TWD225930S - Heat exchange plate - Google Patents
Heat exchange plate Download PDFInfo
- Publication number
- TWD225930S TWD225930S TW111302454F TW111302454F TWD225930S TW D225930 S TWD225930 S TW D225930S TW 111302454 F TW111302454 F TW 111302454F TW 111302454 F TW111302454 F TW 111302454F TW D225930 S TWD225930 S TW D225930S
- Authority
- TW
- Taiwan
- Prior art keywords
- heat exchange
- exchange plate
- design
- item
- article
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000001514 detection method Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 abstract 1
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Abstract
【物品用途】;本設計是關於一熱交換用板,主要用於半導體檢測裝置。;【設計說明】;本物品之設計特徵為設置於正面側之鳍片的排列。;圖式所揭露之虛線部分,為本案不主張設計之部分。;本物品著色狀態之參考圖中,以白色顯示的圓為貫通孔。【Use of article】;This design is about a heat exchange plate, mainly used for semiconductor detection devices. ;[Design Description];The design feature of this item is the arrangement of fins provided on the front side. ; The dotted line portion disclosed in the diagram is the portion of the case that is not intended to be designed. ;In the reference picture of the colored state of this item, the circles shown in white are through-holes.
Description
本設計是關於一熱交換用板,主要用於半導體檢測裝置。 This design is about a heat exchange board, which is mainly used for semiconductor testing devices.
本物品之設計特徵為設置於正面側之鳍片的排列。 The design feature of this article is the arrangement of fins arranged on the front side.
圖式所揭露之虛線部分,為本案不主張設計之部分。 The dotted line part disclosed in the drawing is the part not claimed in this case.
本物品著色狀態之參考圖中,以白色顯示的圓為貫通孔。 In the reference drawing of the colored state of this product, the circles shown in white are through holes.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-025929 | 2021-02-22 | ||
| JP2021025929F JP1712507S (en) | 2021-11-26 | 2021-11-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD225930S true TWD225930S (en) | 2023-06-21 |
Family
ID=81206963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111302454F TWD225930S (en) | 2021-11-26 | 2022-05-24 | Heat exchange plate |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP1712507S (en) |
| TW (1) | TWD225930S (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1073913S1 (en) * | 2021-11-26 | 2025-05-06 | Tomoegawa Corporation | Heat exchange plate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD212326S (en) | 2020-05-27 | 2021-06-21 | 日商日立全球先端科技股份有限公司 | Ion shielding plate for plasma processing device |
-
2021
- 2021-11-26 JP JP2021025929F patent/JP1712507S/ja active Active
-
2022
- 2022-05-24 TW TW111302454F patent/TWD225930S/en unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWD212326S (en) | 2020-05-27 | 2021-06-21 | 日商日立全球先端科技股份有限公司 | Ion shielding plate for plasma processing device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP1712507S (en) | 2022-04-13 |
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