TWI220695B - Electronic testing structure assembly - Google Patents

Abstract

A new electronic testing structure for electronic device, which can test the electronic devices using one or plural pads, would be proposed in this invention. This structure includes one or plural upper plate with elastic structure. One or plural electronic pads and measurement pads would be formed on the said electronic devices. The electronic signal connection between the said electronic pads and said measurement pads could be established by the measurement signal wires. This testing structure also comprises lower plate directly thereon the said upper plate and said electronic devices. Both the said upper plate and said lower plate are configured to receive the said one or plural electronic devices in a predetermined orientation. One or plural contact structures formed on the said lower plate would be electronically contact the said measure pads.

Description

1220695

___ V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a detection technology, in particular to a structure of a test module for a wafer _ test. ~ Machine inspection In recent years, with the rapid improvement of electronic product functions, the first four units are moving toward more fine-grained sizes, high capacity, high speed, and multi-functional electronics. Electronic intrusion into electronic device structures has rapidly moved from traditional pin-type structures Nightmare ^ In. The first area is in the form of a column, and it is developing towards higher I / 0 density and wafer size assembly technology. The electronic device structure utilizes advantages on the wafer that are not available in the traditional way. It has a mounting area, reduces manufacturing costs, and describes the advanced electronic device structure in the two gases to improve heat dissipation. Impedance instability effect. Because of this, the “type” is more effective than the traditional structure. This electronic device can play higher. On the other hand, the process yield and the device of the electronic device device assembly form need to go through a series of test procedures. A needle test procedure is performed to verify the correctness of the function and its good process, including the separation of the mechanical buffer layer fabrication sub-device from the wafer. The assembly process can be completed at Yu, which has the advantages of greatly reducing the excellent electrical performance of the electronic device structure. In the past, the electronic device substrate was directly exposed, and the electricity t from the electronic device to the system substrate was reduced to reduce the length of the connection line, which caused the new type of electronic device structure described in J.J. to increase the heat dissipation capacity of the electronic device, and Faster performance. In terms of test angle, in order to ensure the functional reliability of the electronic device, the electronic ° 7 such as: the completion of wafer fabrication in a wafer fab Install 'Hyun 1 connection unit production, etc., and finally assemble the electronics and electronics into electronic products

1220695 V. Description of the invention (2) Before the product system is tested, a long-term high-temperature environment telecommunication test will be performed to ensure the quality and yield of the sub-device during the assembly process. [Previous technology] Republic of China Patent Bulletin No. 4, 485, 527, which discloses a wafer, test structure, as shown in Figure 1A, its structure is on a wafer i 〇 丨, the main feature is the crystal The circle has a plurality of electronic devices, and a plurality of application bumps i 3 0 and burn-in test bumps 12 are formed between the electronic devices. :, The burn-in test bump 130 is located on the periphery of the electronic device i 〇 〇, and its electronic j number is connected to the electronic device through a wire. In addition, the patent also discloses that the manufacturing method and testing method of the wafer-level test structure include: re-arrangement of the wiring process, formation of a corresponding insulating layer with a wire junction on the wafer 101, formation of A plurality of the burn-in test bumps, etc., and the I-wire layer connects the burn-in test bumps to the electronic device; and a method for performing a burn-in test using the burn-in test bumps just described. US patent word $ 5, 8 5 9, 5 3 9 'It discloses a reusable long-term wafer test: set' as shown in Figure 1B, which includes a wafer 1 〇 丨 and a plurality of electronic set 1 〇〇 on the aforementioned wafer. A test upper board 150 is provided, and a plurality of wires 5 2 are arranged in the aforementioned test upper board 150, and the positions of the aforementioned wires i 5 2 are opposite to the electrodes of the electronic device. In the test upper board 150, there is a telecommunication outer structure 1 51, and there are single or multiple wires 5 2 connected to the aforementioned telecommunications external, structure 153, so that the test is generated by the electronic Pei 100 The electronic signal U is connected to the outside world. And there is a test hole in the test upper board i50 to

1220695 V. Description of the invention (3) — One — — The test wafer 1 OO 1 ′ and single or multiple alignment pins 5 4 can be precisely bonded to the lower test plate 160 during assembly. In addition, an elastic body 16 5 ′ is provided in the test lower plate 15 to protect the wafer i w during the aging test. However, in order to improve the heat dissipation and telecommunication performance of the advanced electronic device structure technology mentioned above, most of the electronic device substrate is directly exposed to the air, and the mechanical protection facilities of the traditional pin structure are lacking. In the traditional long-term Nanning burn-in telecommunications test module test procedure, the test contact unit of the aforementioned test module will be in contact with the dazzling technology of the electronic device. Because the advanced electronics ㊁C70 produces a direct communication connection mechanical buffer layer thickness limit t force: design considerations 'the contact force it applies to electronic devices ..., the basis of the device', resulting in the aforementioned advanced effects. ㈣ Judging the long-term ~ 2 failure of the function function of the electronic device is the destructive factor of the lack of testing of the construction process. The above issues can be roughly caused by the nose 1 = two / 4. However, the traditional direction of special design: , Using a high price and special two, using the aforementioned a round oblique # to greatly increase the test cost; its long-term high-temperature pre-test = test 7 sequence, on the uncut wafer that is the defect caused by the yield; : Risk test structure for efficiency of dicing wafer process. / 、 — Redesigned a low-cost and advanced technology used by the South Korean industry, this invention proposes-Telecommunications' test group K :: Recently, most of them are electronic products. Appropriate combination of the structure of the telecommunication detection module, that is, 4: T. By using the P of the present invention, a suitable long time height can be formed.

丄 220695 V. Description of the invention (4) A problem of reducing the cost of testing and the two-temperature testing mentioned above. The temperature pre-burning detection system is mentioned, and the structure of the large advanced electronic device is long. [Abstract] The present invention provides a detection component structure for detecting an electronic device with a single or a plurality of gaskets. The purpose is to provide a component structure that can perform long-term high-temperature burn-in telecommunication test for independent electronic devices that are completed and installed. And it can 'reduce the long-term high-temperature test system's electronic damage. To achieve the above purpose The present invention provides a chip telecommunications detection component structure. The structure includes a detection structure upper plate, and may have a single or multiple elastomer structures on its surface. And single or multiple electronic devices will correspond to the aforementioned detection structure upper plate. A single or a plurality of telecommunication gaskets are arranged on the telecommunication transmitting surface of the aforementioned electronic device, and a single or a plurality of test gaskets are formed on the surface of the aforementioned electronic device. The telecommunication communication between the test gasket and the telecommunication gasket can be via It can be achieved by single or multiple detection signal wires. The shape of the test pad includes a circle, an oval, a polygon, or a combination of the above shapes. This structure also includes a lower plate of the detection structure, which corresponds to the upper plate of the detection structure and The aforementioned electronic device. A single or a plurality of contact structures are arranged in the lower plate of the aforementioned detection structure, and correspond to the aforementioned test And contact with the aforementioned test pads for telecommunication connection. The aforementioned contact structure shapes include: cylindrical, elliptic, polygonal, non-planar cylindrical top, non-planar elliptical cylindrical, top Irregular column or above with non-planar surface

Page 9 1220695

[Embodiment] The present invention discloses a J-number related to the structure of a chip telecommunication detection assembly. In detail, the present invention provides a detection structure for detecting an electronic device having a car, a chelate, and an embodiment thereof. The detailed description is just as an illustration of the preferred embodiment, and is not intended to limit the electronic device wiring structure of the chip telecommunications detection module structure of the present invention. The schematic diagram of the side view and the side view are shown in Figure 2. A and Figure II. The cross-section of electron two B is shown in the A-a section in FIG. Among them are the push device 200 and its telecommunication transmission surface 203. On the telecommunication transmission surface 2, there is a mechanical buffer layer 280, and the material may be a combination of green lacquer, high molecular photopolymer, polymer material, etc., or a combination of the above compounds. On the mechanical buffer layer 280, a single or a plurality of telecommunication pads 260 ′ are provided, and the material may be nickel, tin, gold, copper, or a combination of the foregoing metal alloys or conductive metals. In addition, it has a welding unit 27, which can be made of tin, lead, nickel, gold, copper, or a combination of the above metal alloys or conductors relative to each telecommunication pad. The above-mentioned welding unit will play the electronic device 2000 and the external wing

1220695 C〇i 5. Description of the invention (6) ^ —— One-to-one communication role of circuit facilities, such as: transmitting electronic signals in electronic devices to the outside of electronic devices; or transmitting external electronic signals to the electronic Device. However, in the structure of the telecommunication detection module of the present invention, the aforementioned welding unit 270 may not be provided. However, in the electronic device that completes the conventional electronic device construction process, most of them have the aforementioned welding unit 27. Therefore, the welding unit 270 is considered in the long-term high-temperature inspection program, which can widely improve the accuracy and representativeness of the test. A single or a plurality of test pads 220 are arranged on the telecommunication transmission surface 203 of the aforementioned electronic device, and are formed on the early edge or plural edges of the outer edge of the aforementioned electronic device 200. And the welding unit located on the outside of the external electronic device 2000 is connected to the electric gasket 2 60, and can be connected to the test gasket i through the test signal wire 2 2 5. In addition, the welding unit at the central part of the electronic device 200, such as the capacity unit 271 and the welding unit 272, can also be composed of a bent detection pad ^ 2? 1 gold, 丨 ^ extended detection signal wire 227, corresponding to The test cymbal 2 2 1 is in phase with the test cymbal 2 2 2. ▲ 2 ι_ To be connected to the test pad, if; Not all fusion splicing units require an external telecommunication connection; 2 73 does not need to be connected to the line during testing. 1 It is guided without making test pads and detection signals. As shown in Figure i: The top view of the first embodiment of the bottom plate of the "test two structure" test structure can be structured; Single / upper test structure with a lower plate of 31 ° and two test cavities 302 placed in the test electric furnace to accommodate the structure to be tested. China Copper also has single or multiple contact junction material alloys or stainless steel nickel. , Money, plutonium, or any of the above metals, will be a combination of materials. Several of the contact structures 330 will be relative to the aforementioned test pads of the electronic device.

1220695

CO V. Description of the invention (7) ---...................... The lower plate of the test structure of the present invention Top view of the second embodiment: early or multiple cavities 3G2 in the board to accommodate the device to be tested. In each test cavity, there is a single row, a combination of 335 ^ # ^. ^ ^ ^ ^ ^ Λ Λ = =. In addition to the aforementioned contact soft sheet: two tungsten or more metal material alloy or conductive material beryllium: together. The position of the road pattern 331 will be relative to the test 塾 η of the aforementioned electronic device. The top view of the upper structure of the test structure i by ί Ϊ 2 can be shown in Figure 4. ^ t ^ An upper plate 440 of the test structure, and early or plural elastic bodies 49 0 in the lower plate of the test structure. Its geometric position is relative to the aforementioned electrical device. It can be used for long-term high-temperature aging telecommunication test Protect the electronic device. You Xilong February ^ Λ detection component structure of the first embodiment of the telecommunication detection operation ΤΛΛ: Figure 5 shows. The cross-section of Figure 5 in Figure 2 is shown in the section A-Α of Lei + Gao Yi 朁 πη 四. The towel includes a single or a plurality of telecommunication transmission surfaces 5 0 3 which are provided with a mechanical buffer layer 5 8 0 k in mechanical reliability of the electronic device. And it has unit wo and single or multiple test cymbals 52. Among them, the test pad signal will be connected to the welding unit 57 through a specific detection signal wire. In addition, the telecommunication transmission surface 503 of the electronic device 500 is oriented 510 ′ under the test structure and placed in a specific test cavity 502. And the contact structure of the test pad 520 of the single or multiple sides of the electronic device and the lower plate 510 of the detection structure

EH Page 12 1220695 hiii. V. Description of the invention (8) One -------------- One item δ corresponds to / mechanically contacts the two during testing to achieve electricity In the test structure lower plate 5 10, there is a single or a plurality of structures ^ ,,, " structure 5 5 0 'connected to the contact structure 5 3 0 through a specific line. May ^ w ^ ^ The electronic signal in the electric device 500 is in communication with the test module and the sensor. At the same time, an upper plate 540 of the test structure is prepared, and has a single buffer 590, which is paired with the lower plate 510 and the electron pair of the test structure. During the test procedure, the aforementioned test junction, the electronic device 50 0 and the test structure upper plate 540 are bonded to each other, and the test pad 520 on the electronic device 500 is connected to the corresponding connection structure 530. It becomes the structure of the telecommunication detection module of the present invention. At the same time, the electronic duties of the outside world and electronic devices can be completed through telecommunications: structure 550, contact structure 530 and test pad 520. The structure of the test device of the present invention does not directly contact the electronic device 500 at the welding joint 70 560, and the test hole 5002 does not directly touch the electronic device 500, so the electronic device 500 ’s telecommunication transmission surface 500 It has considerable mechanical self-deployment! In particular, mechanically, when conducting long-term high-temperature telecommunication tests, its electrical junction i. The stress of 卩 will be less than the test of the conventional contact welding unit 5 70 I. The test operation of the second embodiment of the structure of the ir monthly test module is shown in Fig. Γ: shown in Fig. 6. The horizontal load plane in Figure 6 is shown in Figure 2H. It includes single or multiple ϊ ί ΓΓΛ Λ # ΛΦ 6: 3ΐ:! ^ ^ Given the degree of guilt, and there are early or multiple dazzle: then 670 with single or multiple test pads 62. Of which ‘test gasket ’s electronics

V. Description of the invention (9)

The 1220695 signal will be connected to the welding unit 67 through a specific detection signal wire. In addition, the telecommunication transmission surface 603 of the electronic device 600 is oriented toward the lower plate 610 of the test structure, and is placed in a specific test cavity 602. And make the test pad 6 2 0 of the unilateral or plural sides of the electronic device correspond to the circuit pattern 6 3 1 on the contact soft board 6 3 5 of the lower plate 6 of the detection structure, and make the aforementioned two mechanical during the test. Contact for telecommunication connectivity. At the same time, a single or a plurality of telecommunication external structures 6 50 are arranged in the lower plate 6 of the test structure, and are connected to the circuit pattern 631 through a specific line. During the test, the electronic signals in the electronic device 600 can communicate with the outside of the test component structure. At the same time, the plate 6 4 0 ′ has a single or a plurality of mechanical buffers 6 9 0, so that the lower plate 61G of the toilet test structure is opposed to the electronic device 6_He. The test structure lower plate 610, the electronic device 600 and the test structure upper plate 640 'are connected to each other to perform the test procedure, and the test pad 6200 on the electronic device 600 and the corresponding circuit pattern are assembled. The connection of 631 becomes the structure of the telecommunication detection module of the present invention. At the same time, during the test, the electronic signals of the outside world and the electronic device can be completed through the telecommunication external structure 650, the circuit pattern 631, and the test pad 62 °. The structure of the telecommunication detection module of the present invention does not directly touch the welding unit 6 60 of the electronic device 600 as described above; and the test hole 602 does not directly touch the electronic device 600, so the electronic device 6 0 0 telecommunications The transmission surface 603 has a corresponding degree of mechanical freedom. Therefore, in terms of mechanics, during long-term high-temperature aging measurement, the stress inside the electronic device will be less than the component structure of the transmission, which will greatly reduce the damage to the substrate of the electronic device, which can be referred to as telecommunication measurement. Credibility and reduced testing costs. ,

1220695 ___Sho Received 5. Description of invention (10)

This invention is intended to cover various modifications and similar arrangements to those skilled in the art. Therefore, according to the broadest interpretation of the scope of patent application, the scope that is obvious to accommodate all such modifications and similar configurations should be rooted. 1220695 _____ Brief description of the drawings [Simplified description of the drawings] The preferred embodiment of the present invention will be described in more detail with the following figures in the following description: Figure 'A is a traditional wafer-level test structure. Figure 1B is a traditional wafer-level long-term telecommunications detection structure. FIG. 2A is a schematic top view of the electronic device wiring structure of the chip telecommunications detection module structure of the present invention. FIG. 2B is a schematic cross-sectional view of a wiring structure of an electronic device according to the structure of a chip telecommunication detection module of the present invention. FIG. 3A is a schematic top view of the first embodiment of the lower plate of the detection structure of the present invention. FIG. 3B is a schematic top view of the second embodiment of the lower plate of the detection structure of the present invention. Figure 4 is a schematic top view of the upper plate of the detection structure of the present invention.丨 FIG. 5 is a schematic cross-sectional view of the telecommunication inspection operation of the first embodiment of the structure of the wafer telecommunication inspection component of the present invention. FIG. 6 is a schematic cross-sectional view of a telecommunication inspection operation of the second embodiment of the structure of a wafer telecommunication inspection module according to the present invention.

I

I j | | Symbol Description

I 1 100 electronic device 1 0 1 wafer 1 2 0 burn-in test piece 1 3 0 application bump

Page 16 1220695 __ Schematic description 1 5 0 Test upper board 1 5 1 Telecom external structure 1 5 2 Lead 1 5 3 Test cavity 1 5 4 Alignment pin 1 6 0 Test lower board 1 6 5 Elastomer 2 0 0Electronic device

2 0 3 telecommunication transmission surface 2 2 0 test gasket 2 2 1 test gasket 2 2 2 test gasket | 2 2 5 test signal wire I 2 2 6 test signal wire | 227 test signal wire ί 2 6 0丨 2 7 0 fusion unit i 272 fusion unit I 2 7 3 fusion unit 2 8 0 mechanical buffer layer i 3 0 2 test cavity i 310 detection structure lower plate | 3 3 0 contact structure ii 331 circuit pattern

I

Page 17 1220695 j {V > Original dagger ~ ..--- A simple illustration of a 335 contact soft plate 440 detection structure lower plate 490 elastomer 500 electronic device 502 test cavity 503 telecommunication transmission surface 510 detection structure lower plate 520 test Gasket 530 Contact structure 540 Inspection structure upper plate 560 Telecommunication spacer 550 Telecommunication external structure 570 Welding unit 58 0 Mechanical buffer 590 Elastomer 600 Electronic device 602 Test cavity 603 Telecommunication transmission surface 610 Inspection structure lower plate 620 Test gasket 1 631 circuit pattern | 635 contact soft board; 640 inspection structure upper board 66 0 telecommunication pad

Page 18 1220695 Simple illustration of the drawing 6 5 0 Telecommunication external structure 6 7 0 Welding unit 6 8 0 Mechanical buffer 6 9 0 Elastomer iim

Claims (1)

! 22〇695 6. Scope of patent application1. An electronic device for chip telecommunications inspection, to the upper plate of a detection structure; single or multiple electronics with single or multiple telecommunications orders or multiple test pads or edges, via The aforementioned telecommunication gaskets are connected to a circular, polygonal or lower plate with a detection structure, and a sub-device; a single or a plurality of contact junctions are connected to the aforementioned test gaskets; the aforementioned contact junctions are cylindrical, and the top surface is not flat and the top surface is not Irregularities in the plane | 2 · If the inspection scope of the patent application is on the upper plate, the electronic device contacts. Set 'corresponds to the gasket cloth on the front piece, formed on or multiple inspections; and the shape of each of the shapes described above corresponds to the cylindrical shape of the aforementioned structure' clothed in front 'and includes a surface with the aforementioned structure shape or a column shape ^ 1.01 Structure '"Single or multiple test fixtures are on the upper plate of the test structure, and describe the surface of the electronic device; the single-sided test signal wire of the outer edge of the electronic device just described and all or part of the test piece shape include: circular The upper plate of the detection structure is in contact with the lower plate of the detection structure described above, and the corresponding test pads are in contact to perform electrical g: cylindrical, elliptical cylindrical, polygonal, non-planar elliptic cylindrical, or more A combination of shapes. ^ The telecommunication detection module structure of item 1, wherein the said structure can be provided with a single or a plurality of elastomer structures, and the above 3 · such as the scope of patent application No. 1 顼 + + _ k, evening >, day 丨 from Site > Bei Zhidian said the structure of the detection module, including the electronic device, +, +. There are early or multiple test holes to accommodate the above Sixth, the scope of patent application 4. If the detection structure of the patent scope, the lower plate can be distributed; ^. Telecommunication inspection / 胄 1 component structure, wherein the test is to power the electronic device: there are early or multiple telecommunications external structures, and the test electronic signal is connected to the outside. 5 · — An electronic device of telecommunication detection module structure, including at least: — an upper plate of the detection structure; used to detect a single or a plurality of gasket sheets or a plurality of single or plural sheets or multiple or plural edges; Circular, multilateral and one detection structure sub-device; single or multiple pieces with single or multiple pieces, and connected to the telecommunication pad test pads of the upper electronic device via early or thin pieces; The test described above corresponds to the aforementioned test structure upper plate, with a piece of cloth on the surface of the aforementioned electronic device; 'a single side of a plurality of test signal wires formed on the outer edge of the aforementioned electronic device and all or part of the aforementioned test pads The shape includes: a combination of circular and elliptical shapes; the upper plate of the above detection structure and the aforementioned electricity should be placed in the lower plate of the above detection structure, and the case should have a geometric position corresponding to the aforementioned test diaphragm Touch for a telecommunications connection. 6. If the structure of the telecommunication detection module of item 5 of the patent application is applied, the detection structure of the upper plate may be contacted by an electronic device with a single or multiple elastomer junctions. 1220695 _ 本 j_______ 6. Scope of patent application 7. According to the telecommunication detection module structure of item 5 of the patent application scope, the detection structure lower plate may be provided with a single or a plurality of test holes to accommodate the above electronic devices. 8. The telecommunication detection component structure according to item 5 of the scope of patent application, wherein the lower part of the detection structure may be provided with a single or a plurality of telecommunication external structures to connect the electronic signals of the electronic device to the outside during the test.