TWD218676S - Gas Supply Nozzle for Semiconductor Film Formation Equipment (2) - Google Patents

Gas Supply Nozzle for Semiconductor Film Formation Equipment (2) Download PDF

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Publication number
TWD218676S
TWD218676S TW110305382F TW110305382F TWD218676S TW D218676 S TWD218676 S TW D218676S TW 110305382 F TW110305382 F TW 110305382F TW 110305382 F TW110305382 F TW 110305382F TW D218676 S TWD218676 S TW D218676S
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TW
Taiwan
Prior art keywords
view
design
article
semiconductor film
film formation
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Application number
TW110305382F
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Chinese (zh)
Inventor
及川大海
高村侑矢
坂下訓康
Original Assignee
日商東京威力科創股份有限公司
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Publication of TWD218676S publication Critical patent/TWD218676S/en

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Abstract

【物品用途】;「表示使用狀態之參考剖面圖」中,藍色所表示的本物品係在半導體成膜裝置內設置有1支或複數支,並供給用以在晶圓上進行成膜之氣體者。另外,該圖式中,本物品的形狀係簡化顯示。部分設計所欲主張之部分係用以對晶圓均勻供給氣體之孔。;【設計說明】;實線所表示之部分係部分設計所欲主張之部分。虛線所表示之部分係部分設計所不欲主張之部分。;包含「立體圖」、「A-A部分放大圖」、「B-B端面圖」、「C-C部分放大圖」及「D-D剖面圖」來特定出部分設計所欲主張之部分。;由於仰視圖係顯示為與俯視圖對稱,故省略。;「表示使用狀態之參考剖面圖」中之色彩及文字僅為說明及標示而使用者,非為主張之部分。[Use of the article]; In the "Reference cross-sectional view showing the use state", the article indicated in blue is one or a plurality of pieces installed in the semiconductor film forming equipment and supplied for film formation on the wafer. of gas. In addition, in this drawing, the shape of this article is simplified. Part of the design claim is the hole used to supply gas uniformly to the wafer. ;[Design Description];The part represented by the solid line is the part that the design intends to advocate. The parts indicated by the dotted lines are parts that are not intended to be claimed in the design. ;Include "three-dimensional view", "enlarged view of part A-A", "end view of B-B", "enlarged view of part C-C" and "D-D sectional view" to identify the parts to be advocated in the partial design. ; Since the bottom view system is shown to be symmetrical with the top view, it is omitted. ;The colors and text in the "Reference Cross-sectional Drawing Indicating Usage Conditions" are for illustration and indication purposes only and are not part of the claims.

Description

半導體成膜裝置用氣體供給噴嘴(二)Gas Supply Nozzle for Semiconductor Film Formation Equipment (2)

「表示使用狀態之參考剖面圖」中,藍色所表示的本物品係在半導體成膜裝置內設置有1支或複數支,並供給用以在晶圓上進行成膜之氣體者。另外,該圖式中,本物品的形狀係簡化顯示。部分設計所欲主張之部分係用以對晶圓均勻供給氣體之孔。In the "reference cross-sectional view showing the state of use", the item shown in blue is one or more of which are installed in the semiconductor film forming apparatus and supplied with gas for film formation on the wafer. In addition, in this figure, the shape of this article is shown simplified. Part of what the design claims is a hole for evenly supplying gas to the wafer.

實線所表示之部分係部分設計所欲主張之部分。虛線所表示之部分係部分設計所不欲主張之部分。The part indicated by the solid line is the part that part of the design intends to claim. The part indicated by the dotted line is the part not intended by the partial design.

包含「立體圖」、「A-A部分放大圖」、「B-B端面圖」、「C-C部分放大圖」及「D-D剖面圖」來特定出部分設計所欲主張之部分。Including "three-dimensional view", "A-A part enlarged view", "B-B end view", "C-C part enlarged view" and "D-D cross-sectional view" to identify the part of the design to be advocated.

由於仰視圖係顯示為與俯視圖對稱,故省略。Since the bottom view is shown to be symmetrical with the top view, it is omitted.

「表示使用狀態之參考剖面圖」中之色彩及文字僅為說明及標示而使用者,非為主張之部分。The colors and texts in the "reference cross-sectional view showing the use state" are for illustration and indication only, and are not intended to be part of the claims.

TW110305382F 2020-01-17 2020-07-08 Gas Supply Nozzle for Semiconductor Film Formation Equipment (2) TWD218676S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-000749 2020-01-07
JPD2020-749F JP1682707S (en) 2020-01-17 2020-01-17

Publications (1)

Publication Number Publication Date
TWD218676S true TWD218676S (en) 2022-05-01

Family

ID=75268132

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110305382F TWD218676S (en) 2020-01-17 2020-07-08 Gas Supply Nozzle for Semiconductor Film Formation Equipment (2)

Country Status (2)

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JP (1) JP1682707S (en)
TW (1) TWD218676S (en)

Also Published As

Publication number Publication date
JP1682707S (en) 2021-04-05

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