球形之鍍銀之銅粉末及11克之卡必醇 乙脂作爲溶劑加以取得。 所取得之導電膏材係被熱處理於1 7 0°C 9 0分’以 取得一固化之導電膏材。藉由使用相同於例子1 3中之方 法量測導電膏材之T g爲3 7 °C。 經濟部智慧財產^員工消費合作社印製 於導電膏材中之黏結劑及導電粉末之比例（以固體計 )係使得黏結劑對導電粉末之體積比爲3 9 : 6 1及黏結 劑對導電粉末之重量比爲7 : 9 3。環氧樹脂對軟化劑之 重量比爲35:65。 再者，一導體係以相同於例子1 3中之製程加以生產 ，並且其表面係以濕硏磨紙# 3 0 0 0加以硏磨。於其平 滑及光製時，表面受損’因爲導電膏材之低硬度之故’使 得導體不能受到帶測試。 例子1 9 中國國家標準（CNS ) Μ規格（21GX297公釐)~~~ 1224129 A7 B7 五、發明説明（58 ) (請先閱讀背面之注意事項再填寫本頁) 具有5· 4微米之平均粒子尺寸之球形銅粉末（由日 本噴霧金屬粉末公司由噴霧法所製造之商品名S F - C u )係被以稀釋鹽酸及純水淸洗，然後，使用一電鍍溶液， 而受到替代電鍍法，該溶液每公升水係包含8 0 g之 Ag CN及7 5 g之Na CN，使得基於球銅粉末之重量 之銅比例可能爲1 8 w t %。如此處理之銅粉末係以水力口 以淸洗，並乾燥，以取得鍍銀之銅粉末。 然後，如此取得之4 7 0克的鍍銀銅粉末及具直徑 1Omm之4公斤之氧化锆球係被裝入一球磨機之兩公升 容器中，該容器被振動及旋轉8小時。因此，該鍍銀之銅 粉末之形狀被改變，以取得片狀或片形鑛銀之銅粉末，其 具有6 · 2之長寬比及7 . 8微米之平均粒子尺寸（粒子 之平均長度）。所取得之片狀或片形鍍銅粉末之十個粒子 係以一掃描歐傑電子頻譜分析設備作定量分析，以查出銅 粉末之外露面積。結果，發現外露面積範圍由2 3%至 58%，平均爲48%。 經濟部智慧时/I局S工消費合作钍印製 一導電膏材係藉由於攪拌及混合機中及三滾軋機中， 均勻混合上述取得之3 5克黏結劑，4 6 5克之上述取得 之片狀或片形鍍銀之銅粉末及4 0克之卡必醇乙脂（沸點 :2 0 2 t )作爲溶劑加以取得。 於導電膏材中之黏結劑及導電粉末之比例（以固體計 )係使得黏結劑對導電粉末之重量比爲7 : 9 3。溶劑之 含量爲7.4wt%。 隨後，上述取得之導電膏材係被施加至1.0mm厚 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -61 - 1224129 A7 __B7 五、發明説明（59 ) (請先閲讀背面之注意事項再填寫本頁) 之紙酚銅積層板之一側（日立化學有限公司製造之商品名 MCL — 437F)，銅范之一部份已由該處藉由餽刻法 去除如第1 0及1 1圖所示之形式，並被熱處理於 1 7 0 °C 9 0分，以取得導電體2 1及測試圖案2 2。 再者，導體2 1係受到如例子1 3中所之帶測試，以 確認銲錫未黏著至帶上，即，銲接已經完成於導體2 1之 表面上。 示於第1 1圖之測試圖案之比電阻被評估並找到爲 6 · 1微歐姆•米。 例子2 0 經濟部智慧財1局員工消費合作社印製 於例子1 9中取得之4 7 0克的鍍銀銅粉末及具直徑 1Omm之3公斤之氧化鉻球係被裝入一球磨機之兩公升 容器中，該容器被振動及旋轉8小時。因此，該鍍銀之銅 粉末之形狀被改變，以取得片狀或片形鍍銀之銅粉末，其 具有5 . 7之長寬比及7 . 2微米之平均粒子尺寸（粒子 之平均長度）。所取得之片狀或片形鍍銅粉末之十個粒子 係以一掃描歐傑電子頻譜分析設備作定量分析，以查出銅 粉末之外露面積。結果，發現外露面積範圍由1 8%至 52%，平均爲40%。 一導電膏材係藉由於攪拌及混合機中及三滾軋機中， 均勻混合上述取得之3 0克黏結劑，4 7 0克之上述取得 之片狀或片形鍍銀之銅粉末及4 5克之卡必醇乙脂（沸點 :2 0 2 t )作爲溶劑加以取得。 -62- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 1224129 A7 B7__ 五、發明説明（60 ) (請先閱讀背面之注意事項再填寫本頁) 於導電膏材中之黏結劑及導電粉末之比例（以固體計 )係使得黏結劑對導電粉末之重量比爲6 : 9 4。溶劑之 含量爲8 . 3 w t %。 再者，一導體係藉由相同於例子1 3中之製程加以生 產，並受到相同於例子1 3中之帶測試，以確認銲錫未黏 著至帶上，即，銲接已經完成於導體之表面上。 測試圖案之比電阻被評估並找到爲5 . 8微歐姆•米 例子2 1 一導電膏材係藉由於攪拌及混合機中及三滾軋機中， 均勻混合於例子1 3中取得之3 5克黏結劑，4 6 5克之 例子1中取得之實質球形鍍銀之銅粉末及1 1克之卡必醇 乙脂作爲溶劑加以取得。 於導電膏材中之黏結劑及導電粉末之比例（以固體計 )係使得黏結劑對導電粉末之重量比爲7 : 9 3。溶劑之 含量爲2·2wt%。 經濟部智慧財產QITB(工消費合作社印製 再者，導體係以相同於例子1 3中之製程加以生產， 並受到如於例子1 3中所述之相同帶測試，即確認銲錫未 黏著至帶上。然而，測試圖案之比電阻係高至1 6 · 4微 歐姆•米。 例子2 2 4 7 0克之於例子1 9中所取得之鍍銀之銅粉末及4 本纸張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -63- 1224129 A7 __B7 五、發明説明（61 ) (請先閲讀背面之注意事項再填寫本頁) 公斤之具有直徑1 〇 mm之氧化錯球係被裝入一球磨機之 2公升容器中，該容器被旋轉一 1 〇小時之長時間。結果 ，只有小部份之導電粉末被平坦成爲片狀，即使於處理後 ，其大部份仍大致爲球形鍍銀之銅粉末。因此，並不能取 得足夠量之片狀或片形鍍銀之銅粉末。因此，於上述步驟 後，並未執行操作。 例子2 3 7 5 0克之於例子1中取得之鍍銀銅粉末及3公斤之 直徑5 mm之氧化鍩球係被裝入一球磨機之2公升容器中 ，容器被旋轉4 0分，以取得大致球形之鍍銀銅粉末，以 具有一 5 _ 9 3g/cm3之堆積密度（於1〇〇〇次之堆 積操作後量測），6 4 · 5 %之相對密度，平均1 . 3之 長寬比，及5 · 5微米之平均粒子尺寸（例子之平均長度 )。實質球形之鍍銀銅粉末之5粒子係以一掃描歐傑頻譜 分析設備受到定量分析，以調查銅粉末之外露面積。結果 ，發現外露面積範圍由1 0至5 0%，平均爲2 0%。 經濟部智慧財產局g(工消費合作社印製 一導電膏材係藉由於攪拌及混合機中及三滾軋機中， 均勻混合於例子1 3中取得之3 5克黏結劑，4 6 5克之 上述取得之實質球形鍍銀之銅粉末及1 1克之卡必醇乙脂 作爲溶劑加以取得。 於導電膏材中之黏結劑及導電粉末之比例（以固體計 )係使得黏結劑對導電粉末之重量比爲7 : 9 3。 再者，一導體係藉由相同於例子1 3中之製程加以生 -64- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 1224129 A7 B7 五、發明説明（62 ) 產.，並受到相同於例子1 3中之帶測試，以確認銲鍚未黏 著至帶上’即，銲接已經完成於導體之表面上。 (請先閱讀背面之注意事項再填寫本頁) 例子2 4 7 5 0克之於例子1中取得之鍍銀銅粉末及3公斤之 直徑5 mm之氧化鉻球係被裝入一球磨機之2公升容器中 ，容器被旋轉5 0分，以取得大致球形之鍍銀銅粉末，以 具有一5.22g/cm3之堆積密度（於1000次之堆 積操作後量測），5 8 · 2 %之相對密度，平均1 · 4之 長寬比，及5 · 6微米之平均粒子尺寸（例子之平均長度 )。實質球形之鍍銀銅粉末之5粒子係以一掃描歐傑頻譜 分析設備受到定量分析，以調查銅粉末之外露面積。結果 ，發現外露面積範圍由1 〇至5 0%，平均爲2 7%。 一導電膏材係藉由於攪拌及混合機中及三滾軋機中’ 均勻混合於例子1 3中取得之4 5克黏結劑，4 5 5克之 上述取得之實質球形鍍銀之銅粉末及1 1克之卡必醇乙脂 作爲溶劑加以取得。 經濟部智慧財產^7員工消費合作社印製 於導電膏材中之黏結劑及導電粉末之比例（以固體計 )係使得黏結劑對導電粉末之重量比爲9 : 9 1。 再者，一導體係藉由相同於例子1 3中之製程加以生 產，並受到相同於例子1 3中之帶測試，以確認銲錫未黏 著至帶上，即，銲接已經完成於導體之表面上。 例子2 5 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -65- 1224129 A7 B7 五、發明説明（63 ) (請先閲讀背面之注意事項再填寫本頁) 7 5 0克之於例子1中取得之鍍銀銅粉末及3公斤之 直徑1Omm之氧化鉻球係被裝入一球磨機之2公升容器 中，容器被振動及旋轉8小時，以取得片狀或片形之鍍銀 銅粉末，以具有一 3 . 7 9 g/cm3之堆積密度（於 1 0 0 0次之堆積操作後量測），4 8 %之相對密度，平 均5 · 2之長寬比，及7 · 7微米之平均粒子尺寸（例子 之平均長度）。所取得之片狀或片形之鍍銀銅粉末之5粒 子係以一掃描歐傑頻譜分析設備受到定量分析，以調查銅 粉末之外露面積。結果，發現外露面積範圍由1 〇至 60%’平均爲45%。 一導電膏材係藉由於攪拌及混合機中及三滾軋機中， 均勻混合於例子1 3中取得之6 5克黏結劑，4 3 5克之 上述取得之片狀或片形之鍍銀之銅粉末及1 5克之卡必醇 乙脂作爲溶劑加以取得。 於導電膏材中之黏結劑及導電粉末之比例（以固體計 )係使得黏結劑對導電粉末之重量比爲1 3 : 8 7。 經濟部智慧財產笱8工消費合作社印製 再者，一導體係藉由相同於例子1 3中之製程加以生 產，並受到相同於例子1 3中之帶測試，以確認銲錫未黏 著至帶上’即，銲接已經完成於導體之表面上。 例子2 6 將7 5 0克於例子1中取得之實質球形鍍銀之銅粉末 及2公斤之1 mm直徑之氧化鉻球裝入一球磨機之2公升 容器中，並旋轉容器2 0分，以取得實質球形之鍍銀之銅 本纸張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -66 - 1224129 A7 __ _B7 五、發明説明（64 ) (請先閲讀背面之注意事項再填寫本頁) 粉末。然而’並未能取得高導電率之導電粉末，因爲鍍銀 之銅粉末並不能被解聚結，造成低塡充特性。因此，在上 述步驟後並未執行其他操作。 上述本發明之實施例（1 )所述之通孔配線板係很適 合實用，因爲其容形形成通孔之電氣連接，並於連接上， 具有一高可靠性’並且，形成於銅箔凸起上之導電材料具 有一小厚度。 上述實施例（2 )之通孔配線板依據上述本發明之態 樣，於連接上具有一特別高之可靠度。 上述實施例（3 )之通孔配線板，除了上述實施例（ 1 )之本發明態樣外，具有優點爲導電材料塡入通孔之塡 充特性及形成於絕緣層上之印刷電路之遷移的阻抗良好。 上述實施例（4 ) ，（ 5 )及（6 )之通孔配線板， 除了上述實施例（1 )之本發明態樣外，具有優點爲導電 材料塡入通孔及非通孔之塡充特性及其導電率改良效果優 良。 經濟部智慧財4局8工消費合作社印紫 上述實施例（7 )至（1 5 )之通孔配線板，除了上 述實施例（1 )之本發明態樣外，具有優點爲導電材料塡 入通孔及非通孔之塡充特性及其導電率改良效果優點。 上述實施例（1 6 )之通孔配線板，除了上述實施例 (1 )之本發明態樣外，具有優點爲具有優良之可銲接性 〇 上述實施例（1 7 )至（2 0 )之通孔配線板，除了 上述實施例（1 )之本發明態樣外’具有優點爲具有優良 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -67 - 1224129 A7 ___B7__ 五、發明説明（65 ) 之可銲接性。 (請先閱讀背面之注意事項再填寫本頁) 上述實施例（2 1 )之通孔配線板，除了上述實施例 (1 )之本發明態樣外，具有優點爲其具有優良之可銲接 性及導電率。 上述實施例（2 2 )之通孔配線板，除了上述實施例 (1 )之本發明態樣外，具有優點爲其具有優良之可銲接 性改良作用及對遷移之阻抗。 上述實施例（2 3 )至（2 4 )之通孔配線板，除了 上述實施例（1 )之本發明態樣外，具有優點爲具有於實 施例（2 1 )及（2 2 )所述之對遷移之阻抗及優良工作 效率。 上述實施例（2 5 )之通孔配線板，除了上述實施例 (1 )之本發明態樣外，具有優點爲其具有優良之可銲接 性。 上述實施例（2 6 )至（2 8 )之通孔配線板，除了 上述實施例（1 )之本發明態樣外，具有優點爲其具有優 良之可銲接性改良。 經濟部智慧財產^員工消費合作社印製 上述實施例（2 9 )之通孔配線板，除了上述實施例 (1 )之本發明態樣外，具有以下優點：對於予以銲接至 晶片元件上之側上之銅范凸起之銲接濕潤性佳’連接至這 些銅箔凸起之特點優良，及對沒有晶片元件予以連接之側 上之銅箔凸起之連接的可靠性高。 -68- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐）1224129 A7 B7 V. Description of the invention (1) [. BACKGROUND OF THE INVENTION The present invention relates to through-hole wiring boards. Regarding the process for forming a conductive circuit on a printed wiring board, one of the processes is described in "Electronic Materials", October 1994, pages 4 2-4 6 where a conductive circuit is used by a hybrid Conductive powders, such as gold, silver, copper, carbon, etc., and binders, organic solutions and pastes obtained from optional additives are formed. In areas where high electrical conductivity is required, gold or silver powder has been used. A conductive paste containing silver powder is used to form printed wiring boards, electronic components, etc. or wiring layers (conductive layers) of electronic circuits and electrodes of electronic components because of their good conductivity. However, this paste is unfavorable when an electric field is applied to a high temperature and high humidity environment. Electrodeposition called migration occurs on an electronic circuit or an electrode, so that a short circuit occurs between the electrodes or wiring. Several methods to prevent migration have been adopted. For example, the application of moisture-proof materials on the surface of conductors or the addition of uranium decay inhibitors (such as nitrogen compounds) to conductive pastes have been proposed, but they are not efficient enough — I — — — — — (Please read the back first Please pay attention to this page before filling in this page) Order f Printed by Intellectual Property of the Ministry of Economy 笱 Printed by Employee Consumer Cooperatives [Invention Summary] The present invention intends to provide a through-hole wiring board, which does not have the disadvantages of the foregoing prior art, and allows easy formation of through-holes. The electrical connection has a high reliability on the connection and a conductive material with a small thickness is formed on the copper foil bump. The present invention provides a through-hole wiring board, which includes through-holes through a substrate. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -4- 1224129. Consumers ’cooperation with the Intellectual Property Bureau of the Ministry of Economic Affairs, printed A7 B7 5. Description of the invention (2) and filled with conductive material; copper foil bumps and copper foil circuits are formed on the surface of the substrate; an insulating layer is formed on the copper foil circuits and on the copper foil bumps and copper foil A necessary part of the circuit; and a printed circuit (jumper circuit) formed of another conductive material, the conductive material having a composition different from the through hole filled in the copper foil circuit portion, and a copper foil protrusion And the insulating layer, except that it is not necessary to be conductive; the ends of the printed circuit board and the through hole are electrically connected with a conductive material having a composition different from that of the through hole. [Brief Description of the Drawings] Fig. 1 is a cross-sectional view of a through-hole wiring board according to an example of the present invention. Fig. 2 is a cross-sectional view of a state where a through-hole is connected using a conductive paste. Fig. 3 is a sectional view showing a state where the through-holes are connected by copper plating. Figure 4 is a conductive paste filled through hole as a multilayer printed wiring board. Sectional view of the state of interlayer connection. FIG. 5 is a sectional view of a conventional through-hole wiring board. Fig. 6 is a cross-sectional view showing a state in which a covering plating film is formed on the end of the conductive paste of the filling hole. Fig. 7 is a sectional view showing a state in which the through holes are electroplated and the space in the through holes is filled with a resin composition. Fig. 8 is a film formed on a polyethylene-terephthalate film. FIG. 9 is a cross-sectional view of a non-through hole formed in an adhesive film with a copper foil. Figure 10 is a plan view of the conductor formed on a paper phenol copper laminate. The paper size is applicable to China National Standard (CNS) A4 (210X297 mm). Order-(Please read the precautions on the back before filling this page) -5- 1224129 A7 B7 V. Description of the invention (3). Figure 11 is a plan view of a test pattern formed on a paper phenol copper laminate. [Symbols] Printed by the Intellectual Property of the Ministry of Economic Affairs and Consumer Cooperatives 1 Conductive paste 2 Copper plating 3 Substrate 4 Conductive layer 5 Insulating layer 6 Jumper circuit 7 Copper foil bump 8 Copper foil circuit 9 Overcoat layer 1 0 Hole 1 1 Copper foil circuit 1 2 Cover coating 1 3 Resin 1 4 Copper foil 1 5 Test pattern 1 6 Polyethylene terephthalate 1 7 Through hole 1 8 Adhesive film 1 9 Copper foil 2 0 Copper laminated paper Standards are applicable to Chinese National Standard (CNS) A4 specifications (210X297 mm) (Please read the notes on the back before filling out this page) Order f -6-Printed by Intellectual Property of the Ministry of Economy 笱 Employee Consumer Cooperatives 1224129 A7 _ _B7 _ 5. Description of the invention (4) 2 1 conductor 2 2 test pattern [detailed description of the present invention] The through-hole wiring board of the present invention includes through-holes that pass through a substrate and are filled with a conductive material; copper foil bumps and copper foil circuits are formed On the surface of the substrate; an insulating layer is formed on the copper foil circuits and on the copper foil bumps and necessary parts of the copper foil circuit; and a printed circuit formed of another conductive material ( Jumper circuit), the conductive material has a composition different from the through hole on the copper foil circuit part, and the copper foil bumps and insulation layer, except for the part that is not required to conduct electricity; The ends of the board and the through hole are electrically connected with a conductive material having a composition different from that of the through hole. · In a conductive paste containing silver powder, the silver powder content should be increased to obtain a conductor with good resistance. This conductive paste is not conducive to its price because silver powder is expensive. When silver-coated copper powder is used, migration can be improved and an inexpensive conductive paste can be obtained. However, when the silver coating is uniform and thick, migration cannot be improved. Furthermore, silver-coated copper powder is disadvantageous to the fact that soldering cannot be performed directly on the coating film of the conductive paste. The conductive paste using silver powder is not conducive to the loss of silver during soldering when it is soldered, making it impossible to obtain a sufficient joint. On the other hand, in the conductive paste using copper powder, the oxidation of the heated copper after curing is high. Therefore, the oxygen and a binding agent obtained in the air react with the copper powder to form an oxide film on the surface of the copper powder, resulting in a very low conductivity. Therefore, it has been revealed that the copper paste is used to prevent the paper size from applying the Chinese National Standard (CNS) A4 specification (210X297 mm) " I: n Order I n I (Please read the precautions on the back before filling in this Page) 1224129 Printed by the Intellectual Property of the Ministry of Economic Affairs and Employee Cooperatives A7 _B7_ V. Description of the Invention (5) Various additives added to stop the oxidation of copper powder, and it has stable conductivity. In terms of electrical conductivity, copper paste is inferior to silver paste and has poor storage stability. Furthermore, the traditional copper paste is not advantageous because soldering cannot be performed directly on the coating film of the copper paste. Because, as mentioned above, a known conductive paste cannot be directly soldered, so welding has been performed on the copper surface by subjecting the coating film of the conductive paste to an activation treatment and then electroless plating. Alternatively, copper plating is performed by using a coating film of a conductive paste as a cathode in a plating solution. However, this method is not practical if the interlayer bonding between the coating film and the copper-plated film is not reliable. Therefore, a circuit forming process can be greatly shortened by developing a conductive paste that can be soldered without electroless plating or electroplating. Therefore, the advantages of development are great. Solder is easily incorporated into some metals, but it cannot be incorporated into an adhesive. Ideally, in conductive welding, a coating film composed of a conductive powder is formed and the welding system is performed on the coating film. However, when the conductive powder is used alone, the reliability and working efficiency in forming a coating film are not sufficient. Therefore, the conductive powder is used after being used as a conductive paste for a binder. However, when the proportion of the adhesive is increased, its importance is equivalent to the reliability and working efficiency in forming the coating film, so the adhesive covers the conductive powder of the metal so that the solder will not contact the conductive powder. Therefore, the solder does not adhere to the conductive powder, resulting in low conductivity. In order to obtain the solder paste conductive paste, the composition of the paste must be as much as possible (please read the precautions on the back before filling this page) This paper size applies to China National Standard (CNS) A4 specification (210X 297 mm) -8-1224129 A7 ____B7_ V. Description of the invention (6) (Please read the notes on the back before filling out this page} The composition of the contact copper foil. That is, the composition must be filled with conductive powder when the conductive paste is placed in a certain space. High, so that the adhesive only accounts for the total volume of the space formed between the conductive powder particles. However, when the proportion of the conductive powder as described above increases, the viscosity of the conductive paste increases greatly, making the production of conductive paste become It is difficult and the working efficiency of applying conductive paste is reduced. Moreover, because the proportion of the adhesive that can bind the particles of the conductive powder is very low, The strength of the coating film is reduced. Therefore, when bonding is performed by using a conductive paste, the conductive paste should achieve a good balance between solderability, conductivity, work efficiency, and strength. The method of using a conductive paste includes applying a conductive paste obtained by dispersing a conductive powder to an adhesive on the surface of a substrate, or filling the through holes with a conductive paste to form the one shown in FIG. 2. Conductive layer. In Fig. 2, reference numeral 1 denotes a conductive paste. As for another method of forming a conductive layer in each through hole formed in a printed wiring board, in this method, the conductive layer is formed by forming a copper-plated film 2 on each inner surface of the through hole, This is printed in the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs shown in Figure 3. Generally speaking, when the connection between the layers is formed using a filled conductive paste and filled with through holes, although the through holes Very small, but still requires a high conductivity. Therefore, the conductive paste should be inserted into the holes as much as possible 'so that the holes can be filled, as shown in Figure 4 for example. Therefore, a conventional conductive paste should increase the proportion of conductive powder. However, when the proportion of the conductive powder is increased, the filling characteristics of the pores are deteriorated. On the other hand, when the size of this paper is adhered to the Chinese National Standard (CNS) A4 specification (210X 297 mm) -9- printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 1224129 A7 ___B7 V. Description of the invention (8) Called printed circuit The disadvantage of obtaining a multilayer circuit board is that the pores in the vias should be removed to increase the reliability of the vias 10 connected to the copper foil bumps 7, copper foil circuits 8, and printed circuits. In Figure 5, number 4 represents a conductive layer, number 6 is a jumper circuit, and number 9 is an outer coating. When a multilayer circuit board distributes conductivity to the vias by using a copper plating film formed on the inner surface of each via, the above disadvantages can be caused by forming a copper plating film on the inner surface of each via, and then forming A covering coating film 1 2 is removed on the conductive paste 1 of the filling hole, as shown in FIG. 6. However, this process is not desirable because it requires additional steps and therefore results in a higher cost. As shown in FIG. 7, there is another process including forming a copper-plated film 2 on the inner surface of each through hole to form a conductive layer and filling the space with a resin 1 3. The disadvantage of this process is that it causes high costs because it requires additional steps. Another process includes filling the via with a non-porous or substantially non-porous conductive material to ensure the conductivity of the via, and then forming an insulating layer and a printed circuit on the surface of the substrate. The disadvantage of this process is that the reliability of the connection is low, because the conductive material and the copper foil bumps of the through hole are connected to the edge of the copper foil. In order to avoid this trouble, the above-mentioned cover plating film must be formed. However, this process is not desirable because it requires additional steps and causes a high cost. In addition, when a multi-layer circuit board is produced using a silver through-hole wiring board, the wiring board has through holes filled with a silver conductive material (silver paste), and this paper size applies the Chinese National Standard (CNS) A4 specification (210X297mm) --------------- IT ------ ^ _ wl (Please read the notes on the back before filling this page) -11-1224129 A7 __B7 V. Description of the Invention (9) (Please read the precautions on the back before filling this page) When forming an insulating layer and printed circuit on the surface of a wiring board, the pores formed in the through holes reduce reliability. That is, when ionic impurities are retained in the pores during the washing step or the like, the resistance to migration is reduced. When a silver through-hole wiring board is used, a silver paste is formed thickly on the silver foil bumps. In some examples, thick silver paste prevents component mounting. The present invention solves the aforementioned problems. The preferred embodiment is as follows. (1) A through-hole wiring board includes: a through-hole that passes through a substrate and is filled with a conductive material; a copper foil protrusion and a copper foil circuit are formed on the surface of the substrate; an insulating layer is formed on the copper foil circuit and is formed on copper Between the foil bump and the necessary part of the copper foil circuit; and the printed circuit is formed of another conductive material having a composition different from that of a through hole on a part of the copper-filled copper foil circuit, and the copper foil bump And the insulation layer is different in composition, except for the part that is not necessary to be conductive; the ends of the printed circuit and the via are electrically connected to a conductive material with a composition different from that of the through-hole. (2) The through-hole wiring board according to the above item (1), wherein the conductive material filling the through-holes is a non-porous or substantially non-porous conductive material. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs (3) The through-hole wiring board according to the above item (2), wherein the conductive material filled with the through-holes includes a substantially spherical conductive powder, and a printed circuit formed on an insulating layer The plate is a conductive material, which includes silver and copper and a composite conductive powder of silver powder. (4) The through-hole wiring board according to any one of the above items (1) to (3), wherein the conductive material filling the through hole or the conductive material used to form the printed circuit is a paste-like conductive material. Material (conductive paste). This paper size applies to Chinese National Standard (CNS) A4 specification (210X297 mm) -12- 1224129 A7 _____B7 V. Description of the invention (10) (Please read the notes on the back before filling this page) (5) According to the above items (4) A through-hole wiring board, in which the conductive paste contains a binder and a conductive powder, and the main component of the binder is an alkoxy radical-containing a phenolic resin, a liquid epoxy resin, and the like Resin curing agent. (6) The through-hole wiring board according to the above item (4), wherein the conductive paste contains an adhesive and a conductive powder, and has a 3: 7. 5 ratio. (7) The through-hole wiring board according to the above item (6), wherein the ratio of the binder and the conductive powder in the conductive paste (as a solid) is a volume ratio of the binder to the conductive powder of 35: 65 to 65: 35 . (8) The through-hole wiring board according to the above item (6) or (7), wherein the main component of the adhesive is an alkoxy group-containing a phenol resin, a liquid epoxy resin, and a curing agent for these resins. (9) The through-hole wiring board according to the above item (5) or (8), wherein the alkoxy-containing phenol-formaldehyde resin is a phenol-formaldehyde resin, which is one or more of 1 to 6 carbon atoms Replaced by alkoxy. (10) According to the above item (5), (8) or (9), the intellectual property of the Ministry of Economic Affairs ^ g (industrial consumer cooperative printed hole wiring board, wherein the alkoxy-containing phenolic resin is The oxidation ratio is 5 to 95%. (11) The through-hole wiring board according to the above item (5), (8), (9) or (1 0), wherein the alkoxy-containing fusible phenol resin It has a weight-average molecular weight of 500 to 2000. (1 2) A through-hole wiring board according to any one of the above items (5) to (1 1), wherein the conductive powder is silver, copper And silver-coated copper powder This paper is in accordance with the Chinese National Standard (CNS) A4 specification (210X 297 mm) ~ -13-1224129 A7 B7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. One of the invention description (11) or A mixture of two or more. (1 3) The through-hole wiring board according to any one of the items (5) to (12) above, wherein the conductive powder is a deagglomerated spherical or substantially spherical conductive powder. (1 4 ) A through-hole wiring board according to any one of the items (5) to (1 3) above, wherein the conductive paste has a binder and a conductive powder Example (based on solids) The weight ratio of the binder to the conductive powder is 3: 97 to 17: 83 ° (15) A through-hole wiring board according to any one of the items (5) to (14) above, where The mixing ratio of alkoxy-containing phenolic resin and liquid epoxy resin is based on the weight ratio of phenolic resin to liquid epoxy resin from 10:90 to 90:10. (1 6) According to the above item (4) A through-hole wiring board, wherein the conductive paste contains a conductive powder and a binder; the ratio of the conductive powder to the binder (on a solid basis) in the conductive paste is based on the volume ratio of the conductive powder to the binder of 4 5: 5 5 to 79: 2 1 and the weight ratio of conductive powder to binder is 88: 12 to 96. 5: 3. 55, and the glass transition point of the cured product of conductive paste is 40 ° C to 180 ° C. (1 7) The through-hole wiring board according to the above item (1 6), wherein the adhesive is mainly composed of an epoxy resin and a curing agent for the composition, and the epoxy equivalent of the epoxy resin is 1 60 to 3 3 0 g / eq 0 (1 8) The through-hole wiring board according to the above item (1 7), wherein the epoxy resin composition includes an epoxy resin and a flexibilizer, and the epoxy resin (please Please read the notes on the back before filling this page) This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X 297mm) -14- 1224129 Printed by A Industrial Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 _____ B7 (12) It is liquid at normal temperature, and the mixing ratio of the epoxy resin and the flexible agent is such that the weight ratio of the epoxy resin to the flexible agent is 40: 60 to 90: 10 ° (19) According to the above The through-hole wiring board according to the item (16), (17) or (18), wherein the conductive powder is a silver-plated copper powder or a copper alloy powder, which has 〇. 1 to; [. The specific surface area of 〇m2 / g 'is an aspect ratio of 1 to 1.5 and an average particle size (average length of particles) of 1 to 20 microns, and the conductive powder is a substantially spherical conductive powder, of which copper powder or copper alloy The exposed area of the powder is 10 to 60%. The metals in copper alloys are small or trace amounts of Sn, Ni, Zn, Co, Mn, Fe, Pb, S, etc. (20) The through-hole wiring board according to any one of the above items (16) to (19), wherein the conductive powder is a copper powder or a copper alloy powder, and its surface is substantially coated with silver exposed on the surface, the The shape of the conductive powder is substantially spherical. (2 1) The through-hole wiring board according to the above item (4), wherein the conductive paste contains conductive powder, a binder, and a solvent; the conductive powder is a copper powder or a copper alloy powder, and the surface is substantially coated Covered with a portion of exposed silver; and the conductive powder has a flake shape or a flake shape, an aspect ratio of 3 to 20, and an average particle size (average length of particles) of 5 to 30 micrometers (22) basis The through-hole wiring board of the above item (21), wherein the exposed area of the copper powder or copper alloy powder is 10 to 60% ° (23) The through-hole arrangement according to the above item (21) or (22) (please Please read the notes on the back before filling in this page} This paper size applies to China National Standard (CNS) A4 (210X 297 mm) -15- Wisdom of the Ministry of Economic Affairs 1 ^ Printed by Employee Consumer Cooperative 1224129 A7 _B7_ V. Invention (13) A wire board in which the solvent is included in an amount of 2 to 20 weight percent based on the weight of the conductive paste. (2 4) According to any of the above items (2 1) to (2 3) The through-hole wiring board of the project, wherein the boiling point of the solvent is 150 ° C to 260 ° C. 25) The through-hole wiring board according to the above item (4), wherein the conductive paste contains a bonding agent and a conductive powder, and the conductive powder is approximately spherical, 4.5 to 6. Bulk density of 2g / cm3 and relative density of 50 to 68%. (2 6) The through-hole wiring board according to the above item (2 5), wherein the conductive powder is a copper powder and a copper alloy powder, and its surface is substantially coated with a part of exposed silver; and the conductive powder is roughly Spherical. (27) The through-hole wiring board according to the above item (25) or (26), wherein the conductive powder is a copper powder or a copper alloy powder having an aspect ratio of 1 to 1.5, and a thickness of 1 to 20 microns The average particle size (average length of the particles), and the conductive powder is a substantially spherical conductive powder, in which the exposed area of the copper powder or copper alloy powder is 10 to 60%. (28) The through-hole wiring board according to any one of the above items (12) to (27), wherein the ratio of the conductive powder and the binder (on a solid basis) in the conductive paste is the ratio of the conductive powder to the binder The weight ratio is 88:12 to 96. 5: 3. 5. (29) The through-hole wiring board according to any one of the above items (1) to (28), in which the conductive material of the filled-through hole described in item (1) is items (5) to (1 5 ) The conductive paste of any item in this paper applies the Chinese National Standard (CNS) A4 specification (210X297mm). Order-(Please read the precautions on the back before filling this page) -16- 1224129 A7 __ B7_______ V. Description of the invention (14) (Please read the precautions on the back before filling in this page) The chip component of item (1) should be connected to the end of the conductive paste of the filling hole through the copper foil attached with solder. Conductive paste for any of items (1 6) to (2 8), printed on copper foil bumps, and copper foil bumps of item (1) without wafer elements attached to the solder are connected to 塡The terminal of the conductive paste filling the through holes is printed on the copper foil bumps by using a conductive paste prepared from silver, copper, and silver powder and the composite conductive powder as in item (3). The aspect of the present invention as in the above-mentioned embodiment (1) provides a through-hole wiring board, which allows the electrical connection of through-holes to be easily formed, and has high reliability on the connection, and a conductive material with a small thickness, formed on a copper foil Raised. The aspect of the present invention as in the above embodiment (2) provides a through-hole wiring board, which is based on the aspect as described in the embodiment (1) and has particularly high reliability in connection. The aspect of the present invention as in the above embodiment (3) provides a through-hole wiring board, which has the advantage that in addition to the advantages of the aspect described in the embodiment (1), it also provides a good conductive material to fill the through-holes. Characteristics and resistance to migration of printed circuits formed on the insulating layer. Printed by the Consumer Finance Cooperative of the Bureau of Wisdom and Finance of the Ministry of Economic Affairs, each aspect of the present invention described in the embodiments (4), (5) and (6) provides a through-hole wiring board, which uses conductivity and The conductive paste with excellent filling characteristics enters through-holes or non-through-holes. Each aspect of the present invention as described in the embodiments (7) to (1 5) provides a through-hole wiring board, which is used to conduct electricity with excellent charging characteristics and improved conductivity when entering through-holes or non-through-holes. Paste. According to the aspect of the present invention described in the embodiment (16), a through hole is provided. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) ~-'1224129 A7 B7 V. Description of the invention (15) The board uses a conductive paste with excellent soldering force. (Please read the precautions on the back before filling this page.) The present invention as described in the embodiments (1 7) to (2 0) provides a through-hole wiring board, which uses a conductive material with excellent solderability improvement. Paste. The aspect of the present invention as described in the embodiment (21) provides a through-hole wiring board using a conductive paste having excellent soldering force and electrical conductivity. According to the aspect of the present invention described in the embodiment (2 2), a through-hole wiring board is provided, which is used for a conductive paste having improved welding force and excellent migration resistance. According to the aspect of the present invention described in the embodiments (2 3) and (2 4), a through-hole wiring board is provided, which uses an electrode having excellent resistance to migration as described in the embodiments (2 1) and (2 2) and The conductive paste with excellent working efficiency. As described in the embodiment (25), the present invention provides a through-hole wiring board, which uses a conductive paste with excellent soldering force. . . The aspect of the present invention as described in the embodiments (2 6) to (2 8) provides a through-hole wiring board, which uses a conductive paste with improved soldering force. The Intellectual Property of the Ministry of Economic Affairs and the Employees' Cooperatives printed the aspect of the present invention as described in the embodiment (29) to provide a through-hole wiring board, in which the copper foil bumps on one side of the wafer component to be soldered The solder wettability is good, the connection characteristics for these copper foil bumps are excellent, and the connection reliability of the copper foil bumps on the side where no chip components are connected is very high. The materials used in the present invention, the constitution of the present invention, and the like are described in detail below. This paper size applies to Chinese National Standard (CNS) A4 specification (210X297 mm) -18- 1224129 A7 __B7 V. Description of the invention (17) (Please read the precautions on the back before filling this page) From the viewpoint of solderability, the exposed part From the viewpoint of oxidation, conductivity, etc., the exposed area of the silver-plated copper powder or copper alloy powder is preferably from 10 to 60%, more preferably from 10 to 50%, and most preferably from 10 to 30. %. There are many methods for coating copper powder or copper alloy powder with silver, such as alternative plating method, electroplating method, electroless plating method, etc. The coating is preferably performed by replacing the electric ore method, because the alternative electric ore method can provide a stronger adhesion between copper powder and copper alloy powder and silver, and cause a lower execution cost. Based on the weight of copper powder or copper alloy powder, and from the viewpoint of improving migration resistance, cost, and conductivity, the coating amount of silver on the copper powder or copper alloy powder allows the powder range to be preferably from 5 to 2 5 wt%, more preferably 10 to 2 3 wt%. Printed by the Intellectual Property of the Ministry of Economic Affairs 4¾ Employee Cooperatives When conductive powders have a small number of contact points, conductive powders tend to have a high impedance. In order to obtain a high conductivity by increasing the contact area of the conductive particles with each other, it is preferable to change the shape of the particles into a sheet shape or a sheet shape by applying an impact to the conductive powder. However, the use of a sheet-shaped or sheet-shaped conductive paste has higher viscosity, which makes its characteristics of filling into the holes worse than that of a conductive paste using a substantially spherical conductive powder. To reduce viscosity, it is sufficient to add a large amount of solvent. However, the addition of a large amount of solvent caused a reduction in the thickness of the coating film of the conductive paste after curing to a thickness corresponding to the volume of the solvent. In order to make the surface of the coating film into a sheet shape or a sheet shape, a honing system is sufficient. However, this honing is not desirable because it reduces the thickness of the film. Therefore, a conductive paste using a substantially spherical conductive powder is preferable in terms of working efficiency and conductivity of the conductive paste. ϋThe paper size applies Chinese National Standard (CNS) A4 (210X29? mm) ~ 1224129 A7 B7 V. Invention Description (24) (Please read the precautions on the back before filling this page) Even under the copper foil surface, borrow The recessed end of the through hole formed by excessively honing the conductive material (conductive paste) has high reliability in conductivity, because according to the present invention, the conductive material at the end of the through hole and the copper foil protrusion is a conductive material. Connect them. When the fins formed next to the through-holes are removed by, for example, uranium engraving after the through-holes through the substrate are formed, the connection between the above-mentioned filling holes and the ends of the conductive material of the copper foil protrusions Reliability is further increased. In the present invention, copper foil bumps and copper foil circuits can be formed by a method including forming a pattern on each copper box of a double-sided copper laminated board by using a resist, and using Saturate the solution and proceed to make a pattern. Meanwhile, when the through-holes are formed in advance, after forming a resist pattern on the through-holes by a so-called tent method, copper foil bumps and copper foil circuits can be formed by an etching method. 4 ^ 7a (printed by the Industrial and Consumer Cooperatives, Ministry of Economic Affairs) As a material used in the insulation layer, from the viewpoints of heat resistance and moisture resistance, a thermosetting insulation material composed of epoxy resin is preferred, but it can also be used. Insulation materials with thermosetting characteristics and u V curing characteristics can also be used. When the use environment is very soft, and the voltage generated by the printed circuit board is very low, a stack of V curing insulating materials can also be used. In the present invention, Regarding the adhesive added to each conductive material, filling the through holes and the conductive material used to print the circuit part of the copper foil, and the copper foil bumps and the insulating layer outside the unnecessary conductive part, preferably using a heat Solid resin group, which contains an epoxy resin and phenolic resin, or a single epoxide or paper size applicable to the Chinese National Standard (CNS) A4 specification (210 × 297 mm) -27- 1224129 employees of the Intellectual Property Bureau of the Ministry of Economic Affairs Cooperative printed A7 _B7 V. Description of the invention (25) A polyethylene glycol, which is added to reduce viscosity, a coupling agent, a curing agent, etc. The ratio between epoxy resin and phenolic resin It is as follows. Among the conductive materials for filling holes, a composition with a high content of epoxy resin is preferable because the viscosity reduction and the solvent amount reduction are better. On the other hand, it is used for printing in the above. Among the conductive materials on the copper foil bumps and the insulating layer, a high content of phenolic resin is preferred to reduce the resistance of the printed circuit. This composition may include a solvent in a ratio of 10 to 2 5 W t %, As long as the solvent does not cause bleeding during printing. As for phenolic resins, known phenolic resins, phenolic resins, and other phenolic resins can be used. The ratio of epoxy resin and phenolic resin is better to make the ring The weight ratio of oxygen resin to phenol resin ranges from 10:90 to 90:10, more preferably 10:90 to 60:40. When the ratio of epoxy resin is less than 10 wt%, adhesion to copper foil The characteristics tend to deteriorate. When the proportion of the epoxy resin exceeds 90% by weight, the electrical conductivity is deteriorated. The conductive paste using a phenolic resin has a higher conductivity than the conductive paste using an epoxy resin. The reason is For curing phenolic resin The degree of shrinkage is higher than that of epoxy resins, and the volume of conductive materials using phenolic resins is greatly reduced, which increases the contact area and the possibility of conductive powder particles contacting each other. Although phenolic resins are necessary for a conductive paste that requires high conductivity , But the addition of conductive paste increases the viscosity of the conductive paste and deteriorates the filling characteristics into the hole. In particular, its addition becomes worse with a small diameter (please read the precautions on the back before filling this page) ) This paper size applies to Chinese National Standard (CNS) A4 specification (210X297 mm) -28- 1224129 A7 _B7_ V. Description of the invention (27) (Please read the notes on the back before filling this page) Among the binders in the conductive material on the insulating layer, a high phenol resin content is preferred because the conductivity is as high as possible. Among the binders, an alkoxy-containing resole resin having a high viscosity is preferably used to prevent bleeding during printing and drying. The weight-average molecular weight range of the alkoxy-containing resol phenol fermentation resin is preferably from 5000 to 200,000, more preferably from 700 to 120,000. When a phenolic resin having a high molecular weight is used, the viscosity of the conductive material increases rapidly with the evaporation of the solvent when the conductive material is dried after printing. Therefore, even if the viscosity decreases with heating, when the molecular weight is high, the degree of viscosity reduction is low. Therefore, the conductive material is characterized in that it can be prevented from oozing out, and a wiring board having high reliability in insulation can be obtained. From the characteristics of conductivity and viscosity and conductive paste filling into the holes, the mixing ratio of the alkoxy-containing phenol resin and the liquid epoxy resin is preferably such that the alkoxy-containing phenol resin is in a liquid state. The weight ratio of the epoxy resin is 10:90 to 90:10, preferably 40:60 to 90: 10 °. The epoxy resin printed by the Ministry of Economic Affairs Intellectual Property ΜΓΜ Industrial Cooperative Cooperative is liquid at normal temperature. Epoxy resin crystallized at normal temperature can be prevented from crystallizing by adding epoxy resin which is liquid at normal temperature. Epoxy resins are liquid at ordinary temperatures and are used in the present invention. They include, for example, epoxy resins, which are solid at ordinary temperatures, but can also be epoxy resins which are liquid at ordinary temperatures at ordinary temperatures. Resin and become a stable liquid. In this specification, the term "normal temperature" or "room temperature" means a temperature of about 2 5 t. As for the epoxy resin, known epoxy resins that can be used can be applied to the Chinese national standard (CNS) A4 specification (210X 297 male f) ~ ~ 1224129 A7 ___B7_ at the paper size. V. Description of the invention (28) (please first Read the notes on the back and fill in this page again.) Exemplary compounds containing two or more epoxy groups in the molecule, such as aliphatic epoxy resins, such as polyglycidyl ether, dihydroxynaphthalene diglycidyl ether, butadiene. Diethylene glycol diglycidyl ether, neopentyl ethylene glycol glycidyl ether, etc., which are based on the reaction of bisphenol A, bisphenol AD, bisphenol F, phenolic lacquer, or cresol phenolic lacquer with epichlorine Alcohols are obtained; heterocyclic epoxy compounds, such as diglycidyl hein, etc .; and aliphatic epoxy resins, such as vinyl cyclohexene dioxide, bicyclic pentadiene dioxide, alicyclic diepoxy Adipic acid and the like. If necessary, a softener can be used. As the softener, a known one can also be used. It is, for example, an exemplary compound having only one epoxy group in one molecule, for example, a conventional epoxy resin such as n-butyl glycidyl ether, vesicyl glycidyl ether, styrenated oxygen, ethylhexyl shrink Glyceryl ether, phenyl glycidyl ether, tolyl glycidyl ether, butylphenyl glycidyl ether and the like. The above epoxy resins can be used alone or in combination. The above-mentioned softening agents may be used alone or in combination. The consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed the curing agent added to the binder. The amines that can be used are, for example, menthenediamine, isophorediamine, m-phenylenediaminediamine, diaminediamine Benzylmethane, diaminodiphenylhydrazone, methylenediphenylamine, etc .; acid anhydrides, such as phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, succinic anhydride, tetrahydrophthalic anhydride, etc., compound type curing agents, such as Imidazole, dicyandiamide, etc .; and resin-based curing agents such as polyamide resins, phenolic resins, urea resins, etc. If necessary, the above-mentioned exemplary curing agents may be used in combination with, for example, latent amine curing agents. It can be added to the curing acceleration known for epoxy resin and phenolic resin. The paper size is applicable to Chinese National Standard (CNS) A4 specification (210X297 mm) -31-1224129 A7 __ B7 V. Description of the invention (29). For example, tertiary amine, imidazole, triphenylphosphine, tetraphenylphosphine boronic acid and the like. (Please read the precautions on the back before filling this page) From the viewpoint of the glass transition point (Tg) of the cured product of conductive paste, the curing agent content range is better per 100 parts by weight of epoxy resin. From 0.1 to 25 parts by weight, preferably 1 to 20 parts by weight, and most preferably 1 to 10 parts by weight. The binder used in the present invention can be mixed with a thixotropic agent, a coupling agent, a defoaming tincture, a powder finishing agent, an anti-curing agent and the like by uniformly mixing the above materials. Based on the weight of the conductive paste, if necessary, the content of thixotropic agent, coupling agent, defoaming tincture, powder finishing agent, and anti-curing agent is preferably in the range of 0. 001 to 1 wt%, and most preferably 0. . 03 to 0. 5 w t% 〇 The specific gravity of the conductive paste used in the present invention ranges from 3 to 7. 5, more preferably 3.5 · 6 to 6. 5. When the specific gravity is less than 3, high conductivity cannot be obtained because of the low proportion of conductive powder. On the other hand, when the specific gravity is larger than 7.5, the proportion of the conductive powder is high, but the proportion of the binder and the like is very low, which makes the filling characteristics into the holes worse. In order to adjust the specific gravity of the conductive paste to the above range, the powder conductance f to the agent 5 between the printed materials of the Ministry of Conductive Economics and the Intellectual Property Co., Ltd. 4¾ employee consumer cooperatives. Better} to count ο body 6 solid: to ο (4 ratio from the product is from 7 to 9 is good: the most 3, from 5 to 8 ratio: the amount of 5 weight 1 to 5 between 5 and 9 powder: electricity 5 leads As a result, the agent is more viscous. At 3, %% t% wt 3 w 8 7 is less than 9. The ratio of the powder powder is higher than the conductivity of the powder when the conductivity is 0. 7. 8 Poor: change 3 will 1 The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -32- 1224129 A7 ___B7 V. Description of the invention (30) The adhesiveness and strength of conductive paste are reduced, so This makes the reliability worse. In any one of the conductive pastes (16), (21), and (25) described above, the volume ratio (based on solids) between the adhesive and conductive powder in the conductive paste. The preferred range is from 5 5: 4 5 to 2 1: 7 9, and more preferably from 50:50 to 28:72. The weight ratio between the range of the ratio is preferably 3 powder. 5: 96 · 5 to 1 2: 88, more preferably 5 · · 95 to 10: 90. When the proportion of the conductive powder is lower than the above range, solderability is deteriorated. When the proportion of the conductive powder exceeds the above range, the viscosity of the conductive paste rapidly increases, making it difficult to produce the conductive paste, and reducing the working efficiency of applying the conductive paste. In the present invention, the glass transition point (hereinafter referred to as T g) of the cured product of the conductive paste is preferably from 40 t to 180 ° C, more preferably from 40 ° C to 140 ° C. When 1: 2 is outside the range of 40 ° (: to 18 CTC, it is unlikely to be soldered directly to the coating film of the conductive paste. In order to adjust the cured product of the conductive paste, Ding 1 to 4 to 1 8 In the temperature range of 0 ° C, it is preferable to use an adhesive, which is mainly composed of epoxy resin and a curing agent. The epoxy equivalent range of the epoxy resin is from 160 to 330 g / ecj, more preferably from 160 To 250 g / eq. As for the above epoxy resin composition, in addition to the epoxy resin, a composition containing a softener is preferably used. The mixing ratio of the epoxy resin and the softener is preferably such that the epoxy resin softens the softener. The weight ratio is from 40:60 to 90: This paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) ——— II — 0—, (Please read the precautions on the back before filling in this (Page) Order printed by the Ministry of Economic Affairs and Intellectual Property Co., Ltd.-33- 1224129 A7 B7 V. Description of Invention (33) (Please read the notes on the back before filling this page) As for the added solvents, you can use the above Illustrates a mixture or one of two or more solvents. Based on conductivity It seems that the working efficiency, the viscosity of the conductive paste, the thickness of the coating film, the characteristics of the filling hole, etc., based on the weight of the conductive paste, the range of the solvent content is preferably from 0. 0 1 to 2 0 wt% , More preferably from 1 to 2 0wt%, but also from 2 to 20wt%, most preferably from 2 to 7. 5wt%. From the viewpoint of the viscosity stability of the conductive paste during operation and drying of the solvent, the boiling point range of the solvent is preferably from 150 to 260 t, and more preferably from 170 to 240 ° C. The conductive paste used in the present invention can be obtained by uniformly mixing the above components, that is, a binder, a conductive powder, and optionally a solvent and a thixotropic agent, a coupling agent, a defoaming tincture, a powder finishing agent, and an anti-curing agent. Many mixers, sand mixers, three-roll mills, etc. operate the dispersion. The invention is explained by the following examples. Example 1 The adhesive A printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs is based on an automatic mortar and three rolling mills, which mix 8 2 parts of bisphenol A by weight evenly. The brand name Epikote 827 by Oxygen Resin Co., Ltd., 10 parts by weight of aliphatic glycidyl ether (trade name ED — 503 manufactured by Asahi Denka Chemical Industry Co., Ltd.) and 8 parts by weight of 2-phenol — 4-Methylimidazole (Curesol, 2P4MZ manufactured by Shikoku Chemical Co., Ltd.) was prepared. On the other hand, Binder B is based on an automatic mortar and a three-roller mill with 40 parts of phenol resin (evenly mixed with the weight of phenolic resin produced by Jialibao Company, the standard of China National Standard (CNS) A4). (210X 297 mm) -36- 1224129 A7 B7 V. Description of the invention (34) Brand name Bell pearl S-890), 60 parts by weight of bisphenol A based epoxy resin (from soup shell epoxy resin Epikote 827 manufactured by the company) and 5 parts by weight of 2-phenol-4-methylimidazole are prepared as described above. The ratio of the epoxy resin and the phenol resin in the binder B is such that the weight ratio of the epoxy resin to the phenol resin is 60:40. Further, a spherical copper powder (trade name: SFR-Cu manufactured by Japan Spray Metal Powder Co., Ltd.) having an average particle size of 5.1 microns was rinsed with dilute hydrochloric acid and deionized water, and then, An electroplating solution containing 80 g of Ag CN and 75 g of Na CN per liter of water was used for substitution electroplating, so that the silver ratio may be 18 wt% based on the weight of the spherical copper powder. The copper powder thus treated was rinsed with water and dried to obtain a silver-plated copper powder (silver-plated copper powder). The five particles of the obtained silver-plated copper powder were quantitatively analyzed by a scanning Ogilvy electronic spectrum analysis device to investigate the exposed area of the copper powder. As a result, we found that the exposed area ranged from 12 to 28% and averaged 21%. Then, 750 grams of the above-mentioned silver-plated copper powder and a chromium oxide ball having a diameter of about 3 mm were added to a 4-liter container of a ball mill, and the container was rotated for 40 minutes to obtain a roughly spherical silver-plated silver Copper powder having an average aspect ratio of 1 · 2 and an average particle size (average length of particles) of 5 · 4 microns. On the other hand, 400 g of silver-plated copper powder and 4 kg of chromium oxide balls having a diameter of 10 mm were added to a 4-liter container of a ball mill, and the container was shaken and rotated for 4 hours to obtain The size of this piece of paper is in accordance with Chinese National Standard (CNS) A4 (210X29 * 7mm) (Please read the precautions on the back before filling out this page) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs Consumer Cooperatives-37- 1224129 A7 A7 B7 5. Description of the invention (35) or flake-shaped silver-plated copper powder, which has an average aspect ratio of 7.2 and an average particle size (average length of particles) of 8.6 microns. The conductive paste A is obtained by using a stirring and mixing machine and a three-rolling mill, I to uniformly mix 40 parts of the adhesive A obtained above, weight | 4 to 40 parts of substantially spherical silver-plated copper powder And 20 parts by weight or more | The flake or sheet-shaped silver-plated copper powder and 10 parts by weight of 3-methyl-3 -methoxymethoxybutanol (trade name Solfit manufactured by Kuraray Co., Ltd.) Prepared as a solvent. On the other hand, the conductive paste B is in the form of a sheet or a sheet by weight of 2 to 20 parts by weight based on '65 parts by weight of the above-obtained adhesive B uniformly mixed in a stirring and mixing machine and a three-roll mill. Shape silver-plated copper powder, and 140 parts by weight of the above-mentioned flake or flake silver powder having a mean particle size of 2.1 micrometers (trade name TCG-1 of Tokuriki Chemical Research Co., Ltd.) and 75 parts by weight 3-Methyl-3-methoxybutanol (trade name Solfit manufactured by Kuraray Co., Ltd.) was prepared as a solvent. The ratio of the substantially spherical silver-plated copper powder and the flake-shaped or plate-shaped silver-plated copper powder printed in the conductive paste A by the Industrial and Consumer Cooperative Society 4 ^ 7—The ratio of the spherical silver-plated copper powder to the flake The weight ratio of the plate-shaped silver-plated copper powder is 9 6: 4. The ratio of the flake or flake silver-plated copper powder and the flake or flake silver powder in the conductive paste B is such that the weight ratio of the flake or flake silver-plated copper powder to the flake or flake silver powder is For 6 1: 3 9. The ratio of the binder to the conductive powder in the conductive paste A (on a solid basis) is a weight ratio of the binder to the conductive powder of 8: 9 2. Based on the weight of the conductive paste, the content of the solvent in the conductive paste a is 1.96 w t%. Adhesive and conductive powder in conductive paste B The paper size is applicable to Chinese National Standard (CNS) A4 specification (210X 297 mm) -38- 1224129 A7 _B7_ V. Description of the invention (38) Measured in the same way as above . (Please read the precautions on the reverse side before filling out this page) Example 2 Conductive paste C is obtained by using an agitator and mixer and a three-roll mill to uniformly mix 4 to 5 parts by weight of the adhesive obtained in Example 1 above. Agent A, 4 3 5 parts by weight of the substantially spherical silver-plated copper powder obtained in Example 1, and 10 parts by weight of dendritic silver powder (Tokuriki Chemical Honed Co., Ltd., trade name EG-2 0 ) And 10 parts by weight of 3 monomethyl-3-methoxybutanol (trade name Solfit manufactured by Kuraray Co., Ltd.) as a solvent. Conductive paste D is obtained by uniformly mixing 65 parts by weight of the adhesive B obtained in the above Example 1 in a stirring and mixing machine and a three-roll mill, and 240 parts by weight as in Example 1. The obtained flake-shaped or flake-shaped silver-plated copper powder, and 100 parts by weight have 2. 1 micron average particle The above-mentioned flake or flake silver powder (trade name TC G-1 of Tokuriki Chemical Research Co., Ltd.) printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs and the dendritic silver powder of 20 weight ( Tokuriki Chemical Honing Co., Ltd. has a trade name of EG — 2 0) and 75 parts by weight of 3 —methyl — 3 —methoxybutanol (trade name Solfit manufactured by Kuraray Co., Ltd.) as solvents. system. The ratio of the substantially spherical silver-plated copper powder and the silver powder in the conductive paste C is such that the weight ratio of the spherical silver-plated copper powder to the silver powder is 9 6: 4. The ratio of the flake-shaped or flake-shaped silver-plated copper powder to the silver powder in the conductive paste D is such that the weight ratio of the flake-shaped or flake-shaped silver-plated copper powder to the silver powder is 67:33. Proportion of the binder and conductive powder in the conductive paste C The paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -41-1224129 A7 B7_ V. Description of the invention (39) (Please read the back first Note: Please fill in this page again) (based on solids) The weight ratio of the binder to the conductive powder is 9: 9 1. The content of the solvent in the conductive paste C is 1.96 wt% based on the weight of the conductive paste. The ratio of the binder and the conductive powder in the conductive paste D (on a solid basis) is a weight ratio of the binder to the conductive powder of 15:85. The content of the solvent in the conductive paste D is 15 wt% based on the weight of the conductive paste. Furthermore, a through-hole wiring board was manufactured with the same manufacturing process as in Example 1 above, and the initial characteristics of the through-hole wiring board were evaluated. As a result, we found that the resistance of each through hole has a maximum value of 198 milliohms per hole, a minimum value of 163 milliohms per hole, and an average value of 175 milliohms per hole. A DC voltage of 50 volts was applied between the copper foil circuit and the jumper circuit in the same manner as described in Example 1. The insulation resistance was measured and found to be 10 13 ohms or more. The chip resistance of the jumper circuit was found to be 9 9 ohm • cm. In addition, the through-hole wiring board was subjected to a thermal shock test in the same manner as in Example 1 to find the change in the resistance of the through-hole to 5.8%, and the change rate of the jumper circuit to 1. 9%. Printed by the Intellectual Property Bureau B of the Ministry of Economic Affairs (printed by the Industrial and Consumer Cooperative) On the other hand, the through-hole wiring board was subjected to an anti-migration test in the same way as described in Example 1 to find out the insulation resistance system 010 1 ohm or more Example 3 The conductive paste E is obtained by uniformly mixing 35 parts by weight of the adhesive obtained in the above Example 1 in a stirring and mixing machine and a three-rolling mill. The paper size is in accordance with Chinese National Standard (CNS) A4. Specifications (210X297 mm) 1224129 A7 ______B7 V. Description of the invention (40) (Please read the precautions on the back before filling out this page) A 4 4 5 parts by weight of the actual spherical ore silver copper copper powder obtained in Example 1 ' And 30 parts by weight of dendritic silver powder (trade name EG-2 0 manufactured by Tokuriki Chemical Honed Co., Ltd.) and 13 parts by weight of 3-methyl-3 -methyl as used in Example 2 Oxybutanol was prepared as a solvent. The conductive paste F was obtained by uniformly mixing 60 parts by weight of the adhesive B obtained in Example 1 above in a stirring and mixing machine and a three-roll mill. 2 9 5 servings of flakes or flakes as obtained in Example 1 Silver-plated copper powder, and 50 parts by weight of an example of using the two having 2. 1 micron average particle size of the above flake or flake silver powder and 20 by weight of dendritic silver powder as used in Example 2 and 75 parts by weight of 3-methyl- as used in Example 2 3-methoxybutanol was prepared as a solvent. The intellectual property of the Ministry of Economics ¾ The ratio of the substantially spherical silver-plated copper powder and silver powder printed in the conductive paste E by the employee consumer cooperative is such that the weight ratio of the spherical silver-plated copper powder to the silver powder is 9 4 ·· 6. The ratio of the flake-shaped or flake-shaped silver-plated copper powder to the silver powder in the conductive paste F is such that the weight ratio of the flake-shaped or flake-shaped silver-plated copper powder to the silver powder is 81:19. The ratio of the binder and the conductive powder in the conductive paste E (on a solid basis) is a weight ratio of the binder to the conductive powder of 7: 9 3. The content of the solvent in the conductive paste E is 2.5 wt% based on the weight of the conductive paste. The ratio of the binder and the conductive powder in the conductive paste F (on a solid basis) is a weight ratio of the binder to the conductive powder of 1 4: 86. Based on the weight of the conductive paste, the content of the solvent in the conductive paste F is 15 wt%. This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) -43- 1224129 A7 _____B7_ V. Description of invention (41) (Please read the precautions on the back before filling this page) Furthermore, a through-hole wiring board It was manufactured by the same process as Example 1 above, and the initial characteristics of the through-hole wiring board were evaluated. As a result, we found that the resistance of each through hole has a maximum value of 184 milliohms per hole, a minimum value of 156 milliohms per hole, and an average value of 165 milliohms per hole. A DC voltage of 50 volts was applied between the copper foil circuit and the jumper circuit in the same manner as described in Example 1. The insulation resistance was measured and found to be 10 12 ohms or more. The chip resistance of the jumper circuit was found to be 8 3 ohm • cm. In addition, the through-hole wiring board was subjected to a thermal shock test in the same manner as in Example 1 to find the change in the resistance 通 of the through-hole to 3. 9%, and the change rate of the jumper circuit is 2. 3%. On the other hand, the through-hole wiring board was subjected to an anti-migration test in the same manner as described in Example 1 to find the insulation resistance system of 10 1 1 ohm or more. Comparative Example 1 As shown in FIG. 5, a through hole 10 having a diameter of 0 to 4 mm is formed in the substrate 3 and filled with the conductive paste A obtained in Example 1 to form a conductive layer 4. After drying and curing, the surface of the substrate thus treated is honed to connect the conductive material in the through hole 10 to the copper foil protrusion 7 at the end of the through hole 10. Then, the insulating layer 5 is formed on the surface of the substrate, the end of the through hole, the surface of the copper foil bump 7 and a part of the surface of the copper foil circuit 8. The printing is performed by using the conductive paste B obtained in Example 1 to form a jumper circuit between the copper foil circuit and the surface of the insulating layer. -44- This paper size applies to the Chinese National Standard (CNS) A4 specification (210X297). 1224129 A7 B7 V. Description of the invention (42) (Please read the notes on the back before filling this page) 6. The overcoat layer 9 is formed on the jumper circuit 6 by using the same insulating material as described above. The product thus obtained was dried at 801 hours and then heat-treated at 165 hours for 1 hour to obtain a through-hole wiring board. In the above process, the insulating layer was formed by three printing operations using an insulating material (trade name S G R-100) manufactured by Dayang Ink Co., Ltd. having an U V -curing property and a thermosetting property. The initial characteristics of the through-hole wiring board were evaluated. As a result, we found that each via has the following resistances: a maximum of 355 milliohms per hole, a minimum of 175 milliohms per hole, and an average of 265 milliohms per hole. The through-hole wiring board was subjected to the same thermal shock test as described in Example 1 100 times to find the resistance change rate of the through-holes was 25.9% and the change rate of the jumper circuit was 2. 4%. Comparative Example 2 The Ministry of Economic Affairs, Chi Tsai Choi, and the employee consumer cooperative printed a through-hole wiring board by the same process as in Example 1, except that the conductive paste A obtained in Example 1 was used as the conductive charge of the through-hole. The paste and the conductive paste are used to form a jumper circuit. The initial characteristics of the through-hole wiring board were evaluated. As a result, we found that the resistance of each through hole has a maximum value of 213 milliohms per hole, a minimum value of 173 milliohms per hole, and an average value of 182 milliohms per hole. A DC voltage of 50 volts was applied between the copper foil circuit and the jumper circuit in the same manner as described in Example 1. The insulation resistance was measured and found to be 10 12 ohms or more. The chip resistance of the jumper circuit was found to be 2 50 $. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) ~ -45-1224129 A7 ______B7 5. Description of the invention (43) Micro-ohm • cm. (Please read the precautions on the back before filling this page.) In addition, the through-hole wiring board is subjected to the same thermal shock test as in Example 1 100 times, to find the resistance of the through-hole. The rate of change is as high as 1 2 The change rate of 5% 'and jumper circuit is as high as 9 5%. On the other hand, the through-hole wiring board was subjected to an anti-migration test in the same manner as described in Example 1 to find the insulation resistance system 1 0 1 1 ohm or more. Example 4 A binder system was used to uniformly mix weight 40 parts by weight of a butoxy-containing phenolic resin (manufactured by Hitachi Chemical Co., Ltd .; 65% butoxylation rate, and weight average molecular weight 1200), 55 parts by weight as used in Example 1 The phenol A-based epoxy resin and 5 parts by weight were the same as those used in Example 1 for 2-phenyl-4,4-methyl-imidazole. The weight ratio of phenolic resin to epoxy resin is 4 2 · 1: 5 7. 9 ° Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Then, 750 grams of silver-plated copper powder in Example 1 and 3 kg of chromium oxide balls with a diameter of 5 mm were placed in a 2-liter container in a ball mill. In, and the container is rotated by 40, divided to obtain a substantially spherical silver-plated copper powder having an average aspect ratio of 1. 3 and 5. 5 micron average particle size (average particle length). The obtained 5 particles of the silver-plated copper powder were subjected to quantitative analysis by a scanning Ogilvy spectrum analyzer 'to investigate the exposed area of the copper powder. As a result, we found that the exposed area ranged from 10 to 50%, with an average of 20%. This paper size applies to Chinese National Standard (CNS) A4 specification (210X297 mm) · Milk _ 1224129 A7 B7 V. Description of the invention (44) (Please read the precautions on the back before filling this page) A conductive paste is borrowed Because in the stirring and mixing machine and in the three rolling mills, 50 g of the binder obtained above, 450 g of the substantially spherical silver-plated copper powder obtained above and 15 g of carbitol ethyl ester were used as solvents. Get. The viscosity of the obtained conductive paste was 7 2 0 dPa · s. In order to measure viscosity, a viscometer Η B T manufactured by Brookfield Engineering & Experiment Co. was used. The same viscosity meter Η B T as above is used in the following examples. The ratio of the binder to the conductive powder (on a solid basis) in the conductive paste is such that the weight ratio of the binder to the conductive powder is 10:90. Furthermore, the test pattern 15 shown in Fig. 8 was printed on a polyethylene terephthalate film which was pre-contracted to 17 Ot by using the conductive paste obtained above. The thus-treated film was pre-dried in 90 ° t air for 20 minutes, and then heat-treated at 170 ° C for 1 hour to obtain a wiring board. The characteristics of the wiring board obtained by the Intellectual Property of the Ministry of Economic Affairs and the Employee Consumer Cooperatives were evaluated to find out that the specific resistance of the conductor was 1.4 microohms · meter. In Fig. 8, reference numeral 16 denotes the polyethylene terephthalate film. On the other hand, as shown in Figure 9, each has a diameter of 0. 15 mm and 0 · 1mm bottom through holes 17 are formed in a 55-micron-thick copper foil adhesive film. The adhesive film has a 55-micron-thick copper foil for stable adhesion (a product manufactured by Hitachi Chemical Co., Ltd.) (Named MC F-3000E). The bottom through hole 17 is filled with the conductive paste obtained as described above. Then, the part of the bottom through hole 17 is observed to confirm that it is sufficiently unique. -47- This paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) 1224129 A7 B7 V. Description of the invention (46) The part is observed 'to confirm that the filling has a diameter of 0.15 ^ m and 〇1 (please read the precautions on the back before filling this page) non-through hole conductive paste of mm has no pores, that is, non-through holes It has been completely filled with conductive paste. Example 6 A binder was obtained by uniformly mixing 40 parts by weight of a phenolic resin (trade name Bell Perai S-895 manufactured by Kalibo), and 55 parts by weight of the bisphenol A used in Example 1 was The main epoxy resin, and 5 parts by weight are the same as those used in Example 1 2-phenyl-4 methyl-imide phenol resin to epoxy resin weight ratio is 4 2. 1: 5 7. 9 ° A conductive paste is obtained by uniformly mixing 50 g of the binder obtained above in the stirring and mixing machine and three rolling mills, and 450 g of the substantially spherical silver-plated copper powder obtained in Example 4 above. And 15 grams of carbitol ethyl ester was obtained as a solvent. The viscosity of the conductive paste obtained by the Intellectual Property of the Ministry of Economic Affairs and printed by the employee consumer cooperative was measured in the same way as in Example 4, and was obtained as 3 1 7 0 d P a · s. The ratio of the binder to the conductive powder (on a solid basis) in the conductive paste is such that the weight ratio of the binder to the conductive powder is 10:90. Furthermore, the wiring board identical to that in Example 4 was produced using the same process as in Example 4, and was characterized by the specific resistance of the conductor being 2. 2 micro ohms · meter, which is not very different from the one obtained in Example 4. However, 'the non-through hole portion of the wiring board that has been filled with conductive paste is observed' -49- This paper size applies to China National Standard (CNS) A4 (210X297 mm) 1224129 A7 B7 V. Invention Explanation (47) To find the space between the conductive paste and each non-through hole wall with a diameter of 0.15mm and 0.1mm, and find the conductive paste has pores (please read the precautions on the back first) (Fill in this page again) 〇 Example 7 A binder is obtained by uniformly mixing 40 parts by weight of a phenolic resin (manufactured by Gun-ei Chemical Industry Co., Ltd. under the trade name Resitop PGA-4528) and 55 parts by weight. The bisphenol A-based epoxy resin as used in Example 1 and 5 parts by weight were the same as those used in Example 1 for 2-phenyl-4-methyl-imidazole. The weight ratio of phenolic resin to epoxy resin is 4 2 · 1: 5 7. 9 ° A conductive paste is obtained by uniformly mixing 50 g of the binder obtained above in the stirring and mixing machine and three rolling mills, and 450 g of the substantially spherical silver-plated copper powder obtained in Example 4 above. And 15 grams of carbitol ethyl ester was obtained as a solvent. Printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs; ^ The viscosity of the conductive paste obtained was measured in the same way as in Example 4, and was obtained as 3 1 6 0 d P a · s. The ratio of the binder to the conductive powder (on a solid basis) in the conductive paste is such that the weight ratio of the binder to the conductive powder is 10:90. Furthermore, the wiring board identical to that in Example 4 was produced by the same process as in Example 4, and was characterized by the specific resistance of the conductor being 1 · 9. Micro-ohm · meter, which is not much different from the gain obtained in Example 4. However, the non-through-hole portion of the wiring board that has been filled with conductive paste is observed. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -50- 1224129 A7 __________B7_ V. Description of the invention (48) to find the conductive paste and have a diameter of 0.15 mm and 0. There is space between the walls of the non-through hole of 1 mm, that is, the conductive paste has pores. (Please read the notes on the back before filling this page) Example 8 A binder is obtained by uniformly mixing 10 parts by weight of the same phenolic resin as used in Example 6, and 85 parts by weight as in the example. The bisphenol A-based epoxy resin used in 1 and 5 parts by weight were the same as those used in Example 1 for 2-phenyl-methyl-imidazole. The weight ratio of phenolic resin to epoxy resin is 10. 5: 8 5. 9 ° A conductive paste is obtained by uniformly mixing 50 g of the binder obtained above in the stirring and mixing machine and three rolling mills, and 450 g of the substantially spherical silver-plated copper powder obtained in Example 4 above. And 15 grams of carbitol ethyl ester was obtained as a solvent. The viscosity of the obtained conductive paste was measured in the same manner as in Example 4 to obtain 1 2 6 0 d P a · s. The 4th Bureau of the Ministry of Economic Affairs, Smart Finance 4 (The ratio of the binder and the conductive powder printed on the conductive paste by the industrial and consumer cooperatives (based on solids) is such that the weight ratio of the binder to the conductive powder is 1 0: 9 0. The wiring board identical to that in Example 4 was produced by the same process as in Example 4, and its characteristics were found to be that the specific resistance of the conductor was 1 1 · 5 microohm · m, which was considerably higher than that obtained in Example 4. The non-through-hole portion of the wiring board that has been filled with conductive paste is observed 'to confirm that the filled conductive paste with non-through holes having a diameter of 0 _15 mm and 0.1 mm has no pores, that is, non- The through-holes have been completely filled with conductive paste * ° This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) 1224129 A7 ____B7 ___ V. Description of the invention (49) Example 9 (Please read the note on the back first Please fill in this page again.) A binder is obtained by uniformly mixing 45 parts by weight of the same butoxy-containing phenolic resin as in Example 4 and 50 parts by weight as used in Example 1. Bisphenol A-based epoxy resin, and 5 parts by weight As used in Example 1 of 2 - phenyl - methyl - imidazole phenolic resin weight ratio of epoxy resin to 47. 4: 5 2. 6 ° A conductive paste is obtained by uniformly mixing 50 g of the binder obtained above in a stirring and mixing machine and three rolling mills, and 450 g of the substantially spherical silver-plated copper powder obtained in Example 4 above. And 15 grams of carbitol ethyl ester was obtained as a solvent. The obtained conductive paste has a specific gravity of 5.2 and a viscosity of 750 d P a • s. The ratio of the binder to the conductive powder (on a solid basis) in the conductive paste is such that the volume ratio of the binder to the conductive powder is 4 6. The weight ratio of 1: 53 · 9 and the binder to the conductive powder was 10:90. Printed by the Intellectual Property of the Ministry of Economic Affairs / Employee Consumer Cooperative. Furthermore, the same wiring board as in Example 4 was produced using the same process as in Example 4. It was found that the specific resistance of the conductor was 1.3 μm · m. The non-through hole portion of the wiring board that has been filled with conductive paste is observed to confirm that the filled conductive paste with non-through holes with diameters of 0. 15 mm and 0.1 mm has no pores. The vias have been completely filled with conductive paste. -52-This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) 1224129 A7 ___ B7 V. Description of the invention (50) Example 1 0 A binder is the same by uniformly mixing 60% by weight. The methoxy-containing phenol-formaldehyde resin in Example 5 was 35 parts by weight as the bisphenol A based epoxy resin used in Example 1 and 5 parts by weight was the same as used in Example 1. 2-Phenyl-methyl-imidazole. The weight ratio of phenolic resin to epoxy resin is 6 3 · 2: 36. 8 ° A conductive paste is obtained by uniformly mixing the 40 g of the binder obtained above in the stirring and mixing machine and the three-rolling mill, and the 460 g of the substantially spherical silver-plated silver obtained in Example 4 as above is obtained. Copper powder and 15 g of carbitol ethyl ester were obtained as solvents. The obtained conductive paste has 5. Specific gravity of 3 and viscosity of 780dPa • s. The ratio of the binder to the conductive powder in the conductive paste (as a solid) is such that the volume ratio of the binder to the conductive powder is 40. 1: 5 9. The weight ratio of 9 and the binder to the conductive powder is 8: 9 2. Furthermore, the wiring board identical to that in Example 4 was produced by the same process as in Example 4, and it was found that the specific resistance of the conductor was 1 · ohm · m. The non-through-hole portion of the wiring board that has been filled with conductive paste is observed to confirm that the filled conductive paste with non-through holes having a diameter of 0.1 mm and 0.1 mm has no pores, that is, The non-through holes have been completely filled with conductive paste. Example 1 1 ----- I!, #! (Please read the notes on the back and fill in this tribute.) Ordered by the Ministry of Economic Affairs / I ^ s Industrial and Consumer Cooperatives. This paper is printed according to the Chinese National Standard (CNS). A4 specification (210X 297mm) -53- 1224129 A7 ___ B7_ V. Description of the invention (51) (Please read the precautions on the back before filling this page) A conductive paste is used in the mixing and mixing machine and three rolls In the rolling mill, 15 g of the binder obtained in Example 9 above, 485 g of the substantially spherical silver-plated copper powder obtained in Example 4 above and 15 g of carbitol ethyl ester as a solvent were uniformly obtained. The obtained conductive paste has 7. Specific gravity of 8 and viscosity of 551 dPa * s. The ratio of the binder to the conductive powder in the conductive paste (on a solid basis) is such that the volume ratio of the binder to the conductive powder is 19. 2: 8 0. 8 and the weight ratio of the binder to the conductive powder is 3: 9 7. Furthermore, the same wiring board as in Example 4 was produced using the same process as in Example 4, and its characteristics were evaluated, but proper conductors were not obtained because of its high viscosity, which made measurement impossible. The non-through hole portion of the wiring board that has been filled with conductive paste is observed in the conductive paste and has a diameter of 0.15 mm and 0.1 mm. There is space between the walls of the non-through hole of 1mm, and the conductive paste has pores. Example 1 2 A conductive paste was printed by the Industrial and Commercial Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. As a result of mixing 100 milligrams of the binder obtained in the above Example 9 with a stirring and mixing machine and three rolling mills, 4 0 0 Grams of substantially spherical silver-plated copper powder obtained in Example 4 above and 15 grams of carbitol ethyl ester were obtained as solvents. The obtained conductive paste has a specific gravity of 2.8 and a viscosity of 390dPa • s. The ratio of the binder and conductive powder in the conductive paste (as a solid-54-) This paper size applies to the Chinese National Standard (CNS) A4 specification (210X 297 mm) 1224129 A7 _ _B7 _ V. Description of the invention (52) ) Is such that the volume ratio of the binder to the conductive powder is 6 5. 8: 3 4. The weight ratio of 1 and the binder to the conductive powder is 20:80. (Please read the precautions on the back before filling this page.) Furthermore, the same wiring board as in Example 4 was produced by the same process as in Example 4. Its characteristics were evaluated and the specific resistance of the conductor was as high as 10 · 9 μohm · m, which is much higher than that obtained in Example 4. The non-through-hole portion of the wiring board that has been filled with conductive paste is observed to confirm that the filling has a diameter of 0. Non-through hole conductive pastes of 15mm and 0. 1mm have no pores, that is, non-through holes have been completely filled with conductive paste. Example 1 A binder was obtained by uniformly mixing 60 parts by weight of epoxy resin (trade name: 14 0 C manufactured by Mitsui Chemicals; epoxy equivalent 195 to 215 g / eci), and 40 parts by weight. The aliphatic diglycidyl ether as used in Example 1 and 3 parts by weight were the same as those used in Example 1 and 2-phenyl-4-methyl-imidazole and 3 parts by weight of dicyandiamide. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Then, 750 grams of silver-plated copper powder in Example 1 and 3 kg of chromium oxide balls with a diameter of 5 mm were put into a 2 liter container in a ball mill. And the container was rotated by 40, to obtain a substantially spherical silver-plated copper powder with a specific surface area of 0 · I6m2 / g, an average aspect ratio of 1 · 3, and an average particle size of 5 · 5 microns (average particle length ). The obtained 5-particles of the silver-plated copper powder were subjected to quantitative analysis with a scanning OUGE spectrum analyzer to investigate the exposed area of the copper powder. Result ‘Our paper size is in accordance with Chinese National Standard (CNS) A4 (210X297 mm) 1224129 A7 B7 V. Description of the invention (53) People found that the exposed area ranged from 10 to 50%, and the average was 20%. (Please read the precautions on the back before filling this page) — * Conductive pastes are produced by disturbing the companion and mixing machine and in the two-roller L machine 'evenly mixing the 50 grams of adhesive obtained above' 4 6 5 grams of The substantially spherical silver-plated copper powder and 11 g of carbitol ethyl ester were obtained as solvents. The obtained conductive paste was heat-treated at 170 ° C to obtain a cured conductive paste. By using a TMA 1 2 0 manufactured by Seiko Instruments Inc. at a load of 3 g and a heating rate of 5 ° C per minute, the T g of the obtained conductive paste cured product was 68 ° C. The ratio of the binder to the conductive powder (in terms of solids) in the conductive paste is such that the volume ratio of the binder to the conductive powder is 3 7: 6 3 and the weight ratio of the binder to the conductive powder is 7: 9 3. The weight ratio of epoxy resin to softener is 60:40. Printed by the Ministry of Economic Affairs, Smart Assets 4¾ Employee Consumer Cooperative As shown in Figure 10, the conductive paste obtained above was applied to 1. One side of the paper-copper copper laminate with a thickness of 0 mm (trade name MCL manufactured by Hitachi Chemical Co., Ltd.-4 3 7 F) 'A part of the copper foil has been removed there by etching and heat-treated at 1 90 ° C at 70 ° C to obtain the conductor 21. In Fig. 10, reference numeral 20 indicates a paper phenol copper laminate. The surface of the obtained conductor 21 was honed with a wet honing paper # 3 0 0 0 until smooth and shiny, solder was applied to the smooth shiny surface, and then immersed in a molten solder bath. The laminated board thus treated was taken out and cooled at room temperature. Then, the soldering portion on the surface of the conductor 21 is subjected to an adhesion test (the adhesion test system is attached and then peeled off). As a result, and -56- This paper size is in accordance with Chinese National Standard (CNS) A4 specification (21 × 297 mm) 1224129 A7 B7 V. Description of the invention (54) No solder was found to adhere to the tape, that is, the welding has been completed on the conductor 2 on the surface. (Please read the precautions on the back before filling this page) Example 1 4 An adhesive is made by uniformly mixing 50 parts by weight of the same epoxy resin as used in Example 13 and 50 parts by weight. The aliphatic diglycidyl ether used in Example 1 and 2 parts by weight were the same as those used in Example 1 2-phenyl-4 methylmethylimidazole, and 3 parts by weight were the same as those in Example 1 3 Dicyandiamide used. A conductive paste is used in the stirring and mixing machine and in the three rolling machine. 25 grams of the binder obtained above, 475 grams of the substantially spherical silver-plated copper powder obtained in Example 13 and 11 grams of carbitol ethyl ester as a solvent were uniformly mixed. The obtained conductive paste was heat-treated at 170 to 90 minutes to obtain a cured conductive paste. The T g of the conductive paste was measured by using the same method as in Example 13 to be 59 ° C. The ratio of the binder to the conductive powder printed on the conductive paste by the employee ’s consumer cooperative in the Intellectual Property of the Ministry of Economic Affairs (based on solids) is such that the volume ratio of the binder to the conductive powder is 2 9: 7 1 and the ratio of the binder to the conductive powder The weight ratio is 5: 9 5. The ratio of epoxy resin to softener is 50:50. Furthermore, the lead system was produced using the same process as in Example 13 and subjected to the same tape test as in Example 13 to confirm that no solder was attached to the tape, that is, the soldering was completed on the surface of the conductor. This paper size applies Chinese National Standard (CNS) A4 specification (210X 297 mm) -57- 1224129 A7 B7 ____ V. Description of the invention (55) Example 1 5 (Please read the precautions on the back before filling this page) In the mixer and the three-roll milking machine, 15 grams of the adhesive obtained in Example 1 3, 4.5 grams of the substantially spherical silver-plated copper powder obtained in Example 13 and 11 grams of carbitol ethyl ester As a solvent, they are uniformly mixed for dispersion. The resulting conductive paste has a high viscosity 'and is difficult to apply. Therefore, conductor and tape tests are no longer performed. The ratio of the binder to the conductive powder in the conductive paste (on a solid basis) is such that the volume ratio of the binder to the conductive powder is 19: 8 1 and the weight ratio of the binder to the conductive powder is 3: 9 7. The weight ratio of epoxy resin to softener is 60:40. Example 16 In a mixing and mixing machine and a three-roller mill, 15 grams of the adhesive obtained in Example 13 and 4 2.5 grams of substantially spherical silver-plated copper powder obtained in Example 13 and 11 grams of card Ethyl alcohol is uniformly mixed as a solvent to disperse. The resulting conductive paste has a high viscosity 'and is difficult to apply. Therefore, conductor and tape tests are no longer performed. The conductive paste obtained by the Intellectual Property of the Ministry of Economic Affairs and the Consumer Cooperatives was heat-treated at 170 ° C and 90 minutes to obtain a cured conductive paste. The T g of the cured product of this conductive paste was measured by the same method as in Example 13 'and was 68 ° C. The ratio of the binder to the conductive powder in the conductive paste (solid δ ten) is such that the volume ratio of the binder to the conductive powder is 5 8: 4 2 and the weight ratio of the binder to the conductive powder is 1 5 ·· 8 5. The weight ratio of epoxy resin to softener is 60:40. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 public holiday) 1224129 A7 ____B7___ 5. Description of the invention (56) (Please read the precautions on the back before filling this page) Furthermore, the same as in Example 1 3 A process was performed to produce a conductor and subjected to the same tape test as in Example 13. As a result, the solder is adhered to the tape ', that is, the soldering cannot be completed on the surface of the conductor. Example 17 A binder was obtained by uniformly mixing 100 parts by weight of the same epoxy resin as used in Example 13, 16 parts by weight of the phenolic resin used in the example, and 6 by weight. Parts are the same as those used in Example 1 and 2-phenyl-4 methyl-imidazole, and 4 parts by weight are the same as those used in Example 13 and dicyandiamide. A conductive paste was obtained by uniformly mixing 35 g of the binder obtained above in a stirring and mixing machine and three rolling mills, 4.55 g of the substantially spherical silver-plated copper powder obtained in Example 1 and 1 One gram of carbitol ethyl ester was obtained as a solvent. The obtained conductive paste was heat-treated at 17 Ot 90 minutes to obtain a cured conductive paste. The T g of the conductive paste was measured by using the same method as in Example 13 to be 18 6 ° C. The ratio of the binder to the conductive powder (in solids) printed on the conductive paste by the Intellectual Property of the Ministry of Economic Affairs / Employee Consumer Cooperatives is such that the volume ratio of the binder to the conductive powder is 3 8: 6 2 and the binder to the conductive powder The weight ratio is 7: 9 3. The weight ratio of epoxy resin to softener is 100: 0. Furthermore, the lead system was produced in the same process as in Example 13 and subjected to the same belt test as in Example 13. As a result, solder adheres to the tape, that is, soldering cannot be completed on the surface of the conductor. -59- This paper size is in accordance with Chinese National Standard (CNS) A4 specification (210X 297mm) 1224129 A7 ____ B7___ V. Description of the invention (57) Example 1 8 (Please read the precautions on the back before filling this page) The agent was made by uniformly mixing 35 parts by weight of the same epoxy resin as used in Example 1 3, 65 parts by weight of the aliphatic diglycidyl ether as used in Example 1, and 2 by weight Parts are the same as those used in Example 1 2-phenyl-4, 4-methyl-imidazole 'and 2 parts by weight are the same as those used in Example 13 for dicyandiamide. A conductive paste was obtained by uniformly mixing 35 g of the binder obtained above in a stirring and mixing machine and three rolling mills, 465 g of the substantially spherical silver-plated copper powder obtained in Example 13 and 11 g of Carbitol ethyl ester was obtained as a solvent. The obtained conductive paste was heat-treated at 170 ° C for 90 minutes' to obtain a cured conductive paste. The T g of the conductive paste was measured by using the same method as in Example 13 to be 37 ° C. Intellectual Property of the Ministry of Economic Affairs ^ The ratio of the binder to the conductive powder printed on the conductive paste by the employee consumer cooperative (based on solids) is such that the volume ratio of the binder to the conductive powder is 3 9: 6 1 and the binder to the conductive powder The weight ratio is 7: 9 3. The weight ratio of epoxy resin to softener is 35:65. Furthermore, a lead system was produced in the same process as in Example 13 and its surface was honed with a wet honing paper # 3 0 0 0. When it is smooth and light, the surface is damaged 'because the low hardness of the conductive paste' prevents the conductor from being subjected to the tape test. Example 1 9 Chinese National Standard (CNS) M specification (21GX297 mm) ~~~ 1224129 A7 B7 V. Description of the invention (58) (Please read the precautions on the back before filling this page) Have an average particle of 5.4 microns Spherical copper powder (trade name SF-Cu manufactured by Nippon Spray Metal Powder Co., Ltd. by the spray method) is washed with diluted hydrochloric acid and pure water, and then an electroplating solution is used instead of the electroplating method. The solution contains 80 g of Ag CN and 75 g of Na CN per liter of water, so that the copper ratio based on the weight of the nodular copper powder may be 18 wt%. The copper powder thus treated was rinsed with a hydraulic port and dried to obtain a silver-plated copper powder. Then, 470 g of the silver-plated copper powder thus obtained and 4 kg of zirconia balls having a diameter of 10 mm were put into a two-liter container of a ball mill, and the container was shaken and rotated for 8 hours. Therefore, the shape of the silver-plated copper powder was changed to obtain a flake-shaped or flake-shaped mineral silver copper powder having an aspect ratio of 6.2 and 7. 8 micron average particle size (average particle length). The ten particles of the flake-shaped or flake-shaped copper-plated powder obtained were quantitatively analyzed by a scanning Oujie electronic spectrum analysis equipment to detect the exposed area of the copper powder. As a result, the exposed area was found to range from 23% to 58%, with an average of 48%. The Ministry of Economic Affairs and the Bureau of Smart Industry / I Bureau of Industry and Consumer Cooperation collaborated to print a conductive paste by uniformly mixing the 35 g of the binder obtained in the stirring and mixing machine and the three-rolling mill, and 465 g of the above obtained. A flake-shaped or flake-shaped silver-plated copper powder and 40 g of carbitol ethyl ester (boiling point: 202 t) were obtained as solvents. The ratio of the binder to the conductive powder (on a solid basis) in the conductive paste is such that the weight ratio of the binder to the conductive powder is 7: 93. The content of the solvent is 7. 4wt%. Subsequently, the obtained conductive paste was applied to 1. The paper size of 0mm thick paper is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -61-1224129 A7 __B7 V. Description of the invention (59) (Please read the precautions on the back before filling this page) Paper phenol copper laminate One side of the plate (trade name MCL-437F manufactured by Hitachi Chemical Co., Ltd.), a part of the copper fan has been removed there by a feed-in method as shown in Figures 10 and 11 and heat treated. At 170 ° C for 90 minutes, the conductor 21 and the test pattern 22 were obtained. Further, the conductor 21 was subjected to a tape test as in Example 13 to confirm that the solder was not adhered to the tape, that is, the soldering was completed on the surface of the conductor 21. The specific resistance of the test pattern shown in Figure 11 was evaluated and found to be 6 · 1 microohm · meter. Example 2 0 The 4-7 grams of silver-plated copper powder and 3 kg of chromium oxide balls with a diameter of 10 mm were printed into two liters of a ball mill printed by an employee consumer cooperative of the Bureau of Intellectual Property 1 of the Ministry of Economic Affairs. In the container, the container was shaken and rotated for 8 hours. Therefore, the shape of the silver-plated copper powder was changed to obtain a flake-shaped or flake-shaped silver-plated copper powder, which has 5. Aspect ratio of 7 and 7. 2 micron average particle size (average particle length). The ten particles of the flake-shaped or flake-shaped copper-plated powder obtained were quantitatively analyzed by a scanning Oujie electronic spectrum analysis equipment to detect the exposed area of the copper powder. As a result, the exposed area was found to range from 18% to 52%, with an average of 40%. A conductive paste is obtained by uniformly mixing 30 g of the binder obtained above, 470 g of the flake-shaped or flake-shaped silver-plated copper powder obtained above, and 45 g of the agitator and mixer and three rolling mills. Carbitol ethyl ester (boiling point: 2 0 2 t) was obtained as a solvent. -62- This paper size applies Chinese National Standard (CNS) A4 specification (210X297mm) 1224129 A7 B7__ V. Description of the invention (60) (Please read the precautions on the back before filling this page) Adhesion in conductive paste The ratio of the agent to the conductive powder (on a solid basis) is such that the weight ratio of the binder to the conductive powder is 6: 9 4. The content of the solvent is 8. 3 w t%. Furthermore, a lead system was produced by the same process as in Example 13 and subjected to the same tape test as in Example 13 to confirm that the solder was not adhered to the tape, that is, the soldering was completed on the surface of the conductor . The specific resistance of the test pattern was evaluated and found to be 5. 8μohm · m Example 2 1 A conductive paste is obtained by mixing in a stirring and mixing machine and a three-roller mill evenly with 3.5 g of the binder obtained in Example 1 3 and 6.5 g of the adhesive obtained in Example 1. Substantially spherical silver-plated copper powder and 11 g of carbitol ethyl ester were obtained as solvents. The ratio of the binder to the conductive powder (on a solid basis) in the conductive paste is such that the weight ratio of the binder to the conductive powder is 7: 93. The content of the solvent was 2.2 wt%. The Ministry of Economic Affairs ’intellectual property QITB (printed by industrial and consumer cooperatives, and the guide system is produced in the same process as in Example 13 and tested by the same tape as described in Example 13 to confirm that the solder has not adhered to the tape However, the specific resistance of the test pattern is as high as 16 · 4 μohm · m. Example 2 2 4 7 0 g of the silver-plated copper powder obtained in Example 19 and 4 paper standards are applicable in China Standard (CNS) A4 specification (210X 297 mm) -63- 1224129 A7 __B7 V. Description of the invention (61) (Please read the precautions on the back before filling out this page) Kilograms of oxidation ball with a diameter of 10 mm It was put into a 2 liter container of a ball mill, and the container was rotated for a long time of 10 hours. As a result, only a small part of the conductive powder was flattened into a sheet shape, and even after processing, most of it was still roughly Spherical silver-plated copper powder. Therefore, a sufficient amount of flake-shaped or flake-shaped silver-plated copper powder cannot be obtained. Therefore, the operation was not performed after the above steps. Example 2 3750 g was obtained in Example 1. Silver-plated copper powder and 3 kg of A 5 mm diameter osmium oxide ball is put into a 2 liter container of a ball mill, and the container is rotated for 40 minutes to obtain a roughly spherical silver-plated copper powder to have a bulk density of 5_9 3g / cm3 (in Measured after 1000 stacking operations), relative density of 64.5%, average 1. An aspect ratio of 3 and an average particle size of 5.5 microns (average length of the example). The 5 particles of the substantially spherical silver-plated copper powder were subjected to quantitative analysis with a scanning Oujie spectrum analyzer to investigate the exposed area of the copper powder. As a result, it was found that the exposed area ranged from 10 to 50%, with an average of 20%. The Bureau of Intellectual Property of the Ministry of Economic Affairs (industrial and consumer cooperatives printed a conductive paste by uniformly mixing 35 g of the binder obtained in Example 1 3 and 4 6 5 g of the above in a mixing and mixing machine and a three rolling mill). The obtained substantially spherical silver-plated copper powder and 11 g of carbitol ethyl ester were used as solvents. The ratio of the binder to the conductive powder in the conductive paste (on a solid basis) is such that the weight of the binder to the conductive powder is The ratio is 7: 9 3. Furthermore, the lead system was produced by the same process as in Example 13 -64- This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 1224129 A7 B7 V. Invention Description (62) And was subjected to the same tape test as in Example 13 to confirm that the welding pad was not adhered to the tape ', that is, the welding has been completed on the surface of the conductor. (Please read the precautions on the back before filling this page) Example 2 4 7 5 0 grams of silver-plated copper powder obtained in Example 1 and 3 kg of 5 mm diameter chromium oxide balls were loaded into a ball mill of 2 liters In the container, the container was rotated for 50 minutes to obtain a roughly spherical silver-plated copper powder to have a 5. 22g / cm3 bulk density (measured after 1,000 stacking operations), relative density of 5 8 · 2%, average aspect ratio of 1 · 4 and average particle size of 5 · 6 microns (average length of the example) ). The 5 particles of the substantially spherical silver-plated copper powder were subjected to quantitative analysis with a scanning Oujie spectrum analyzer to investigate the exposed area of the copper powder. As a result, it was found that the exposed area ranged from 10 to 50%, with an average of 27%. A conductive paste was obtained by uniformly mixing 4 5 g of the binder obtained in Example 1 3 in the stirring and mixing machine and three rolling mills, 4 5 5 g of the substantially spherical silver-plated copper powder obtained in the above and 1 1 Gram carbitol ethyl ester was obtained as a solvent. Intellectual Property of the Ministry of Economic Affairs ^ 7 The ratio of the binder to the conductive powder (on a solid basis) printed in the conductive paste by the employee consumer cooperative is such that the weight ratio of the binder to the conductive powder is 9: 91. Furthermore, a lead system was produced by the same process as in Example 13 and subjected to the same tape test as in Example 13 to confirm that the solder was not adhered to the tape, that is, the soldering was completed on the surface of the conductor . Example 2 5 This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) -65- 1224129 A7 B7 V. Description of invention (63) (Please read the precautions on the back before filling this page) 7 5 0 Grams of silver-plated copper powder obtained in Example 1 and 3 kg of chromium oxide balls with a diameter of 10 mm were put into a 2 liter container of a ball mill, and the container was shaken and rotated for 8 hours to obtain a plate-like or plate-shaped plating Silver copper powder to have a 3. 7 9 g / cm3 bulk density (measured after 1 000 stacking operations), 4 8% relative density, average aspect ratio of 5 · 2 and average particle size of 7 · 7 microns (example Average length). Five particles of the obtained flake-shaped or flake-shaped silver-plated copper powder were subjected to quantitative analysis with a scanning Oujie spectrum analyzer to investigate the exposed area of the copper powder. As a result, it was found that the exposed area ranged from 10 to 60% 'on average to 45%. A conductive paste was obtained by uniformly mixing 65 g of the binder obtained in Example 1 3 in a stirring and mixing machine and three rolling mills, and 4 3.5 g of the plate-shaped or plate-shaped silver-plated copper obtained in the above. Powder and 15 grams of carbitol ethyl ester were obtained as solvents. The ratio of the binder to the conductive powder (on a solid basis) in the conductive paste is such that the weight ratio of the binder to the conductive powder is 1 3: 87. Printed by the Intellectual Property of the Ministry of Economic Affairs and the Industrial Cooperative Cooperative. Furthermore, the lead system was produced using the same process as in Example 13 and subjected to the same tape test as in Example 13 to confirm that the solder was not adhered to the tape. 'That is, welding has been completed on the surface of the conductor. Example 2 6 Put 750 grams of the substantially spherical silver-plated copper powder obtained in Example 1 and 2 kg of a 1 mm diameter chromium oxide ball into a 2 liter container of a ball mill, and rotate the container for 20 minutes to Obtained a substantially spherical silver-plated copper paper size applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) -66-1224129 A7 __ _B7 V. Description of the invention (64) (Please read the notes on the back before filling (This page) powder. However, the conductive powder with high conductivity cannot be obtained because the silver-plated copper powder cannot be deagglomerated, resulting in low charge characteristics. Therefore, no other operations are performed after the above steps. The through-hole wiring board according to the above-mentioned embodiment (1) of the present invention is very suitable for practical use, because its capacitance forms the electrical connection of the through-holes, and has high reliability on the connection, and is formed on the copper foil protrusions. The conductive material has a small thickness. According to the aspect of the present invention described above, the through-hole wiring board of the above-mentioned embodiment (2) has a particularly high reliability in connection. The through-hole wiring board of the above-mentioned embodiment (3), in addition to the aspect of the present invention of the above-mentioned embodiment (1), has the advantages of the charging characteristics of the conductive material penetrating into the through-hole and the migration of the printed circuit formed on the insulating layer. The impedance is good. The through-hole wiring boards of the above-mentioned embodiments (4), (5), and (6), in addition to the aspect of the present invention of the above-mentioned embodiment (1), have the advantage that the conductive material penetrates into the through holes and the non-through holes. The characteristics and the conductivity improvement are excellent. The through-hole wiring board of the above-mentioned embodiments (7) to (15) printed by the 8th Industrial Cooperative Cooperative of the 4th Bureau of Wisdom and Finance of the Ministry of Economic Affairs has the advantage of the conductive material in addition to the aspect of the invention of the above-mentioned embodiment (1). The charging characteristics of through-holes and non-through-holes and the advantages of improving the conductivity. The through-hole wiring board of the above-mentioned embodiment (16), in addition to the aspect of the present invention of the above-mentioned embodiment (1), has the advantage of having excellent solderability. Among the above-mentioned embodiments (17) to (20) The through-hole wiring board, in addition to the aspect of the present invention of the above-mentioned embodiment (1), has the advantage that it has an excellent paper size and applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -67-1224129 A7 ___B7__ V. Invention Describe the weldability of (65). (Please read the precautions on the back before filling in this page) The through-hole wiring board of the above embodiment (2 1), in addition to the aspect of the invention of the above embodiment (1), has the advantage that it has excellent solderability And conductivity. In addition to the aspect of the present invention of the above-mentioned embodiment (1), the through-hole wiring board of the above-mentioned embodiment (2 2) has the advantages that it has excellent solderability improvement and resistance to migration. The through-hole wiring board of the above-mentioned embodiments (2 3) to (2 4), in addition to the aspect of the present invention of the above-mentioned embodiment (1), has the advantage of having the advantages described in the embodiments (2 1) and (2 2). Its resistance to migration and excellent work efficiency. The through-hole wiring board of the above-mentioned embodiment (25) has the advantage that, in addition to the aspect of the invention of the above-mentioned embodiment (1), it has excellent solderability. In addition to the aspect of the present invention of the above-mentioned embodiment (1), the through-hole wiring board of the above-mentioned embodiments (2 6) to (2 8) has the advantage that it has excellent solderability improvement. The through-hole wiring board printed by the above-mentioned embodiment (2 9) printed by the intellectual property of the Ministry of Economic Affairs ^ employee consumer cooperative has the following advantages in addition to the aspect of the present invention of the above embodiment (1): for the side to be soldered to the chip component The copper solder bumps on the top have good solder wettability. The characteristics of connecting to these copper foil bumps are excellent, and the reliability of the connection to the copper foil bumps on the side where no chip components are connected is high. -68- This paper size applies to China National Standard (CNS) A4 (210X297 mm)