TWI221331B - Heat sink module plate with slot structure and method for fabricating semiconductor package substrate with the heat sink - Google Patents
Heat sink module plate with slot structure and method for fabricating semiconductor package substrate with the heat sink Download PDFInfo
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- TWI221331B TWI221331B TW092131046A TW92131046A TWI221331B TW I221331 B TWI221331 B TW I221331B TW 092131046 A TW092131046 A TW 092131046A TW 92131046 A TW92131046 A TW 92131046A TW I221331 B TWI221331 B TW I221331B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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Description
1221331 五、發明說明（1) [發明所屬之技術領域] 本發明係有關於一種散熱片與整合—散献 封裝基板製法’更詳而言之’尤指一種具切割缝結構之散 熱片模組板與整合該散熱片之半導體封裝基板雙法。 [先前技術] & 球拇陣列式（Ball grid array，BGA)為一種先進的半 導體晶片封裝技術，其特點在於採用一基板來安置半導體 晶片，並於該基板背面植置複數個成栅狀陣列排列之銲^ (Solder baU)，使相同單位面積之半導體晶片承載件上 ^ j容納更多輸入/輸出連接端（I/〇 c〇nnecti〇n)以符合 Ϊ化（Integratl〇n)之半導體晶片所需，同時藉由 球將整個封裝單元銲結並電性連接至外部之印刷電 路板。 由於半導體晶片上之電子元件及電子電路之密 頻率的提高，4吏其運作產生之熱量亦隨之增加， 半導體晶片運作時產生的熱量有效散逸，將 之: 1導體晶片之正常操作以及嚴重縮短半導體晶片 之使用哥命。 的恭^ =決上述之缺A，並符合電子產品輕、薄、短、小 雕：勢、：半導體業界發展出—種散熱片外露於封裝膠 ^ i半導體封裝基板，例如底穴置晶型球柵陣列式 avity down ball grid array，CDBGA)半導體封裝基 板，其特徵在於其中之基板形成有一開口，並將一半導體 晶片以倒置方式透過該開口電性連結至該基板。1221331 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a method for manufacturing a heat sink and integration-distribution package substrate 'more specifically', especially a heat sink module having a slit structure. A dual method of a board and a semiconductor package substrate integrating the heat sink. [Prior technology] & Ball grid array (BGA) is an advanced semiconductor chip packaging technology, which is characterized in that a substrate is used to place the semiconductor wafer, and a plurality of grid arrays are planted on the back of the substrate Array soldering (Solder baU), so that more semiconductor input / output terminals (I / 〇c〇nnecti〇n) can be accommodated on semiconductor wafer carriers of the same unit area to conform to Integratlion semiconductors. The chip is required, and the entire packaging unit is soldered and electrically connected to an external printed circuit board by a ball. Due to the increase in the dense frequency of the electronic components and electronic circuits on the semiconductor wafer, the heat generated by its operation will also increase, and the heat generated during the operation of the semiconductor wafer will be effectively dissipated, which will: The use of semiconductor wafers. Congratulations ^ = the above-mentioned lack of A, and in line with the light, thin, short, small sculptures of electronic products: potential, the semiconductor industry has developed-a heat sink exposed on the packaging glue ^ i semiconductor packaging substrate, such as bottom cavity crystal An avionic down ball grid array (CDBGA) semiconductor package substrate is characterized in that an opening is formed in the substrate, and a semiconductor wafer is electrically connected to the substrate through the opening in an inverted manner.
17404全懋.ptd 第7頁 I2213J1 五、發明說明（2) 請參閱第1圖所力 半導體封裝基板，其 成有至少一貫穿其上 置於該基板1 〇之上表 一半導體晶片1 3收納 用面耩由一導熱性膠 多數銲線1 4以電性連 裝膠體（未圖示）包覆 板下表面植置有多數 導體封裝製程。此種 以快速通過該導熱性 而散逸到大氣中以有 而於習知製程中 元之板材（Panel)與 型，再經切割製程而 元完成切單後’再一 frame)上，形成條片 半導體封裝製程。 、之半導體封裝基板，即為一種◦㈣q 主要在一 BGA半導體封裝基板1 0中形 下表面之開孔11，並以一散熱片12接 面上以封閉住該開孔1 1之一側，俾將 於該開孔1 1中，以將該晶片i 3之非作 黏劑緊密黏附於該散熱片上，並透過 結该半導體晶片1 3與基板1 〇，再以封 該半導體晶片1 3與銲線1 4後，於該基 鲜球1 5，以完成該整合散散熱片之半 結構使該半導體晶片1 3產生之熱量得 ‘劑與該散熱片1 2構成之散熱途徑， 效提升散熱效率。 ’該封裝基板係由具有複數顆基板單 散熱片（Heatsink)板材整片壓合成 形成單顆成品出貨；或先將各基板單 —貼合於一條片狀散熱片（Carrier 狀（S t r i p )成品出貨，俾進行後續之 然而因為加入散熱片之材質多為較半導體封裝基板堅 硬之金屬’故’該整合散熱片板材與半導體封裝基板於進 行切割製程時’對於該切割製程所使用同為金屬材質之銑 刀相當損耗而使製作成本相對提高；且由於金屬延展性高 而使得銑刀切割金屬材質散熱片時易有毛邊（Burr)的產 生。此外’若以切割完成之基板單元直接貼合於預先形成17404 全懋 .ptd Page 7 I2213J1 V. Description of the invention (2) Please refer to the semiconductor package substrate shown in Figure 1. It has at least one through it placed on the substrate 1 0. Table 1 semiconductor wafer 1 3 storage A conductor is used to cover the lower surface of the board with a plurality of bonding wires 14 from a thermally conductive adhesive, and a plurality of conductor packaging processes are planted on the lower surface of the board. This kind of plate is quickly dissipated into the atmosphere through the thermal conductivity to obtain the panels and patterns in the conventional manufacturing process, and then cut through the manufacturing process to complete the singulation (re-frame) to form strips. Semiconductor packaging process. The semiconductor package substrate is a type of opening 11 mainly formed on the lower surface of a BGA semiconductor package substrate 10, and a heat sink 12 is connected to close one side of the opening 11,俾 will be in the opening 11 to closely adhere the non-adhesive of the wafer i 3 to the heat sink, and pass through the semiconductor wafer 13 and the substrate 10, and then seal the semiconductor wafer 13 and After bonding wire 14 to the base fresh ball 15 to complete the semi-structure of the integrated dissipating heat sink, the heat generated by the semiconductor wafer 13 can be obtained through a heat dissipation path composed of the agent and the heat sink 12 to improve heat dissipation. effectiveness. 'The package substrate is a single finished product shipped from a single sheet with multiple substrate single heat sink (Heatsink) sheets; or each substrate is single-bonded to a sheet-like heat sink (Carrier-like (S trip) The finished product is shipped, and the follow-up is performed. However, because the material of the heat sink is mostly harder than the semiconductor package substrate, the integrated heat sink plate and the semiconductor package substrate are cut during the cutting process. The same is used for the cutting process. The milling cutter made of metal material is relatively worn out and the production cost is relatively increased; and because of the high ductility of the metal, the milling cutter is prone to produce burrs when cutting metal heat sinks. In addition, 'if the board unit completed by cutting is directly attached Pre-form
1221331 五、發明說明（3) 條片狀散熱片，其必須先將各基板單元完成切單後，再一 一貼合於散熱片上，造成製程複雜度之增加，基板單元與 散熱片往往無法貼合齊平，同時因該條片狀散熱片係預先 進行排版規劃後進行切割，其中由於該散熱片板材通常僅 具有數個固定尺寸，且各散熱片間之排列切割仍需預留空 隙，因此無法在該固定尺寸之散熱片板材上做有效之排列 與較佳之佈置切割，造成部分板材之浪費。 因此，如何有效運用散熱片板材，同時簡化製程步驟 與成本，俾有效形成整合有散熱片之半導體封裝基板即成 為目前急待解決之課題。 [發明内容] 鑒於上述習知技術之缺點，本發明之主要目的在於提 供一種具切割缝結構之散熱片模組板與整合該散熱片之半 導體封裝基板製法，用以令後段製程中將對整合有散熱片 之半導體封裝基板進行切割之銑刀的損耗減少而降低製作 成本。 本發明之另一目的在於提供一種具切割缝結構之散熱 片模組板與整合該散熱片之半導體封裝基板製法，用以令 此整合散熱片之半導體封裝基板進行切割製程時減少散熱 片毛邊之產生。 本發明之又一目的在於提供一種具切割缝結構之散熱 片模組板與整合該散熱片之半導體封裝基板製法，以簡化 製程步驟，俾有效形成整合有散熱片之半導體封裝基板。 本發明之再一目的在於提供一種具切割缝結構之散熱1221331 V. Description of the invention (3) For strip-shaped heat sinks, each substrate unit must be cut and then attached to the heat sink one by one, resulting in an increase in the complexity of the process, and the substrate unit and the heat sink often cannot be attached. They are flush with each other. At the same time, the strip-shaped heat sink is cut after layout planning in advance. Among them, the heat sink plate usually has only a few fixed dimensions, and the gap between the heat sinks is still required to be reserved. It is impossible to perform effective arrangement and better layout cutting on the heat sink plate of the fixed size, resulting in waste of some boards. Therefore, how to effectively use the heat sink plate, while simplifying the process steps and costs, and effectively forming a semiconductor package substrate with integrated heat sinks has become an urgent issue. [Summary of the Invention] In view of the shortcomings of the above-mentioned conventional technology, the main object of the present invention is to provide a heat sink module board with a slit structure and a method for manufacturing a semiconductor package substrate integrating the heat sink, so as to integrate the heat sink in the subsequent process. The loss of the milling cutter for cutting the semiconductor package substrate with the heat sink is reduced, and the manufacturing cost is reduced. Another object of the present invention is to provide a heat sink module board with a slit structure and a method for manufacturing a semiconductor package substrate integrated with the heat sink, so as to reduce the burr of the heat sink when the semiconductor package substrate integrated with the heat sink is cut. produce. Another object of the present invention is to provide a heat sink module board with a slit structure and a method for manufacturing a semiconductor package substrate integrating the heat sink, in order to simplify the process steps, and effectively form a semiconductor package substrate integrated with a heat sink. Another object of the present invention is to provide a heat sink with a cutting seam structure.
17404 全懋.ptd 第9頁 1221331 五、發明說明（4) ^ --一~ 片模組板與整合該散熱片之半導體封 · 效運用散熱片板材，提高排版率，而^ ^板製法，係可有 為達上揭及其他目的，本發明之呈夕，材之浪費。 片模組板係由一整片之散熱片板材所構I割縫結構之散熱 個散熱片單元，各該散熱片單元係，」其包含有複數 片狀基板中各基板單元，且各該散熱J π奴正合散熱片之 割縫（S 1 〇 t S )，俾於片狀基板接置並敕早兀周圍形成有切 板後，得以機台進行切割。置I整合於該散熱片模組 步驟 複數 板材 元， 散熱 中各 模組 將散 之整 合有 置在 散熱 別整 本發明之整合散熱 片 早 包括：提供 半導體封裝 所構成之散 各該散熱片 片單元係對 基板單元； 板上；以及 熱片模組板 片狀基板模 散熱片單元 該散熱片模 片單元時， 合有散熱片 由於本發明 元周圍預先 一整片 基板單 熱片模 單元周 應至欲 將該整 沿該散 切割形 組片切 之條片 組板上 同時切 單元之 係在一 透過蝕 片之半導體封裝基板製法，其主 狀（P a n e 1 )之其 k f 2 ^ - & Μ Λ、 杈組片，其係由 所構成，提供一由整片之散熱少 組板’其包含有複數個散熱片單 圍形成有切割縫（S1〇ts)，且各該 整合散熱片之該整片狀基板模組少 片狀之基板模組片接置至該散熱> 熱片模組板之切割缝進行切割， 成各散熱片單元及將整合有散熱f 割成條片狀基板模組片，俾完成4 狀基板模組片。此外，亦可將該名 之整片狀基板模組片於進行切割名 割該整片狀基板模組片，俾完成布 基板單元。 整片狀之散熱片模組板上之各散卖 刻或沖壓等方式形成有切割缝，017404 Quan 懋 .ptd Page 9 1221331 V. Description of the invention (4) ^-a module board and a semiconductor package integrating the heat sink · Effectively use the heat sink plate to improve the typesetting rate, and ^ ^ board manufacturing method, It can be a waste of materials for the purpose of disclosure and other purposes. A chip module board is a radiating fin unit with a slit structure composed of a whole piece of fin plate, and each fin unit is a system, "which includes a plurality of substrate units in a plurality of chip substrates, and each of the radiating elements The slot of the J π slave positive heat sink (S 1 0t S) is placed on the sheet substrate and a cutting board is formed around the plate, and then the machine can cut it. The method of integrating I into the heat sink module includes a plurality of plate elements, and each module in the heat dissipation will be integrated with the heat sink. The integrated heat sink of the present invention includes: providing a semiconductor package to disperse the heat sink. The unit is a substrate unit; a board; and a heat sink module plate-like substrate mold heat sink unit. When the heat sink mold unit is integrated with a heat sink, a single substrate of a single heat sink mold unit is provided in advance around the element of the present invention. It is necessary to simultaneously cut the unit along the strip-shaped group board that is cut along the scatter-shaped group board is a method for manufacturing a semiconductor package substrate through an etched wafer, and its main shape (P ane 1) is kf 2 ^- & Μ Λ, a branch assembly, which is composed of a whole heat-removing panel, which includes a plurality of heat sinks, and a cutting slot (S10t) is formed around each of the heat sinks. The whole sheet-like substrate module with fewer pieces of the substrate module is connected to the heat sink > cutting slot of the heat-strip module board to cut into each heat sink unit and cut the integrated heat sink f into strips Substrate module , 4 serve to complete the module sheet-shaped substrate. In addition, it is also possible to cut the whole-piece substrate module piece under the name, and complete the cloth substrate unit. Cutting slits are formed on the entire sheet of heat sink module board in various ways such as engraving or stamping. 0
1221331 五、發明說明（5) 於後續接置整片狀基板模組片時，得以提供銑刀較少之切 割散熱片面積，即可完成有整合散熱片單元之條片狀基板 模組片或直接形成有個別整合散熱片單元之封裝基板單 元，以避免銑刀的損耗減少而降低製作成本，又可避免習 知需——將完成切單後基板單元貼合在條片狀散熱片所導 致之製程複雜與板材浪費問題；再者，本發明係可直接預 先在散熱片模組板上進行各散熱片單元之排版，故可有效 運用散熱片板材，而減少板材之浪費。 [實施方式] 以下係藉由特定的具體實例說明本發明之實施方式， 熟悉此技藝之人士可由本說明書所揭示之内容輕易地瞭解 本發明之其他優點與功效。本發明亦可藉由其他不同的具 體實例加以實施或應用，本說明書中的各項細節亦可基於 不同觀點與應用，在不悖離本發明之精神下進行各種修飾 與變更。 請參閱第2至6圖，係顯示本發明之整合散熱片之半導 體封裝基板製法示意圖。 請參閱第2圖，係顯示本發明之具切割縫結構之散熱 片模組板，該具切割缝結構之散熱片模組板2 0係由一整片 之散熱片板材所構成，其包含有複數個散熱片單元2 1，各 該散熱片單元2 1係對應至欲整合散熱片之整片狀基板中各 基板單元，且各該散熱片單元2 1周圍係可形成有複數個預 鑽孔（Predrilling holes)210供整片狀散熱片與整片狀基 板模組片貼合後，於基板上鑽出後續封裝製程使用之定位1221331 V. Description of the invention (5) When the whole chip substrate module is subsequently connected, it can provide a small area for cutting the heat sink with a milling cutter, and a strip chip substrate module with an integrated heat sink unit or The package substrate unit with individual integrated heat sink units is directly formed to avoid the reduction of the milling cutter loss and reduce the manufacturing cost, and to avoid the need for habituation-caused by the substrate unit being attached to the strip-shaped heat sink after the singulation is completed. The manufacturing process is complicated and the problem of sheet waste. Furthermore, the present invention can directly perform layout of each heat sink unit on the heat sink module board in advance, so the heat sink plate can be effectively used and the waste of the plate can be reduced. [Embodiments] The following is a description of specific embodiments of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific examples, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the spirit of the present invention. Please refer to FIGS. 2 to 6, which are schematic diagrams showing a method for manufacturing a semiconductor package substrate with an integrated heat sink according to the present invention. Please refer to FIG. 2, which shows a heat sink module board with a slit structure according to the present invention. The heat sink module board 20 with a slit structure is composed of a whole piece of heat sink plate, which includes A plurality of heat sink units 21, each of the heat sink units 21 corresponding to each substrate unit in the entire sheet substrate to be integrated with the heat sink, and a plurality of pre-drilled holes may be formed around each of the heat sink units 21 (Predrilling holes) 210 is used for drilling the positioning of the subsequent packaging process on the substrate after laminating the entire sheet of heat sink to the entire sheet of substrate module.
17404 全懋.ptd 第11頁 122133117404 懋 .ptd p. 11 1221331
孔，該散熱片單元2 1周圍並形Λ古逄叙^ t'i^ ^ f.i -^ ( S 1 01 s ) 2 1 1 a ^ 2T! t, J Λ ^ ^ ^ ^ „ 整合於該散熱片模組板後，得以、”、：片狀基板接置並 進行切割以形成整合有複數；=川b 片或複數個整合有散熱片單元美1木片3、土板拉組 u心巷板早兀。丨If冰，p、+、仕 板上之封裝製程定位孔亦可先於基板模組 ：： 散熱片上之預鑽孔2 1 0對位貼合，此庫 、产 再“ 換，故不再贅述。 &應為製程之簡易替 該散熱片模組板20係採用一具有高 質：例如銅所製成。該散熱片模組板係可利、用化學更；：方 式（Cheimcal etching)或沖壓（Punching)等方式，形 陣列排列之複數散熱片單元21，俾使各散熱片單元2 形成有預鑽孔210以及供機台進行切割之切割缝211&、 2 1 1 b，该切割缝2 1 1 a、2 1 1 b係分別形成於該散埶片單元2】 周圍及由複數散熱片單元21所構成之條狀散熱^間，並使 各邊散熱片單π 2 1得以藉由多數形成於其周圍切割缝2丨i & 間之連接部2 1 2與該散熱片模組板2 0相連。但應了解的是 該工具孔與切割縫之設置數量、形狀與位置係對應於機台 設計’而非偈限於本實施例中所述者。 請參閱第3圖，提供一整片狀之基板模組片3 〇，其係 由複數半導體封裝基板單元3 2所構成。該基板單元3 2可為 一底穴置晶型球柵陣列式（CDBG A )半導體封裝基板單元， 其在一表面上佈設有球柵陣列結構之銲球塾3 2 〇，以提供 該基板藉由後續接置在該銲球墊上之銲球電性連接至外部Hole, the heat sink unit 2 1 is formed Λ 古 逄 述 ^ t'i ^ ^ fi-^ (S 1 01 s) 2 1 1 a ^ 2T! T, J Λ ^ ^ ^ ^ „integrated in the heat sink After the module board is connected, the sheet substrates are connected and cut to form a plurality of integrated pieces; = a piece of b or a plurality of integrated heat sink units, a wood piece, and a soil plate pull group, and a heart lane plate. Early.丨 If ice, p, +, the packaging process positioning holes on the board can also be preceded by the substrate module :: Pre-drilled holes on the heat sink 2 1 0 alignment, this library, production and "change, so no longer To repeat. &Amp; Should be a simple process for the heat sink module board 20 is made of a high quality: for example made of copper. The heat sink module board can be used, more chemically ;: method (Cheimcal etching) Or punching (Punching), a plurality of fin units 21 arranged in an array, so that each fin unit 2 is formed with a pre-drilled hole 210 and a cutting slot 211 & 2 for the machine for cutting, the cutting The slits 2 1 1 a, 2 1 1 b are respectively formed in the loose sheet unit 2] around and in the form of strips of heat radiation formed by a plurality of heat sink units 21, and each side heat sink sheet π 2 1 can be borrowed. A plurality of connecting portions 2 1 2 formed between the cutting slits 2 i & are connected to the heat sink module board 20. However, it should be understood that the number, shape and position of the tool holes and the cutting slits are related to each other. Corresponds to the machine design 'instead of being limited to those described in this embodiment. Please refer to Figure 3 for a complete The substrate module sheet 30 is formed by a plurality of semiconductor package substrate units 32. The substrate unit 32 may be a bottom-hole crystal ball grid array (CDBG A) semiconductor package substrate unit. A ball grid 302 is provided on a surface to provide a ball grid array structure to provide the substrate to be electrically connected to the outside through a subsequent solder ball placed on the solder ball pad.
1221331 五、發明說明（7) ^子m衣-置λ ’且各該基板單元32中佈設有多數之導電線路 (未圖不），並形成有至少一貫穿其 說疋，該圖式中基板單& 32之數目僅係用以例亍 5兄明亚非以此為限。 1 j不 &右2 t閱第4圖，係將該整片狀基板模組片30以盆未# 20上，f蚀It 劑接置於該散熱片模組板 :Ui散熱片模組板2°上之各散熱片單元21對廣至 以正片狀基板模組片3 〇之各基板二- 32，，圍顯露於該散熱片單元21周圍之切割缝：二反：： ίϊϊ: T元21周圍係可形成有編固預鑽孔21〇供整片口 ;嶋模組片貼合後，於基板上鑽出後續 釕衣衣％使用之定位孔3 4 〇 搞2〇Ϊ i r!5圖’利用切割機具之銑刀沿該散熱片模組 η政熱片單元21周圍之切割縫2lla1221331 V. Description of the invention (7) ^ m-coat-set λ ', and each of the substrate units 32 is provided with a plurality of conductive lines (not shown), and at least one of them is formed therethrough. The substrate in the drawing The number of Dan & 32 is only used as an example. 1 j 不 & right 2 t see Figure 4, the whole piece of the substrate module 30 is placed on the pot # 20, and the etch it is placed on the heat sink module board: Ui heat sink module Each heat sink unit 21 on the plate 2 ° pairs each of the substrates 2 to 32, which are as wide as a positive-shaped substrate module sheet 30, and surrounds the cutting seam exposed around the heat sink unit 21: two counters :: ίϊϊ: T-element 21 can be formed around the pre-drilled hole 21 for the whole piece of mouth; after the 片 module piece is bonded, the positioning hole 3 4 〇 used for subsequent ruthenium clothes on the substrate is drilled 2 0 0 ir! Fig. 5 'A cutting knife 2111 around the heat sink module η and the heat sink unit 21 using a milling cutter of a cutting machine
:切割連接該散熱片單元21之連接部212以及整片狀基板1 才旲組片 3 0之基板單元3 R FI Μ A 献η m-m 圍部分，而得以完全分離各該散 ‘: 兀 ，/、，右同時完全切離該基板單元3 2周圍 日：；將可形成多數個別整合有散熱片單元21之封裝基板單 兀d Z。 ’亦可利用銳刀沿該相鄰呈條狀之散熱 &之切副缝2 1 1 b，以及沿各該散熱片單元2 1周圍之 切告丨j縫2 1 1 a進行切宝丨]兮敕人上^ 模組片3。，且模組板20之整片基板 單元3 2周圍以形成基：元3 2而保留 '分2板 接部（Substrate tie bar)33，: Cut the connection portion 212 that connects the heat sink unit 21 and the entire substrate 1 to form the substrate unit 3 R FI Μ A of the substrate 30 to provide a space of η mm, so that the individual components can be completely separated. At the same time, the right and left sides of the substrate unit 32 are completely cut off at the same time: a plurality of individual package substrate units d Z that can integrate the heat sink unit 21 can be formed. 'You can also use a sharp knife to cut along the adjacent strip-shaped heat dissipation & 2 1 1 b, and cut along the periphery of each of the heat sink unit 2 1 丨 j slit 2 1 1 a to cut treasure 丨] 西 敕 人 上 ^ Module 3. And the entire substrate unit 3 2 of the module board 20 is formed around the element: element 3 2 and the 'substrate tie bar' 33 is retained,
1221331 五、發明說明（8) 藉由該基板連接部3 3使各該基板單元3 2與該條片狀基板模 組片3 1相連接，俾將複數個基板單元3 2形成一條片狀基板 模組片3 1，而形成一於個別基板單元3 2上接置有散熱片單 元2 1之條片狀基板模組片3 1。 因此，本發明係透過切割製程之銑刀於其切割路徑之 散熱片上預先形成有切割缝結構，藉以減少銑刀切割散熱 片之切割路徑（可由較易切割之基板單元所取代），而可降 低銑刀之耗損以及銑刀切割散熱片時所產生之毛邊 (Burr );當然亦可預先在該基板單元上對應該散熱片切割 缝位置形成有切割縫，或使用呈條片狀之基板模組片藉以 進一步降低銑刀之耗損。 請參閱第7至1 1圖，係顯示本發明之整合散熱片之半 導體封裝基板製法第二實施態樣之示意圖。 請參閱第7圖，該具切割縫結構之散熱片模組板4 0係 由一整片之散熱片板材所構成，其包含有複數個散熱片單 元4 1，各該散熱片單元4 1係對應至欲整合散熱片之整片狀 基板模組片中各基板單元，且相鄰散熱片單元間形成有切 割缝（S 1 〇 t s ) 4 1 0，俾於將基板模組片接置於該散熱片模組 板4 0後，得以沿該散熱片模組板4 0之切割缝4 1 0進行切 割。 該散熱片模組板4 0係採用一具有南導熱性及硬度材 質，例如銅所製成。該散熱片模組板4 0係可利用化學蝕刻 方式或沖壓等方式，形成有複數個呈陣列排列之散熱片單 元4卜俾使相鄰散熱片單元4 1間形成有切割缝4 1 0，並使1221331 V. Description of the invention (8) Each substrate unit 3 2 is connected to the strip-shaped substrate module piece 31 by the substrate connection portion 3 3, and a plurality of substrate units 32 are formed into a sheet-shaped substrate. The module sheet 31 is formed as a strip-shaped substrate module sheet 31 with a heat sink unit 21 connected to the individual substrate unit 32. Therefore, in the present invention, a cutting slit structure is formed in advance on the heat sink of the cutting path through the milling cutter of the cutting process, thereby reducing the cutting path of the heat sink by the milling cutter (which can be replaced by a substrate unit that is easier to cut), which can reduce the The wear of the milling cutter and the burr generated by the milling cutter when cutting the heat sink; of course, a cutting slit can be formed on the substrate unit corresponding to the cutting slit of the heat sink, or a strip-shaped substrate module is used. The chip can further reduce the wear of the milling cutter. Please refer to FIGS. 7 to 11, which are schematic diagrams showing a second embodiment of the method for manufacturing a semiconductor package substrate with an integrated heat sink according to the present invention. Please refer to FIG. 7, the heat sink module board 40 with a slit structure is composed of a whole heat sink plate, which includes a plurality of heat sink units 41, and each of the heat sink units 41 is Corresponding to each substrate unit in the whole substrate module module sheet to be integrated with a heat sink, and a cutting seam (S 1 ots) 4 1 0 is formed between adjacent heat sink units, and the substrate module sheet is connected to After the heat sink module board 40, cutting can be performed along the cutting seam 4 1 0 of the heat sink module board 40. The heat sink module board 40 is made of a material having thermal conductivity and hardness, such as copper. The heat sink module board 40 can be formed by a plurality of heat sink units 4 arranged in an array by chemical etching or stamping, etc., so that cutting slits 4 1 0 are formed between adjacent heat sink units 41. Make
17404 全懋.ptd 第14頁 1221331 五、發明說明（9) -- 各該散熱片單元4 1得以藉由多數形成於其切割縫間之連接 部4 1 1與該散熱片模組板4 0相連。但應了解的是該切割缝 4 1 0之設置數量、形狀與位置係對應於機台設計，而非偈 限於本貫施例中所述者。 ° 請參閱第8圖，提供一整片狀之基板模組片5〇，苴係 由複數半導體封裝基板單元51所構成；該基板單元/丨'可為 一底穴置晶型球柵陣列式（CDBGA)半導體封裝基板單元/ 其在一表面上佈設有球柵陣列結構之銲球墊5 1 〇，以提供 該基板藉由後續接置在該銲球墊上之銲球電性連接至外部 電子裝置，且各該基板單元5 1中佈設有多數之導電線路 (未圖示）並形成有至少一貫穿其上下表面之開孔5 1 1。 請參閱第9圖，係將該整片狀基板模組片5 0以其未形 成有銲球墊5 1 0之一表面藉由黏著劑接置於該散熱片模組 板4 0上，並使該散熱片模組板4 0上之各散熱片單元4 1對應 至該條片狀基板模組片5 0之各基板單元5 1，而使該基板單 元5 1之周圍顯露於該散熱片模組板4 0之切割缝4 1 0。 請參閱第1 0及第1 1圖，將接置有該基板模組片5 0之散 熱片模組板4 0，依據該散熱片模組板4 0之切割縫4 1 0利用 切割機具之銑刀沿該散熱片模組板之切割縫4 1 0進行切 割，俾同時將該散熱片模組板4 0與接置其上之整片狀基板 模組片5 0完全切割分離成個別整合有散熱片單元4 1之封裝 基板單元5 1。俾藉由切割製程之銑刀於其切割路徑上之散 熱片預先形成之切割縫結構減少散熱片之切割路徑（可由 較易切割之基板單元所取代），而可降低銑刀之耗損以及17404 Quan 懋 .ptd Page 14 1221331 V. Description of the invention (9)-Each of the heat sink units 41 can be formed by a plurality of connecting portions 4 1 1 formed between the cutting slits and the heat sink module board 4 0 Connected. However, it should be understood that the number, shape, and position of the cutting seams 4 1 0 correspond to the design of the machine, and are not limited to those described in this embodiment. ° Please refer to Figure 8 to provide a complete substrate module module 50, which is composed of a plurality of semiconductor package substrate units 51; the substrate unit / ′ ′ can be a cavity-type crystal ball grid array (CDBGA) semiconductor package substrate unit / which is provided with a ball grid array structure of a solder ball pad 5 1 〇 on one surface, so as to provide the substrate to be electrically connected to external electronics through solder balls subsequently placed on the solder ball pad. Device, and each of the substrate units 51 is provided with a plurality of conductive lines (not shown) and is formed with at least one opening 5 1 1 penetrating the upper and lower surfaces thereof. Please refer to FIG. 9, which is that the entire substrate module chip 50 is placed on the heat sink module board 40 with an adhesive on one of the surfaces on which the solder ball pad 5 10 is not formed, and Each heat sink unit 41 on the heat sink module board 40 is corresponding to each substrate unit 51 in the strip-shaped substrate module sheet 50, and the periphery of the substrate unit 51 is exposed to the heat sink. The cutting seam 4 1 0 of the module board 40. Please refer to FIG. 10 and FIG. 11. The heat sink module board 40, to which the substrate module sheet 50 is connected, is used according to the cutting seam 4 1 0 of the heat sink module board 40. The milling cutter cuts along the cutting seam 4 1 0 of the heat sink module board, and at the same time completely cuts and separates the heat sink module board 40 and the entire sheet substrate module wafer 50 placed on it into separate integrations. A package substrate unit 51 having a heat sink unit 41.俾 The pre-formed slit structure of the heat sink on the cutting path of the milling cutter in the cutting process reduces the cutting path of the heat sink (which can be replaced by a substrate unit that is easier to cut), which can reduce the consumption of the milling cutter and
17404全想.口士(] 第15頁 1221331 五、發明說明（ίο) 銑刀切割散熱片時所產生之毛邊（B u r r );當然亦可預先在 該基板單元形成有對應該散熱片切割缝位置形成有切割 缝，俾進一步降低銑刀之耗損。 於該第二實施態樣中，由於該散熱片模組板之切割缝 係直接形成在相鄰之散熱片單元間，以縮小排版間距，提 高排版率，同時各該散熱片單元係對應至形成在該整片狀 基板模組片之各基板單元，因此，在相同尺寸之散熱片模 組板與基板模組片下，俾提供更多之整合有散熱片單元之 封裝基板單元。 請參閱第1 2至1 6圖，係顯示本發明之整合散熱片之半 導體封裝基板製法第三實施態樣之示意圖。 請參閱第1 2圖，該具切割缝結構之散熱片模組板6 0係 由一整片之散熱片板材所構成，其包含有複數個散熱片單 元6 1，且相鄰散熱片單元間形成有切割缝（S 1 〇 t s ) 6 1 0，俾 供切割刀具得以沿該切割縫61 0進行切割。該散熱片模組 板6 0係採用一具有高導熱性及硬度材質，例如銅所製成， 並可利用化學蝕刻方式或沖壓等方式，藉以形成複數呈陣 列排列之散熱片單元6 1，俾於相鄰散熱片單元6 1間形成有 切割缝6 1 0，並使各該散熱片單元6 1得以藉由多數形成於 其切割縫6 1 0間之連接部6 1 1與該散熱片模組板6 0相連。本 實施態樣中與第二實施態樣不同處係在於該散熱片單元6 1 之連接部6 1 1僅形成於該散熱片單元6 1周邊之中間部分， 而在其它部分係為切割縫6 1 0之開孔，如此，於後續進行 切割作業時，僅需切除該散熱片單元6 1周圍之連接部6 1 117404 All thoughts. Mouth () Page 15 122331 V. Description of the invention (bur) Burr produced by a milling cutter when cutting the heat sink; Of course, a cutting slot corresponding to the heat sink can also be formed in the substrate unit in advance. A cutting seam is formed at the position to further reduce the wear of the milling cutter. In the second embodiment, the cutting seam of the heat sink module board is directly formed between adjacent heat sink units to reduce the typesetting distance. Improve the typesetting rate, and each heat sink unit corresponds to each of the substrate units formed on the entire substrate module sheet. Therefore, under the same size heat sink module board and substrate module sheet, we provide more The package substrate unit with integrated heat sink unit. Please refer to FIGS. 12 to 16, which are schematic diagrams showing the third embodiment of the method for manufacturing a semiconductor package substrate with integrated heat sink according to the present invention. Please refer to FIG. 12, which The heat sink module board 60 with a slit structure is composed of a whole piece of heat sink plate, which includes a plurality of heat sink units 61, and a slit (S 1 〇) is formed between adjacent heat sink units. ts) 6 10, the cutting tool can cut along the cutting seam 61 0. The heat sink module board 60 is made of a material with high thermal conductivity and hardness, such as copper, and can be chemically etched or stamped. In other ways, a plurality of heat sink units 6 1 arranged in an array are formed, and a cutting slit 6 1 0 is formed between adjacent heat sink units 61, and each of the heat sink units 61 can be formed by a majority thereof. The connecting portion 6 1 1 between the cutting slits 6 10 is connected to the heat sink module board 60. The difference between this embodiment and the second embodiment lies in the connecting portion 6 1 1 of the heat sink unit 6 1 It is only formed in the middle part of the periphery of the heat sink unit 61, and the other parts are openings of the cutting seam 6 10. In this way, when the subsequent cutting operation is performed, only the connection around the heat sink unit 61 needs to be cut off. Part 6 1 1
17404 全懋.ptd 第16頁 1221331 五、發明說明（11) 即可加以分離，俾進一步減少切割刀具切割散熱片之路徑 以降低切割刀具之耗損。但應了解的是該切割縫之設置數 量、形狀與位置係對應於機台設計，而非侷限於本實施例 中所述者。 請參閱第1 3圖，提供一整片狀基板模組片7 〇，其係由 複數半導體封裝基板單元7 1所構成；該基板單元7丨可為一 底穴置晶型球栅陣列式（CDBGA)半導體封裝基板單元，其 在一表面上佈設有球栅陣列結構之銲球墊7 1 〇，且各該基 板單元71中形成有至少一貫穿其上下表面之開孔711。 請參閱第14圖，係將該整片狀基板模組片7〇以其未形 成有I干球墊7 1 0之一表面藉由黏著劑接置於該散熱片模組 板6 0上’並使該散熱片模組板6 〇上之各散熱片單元6 i對應 至4整片狀基板模組片7 0之各基板單元71，而使該基板單 元7 1之周圍顯露於該散熱片模組板6 〇之切割縫6丨〇。 請 7 0之散 板之切 連接部 離成個 由 片單元 於後續 以提供 片單元 筝閱第1 5及第1 6圖，將接置有該整片狀基板模組片 熱片模組板60利用切割機具之銑刀沿該散熱片模組 割縫610進行切割，俾同時將該散熱片模組板㈤之 6 1 1與接置其上之整片狀基板模組片7 〇完全切割分 別整合有散熱片單元6 1之封裝基板單元7 1。 於本發明係在一整片狀之散熱片模組板上之各散敎 周圍預先透過蝕刻或沖壓等方式形成有切割缝，俾 ί置Ϊί狀基板模組片或整片狀基板模組片時，得 之二：ί Γ 2散熱片面積，即可完成有整合散熱 ^ 、土反吴組片或直接形成有個別整合散熱片17404 Quan 懋 .ptd Page 16 1221331 V. Description of the invention (11) It can be separated, which further reduces the path of the cutting blade cutting the heat sink to reduce the consumption of the cutting blade. However, it should be understood that the number, shape and position of the cutting slits correspond to the design of the machine and are not limited to those described in this embodiment. Please refer to FIG. 13 to provide a whole-piece substrate module chip 70, which is composed of a plurality of semiconductor package substrate units 71; the substrate unit 7 丨 can be a bottom-hole crystal ball grid array ( A CDBGA) semiconductor package substrate unit is provided with solder ball pads 7 10 of a ball grid array structure on one surface, and each of the substrate units 71 is formed with at least one opening 711 penetrating the upper and lower surfaces thereof. Please refer to FIG. 14, which is that the entire sheet substrate module sheet 70 is placed on the heat sink module board 60 with an adhesive on one of the surfaces on which the I dry ball pad 7 10 is not formed. Each heat sink unit 6 i on the heat sink module board 60 is made to correspond to each substrate unit 71 of 4 whole-piece substrate module sheet 70, so that the periphery of the substrate unit 71 is exposed to the heat sink. Cutting slit 6 丨 of the module board 60. Please separate the cutting and connecting part of the 70's loose board into a sheet unit to provide the sheet unit. See Figures 15 and 16 to connect the whole piece of substrate module to the hot sheet module board. 60 Use a cutter of a cutting machine to cut along the heat sink module slit 610, and at the same time, 6 1 1 of the heat sink module board and the entire sheet substrate module 7 placed on the heat sink module are completely cut. Each of the package substrate units 7 1 is integrated with a heat sink unit 61. In the present invention, a cutting seam is formed in advance around each scatter of a whole-piece heat sink module board through etching or stamping, and a single-shaped substrate module piece or a whole-piece substrate module piece is formed. Time, get the second: Γ Γ 2 heat sink area, you can complete the integrated heat sink ^, soil anti-Wu group or directly formed individual integrated heat sink
17404全想.ptd 第]7頁 1221331 五、發明說明（12) 單元之封裝基板單元，以避免銑刀的損耗減少而降低製作 成本，又可避免習知需——將完成切單後基板單元貼合在 條片狀散熱片所導致之製程複雜與板材浪費問題；再者， 本發明係可直接預先在散熱片模組板上進行各散熱片單元 之排版，故可有效運用散熱片板材，而減少板材之浪費。 上述之實施例僅用以例示本發明之原理及其功效，而 非用於限定本發明，例如本發明之具切割缝結構的散熱片 模組板與整合該散熱片模組板之半導體封裝基板製法，並 非局限於使用在CDBGA半導體封裝基板上，任何結合有散 熱片之半導體封裝基板皆可透過本發明中具切割缝結構之 散熱片而減少對半導體封裝基板進行切割之銑刀的損耗以 及進行切割製程時減少散熱片毛邊之產生。因此任何熟習 此項技藝之人士均可在不違背本發明之精神及範疇下，對 上述實施例進行修飾與變化，端視實施型態而定。17404 全 想 .ptd Page] 71221231 V. Description of the invention (12) Unit package substrate unit, to avoid the reduction of milling cutter loss and reduce the production cost, and to avoid the need for custom-the substrate unit will be cut after ordering Complicated manufacturing process and plate waste caused by sticking to the strip-shaped heat sink; Furthermore, the present invention can directly perform layout of each heat sink unit on the heat sink module board in advance, so the heat sink plate can be effectively used. And reduce the waste of plates. The above embodiments are only used to illustrate the principles and effects of the present invention, but not to limit the present invention. For example, the heat sink module board with a slit structure of the present invention and a semiconductor package substrate integrating the heat sink module board The manufacturing method is not limited to the use on a CDBGA semiconductor package substrate. Any semiconductor package substrate combined with a heat sink can reduce the loss of the milling cutter and cut the semiconductor package substrate through the heat sink with a slit structure in the present invention. Reduce the occurrence of burrs on the heat sink during the cutting process. Therefore, anyone skilled in the art can modify and change the above embodiments without departing from the spirit and scope of the present invention, depending on the implementation mode.
17404 全懋.ptd 第18頁 1221331 圖式簡單說明 [圖式簡單說明] 第1圖所示係習知之CDBGA半導體封裝基板示意圖； 第2圖所示係本發明之具切割缝結構的散熱片模組板 不意圖， 第3至6圖所示係本發明之整合散熱片之半導體封裝基 板製法不意圖， 第7圖所示係本發明之具切割缝結構的散熱片模組板 第二實施態樣之示意圖； 第8至1 1圖所示係本發明之整合散熱片之半導體封裝 基板製法第二實施態樣之示意圖； 第1 2圖所示係本發明之具切割缝結構的散熱片模組板 第三實施態樣之示意圖；以及 第1 3至1 6圖所示係本發明之整合散熱片之半導體封裝 基板製法第二實施態樣之示意圖。 10 半導體封裝基板 11 開孔 12 散熱片 13 半導體晶片 14 銲線 15 銲球 2 0 散熱片模組板 21 散熱片單元 210 預鑽孔17404 Quan 懋 .ptd Page 18 1223131 Brief description of the drawings [Simplified description of the drawings] Figure 1 is a conventional schematic diagram of a CDBGA semiconductor package substrate; Figure 2 is a heat sink die with a slit structure according to the present invention The assembly board is not intended. Figures 3 to 6 show the manufacturing method of the semiconductor package substrate with integrated heat sink of the present invention. Figure 7 shows the second embodiment of the heat sink module board with a slit structure of the present invention. Figures 8 to 11 are schematic views of the second embodiment of the method for manufacturing a semiconductor package substrate with integrated heat sinks according to the present invention; Figures 12 and 12 are heat sink dies with a slit structure according to the present invention. A schematic diagram of the third embodiment of the panel assembly; and FIGS. 13 to 16 are schematic diagrams of the second embodiment of the method for manufacturing a semiconductor package substrate with an integrated heat sink according to the present invention. 10 Semiconductor package substrate 11 Opening hole 12 Heat sink 13 Semiconductor wafer 14 Solder wire 15 Solder ball 2 0 Heat sink module board 21 Heat sink unit 210 Pre-drilled holes
17404 全懋.ptd 第19頁 122133117404 懋 .ptd Page 19 1221331
圖式簡單說明 21 la，21 lb 切割缝 212 連接部 30 整片狀基板模組片 31 條片狀基板模組片 32 基板單元 33 基板連接部 34 定位孔 320 焊球塾 321 開孑L 40, 60 散熱片模組板 41，61 散熱片單元 410, 610 切割縫 411,611 連接部 51，71 基板單元 510, 710 鮮球塾 511， 711 開孔 17404 全懋.ptd 第20頁The drawing briefly explains 21 la, 21 lb cutting slits 212 connecting portions 30 whole piece substrate module pieces 31 strip substrate module pieces 32 substrate units 33 substrate connection portions 34 positioning holes 320 solder balls 塾 321 openings L 40, 60 Heat sink module board 41, 61 Heat sink unit 410, 610 Cutting slot 411, 611 Connection portion 51, 71 Base unit 510, 710 Fresh ball 塾 511, 711 Opening hole 17404 Full pt.ptd Page 20
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| TW (1) | TWI221331B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI683229B (en) * | 2018-07-06 | 2020-01-21 | 智茂電腦科技有限公司 | Computer program product for offline editing of circuit board processing machine |
| TWI768593B (en) * | 2020-12-15 | 2022-06-21 | 華泰電子股份有限公司 | Semiconductor package and manufacturing method thereof |
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2003
- 2003-11-06 TW TW092131046A patent/TWI221331B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TW200516743A (en) | 2005-05-16 |
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