1220563 五、發明說明（l) 【發明所屬之技術領域】 本發明係有關一種發光二極體封裝技術，特別係指一 種白光發光二極體之封裝結構及其封裝方法。 【先前技術】 一般發光二極體（LED)之封裝係使用移轉注模成型 (transfer molding)或液狀點膠封止之方式進行。移轉注 模成型係目前使用最普遍的製程，其係將已黏設有LED晶 片及導線之印刷電路板（printed circuit b〇ard，pcb)或 金屬片（metal frame)先置放於移轉成型模的鑄孔 (cavity)中，再利用擠製桿（ram)將預熱軟化的固態粒狀 環氧樹脂壓注入移轉模的鑄孔中，經加熱使環氧樹脂原料 產生硬化反應，即完成模封程序，而後再進行切單成為複 數個LED封裝元件。然而，對於小尺寸LED產品而言，由於 移轉注模成型製程的原料運送槽很長，使得原料&費在此 槽中很多，而具有浪費原料之缺失；#者，在填充鑄模原 料的過程中，必須精確控制擠製桿的壓力與原料流動速 度，若控制不當則易壓倒導線或造成短路，具有製程複雜 而不易控制之缺失。 而液狀點膠封止係使用常溫呈液狀之封止 (encapsulation)材料，利用點膠機點滴環氧樹脂於led基 片士 ’ J經加溫烘烤使點膠凝固而成型，液狀點膠封止加 工雖不南模具，具有加工簡易及價格低廉之 表面不易控制且產出效率遠不及模封製程、此 季父不晋及。 第5頁 1220563 五、發明說明（2) 另一方面，於製作白光LED封裝元件時，移 型法及點膠封止法之原料係分別使用固態含磷光劑環氧成 脂及液態含磷光劑環氧樹脂，但不論係採何種方法封 裝，最後之封裝結構皆係一基板1〇上設有一LEJ)晶粒12，' 且在LED晶粒12上覆蓋一磷光劑及環氧樹脂之混合層“， 如第-圖所示，由於磷光粒子16係分散在環氧樹脂曰 18中而 非密集地披覆在LED晶粒12上，因此LED晶粒12之光色茂漏 率較高。 '/馬 因此，本發明係針對上述之種種問題，提出一種 一極體封裝結構及其封裝方法，以有效克服習知之該等缺 【發明内容】 本發明之主要目的，係在提供一種發光二極體封裝結 構及方法，藉由液態含磷光劑膠體的使用，在内模中允3 磷光劑沈殿覆蓋於led晶粒上，以有效降低LED之光色洩^ 率，進而改善習知磷光粒子分散在封裝膠體中而具有漏杏 率高之缺失者。 、、疋 、本發明之另一目的，係在提供一種發光二極體之封裝 方法，其係使用鑄模法模封led，以塑造出尺寸固定的led 兀件’進而提供光譜範圍穩定之白光!^〇，以解決習知封 裝尺寸不易控制而衍生之光譜偏移問題，故具有使白光 LED發光光色精準之功效。 、、本發明之又一目的，係在提供一種發光二極體之封裝 方法’具有尺寸規格化、良率高且適用於製作大尺寸外模 mm 第6頁 12205631220563 V. Description of the invention (l) [Technical field to which the invention belongs] The present invention relates to a light emitting diode packaging technology, and particularly to a white light emitting diode packaging structure and a packaging method thereof. [Prior art] The packaging of general light-emitting diodes (LEDs) is performed using transfer injection molding or liquid dispensing sealing. Transfer injection molding is currently the most common manufacturing process, which involves placing a printed circuit board (pcb) or metal frame (metal frame) on which LED chips and wires have been adhered. In the cavity of the mold, the extruded rod (ram) is used to inject the preheated and softened solid granular epoxy resin into the casting hole of the transfer mold, and the epoxy material is hardened by heating. That is, the molding process is completed, and then singulation is performed to form a plurality of LED packaging components. However, for small-sized LED products, the raw material transport groove for the transfer injection molding process is very long, so that the raw material & costs are much in this groove, and there is a lack of wasted raw materials; In the process, it is necessary to precisely control the pressure of the extrusion rod and the flow speed of the raw material. If it is not controlled properly, it will easily overwhelm the wire or cause a short circuit. It has the disadvantage of complicated manufacturing process and difficult to control. The liquid dispensing sealer uses an encapsulation material that is liquid at normal temperature, and uses a dispenser to drip epoxy resin on the LED substrate. J'J is heated and baked to solidify and dispense the liquid. Although the dispensing and sealing process is not a southern mold, it has a simple processing and low-cost surface that is not easy to control and the output efficiency is far less than that of the mold sealing process. Page 5 1220563 V. Description of the invention (2) On the other hand, in the production of white LED packaging components, the raw materials of the transfer method and the dispensing and sealing method are solid epoxy-based phosphorescent agent and liquid phosphor-containing agent, respectively. Epoxy resin, but no matter what method is used for packaging, the final packaging structure is a substrate 10 with a LEJ) die 12, and the LED die 12 is covered with a mixture of phosphor and epoxy The layer ", as shown in Fig.-, Since the phosphorescent particles 16 are dispersed in the epoxy resin 18 instead of densely covering the LED die 12, the light color leakage rate of the LED die 12 is high. '/ Therefore, the present invention is directed to the above-mentioned problems, and proposes a monopolar package structure and a packaging method to effectively overcome the conventional shortcomings [Abstract] The main purpose of the present invention is to provide a light-emitting diode. The polar package structure and method, through the use of liquid phosphor-containing colloid, allows 3 phosphorescent agent Shen Dian to cover the LED crystal grains in the inner mold, so as to effectively reduce the light color leakage rate of LED ^, and then improve the conventional phosphorescent particles Dispersed in the encapsulant with leakage The missing person with high apricot rate. Another object of the present invention is to provide a method for packaging a light emitting diode, which uses a casting method to mold the LED to form a fixed size LED element. Provide white light with stable spectral range! ^ 〇, in order to solve the problem of spectral shift that is derived from the difficult to control the conventional package size, so it has the effect of making the white LED's light color accurate. Another object of the present invention is to provide A packaging method of light-emitting diodes with standardized size, high yield, and suitable for making large-size outer mold mm Page 6 1220563
產品之優點。 本發明之再一目的，将描板 _ 之抖驻士1 Z 係徒供一種可充分實用封裝原料 之封裝方法，達成節省原料之功 成本。 从進而可有效降低封裝 為達到上述之目 膠體為原料進行發光 體溶液飽和而令磷光 一基板及其上之一發 包覆有一填光介質層 且於該封裝膠體底部 搬層係緊密覆蓋於發 底下藉由具體實 容易瞭解本發明之目 效0 的，本發明 二極體之封 劑沉澱，進 光二極體單 ’此填光介 沉搬有一磷 光二極體單 施例配合所 的、技術内 以模鑄 裝，且 而使封 元，在 質層係 光劑沉 元上。 附的圖 容、特 態含磷光劑 過程中使膠 之結構包括 發光二極體單元外 封裝膠體， 使磷光劑沉 法及液 於封裝 裝完成 包含一 澱層， 式詳加 點及其Advantages of the product. Yet another object of the present invention is to provide a packaging method that can fully and practically package raw materials by using the tracing plate _Zhuo Zhushi Shi 1 Z to achieve savings in the cost of raw materials. From this, it can effectively reduce the encapsulation to achieve the above-mentioned colloid as the raw material to saturate the luminous body solution, so that the phosphorescent substrate and one of the hairs are coated with a light-filling medium layer, and the layer at the bottom of the packaging colloid is closely covered with the hair The objective of the present invention is easy to understand below. The sealing agent of the diode of the present invention precipitates and enters the photodiode sheet. This light-filling medium contains a phosphorescent diode sheet. The inner part is cast with a mold, and the sealing element is placed on the layer-based lightening agent Shen Yuan. Attached picture, special state phosphor-containing agent The structure of the glue in the process includes the light-emitting diode unit outside the packaging colloid, so that the phosphor deposition method and the liquid package are completed. The package contains a deposit layer.
說明，當更 所達成之功 【實施方式】 本發明之發光二極體（led)模封技術係以液體含磷光 劑（Phosphor)膠體為模封原料，利用鑄模法且基於液體飽 和之固體沈殿凝固原理，製作出LED封裝結構。Explanation: When the achievement is achieved [Embodiment] The light-emitting diode (LED) molding technology of the present invention uses a liquid phosphor-containing colloid (Phosphor) colloid as the molding raw material, using a casting method and a liquid-saturated solid Shen Dian The solidification principle makes an LED package structure.
、請參第二圖所示，為本發明之發光二極體封裝結構的 2視圖’一LED封裝元件20係包括一基板22，該基板22通 常為印刷電路板（printed circuit board，PCB)或金屬架 (metal frame)，在基板22上安裝有一發光二極體（LED)單 兀，其係為一LED晶粒24，且有一磷光介質層26披覆在基 板22上以包覆該LED晶粒24，另有一外部封裝膠體32包覆Please refer to the second figure, which is a 2 view of the light emitting diode package structure of the present invention. An LED package component 20 includes a substrate 22, which is usually a printed circuit board (PCB) or A metal frame, a light emitting diode (LED) unit is mounted on the substrate 22, which is an LED die 24, and a phosphorescent dielectric layer 26 is coated on the substrate 22 to cover the LED crystal Granules 24, and an outer encapsulant 32
Ιϋϋ 第7頁 1220563 五、發明說明（4) 在磷光介質層26外；其中該磷光介質層26如 係包3 裝膠？28 ’且於封裝膠體28底部沉澱有-磷光 。該封裝膠體28及外部封裝膠體32之材料 氧樹知（epoxy)，而磷光劑沉澱層則係由磷微粒所組成， 2用磷微粒及固定頻率發光體所發的光相互折射而發出 別ί!知技術將磷光粒子分散在封裝膠體中之結構 由將磷光劑沉澱於封襄膠體底部，以藉 此使磷先粒子緊密排列而密集地披覆在LED單元12上進 而可有效降低LED單开1?夕：ϋ士 色浪漏率高之問題 率’改善習知結構光 遂用ί:ί t發明之封裝結構後’接續將詳細說明本發明 ί = ϊ 飽和凝固原理製作此封裝結構之方法， 相：=第四圖所示’係為本發明之封裝流 ==裝係、包括下列步驟：首先，如步細所 為已i装右；、一鑄模及模封原料，其中該LED基板係 I ^ ED晶粒者，且該等LED晶粒係電連接至基 3^，所’Λ 如第五圖所示，係、由二上、下模具34、 設有在下。模具34’相對於上模具34之内表面係凹 某板上之 > 一成型單疋36，每一等成型單元36係對應led 常係為環氧樹p =體均句混合而組成’該封裝膠體通 衣乳树爿曰’且磷光劑通常係為磷微粒。Ιϋϋ Page 7 1220563 V. Description of the invention (4) Outside the phosphorescent medium layer 26; where is the phosphorescent medium layer 26 filled with glue? 28 ', and -phosphorescence is deposited on the bottom of the encapsulant 28. The materials of the encapsulating colloid 28 and the outer encapsulating colloid 32 are epoxy, and the phosphor deposition layer is composed of phosphor particles, and the light emitted by the phosphor particles and the fixed-frequency light emitting body is refracted to each other to emit light. The structure of the known technology that disperses phosphorescent particles in the encapsulating colloid is by depositing a phosphorescent agent on the bottom of the colloidal colloid, so that the phosphorous particles are closely arranged and densely covered on the LED unit 12, which can effectively reduce the single opening of the LED. 1? Xi: The problem rate of the high leak rate of the fighters' color is to improve the conventional structure, and then use the package structure invented: ί t will continue to explain the invention in detail = = ϊ saturated solidification principle to make this package structure method Phase: = shown in the fourth figure is the package flow of the present invention = = installation system, including the following steps: First, as shown in the step has been installed on the right ;, a mold and molding material, where the LED substrate system I ^ ED grains, and these LED dies are electrically connected to the base 3 ^, so 'Λ is shown in the fifth figure, the system consists of two upper and lower molds 34, which are arranged below. The inner surface of the mold 34 'relative to the upper mold 34 is concave on a certain plate> A molding unit 36, each molding unit 36 is corresponding to the LED, which is usually composed of an epoxy tree p = body equal sentence mixture. The encapsulating colloidal coat is said to be lactose, and the phosphorescent agent is usually a phosphor particle.
“由磷1劑模封原料則為一含磷光劑膠體， 第8頁 1220563 五、發明說明（5) 在備女L E D基板、鐘jr -- L. . ς19张-, 缉模及模封原料之後，接者如步驟 相二矣 合第五圖，先在上、下模具34，之 面为別噴塗脫模油，再將LED基板38具有咖晶 楚τ 面朝下且將其安置於下模具34,之凹槽40内，使該 晶粒對應下模具34,之該等成型單元36，接著旋鎖 固將上、下模具34、34,鎖固在一起。 鎖 在鎖固該鑄模之後，即如步驟S14所示，先將鑄模預 熱至一適當溫度，接下來，便進行步驟S16，將一液態之 含磷光劑膠體經由鑄模之填充流道42填入於鑄模内部、而填 滿該等成型單元36，之後並如步驟S18般，進行消除膠體、 氣泡之步驟，此消泡步驟通常係在一自動真空/氣壓烤箱 中進行’使用所而預疋數據而設定不同真空、氣壓、溫度 及時間條件，利用真空抽氣來消除膠體中之氣泡。 在完成消泡步驟後，即進入步驟S20，同時配合第六a 圖及第六β圖所示，令該含磷光劑膠體44成為飽和狀態而 使磷光劑46沉澱，進而使原本分散於膠體中之磷光劑46沉 氣而覆盡於該等LED晶粒24上。其中’使含鱗光劑膠體4 4 呈飽和之方法係使用某溫度而令含磷光劑膠體44中之鱗微 粒下降，進而利用地心吸力允許磷微粒下沈於膠體底部而 覆盖於LED晶粒24上’而溫度及時間係依據含鱗光劑膠體 44的膠體濃度及磷微粒密度而確定，且必須一併考量%模 流動槽的大小尺寸來決定。 ' 接著，如步驟S22所示’加熱該液態含鱗光劑膠體， 使液態之膠體部分產生固化反應（curing)而硬化，在完成 1220563 五、發明說明（6) yn步驟之後’即可打開缚模，如步驟s24所示，取 出模：裝之LED基板’並清洗LED基板上之脫模油， 即可付到一模封led基板。 在製作得到該模封LED基板之後，更可如步驟S26所 示，進行外模封裝作業，其係利用前述模鑄法在已硬化之 含磷光劑膠體外再形成一外部封裝膠體，其封裝方法係類 似於上述步驟Sl〇至S24，不同處係省除步驟S2〇之沉澱步 驟，且外部封裝膠體為一單相液體，常用者為環氧樹脂。 最後，在完成LED基板之内模及外模封裝之後，即如 步驟S28所示，以每一LED晶粒為單位進行切單作業，將封 模之LED基板切割分成複數個LED封裝元件，如此即成完整 個封裝流程’進而得到一具有麟光層之LED封裝元件。 在本發明之封裝方法中，由於鑄模係具有一定的尺寸 規格，故能塑造出尺寸固定的LED產品，而白光led需要有 一特定的尺寸才能產生一特定光譜的白光，因此本發明係 可有效解決習知封裝尺寸不易控制的問題，而改進產品良 率’同時更適合製作大尺寸外模的產品，具有尺寸規格化 及發光光色精準之優點。另一方面，由於本發明係捨棄習 知移轉注模成型法，故可充分實用原料到9〇%程度，比習 知使用轉換模具技術約多出30%以上的原料實用率，具有 卽省原料之功效，進而可有效降低封裝成本。 以上所述係藉由實施例說明本發明之特點，其目的在 使熟習該技術者能暸解本發明之内容並據以實施，而非限 定本發明之專利範圍，故，凡其他未脫離本發明所揭示之 1220563 五、發明說明（7) 精神所完成之等效修飾或修 請專利範圍中。 圖號說明： 10 基板 12 14 混合層 16 18 環氧樹脂 20 LED封裝元件 22 24 L E D晶粒 26 28 封裝膠體 30 32 外部封裝膠體 34 34, 下模具 36 38 LED基板 40 42 填充流道 44 46 磷光劑 改，仍應包含在以下所述之申 L E D晶粒 填光粒子 基板 磷光介質層 磷光劑沉澱層 上模具 成型單元 凹槽 含磷光劑膠體"The moulding raw material from 1 phosphor is a colloid containing phosphor. Page 8 1220563 V. Description of the invention (5) In preparing female LED substrates, clock jr-L.. Σ 19 sheets-, moulding and moulding raw materials After that, as shown in the second step, the first step is to combine the fifth figure. First, spray the mold release oil on the upper and lower molds 34, and then place the LED substrate 38 with the coffee crystal τ facing down and set it down. In the groove 40 of the mold 34, the die corresponds to the forming units 36 of the lower mold 34, and then the upper and lower molds 34 and 34 are locked together by screwing. After locking the mold That is, as shown in step S14, the mold is preheated to an appropriate temperature first, and then step S16 is performed, and a liquid phosphor-containing colloid is filled into the mold through the filling channel 42 of the mold and filled. The forming units 36 are then subjected to the steps of removing colloids and air bubbles as in step S18. This defoaming step is usually performed in an automatic vacuum / pressure oven to pre-set the data and set different vacuum, air pressure, Under temperature and time conditions, vacuum extraction is used to eliminate air bubbles in the colloid. After the defoaming step is completed, the process proceeds to step S20. At the same time, as shown in the sixth a diagram and the sixth beta diagram, the phosphor-containing colloid 44 is saturated, and the phosphor 46 is precipitated, thereby dispersing the original phosphor in the colloid. The phosphorescent agent 46 sinks and covers all of the LED crystal grains 24. The method of 'saturating the colloid-containing colloid 4 4 is to use a certain temperature to reduce the scale particles in the phosphor-containing colloid 44 and then use The gravity attraction allows the phosphorus particles to sink to the bottom of the colloid and cover the LED crystal grains 24 '. The temperature and time are determined according to the colloidal concentration of the colloid 44 and the density of the phosphorus particles, and the% mode flow must be considered together. The size of the groove is determined. 'Next, as shown in step S22', the liquid scale-containing colloid is heated to cause a curing reaction (curing) of the liquid colloid to harden. After completion of 1220563 V. Description of the invention (6) yn After the steps, 'the mold can be opened, as shown in step s24, take out the mold: mounted LED substrate' and clean the mold release oil on the LED substrate, you can pay a molded LED substrate. The molded LED After the substrate, more As shown in step S26, the outer mold encapsulation operation is performed, which uses the aforementioned mold casting method to form an outer encapsulation colloid outside the hardened phosphor-containing colloid. The encapsulation method is similar to the above steps S10 to S24, except for the difference The precipitation step in step S20 is omitted, and the outer packaging colloid is a single-phase liquid, and epoxy resin is commonly used. Finally, after the inner mold and outer mold packaging of the LED substrate is completed, as shown in step S28, Each LED die is singulated, and the sealed LED substrate is cut into a plurality of LED packaging components. This completes the packaging process. Thus, an LED packaging component with a light layer is obtained. In the packaging method of the present invention, since the mold system has a certain size specification, a fixed-size LED product can be molded, and a white LED needs a specific size to generate a specific spectrum of white light. Therefore, the present invention can effectively solve the problem. It is familiar with the problem that the package size is not easy to control, and improving the product yield rate is also more suitable for making large-size external mold products. It has the advantages of size standardization and accurate light color. On the other hand, since the present invention abandons the conventional transfer injection molding method, it can fully use raw materials to about 90%, which is about 30% more raw materials than the conventional technology using conversion molds. Effect, which can effectively reduce packaging costs. The above is the description of the features of the present invention through the examples. The purpose is to enable those skilled in the art to understand the contents of the present invention and implement them accordingly, rather than to limit the patent scope of the present invention. Disclosed 1220563 V. Description of the Invention (7) The equivalent modification or repair completed by the spirit is within the scope of the patent. Description of drawing number: 10 substrate 12 14 mixed layer 16 18 epoxy 20 LED package element 22 24 LED die 26 28 package gel 30 32 external package gel 34 34, lower mold 36 38 LED substrate 40 42 filling runner 44 46 phosphorescence The agent modification should still be included in the below-mentioned LED die-filled particle substrate phosphorescent medium layer phosphorescent agent deposition layer on the mold forming unit groove phosphor-containing colloid
1220563 圖式簡單說明 第一圖為習知白光LED封裝元件之結構剖視圖。 第二圖為本發明之發光二極體封裝結構的剖視圖。 第三圖為第二圖之局部放大剖視圖。 第四圖為本發明之封裝流程圖。 第五圖為本發明安裝LED基板於鑄模内之示意圖。 第六A圖及第六B圖為本發明於進行飽和凝固步驟之結構剖 視圖。1220563 Brief description of the drawings The first diagram is a cross-sectional view of the structure of a conventional white LED package component. The second figure is a cross-sectional view of a light emitting diode package structure of the present invention. The third figure is a partially enlarged sectional view of the second figure. The fourth figure is a packaging flowchart of the present invention. The fifth figure is a schematic view of mounting an LED substrate in a mold according to the present invention. Figures 6A and 6B are cross-sectional views of the structure of the present invention during the saturation solidification step.
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