TWD221771S - cooling module - Google Patents
cooling module Download PDFInfo
- Publication number
- TWD221771S TWD221771S TW111301715F TW111301715F TWD221771S TW D221771 S TWD221771 S TW D221771S TW 111301715 F TW111301715 F TW 111301715F TW 111301715 F TW111301715 F TW 111301715F TW D221771 S TWD221771 S TW D221771S
- Authority
- TW
- Taiwan
- Prior art keywords
- heat dissipation
- design
- rectangular
- vapor chamber
- heat
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title 1
- 230000017525 heat dissipation Effects 0.000 abstract description 10
- 238000010586 diagram Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 230000000007 visual effect Effects 0.000 abstract description 2
Images
Abstract
【物品用途】;本設計係有關一種『散熱模組』之設計，尤指一種結合熱管與均溫板且用於逸散電子裝置熱量的散熱模組。;【設計說明】;如附圖所示，本設計散熱模組主要包含一矩形均溫板及穿接在矩形均溫板兩側的複數長條形熱管，此矩形均溫板兩側具有二長方形蓋板，且每一長方形蓋板延伸有包覆在各長條形熱管外周緣的複數圓形凸環，以使整體造型顯現簡約大方的立體效果。此外，矩形均溫板的各角端皆以圓弧來潤飾，而產生柔和的視覺感受。;參考圖為複數散熱鰭片套接於複數長條形熱管的示意圖，且參考圖中所揭露之虛線係表示散熱鰭片，為本案不主張設計之部分。[Use of item]; This design is related to the design of a "heat dissipation module", specifically a heat dissipation module that combines a heat pipe and a vapor chamber and is used to dissipate heat from electronic devices. ;[Design Description];As shown in the attached figure, the heat dissipation module of this design mainly includes a rectangular vapor chamber and a plurality of long strip heat pipes connected on both sides of the rectangular vapor chamber. There are two strips on both sides of the rectangular vapor chamber. A rectangular cover plate, and each rectangular cover plate is extended with a plurality of circular convex rings covering the outer periphery of each long heat pipe, so that the overall shape presents a simple and elegant three-dimensional effect. In addition, each corner of the rectangular vapor chamber is decorated with arcs, creating a soft visual experience. ; The reference picture is a schematic diagram of a plurality of heat dissipation fins connected to a plurality of elongated heat pipes, and the dotted lines disclosed in the reference picture represent the heat dissipation fins, which are parts of the design that are not recommended in this case.
Description
本設計係有關一種『散熱模組』之設計，尤指一種結合熱管與均溫板且用於逸散電子裝置熱量的散熱模組。This design is related to the design of a "heat dissipation module", especially a heat dissipation module that combines heat pipes and vapor chambers and is used to dissipate heat from electronic devices.
如附圖所示，本設計散熱模組主要包含一矩形均溫板及穿接在矩形均溫板兩側的複數長條形熱管，此矩形均溫板兩側具有二長方形蓋板，且每一長方形蓋板延伸有包覆在各長條形熱管外周緣的複數圓形凸環，以使整體造型顯現簡約大方的立體效果。此外，矩形均溫板的各角端皆以圓弧來潤飾，而產生柔和的視覺感受。As shown in the attached figure, the heat dissipation module of this design mainly includes a rectangular vapor chamber and a plurality of long heat pipes pierced on both sides of the rectangular vapor chamber. There are two rectangular cover plates on both sides of the rectangular chamber, and each A rectangular cover plate is extended with a plurality of circular protruding rings covering the outer periphery of each elongated heat pipe, so that the overall shape presents a simple and elegant three-dimensional effect. In addition, each corner of the rectangular chamber is decorated with arcs to create a soft visual experience.
參考圖為複數散熱鰭片套接於複數長條形熱管的示意圖，且參考圖中所揭露之虛線係表示散熱鰭片，為本案不主張設計之部分。The reference figure is a schematic diagram of a plurality of heat dissipation fins socketed on a plurality of long strip heat pipes, and the dotted lines disclosed in the reference figure represent heat dissipation fins, which are not designed in this case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111301715F TWD221771S (en) | 2022-04-12 | 2022-04-12 | cooling module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW111301715F TWD221771S (en) | 2022-04-12 | 2022-04-12 | cooling module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWD221771S true TWD221771S (en) | 2022-10-21 |
Family
ID=88924660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111301715F TWD221771S (en) | 2022-04-12 | 2022-04-12 | cooling module |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWD221771S (en) |
-
2022
- 2022-04-12 TW TW111301715F patent/TWD221771S/en unknown
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