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备明所屬之技術領域 微押為一種積體電路之檢測方&，尤指-種藉由-^$來驅動—高準位電M與—低準位電虔至—待 體電路之接腳以進行測試之檢測方法。 、 先前技術 由於電子產業競爭之劇 一便是要降低產品之成本， 電路（Integrated Circuit， 積體電路之晶粒以COB (Chip 刷電路板上。然而此種生產 程中，可能會導致打線之脫 為成品前未將此不良品淘汰 w式成本，因此如何研擬一套 短路檢測法，便成為一個重 習用之積體電路開短路 機台作測試，徒然增加了許 爰是之故，申請人有鏗 試驗與研究，並一本鍥而不 體電路之檢測方法」。 烈，廠商為爭取 因此許多系統商 I C)之封裝成本， On Board)方式 方式在積體電路 落或打線間短路 ，則會增加不必 快速方便又有效 要的課題。 檢測法乃是以昂 多生產成本。 於習知技術之缺 捨的精神，終發 利潤，方法之 為了節省積體 於生產時將 直接打線在印 打線及封膠過 ，若是在組裝 要之材料及測 之積體電路開 貴的自動測試 失，乃經悉心 明出本案「積The technical field of Beiming belongs to the detection method of integrated circuits, especially-a type driven by-^ $-high-level electricity M and-low-level electricity M-to the circuit of the body Foot for testing. 1. The previous technology due to the competition of the electronics industry is to reduce the cost of the product. The integrated circuit (Integrated Circuit, the chip of the integrated circuit is COB (Chip brush circuit board). However, in this production process, it may lead to The W-type cost of this defective product has not been eliminated before being taken off as a finished product. Therefore, how to develop a short-circuit detection method has become a re-used integrated circuit to open and short-circuit the machine for testing. People have experiments and research, and they do n’t have a test method for the body circuit. ”Lie, in order to fight for the packaging cost of many system vendors, the On Board method is used to short circuit between the integrated circuit or the wiring. This will increase the number of topics that do not have to be fast, convenient, and effective. The test method is based on the high production cost. In the spirit of the lack of know-how, the final profit is the method. In order to save the product, it will be directly printed on the line and sealed in the production. If it is assembled in the required materials and tested the integrated circuit expensive automatic The test failed, after carefully knowing that
發明内容 測 本案之主要目的係藉由微控制 積體電路之接腳，利用積體電路 恭來驅動電壓準位至待 之輸出入接腳有加保護SUMMARY OF THE INVENTION The main purpose of this case is to control the pins of the integrated circuit by micro-control, and use the integrated circuit to drive the voltage level to the input and output pins to be protected.
第4頁 1220173 五、發明說明⑵ ' ^ 二極體之特性，進行簡易方便快速之積體電路開路或翅 檢測， 本案之另一目的係為提供一種積體電路之檢測方法 其係藉由一微控制器來驅動一高準位電壓與一低準位電壓 至一待測積體電路之接腳以進行測試，而該方法之步驟t έ (a)该微控制器驅動該高準位電壓至該待測積體電路之 接地接腳；（b )該微控制器分別讀入該待測積體電路之其 輸出入接腳及電源接腳之電位，以判斷那一隻接腳呈現 路狀悲；（c )該微控制器驅動該高準位電壓至該待測積體^ =之一待測輸出入接腳及驅動該低準位電壓至該待測辦 之ϊ i ΐ地接腳；（d)該微控制器分別讀入該待測積體電路 =腳與該待測輸出入接腳呈現短路狀態， :該電源接腳是否與該接地接腳呈現短路狀’、 Γ二步驟⑷，以對該待測積體電路ΐ所 動該高準位電壓至該待測積體電路之，（j忒楗控制器驅 準位電壓至該待測積體電路之接地接Λ、接腳及驅動該低 為分別讀入該待測積體電路之 ，以及（g)該微控制 判斷那一隹妗屮人技脱如# 所有輸出入接腳之電位，以 二康該電源接腳呈現短路狀態。 入之電位為低電位，則該接腳俜呈現’若該微控制器讀 根據上述構想，其中該步;(呈d\開路狀態。 入之輪出，入接腳之電位為高電位（d)中，若該微控制器讀 則違輸出入接腳與該待Page 4 1220173 V. Description of the invention ⑵ ^ Characteristics of diodes for simple and convenient open circuit or fin detection of integrated circuits. Another object of this case is to provide a method for detecting integrated circuits. A microcontroller to drive a high-level voltage and a low-level voltage to the pins of an integrated circuit under test for testing, and step of the method t (a) the microcontroller drives the high-level voltage To the ground pin of the circuit under test; (b) the microcontroller reads the potentials of the input and output pins and the power pin of the circuit under test to determine which pin is present (C) the microcontroller drives the high-level voltage to the product under test ^ = one of the I / O pins to be tested and drives the low-level voltage to the ϊ i ΐ ground of the test (D) the microcontroller reads the circuit of the product under test = the pin and the input / output pin under test are in a short-circuit state, whether the power pin and the ground pin are in a short-circuit state; Step ⑷, moving the high-level voltage to the circuit under test to the circuit under test (J 忒 楗 The controller drives the level voltage to the ground connection Λ, pin and drive low of the integrated circuit under test to read the integrated circuit under test, and (g) the micro-control judges that一 隹 妗 屮 人 技 脱 如 # The potential of all the input and output pins, the power pin of Erkang presents a short-circuit state. If the input potential is low, the pin appears as' If the microcontroller reads according to the above Conceived, this step; (shown as d \ open circuit state. The input is in and out, and the potential of the input pin is in high potential (d). If the microcontroller reads it, it will violate the input and output pins and the waiting state.
|爆上述構想，其中該步 ^ 五、發明說明（3) 測輸出入接腳呈現短路狀態。 根據上述構想，其中該步 人之該電源接腳之電位為低電位⑷中’若該微控制器讀 該電源接腳係與該接則該待測輸出入接腳或 根據上述構想，其中短路狀態。 入之輸出入接腳之電位為高電位g中★，若該微控制器讀 電源接腳呈現短路狀熊。 、°亥輸出入接腳係與該 其係藉由-微控制器來驅二含J積體電路之檢測方法， 至複數個待測積體電路以進行=位^與-低準位電壓 j複數個類比開關與該等待測積體路=微控制器係透 步驟包含（a)該微控制器切換至兮電路電連接，該方法之 以選擇該等待測積體電路其中之^類，開關其中之-， 器驅動該高準位電壓至該待測積體3 : J :則;⑻該微控制 微控制器分別讀入該待測積體電=接腳加該 源接腳之電位，以判斷那一隹 ，、他輸出入接腳及電 控制器驅動該高準位電壓至：待“ = 該微 入接腳及驅動該低準位電壓至該洌待測輸出 :加該微控制器分別讀入該待測積 =地接 接腳及電源接腳之電位，以判斷那」隹=其他輸出入 測輸出入接腳呈現短路狀態；：出二接腳與該待 該電源接腳是否與該接地接腳呈==輸出二接腳或 ⑷至步驟(e)，以對該待測積體;Ί)重覆步驟 -進行短路狀態之判斷;(g)該微控制器以 五、發明說明（4) 測積體電Ϊ :，接腳及驅動該低準位電壓至該待 體電路之所有= 該微控制器分別讀入該待測積 腳盥訪φ、有輸出入接腳之電位，以判斷那一隹輪屮X # ，、μ電源接腳呈現短能又 接 驟（h)，以對哕辇锌、目丨技狀心，及Cl)重覆步驟（a)至步 根據上4=積 入之電位為低電彳目7以v ^(c)中，右該微控制器讀 根據上 入之輸出入接腳之電 =^ 右-玄U控制器讀 測輸出入接腳呈現短路=電位’則該輸出入接聊與該待 根據上述構想，其中 + » 入之該電源接腳之電位ϋ j (e)中，右該微控制器讀 該電源接腳係盥該接垃-電位，則該待測輸出入接腳或 根據上述構：接 入之輸出入接腳之電位為^雷^ ^右°亥极控制器讀 電源接腳呈現短路狀態：冋“立’則該輸出入接腳係與該 其係ί 2供-種積體電路之檢測方法， 位電壓與一低準：電； = 制器來驅動一高準 中該待測積體電路之電娜，、丨貝-電路以進行測試，其 接腳係電連接於哕主腳、接地接腳、及部分輸出入 出入接腳係電連;===該待測積體電路之其他輸 ^ ^ ^,.. ,1; ^ ^ /；7· r"^ 接地接腳;⑻該主微控制 “待接 电逆接於该主微控制 五、發明說明（5) 器之該待測積體電路之輸出入 判斷那-隻接腳呈現開路狀態，·⑷該主微；：=立，以 微控；f分別讀入電連接於該副微控制器二該副 態，而該副微控制器再將檢測回；；：=路狀 制器之該待測積體電路之— 接於该主锨控 位電壓至該待測積體電路槌二二妾腳及驅動該低準 入接腳及電源接腳i;:，:寺測積體電路之其他輪出 待測輸出入接腳呈現短路狀態，並判腳與該 或該電源接腳是否與該接地接腳呈現=出=腳 控制器通知該副微控制器分 狀怎，（〇该主微 之該待測積體電路之輸出入接腳之電位控= 出入接腳與該待測輸出入接腳呈 =η畊那一隻輸 制器再將檢測結$回傳至該主微=舌而該副微控 至步驟（f)，以對雷、查拉认—μ益’（g)重覆步驟（d) 路之所有輸出入接腳逐一進路控制器之該待測積體電 控制器將控制權交給該副 副微控制器」== 該副微控器之該待分別讀入電連接於 該副微控制器通知該主微控制器分別 五 押發明說明⑹ _— _ j器之該待測積體 ±隻輪出入接腳盘該待=出入接腳之電位，以判斷那 主礅控制器再將檢測钍杲輸^入接腳呈現短路狀態，而該 ，器將完整檢===該副微控制器'•⑴該副微 步驟⑴至步驟⑴，J 主微控制器；以及⑷重覆 積體電路之所有輸出：妾：泫副微控制器之該待測 根據上述構相，i —進行短路狀態之判斷。 讀入之電位為低;二中，若該主微控制器 根據上述構想，腳係呈現開路狀態。 讀入之電位為低電位？ 中，若該副微控制器 根據上述構雄，复中腳係呈現開路狀態。 讀入之輪出入接;之電：：=)，中二若該主微控制器 待測輸出入接腳呈現短路狀能。 則5亥輸出入接腳與該 根據上述構想，其中 + 讀人之該電源接腳之電二雷』中，若該主微控制器 或該電源接腳係與該接地接腳= 豆：Γ!測輸出入接腳 &入ΐϊΐ述構想’其中該步驟⑴中， 待測輸出入接腳呈現短路1熊。，則該輸出入接腳與該 讀人之==(广’若該 待測輸出入接腳呈現短路^電位1該輸出入接腳與該 讀入，其中該步驟(k)，，若該主微控制哭 輸出入接腳之電位為高電位，則該輸出入接腳:該 1220173 五、發明說明（7) 待測輸出入接腳呈現短路狀態 實施方式 法係(广rTed Clrcuit，Ic)之檢測方 性，作為本案檢測方法之基礎，可以瘦二極體之特 積體電路(較佳實施例-），或是以—微押：益檢測-顆 體電路(較佳實施例二），或是以複 檢測數顆積 接腳數目較多之積體電路(較佳 三，：器檢測-顆 式如以下所述： —^ ’其詳細實施方 較佳實施例一 本實施例係為以一微控制器檢測一 方法，其係藉由一微控制器來驅動一高準：之檢測 位電壓至一待測積體電路之接腳以進行測包低準 一圖所示，其中該待測積體電路12係、具有L内；=如第 121 ~第一圖所示之架構係以2隻輸出入接腳ι〇ι°、丨⑽ =，右輸出入接腳大於2隻，則檢試方法依下述方式類”、、 、首先，透過該微控制器11驅動該高準位電壓Vh至該 測積體電路12之接地接腳GND，則該待測積體電路12 γ ’ 接腳及102接腳將呈現一 vh-diode壓降（約〇· 7V)之高準 位，該待測積體電路12之電源接腳VDd將呈現—Vh—1倍 d 1 ode壓降之咼準位，此時從該微控制器丨丨讀入該待測積 第10頁 五、發明說明（8) 之101接腳、102接腳、及電源接腳⑽之雷付 有(高準V若有任何一隻接腳為低準&，則表干 有接腳開路（open)，因為在該微 i表不 腳加上低電平（PuU-low)電阻。 $ 11知已對項入之接 接著’透過該微控制器丨丨驅動 =電路12之101接腳及驅動：二至二則 路12之接地腳GND，之後從該微控：積體電 電路12之102接腳及電源接㈣電。^入该;^積體 腳之電位應為低準位，若為高準J L此接 接腳短路(short);讀到電“：二又表不102接腳與101 婪盔你、、隹， 貝j电源接腳VDD之電位應為高準位， GND短路1V於則^表示101接腳或電源接腳VDD與接地接腳 接腳是否為人。㈣大於2隻，則繼續㈣其他輸出入 2後，透過該微控制器u驅動該高準位 ==了接腳及驅動該低準位電厂堅至該待測積待： ΐ==腳』ND，之後從該微控制器11讀入該待測 1〇1拉1 及電源接腳VDD之電位，此時讀到 電位應為低準位，若為高準位，則表示丨〇"妾腳 為02接腳短路；讀到電源接腳_之電位應為高準位，若 短路^ ^表不102接腳或電源接腳VDD與接地接腳gnd 輸出入接腳大於2隻，則繼續檢測其他輸出入接 法疋。若輸出入接腳大於2隻，則按照上述方 電愿ΐ動南準位電壓至待測輸出入接腳及驅動低準位 至^寺測積體電路12之接地接腳GND ’然後檢測其他 1220173 五、發明說明（9) 輸出入接腳及電源接腳VDD之準位e 輸出入接腳檢測完成之後疋正確。 動高準位電屡至該待測積體€路12 =過該微控制器η驅 低準位電壓至該待測積體電 f源接腳VDD及驅動 :⑽接腳及!〇2接腳之電位應為： = 續檢查其他輸出入接腳是否/氏出準？腳大於2 ^ 檢測出任何一隻接腳開：否二依照上述方法可以 及疋任何2隻接腳短路。 較佳實施例二 測方i實ϊγ”以一微控制器檢測複數顆積體電路之> 其係精由一微控制器來驅動 ：， =位電壓至複數個待測積體電路之接腳以進:、低 =控制器係透過複數個類比開關與該等待測積體 2 ’其架構如第二圖所示，其中該等待測積體電路。 i 一係具有一内部電路241、251。第二圖所示之年播 =以2個類比開關22、23與2顆待測積體電路24、託=構 :待測積體電路顆數大於2顆，則類比開關之數目也必， 專量增加。本實施例之檢測方法係以較佳實施例一之Θ 方法為基礎，同時利用類比開關快速切換之優點，取=领 換速度較慢之繼電器，用以增快檢測速度與提昇可靠户刀 並且可以檢測複數顆積體電路，使得檢測效率大為提=’ 其檢測方法如下所述： 外。 首先，該微控制器21切換至第一類比開關22以選擇對 第12頁 1220173 五、發明說明（ίο) :二1寺測積體電路24進行檢測（II由發送致能信號EN1至該 ί 了 Ϊ 關22來達成）。之後即開始進行檢測，檢測方 :ίΪί貫施例一相同。檢測完成之後，該微控制器21再 :1 Λ類比開關23以選擇對第二待測積體電路25進行 k測（错由發送致能信號ΕΝ2至該第二類比開關23來達 i電：:以二亦與較佳實施例—相同。若欲對第三顆積 體電路進饤檢測，則依上述方法類推。 較佳實施例三 若是待測 時測試所有的 待測積體電路 施例三之架構 器3 1、3 2檢測 法，其係藉由 動一高準位電 腳以進行測試 接地接腳GND ' 主微控制器3 1 I03、I 〇4 係電 示，其中該待 測方法如下所 測試是否 壓至該待測積 積體電路之接腳太多，以一微控制器無法同 接腳，則可使用2顆以上的微控制器來對此 進1檢測。請參閱第三圖，其係本案較佳實 不思圖，較佳實施例三係為以複數個微控制 一顆接腳數目較多之積體電路3 3之檢測方 =主微控制器3 1及，至少一副微控制器3 2來驅 壓與一低準位電壓至一待測積體電路3 3之接 ’其中該待測積體電路33之電源接腳VDD、 、及部分輸出入接腳101、1〇2係電連接於該 ’ 6亥待測積體電路3 3之其他輸出入接腳 連接於該副微控制器32，其架構如第三圖所 測積體電路3 3係具有一内部電路3 3 1。其檢 述： 八 開路時，由該主微控制器3 1驅動該高準位電 體電路33之接地接腳GND，之後檢測其他接| Exploit the above idea, where this step ^ V. Description of the invention (3) The test input and output pins are short-circuited. According to the above concept, wherein the potential of the power pin of the step is low potential, if the microcontroller reads the power pin is connected to the pin, then the I / O pin under test or according to the above concept, where short circuit status. The potential of the input I / O pin is at high potential g. If the microcontroller reads the power supply pin, it will be short-circuited. The I / O pins are connected to the J-integrated circuit by using a -microcontroller to detect the J-integrated circuit, to a number of integrated circuits to be tested for = bit ^ and -low-level voltage j The plurality of analog switches are connected to the waiting-measurement body circuit through the micro-controller. The steps include (a) the microcontroller is switched to the electrical circuit of the circuit. The method is to select one of the waiting-measurement circuit circuits, the switch. Among them-, the device drives the high-level voltage to the product under test 3: J: then; 微 the micro-controller reads the voltage of the product under test = pin plus the potential of the source pin, To determine which line, his I / O pins and the electrical controller drive the high-level voltage to: To be "= the micro-input pin and drive the low-level voltage to the 洌 test output: add the micro-control The device reads the potential of the product to be tested = the potential of the ground pin and the power pin to determine that "隹 = other I / O test I / O pins are short-circuited ;: the second pin and the power pin to be tested Whether it is equal to the ground pin == output two pins or go to step (e) to the product under test; Ί) Repeat the steps-go Judgment of the road status; (g) The micro-controller uses five, descriptions of the invention (4) Measure the body's voltage:, pins and drive the low-level voltage to all of the circuit of the body = the microcontroller reads separately Enter the potential of the foot to be tested, φ, the potential of the input and output pins, to determine which wheel X #, the μ power pin shows short energy and then (h), in order to丨 Technical heart, and Cl) Repeat steps (a) to step according to the previous 4 = the accumulated potential is low. Head 7 to v ^ (c), right the microcontroller reads the input and output according to the input. Electricity of the pin = ^ Right-Xuan U controller reads the input and output pins are short-circuited = potential ', then the input and output contacts and should be based on the above concept, where + »the potential of the power supply pin ϋ j ( e), right, the microcontroller reads that the power pin is connected to the potential, then the I / O pin under test or according to the above structure: the potential of the input I / O pin is ^ 雷 ^ ^ Right ° The reading of the power supply pin of the controller is short-circuited: 冋 “Li” means that the input and output pins are connected to the other two kinds of integrated circuit detection methods, the bit voltage and a low standard: electricity; = Controller to drive a Micron ’s circuit of the integrated circuit under test, and the circuit is used for testing. Its pins are electrically connected to the main pin, ground pin, and some I / O pins. Electrical connection; === Other inputs of the circuit under test ^ ^ ^, .., 1; ^ ^ /; 7. r " ^ Ground pin; ⑻ The main micro control The main micro control V. Description of the invention (5) The output of the integrated circuit under test is judged-only the pins are in an open circuit state. · ⑷The main micro ;: = stand by micro control; f read the power Connected to the sub-microcontroller and the sub-state, and the sub-microcontroller will detect it again;: == of the circuit of the integrated circuit under test—connected to the main control voltage to the standby The circuit of the measurable body is malleted, and the low-access pin and the power pin i;:,: The other wheels of the measurable body circuit are short-circuited and the input and output pins are short-circuited. Or whether the power pin and the ground pin are present = out = the foot controller notifies the sub-microcontroller of what is happening, (0 of the output and input pins of the main integrated circuit of the circuit under test) Position control = The input / output pin and the output / input pin to be tested are equal to the output device, and then the tester will return the detection result to the main micro = tongue and the sub micro control to step (f). Lei, Chara acknowledged—μ benefit '(g) Repeat step (d) All the input and output pins of the circuit are routed to the controller one by one. The integrated controller under test will give control to the deputy microcontroller. " == The sub-microcontroller should be read separately and electrically connected to the sub-microcontroller to notify the main micro-controller to separate five bets. Description of the invention Examine the potential of the input and output pins to determine the main controller, and then the detection input and input pins are in a short-circuit state, and the device will complete the test === the sub-microcontroller ' Sub-micro step ⑴ to step ⑴, J main microcontroller; and ⑷ Repeat all outputs of the integrated circuit: 妾: 待 The test of the sub-micro controller is based on the above-mentioned configuration, i — judge the short-circuit state. The read potential is low. Second, if the main microcontroller according to the above concept, the foot system is open. Is the read potential low? In the middle, if the sub-microcontroller is configured according to the above-mentioned configuration, the compound middle leg system is in an open state. Read in and out; electrical :: =), if the main microcontroller is under test, the I / O pins of the main microcontroller will be short-circuited. Then the input and output pins of 5H and the above-mentioned concept, where + reads the electric two thunder of the power pin ”, if the main microcontroller or the power pin is connected to the ground pin = bean: Γ The test input / output pin & input description concept 'wherein in this step, the input / output pin to be tested shows a short circuit. ， The I / O pin and the reader == (Wide 'If the I / O pin under test is short-circuited ^ Potential 1 The I / O pin and the read, where step (k), if the The potential of the I / O pin of the main micro control is high, then the I / O pin: The 1220173 V. Description of the invention (7) The I / O pin to be tested is short-circuited. Implementation method (Guangdong Trc Cluit, Ic) The detection squareness, as the basis of the detection method in this case, can be a thin diode special integrated circuit (preferred embodiment-), or-micro bet: beneficial detection-particle circuit (preferred embodiment 2) Or, it is a complex circuit that detects a plurality of integrated pins (preferably three, the device detection-the type is as follows:-^ ', its detailed implementation is preferred embodiment one this embodiment is In order to detect a method by a microcontroller, a microcontroller is used to drive a Micro Motion: the detection bit voltage to a pin of the integrated circuit under test to perform a test package low accuracy. The product circuit to be tested is 12 series, with L inside; = The architecture shown in Figure 121 ~ the first figure is connected with 2 outputs ι〇ι °, 丨 ⑽ =, the right I / O pin is greater than 2, then the test method is as follows ",,,, First, the microcontroller 11 is used to drive the high-level voltage Vh to the measured product The ground pin GND of the body circuit 12, the γ ′ pin and pin 102 of the integrated circuit under test will present a high level of vh-diode voltage drop (about 0.7V). The power supply pin VDd of 12 will show the level of the voltage drop of -Vh-1 times d 1 ode. At this time, read the product to be measured from the microcontroller 丨 丨 Page 10 V. Description of invention (8) 101 Pins, 102 pins, and power pins are provided. (If any pin in Micro Motion V is Low Accuracy &, the surface of the pin is open. Do not add a low-level (PuU-low) resistor. $ 11 knows that the item is connected and then 'through the microcontroller 丨 drive = 101 pin and drive of circuit 12: two to two road 12 ground GND, and then from the micro control: the 102 pin of the integrated circuit 12 and the power supply are connected. ^ Enter this; ^ the potential of the integrated pin should be a low level, if it is a high-level JL short this pin (short); read ": Secondly, it means that the 102 pin and the 101 greedy helmet, you, 隹, the potential of the power pin VDD should be a high level, GND short 1V and then ^ means that the 101 pin or the power pin VDD is connected to the ground Whether the pin is human. ㈣ If it is more than 2, continue to ㈣ After the other input and output 2, drive the high level through the microcontroller u == the pin and drive the low level power plant to the test. Accumulate: ΐ == pin ”ND, then read the potential of the test 101 and the power supply pin VDD from the microcontroller 11, then read the potential should be low level, if it is high Bit, it means that the pin is shorted on pin 02; read that the potential of the power pin _ should be a high level, if shorted ^ ^ Table 102 or the power pin VDD and ground pin gnd output If there are more than 2 input pins, the other input / output connection methods will continue to be detected. If there are more than two I / O pins, according to the above-mentioned electric power, I would like to move the south level voltage to the I / O pins to be tested and drive the low level to the ground pin GND 'of the Integrator Circuit 12 and then detect 1220173 V. Description of the invention (9) The level of the input / output pin and the power supply pin VDD e The input / output pin detection is completed correctly. Move the high level power to the DUT repeatedly. 12 = drive the low level voltage through the microcontroller η to the DUT f source pin VDD and drive: ⑽ pin and! 〇2 The potential of the pin should be: = Continue to check if other I / O pins are accurate? Pin is greater than 2 ^ Any one of the pins is detected to be open: No 2. Shorten any two pins according to the above method. The preferred embodiment of the second embodiment is to test a plurality of integrated circuits with a microcontroller > which is driven by a microcontroller: = bit voltage to the connection of a plurality of integrated circuits to be tested Foot forward: Low = The controller is connected to the wait-for-measurement body through a plurality of analog switches. The architecture is shown in the second figure, in which the wait-for-measurement body circuit is provided. I The system has an internal circuit 241, 251. The annual broadcast shown in the second figure = 2 analog switches 22, 23, and 2 circuits of the product to be tested 24, bracket = structure: if the number of circuits of the product to be tested is greater than 2, the number of analog switches must also be The specific method is increased. The detection method of this embodiment is based on the Θ method of the first preferred embodiment. At the same time, the advantages of fast switching of the analog switch are used, and the relay with a slower exchange speed is used to increase the detection speed and Promote a reliable household knife and can detect multiple integrated circuits, so that the detection efficiency is greatly improved = 'The detection method is as follows: First, the microcontroller 21 switches to the first analog switch 22 to select the right page 12 1220173 V. Description of invention (ίο): Er 1 Temple Measured Body Circuit 2 4 test (II is achieved by sending the enable signal EN1 to the Ϊ 22 22). After that, the test is started, the test party: Ϊ Ϊ the same as in Example 1. After the test is completed, the microcontroller 21 again: 1 The Λ analog switch 23 selects to perform a k test on the second integrated circuit 25 (by mistake, the enable signal EN2 is sent to the second analog switch 23 to achieve i :: the second is also the same as the preferred embodiment—the same. If the third integrated circuit is to be tested, the analogy is based on the above method. The preferred embodiment three is to test all the integrated circuits under test in the third embodiment. It is to test a ground pin by moving a high-level electrical pin. The main microcontroller 3 1 I03, I 〇4 are electrical indicators, where the method under test is tested as follows: whether it is pressed to the product under test There are too many pins in the body circuit. If a microcontroller cannot have the same pins, you can use two or more microcontrollers to detect this. Please refer to the third figure, which is a better picture of this case. The third preferred embodiment is to use a plurality of micro-controllers to integrate a large number of integrated circuits. The detection side of 3 3 = the main microcontroller 31 and at least one secondary microcontroller 32 to drive the connection with a low level voltage to an integrated circuit 33 to be tested, wherein the integrated circuit to be tested The power supply pins VDD of 33, and some of the input and output pins 101 and 102 are electrically connected to the '6H under test integrated circuit 33. The other input and output pins are connected to the sub-microcontroller 32. The structure of the integrated circuit 3 3 as shown in the third figure has an internal circuit 3 3 1. Its description: When the circuit is eight, the main microcontroller 31 drives the ground pin of the high-level electrical circuit 33 GND, then detect other connections
第13頁 1^20173 五、發明說明（11) :该,：控制器31之接腳之電位是否為高準位，若為 則表不該接腳開路。檢測完成之後，該主微控制器二 > ^ a亥副^控制器3 2檢測接至該副微控制器3 2之接腳之 :是否為高準位’若為低準位，則該副微控制器32告知兮 主微控制器31有開路之情況，其時序如第四圖所示。。/ 測試是否短路時，由該主微控制器3 2電連接於該主微控制器31之該待測積體電路33 = ，輸出入接腳及驅動該低準位電壓至該之 接腳是否有與該待測輸出入接腳短路之情況，=31之 Ϊ制！=制器31通知該副微控制器32檢測接至該副微 巧制益32之接腳之電位是否為低準位， ： 副微控制器32告知該主微控制器31有短路之情況，其：： 如第五圖所示。 、斤 檢測70接至该主微控制器3丨之接腳是否有盥1他 1路玄主微控制器31將控制權交給該副微控 32 ’該副微控制器32驅動該高準位電壓至電連接於該^ Π 32之該待測積體電路33之—待測輸出入接腳广之後 檢測^接至該副微控制器32之接腳之電位是否為低準 位，右為间準位，則表示與該待測輸 ^成之後，該副微控制器32通知該主微控制器31:測；； 該主微㈣器31之接腳Α否有與該 短至 ，該主微控制㈣將㈣結果通知該副微控=3 ^ 後該副微控制器⑽整檢測結果通知該主微控制器3^ ^20173 五、發明說明（12) --- ifϊ法進行檢測，可以檢測出任何2隻接腳短路，其時 吁如第六圖所示。 牡本案之積體電路之檢測方法適用於對單獨積體電路包 二=檢測，也可對積體電路包裝後銲在印刷電路板上之 或是積體電路晶粒以C0B(Chlp 0n B〇ard)方式打線 在I ^刷電路板上之檢測，應用範圍廣泛，可有效生產 法。本貝為一種間易快速有效之積體電路之檢測方 來驅i i: 本案之積體電路之檢測方法藉由微控制器 輸出入接:古立至f測積體電路之接腳，利用積體電路之 ‘體電路門路t f護二極體之特性，進行簡易方便快速之 積體電路開路或短路檢測，有效 故具有產業價值，進而達成發展本案==之缺失疋 飾，缺ί $】：f習此技藝之人士任施匠思而為諸般修 飾“不脫如附申請專利範圍所欲保護者。 圖式簡單說明 第-圖：其係本案較佳 第二圖:其係本案較佳實施例二之；訌：；。 第三圖：其係本案輕社每a ,丨一木構不思圖0 第四圖：其係第2圖夕貝:例二=架構示意圖。 路之時序圖。曰主微控制器通知副微控制器檢測開 第五圖：其係第二a 第—圖之主微控制器通知副微控制器檢測短Page 13 1 ^ 20173 V. Description of the invention (11): This: whether the potential of the pin of the controller 31 is a high level, if it is, it means that the pin is not open. After the detection is completed, the main microcontroller 2> ^ a sub-controller 3 2 detects the pin connected to the sub-microcontroller 32: whether it is a high level. If it is a low level, then the The sub-microcontroller 32 notifies the main micro-controller 31 that there is an open circuit. The timing is shown in the fourth figure. . / When the test is short-circuited, the main microcontroller 32 is electrically connected to the main circuit 31 of the main microcontroller 31 to test the integrated circuit 33 =, the input and output pins and the low level voltage is driven to the pins If there is a short circuit with the I / O pin to be tested, it is controlled by 31! = The controller 31 notifies the sub-microcontroller 32 to detect whether the potential of the pin connected to the sub-microcontroller 32 is at a low level,: The sub-microcontroller 32 notifies the main microcontroller 31 of a short circuit condition, Its: As shown in the fifth figure. Detecting whether the 70 pins connected to the main microcontroller 3 丨 have 1 or 1 Xuan master microcontroller 31 gives control to the sub-microcontroller 32 'The sub-microcontroller 32 drives the Micro Motion The bit voltage is electrically connected to the test circuit 33 of the ^ Π 32-after the input and output pins under test are wide, check if the potential of the pin connected to the sub-microcontroller 32 is low, right If it is at an intermediate level, it means that the sub-microcontroller 32 notifies the main micro-controller 31 after the input to the test is completed; whether the pin A of the main micro-processor 31 is as short as the The main micro-controller notifies the sub-microcontroller of the result of the test = 3 ^ and then informs the main micro-controller of the detection result of the sub-microcontroller correction 3 ^ 20173 V. Description of the invention (12) --- if method , Can detect any two pins short circuit, then call as shown in the sixth figure. The detection method of the integrated circuit in this case is applicable to the detection of a single integrated circuit package 2 =. It can also be packaged on a printed circuit board after welding the integrated circuit or the integrated circuit die with C0B (Chlp 0n B〇). The ard) method is used for the detection of I ^ brushed circuit boards. It has a wide range of applications and can be an effective production method. The Bebe is a fast and effective integrated circuit detection method to drive ii: The detection method of the integrated circuit in this case is through the input and output of the microcontroller: the pin of Guli to f integrated circuit, using the product The characteristics of the body circuit gate circuit tf protection diodes are simple, convenient and fast to detect the open circuit or short circuit of the integrated circuit, which is effective and therefore has industrial value, so as to achieve the development of this case == the lack of decoration, the lack of $]: f. Those who are practising this skill can use all kinds of modifications to the artisan's thoughts. "They can not be separated from those who want to protect the scope of the patent application. The diagram is briefly explained.-Picture: It is the better in this case. Picture 2: It is the better implementation in this case. Example 2: No. 3: Figure 3: It is a wooden structure of the light society in this case. Figure 4: It is the second figure. Xibei: Example 2 = Schematic diagram of the road. The main microcontroller notifies the sub-microcontroller to detect the fifth picture: it is the second a. The first micro-controller notifies the sub-microcontroller to detect a short
第15頁 1220173 五、發明說明（13) 路之時序圖。 第六圖：其係第三圖之主微控制器將控制權交給副微控制 器以檢測短路之時序圖。 元件符號說明 1 1 :微控制器 1 2 :待測積體電路 1 2 1 :待測積體電路之内部電路 2 1 :微控制器 2 2 .·第一類比開關 23 :第二類比開關 24 .·第一待測積體電路Page 15 1220173 V. Description of the invention (13) Timing chart of the road. Figure 6: This is the timing chart of the third microcontroller in which the main microcontroller transfers control to the sub-microcontroller to detect a short circuit. Explanation of component symbols 1 1: Microcontroller 1 2: Integrated circuit under test 1 2 1: Internal circuit of integrated circuit under test 2 1: Microcontroller 2 2. · First analog switch 23: Second analog switch 24 . · The first integrated circuit
2 4 1 :第一待測積體電路之内部電路 2 5 :第二待測積體電路 2 5 1 :第二待測積體電路之内部電路 3 1 :主微控制器 3 2 :副微控制器 3 3 :待測積體電路 3 3 1 :待測積體電路之内部電路2 4 1: Internal circuit of the first integrated circuit under test 2 5: Second circuit of the integrated circuit under test 2 5 1: Internal circuit of the second integrated circuit under test 3 1: Main microcontroller 3 2: Deputy micro controller Controller 3 3: Integrated circuit under test 3 3 1: Internal circuit of integrated circuit under test
第16頁 1220173 圖式簡單說明 第一圖：其係本案較佳實施例一之架構示意圖。 第二圖：其係本案較佳實施例二之架構示意圖。 第三圖：其係本案較佳實施例三之架構示意圖。 第四圖：其係第三圖之主微控制器通知副微控制器檢測開 路之時序圖。 第五圖：其係第三圖之主微控制器通知副微控制器檢測短 路之時序圖。 第六圖；其係第三圖之主微控制器將控制權交給副微控制 器以檢測短路之時序圖。Page 16 1220173 Brief Description of the Drawings Figure 1: It is a schematic diagram of the structure of the first preferred embodiment of the present invention. Second figure: It is a schematic diagram of the structure of the second preferred embodiment of the present invention. Third figure: It is a schematic diagram of the structure of the third preferred embodiment of the present invention. Figure 4: It is the timing chart of the third microcontroller informing the sub-microcontroller to detect the open circuit. Fifth figure: It is a timing chart of the third microcontroller informing the sub-microcontroller to detect a short circuit. Fig. 6 is a timing diagram of the main microcontroller in Fig. 3 giving control to the sub-microcontroller to detect a short circuit.
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