TWI223641B - Method and apparatus for reducing toxic gas emission - Google Patents
Method and apparatus for reducing toxic gas emission Download PDFInfo
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- TWI223641B TWI223641B TW92122074A TW92122074A TWI223641B TW I223641 B TWI223641 B TW I223641B TW 92122074 A TW92122074 A TW 92122074A TW 92122074 A TW92122074 A TW 92122074A TW I223641 B TWI223641 B TW I223641B
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1223641 五、發明說明(1) 發明所屬之技術領域 本發明係有關於一種減低毒氣逸散之裝置,特別 關於一種應用於清潔半導體設備時,可針對設備零所 生之毒氣進行過濾,並可避免毒氣逸散之裝置。 先前技術 在習知半導體製造過程中,為了保持製程 穩定,半導體製造設備通常必須定期實施預防保=吊與 Preventive Maintenance )。以金屬蝕、 蝕刻機台(metal—etcher )内部之各項零二須,’金屬 清潔與保養,藉以確保其功能正常,進而提升'彡、,期實施 率。然而,由於半導體製程設備中常存 a產σσ之良 物(如氣離子C卜),因此當進行拆裝清潔4伤製程殘留 濕式清洗(we t c 1 ean )的過程中)或者斑* 例如在實施 況下,上述製程殘留物將容易形成有毒/、空氣接觸的情 HC1 )。如此,不僅對生產線上之人員^產氣^ (如氣化氫 因氣化氫(HC1 )等有毒氣體具有腐麵性,不良影響,且 中之產品或元件造成損壞。 ’亦可能對製程 針對習知清潔半導體製程設備之方式 先必須先將設備中所欲實施清潔保養之^ —般而言,首 著移動至一清潔室(clean room)中给A件拆卸下來,接 只方也〉杳":參 閱第1圖,該圖係表示一習知防止毒氣逸羞成工作。請參 圖。其中,為了避免由製程設備拆卸下政裂置之示意 過程中產生有毒氣體而逸散至空氣中 之零件P在運送 ,因此零件P必須置1223641 V. Description of the invention (1) Technical field to which the invention belongs The present invention relates to a device for reducing the escape of toxic gas, and particularly to a device for cleaning semiconductor devices, which can filter the toxic gas generated by the device and avoid Device for escape of poison gas. Prior art In the conventional semiconductor manufacturing process, in order to maintain process stability, semiconductor manufacturing equipment must usually implement preventive maintenance (Preventive Maintenance and Preventive Maintenance) on a regular basis. By using the metal etcher and metal etchers, the metal must be cleaned and maintained to ensure its normal function, and improve the implementation rate. However, because good products (such as gas ions) produced by a often exist in semiconductor manufacturing equipment, when performing disassembly and cleaning (wetc 1 ean residual wet cleaning (we tc 1 ean)) or spots * In the embodiment, the residue of the above process will easily form toxic / air contact conditions (HC1). In this way, not only does the production line personnel ^ produce gas ^ (such as hydrogenated gas due to hydrogenated gas (HC1) and other toxic gases have a corrosive surface, adverse effects, and the products or components in the damage. 'May also target the process To know the way to clean the semiconductor process equipment, you must first perform the cleaning and maintenance in the equipment ^ In general, first move to a clean room to remove the A piece, and then only >> ": Refer to Figure 1. This figure shows a conventional method to prevent the escape of poisonous gas. Please refer to the figure. In order to avoid the toxic gas from escaping to the air during the schematic process of dismantling the cracks by the process equipment Part P is in transit, so part P must be placed
0503-9264TW(Nl); tsmc2002-0894; tkl in.ptd 1223641 五、發明說明(2) 放於防止毒氣逸散裝置丨上;如 散裝置1具有複數個隔板12,其 知防止毒氣逸 12上。此外,為了避免有毒氣、述零件P係置放於隔板 I阻隔罩11覆蓋於零件P上方,藉散至空氣中’故透過將 接觸。其中,習知防止毒氣逸藉二與外界之空氣 13,藉此操作人員可將零件更設有輪子 處理。 ^至,月森至中做進一步的 然而,習用防止毒氣逸散裝 蓋於零件1>上$,事實上並A法裝4用一阻隔罩η覆 此隨著時間的增加往往會使yV;%與之外部空/隔絕,因 升,不僅嚴重影響操作人員的中=毒乳體濃度上 的污染。 王 同時造成工作環境上 清潔ί:: η: ? ’若能使零件p在拆卸後到運送至 過滤之方式而減低有毒氣體含旦:::間内’並错由循環 操作人員暴露於危險;與ί度,便可大幅地避免 ::::ίϊ 式如美國專利6,°79,術所揭露之 施過濾、。以及,如美國:=生76強3:^ 別揭露一種室内空調系統以及一種:及m、分 裝置,其…驅動風扇或者透過; pressure ),可產生一強 μ 5, ^negative 藉以調節氣體之溫度或ί力。二』forced convection) 般皆需佔據魔大體積1時需^ =34進/抽氣設備一 丨J時而要配合穩定的進/排氣控制 第7頁 0503-9264TW(Nl);tsmc2002.0894;tklin.ptd 1223641 五、發明說明(3) 系統,因此成本較高 有鑑於習知防止毒氣逸散裝置1 ^在於減低半導體設備零件於拆卸後所缺產點’本#發明之動 藉由於一密閉迴路中之氣體實施強 ,虱 >可染,並 ,方式有效地減低半導體設備零件於拆=所,循環過濾 氣體濃度,並可避免有毒氣體逡 、 產生之有毒 操作人員之安全。 乱體逸政至外界空氣中,以確保 發明内 如 防止毒 於提供 容 前所述 針對半導體設備 要課題 一種防止毒氣逸散之方法 連接中 濾層, 殼體内 有毒氣 氣逸散實成為一重 中空殼體。提 成一密閉迴路 之污染 ,使氣 濾有毒 外,本 空殼體 供一管路, 。提供一過 毒氣體 體對流 藉以過 此 括一中 第一腔中,上 位於中 之間。 體位於 體、一 述中空 空殼體 前述過 透氣隔 源位於中空 體依序流經 氣體同時避免有毒 發明之更提供一種 、一網狀隔板、一 第二腔體、 殼體具有一 内部。前述 濾層位於網 板與頂部之 零件於 ’因此 ’包括 空殼體 位於中 部。強 體之污 氣體逸 防止毒 透氣隔 管路、一 頂杳P以 透氣隔 狀隔板 間。前 及一底 板位於 與底部 述第二 拆卸後, 本發明之 下列步驟 ’並與中 空殼體内 制密閉迴 染源以及 散。 氣逸散之 板x _過 扇以及一 部。前述 頂部以及 之間。前 腔體位於 必須有效 目的是在 •提供一 空殼體形 部。使有 路内之氣 過據層, 裝置,包 據層、一 腔體。其 網狀隔板 網狀隔板 述第一腔 過濾層與0503-9264TW (Nl); tsmc2002-0894; tkl in.ptd 1223641 V. Description of the invention (2) Placed on the device for preventing the escape of poisonous gas; such as the device 1 has a plurality of partitions 12, which are known to prevent the escape of poisonous gas 12 on. In addition, in order to avoid toxic gas, the component P is placed on the partition plate I. The barrier cover 11 covers the component P and is released into the air ', so it will come into contact with it. Among them, it is known to prevent poisonous gas from escaping from the outside air 13 so that the operator can further set the parts to handle wheels. ^ To, Yuesen Zhizhong did further. However, it is customary to prevent the escape of poisonous gas to cover parts 1>. In fact, it is installed in A method 4 and covered with a barrier cover η. Over time, it often leads to yV;% The external air / isolation, due to the rise, not only seriously affects the operator's pollution on the toxic milk concentration. At the same time, Wang caused the working environment to be cleaned. Ί: η:? 'If the parts p can be disassembled and transported to filtration to reduce the toxic gas containing denier ::: inside', the cycle operator will be exposed to danger; With ίdegree, you can largely avoid the filtering of the :::: ίϊ formula as disclosed in US Patent 6, ° 79 ,. And, for example, the United States: = 生 76 强 3: ^ Do not disclose an indoor air-conditioning system and one: and m, sub-devices, which drive the fan or through; pressure), can produce a strong μ 5, ^ negative to regulate the gas Temperature or force. (2) forced convection) Generally need to occupy the magic volume. 1 = ^ 34 intake / exhaust equipment. 丨 J must cooperate with stable intake / exhaust control. Page 7 0503-9264TW (Nl); tsmc2002.0894 tklin.ptd 1223641 V. Description of the invention (3) System, so the cost is high in view of the conventional device for preventing gas escape 1 ^ is to reduce the missing production points of semiconductor device parts after disassembly The gas in the closed circuit is strong, and lice > can be dyed, and the method can effectively reduce the semiconductor device parts to be dismantled, filter the gas concentration cyclically, and avoid the toxic gas purge and the safety of the toxic operators. Disturb the body to the outside air to ensure that the invention as described in the previous article provides a method for preventing the escape of poisonous gas to prevent the poisoning of the semiconductor device. The method of preventing the escape of poisonous gas is connected to the middle filter layer. Hollow shell. Promote a closed loop pollution, make the air filter toxic, and the empty shell provides a pipeline. Provide a toxic gas through the body convection, including the first cavity, the upper is located between the middle. The body is located in the body, a hollow housing is mentioned, the aforementioned air-permeable barrier is located in the hollow body, and the gas flows sequentially through the gas while avoiding toxicity. The invention further provides a mesh partition, a second cavity, and the housing has an interior. The aforementioned filter layer is located on the screen and the top part includes 'therefore' including the empty housing in the middle. Strong body fouling, gas escape, prevention of poisoning, air-permeable partitions, and a top partition with air-permeable partitions. The front and a bottom plate are located at the bottom and the bottom. After the second disassembly, the following steps of the present invention are performed with the hollow shell to make a closed back dyeing source and disperse. The plate of air effusion x _ passing fan and one. The aforementioned top and between. The front cavity must be located in order to provide an empty shell-shaped part. Let the air in the road pass through the data layer, the device, the data layer, and a cavity. Its mesh partition, mesh partition, said first cavity filter layer and
第8頁 11^ 0503-9264TWF(Nl);tsmc2002-0894;tklin.ptd 1223641 五、發明說明(4) 底。卩之間。則述管路連接第一腔體以及第二腔體,並與殼 體内部形成一密閉迴路。前述風扇設置於管路内部,驅動 空氣依序流經前述第一腔體、透氣隔板、網狀隔板、過濾 層以及第二腔體。 實施方式 效配合圖式說明本發明之較佳實施例。 相較於前述習知技術,本發明係屬於一自給式排氣系 統(self-contained exhaust system),透過一密閉之 氣體迴路對製程設備零件所產生之有毒氣體實施循環過 滤。首先請參閱第2圖,該圖係表示本發明之減低有毒氣 體逸散裝置示意圖。如圖所示,一中空殼體2具有一頂部 201以及一底部2 02,且於内部分別設置有一透氣隔板4、 一網狀隔板5以及一過濾層6。其中過濾層6係以活性碳 (Activated Carbon )為材質,藉以過濾上述之右主 (如氯化氫HC1 )。 货;、一 於第2圖中,透氣隔板4係與殼體2之頂部2 〇 i間妒一 腔體21,又網狀隔板5與透氣隔板4之間形成一腔成一 外網狀隔板5與上述過濾層6之間形成一腔體2 3,/ 此 層6與殼體2底部202之間形成一腔體24。其中, 體2外部更透過一管路7分別連接前述腔體21以及、中空殼 如此,透過管路7可與前述腔體21、22、23 κ,體24 ° 閉迴路,並使得有毒氣體不致外洩至大氣中。$成一密 此外,殼體2之側邊具有一可動門3,透滿 開啟可動門Page 8 11 ^ 0503-9264TWF (Nl); tsmc2002-0894; tklin.ptd 1223641 5. Explanation of the invention (4). Between you. The pipeline is connected to the first cavity and the second cavity, and forms a closed circuit with the inside of the casing. The fan is disposed inside the pipe, and drives air to flow through the first cavity, the air-permeable partition, the mesh partition, the filter layer, and the second cavity in order. Implementation Modes The preferred embodiments of the present invention will be described in conjunction with the drawings. Compared with the prior art, the present invention belongs to a self-contained exhaust system. The toxic gas generated by the process equipment parts is circulated and filtered through a closed gas circuit. First, please refer to FIG. 2, which is a schematic diagram showing the toxic gas emission reduction device of the present invention. As shown in the figure, a hollow casing 2 has a top 201 and a bottom 202, and a breathable partition 4, a mesh partition 5 and a filter layer 6 are respectively disposed inside. The filtering layer 6 is made of activated carbon (Activated Carbon) as a material to filter the above-mentioned right main (such as hydrogen chloride HC1). First, in the second figure, the air-permeable partition 4 is a cavity 21 between the top 2 and the top 2 of the casing 2, and a cavity forms an outer net between the mesh-shaped partition 5 and the air-permeable partition 4. A cavity 23 is formed between the partition 5 and the filter layer 6, and a cavity 24 is formed between the layer 6 and the bottom 202 of the casing 2. Among them, the outside of the body 2 is further connected to the cavity 21 and the hollow shell through a pipeline 7 respectively. Through the pipeline 7, the cavity can be closed to the cavity 21, 22, 23 κ through the pipeline 7 and the toxic gas can be closed. No leakage to the atmosphere. $ 成 一 密 In addition, there is a movable door 3 on the side of the casing 2
0503-9264IW(Nl); t smc2002-0894; tkl in. ptd 12236410503-9264IW (Nl); t smc2002-0894; tkl in. Ptd 1223641
3可將零件P置放於前述網狀隔板5上,其中前述可動門3周 圍具有膠磁31 (Rubber Magnet ),當玎動門3關閉時,係 透過膠磁31與殼體2形成密封,以有^防土有毒氣體逸散' 至外部大氣中形成污染。 如前所述,本發明係透過形成一密閉之氣體迴路對製 程設備零件P產生之有毒氣體實施循環過濾。此外,在管 路7内不設置有一風扇81,藉以驅動密閉迴路内之氣體流 動(如第2圖中箭頭所示方向)。首先,氣體經由風扇81 驅動並經由管路7而進入腔體21,其中為了使氣體可均勻 地向下擴散到達透氣隔板4處,腔髋2 L係呈一由下向上收 斂之漏斗狀結構。 再请參閱第3a圖,該圖係表示本發明中透氣隔板4之 不意圖。如圖所示,前述透氣隔板4之材質可為不銹鋼 (Stainless )或鐵氟龍(Tefl〇n ),且設有複數個均勻 分佈之開孔4 0,其中上述開孔係成圓形,當氣體流經透氣 隔板4時,可透過上述開孔40而被均勻地導入下方腔體22 中 〇3 The component P can be placed on the aforementioned mesh partition 5, wherein the movable door 3 has a rubber magnet 31 (Rubber Magnet) around it. When the swing door 3 is closed, the rubber magnet 31 forms a seal with the casing 2 In order to prevent soil and toxic gases from escaping 'into the external atmosphere, pollution is formed. As mentioned above, the present invention performs cyclic filtration of the toxic gas generated by the process equipment part P by forming a closed gas circuit. In addition, a fan 81 is not provided in the pipe 7 to drive the gas flow in the closed circuit (in the direction shown by the arrow in Fig. 2). First, the gas is driven by the fan 81 and enters the cavity 21 through the pipeline 7. Among them, in order to allow the gas to diffuse evenly down to reach the ventilating partition 4, the cavity 2 L has a funnel-like structure that converges from bottom to top . Please refer to Fig. 3a again, which shows the intention of the air-permeable partition 4 in the present invention. As shown in the figure, the material of the aforementioned air-permeable partition 4 may be stainless steel or Teflon, and is provided with a plurality of uniformly distributed openings 40, wherein the above-mentioned openings are circular, When the gas flows through the air-permeable partition 4, it can be evenly introduced into the lower cavity 22 through the above-mentioned opening 40.
如第2圖所示,腔體22内之氣流係由上往下地移動, 因此位於網狀隔板5上之有毒氣體產生源(即製程零件p ) 係可藉由氣流帶動逸出之有毒物質,穿過網狀隔板;而到 達下方之腔體23。其中,前述網狀隔板5可為不銹鋼 (Stainless)或鐵氟龍(Tefl〇n)材質,又如第“圖所 示,網狀隔板5上係具有複數個開孔50,藉以使氣流可迅 速地通過。As shown in FIG. 2, the airflow in the cavity 22 moves from top to bottom, so the toxic gas generating source (ie, the process part p) located on the mesh partition 5 is a toxic substance that can be driven out by the airflow. , Through the mesh partition; and reach the cavity 23 below. The mesh partition 5 may be made of stainless steel or Teflon. As shown in the figure, the mesh partition 5 is provided with a plurality of openings 50 to allow airflow. Can be passed quickly.
1223641 五、發明說明(6) ---- 接著,當具有有毒物質之氣流經過腔體23後,係可 過一過濾層6實施過濾,其中上述過濾層6之材質為活性碳 (Activated Carbon ),可有效吸附氣體中之污染物以及· 有毒物質,藉此可產生一潔淨之氣流至過濾層6下方之 體24 〇 如第2圖所示,腔體24係呈現一向下收斂之斗狀結 構,由於下方之流體通道較窄,因此可加速氣流通過而進 入官路7,同時使得氣體流場中可自然產生一低壓區。如 此,腔體24下方通道較窄處可於流場中產生一吸引力 (drawing force),並驅動上方有毒氣體加速通過上方 之過濾層6以有效地實施過濾。 蜂 如前所述,在潔淨之氣流經由腔體24進入管路7之 後,仍可藉由風扇81不斷地驅動而進入上方之腔體以,並 藉此可形成一氣體循環。此外,當前述密閉迴路需實施換 氣時,可透過位於管路7側邊之一換氣口82 (exhaust 、 port),連接一固設於外之區域排氣系統(丨加以 exhaust system)以執行換氣動作(未圖示),直中於換 氣口 82處設有一控制閥83,當控制閥83關閉時係形成一封 閉迴路,當控制閥83開啟時則可透過換氣口 82實施換氣。 然而,為了使本發明之減低有毒氣體逸散裝置具有機 動性,於设體2底側更设有複數個輪子9,可方便移動至清 潔室(clean room)中對零件p做進一步的清潔動作。此 外,如第4圖之另一較佳實施例中所示,本發明之腔體以 亦可藉由複數個網狀隔板5以及側壁加以區隔,以形成複 1223641 五、發明說明(7) 數個隔間,如此可容置更多的零件p。 綜上所述,本發明透過在管 氣體於-密閉迴路中產生對流,並且中二置風屬以’:動 免工作環境的污染。此夕卜,本發安全,並避 氣控制系統,不僅構造簡單且使用與操作上:責的進/排 此具有成本低廉以及實用性高等優點。 為方便,因 雖然本發明已以較佳實施例揭露於上,缺 限定本發明,任何熟習此項二”並非用以 神和㈣,當可作些許之更動不= 護範圍當視後附之申請專利範圍所界定者為準。發月之保1223641 V. Description of the invention (6) ---- Then, after the air stream with toxic substances passes through the cavity 23, it can be filtered through a filter layer 6, wherein the material of the filter layer 6 is activated carbon. Can effectively absorb pollutants and toxic substances in the gas, thereby generating a clean airflow to the body 24 below the filter layer 6 〇 As shown in Figure 2, the cavity 24 presents a downwardly converging bucket-like structure Because the lower fluid channel is narrower, it can accelerate the airflow to enter the official road 7, and at the same time, a low-pressure region can be naturally generated in the gas flow field. In this way, a narrower channel below the cavity 24 can generate a drawing force in the flow field and drive the toxic gas above to accelerate through the filtering layer 6 above to effectively perform filtration. As described above, after the clean airflow enters the pipeline 7 through the cavity 24, it can still be driven by the fan 81 to enter the upper cavity, and thereby a gas cycle can be formed. In addition, when the aforementioned closed circuit needs to be ventilated, a venting port 82 (exhaust, port) located on the side of the pipe 7 can be connected to an external exhaust system (丨 exhaust system) fixed outside To perform a ventilation action (not shown), a control valve 83 is provided directly at the ventilation port 82. When the control valve 83 is closed, a closed circuit is formed. When the control valve 83 is opened, it can be implemented through the ventilation port 82. Breathe. However, in order to make the toxic gas emission reducing device of the present invention have mobility, a plurality of wheels 9 are further provided on the bottom side of the body 2 so that it can be easily moved to a clean room for further cleaning of the part p. . In addition, as shown in another preferred embodiment of FIG. 4, the cavity of the present invention can also be separated by a plurality of mesh partitions 5 and side walls to form a complex 1223641. 5. Description of the invention (7 ) Several compartments so that more parts p can be accommodated. To sum up, the present invention generates convection in the gas-in-closed circuit of the tube, and the second and second winds are set to ': to avoid pollution of the working environment. In addition, the safety and air-avoidance control system is not only simple in construction, but also easy to use and operate: it has the advantages of low cost and high practicability. For the sake of convenience, although the present invention has been disclosed in the preferred embodiment above, and the present invention is not limited, any familiarity with this item "2" is not used for gods and concubines. What is defined in the scope of the patent application shall prevail.
1223641 圖式簡單說明 第1圖係表示一習知防止毒氣逸散裝置之示意圖; 第2圖係表示本發明之減低毒氣逸散裝置之示意圖; 第3a圖係表示本發明中透氣隔板之示意圖; 第3b圖係表示本發明中網狀隔板之示意圖; 第4圖係表示本發明中另一較佳實施例之示意圖。 符號說明 1〜防止毒氣逸散裝置;11〜阻隔罩; 13〜輪子; 2 (Π〜頂部; 2 卜 22 > 23 31〜膠磁 4 0〜開孔 5 0〜開孔 7〜管路; 8 2〜連接部 9〜輪子; 1 2〜隔板; 2〜殼體; 24〜腔體 2 0 2〜底部; 3〜可動門; 4〜透氣隔板 5〜網狀隔板 6〜過濾層; 8 1〜風扇; 8 3〜控制閥 P〜零件。1223641 Brief description of the drawings. Figure 1 is a schematic diagram of a conventional device for preventing the escape of poisonous gas; Figure 2 is a schematic diagram of the device for reducing the escape of poisonous gas of the present invention; Figure 3a is a schematic diagram of a ventilating partition in the present invention Figure 3b is a schematic diagram showing a mesh separator in the present invention; Figure 4 is a schematic diagram showing another preferred embodiment of the present invention. DESCRIPTION OF SYMBOLS 1 ~ Device for preventing escape of poisonous gas; 11 ~ Barrier cover; 13 ~ Wheel; 2 (Π ~ Top; 2 Bu 22 > 23 31 ~ Rubber magnetic 4 0 ~ Opening hole 5 0 ~ Opening hole 7 ~ Pipeline; 8 2 ~ connecting part 9 ~ wheels; 1 2 ~ partition; 2 ~ shell; 24 ~ cavity 2 0 2 ~ bottom; 3 ~ movable door; 4 ~ breathable partition 5 ~ mesh partition 6 ~ filter layer 8 1 to fan 8 3 to control valve P to parts.
0503-9264TWF(Nl);tsmc2002-0894;tklin.ptd 第13頁0503-9264TWF (Nl); tsmc2002-0894; tklin.ptd Page 13
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