TWD227756S - Heat exchange plate - Google Patents
Heat exchange plate Download PDFInfo
- Publication number
- TWD227756S TWD227756S TW111302454D01F TW111302454D01F TWD227756S TW D227756 S TWD227756 S TW D227756S TW 111302454D01 F TW111302454D01 F TW 111302454D01F TW 111302454D01 F TW111302454D01 F TW 111302454D01F TW D227756 S TWD227756 S TW D227756S
- Authority
- TW
- Taiwan
- Prior art keywords
- heat exchange
- exchange plate
- design
- item
- parts
- Prior art date
Links
- 238000010586 diagram Methods 0.000 abstract description 2
- 239000011810 insulating material Substances 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
Abstract
【物品用途】;本設計是關於一熱交換用板，可用於半導體檢測設備。;【設計說明】;本物品之設計特徵為設置於正面側之鳍片的排列。背面側具有用以設置隔熱材等之略呈扇形的沉頭孔部。;圖式所揭露之虛線部分，為本案不主張設計之部分。;本物品著色狀態之參考圖中，以白色顯示的圓為貫通孔。【Use of article】;This design is about a heat exchange plate, which can be used in semiconductor testing equipment. ;[Design Description];The design feature of this item is the arrangement of fins provided on the front side. The back side has a slightly fan-shaped countersunk hole for placing a heat insulating material or the like. ;The dotted line parts disclosed in the diagram are the parts of this case that are not intended to be designed. ;In the reference picture of the colored state of this item, the circles shown in white are through-holes.
Description
本設計是關於一熱交換用板，可用於半導體檢測設備。 This design is about a heat exchange plate that can be used in semiconductor testing equipment.
本物品之設計特徵為設置於正面側之鳍片的排列。背面側具有用以設置隔熱材等之略呈扇形的沉頭孔部。 The design feature of this item is the arrangement of fins provided on the front side. The back side has a slightly fan-shaped countersunk hole for placing a heat insulating material or the like.
圖式所揭露之虛線部分，為本案不主張設計之部分。 The dotted line parts revealed in the diagram are the parts that are not designed in this case.
本物品著色狀態之參考圖中，以白色顯示的圓為貫通孔。 In the reference picture of the colored state of this article, the circles shown in white are through-holes.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-025930 | 2021-11-26 | ||
| JP2021025930F JP1713113S (en) | 2021-11-26 | 2021-11-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD227756S true TWD227756S (en) | 2023-10-01 |
Family
ID=81209725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111302454D01F TWD227756S (en) | 2021-11-26 | 2022-05-24 | Heat exchange plate |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1713113S (en) |
| TW (1) | TWD227756S (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1073913S1 (en) * | 2021-11-26 | 2025-05-06 | Tomoegawa Corporation | Heat exchange plate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD212326S (en) | 2020-05-27 | 2021-06-21 | 日商日立全球先端科技股份有限公司 | Ion shielding plate for plasma processing device |
-
2021
- 2021-11-26 JP JP2021025930F patent/JP1713113S/ja active Active
-
2022
- 2022-05-24 TW TW111302454D01F patent/TWD227756S/en unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD212326S (en) | 2020-05-27 | 2021-06-21 | 日商日立全球先端科技股份有限公司 | Ion shielding plate for plasma processing device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP1713113S (en) | 2022-04-20 |
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