TWD217960S - Probe - Google Patents

Probe Download PDF

Info

Publication number
TWD217960S
TWD217960S TW109306823F TW109306823F TWD217960S TW D217960 S TWD217960 S TW D217960S TW 109306823 F TW109306823 F TW 109306823F TW 109306823 F TW109306823 F TW 109306823F TW D217960 S TWD217960 S TW D217960S
Authority
TW
Taiwan
Prior art keywords
probe
view
design
enlarged
perspective
Prior art date
Application number
TW109306823F
Other languages
Chinese (zh)
Inventor
陳子揚
林哲緯
巫晨睿
Original Assignee
旺矽科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 旺矽科技股份有限公司 filed Critical 旺矽科技股份有限公司
Priority to TW109306823F priority Critical patent/TWD217960S/en
Priority to US29/786,073 priority patent/USD983681S1/en
Publication of TWD217960S publication Critical patent/TWD217960S/en

Links

Images

Description

探針 probe

本設計用於點測諸如晶圓之類的待測物,使用於半導體元件、積體電路等電子裝置的測試裝置。 This design is used to spot test objects such as wafers, and is used as a test device for electronic devices such as semiconductor components and integrated circuits.

本設計具有如圖式所示的特殊設計。 This design has a special design as shown in the drawing.

圖式中所揭露的虛線為本案不主張設計的部分。圖式中所揭露的一點鏈線為邊界線,做為區隔本案主張設計的部分與不主張設計的部分,該邊界線本身亦為本案不主張設計的部分。 The dotted lines disclosed in the drawings are the parts that are not claimed in this case. The one-point chain line disclosed in the drawing is the boundary line, which is used to distinguish the part that advocates design and the part that does not advocate design in this case. The boundary line itself is also the part that does not advocate design in this case.

A-A部分放大立體圖1為立體圖中A-A部分的放大立體圖;A-A部分放大前、後視圖分別為立體圖中A-A部分的放大前、後視圖;A-A部分放大俯、仰視圖分別為立體圖中A-A部分的放大俯、仰視圖;A-A部分放大立體圖2為立體圖中A-A部分另一視角的放大立體圖。 Part A-A enlarged perspective Figure 1 is an enlarged perspective view of part A-A in the three-dimensional view; the enlarged front and rear views of part A-A are respectively the enlarged front and rear views of part A-A in the three-dimensional view; the enlarged top and bottom views of part A-A are respectively the enlarged top view of part A-A in the three-dimensional view , Bottom view; A-A part enlarged perspective Figure 2 is an enlarged perspective view of the A-A part of the perspective view from another perspective.

TW109306823F 2020-12-03 2020-12-03 Probe TWD217960S (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW109306823F TWD217960S (en) 2020-12-03 2020-12-03 Probe
US29/786,073 USD983681S1 (en) 2020-12-03 2021-05-28 Probe for testing device under test

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW109306823F TWD217960S (en) 2020-12-03 2020-12-03 Probe

Publications (1)

Publication Number Publication Date
TWD217960S true TWD217960S (en) 2022-04-01

Family

ID=89543946

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109306823F TWD217960S (en) 2020-12-03 2020-12-03 Probe

Country Status (1)

Country Link
TW (1) TWD217960S (en)

Similar Documents

Publication Publication Date Title
HUP0203331A2 (en) Visual inspection machine for surface mount passive component
USD900106S1 (en) Electronic device adapter
JP2014182397A5 (en)
WO2016099580A3 (en) Three dimensional integrated circuits employing thin film transistors
TWD202095S (en) Industrial robot
EP3273467A3 (en) Semiconductor die backside devices and methods of fabrication thereof
TWD217960S (en) Probe
TW200644191A (en) Semiconductor device
TWD202096S (en) Portion of an industrial robot
TWD220632S (en) Probe
EP3309828A3 (en) Semiconductor device, system in package, and system in package for vehicle
TWD207698S (en) Contacts for electronics tester
TWD202097S (en) Portion of an industrial robot
TW200511501A (en) Semiconductor integrated circuit device
Ali et al. Different scenarios for estimating coupling capacitances of through silicon via (TSV) arrays
TWD195583S (en) Part of electric contact
US7001185B2 (en) Chip scale package socket for various package sizes
TWD195360S (en) Part of electric contact
TWD209939S (en) Electric contacts
TWD230243S (en) Package structure of semiconductor element
TWD197821S (en) Part of electric contact
TW201306386A (en) Component with pins fixed on circuit board
JP2021158380A (en) Prober and wafer chuck
US9417309B1 (en) Test structure and method for calibrating three-dimensional thermography fault isolation tool
JP2010109337A5 (en)